Material taking control method, device and equipment and storage medium

Abstract

Embodiments of the present disclosure disclose a material taking control method and device, equipment and storage medium. The method comprises the following steps: obtaining a fiber signal obtained by scanning a fiber on a material box, the material box containing at least one wafer, the scanning fiber and a mechanical hand being installed on the same movement motor, the movement motor being used to drive the scanning fiber and the mechanical hand to move; determining a first motor position when the scanning fiber scans a lower surface of a wafer in a target material layer and a second motor position when the scanning fiber scans an upper surface of a wafer in a next layer of the target material layer based on the fiber signal; determining a safe position range of the movement motor when the mechanical hand safely takes out the wafer from the target material layer or the next layer of the target material layer based on the first motor position and the second motor position; and controlling the mechanical hand to take material from the target material layer or the next layer of the target material layer based on the safe position range, so as to reduce the risk of the wafer being broken due to the wafer being touched by the mechanical hand in the process of the mechanical hand extending into the material box and improve the material taking safety.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to wafer manufacturing technology and wafer testing technology, and in particular to a material taking control method, device, equipment and storage medium. BACKGROUND

[0002] In chip production, multiple process steps need to be performed on wafers, and different process steps are distributed on different equipment. Most of the equipment needs to take out the transferred wafers from the wafer box by the robot. In the related technology, a fixed robot taking position is set, and the robot takes out the wafers from the wafer box based on the fixed taking position. However, when the robot takes out the wafers, if the wafer box is placed abnormally or the wafer shape is abnormal, the robot will collide and damage the wafers, and there is a risk of wafer fragments. How to safely take out the wafers from the wafer box is a problem to be solved. SUMMARY

[0003] Embodiments of the present disclosure provide a material taking control method, device, equipment and storage medium to improve the safety of material taking.

[0004] In one aspect of the embodiments of the present disclosure, a material taking control method is provided, comprising:

[0005] obtaining a fiber signal obtained by scanning a wafer box by a scanning fiber, at least one layer of wafers being placed in the wafer box, the scanning fiber and a robot being installed on the same movement motor, the movement motor being used to drive the scanning fiber and the robot to move;

[0006] determining a first motor position when the scanning fiber scans a lower surface of a wafer in a target layer, and determining a second motor position when the scanning fiber scans an upper surface of a wafer in a next layer of the target layer based on the fiber signal;

[0007] determining a safe position range of the movement motor when the robot safely takes out the wafer from the target layer or the next layer of the target layer based on the first motor position and the second motor position;

[0008] controlling the robot to adsorb the upper surface of the wafer in the next layer of the target layer or the lower surface of the wafer in the target layer and move out of the wafer box based on the safe position range.

[0009] In another aspect of the embodiments of the present disclosure, a material taking control device is provided, comprising:

[0010] a signal obtaining module configured to obtain a fiber signal obtained by scanning a wafer box by a scanning fiber, at least one layer of wafers being placed in the wafer box, the scanning fiber and a robot being installed on the same movement motor, the movement motor being used to drive the scanning fiber and the robot to move;

[0011] determining a first motor position when the scanning fiber scans a lower wafer surface in the target layer, and determining a second motor position when the scanning fiber scans an upper wafer surface in a next layer of the target layer based on the fiber signal;

[0012] determining a safe position range of the motion motor when the robot safely takes out the wafer from the target layer or the next layer of the target layer based on the first motor position and the second motor position;

[0013] controlling the robot to adsorb the upper wafer surface in the next layer of the target layer or the lower wafer surface in the target layer and move out the magazine based on the safe position range.

[0014] In another aspect of the embodiments of the present disclosure, a device for material taking control is provided, and the device comprises a host computer, a scanning fiber, a robot and a motion motor, wherein the robot and the scanning fiber are installed on the motion motor.

[0015] The motion motor is configured to drive the scanning fiber to move and scan a magazine, and the magazine is configured to place at least one wafer layer; and the motion motor is configured to drive the robot to move.

[0016] The host computer is configured to acquire a fiber signal obtained by the scanning fiber scanning the magazine; determine a first motor position when the scanning fiber scans a lower wafer surface in a target layer, and determine a second motor position when the scanning fiber scans an upper wafer surface in a next layer of the target layer based on the fiber signal; determine a safe position range of the motion motor when the robot safely takes out the wafer from the target layer or the next layer of the target layer based on the first motor position and the second motor position; and control the robot to adsorb the upper wafer surface in the next layer of the target layer or the lower wafer surface in the target layer and move out the magazine based on the safe position range.

[0017] In another aspect of the embodiments of the present disclosure, an electronic device is provided, and the electronic device comprises a memory configured to store a computer program, and a processor configured to execute the computer program stored in the memory, and the computer program is configured to implement the material taking control method of any of the above embodiments when executed.

[0018] In another aspect of the embodiments of the present disclosure, a computer readable storage medium is provided, and the computer readable storage medium stores a computer program, and the computer program is configured to implement the material taking control method of any of the above embodiments when executed by a processor.

[0019] In another aspect of the embodiments of the present disclosure, a computer program product is provided, which comprises a computer program. When the computer program is executed by a processor, the computer program implements the material taking control method according to any one of the above embodiments.

[0020] In the embodiments of the present disclosure, based on the optical fiber signals obtained by scanning the material box by the scanning optical fiber, the first motor position corresponding to the movement motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer and the second motor position corresponding to the movement motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer can be determined. The relative position between the lower surface of the wafer in the target material layer and the upper surface of the wafer in the next layer of the target material layer can be converted into the relative position of the movement motor. Thus, based on the relative position of the movement motor, the safe position range of the movement motor when the manipulator extends into the target material layer and the next layer can be determined. Based on the safe position range, the manipulator can be controlled to take material from the target material layer or the next layer of the target material layer. The risk of the wafer fragments caused by the manipulator touching the wafer in the target material layer and the wafer in the next layer of the target material layer during the extension into the material box can be reduced, and the safety of the material taking can be improved.

[0021] The technical solutions of the present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings, which form a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] The present disclosure can be more clearly understood and appreciated from the following detailed description, taken in conjunction with the accompanying drawings, in which:

[0024] Figure 1 FIG. 1 is a structural schematic diagram of a material taking control device provided by an exemplary embodiment of the present disclosure;

[0025] Figure 2 FIG. 2 is a flowchart of a material taking control method provided by an exemplary embodiment of the present disclosure;

[0026] Figure 3 FIG. 3 is a flowchart of a process of determining a safe position range provided by an exemplary embodiment of the present disclosure;

[0027] Figure 4 FIG. 4 is a schematic diagram of the movement change of a scanning optical fiber and a manipulator provided by an exemplary embodiment of the present disclosure;

[0028] Figure 5 FIG. 5 is a flowchart of a process of determining a safe position range provided by another exemplary embodiment of the present disclosure;

[0029] Figure 6 FIG. 6 is a schematic diagram of the movement change of a manipulator provided by an exemplary embodiment of the present disclosure;

[0030] Figure 7 is a schematic diagram of a safety upper limit margin and a safety lower limit margin provided by an example embodiment of the present disclosure;

[0031] Figure 8 is a flowchart of a material taking control method provided by another example embodiment of the present disclosure;

[0032] Figure 9 is a structural schematic diagram of a material taking control device provided by an example embodiment of the present disclosure;

[0033] Figure 10 is a structural schematic diagram of an electronic device provided by an example embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] Various example embodiments of the present disclosure will now be described in detail below with reference to the accompanying drawings. Note that the relative arrangement, numerical expressions, and numerical values of components and steps set forth in these embodiments do not limit the scope of the present disclosure unless otherwise specifically stated.

[0035] Those skilled in the art can understand that the terms "first", "second", and the like in the embodiments of the present disclosure are only used to distinguish different steps, devices, or modules, and do not represent any specific technical meaning, nor do they represent a necessary logical sequence between them.

[0036] It should also be understood that in the embodiments of the present disclosure, "multiple" can mean two or more, and "at least one" can mean one, two, or more.

[0037] It should also be understood that for any component, data, or structure mentioned in the embodiments of the present disclosure, one or more can be generally understood unless specifically limited or the context gives a contrary implication.

[0038] In addition, the term "and / or" in the present disclosure is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " in the present disclosure generally represents an "or" relationship between the front and rear associated objects.

[0039] It should also be understood that the description of various embodiments of the present disclosure focuses on the differences between the various embodiments, and the same or similar parts can be referred to each other, and for the sake of brevity, will not be repeated.

[0040] At the same time, it should be understood that, for the sake of brevity, the size of each part shown in the drawings is not drawn in accordance with the actual proportional relationship.

[0041] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0042] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0044] The embodiments disclosed herein can be applied to electronic devices such as terminal devices, computer systems, and servers, and can operate together with a wide range of other general-purpose or special-purpose computing system environments or configurations. Examples of well-known terminal devices, computing systems, environments, and / or configurations suitable for use with electronic devices such as terminal devices, computer systems, and servers include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputer systems, mainframe computer systems, and distributed cloud computing environments including any of the above systems, etc.

[0045] Electronic devices such as terminal devices, computer systems, and servers can be described in the general context of computer system executable instructions (such as program modules) executed by a computer system. Typically, program modules can include routines, programs, object programs, components, logic, data structures, etc., which perform specific tasks or implement specific abstract data types. Computer systems / servers can be implemented in distributed cloud computing environments, where tasks are executed by remote processing devices linked through communication networks. In distributed cloud computing environments, program modules can reside on local or remote computing system storage media, including storage devices.

[0046] like Figure 1 As shown, it illustrates a schematic diagram of the material handling control device provided in an exemplary embodiment of the present disclosure.

[0047] The taking control device includes a host computer 11 and a taking device 12. The taking device 12 includes a scanning optical fiber 121, a mechanical hand 122 and a motion motor 123. The scanning optical fiber 121 and the mechanical hand 122 are installed on the motion motor 123. The motion motor 123 is used to drive the scanning optical fiber 121 and the mechanical hand 122 to move. The scanning optical fiber 121 is used to scan a material box. Specifically, the scanning optical fiber 121 is used to scan a wafer placement layer in the material box, i.e., a material layer. The mechanical hand 122 is used to take and place wafers from the material box. The scanning optical fiber 121 and the mechanical hand 122 can move synchronously. The motion motor 123 can drive the scanning optical fiber 121 to move to scan the material box. The motion motor 123 can also drive the mechanical hand 122 to move so that the mechanical hand 122 moves to a position where the mechanical hand 122 can extend into the wafer placement layer of the material box to take and place wafers from the material box.

[0048] In a possible implementation, the scanning optical fiber 121 and the mechanical hand 122 are installed on the motion motor 123. The scanning optical fiber 121 and the mechanical hand 122 move in a space according to the motion motor 123. For example, the scanning optical fiber 121 and the mechanical hand 122 can move in the space along with the motion motor 123. In the space, the up-down direction can be regarded as a V-axis, and the left-right direction can be regarded as a U-axis. During the scanning of the material box, the motion motor 123 drives the scanning optical fiber 121 to move in parallel in the wafer placement direction of the material box, i.e., the up-down direction. The motion motor 123 can drive the scanning optical fiber 121 to move in the up-down direction (V-axis) so that the scanning optical fiber 121 scans the material box. During the wafer carrying process, the motion motor 123 drives the mechanical hand 122 to move in the up-down direction (V-axis). When the mechanical hand 122 moves to a position where the mechanical hand 122 can take wafers, the motion motor 123 drives the mechanical hand 122 to move in the left-right direction (U-axis) so that the mechanical hand 122 extends into the material box to take wafers.

[0049] The host computer 11 can be used to control the taking device 12 to perform a taking process. The taking device 12 controls the mechanical hand to take and place wafers from the material box according to a control signal of the host computer. In a possible implementation, when the mechanical hand takes wafers from the material box, the host computer 11 can acquire an optical fiber signal obtained by the scanning optical fiber scanning the material box. Based on the optical fiber signal, the host computer 11 determines a first motor position at which the scanning optical fiber scans a lower surface of a wafer in a target material layer, and a second motor position at which the scanning optical fiber scans an upper surface of a wafer in a next layer of the target material layer. Based on the first motor position and the second motor position, the host computer 11 determines a safe position range of the motion motor when the mechanical hand safely takes the wafer from the target material layer or the next layer of the target material layer. Based on the safe position range, the host computer 11 controls the mechanical hand to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

[0050] In one possible implementation, the robotic arm can remove the wafer by adsorbing its lower surface or its upper surface. Specifically, if a ceramic robotic arm is used, it uses negative pressure to adsorb and remove the wafer from its lower surface; if a Bernoulli robotic arm is used, it uses positive pressure to adsorb and remove the wafer from its upper surface. Therefore, after determining the position of the first motor when the scanning fiber scans the lower surface of the wafer in the target layer, and the position of the second motor when the scanning fiber scans the upper surface of the wafer in the next layer of the target layer, the wafers adsorbed by robotic arms with different adsorption principles can be either the target layer wafer or the wafer in the next layer of the target layer.

[0051] This can be understood as follows: Based on the positions of the first and second motors, after determining the safe position range, the Bernoulli manipulator is controlled to pick up the material from the layer below the target material layer using positive pressure adsorption, or the ceramic manipulator is controlled to pick up the material from the target material layer using negative pressure adsorption. For example, there are a total of 8 material layers in the material box, all storing wafers. From the top to the bottom (V-axis), the topmost wafer is the 8th layer, and so on. If the target material layer is the 3rd layer, and the layer below the target material layer is the 2nd layer, after determining the safe position range, the manipulator can extend between the 3rd and 2nd layers. If the manipulator is a ceramic manipulator, it will adsorb the lower surface of the 3rd layer wafer and remove it from the material box; if the manipulator is a Bernoulli manipulator, it will adsorb the upper surface of the 2nd layer wafer and remove it from the material box.

[0052] like Figure 2 The diagram illustrates a flowchart of a material handling control method provided in an exemplary embodiment of this disclosure. In one example, the method can be used in the host computer 11 of the aforementioned material handling control device, and the method includes steps 210-240:

[0053] Step 210: Obtain the optical fiber signal obtained from the scanning optical fiber scanning box.

[0054] The hopper contains at least one layer of wafers. The scanning fiber and the robotic arm are mounted on the same motion motor, which drives the movement of both. Before controlling the picking device to pick up wafers, the device can be installed and debugged. The robotic arm and scanning fiber are mounted on the V-axis of the motion motor, and the V-axis movement path of the motion motor is adjusted to be parallel to the wafer placement direction in the hopper. The robotic arm and scanning fiber are aligned and perpendicular to the movement direction axis of the motion motor, pointing towards the center of the hopper, so that the scanning fiber can scan the hopper and the robotic arm can reach into the hopper to pick up wafers.

[0055] After debugging, the control motion motor moves to make the scanning fiber scan the material box. When the scanning fiber scans the material box, the emitted opposite light fiber will be blocked by the wafer to generate a signal change, that is, the fiber signal obtained by the scanning fiber scanning the material box changes due to the wafer blocking. The host computer can obtain the fiber signal obtained by the scanning fiber scanning the material box, and determine whether the scanning fiber scans the wafer surface based on the fiber signal.

[0056] Step 220, based on the fiber signal, determining the first motor position when the scanning fiber scans the lower surface of the wafer in the target material layer, and determining the second motor position when the scanning fiber scans the upper surface of the wafer in the next layer of the target material layer.

[0057] The target material layer is the reference material layer, and the lower surface of the wafer in the target material layer is used to determine the safe range of the motion motor capable of taking out the wafer. In one possible implementation, when the robot takes out the wafer in the target material layer, it needs to stretch in from the middle of the target material layer and the next layer of the target material layer. In order to avoid the risk of touching the wafer in the target material layer or the wafer in the next layer of the target material layer when the robot stretches in, causing wafer fragments, the stretching position of the robot needs to be controlled according to the position of the lower surface of the wafer (referred to as the lower surface of the wafer) in the target material layer and the position of the upper surface of the wafer (referred to as the upper surface of the wafer) in the next layer of the target material layer. Of course, the principle of the robot taking out the wafer in the next layer of the target material layer is also the same, which will not be described here.

[0058] In one possible implementation, the wafer surface position is converted into the motor position of the motion motor in the material taking equipment, so as to determine whether the wafer can be safely taken out or placed according to the motion motor position. Wherein, the motor position of the motion motor refers to the position of the motion motor on the direction axis corresponding to the direction of the wafer in the material box (i.e. the above-mentioned V-axis position), for example, when the motion motor drives the scanning fiber to move up and down to scan the material box, the motor position of the motion motor is the position of the motion motor on the direction axis corresponding to the up-down direction (also can be called motor height).

[0059] Based on the acquired optical fiber signal, the first motor position of the moving motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer can be determined, and the second motor position of the moving motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer can be determined. In a possible implementation, the host computer can record the change process of the optical fiber signal of the scanning optical fiber scanning the material box and the corresponding scanning time, and record the motor position of the moving motor at the corresponding scanning time. When the first motor position is determined, the motor position of the moving motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer can be determined according to the change of the optical fiber signal, that is, the first motor position. When the second motor position is determined, the motor position of the moving motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer can be determined according to the change of the optical fiber signal, that is, the second motor position.

[0060] In step 230, based on the first motor position and the second motor position, the safe position range of the moving motor when the robot safely takes out the wafer from the target material layer or the next layer of the target material layer is determined.

[0061] In a possible implementation, the interval distance between the robot and the scanning optical fiber is a fixed distance. After the first motor position of the moving motor when the scanning optical fiber scans the lower surface of the wafer is obtained, and the second motor position of the moving motor when the scanning optical fiber scans the upper surface of the wafer in the next layer is obtained, the safe position range of the moving motor when the robot safely takes out the wafer from the target material layer or the next layer of the target material layer can be determined in combination with the interval distance between the robot and the scanning optical fiber.

[0062] Specifically, if a ceramic robot is used, the ceramic robot will adsorb the wafer from the lower surface of the wafer in the target material layer by negative pressure and move out of the material box. If a Bernoulli robot is used, the Bernoulli robot will adsorb the wafer from the upper surface of the wafer in the next layer of the target material layer by positive pressure and move out of the material box.

[0063] Whether the lower surface of the wafer in the target material layer is adsorbed or the upper surface of the wafer in the next layer of the target material layer is adsorbed, the safe position range of the moving motor when the robot safely takes out the corresponding wafer is consistent.

[0064] In step 240, based on the safe position range, the robot is controlled to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

[0065] In a possible implementation, after the safe position range is determined, the current motor position of the motion motor can be obtained, and if the current motor position is within the safe position range, the robot arm can be controlled to extend into the middle of the target layer and the next layer of the target layer, and the wafer in the target layer or the next layer of the target layer can be taken, that is, the robot arm can be controlled to adsorb the wafer in the target layer or the next layer of the target layer and move out of the magazine, thereby completing the wafer taking process.

[0066] In the embodiments of the present disclosure, based on the fiber signals obtained by scanning the magazine by the scanning fiber, the first motor position corresponding to the motion motor when the scanning fiber scans the lower surface of the wafer in the target layer and the second motor position corresponding to the motion motor when the scanning fiber scans the upper surface of the wafer in the next layer of the target layer can be determined, and the relative position between the lower surface of the wafer in the target layer and the upper surface of the wafer in the next layer of the target layer can be converted into the relative position of the motion motor, so that the safe position range of the motion motor when the robot arm extends into the middle of the target layer and the next layer of the target layer to take the wafer can be determined based on the relative position of the motion motor, and the wafer in the target layer or the next layer of the target layer can be taken based on the safe position range, thereby reducing the risk of the robot arm touching the wafer to cause wafer fragments during the extending process and improving the safety of taking the wafer.

[0067] In a possible implementation, the safe position range is determined in combination with the first motor position, the second motor position, and the interval distance between the robot arm and the scanning fiber, as shown in FIG. 3, the process can include steps 310-330. Figure 3

[0068] In step 310, the interval distance between the robot arm and the scanning fiber is obtained.

[0069] In a possible implementation, after the robot arm and the scanning fiber are installed on the motion motor, the interval distance between the robot arm and the scanning fiber on the motion direction axis can be measured and stored in the upper computer, and the interval distance is the vertical interval distance between the robot arm and the scanning fiber on the motion direction axis. In combination with the above example, when the motion direction axis is the direction axis corresponding to the up-down direction, the interval distance can be the vertical distance between the robot arm and the scanning fiber in the up-down direction.

[0070] In the process of determining the safe position range, the upper computer can obtain the stored interval distance.

[0071] In step 320, the upper limit of the safe range is determined based on the difference between the first motor position and the interval distance, and the upper limit of the safe range is the maximum value of the safe position range.

[0072] ​In one possible implementation, the robot arm is installed at a position higher than the scanning optical fiber. The first motor position is the position of the motion motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer. Subtracting the distance between the robot arm and the scanning optical fiber gives the position of the motion motor when the robot arm is aligned with the lower surface of the wafer in the target material layer. Based on the motor position when the robot arm is aligned with the lower surface of the wafer in the target material layer, the upper limit of the safe range corresponding to the motor position of the motion motor is determined. The upper limit of the safe range is not greater than the motor position when the robot arm is aligned with the lower surface of the wafer in the target material layer.

[0073] Indicative, such as Figure 4 As shown, the distance between the robot arm 122 and the scanning fiber 121 is H. The difference between the position of the motor of the motion motor when the scanning fiber scans the lower surface of the wafer in the target material layer and the position of the motor of the motion motor when the robot arm is aligned with the lower surface of the wafer in the target material layer is the distance H between the robot arm 122 and the scanning fiber 121. That is, as shown in the following formula (1):

[0074] ArmWaferPosV_up[i]=LightWaferPosV_down[i]-H (1)

[0075] Wherein, LightWaferPosV_down[i] is the motor position when the scanning fiber scans the lower surface of the i-th layer wafer (i.e., the first motor position), H is the interval distance between the robot arm 122 and the scanning fiber 121, and ArmWaferPosV_up[i] is the motor position when the robot arm is aligned with the lower surface of the i-th layer wafer.

[0076] Step 330: Based on the difference between the position of the second motor and the interval distance, determine the lower limit of the safe range. The lower limit of the safe range is the minimum value of the safe position range.

[0077] The second motor position is the position of the motion motor when the scanning fiber scans the upper surface of the wafer in the next layer of the target material layer. Subtracting the distance between the robot and the scanning fiber gives the position of the motion motor when the robot is aligned with the upper surface of the wafer in the next layer of the target material layer. Based on this position, the lower limit of the safety range corresponding to the motion motor position is determined. This lower limit is not less than the position of the motion motor when the robot is aligned with the upper surface of the wafer in the next layer of the target material layer. As shown in equation (2):

[0078] ArmWaferPosV_down[i]=LightWaferPosV_up[i-1]-H (2)

[0079] LightWaferPosV_up[i-1] is the motor position of the scanning fiber when scanning the upper surface of the i-1th wafer (i.e., the second motor position), and ArmWaferPosV_down[i] is the motor position of the robot when the robot is flush with the upper surface of the i-1th wafer.

[0080] In this embodiment, according to the first motor position and the second motor position and the interval distance between the robot and the scanning fiber, the motor position of the robot when the robot is flush with the lower surface of the wafer in the target layer and the motor position of the robot when the robot is flush with the upper surface of the wafer in the next layer of the target layer can be determined respectively, the upper limit of the safety range is determined according to the motor position of the robot when the robot is flush with the lower surface of the wafer in the target layer, and the lower limit of the safety range is determined according to the motor position of the robot when the robot is flush with the upper surface of the wafer in the next layer of the target layer, which can improve the accuracy of determining the safety position range, thereby helping to improve the safety of taking materials.

[0081] The robot has a certain thickness, and in another possible implementation, the thickness of the robot can also be considered in the process of determining the safety position range, so as to improve the accuracy of determining the safety position range. As shown in FIG. 4B, the process can include steps 410-430: Figure 5

[0082] Step 410: Obtain the first interval distance between the scanning fiber and the upper surface of the robot, and obtain the second interval distance between the scanning fiber and the lower surface of the robot.

[0083] To avoid the robot from touching the wafer, the upper surface of the robot needs to be avoided from touching the lower surface of the wafer in the target layer, and the lower surface of the robot needs to be avoided from touching the upper surface of the wafer in the next layer of the target layer, so the first interval distance between the scanning fiber and the upper surface of the robot and the second interval distance between the scanning fiber and the lower surface of the robot can be obtained respectively, and the first interval distance and the second interval distance can be measured and calculated in advance.

[0084] Step 420: Determine the upper limit of the safety range based on the difference between the first motor position and the first interval distance.

[0085] The motor position of the moving motor when the upper surface of the robot is flush with the lower surface of the wafer can be obtained by subtracting the first interval distance between the upper surface of the robot and the scanning fiber from the first motor position. For example, as shown in the following formula (3):

[0086] ArmWaferPosV_up[i]=LightWaferPosV_down[i]-H_up (3)

[0087] Wherein, H_up is the first interval distance.

[0088] ​The upper limit of the safety range is determined according to the motor position of the motor when the upper surface of the mechanical arm is flush with the lower surface of the wafer in the target material layer, so that the upper surface of the mechanical arm is prevented from touching the wafer in the target material layer. The upper limit of the safety range is not greater than the motor position when the upper surface of the mechanical arm is flush with the lower surface of the wafer in the target material layer.

[0089] In step 430, the lower limit of the safety range is determined based on the difference between the second motor position and the second interval distance.

[0090] The motor position of the motor when the lower surface of the mechanical arm is flush with the upper surface of the wafer in the next layer of the target material layer is obtained by subtracting the second interval distance between the lower surface of the mechanical arm and the scanning optical fiber from the second motor position. For example, the motor position is shown in the following formula (4):

[0091] ArmWaferPosV_down[i]=LightWaferPosV_up[i-1]-H_down (4)

[0092] H_down is the second interval distance.

[0093] The lower limit of the safety range is determined according to the motor position of the motor when the lower surface of the mechanical arm is flush with the upper surface of the wafer in the next layer of the target material layer, so that the lower surface of the mechanical arm is prevented from touching the wafer in the next layer of the target material layer. The lower limit of the safety range is not less than the motor position when the lower surface of the mechanical arm is flush with the upper surface of the wafer in the next layer of the target material layer.

[0094] In the embodiment, in the process of determining the safety position range, the thickness of the mechanical arm is considered, the upper limit of the safety range is determined based on the motor position of the motor when the upper surface of the mechanical arm is flush with the lower surface of the wafer in the target material layer, and the lower limit of the safety range is determined based on the motor position of the motor when the lower surface of the mechanical arm is flush with the upper surface of the wafer in the next layer of the target material layer, so that the upper surface of the mechanical arm is prevented from touching the wafer in the target material layer, the lower surface of the mechanical arm is prevented from touching the wafer in the next layer of the target material layer, and the safety of material taking is improved.

[0095] In a possible implementation, the process of calculating and obtaining the first interval distance between the scanning optical fiber and the upper surface of the mechanical arm can include steps 510-530:

[0096] In step 510, m third motor positions when the scanning optical fiber scans the lower surface of the m layers of wafers are obtained, and m fourth motor positions when the upper surface of the mechanical arm contacts the lower surface of each layer of wafers in the m layers of wafers are obtained respectively, m is an integer greater than or equal to 1.

[0097] In a possible implementation, m third motor positions when the scanning fiber scans the lower surface of the m layers of wafers can be acquired, and the m third motor positions are respectively the motor positions of the moving motor when the scanning fiber scans the lower surface of each layer of wafer in the m layers of wafers. To improve the accuracy of acquiring the third motor position, when the third motor position corresponding to scanning the lower surface of one layer of wafer is acquired, multiple sets of position data corresponding to scanning the lower surface of the layer of wafer multiple times can be acquired, and the average of the multiple sets of position data is determined as the third motor position corresponding to the lower surface of the layer of wafer.

[0098] Illustratively, the manner of calculating the third motor position when the scanning fiber scans the lower surface of the first layer of wafer is as shown in the following formula (5):

[0099]

[0100] wherein Vg1 is the third motor position corresponding to scanning the lower surface of the first layer of wafer once, n is the number of scanning times of the scanning fiber scanning the first layer of wafer, n is an integer greater than or equal to 1, the sum of the n sets of Vg1 is the sum of the third motor positions corresponding to scanning the lower surface of the first layer of wafer n times, and Vgp1 is the third motor position finally determined to correspond to scanning the lower surface of the first layer of wafer. Illustratively, n can be 10.

[0101] In a possible implementation, the position of the moving motor can be adjusted so that the upper surface of the mechanical hand is in contact with the lower surface of each layer of wafer in the m layers of wafers, and m fourth motor positions when the contact occurs can be acquired respectively.

[0102] Illustratively, when the m layers of wafers include the first layer of wafer, the thirteenth layer of wafer, and the twenty-fifth layer of wafer, the position of the moving motor can be adjusted so that the upper surface of the mechanical hand is in contact with the lower surface of the first layer of wafer, the thirteenth layer of wafer, and the twenty-fifth layer of wafer respectively, thereby acquiring the fourth motor position when the upper surface of the mechanical hand is in contact with the lower surface of the first layer of wafer, the fourth motor position when the upper surface of the mechanical hand is in contact with the lower surface of the thirteenth layer of wafer, and the fourth motor position when the upper surface of the mechanical hand is in contact with the lower surface of the twenty-fifth layer of wafer respectively.

[0103] In step 520, the difference between the m third motor positions and the m fourth motor positions is determined respectively, and m differences are obtained.

[0104] After the m third motor positions and the m fourth motor positions are obtained, the difference between the m third motor positions and the fourth motor positions corresponding to each of the third motor positions can be calculated respectively, and m differences are obtained. One difference is the difference between the third motor position when the scanning fiber scans the lower surface of one layer of wafer and the fourth motor position when the upper surface of the mechanical hand is in contact with the lower surface of the layer of wafer.

[0105] Illustratively, in combination with the above example, when the m layers of wafers include the 1st layer of wafers, the 13th layer of wafers, and the 25th layer of wafers, three difference values can be calculated, as shown in the following formulas (6), (7), and (8):

[0106] G1 = Vgp1 - V1 (6)

[0107] G13 = Vgp13 - V13 (7)

[0108] G25 = Vgp25 - V25 (8)

[0109] wherein Vgp1 is the third motor position corresponding to scanning the lower surface of the 1st layer of wafers; Vgp13 is the third motor position corresponding to scanning the lower surface of the 13th layer of wafers; Vgp25 is the third motor position corresponding to scanning the lower surface of the 25th layer of wafers; V1 is the fourth motor position when the upper surface of the robot is in contact with the lower surface of the 1st layer of wafers; V13 is the fourth motor position when the upper surface of the robot is in contact with the lower surface of the 13th layer of wafers; V25 is the fourth motor position when the upper surface of the robot is in contact with the lower surface of the 25th layer of wafers; G1 is the interval distance between the scanning optical fiber and the upper surface of the robot when scanning the lower surface of the 1st layer of wafers; G13 is the interval distance between the scanning optical fiber and the upper surface of the robot when scanning the lower surface of the 13th layer of wafers; and G25 is the interval distance between the scanning optical fiber and the upper surface of the robot when scanning the lower surface of the 25th layer of wafers.

[0110] Step 530, determining the mean value of the m difference values as the first interval distance.

[0111] Calculating the mean value of the m difference values, and determining the mean value of the m difference values as the first interval distance between the scanning optical fiber and the upper surface of the robot.

[0112] In combination with the above example, the first interval distance is calculated as shown in the following formula (9):

[0113]

[0114] That is, the first interval distance H_up between the scanning optical fiber and the upper surface of the robot is the mean value of the interval distance between the scanning optical fiber and the upper surface of the robot when scanning the lower surface of the 1st layer of wafers, the interval distance between the scanning optical fiber and the upper surface of the robot when scanning the lower surface of the 13th layer of wafers, and the interval distance between the scanning optical fiber and the upper surface of the robot when scanning the lower surface of the 25th layer of wafers.

[0115] In one possible implementation, the second interval distance can be calculated using the method of calculating the first interval distance. In another possible implementation, the second interval distance can be calculated based on the first interval distance and the thickness of the robot. The process of calculating the second interval distance between the scanning optical fiber and the lower surface of the robot can include steps 540-560:

[0116] Step 540: Obtain the position of the fifth motor when the lower surface of the robotic arm contacts the upper surface of the target wafer, and obtain the position of the sixth motor when the upper surface of the robotic arm contacts the lower surface of the target wafer. The target wafer has a preset thickness.

[0117] In one possible implementation, a target wafer with a preset thickness can be placed in the hopper beforehand, and the positions of the fifth motor and the sixth motor when the lower surface of the robot arm just contacts the upper surface of the target wafer are recorded respectively.

[0118] Step 550: Determine the thickness of the robotic arm based on the preset thickness and the difference between the positions of the fifth and sixth motors.

[0119] Indicative, such as Figure 6 As shown, the difference D between the positions of the fifth and sixth motors is the wafer thickness H of the target wafer. 晶 With the thickness H of the robotic arm 手 The difference between the positions of the fifth and sixth motors is calculated by summing the values ​​of the first and sixth motors, and then the difference between this difference and the preset thickness is calculated to obtain the thickness of the robotic arm.

[0120] Step 560: Determine the second interval distance based on the difference between the first interval distance and the thickness of the robotic arm.

[0121] The second interval distance is obtained by subtracting the thickness of the robotic arm from the first interval distance.

[0122] In this embodiment, the first interval distance between the upper surface of the robot arm and the scanning optical fiber is calculated based on multiple sets of data, which can improve the accuracy of determining the first interval distance. In addition, after the robot arm is installed on the motion motor, deformation and tilting may occur, and the thickness after installation may not be the same as the original thickness of the robot arm. Based on the motor position when the upper and lower surfaces of the robot arm are in contact with the upper and lower surfaces of the target wafer, respectively, and the wafer thickness of the target wafer, the thickness of the robot arm is calculated, which can obtain the actual thickness of the robot arm after it is installed on the motion motor, ensuring that the accurate thickness of the robot arm is obtained. Based on the accurate thickness of the robot arm and the first interval distance, a more accurate second interval distance is calculated, which improves the accuracy of determining the second interval distance.

[0123] In one possible implementation, a safety upper limit margin and a safety lower limit margin can be preset. The safety upper limit margin is used to control the lower surface distance between the robot and the lower surface of the wafer in the target material layer, and the safety lower limit margin is used to control the upper surface distance between the robot and the upper surface of the wafer in the next layer of the target material layer.

[0124] Indicative, such as Figure 7As shown, the safe upper limit margin Safe_up and the safe lower limit margin Safe_down can be preset.

[0125] When determining the safe position range, the preset safe upper limit margin and the safe lower limit margin can be obtained.

[0126] Optionally, the safe range upper limit can be determined based on the difference between the first motor position and the interval distance, and the safe upper limit margin. The difference between the first motor position and the interval distance is the motor position when the upper surface of the mechanical hand is flush with the lower surface of the wafer in the target material layer. In one possible implementation, the safe range upper limit is the difference between the motor position when the upper surface of the mechanical hand is flush with the lower surface of the wafer in the target material layer and the safe upper limit margin. In another possible implementation, the safe range upper limit can also be determined based on the difference between the first motor position and the first interval distance, and the safe upper limit margin. The difference between the first motor position and the first interval distance is the motor position when the lower surface of the mechanical hand is flush with the upper surface of the wafer in the target material layer. The safe range upper limit can be the difference between the motor position when the lower surface of the mechanical hand is flush with the upper surface of the wafer in the target material layer and the safe upper limit margin.

[0127] In combination with the above example, the safe range upper limit is ArmWaferPosV_up-Safe_up.

[0128] Optionally, the safe range lower limit can be determined based on the difference between the second motor position and the interval distance, and the safe lower limit margin. The difference between the second motor position and the interval distance is the motor position when the lower surface of the mechanical hand is flush with the upper surface of the wafer in the next layer of the target material layer. In one possible implementation, the safe range lower limit is the sum of the motor position when the lower surface of the mechanical hand is flush with the upper surface of the wafer in the next layer of the target material layer and the safe lower limit margin. In another possible implementation, the safe range lower limit can also be determined based on the difference between the second motor position and the second interval distance, and the safe lower limit margin. The difference between the second motor position and the second interval distance is the motor position when the upper surface of the mechanical hand is flush with the lower surface of the wafer in the next layer of the target material layer. The safe range lower limit can be the sum of the motor position when the upper surface of the mechanical hand is flush with the lower surface of the wafer in the next layer of the target material layer and the safe lower limit margin.

[0129] In combination with the above example, the safe range lower limit is ArmWaferPosV_down+Safe_down, and the safe position range is (ArmWaferPosV_down+Safe_down, ArmWaferPosV_up-Safe_up).

[0130] In this embodiment, the upper limit and the lower limit of the safety range are combined to determine the safety position range, so that when the motor position of the motion motor is in the safety position range, the robot can maintain a certain distance from the lower surface of the wafer in the target layer and the upper surface of the wafer in the next layer of the target layer, thereby avoiding damage to the wafer and improving the safety of the material taking.

[0131] After determining the safety position range, the robot can be controlled to take material from the target layer or the next layer of the target layer based on the safety position range. The step 240 can include the following steps 2401-2402.

[0132] In step 2401, the current motor position of the motion motor is obtained.

[0133] In one possible implementation, the motor position of the motion motor when taking the first layer of wafers (which can be referred to as the initial motor position) and the motion step of the motion motor can be pre-set. The motion step can be determined according to the distance between each layer of wafers in the material box. During the material taking process, the motion motor moves according to the set motion step to drive the robot to move.

[0134] The current motor position of the motion motor is the target position to which the motion motor moves before the robot takes material from the target layer or the next layer of the target layer. The current motor position of the motion motor can be calculated according to the corresponding layer number of the target layer or the next layer of the target layer and the pre-set motion step of the motion motor.

[0135] In step 2402, in response to the current motor position belonging to the safety position range, the robot is controlled to extend into the target layer and the next layer of the target layer to take material from the target layer or the next layer of the target layer.

[0136] After calculating the current motor position, if the current motor position belongs to the safety position range, the robot can be controlled to extend into the material layer to take wafers.

[0137] In response to the current motor position not belonging to the safety position range, a material taking alarm information is generated. The material taking alarm information is used to prompt that the position of the robot has a risk of taking and placing, so that the user can know the risk information in time to debug the equipment. In one possible implementation, generating the material taking alarm information can also control the material taking equipment to stop, that is, control the robot to pause the material taking process to avoid the risk of wafer fragmentation.

[0138] In one possible implementation, in response to the current motor position not belonging to the safety position range, the motor position of the motion motor can be automatically adjusted so that the motion motor is in the safety position range. When the motion motor moves into the safety position range, the robot can be controlled to take material from the target layer or the next layer of the target layer.

[0139] In a possible implementation, before the wafer is taken from the target layer or the next layer of the target layer, the thickness of the wafer can be detected to determine whether there is an abnormality, and in the case where the actual thickness of the wafer is normal, the safe position range of the moving motor is determined to control the robot to take the material based on the safe position range. The process includes steps 610-630.

[0140] In step 610, in response to taking the material from the target layer, the seventh motor position when the scanning fiber scans the upper surface of the wafer in the target layer is determined based on the fiber signal; and the actual thickness of the wafer to be taken in the target layer is determined based on the difference between the seventh motor position and the first motor position.

[0141] If the robot takes the material from the target layer, the wafer in the target layer is the wafer to be taken, and the thickness of the wafer to be taken in the target layer is detected. In this process, the host computer determines the seventh motor position when the scanning fiber scans the upper surface of the wafer in the target layer based on the acquired fiber signal.

[0142] In a possible implementation, the difference between the seventh motor position and the first motor position is determined as the actual thickness of the wafer to be taken in the target layer.

[0143] In step 620, in response to taking the material from the next layer of the target layer, the eighth motor position when the scanning fiber scans the lower surface of the wafer in the next layer of the target layer is determined based on the fiber signal; and the actual thickness of the wafer to be taken in the next layer of the target layer is determined based on the difference between the second motor position and the eighth motor position.

[0144] If the robot takes the material from the next layer of the target layer, the wafer in the next layer of the target layer is the wafer to be taken, and the thickness of the wafer to be taken in the next layer of the target layer is detected. In this process, the host computer determines the eighth motor position when the scanning fiber scans the lower surface of the wafer in the next layer of the target layer based on the acquired fiber signal.

[0145] The actual thickness of the wafer to be taken in the next layer of the target layer is determined based on the difference between the second motor position and the eighth motor position.

[0146] Illustratively, the method for calculating the actual thickness of the wafer is shown in the following formula (10):

[0147] WaferThick[i]=LightWaferPosV_up[i]-LightWaferPosV_down[i] (10)

[0148] WaferThick[i] is the actual thickness of the i-th wafer, LightWaferPosV_up[i] is the motor position of the moving motor when the scanning optical fiber is flush with the upper surface of the i-th wafer (the seventh motor position when the i-th wafer is the target wafer, and the second motor position when the i-th wafer is the next wafer of the target wafer); LightWaferPosV_down[i] is the motor position of the moving motor when the scanning optical fiber is flush with the lower surface of the i-th wafer (the first motor position when the i-th wafer is the target wafer, and the eighth motor position when the i-th wafer is the next wafer of the target wafer).

[0149] In step 630, in response to the actual thickness of the wafer belonging to the preset thickness range, a safe position range of the moving motor when the robot safely takes out the wafer from the target wafer or the next wafer of the target wafer is determined based on the first motor position and the second motor position.

[0150] In a possible implementation, the maximum wafer thickness ThicKMax and the minimum wafer thickness ThicKMin can be preset. If the actual thickness of the wafer is within the preset thickness range (ThicKMin, ThicKMax), it is determined that the actual thickness of the wafer belongs to the preset thickness range, and the safe position range can be determined based on the first motor position and the second motor position, that is, the above-mentioned step 230 can be executed.

[0151] In another possible implementation, the thickness range can be set based on the preset wafer thickness. For example, the minimum wafer thickness is 1 / 2 of the preset wafer thickness, and the maximum wafer thickness is 2 times the preset wafer thickness. If the actual thickness of the wafer is within the preset thickness range (1 / 2 of the preset wafer thickness, 2 times the preset wafer thickness), it is determined that the actual thickness of the wafer belongs to the preset thickness range.

[0152] In a possible case, in response to the actual thickness of the wafer not belonging to the preset thickness range, the wafer abnormal type can be determined based on the actual thickness of the wafer, and the corresponding abnormal alarm information can be generated based on the wafer abnormal type.

[0153] Optionally, in response to the actual thickness of the wafer being less than the minimum thickness value of the preset thickness range, it is determined that the wafer abnormal type is a wafer thickness abnormality. If the actual thickness of the wafer is less than the set minimum thickness value (i.e., the above-mentioned minimum wafer thickness), it is determined that the wafer thickness is abnormal, and the thickness abnormality alarm information can be output. Illustratively, if the actual thickness of the wafer is less than 1 / 2 of the preset wafer thickness, the thickness abnormality alarm information is output.

[0154] Optionally, in response to the actual thickness of the wafer belonging to the first preset range, it is determined that the wafer abnormal type is wafer stacking placement, and the minimum value of the first preset range is not less than the maximum value of the preset thickness range. If the actual thickness of the wafer is within the first preset range, it is determined that the wafer is stacked (i.e. multiple wafers are placed in the layer where the wafer to be taken is placed), and wafer stacking alarm information can be output. Illustratively, the first preset range can be (2 times the preset wafer thickness, 3 times the preset wafer thickness), and if the actual thickness of the wafer is within the first preset range, wafer stacking alarm information can be output.

[0155] Optionally, in response to the actual thickness of the wafer belonging to the second preset range, it is determined that the wafer abnormal type is wafer misplacement mode, and the minimum value of the second preset range is not less than the maximum value of the first preset range. If the actual thickness of the wafer is within the second preset range, it is determined that the wafer is misplaced (e.g. the wafer is clamped into a groove in a different layer at both ends), and wafer misplacement alarm information can be output. Illustratively, the second preset range can be greater than 3 times the preset wafer thickness or more, and if the actual thickness of the wafer is within the second preset range, wafer misplacement alarm information can be output.

[0156] In this embodiment, before determining the safe position range, the actual thickness of the wafer to be taken in the taking layer (the target layer or the next layer of the target layer) is detected, and the safe position range is determined again in the case of normal wafer actual thickness, and the robot is controlled to take the material, so that the wafer itself and the placement position in the taking layer can be detected in time, and the taking safety is improved.

[0157] In the case of abnormal wafer actual thickness, the wafer abnormal type can also be determined based on the wafer actual thickness, and corresponding abnormal alarm information can be output, so that the user can obtain abnormal information and abnormal reasons in time.

[0158] In one exemplary embodiment, as shown in Figure 8 Taking the wafer in the target layer as an example, the taking control process includes the following steps:

[0159] In step 810, the motor position when the scanning fiber scans the upper surface and the lower surface of the wafer in the target layer is obtained, and the actual thickness of the wafer is calculated.

[0160] In step 820, it is determined whether the actual thickness of the wafer in the target layer is within the thickness range, and if so, step 830 is performed, and if not, step 870 is performed.

[0161] In step 830, it is determined whether the value of the first interval distance between the motor position when the scanning fiber scans the lower surface of the wafer in the target layer and the upper surface of the robot minus the safe upper limit margin is greater than the wafer taking and placing height, and if so, step 840 is performed, and if not, step 860 is performed.

[0162] The wafer pick-and-place height of the robot refers to the motor height of the motor moving when the robot picks and places the wafer, i.e., the current motor position in the above embodiment. The safe upper limit range is the first interval distance between the motor position when the wafer lower surface in the target material layer is scanned and the scanning optical fiber and the upper surface of the robot plus the safe upper limit margin. Whether the value of the first interval distance between the motor position when the wafer lower surface in the target material layer is scanned and the scanning optical fiber and the upper surface of the robot plus the safe upper limit margin is greater than the wafer pick-and-place height of the robot determines whether the current motor position is less than the safe upper limit range.

[0163] In step 840, whether the value of the second interval distance between the motor position when the wafer upper surface in the next layer of the target material layer is scanned and the scanning optical fiber and the lower surface of the robot plus the safe lower limit margin is less than the wafer pick-and-place height of the robot is determined. If yes, step 850 is performed; if no, step 860 is performed.

[0164] The safe lower limit range is the value of the second interval distance between the motor position when the wafer upper surface in the next layer of the target material layer is scanned and the scanning optical fiber and the lower surface of the robot plus the safe lower limit margin. Whether the value of the second interval distance between the motor position when the wafer upper surface in the next layer of the target material layer is scanned and the scanning optical fiber and the lower surface of the robot plus the safe lower limit margin is less than the wafer pick-and-place height of the robot determines whether the current motor position is greater than the safe lower limit range.

[0165] In step 850, the robot is controlled to pick and place the wafer.

[0166] In step 860, pick-up alarm information is generated.

[0167] In step 870, whether the actual thickness of the wafer is less than 0.5 times the preset wafer thickness is determined. If yes, step 880 is performed; if no, step 890 is performed.

[0168] In step 880, wafer thickness abnormality alarm information is generated.

[0169] In step 890, whether the actual thickness of the wafer is greater than 2 times the preset wafer thickness and less than 3 times the preset wafer thickness is determined. If yes, step 8100 is performed; if no, step 8110 is performed.

[0170] In step 8100, wafer stacking alarm information is generated.

[0171] In step 8110, whether the actual thickness of the wafer is greater than 3 times the preset wafer thickness is determined. If yes, step 8120 is performed.

[0172] In step 8120, wafer mislayering alarm information is generated.

[0173] The specific implementation of steps 810-8120 can refer to the above embodiment, which will not be repeated here.

[0174] Figure 9 is a structural schematic diagram of a material taking control device provided by one exemplary embodiment of the present disclosure, which can be used in the upper computer in the above embodiments, and the device comprises:

[0175] The signal acquisition module 910 is configured to acquire a fiber signal obtained by scanning a fiber on a material box, at least one wafer is placed in the material box, the scanning fiber and the mechanical hand are installed on the same movement motor, and the movement motor is configured to drive the scanning fiber and the mechanical hand to move.

[0176] The position determination module 920 is configured to determine a first motor position when the scanning fiber scans a lower surface of a wafer in a target material layer, and determine a second motor position when the scanning fiber scans an upper surface of a wafer in a next layer of the target material layer based on the fiber signal.

[0177] The range determination module 930 is configured to determine a safe position range of the movement motor when the mechanical hand safely takes out the wafer from the target material layer or the next layer of the target material layer based on the first motor position and the second motor position.

[0178] The material taking control module 940 is configured to control the mechanical hand to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer and move out of the material box based on the safe position range.

[0179] In one exemplary embodiment, the installation position of the mechanical hand is higher than the installation position of the scanning fiber.

[0180] The range determination module 930 is further configured to:

[0181] acquire a spacing distance between the mechanical hand and the scanning fiber;

[0182] determine an upper limit of the safe range based on a difference between the first motor position and the spacing distance, the upper limit of the safe range being a maximum value of the safe position range;

[0183] determine a lower limit of the safe range based on a difference between the second motor position and the spacing distance, the lower limit of the safe range being a minimum value of the safe position range.

[0184] In one exemplary embodiment, the range determination module 930 is further configured to:

[0185] acquire a first spacing distance between the scanning fiber and an upper surface of the mechanical hand, and acquire a second spacing distance between the scanning fiber and a lower surface of the mechanical hand;

[0186] determine the upper limit of the safety range based on a difference between the first motor position and the first interval distance;

[0187] determine the lower limit of the safety range based on a difference between the second motor position and the second interval distance.

[0188] In an exemplary embodiment, the range determining module 930 is further configured to:

[0189] obtain a preset safety upper limit margin and a safety lower limit margin, the safety upper limit margin being used to control a lower surface spacing between the robot and a lower surface of a wafer in the target layer, and the safety lower limit margin being used to control an upper surface spacing between the robot and an upper surface of a wafer in a next layer of the target layer;

[0190] determine the upper limit of the safety range based on a difference between the first motor position and the interval distance, and the safety upper limit margin;

[0191] determine the lower limit of the safety range based on a difference between the second motor position and the interval distance, and the safety lower limit margin.

[0192] In an exemplary embodiment, the apparatus further comprises:

[0193] a position obtaining module configured to obtain m third motor positions when the scanning fiber scans a lower surface of a wafer in an mth layer, and obtain m fourth motor positions when an upper surface of the robot contacts a lower surface of each wafer in the m layers of wafers, m being an integer greater than or equal to 1;

[0194] a difference determining module configured to determine a difference between the m third motor positions and the m fourth motor positions, respectively, to obtain m differences;

[0195] a distance determining module configured to determine a mean value of the m differences as the first interval distance.

[0196] In an exemplary embodiment, the position obtaining module is further configured to:

[0197] obtain a fifth motor position when a lower surface of the robot contacts an upper surface of a target wafer, and obtain a sixth motor position when an upper surface of the robot contacts a lower surface of the target wafer, the target wafer having a preset thickness;

[0198] The apparatus further comprises:

[0199] a first thickness determining module configured to determine a robot thickness of the robot based on the preset thickness and a difference between the fifth motor position and the second motor position;

[0200] The distance determining module is further configured to determine the second interval distance based on a difference between the first interval distance and the thickness of the robot arm.

[0201] In one example embodiment, the position determining module 910 is further configured to:

[0202] In response to taking the wafer from the target layer, determine a seventh motor position of the scanning fiber when scanning a top surface of the wafer in the target layer based on the fiber signal; and in response to taking the wafer from the next layer of the target layer, determine an eighth motor position of the scanning fiber when scanning a bottom surface of the wafer to be taken in the next layer of the target layer based on the fiber signal.

[0203] The apparatus further includes:

[0204] A second thickness determining module is configured to, in response to taking the wafer from the target layer, determine a wafer actual thickness of the wafer in the target layer based on a difference between the seventh motor position and the first motor position; and in response to taking the wafer from the next layer of the target layer, determine a wafer actual thickness of the wafer to be taken in the next layer of the target layer based on a difference between the second motor position and the eighth motor position.

[0205] The range determining module 930 is further configured to, in response to the wafer actual thickness belonging to a preset thickness range, determine a safe position range of the motion motor when the robot arm safely takes the wafer from the target layer or the next layer of the target layer based on the first motor position and the second motor position.

[0206] In one example embodiment, the apparatus further includes:

[0207] A type determining module is configured to, in response to the wafer actual thickness not belonging to the preset thickness range, determine a wafer abnormality type based on the wafer actual thickness.

[0208] An information generating module is configured to generate corresponding abnormal alarm information based on the wafer abnormality type.

[0209] In one example embodiment, the type determining module is further configured to:

[0210] In response to the wafer actual thickness being less than a minimum thickness value of the preset thickness range, determine that the wafer abnormality type is a wafer thickness abnormality.

[0211] In response to the wafer actual thickness belonging to a first preset range, determine that the wafer abnormality type is wafer stacking, and a minimum value of the first preset range is not less than a maximum value of the preset thickness range.

[0212] In response to the actual thickness of the wafer belonging to a second preset range, the wafer abnormal type is determined as a wafer mislayering mode, and a minimum value of the second preset range is not less than a maximum value of the first preset range.

[0213] In one example embodiment, the material taking control module 940 is further configured to:

[0214] obtain a current motor position of the movement motor;

[0215] In response to the current motor position belonging to the safe position range, control the material taking device to take material from the target material layer or the next layer of the target material layer.

[0216] The information generation module is further configured to generate a material taking alarm information in response to the current motor position not belonging to the safe position range.

[0217] The material taking control device in the embodiments of the present disclosure and the embodiments of the material taking control method described above correspond to each other, and the related contents can be referred to each other, which will not be described here again. The beneficial technical effects of the material taking control device in the embodiments of the present disclosure can be referred to the corresponding beneficial technical effects of the example method described above, which will not be described here again.

[0218] In addition, the embodiments of the present disclosure further provide an electronic device, which comprises:

[0219] a memory configured to store a computer program;

[0220] a processor configured to execute the computer program stored in the memory, and when the computer program is executed, the material taking control method described in any of the embodiments of the present disclosure is implemented.

[0221] Figure 10 is a structural schematic diagram of an electronic device provided by an example embodiment of the present disclosure, as shown in Figure 10 The electronic device comprises one or more processors and a memory.

[0222] The processor can be a central processing unit (CPU) or other forms of processing units with data processing capability and / or instruction execution capability, and can control other components in the electronic device to perform desired functions.

[0223] The memory can store one or more computer program products, which can include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory, for example, can include random access memory (RAM), cache memory, and / or the like. The non-volatile memory, for example, can include read-only memory (ROM), hard disk, flash memory, and / or the like. One or more computer program products can be stored on the computer-readable storage media, and the processor can execute the computer program products to implement the material taking control method of various embodiments of the present disclosure described above and / or other desired functions.

[0224] In one example, the electronic device can further include an input device and an output device, which are interconnected through a bus system and / or other forms of connection mechanisms (not shown).

[0225] In addition, the input device can further include, for example, a keyboard, a mouse, and / or the like.

[0226] The output device can output various information, including the determined distance information, direction information, and / or the like, to the outside. The output device can include, for example, a display, a speaker, a printer, a communication network and a remote output device connected thereto, and / or the like.

[0227] Of course, in order to simplify, Figure 10 Only some of the components related to the present disclosure among the electronic device are shown in FIG. 1, and components such as a bus, an input / output interface, and / or the like are omitted. In addition to this, the electronic device can further include any other appropriate components according to a specific application.

[0228] In addition to the above-described method and device, embodiments of the present disclosure can be a computer program product including computer program instructions that, when executed by a processor, cause the processor to perform steps of the material taking control method according to various embodiments of the present disclosure described in the above parts of the specification.

[0229] The computer program product can be written in any combination of one or more programming languages, including an object-oriented programming language such as Java, C++, and / or the like, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device or entirely on the remote computing device or server.

[0230] In addition, an embodiment of the present disclosure can also be a computer readable storage medium, having stored thereon computer program instructions, which, when executed by a processor, cause the processor to perform the steps of the material taking control method according to various embodiments of the present disclosure described in the foregoing parts of the specification.

[0231] The computer readable storage medium can take the form of one or more combinations of any type of computer readable medium. The computer readable medium can be a computer readable signal medium or a computer readable storage medium. The computer readable storage medium can include, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium include an electrical connection having one or more wires, a portable disc, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0232] The above describes the basic principles of the present disclosure in combination with specific embodiments, but it should be noted that the advantages, benefits, effects and the like mentioned in the present disclosure are only examples and are not limiting, and these advantages, benefits, effects and the like cannot be considered as necessary for each embodiment of the present disclosure. In addition, the above specific details are only for the purpose of example and for the purpose of understanding, and the above details do not limit the present disclosure to be necessarily implemented with the above specific details.

[0233] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between each embodiment can be mutually referred to. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the part of the method embodiment.

[0234] The block diagrams of the devices, apparatuses, equipment, systems involved in the present disclosure are only illustrative examples and are not intended to require or imply that the connection, arrangement, configuration must be as shown in the block diagram. As those skilled in the art will recognize, these devices, apparatuses, equipment, systems can be connected, arranged, configured in any manner. Words such as "include", "contain", "have" and the like are open-ended words, mean "including but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0235] The methods and apparatus of the present disclosure can be implemented in a number of ways. For example, the methods and apparatus of the present disclosure can be implemented using software, hardware, firmware or any combination of software, hardware, firmware. The order of any steps described above is merely exemplary and the steps of the methods of the present disclosure need not be performed in the order described above unless otherwise specified. Furthermore, in some embodiments, the present disclosure can also be implemented as a program for running on a computer or a processor to implement the methods according to the present disclosure. Thus, the present disclosure also covers a record medium storing the program for executing the methods according to the present disclosure.

[0236] It is also noted that the methods of the present disclosure can be implemented by a computer or processor running a software program to execute the steps of the methods. In addition, the present disclosure covers any possible hardware and / or software combination having these functionalities. It is therefore contemplated to be covered by the scope of the present disclosure that combining computer software and hardware to create the methods of the present disclosure.

[0237] The foregoing description of the disclosed aspects is provided as an enabling teaching of the aspects described herein. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other aspects. Therefore, the description is not intended to be limited to the aspects described herein and the exemplary aspects are provided only as an illustration of the principles of the present disclosure. The scope of the present disclosure is defined by the appended claims and their equivalents.

[0238] The foregoing description has been presented for the purposes of illustration and description. Further, the description is not intended to limit the embodiments of the present disclosure to the form disclosed herein. Although various example aspects and embodiments have been discussed above, those of skill in the art will recognize certain modifications, permutations, additions, and sub-combinations thereof.

Claims

1. A material handling control method, characterized in that, The method includes: The fiber optic signal obtained by scanning the fiber optic cassette contains at least one layer of wafers. The scanning fiber optic and the robotic arm are mounted on the same motion motor, which drives the scanning fiber optic and the robotic arm to move. Based on the optical fiber signal, the position of the first motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer is determined, and the position of the second motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer is determined; Based on the positions of the first motor and the second motor, determine the safe position range of the motion motor when the robot arm safely removes the wafer from the target material layer or the layer below the target material layer; Based on the safe position range, the robotic arm is controlled to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and remove it from the material box; Wherein, the robotic arm is installed at a position higher than the scanning optical fiber; the step of determining the safe position range of the motion motor when the robotic arm safely removes the wafer from the target material layer or the layer below the target material layer, based on the positions of the first motor and the second motor, includes: Obtain the distance between the robotic arm and the scanning optical fiber; Based on the difference between the position of the first motor and the interval distance, an upper limit of the safety range is determined, wherein the upper limit of the safety range is the maximum value of the safety position range; Based on the difference between the second motor position and the interval distance, a lower limit of the safety range is determined, which is the minimum value of the safety position range.

2. The method according to claim 1, characterized in that, The step of obtaining the distance between the robotic arm and the scanning optical fiber includes: Obtain a first interval distance between the scanning optical fiber and the upper surface of the robotic arm, and obtain a second interval distance between the scanning optical fiber and the lower surface of the robotic arm; Determining the upper limit of the safety range based on the difference between the position of the first motor and the interval distance includes: The upper limit of the safety range is determined based on the difference between the position of the first motor and the first interval distance; Determining the lower limit of the safety range based on the difference between the position of the second motor and the interval distance includes: The lower limit of the safety range is determined based on the difference between the position of the second motor and the second interval distance.

3. The method according to claim 1 or 2, characterized in that, The method further includes: Obtain a preset safety upper limit margin and a safety lower limit margin. The safety upper limit margin is used to control the lower surface distance between the robot and the lower surface of the wafer in the target material layer. The safety lower limit margin is used to control the upper surface distance between the robot and the upper surface of the wafer in the next layer of the target material layer. Determining the upper limit of the safety range based on the difference between the position of the first motor and the interval distance includes: The upper limit of the safety range is determined based on the difference between the position of the first motor and the interval distance, and the safety upper limit margin; Determining the lower limit of the safety range based on the difference between the position of the second motor and the interval distance includes: The lower limit of the safety range is determined based on the difference between the position of the second motor and the interval distance, and the safety margin.

4. The method according to claim 2, characterized in that, The method further includes: The positions of m third motors when the scanning fiber scans the lower surface of the m-layer wafer are obtained, and the positions of m fourth motors when the upper surface of the robotic arm contacts the lower surface of each layer of the m-layer wafer are obtained respectively, where m is an integer greater than or equal to 1; The differences between the positions of the m third motors and the positions of the m fourth motors are determined respectively, resulting in m differences; The mean of the m differences is determined as the first interval distance.

5. The method according to claim 2, characterized in that, The method further includes: The position of the fifth motor is obtained when the lower surface of the robotic arm contacts the upper surface of the target wafer, and the position of the sixth motor is obtained when the upper surface of the robotic arm contacts the lower surface of the target wafer, wherein the target wafer has a preset thickness; The thickness of the robotic arm is determined based on the preset thickness and the difference between the position of the fifth motor and the position of the second motor. The second interval distance is determined based on the difference between the first interval distance and the thickness of the robotic arm.

6. The method according to claim 1 or 2, characterized in that, After acquiring the fiber optic signal obtained from the scanning fiber optic cassette, the method further includes: In response to retrieving material from the target material layer, based on the fiber optic signal, the position of the seventh motor when the scanning fiber scans the upper surface of the wafer in the target material layer is determined; based on the difference between the seventh motor position and the first motor position, the actual thickness of the wafer to be retrieved in the target material layer is determined; or, in response to retrieving material from the next layer of the target material layer, based on the fiber optic signal, the position of the eighth motor when the scanning fiber scans the lower surface of the wafer to be retrieved in the next layer of the target material layer is determined; based on the difference between the second motor position and the eighth motor position, the actual thickness of the wafer to be retrieved in the next layer of the target material layer is determined. In response to the actual thickness of the wafer falling within a preset thickness range, based on the positions of the first motor and the second motor, a safe position range for the motion motor is determined when the robotic arm safely removes the wafer from the target material layer or the layer below the target material layer; In response to the actual thickness of the wafer not falling within the preset thickness range, a wafer anomaly type is determined based on the actual wafer thickness; based on the wafer anomaly type, a corresponding anomaly alarm message is generated.

7. The method according to claim 6, characterized in that, The determination of wafer anomaly type based on the wafer thickness includes: In response to the actual thickness of the wafer being less than the minimum thickness value of the preset thickness range, the wafer anomaly type is determined to be a wafer thickness anomaly; In response to the actual thickness of the wafer falling within a first preset range, the wafer anomaly type is determined to be wafer stacking, wherein the minimum value of the first preset range is not less than the maximum value of the preset thickness range; In response to the actual thickness of the wafer falling within a second preset range, the wafer anomaly type is determined to be a wafer misalignment, wherein the minimum value of the second preset range is not less than the maximum value of the first preset range.

8. The method according to claim 1 or 2, characterized in that, Based on the safe position range, controlling the robotic arm to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and remove it from the material box includes: Obtain the current position of the motion motor; In response to the current motor position being within the safe position range, the robotic arm is controlled to extend between the target material layer and the layer below the target material layer to retrieve material from the target material layer or the layer below the target material layer; The method further includes: In response to the current motor position not being within the safe position range, a material handling alarm is generated.

9. A material handling control device, characterized in that, The device includes: The signal acquisition module is used to acquire the optical fiber signal obtained by scanning the optical fiber scanning box. The box contains at least one layer of wafers. The scanning optical fiber and the robot are mounted on the same motion motor. The motion motor is used to drive the scanning optical fiber and the robot to move. The position determination module is used to determine, based on the optical fiber signal, the position of the first motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and the position of the second motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer; The range determination module is used to determine, based on the positions of the first motor and the second motor, the safe position range of the motion motor when the robot arm safely removes the wafer from the target material layer or the layer below the target material layer; The material handling control module is used to control the robotic arm to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer based on the safe position range, and remove it from the material box; Wherein, the robotic arm is installed at a position higher than the scanning optical fiber; the range determination module is specifically used for: Obtain the distance between the robotic arm and the scanning optical fiber; Based on the difference between the position of the first motor and the interval distance, an upper limit of the safety range is determined, wherein the upper limit of the safety range is the maximum value of the safety position range; Based on the difference between the second motor position and the interval distance, a lower limit of the safety range is determined, which is the minimum value of the safety position range.

10. A material handling control device, characterized in that, The device includes a host computer, a scanning optical fiber, a robotic arm, and a motion motor, wherein the robotic arm and the scanning optical fiber are mounted on the motion motor; The motion motor is used to drive the scanning optical fiber to move the scanning cassette, which contains at least one layer of wafers. And for driving the robotic arm to move; The host computer is used to acquire the optical fiber signal obtained by scanning the material box with the scanning optical fiber; based on the optical fiber signal, it determines the position of the first motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and determines the position of the second motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer; Based on the positions of the first motor and the second motor, determine the safe position range of the motion motor when the robot arm safely removes the wafer from the target material layer or the layer below the target material layer; Based on the safe position range, the robotic arm is controlled to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and remove it from the material box; Wherein, the robotic arm is installed at a position higher than the scanning optical fiber; when the host computer determines the safe position range of the motion motor when the robotic arm safely removes the wafer from the target material layer or the layer below the target material layer, it is specifically used for: Obtain the distance between the robotic arm and the scanning optical fiber; Based on the difference between the position of the first motor and the interval distance, an upper limit of the safety range is determined, wherein the upper limit of the safety range is the maximum value of the safety position range; Based on the difference between the second motor position and the interval distance, a lower limit of the safety range is determined, which is the minimum value of the safety position range.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the material handling control method according to any one of claims 1-8.

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