Silicon wafer stacking device and unpacking equipment thereof

Abstract

The invention discloses a silicon wafer stacking device and unpacking equipment thereof, and belongs to the technical field of silicon wafer treatment.The silicon wafer stacking device comprises a stacking device body, an unpacking device, a material removing device and a discharging device, the stacking device body is located between the material removing device and the discharging device, and the stacking device body comprises a first overturning module; the first overturning module comprises a first bottom plate and a first limiting block located on the edge of the first bottom plate. The second overturning module comprises a second bottom plate and a second limiting block located on the edge of the second bottom plate; the third overturning module comprises a third bottom plate and a third limiting block located on the edge of the third bottom plate; and the fourth overturning module comprises a fourth bottom plate and a fourth limiting block located on the edge of the fourth bottom plate. According to the silicon wafer unpacking device, rapid unpacking treatment of silicon wafers is achieved, manual operation is not needed, pollution to the silicon wafers due to manual operation is avoided, and the quality of the silicon wafers is guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of silicon wafer processing, and in particular relates to a silicon wafer stacking device and unpacking equipment thereof. Background Art

[0002] Silicon wafers are thin slices made of high-purity crystalline silicon. Existing finished silicon wafers are usually stored in boxes. When the silicon wafers need to be used, they need to be unpacked and stacked after unpacking to meet the use requirements of the silicon wafers.

[0003] At present, the unpacking and stacking of silicon wafers are usually performed manually, that is, the operator uses handheld tools to unpack the silicon wafers, and then manually stacks the silicon wafers. This method requires a lot of manpower, which greatly increases the labor intensity of the operator. In addition, the manual operation process is inefficient and the silicon wafers are prone to damage and contamination, which will directly affect the quality of the silicon wafers. Summary of the invention

[0004] The present invention overcomes the deficiencies of the prior art and provides a silicon wafer stacking device and unpacking equipment thereof to solve the problems existing in the prior art.

[0005] To achieve the above object, the technical solution adopted by the present invention is: a silicon wafer stacking device, comprising

[0006] A first flip module, the first flip module comprising a first bottom plate and a first limiting block located at an edge of the first bottom plate;

[0007] A second flip module, the second flip module comprising a second bottom plate and a second limiting block located at an edge of the second bottom plate;

[0008] A third flip module, the third flip module comprising a third bottom plate and a third limiting block located at an edge of the third bottom plate;

[0009] A fourth flip module, the fourth flip module comprising a fourth bottom plate and a fourth limit block located at an edge of the fourth bottom plate;

[0010] in:

[0011] Silicon wafers are placed on the first bottom plate, the second bottom plate, the third bottom plate and the fourth bottom plate, and are limited by the first limit block, the second limit block, the third limit block and the fourth limit block respectively;

[0012] The first limit block and the second limit block are complementary in structure, and a first pressing plate is arranged above the first bottom plate. When the silicon wafer on the first bottom plate contacts the silicon wafer on the second bottom plate, the first pressing plate presses the silicon wafer against the first bottom plate;

[0013] The third limit block and the fourth limit block are complementary in structure, a third pressing plate is arranged above the third bottom plate, and when the silicon wafer on the third bottom plate contacts the silicon wafer on the fourth bottom plate, the third pressing plate presses the silicon wafer against the third bottom plate;

[0014] The first limiting block and the third limiting block are complementary in structure. When the silicon wafer on the first bottom plate contacts the silicon wafer on the third bottom plate, the third pressing plate presses the silicon wafer onto the third bottom plate.

[0015] In a preferred embodiment of the present invention, it also includes

[0016] A transverse driving module, wherein the number of the transverse driving modules is at least two, one of the transverse driving modules drives the first flip module to make the first flip module close to the second flip module, and the other transverse driving module drives the third flip module to make the third flip module close to the fourth flip module;

[0017] A longitudinal driving module drives the third flip module to make the third flip module close to the first flip module.

[0018] In a preferred embodiment of the present invention, the longitudinal driving module is installed on one of the transverse driving modules to drive the third flip module transversely or longitudinally.

[0019] In a preferred embodiment of the present invention, direction-changing motors are provided under the first base plate and under the third base plate. One direction-changing motor drives the first base plate to change the stacking direction of the silicon wafers on the first base plate, and the other direction-changing motor drives the third base plate to change the stacking direction of the silicon wafers on the third base plate.

[0020] In a preferred embodiment of the present invention, a second pressure plate is arranged above the second base plate, and when the first base plate is close to the second base plate for stacking silicon wafers, the second pressure plate and the first pressure plate are staggered; a fourth pressure plate is arranged above the fourth base plate, and when the third base plate is close to the fourth base plate for stacking silicon wafers, the fourth pressure plate and the third pressure plate are staggered; when the third base plate is close to the first base plate for stacking silicon wafers, the third pressure plate and the first pressure plate are staggered.

[0021] The present invention also discloses a silicon wafer unpacking device, which includes the silicon wafer stacking device, and also includes an unpacking device, a material removal device and a material unloading device, and the stacking device is located between the material removal device and the material unloading device.

[0022] In a preferred embodiment of the present invention, the unpacking device includes an unpacking conveyor line and an unpacking robot arm. The unpacking conveyor line transports boxes containing silicon wafers. The end of the unpacking robot arm is provided with a loading suction cup and an unpacking cutter. The loading suction cup absorbs the box, and the unpacking cutter cuts the tape on the box.

[0023] In a preferred embodiment of the present invention, a plurality of unpacking cylinders are provided at the end of the unpacking conveyor line, and an unpacking suction cup is provided at the end of the unpacking cylinder. The unpacking cylinder drives the unpacking suction cup to open the box.

[0024] In a preferred embodiment of the present invention, the material removal device includes a material removal robot arm, a bag removal part and a material removal conveyor line. The material removal robot arm grabs the silicon wafer to the bag removal part to remove the bagging on the surface of the silicon wafer. The material removal conveyor line is provided with a paper removal part, which removes paper pieces on the surface of the silicon wafer.

[0025] In a preferred embodiment of the present invention, a material transfer truss is further included, and the material transfer truss grabs and transfers the silicon wafer.

[0026] The present invention solves the defects existing in the background technology and has the following beneficial effects:

[0027] 1. The present invention realizes the rapid unpacking of silicon wafers, and can continuously unpack, remove materials, stack and unload silicon wafers. During this process, no manual operation is required, which reduces manpower consumption and can effectively improve the processing efficiency of silicon wafers. In addition, the silicon wafers will not be contaminated by manual operation, thereby ensuring the quality of the silicon wafers.

[0028] 2. The present invention continuously flips four groups of silicon wafers under the cooperation of the first flip module, the second flip module, the third flip module and the fourth flip module, and finally stacks the four groups of silicon wafers at the position of the third flip module, completing the stacking process of the silicon wafers, thereby meeting the use requirements of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention is further described below in conjunction with the accompanying drawings and embodiments;

[0030] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the present invention;

[0031] Figure 2 It is a schematic diagram of the structure of silicon wafer stacking of the first flip module and the second flip module in the first embodiment of the present invention;

[0032] Figure 3 It is a structural schematic diagram of the first flip module and the third flip module in the first embodiment of the present invention performing silicon wafer stacking after changing direction;

[0033] Figure 4 It is a structural schematic diagram of the first flip module in the first embodiment of the present invention;

[0034] Figure 5 is a schematic diagram of the overall structure of the second embodiment of the present invention;

[0035] Figure 6 This is a schematic diagram of the structure of the box opening robot arm according to the second embodiment of the present invention;

[0036] Figure 7 It is a structural schematic diagram of unpacking the unpacking cylinder in the second embodiment of the present invention;

[0037] Figure 8 It is a schematic structural diagram of a material removal device in a second embodiment of the present invention;

[0038] Fig. 9 It is a schematic structural diagram of a bag removal portion in a second embodiment of the present invention;

[0039] Fig.10 It is a structural schematic diagram of a paper removal unit in a second embodiment of the present invention;

[0040] In the figure: 10, first flip module; 11, first bottom plate; 12, first limit block; 20, second flip module; 21, second bottom plate; 22, second limit block; 30, third flip module; 31, third bottom plate; 32, third limit block; 40, fourth flip module; 41, fourth bottom plate; 42, fourth limit block; 50, first pressure plate; 60, second pressure plate; 70, third pressure plate; 80, fourth pressure plate; 90, horizontal drive module; 100, longitudinal drive module; 110, direction changing motor; 120, unpacking conveyor line; 130, unpacking robot arm; 131, Feeding suction cup; 132, box cutting knife; 140, box body; 150, box opening cylinder; 151, box opening suction cup; 160, material removal robot arm; 161, clamp; 170, bag removal unit; 171, bag removal cylinder; 172, bag removal panel; 173, bag removal suction cup; 180, material removal conveyor line; 181, paper removal unit; 1811, transverse cylinder; 1812, paper picking cylinder; 1813, paper picking suction cup; 190, material transfer truss; 200, material unloading conveyor line; 210, rotation drive motor; 220, pressure plate adjustment cylinder; 230, feeding unit; 240, offset cylinder. DETAILED DESCRIPTION

[0041] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0042] Embodiment 1

[0043] The present embodiment provides a silicon wafer stacking device, which can continuously flip and stack multiple groups of silicon wafers. It has good stacking effect and strong stability, and will not cause damage to the silicon wafers. In addition, no manual operation is required during this process, which improves efficiency and effectively reduces the labor intensity of the operator.

[0044] Combination Figures 1 to 4 As shown, the silicon wafer stacking device of this embodiment includes a first flip module 10, a second flip module 20, a third flip module 30 and a fourth flip module 40. The second flip module 20 and the fourth flip module 40 of this embodiment are fixedly arranged. After the first flip module 10 and the second flip module 20 flip toward each other, the first flip module 10 approaches the second flip module 20, and the silicon wafers on the second flip module 20 are stacked on the first flip module 10. After the third flip module 30 and the fourth flip module 40 flip toward each other, the third flip module 30 approaches the fourth flip module 40, and the silicon wafers on the fourth flip module 40 are stacked on the third flip module 30. Then the first flip module 10 and the third flip module 30 flip toward each other, the third flip module 30 approaches the first flip module 10, and the silicon wafers on the first flip module 10 are stacked on the third flip module 30, thereby completing the stacking process of four groups of silicon wafers.

[0045] In this embodiment, silicon wafers are placed on the first base plate 11, the second base plate 21, the third base plate 31 and the fourth base plate 41, wherein:

[0046] The first flip module 10 includes a first bottom plate 11 and a first limiting block 12 located at the edge of the first bottom plate 11. The first limiting blocks 12 are continuously spaced around the first bottom plate 11 to form a first limiting structure to limit the silicon wafer on the first bottom plate 11.

[0047] The second flip module 20 includes a second bottom plate 21 and a second limiting block 22 located at the edge of the second bottom plate 21. The second limiting blocks 22 are continuously spaced around the second bottom plate 21 to form a second limiting structure to limit the silicon wafer on the second bottom plate 21.

[0048] The third flip module 30 includes a third bottom plate 31 and a third limiting block 32 located at the edge of the third bottom plate 31. The third limiting blocks 32 are continuously spaced and distributed around the third bottom plate 31 to form a third limiting structure to limit the silicon wafer on the third bottom plate 31.

[0049] The fourth flip module 40 includes a fourth bottom plate 41 and fourth limiting blocks 42 located at the edge of the fourth bottom plate 41 . The fourth limiting blocks 42 are continuously spaced around the fourth bottom plate 41 to form a fourth limiting structure to limit the silicon wafer on the fourth bottom plate 41 .

[0050] Specifically, in the present embodiment, the first limiting structure and the second limiting structure are structurally complementary, and the third limiting structure and the fourth limiting structure are structurally complementary. The first limiting structure and the third limiting structure are structurally complementary. When the first flip module 10 and the second flip module 20 perform silicon wafer stacking, the first limiting structure and the second limiting structure complement each other, so that the silicon wafers of the first flip module 10 and the second flip module 20 can be smoothly fitted and stacked. When the third flip module 30 and the fourth flip module 40 perform silicon wafer stacking, the third limiting structure and the fourth limiting structure are structurally complementary, so that the silicon wafers of the third flip module 30 and the fourth flip module 40 can be smoothly fitted and stacked. When the first flip module 10 and the third flip module 30 perform silicon wafer stacking, the first limiting structure and the third limiting structure are structurally complementary, so that the silicon wafers of the first flip module 10 and the third flip module 30 can be smoothly fitted and stacked.

[0051] like Figure 1 As shown, in this embodiment, a first pressure plate 50 is arranged above the first bottom plate 11, a second pressure plate 60 is arranged above the second bottom plate 21, a third pressure plate 70 is arranged above the third bottom plate 31, and a fourth pressure plate 80 is arranged above the fourth bottom plate 41, and pressure plate adjusting cylinders 220 are arranged on the sides of the first bottom plate 11, the second bottom plate 21, the third bottom plate 31 and the fourth bottom plate 41.

[0052] In this embodiment, in the initial state, the first pressing plate 50 presses and positions the silicon wafers on the first base plate 11, the second pressing plate 60 presses and positions the silicon wafers on the second base plate 21, the third pressing plate 70 presses and positions the silicon wafers on the third base plate 31, and the fourth pressing plate 80 presses and positions the silicon wafers on the fourth base plate 41, and the corresponding pressing plate adjusting cylinder 220 can respectively adjust the positions of the first pressing plate 50, the second pressing plate 60, the third pressing plate 70 and the fourth pressing plate 80, so that the first pressing plate 50, the second pressing plate 60, the third pressing plate 70 and the fourth pressing plate 80 can be staggered when stacking silicon wafers to ensure the smooth progress of the silicon wafer stacking operation.

[0053] Specifically, when the first flip module 10 and the second flip module 20 stack silicon wafers, the first pressing plate 50, under the action of the pressing plate adjusting cylinder 220, presses the flipped silicon wafers on the first base plate 11, and the second pressing plate 60, under the action of the pressing plate adjusting cylinder 220, presses the flipped silicon wafers on the second base plate 21, and then the first base plate 11 moves close to the second base plate 21, so that the silicon wafers on the first base plate 11 and the silicon wafers on the second base plate 21 are stacked, and after stacking, the second pressing plate 60 is reset by the pressing plate adjusting cylinder 220, and another pressing plate adjusting cylinder 220 drives the first pressing plate 50 to the pressing position, and the pressing plate adjusting cylinder 220 drives the first pressing plate 50 to press the stacked silicon wafers, so that the silicon wafers are pressed and stacked on the first base plate 11, and similarly, the third flip module 30 and the fourth flip module 40 perform the same operation of silicon wafer stacking, and the third flip module 30 and the first flip module 10 perform the same operation of silicon wafer stacking.

[0054] In this embodiment, when the first base plate 11 is close to the second base plate 21 for silicon wafer stacking, the second pressure plate 60 and the first pressure plate 50 are staggered; when the third base plate 31 is close to the fourth base plate 41 for silicon wafer stacking, the fourth pressure plate 80 and the third pressure plate 70 are staggered; when the third base plate 31 is close to the first base plate 11 for silicon wafer stacking, the third pressure plate 70 and the first pressure plate 50 are staggered. The pressure plates are staggered to avoid interference with each other, thereby ensuring smooth stacking of the silicon wafers.

[0055] In this embodiment, the first flip module 10, the second flip module 20, the third flip module 30 and the fourth flip module 40 all include a rotary drive motor 210, and the rotary drive motor 210 drives the first base plate 11, the second base plate 21, the third base plate 31 and the fourth base plate 41 respectively, so as to flip the silicon wafer, thereby realizing smooth flipping of the silicon wafer between the first flip module 10 and the second flip module 20, between the third flip module 30 and the fourth flip module 40, and between the third flip module 30 and the first flip module 10.

[0056] Combination Figure 2 and Figure 3As shown, the silicon wafer stacking device of this embodiment also includes a horizontal driving module 90 and a vertical driving module 100. The horizontal driving modules 90 are in two groups. One group of horizontal driving modules 90 drives the first flip module 10 to make the first flip module 10 close to the second flip module 20, so as to stack the silicon wafers of the first flip module 10 with the silicon wafers of the second flip module 20. The other horizontal driving module 90 drives the third flip module 30 to make the third flip module 30 close to the fourth flip module 40, so as to stack the silicon wafers of the third flip module 30 with the silicon wafers of the fourth flip module 40. The vertical driving module 100 of this embodiment is installed on a horizontal driving module 90. The vertical driving module 100 drives the third flip module 30 vertically to make the third flip module 30 close to the first flip module 10. Therefore, the third flip module 30 can move horizontally and vertically, so that the third flip module 30 is close to the fourth flip module 40 or the first flip module 10, so as to perform silicon wafer stacking.

[0057] In this embodiment, a direction-changing motor 110 is provided under the first base plate 11 and under the third base plate 31. One direction-changing motor 110 drives the first base plate 11 to change the stacking direction of the silicon wafers on the first base plate 11, and the other direction-changing motor 110 drives the third base plate 31 to change the stacking direction of the silicon wafers on the third base plate 31. In this embodiment, the silicon wafers on the first base plate 11 need to be stacked with the silicon wafers on the second base plate 21 and the third base plate 31, and the silicon wafers on the third base plate 31 need to be stacked with the silicon wafers on the fourth base plate 41 and the silicon wafers on the first base plate 11. Therefore, it is necessary to use the direction-changing motor 110 to change the direction of the first base plate 11 and the third base plate 31, thereby changing the direction of the silicon wafers on the first base plate 11 and the third base plate 31 to meet the stacking processing of the silicon wafers.

[0058] like Figure 1 As shown, the first base plate 11 of this embodiment is connected to a direction-changing motor 110 through a hollow platform, and the third base plate 31 is connected to another direction-changing motor 110 through another hollow platform. When driven by the direction-changing motor 110, the orientations of the first base plate 11 and the third base plate 31 are changed to meet the stacking requirements of silicon wafers.

[0059] In actual use of the silicon wafer stacking device of this embodiment, the second flip module 20 and the fourth flip module 40 are fixedly arranged (can only flip themselves), and the first flip module 10 can move laterally to approach the second flip module 20, the third flip module 30 can move laterally to approach the fourth flip module 40, and can also move longitudinally to approach the first flip module 10. In the initial state, a group of silicon wafers are placed on the first bottom plate 11, the second bottom plate 21, the third bottom plate 31 and the fourth bottom plate 41. The silicon wafers on the first bottom plate 11 and the silicon wafers on the second bottom plate 21 are flipped so that the two groups of silicon wafers are arranged facing each other, and then the first bottom plate 11 is driven by a horizontal driving module 90 to approach the second bottom plate 21, so that the silicon wafers on the first bottom plate 11 after flipping and the silicon wafers on the second bottom plate 21 after flipping are aligned. The stacked silicon wafers are stacked by the first pressing plate 50 and then the first bottom plate 11 is reset. At the same time, the same operation is performed between the third bottom plate 31 and the fourth bottom plate 41, so that the silicon wafers on the fourth bottom plate 41 are stacked on the third bottom plate 31. The stacked silicon wafers are pressed by the third pressing plate 70 and the third bottom plate 31 is reset. Then the direction-changing motor 110 changes the phases of the first bottom plate 11 and the third bottom plate 31 so that the silicon wafers on the first bottom plate 11 and the silicon wafers on the third bottom plate 31 are arranged opposite to each other. The third bottom plate 31 is driven by the longitudinal driving module 100 so that the third bottom plate 31 is close to the first bottom plate 11, so that the silicon wafers on the flipped third bottom plate 31 are stacked with the silicon wafers on the flipped first bottom plate 11. After stacking, the silicon wafers are pressed and positioned by the third pressing plate 70, thereby completing the stacking process of four groups of silicon wafers.

[0060] In this embodiment, a fifth flip module is provided on the side of the second flip module 20 away from the first flip module 10, and a sixth flip module is provided on the side of the fourth flip module 40 away from the third flip module 30. The fifth flip module has the same structure as the first flip module 10, and the sixth flip module has the same structure as the third flip module 30. The presence of the fifth flip module and the sixth flip module can cooperate with the second flip module 20 and the fourth flip module 40 respectively to further improve the stacking efficiency of the silicon wafers.

[0061] Embodiment 2

[0062] The present embodiment provides a silicon wafer unpacking device, which realizes the rapid unpacking of silicon wafers and can continuously unpack, remove materials, stack and unload silicon wafers. No manual operation is required in this process, which reduces manpower consumption and can effectively improve the processing efficiency of silicon wafers. The silicon wafers will not be contaminated by manual operation, thereby ensuring the quality of the silicon wafers.

[0063] Combination Figures 5 to 10As shown, the silicon wafer unpacking equipment of this embodiment includes a silicon wafer stacking device, and also includes an unpacking device, a material removal device and a material unloading device. The stacking device is located between the material removal device and the material unloading device, so as to unpack, remove materials, stack and unload the silicon wafers in sequence.

[0064] In this embodiment, the silicon wafer unpacking equipment also includes a material moving truss 190, which grabs and transfers the silicon wafers. The material moving truss 190 of this embodiment circulates between the material removal device, the stacking device and the unloading device to grab and transfer the silicon wafers. The unloading device of this embodiment uses an unloading conveyor line 200 to convey the stacked silicon wafers.

[0065] Combination Figures 5 to 7 As shown, the unpacking device of this embodiment includes an unpacking conveyor line 120 and an unpacking robot arm 130. The unpacking conveyor line 120 conveys a box 140 containing silicon wafers. A loading suction cup 131 and an unpacking cutter 132 are provided at the end of the unpacking robot arm 130. The loading suction cup 131 sucks the box 140, and the unpacking cutter 132 cuts the tape on the box 140. A feeding part 230 is provided in the working area of ​​the unpacking robot arm 130 to continuously feed the box 140 containing silicon wafers. When the unpacking robot arm 130 uses the loading suction cup 131 to grab the box 140 to the unpacking conveyor line 120, the unpacking cutter 132 at the end of the unpacking robot arm 130 cuts the tape on the surface of the box 140 so that the box 140 can be opened later. Then the unpacking conveyor line 120 conveys the box 140 to the end to wait for the unpacking operation.

[0066] In this embodiment, a plurality of unpacking cylinders 150 are provided at the end of the unpacking conveyor line 120, and an unpacking suction cup 151 is provided at the end of the unpacking cylinder 150. The unpacking cylinder 150 drives the unpacking suction cup 151 to open the box body 140. There are four unpacking cylinders 150 in this embodiment, and they are distributed around the box body 140. The unpacking suction cup 151 is driven by the unpacking cylinder 150 to approach the box body 140 and adsorb the top of the box body 140. Then the unpacking cylinder 150 is reset, and the unpacking suction cup 151 pulls the top of the box body 140 to open the box body 140. The unpacking cylinder 150 in this embodiment is an inclined angle cylinder, so it can smoothly drive the unpacking suction cup 151 to open the box body 140.

[0067] Furthermore, the unpacking conveyor line 120 of the present embodiment is provided with a dislocation cylinder 240, which drives one of the unpacking cylinders 150 to move and dislocate, thereby avoiding interference between the unpacking cylinder 150 and the box body 140, so that the box body 140 can smoothly reach the unpacking position of the conveyor line, so as to facilitate the smooth progress of the unpacking operation.

[0068] Combination Figure 5 , Figure 8 , Fig. 9 as well as Fig.10 As shown, the material removal device of this embodiment includes a material removal robot arm 160, a bag removal part 170 and a material removal conveyor line 180. The material removal robot arm 160 grabs the silicon wafer to the bag removal part 170 to remove the bagging on the surface of the silicon wafer. The material removal conveyor line 180 is provided with a paper removal part 181, and the paper removal part 181 removes the paper pieces on the surface of the silicon wafer. After the box body 140 is opened, the material removal robot arm 160 grabs the silicon wafer and transfers the silicon wafer to the bag removal part 170 and the material removal conveyor line 180 in turn to remove the bagging and paper pieces on the surface of the silicon wafer.

[0069] In this embodiment, a plurality of clamps 161 are provided at the end of the material removal robot arm 160, and the bag removal unit 170 includes a bag removal cylinder 171, a bag removal panel 172 and a bag removal suction cup 173. The bag removal cylinder 171 drives the bag removal panel 172, and the bag removal suction cups 173 are evenly distributed on the bag removal panel 172. The paper removal unit 181 includes a transverse cylinder 1811, a paper picking cylinder 1812 and a paper picking suction cup 1813. The transverse cylinder 1811 and the paper picking cylinder 1812 drive the paper picking suction cup 1813 to make the paper picking suction cup 1813 close to the silicon wafer for paper picking processing. The material removal robot 160 grabs several silicon wafers at a time and transfers them to the position of the bag removal suction cup 173, which absorbs the bag on the surface of the silicon wafer, and then the bag removal cylinder 171 flips the bag removal suction cup 173 through the bag removal panel 172 to facilitate the bag falling. After the bag removal is completed, the material removal robot 160 transfers the silicon wafer to the material removal conveyor line 180. When it arrives at the paper picking position, the transverse cylinder 1811 drives the paper picking suction cup 1813 to the corresponding position, and the paper picking cylinder 1812 drives the paper picking suction cup 1813 close to the silicon wafer to remove the paper on the surface of the silicon wafer.

[0070] Furthermore, after removing the bags and paper sheets on the surface of the silicon wafers, the material transfer truss 190 transfers the silicon wafers to the first base plate 11, the second base plate 21, the third base plate 31 and the fourth base plate 41 for silicon wafer stacking. After the stacking device completes the stacking, the material transfer truss 190 grabs the stacked silicon wafers to the unloading conveyor line 200 to complete the unloading process.

[0071] In combination with Example 1 and Example 2, the present invention realizes the rapid unpacking processing of silicon wafers, and can continuously unpack, remove materials, stack and unload silicon wafers. During this process, no manual operation is required, which reduces manpower consumption and can effectively improve the processing efficiency of silicon wafers. The silicon wafers will not be contaminated by manual operation, thereby ensuring the quality of the silicon wafers.

[0072] Obviously, the above embodiments are merely examples for clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the protection scope of the invention.

Claims

1. A silicon wafer stacking device, characterized in that: include A first flip module (10), the first flip module (10) comprising a first bottom plate (11) and a first limit block (12) located at an edge of the first bottom plate (11); A second flip module (20), the second flip module (20) comprising a second bottom plate (21) and a second limiting block (22) located at an edge of the second bottom plate (21); A third flip module (30), the third flip module (30) comprising a third bottom plate (31) and a third limiting block (32) located at an edge of the third bottom plate (31); A fourth flip module (40), the fourth flip module (40) comprising a fourth bottom plate (41) and a fourth limit block (42) located at an edge of the fourth bottom plate (41); in: Silicon wafers are placed on the first bottom plate (11), the second bottom plate (21), the third bottom plate (31) and the fourth bottom plate (41), and are respectively limited by the first limit block (12), the second limit block (22), the third limit block (32) and the fourth limit block (42); The first limiting block (12) and the second limiting block (22) are complementary in structure, and a first pressing plate (50) is arranged above the first bottom plate (11). When the silicon wafer on the first bottom plate (11) contacts the silicon wafer on the second bottom plate (21), the first pressing plate (50) presses the silicon wafer onto the first bottom plate (11); The third limiting block (32) and the fourth limiting block (42) are complementary in structure, and a third pressing plate (70) is arranged above the third bottom plate (31). When the silicon wafer on the third bottom plate (31) contacts the silicon wafer on the fourth bottom plate (41), the third pressing plate (70) presses the silicon wafer onto the third bottom plate (31); The first limiting block (12) and the third limiting block (32) are complementary in structure, and when the silicon wafer on the first bottom plate (11) contacts the silicon wafer on the third bottom plate (31), the third pressing plate (70) presses the silicon wafer onto the third bottom plate (31).

2. The silicon wafer stacking device according to claim 1, characterized in that: Also includes a transverse driving module (90), wherein the number of the transverse driving modules (90) is at least two, wherein one of the transverse driving modules (90) drives the first flip module (10) so that the first flip module (10) is close to the second flip module (20), and the other of the transverse driving modules (90) drives the third flip module (30) so that the third flip module (30) is close to the fourth flip module (40); A longitudinal driving module (100), wherein the longitudinal driving module (100) drives the third flipping module (30) so that the third flipping module (30) is close to the first flipping module (10).

3. The silicon wafer stacking device according to claim 2, characterized in that: The longitudinal driving module (100) is installed on a transverse driving module (90) to drive the third flip module (30) transversely or longitudinally.

4. The silicon wafer stacking device according to claim 1, characterized in that: Direction-changing motors (110) are arranged below the first base plate (11) and below the third base plate (31); one direction-changing motor (110) drives the first base plate (11) to change the stacking direction of the silicon wafers on the first base plate (11); and the other direction-changing motor (110) drives the third base plate (31) to change the stacking direction of the silicon wafers on the third base plate (31).

5. The silicon wafer stacking device according to claim 1, characterized in that: A second pressing plate (60) is arranged above the second bottom plate (21); when the first bottom plate (11) is close to the second bottom plate (21) for stacking silicon wafers, the second pressing plate (60) and the first pressing plate (50) are arranged in a staggered manner; A fourth pressing plate (80) is arranged above the fourth bottom plate (41), and when the third bottom plate (31) is close to the fourth bottom plate (41) for silicon wafer stacking, the fourth pressing plate (80) and the third pressing plate (70) are arranged in a staggered manner; When the third base plate (31) is close to the first base plate (11) for silicon wafer stacking, the third pressing plate (70) and the first pressing plate (50) are arranged in a staggered manner.

6. A silicon wafer unpacking device, comprising a silicon wafer stacking device according to any one of claims 1 to 5, characterized in that: It also includes a box opening device, a material removing device and a material unloading device, and the stacking device is located between the material removing device and the material unloading device.

7. The silicon wafer unpacking device according to claim 6, characterized in that: The box opening device comprises a box opening conveyor line (120) and a box opening mechanical arm (130). The box opening conveyor line (120) conveys a box body (140) containing silicon wafers. The end of the box opening mechanical arm (130) is provided with a loading suction cup (131) and a box opening cutter (132). The loading suction cup (131) sucks the box body (140), and the box opening cutter (132) cuts the tape on the box body (140).

8. The silicon wafer unpacking device according to claim 7, characterized in that: A plurality of box opening cylinders (150) are arranged at the end of the box opening conveyor line (120), and a box opening suction cup (151) is arranged at the end of the box opening cylinder (150). The box opening cylinder (150) drives the box opening suction cup (151) to open the box body (140).

9. The silicon wafer unpacking device according to claim 6, characterized in that: The material removal device comprises a material removal robot arm (160), a bag removal unit (170) and a material removal conveyor line (180). The material removal robot arm (160) grabs the silicon wafer to the bag removal unit (170) to remove the bagging on the surface of the silicon wafer. The material removal conveyor line (180) is provided with a paper removal unit (181), and the paper removal unit (181) removes paper pieces on the surface of the silicon wafer.

10. The silicon wafer unpacking device according to claim 6, characterized in that: It also includes a material transfer truss (190), which grabs and transfers the silicon wafer.

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