Electroplating equipment and selective electroplating method
By setting the design of a morphologically matching shielding gasket and clamping mechanism at the outlet of the electroplating equipment, the problem of high cost of complex masking technology in the prior art is solved, and the accuracy and cost-effectiveness of selective electroplating are achieved.
Patent Information
- Application Number
- CN202411883844.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-03-28
AI Technical Summary
Existing electroplating equipment requires complex masking technology to achieve selective electroplating, which is costly.
An electroplating device is designed, including an electroplating liquid tank and a liquid outlet that can be flipped up and down. A shielding gasket and a clamping mechanism are provided at the liquid outlet. The morphology of the shielding gasket matches the geometric shape of the desired electroplating area to achieve selective electroplating.
By matching the precise shielding gasket with the desired electroplating area, the electroplating area is effectively controlled, the electroplating in non-target areas is reduced, the material utilization rate and processing accuracy are improved, and the cost is reduced.
Smart Images
Figure CN119710873A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electroplating technology, and in particular to an electroplating device and a selective electroplating method. Background Art
[0002] Electroplating is a common surface treatment process in modern industry and is widely used in many fields. By connecting current to the electroplating solution, the metal ions in the electroplating solution are reduced from the electroplating solution through electrolysis reaction and deposited on the surface of the workpiece to be electroplated, forming a uniform metal coating to improve the physical, chemical and electrical properties of the workpiece to be electroplated.
[0003] In the electronics, automotive, aerospace or other industries, it is often necessary to electroplate only specific areas of the workpiece to be electroplated (the specific area is referred to as the desired electroplating area of the workpiece to be electroplated). This can improve the corrosion resistance, conductivity or wear resistance of the workpiece after electroplating while minimizing the use of expensive electroplating materials.
[0004] However, currently common electroplating equipment requires complex mask technology to achieve selective electroplating, which is relatively costly. Summary of the invention
[0005] In view of this, the present application provides an electroplating device and a selective electroplating method, so as to provide an electroplating device with lower cost to achieve selective electroplating.
[0006] Specifically, the present application is implemented through the following technical solutions: A first aspect of the present application provides an electroplating device, the electroplating device comprising an electroplating liquid tank that can be turned upside down; The upper end of the electroplating tank is provided with at least one liquid outlet, and each liquid outlet is provided with a shielding gasket and a clamping mechanism; the workpiece to be electroplated covers each liquid outlet and is clamped and fixed by the clamping mechanism, the shielding gasket covers a partial area of the workpiece to be electroplated and forms a seal with the workpiece to be electroplated, and the morphology of the shielding gasket matches the geometric shape of the desired electroplating area to achieve selective electroplating; The clamping mechanism constitutes the anode of the electroplating equipment; a cathode is also arranged on the electroplating tank; the electroplating tank is specifically used to clamp the workpiece to be electroplated through the clamping mechanism when the liquid outlet is at the top, and then after clamping the workpiece to be electroplated, the liquid outlet is flipped downward, and the anode and the cathode are energized to start electroplating the workpiece to be electroplated.
[0007] Optionally, the electroplating equipment further comprises a self-cleaning component, the lower end of the electroplating tank is provided with an insertion channel, the self-cleaning component is inserted into the insertion channel, and can move up and down in the insertion channel; The self-cleaning component comprises an inlet channel, an outlet channel, and a receiving groove respectively connected to the inlet channel and the outlet channel; a sealing gasket is provided at the end of the receiving groove; Wherein, during the electroplating process, the self-cleaning component is at the lowest position; before the electroplating starts or after the electroplating ends, the self-cleaning component rises to the highest position, so that the end of the containing tank contacts the liquid outlet to form a sealing area; The inlet channel and the outlet channel are used for the inflow and outflow of clean water during the cleaning process and gas during the drying process. Cleaning liquid or gas is provided to the sealing area to clean or dry the workpiece at the liquid outlet.
[0008] Optionally, the electroplating liquid tank can be swung left and right or rotated horizontally to achieve a stirring function during the electroplating process to remove bubbles in the electroplating liquid.
[0009] Optionally, the height of the shielding gasket is greater than a specified value to accommodate the plating solution.
[0010] Optionally, the shielding gasket and / or the sealing gasket are made of any one of the following materials: silicone, rubber and polyvinyl fluoride.
[0011] Optionally, the electroplating equipment is used to selectively electroplate a two-dimensional plane, or the electroplating equipment is used to selectively electroplate a three-dimensional plane.
[0012] Optionally, the electroplating equipment further comprises a driving mechanism; Wherein, the driving mechanism is used to drive the electroplating liquid tank to flip up and down.
[0013] A second aspect of the present application provides a selective electroplating method, which is implemented based on any one of the electroplating devices provided in the first aspect of the present application; the method comprises: When the liquid outlet of the electroplating equipment is facing upward, fixing the workpiece to be electroplated at the liquid outlet; Turning the electroplating device upside down so that the liquid outlet is at the bottom; The anode and cathode of the electroplating device are energized to start selective electroplating of the workpiece to be electroplated by the electroplating device.
[0014] Optionally, the method further includes: After the electroplating is completed, turning the electroplating device upside down so that the liquid outlet is at the top; Controlling the self-cleaning component of the electroplating equipment to rise to the highest position, so that the end of the receiving groove of the self-cleaning component contacts the liquid outlet to form a sealing area; A cleaning liquid is provided to the sealing area through the inlet channel of the self-cleaning component, so as to clean the electroplated workpiece at the liquid outlet through the cleaning liquid; wherein, after the cleaning liquid cleans the electroplated workpiece, it is discharged from the outlet channel of the self-cleaning component; Gas is provided to the sealing area through the inlet channel of the self-cleaning component so as to dry the cleaned workpiece by the gas.
[0015] Optionally, after fixing the workpiece to be electroplated at the liquid outlet, the method further comprises: A cleaning liquid is provided to the sealing area through the inlet channel of the self-cleaning component so as to pre-clean the workpiece to be electroplated by the cleaning liquid; wherein, after the cleaning liquid pre-cleans the workpiece to be electroplated, it is discharged from the outlet channel of the self-cleaning component.
[0016] The electroplating equipment and selective electroplating method provided by the present application are provided with an electroplating tank that can be turned upside down, and at least one liquid outlet is provided at the upper end of the electroplating tank, and a shielding gasket and a clamping mechanism are provided at each liquid outlet, so that the workpiece to be electroplated is covered at each liquid outlet and clamped and fixed by the clamping mechanism, and the shielding gasket covers a partial area of the workpiece to be electroplated and forms a seal with the workpiece to be electroplated, the morphology of the shielding gasket matches the geometric shape of the desired electroplating area to achieve selective electroplating, and the clamping mechanism constitutes the anode of the electroplating equipment, and a cathode is also provided on the electroplating tank, so that the workpiece to be electroplated can be clamped by the clamping mechanism when the liquid outlet is at the top, and then after the workpiece to be electroplated is clamped, the liquid outlet is flipped to the bottom, and the anode and the cathode are energized to start electroplating the workpiece to be electroplated. In this way, on the first hand, by arranging a shielding gasket at the liquid outlet, its morphology matches the geometric shape of the desired electroplating area, and through the precise coordination of the shielding gasket and the desired electroplating area, the electroplating area can be effectively controlled, reducing the electroplating of non-target areas and avoiding unnecessary electroplating, thereby improving material utilization and processing accuracy, achieving selective electroplating, and achieving uniformity and consistency of electroplating. In addition, the electroplating equipment reduces the need for complex mask processes or special tools and has low costs. On the second hand, the clamping mechanism clamps the workpiece to be electroplated and acts as an anode, while cooperating with the shielding gasket to achieve sealing, which helps to reduce leakage of the plating solution and improves the reliability of the process. On the third hand, the plating tank can be flipped up and down, and the workpiece is fixed and aligned when the plating tank is on the top, and the electroplating operation is performed after flipping to the bottom, which helps to simplify the process and improve operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A schematic diagram of a first embodiment of the electroplating equipment provided in the present application; Figure 2A schematic diagram of the electroplating equipment provided in this application; Figure 3 A schematic diagram of a second embodiment of the electroplating equipment provided in this application; Figure 4 A schematic diagram showing the left-right swing of the electroplating tank provided in this application; Figure 5 This is a working principle diagram of a self-cleaning component in an electroplating device exemplarily shown in the present application; Figure 6 A schematic diagram of a third embodiment of the electroplating equipment provided in this application; Figure 7 This is a flow chart of Example 1 of the selective electroplating method provided in the present application.
[0018] 1: Electroplating tank; 11: Liquid outlet; 12: shielding gasket; 13: Clamping mechanism; 2: Workpiece to be electroplated; 21: Expected plating area; 3: Extend into the channel; 4: Self-cleaning components; 41: Entranceway; 42: Exit channel; 43: receiving groove; 44: Sealing gasket; 5: cathode; 6: Electroplating solution. DETAILED DESCRIPTION
[0019] Here, exemplary embodiments are described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application.
[0020] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in this article refers to and includes any or all possible combinations of one or more associated listed items.
[0021] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0022] Specific embodiments are given below to introduce the technical solution of the present application in detail.
[0023] Figure 1 This is a schematic diagram of the first embodiment of the electroplating equipment provided in this application. Please refer to Figure 1 The electroplating equipment provided in this embodiment includes an electroplating tank 1 that can be turned upside down; The upper end of the electroplating tank 1 is provided with at least one liquid outlet 11, and each liquid outlet 11 is provided with a shielding gasket 12 and a clamping mechanism 13; the workpiece 2 to be electroplated is covered at each liquid outlet 11, and is clamped and fixed by the clamping mechanism 13, the shielding gasket 12 covers a part of the workpiece 2 to be electroplated, and forms a seal with the workpiece 2 to be electroplated, and the morphology of the shielding gasket 12 matches the geometric shape of the desired electroplating area 21, so as to achieve selective electroplating; The clamping mechanism 13 constitutes the anode of the electroplating equipment; a cathode 5 is also provided on the electroplating tank 1; the electroplating tank 1 is specifically used to clamp the workpiece 2 to be electroplated through the clamping mechanism 13 when the liquid outlet 11 is at the top, and then after clamping the workpiece 2 to be electroplated, the liquid outlet 11 is flipped to the bottom, and the anode and the cathode 5 are energized to start electroplating the workpiece 2 to be electroplated.
[0024] Figure 2 This is the implementation principle diagram of the electroplating equipment provided in this application. Please refer to Figure 2 , Figure 2 In the electroplating device shown in FIG. (A), the liquid outlet 11 faces upward, and the workpiece 2 to be electroplated has been clamped and fixed above the liquid outlet 11 by the clamping mechanism 13, and the desired electroplating area 21 matches the morphology of the shielding gasket 12; Figure 2 In the electroplating equipment shown in FIG. 2 (B), the electroplating tank 1 is turned upside down, at which time the liquid outlet 11 faces downward, and the electroplating liquid 6 covers the liquid outlet 11 to electroplate the desired electroplating area 21 of the workpiece 2 to be electroplated.
[0025] It should be noted that the electroplating equipment provided in the present application further includes a driving mechanism (not shown in the figure); wherein the driving mechanism is used to drive the electroplating liquid tank 1 to flip up and down.
[0026] In specific implementation, different driving mechanisms can be selected according to actual needs to drive the electroplating tank 1 to flip up and down, and this application does not limit it. For example, in one embodiment, a motor driving system is used as a driving mechanism to drive the electroplating tank 1 to flip up and down; in another embodiment, a pneumatic or hydraulic driving system is used as a driving mechanism to drive the electroplating tank 1 to flip up and down.
[0027] For details, please refer to Figure 1 and Figure 2 The electroplating equipment provided in the present application includes a plating liquid tank 1 that can be turned upside down. The plating liquid tank 1 serves as the main body of the electroplating equipment, and a plating liquid 6 for plating a workpiece 2 to be plated is placed inside the plating liquid tank 1. Furthermore, a liquid outlet 11 is provided at the upper end of the plating liquid tank 1. When the workpiece 2 to be plated is electroplated, the plating liquid tank 1 can be turned upside down so that the liquid outlet 11 faces downward. At this time, the plating liquid 6 in the plating liquid tank 1 can cover the desired plating area 21 of the workpiece 2 to be plated, and the desired plating area 21 of the workpiece 2 to be plated can be accurately plated.
[0028] Furthermore, a shielding gasket 12 and a clamping mechanism 13 are provided near the liquid outlet 11, and the clamping mechanism 13 can firmly clamp and fix the workpiece 2 to be electroplated at the liquid outlet 11 to prevent the workpiece 2 to be electroplated from loosening, thereby avoiding misalignment of the desired electroplating area 21 and the liquid outlet 11, resulting in incomplete electroplating in the desired electroplating area 21.
[0029] In addition, the morphology of the shielding gasket 12 matches the geometric shape of the desired electroplating area 21. The shielding gasket 12 is placed under the workpiece 2 to be electroplated, and the workpiece 2 to be electroplated is fixed together with the clamping mechanism 13. The shielding gasket 12 also covers a partial area of the workpiece 2 to be electroplated, forming a sealed structure with the workpiece 2 to be electroplated, so that when the desired electroplating area 21 is electroplated, the plating solution 6 will not flow into a position outside the desired electroplating area 21, causing erroneous electroplating.
[0030] It should be noted that, in a possible implementation, the height of the shielding gasket 12 is greater than a specified value to accommodate the electroplating solution 6. Figure 2 It is understood that the specified value is set according to actual needs, and is not limited in this embodiment. When the workpiece 2 to be electroplated is different, the specified height can be different, and the height of the shielding gasket 12 can be set according to actual needs. For example, see Figure 2 When the workpiece 2 to be electroplated is a heat dissipation cover, the height of the shielding gasket 12 can be equal to the height of the surrounding portion of the heat dissipation cover.
[0031] Furthermore, the shielding gasket 12 is made of any of the following materials: silicone, rubber and polyvinyl fluoride. It should be noted that different materials can be selected according to actual needs to make the shielding gasket 12. In the present application, it is not limited. For example, in one embodiment, in an electroplating process with high temperature and elasticity requirements, silicone can be selected as the material for making the shielding gasket 12; in another embodiment, when the workpiece 2 to be electroplated is a metal, an electroplating solution with low chemical requirements is used for electroplating, and rubber can be used as the material for making the shielding gasket 12, which has good sealing properties; in yet another embodiment, an electroplating environment with high chemical resistance and high temperature resistance is required, and polyvinyl fluoride can be used as the material for making the shielding gasket 12.
[0032] In summary of the above description, the electroplating equipment provided by the present application, by arranging a liquid outlet above the electroplating liquid tank, containing electroplating liquid inside the electroplating liquid tank, fixing the workpiece to be electroplated by a shielding gasket and a clamping mechanism, so that the position of the liquid outlet matches the desired electroplating area of the workpiece to be electroplated, and then, turning the electroplating liquid tank upside down so that the liquid outlet faces downward, the electroplating liquid covers the desired electroplating area, and selectively electroplating the desired electroplating area of the workpiece to be electroplated, thereby improving the precision electroplating capability of the electroplating equipment.
[0033] It should be noted that there is at least one liquid outlet 11 at the upper end of the electroplating tank 1, and multiple liquid outlets 11 can be set. Each liquid outlet 11 is provided with a respective matching clamping mechanism 13 and a shielding gasket 12, and a plurality of workpieces 2 to be electroplated, the same number as the liquid outlets 11, are respectively covered on each liquid outlet 11, so that multiple desired electroplating areas 21 of the multiple workpieces 2 to be electroplated can be electroplated simultaneously.
[0034] Furthermore, the specific number of the liquid outlets 11 can be set according to actual needs, and in the present application, there is no limitation on the number of the liquid outlets 11. For example, in one embodiment, the number of the liquid outlets 11 on the electroplating tank 1 is 2. Figure 3 This is a schematic diagram of the second embodiment of the electroplating equipment provided in this application. Please refer to Figure 3 ,exist Figure 3 In the electroplating equipment shown in FIG. (A), two liquid outlets 11 are arranged above the electroplating tank 1, two workpieces 2 to be electroplated are placed above the liquid outlets 11, clamping mechanisms 13 are arranged on both sides of the liquid outlets 11 to clamp and fix the workpieces 2 to be electroplated, and shielding gaskets 12 are arranged around the liquid outlets 11 to further fix the workpieces 2 to be electroplated and limit the desired electroplating area 21 to match the liquid outlets 11; Figure 3 In the electroplating device shown in FIG. (B), two workpieces 2 to be electroplated are respectively covered on two liquid outlets 11, which are fixed by a clamping mechanism 13 and a shielding gasket 12, and the liquid outlet 11 matches the desired electroplating area 21; Figure 3 In the electroplating equipment shown in Figure (C), the electroplating tank 1 is turned upside down. At this time, the two liquid outlets 11 are facing downward, and the electroplating liquid 6 in the electroplating tank 1 covers the desired plating areas 21 of the two workpieces 2 to be electroplated, and the two workpieces 2 to be electroplated are electroplated at the same time.
[0035] The electroplating equipment provided in this embodiment has multiple liquid outlets arranged above the electroplating liquid tank, and respective matching shielding gaskets and clamping mechanisms are arranged around the multiple liquid outlets. In this way, the desired plating areas of multiple workpieces to be electroplated can be matched with the respective liquid outlets, and then the multiple workpieces to be electroplated can be electroplated at the same time, which can improve the efficiency of electroplating.
[0036] Furthermore, in the electroplating equipment provided in this embodiment, the clamping mechanism 13 constitutes the anode of the electroplating equipment; a cathode 5 is also provided on the electroplating tank 1; the electroplating tank 1 is specifically used to clamp the workpiece 2 to be electroplated through the clamping mechanism 13 when the liquid outlet 11 is at the top, and then after clamping the workpiece 2 to be electroplated, the liquid outlet 11 is flipped to the bottom, and the anode and the cathode 5 are energized to start electroplating the workpiece 2 to be electroplated.
[0037] For details, please continue to refer to Figure 1 ,exist Figure 1 The cathode 5 is arranged on the left side of the electroplating tank 1 shown, and the clamping mechanism 13 is used as the anode of the electroplating equipment. After that, after the clamping mechanism 13 clamps the workpiece 2 to be electroplated, the electroplating tank 1 is turned upside down, so that the liquid outlet 11 is turned down, and the electroplating liquid 6 covers the desired electroplating area 21 of the workpiece 2 to be electroplated. In this way, the anode and the cathode 5 are energized, and the current flows through the anode and the cathode 5, prompting the desired electroplating area 21 of the workpiece 2 to be electroplated to start electroplating. Furthermore, during the electroplating process, the metal ions in the electroplating solution 6 can be precipitated on the surface of the workpiece 2 to be electroplated under the action of the current, thereby forming an electroplating layer in the desired electroplating area 21 of the workpiece 2 to be electroplated.
[0038] It should be noted that the duration and intensity of the current will affect the electroplating process. For example, the longer the duration of the current, the longer the electroplating time, and the thicker the electroplated layer obtained by electroplating; the shorter the duration of the current, the shorter the electroplating time, and the thinner the electroplated layer obtained by electroplating; the appropriate current duration can make the electroplated layer more uniform and of higher quality, while too long or too short a current duration will make the thickness of the electroplated layer uneven, the quality is poor, and the electroplated layer is prone to cracking or falling off; further, the higher the current intensity, the faster the electroplating speed but the looser the electroplating layer; the lower the current intensity, the slower the electroplating speed but the denser the electroplating layer and the stronger the adhesion; the appropriate current intensity can make the electroplated layer uniform and more durable. The electroplating equipment provided in this embodiment can select the appropriate current duration and intensity according to the material and size of the actual workpiece to be electroplated, and it is not limited in this embodiment. For example, in one embodiment, when electroplating alloy metals such as aluminum alloys, a higher current intensity and a longer duration are required; in another embodiment, when electroplating metal substrates such as copper or silver, a lower current intensity and a shorter duration are required.
[0039] With reference to the foregoing description, it can be understood that the electroplating equipment provided in this embodiment has at least the following advantages: 1. Masking washers define the exact area to be plated, eliminating overspray or accidental plating.
[0040] 2. The electroplating equipment reduces the need for complex mask processes or special tools, has low cost, and minimizes the complexity of the mask, which can reduce processing time.
[0041] 3. This electroplating equipment is suitable for small-scale and large-scale production, providing consistent results.
[0042] 4. Using a shielding gasket can minimize the waste of plating solution and reduce the overall consumption of electroplating materials.
[0043] The electroplating equipment provided in this embodiment is provided with an electroplating tank that can be turned upside down, and at least one liquid outlet is provided at the upper end of the electroplating tank, and a shielding gasket and a clamping mechanism are provided at each liquid outlet, so that the workpiece to be electroplated is covered at each liquid outlet and clamped and fixed by the clamping mechanism, and the shielding gasket covers a partial area of the workpiece to be electroplated and forms a seal with the workpiece to be electroplated, the morphology of the shielding gasket matches the geometric shape of the desired electroplating area to achieve selective electroplating, and the clamping mechanism constitutes the anode of the electroplating equipment, and a cathode is also provided on the electroplating tank, so that the workpiece to be electroplated can be clamped by the clamping mechanism when the liquid outlet is at the top, and then after the workpiece to be electroplated is clamped, the liquid outlet is flipped to the bottom, and the anode and the cathode are energized to start electroplating the workpiece to be electroplated. In this way, on the first hand, by arranging a shielding gasket at the liquid outlet, its morphology matches the geometric shape of the desired electroplating area, and through the precise coordination of the shielding gasket and the desired electroplating area, the electroplating area can be effectively controlled, reducing the electroplating of non-target areas and avoiding unnecessary electroplating, thereby improving material utilization and processing accuracy, achieving selective electroplating, and achieving uniformity and consistency in electroplating. In addition, the electroplating equipment reduces the need for complex mask processes or special tools and has low costs. On the second hand, the clamping mechanism clamps the workpiece to be electroplated and acts as an anode, while cooperating with the shielding gasket to achieve sealing, which helps to reduce leakage of the plating solution and improve the reliability of the process. On the third hand, the plating tank can be flipped up and down, and the workpiece is fixed and aligned when the plating tank is on the top, and the electroplating operation is performed after flipping to the bottom, which helps to simplify the process and improve operating efficiency.
[0044] Optionally, in a possible implementation, the electroplating liquid tank 1 can be swung left and right or rotated horizontally, so as to achieve a stirring function by swinging left and right or rotating horizontally during the electroplating process to remove bubbles in the electroplating liquid 6.
[0045] Specifically, when the electroplating tank 1 is turned over, the liquid outlet 11 is located at the bottom. During the electroplating process of the workpiece 2 to be electroplated, the electroplating tank 1 can be controlled to swing left and right or rotate horizontally to achieve a stirring function and remove bubbles in the electroplating solution 6.
[0046] It should be noted that the shaking method of the plating tank can be selected according to actual needs, and it is not limited in this application. For example, in one embodiment, the workpiece to be plated is large and needs to be treated with a high-concentration plating solution. At this time, the plating tank can be rotated horizontally to force the plating solution to flow quickly in the tank through centrifugal force to ensure the uniformity of the liquid and help remove bubbles that may be formed in the plating solution; in another embodiment, the workpiece to be plated is small, and the liquid can be stirred by swinging left and right to ensure sufficient mixing of the plating solution and removal of bubbles.
[0047] Figure 4 This is the principle diagram for realizing the left-right swing of the electroplating tank provided in this application. Figure 4 , it can be seen that in Figure 4 In the shown Figures (A), (B), and (C), the plating tank 1 can be continuously swung left and right to promote the flow of the plating solution 6 inside the plating tank 1 and increase the disturbance degree of the plating solution 6, thereby reducing the accumulation of bubbles on the surface of the plating solution 6 or the desired plating area 21, avoiding the formation of bubbles inside the plating layer of the workpiece 2 to be electroplated, and affecting the quality of the electroplating.
[0048] Furthermore, in a possible implementation, the electroplating equipment provided by the present application further includes a self-cleaning component 4, the lower end of the electroplating tank 1 is provided with an insertion channel 3, the self-cleaning component 4 is inserted into the insertion channel 3, and can move up and down in the insertion channel 3; The self-cleaning component 4 includes an inlet channel 41, an outlet channel 42, and a receiving groove 43 respectively connected to the inlet channel 41 and the outlet channel 42; a sealing gasket 44 is provided at the end of the receiving groove 43; In the electroplating process, the self-cleaning component 4 is at the lowest position; before or after the electroplating, the self-cleaning component 4 rises to the highest position, so that the end of the accommodating groove 43 contacts the liquid outlet 11 to form a sealing area; The inlet channel 41 and the outlet channel 42 are used for the inflow and outflow of cleaning liquid during the cleaning process and gas during the drying process. The cleaning liquid or gas is provided to the sealing area to clean or dry the workpiece at the liquid outlet 11.
[0049] Figure 5 This is a working principle diagram of a self-cleaning component in an electroplating device as shown in an example of this application. Figure 5 , Figure 5 The electroplating equipment shown also includes a self-cleaning component 4, which can pre-clean the desired workpiece area of the workpiece 2 to be electroplated before electroplating, and clean and dry the electroplated workpiece after electroplating.
[0050] The self-cleaning component 4 includes an inlet channel 41 , an outlet channel 42 , and a receiving groove 43 respectively connected to the inlet channel 41 and the outlet channel 42 ; a sealing gasket 44 is provided at the end of the receiving groove 43 .
[0051] Furthermore, an insertion channel 3 is provided below the electroplating tank 1, and a self-cleaning component 4 is provided in the insertion channel 3. The self-cleaning component 4 can move up and down in the insertion channel 3 through the insertion channel 3. During the electroplating process, it is not necessary to self-clean the workpiece at the liquid outlet 11. At this time, please refer to Figure 1, the self-cleaning component 4 is in the lowest position, which will not affect the electroplating process of the workpiece 2 to be electroplated; before or after the electroplating starts, the workpiece at the liquid outlet 11 can be cleaned. At this time, please refer to Figure 5 , the self-cleaning component 4 extends upward, and the sealing gasket 44 at the end position of the receiving tank 43 can abut against the electroplating liquid tank 1 above it to form a sealing area, in which the plating liquid in the electroplating liquid tank 1 will not penetrate into the receiving tank 43 through the gap between the sealing gasket 44 and the electroplating liquid tank 1, and will not interfere with the cleaning process. In addition, the cleaning liquid will not penetrate into the electroplating liquid tank 1 to affect the plating liquid.
[0052] It should be noted that the time to use the self-cleaning component to self-clean the workpiece at the liquid outlet can be selected according to actual needs, and this application does not limit it. For example, in one embodiment, the self-cleaning process can be selected before the start of electroplating; in another embodiment, the self-cleaning process can be selected after the end of electroplating; in another embodiment, the self-cleaning process can be selected before the start of electroplating and after the end of electroplating.
[0053] The following describes how to use the self-cleaning component 4 to self-clean the workpiece at the liquid outlet 11: Specifically, when the workpiece at the liquid outlet 11 needs to be self-cleaned, the cleaning assembly is raised. At this time, the cleaning assembly is slowly raised from the insertion channel 3 until the sealing gasket 44 provided at the end of the accommodating groove 43 is tightly pressed against the electroplating liquid tank 1 to form a sealing area. Figure 5 , provide cleaning liquid to the inlet channel 41 in the self-cleaning component 4, so that it flows into the sealing area, the accommodating groove 43 can accommodate the cleaning liquid, and the inflowing cleaning liquid can clean the workpiece at the liquid outlet 11, and remove impurities on the surface of the workpiece at the liquid outlet 11; after completing the cleaning of the desired electroplating area 21, the cleaning liquid with impurities after cleaning flows out through the outlet channel 42, which can prevent contamination of the electroplating liquid.
[0054] Furthermore, after the cleaning process is completed, a drying process can also be performed by flowing gas into the inlet channel 41, allowing the gas to flow into the sealed area, drying the workpiece at the liquid outlet 11, and then discharging the gas through the outlet channel 42. In this way, the drying process of the workpiece at the liquid outlet 11 using the self-cleaning component 4 is completed.
[0055] It should be noted that the gas flowing in through the inlet channel includes air or other protective gases, and a suitable protective gas can be selected according to actual needs, which is not limited in the present application.
[0056] The electroplating equipment provided in this embodiment is provided with a self-cleaning component, and an inlet channel, an outlet channel, and a receiving tank respectively connected to the inlet channel and the outlet channel are provided in the self-cleaning component, and a sealing gasket is provided at the end of the receiving tank. In this way, during the electroplating process, by setting the self-cleaning component at the lowest position of the electroplating liquid tank, the normal electroplating process will not be affected. Then, when it is necessary to self-clean the workpiece at the liquid outlet, the self-cleaning component is raised by extending into the channel until the sealing gasket is used to support the electroplating liquid tank above to form a sealing area. Subsequently, the cleaning liquid for cleaning and the gas for drying are flowed in through the inlet channel, and the cleaning liquid containing impurities after cleaning and the gas after the drying process are completed are flowed out through the outlet channel. In this way, the process of self-cleaning the workpiece at the liquid outlet is completed, and the workpiece at the outlet can be effectively self-cleaned, thereby improving the degree of automation of the electroplating equipment and improving the quality of the electroplated product obtained.
[0057] Furthermore, the electroplating equipment provided in the present application is used for selective electroplating on a two-dimensional plane, or the electroplating equipment is used for selective electroplating on a three-dimensional plane.
[0058] Figure 6 For a schematic diagram of the electroplating equipment embodiment 3 provided in this application, please refer to Figure 6 , Figure 6 The electroplating equipment shown can selectively electroplate a three-dimensional plane. Figure 6 As shown in Figure (A), it can be seen that the workpiece 2 to be electroplated is a "T"-shaped structure. In Figure (B), the workpiece 2 to be electroplated is inserted into the liquid outlet 11, and part of the workpiece below it enters the electroplating liquid tank 1. Shielding gaskets 12 are installed on both sides of the liquid outlet 11 to fit and surround the non-desired electroplating area of the workpiece 2 to be electroplated. In this way, during the electroplating process, only the desired electroplating area 21 of the workpiece 2 to be electroplated protrudes into the inside of the electroplating liquid tank 1. During the electroplating process, the electroplating solution 6 can only surround the surroundings of the desired electroplating area, and selectively plate the three-dimensional plane (the desired electroplating area of the "T"-shaped workpiece to be electroplated is a three-dimensional plane).
[0059] The electroplating equipment provided in this embodiment can achieve selective electroplating of a workpiece to be electroplated whose desired plating area is a three-dimensional plane by adding a shielding gasket that matches the morphology of the workpiece to be electroplated at the liquid outlet, thereby improving the applicability of the electroplating equipment.
[0060] Corresponding to the above-mentioned embodiment of an electroplating device, the present application also provides an embodiment of a selective electroplating method. The selective electroplating method provided by the present application is introduced below.
[0061] Figure 7This is a flow chart of the first embodiment of the selective electroplating method provided by this application. Please refer to Figure 7 The selective electroplating method provided in this embodiment is implemented based on any electroplating device provided in the first aspect of the present application. The selective electroplating method may include: S701. When the liquid outlet of the electroplating equipment is facing upward, fix the workpiece to be electroplated at the liquid outlet.
[0062] Specifically, before the electroplating begins, the liquid outlet of the electroplating equipment faces upward, and the workpiece to be electroplated is fixed at the liquid outlet using a clamping mechanism and a shielding gasket. The shielding gasket can seal the desired plating area of the workpiece to be electroplated, so that during the electroplating process, electroplating operations are only performed in the desired plating area.
[0063] Furthermore, in a possible implementation, after the workpiece to be electroplated is fixed at the liquid outlet, the method further includes: Controlling the self-cleaning component of the electroplating equipment to rise to the highest position, so that the end of the receiving groove of the self-cleaning component contacts the liquid outlet to form a sealing area; A cleaning liquid is provided to the sealing area through the inlet channel of the self-cleaning component so as to pre-clean the workpiece to be electroplated by the cleaning liquid; wherein, after the cleaning liquid pre-cleans the workpiece to be electroplated, it is discharged from the outlet channel of the self-cleaning component.
[0064] It should be noted that the cleaning liquid is used for pre-cleaning of the workpiece to be electroplated. For example, in one possible implementation, the pre-cleaning mainly includes the following aspects: 1. Use an organic solvent to dissolve grease and dirt on the surface of the workpiece to preliminarily remove surface pollutants; 2. Use the saponification and emulsification effect of the alkaline cleaning agent to further remove grease and dirt; 3. Use an acidic solution to remove the oxide layer, rust and other attachments on the surface of the workpiece to ensure that the metal surface is pure and smooth, providing a good adhesion basis for electroplating; 4. Use deionized water or pure water to rinse the workpiece surface to prevent secondary contamination.
[0065] With reference to the foregoing description, it can be understood that the specific type of the cleaning liquid is selected according to actual needs and is not limited in this embodiment.
[0066] The selective electroplating method provided in this embodiment, after the workpiece to be electroplated is fixed at the liquid outlet, the cleaning liquid is provided to the sealed area through the inlet channel of the self-cleaning component to pre-clean the workpiece to be electroplated, so that the cleaning liquid flows into the sealed area through the inlet channel of the self-cleaning component and fully contacts the desired electroplating area to remove impurities on the surface of the desired electroplating area, ensuring that the surface of the desired electroplating area is free of impurities, which is conducive to the subsequent electroplating operation. Further, after the pre-cleaning is completed, the cleaning liquid can be discharged through the outlet channel of the self-cleaning component, thereby effectively taking away the impurities removed from the surface of the desired electroplating area, preventing the electroplating liquid from being contaminated, and improving the quality of the electroplated product formed after the subsequent electroplating is completed.
[0067] S702, turning the electroplating equipment upside down so that the liquid outlet is at the bottom.
[0068] S703, energizing the anode and cathode of the electroplating equipment to start selective electroplating of the workpiece to be electroplated through the electroplating equipment.
[0069] Specifically, when electroplating operation is required, the electroplating equipment is turned upside down so that the liquid outlet is at the bottom and the electroplating liquid covers the area to be electroplated. Then, the anode and cathode of the electroplating equipment are energized. In this way, the desired electroplating area of the workpiece to be electroplated can be selectively electroplated.
[0070] Furthermore, in a possible implementation, after the electroplating is completed, the electroplating equipment can be cleaned and dried using a self-cleaning component according to the following steps: Step 1: After the electroplating is completed, the electroplating device is turned upside down so that the liquid outlet is at the top; Step 2: controlling the self-cleaning component of the electroplating equipment to rise to the highest position, so that the end of the receiving groove of the self-cleaning component contacts the liquid outlet to form a sealing area; Step 3: providing a cleaning liquid to the sealing area through the inlet channel of the self-cleaning component, so as to clean the electroplated workpiece at the liquid outlet through the cleaning liquid; wherein, after the cleaning liquid cleans the electroplated workpiece, it is discharged from the outlet channel of the self-cleaning component; Step 4: providing gas to the sealing area through the inlet channel of the self-cleaning component to dry the cleaned workpiece by the gas.
[0071] The selective electroplating method provided in the present embodiment turns the electroplating equipment over after the electroplating is completed so that the liquid outlet is at the top, and provides a cleaning and drying process through a self-cleaning component. Specifically, after the electroplating is completed, a cleaning liquid first flows into the sealed area through the inlet of the self-cleaning component to clean the desired electroplated area that has been electroplated, and remove the residual plating liquid and impurities on the surface, thereby ensuring that the surface of the desired electroplated area of the workpiece is clean; thereafter, gas is provided to the inside of the sealed area through the inlet channel to dry the cleaned workpiece, ensuring that the surface of the workpiece is completely dry, and preventing the residual cleaning liquid or moisture from corroding the workpiece. In this way, not only the degree of automation of the electroplating equipment is improved, but also manual intervention can be effectively reduced, while improving the electroplating quality and the overall cleanliness of the workpiece.
[0072] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. An electroplating device, characterized in that: The electroplating equipment includes an electroplating liquid tank that can be turned upside down; The upper end of the electroplating tank is provided with at least one liquid outlet, and each liquid outlet is provided with a shielding gasket and a clamping mechanism; the workpiece to be electroplated covers each liquid outlet and is clamped and fixed by the clamping mechanism, the shielding gasket covers a partial area of the workpiece to be electroplated and forms a seal with the workpiece to be electroplated, and the morphology of the shielding gasket matches the geometric shape of the desired electroplating area to achieve selective electroplating; The clamping mechanism constitutes the anode of the electroplating equipment; a cathode is also arranged on the electroplating tank; the electroplating tank is specifically used to clamp the workpiece to be electroplated through the clamping mechanism when the liquid outlet is at the top, and then after clamping the workpiece to be electroplated, the liquid outlet is flipped downward, and the anode and the cathode are energized to start electroplating the workpiece to be electroplated.
2. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment further comprises a self-cleaning component, the lower end of the electroplating tank is provided with an insertion channel, the self-cleaning component is inserted into the insertion channel, and can move up and down in the insertion channel; The self-cleaning component comprises an inlet channel, an outlet channel, and a receiving groove respectively connected to the inlet channel and the outlet channel; a sealing gasket is provided at the end of the receiving groove; Wherein, during the electroplating process, the self-cleaning component is at the lowest position; before the electroplating starts or after the electroplating ends, the self-cleaning component rises to the highest position, so that the end of the containing tank contacts the liquid outlet to form a sealing area; The inlet channel and the outlet channel are used for the inflow and outflow of clean water during the cleaning process and gas during the drying process. Cleaning liquid or gas is provided to the sealing area to clean or dry the workpiece at the liquid outlet.
3. The electroplating equipment according to claim 1, characterized in that: The electroplating liquid tank can swing left and right or rotate horizontally, so as to achieve a stirring function by swinging left and right or rotating horizontally during the electroplating process, so as to remove bubbles in the electroplating liquid.
4. The electroplating equipment according to claim 1, characterized in that: The height of the shielding gasket is greater than a specified value to accommodate the plating solution.
5. The electroplating equipment according to claim 2, characterized in that: The shielding gasket and / or the sealing gasket are made of any one of the following materials: silicone, rubber and polyvinyl fluoride.
6. The electroplating equipment according to claim 1, characterized in that: The electroplating device is used for selective electroplating on a two-dimensional plane, or the electroplating device is used for selective electroplating on a three-dimensional plane.
7. The electroplating equipment according to claim 1, characterized in that: The electroplating equipment also includes a driving mechanism; Wherein, the driving mechanism is used to drive the electroplating liquid tank to flip up and down.
8. A selective electroplating method, characterized in that: The method is implemented based on the electroplating equipment according to any one of claims 1 to 7; the method comprises: When the liquid outlet of the electroplating equipment is facing upward, fixing the workpiece to be electroplated at the liquid outlet; Turning the electroplating device upside down so that the liquid outlet is at the bottom; The anode and cathode of the electroplating device are energized to start selective electroplating of the workpiece to be electroplated by the electroplating device.
9. The selective electroplating method according to claim 8, characterized in that: The method further comprises: After the electroplating is completed, turning the electroplating device upside down so that the liquid outlet is at the top; Controlling the self-cleaning component of the electroplating equipment to rise to the highest position, so that the end of the receiving groove of the self-cleaning component contacts the liquid outlet to form a sealing area; A cleaning liquid is provided to the sealing area through the inlet channel of the self-cleaning component, so as to clean the electroplated workpiece at the liquid outlet through the cleaning liquid; wherein, after the cleaning liquid cleans the electroplated workpiece, it is discharged from the outlet channel of the self-cleaning component; Gas is provided to the sealing area through the inlet channel of the self-cleaning component so as to dry the cleaned workpiece by the gas.
10. The method according to claim 8 or 9, characterized in that: After the workpiece to be electroplated is fixed at the liquid outlet, the method further comprises: Controlling the self-cleaning component of the electroplating equipment to rise to the highest position, so that the end of the receiving groove of the self-cleaning component contacts the liquid outlet to form a sealing area; A cleaning liquid is provided to the sealing area through the inlet channel of the self-cleaning component so as to pre-clean the workpiece to be electroplated by the cleaning liquid; wherein, after the cleaning liquid pre-cleans the workpiece to be electroplated, it is discharged from the outlet channel of the self-cleaning component.