Substrate holding device

Abstract

The invention provides a substrate holding device, which comprises a cup body configured to bear a substrate; the pressure plate is configured to press against the back surface of the substrate to relatively fix the substrate and the cup body so as to keep the substrate; the pressure plate driving device is connected with the pressure plate, and the pressure plate driving device drives the pressure plate to descend or ascend, so that the pressure plate is pressed on the back surface of the substrate to clamp the substrate or the pressure plate is separated from the back surface of the substrate; the sealing element is arranged on the pressure plate and comprises a fixing part and a sealing part; the fixing part is used for fixing the sealing element on the pressure plate; the first sealing part protrudes downwards from the fixing part, the section shape of the first sealing part is the section shape of a gap between the peripheral side of the pressing disc and the cup body when the pressing disc abuts against the cup body, and the first sealing part abuts against the upper end face of the cup body when pressed by the pressing disc so as to limit a sealing area. Multiple sealing is formed under the combined action of the first sealing part, the second sealing part and the third sealing part of the sealing piece, the sealing effect is further guaranteed, and then the electroplating quality is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a substrate holding device. Background Art

[0002] In the semiconductor integrated circuit manufacturing process, the chemical electroplating process of the substrate is an essential process for high-quality integrated circuits. In the process of chemical electroplating, in order to achieve high-quality substrate electroplating, it is first necessary to ensure that there are no bubbles on the electroplating surface of the substrate after the substrate enters the electroplating solution. Once bubbles are retained on the electroplating surface of the substrate, many problems will occur. The area with bubbles on the electroplating surface of the substrate is not exposed to the electroplating solution, and electroplating will not occur in this area. The resulting electroplating defects may appear as no electroplating or reduced electroplating thickness in the area with bubbles, depending on the time the bubbles stay on the substrate and the length of time the bubbles stay in this area. In an inverted (substrate electroplating surface facing down) configuration, buoyancy tends to pull the bubbles up to the electroplating surface of the substrate. Bubbles are difficult to remove from the substrate surface because there is no relevant mechanism in the electroplating chamber to drive the bubbles to the edge of the substrate, which is the only path for bubbles to leave the substrate surface. Therefore, when the substrate holding device holds the substrate and lowers it into the electroplating solution, it usually rotates while controlling the substrate to tilt at a certain angle to enter the electroplating solution, and then adjusts the substrate to a horizontal angle (parallel to the surface of the electroplating solution) to allow bubbles to escape, so as to prevent bubbles from being trapped on the electroplating surface of the substrate. When the substrate holding device holds the substrate and makes the substrate contact the electroplating solution at an angle, the electroplating solution easily enters the substrate holding device through the gap between the pressure plate and the cup body of the substrate holding device and contacts the conductive area of ​​the substrate, resulting in a voltage increase during the electroplating process. Summary of the invention

[0003] In order to prevent the electroplating liquid from entering the substrate holding device through the gap between the peripheral side of the pressure plate and the upper end surface of the cup body when the substrate holding device fixes the substrate into the electroplating liquid, thereby affecting the electroplating quality, the present invention proposes a substrate holding device.

[0004] A substrate holding device, comprising:

[0005] A cup body configured to carry a substrate;

[0006] A pressure plate, configured to press against the back side of the substrate to fix the substrate relative to the cup body, so as to hold the substrate;

[0007] A pressure plate driving device connected to the pressure plate, the pressure plate driving device drives the pressure plate to descend or ascend, so that the pressure plate is pressed on the back side of the substrate to clamp the substrate or the pressure plate is moved away from the back side of the substrate;

[0008] A sealing member, disposed on the pressure plate;

[0009] Wherein, the sealing element comprises:

[0010] a fixing portion configured to fix the seal to the pressure plate;

[0011] and a first sealing portion protruding downward from the fixing portion, wherein the cross-sectional shape of the first sealing portion is the cross-sectional shape of the gap between the peripheral side of the pressure plate and the cup body when the pressure plate abuts against the cup body, and the first sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

[0012] According to a specific implementation of the embodiment of the present application, the sealing element is an elastomer.

[0013] According to a specific implementation of the embodiment of the present application, the sealing member further includes a second sealing portion extending downward and outward from an outer edge of the fixing portion.

[0014] According to a specific implementation of the embodiment of the present application, the lower end surface of the second sealing portion is lower than the lower end surface of the first sealing portion, and the second sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

[0015] According to a specific implementation of the embodiment of the present application, when the second sealing portion abuts against the upper end surface of the cup body, part of the second sealing portion is pressed to a horizontal state, and the end of the second sealing portion is substantially flush with the edge of the cup body.

[0016] According to a specific implementation of the embodiment of the present application, the seal also includes a third sealing portion formed by protruding downward from the lower end surface of the seal; the third sealing portion is located between the first sealing portion and the second sealing portion.

[0017] According to a specific implementation of the embodiment of the present application, the lower end surface of the third sealing portion is lower than the lower end surface of the first sealing portion.

[0018] According to a specific implementation of the embodiment of the present application, the sealing component is arranged on the peripheral side of the pressure plate.

[0019] According to a specific implementation of the embodiment of the present application, the fixing part includes a limiting groove, the limiting groove is arranged on the inner side wall of the fixing part, the outer side wall of the pressure plate is provided with a limiting protrusion, and the limiting groove matches the limiting protrusion to fix the seal to the peripheral side of the pressure plate.

[0020] According to a specific implementation of the embodiment of the present application, the top end of the fixing portion is clamped in a fixing groove provided on the lower end surface of the pressure plate.

[0021] According to a specific implementation of the embodiment of the present application, the pressure plate further includes a protective cover, which is formed on the edge of the pressure plate and surrounds the outer side of the pressure plate driving device.

[0022] According to a specific implementation of the embodiment of the present application, the sealing member is arranged on a protective cover in a corresponding area of ​​the upper end surface of the cup body.

[0023] According to a specific implementation of the embodiment of the present application, a through hole is opened on the side wall of the pressure plate.

[0024] According to a specific implementation of the embodiment of the present application, the lower surface of the pressure plate is provided with a protrusion extending downward.

[0025] The substrate holding device of the present invention is provided by arranging a sealing member on the peripheral side of the pressure plate. The shape of the sealing member is the cross-sectional shape of the gap between the peripheral side of the pressure plate and the upper area of ​​the cup body. When the pressure plate and the cup body are in abutment with each other, the gap between the peripheral side of the pressure plate and the upper end surface of the cup body is blocked to form a fluid seal, thereby achieving a better sealing effect, protecting the substrate, and improving the electroplating quality of the substrate.

[0026] At the same time, multiple seals are set for the seal. When the pressure plate moves from the top plate to the cup body, the second seal is first in close contact with the upper end surface of the cup body to achieve the first seal; when the pressure plate continues to move toward the cup body, the lower end surface of the third seal is in close contact with the upper end of the cup body to achieve the second seal; as the pressure plate continues to move toward the cup body, the first seal contacts the upper end surface of the cup body and is pressed between the gaps to achieve the third seal; when the pressure plate abuts against the cup body, the vertical force from the pressure plate further compresses the seal to form a fluid seal. Multiple seals are formed under the joint action of the first seal, the second seal, and the third seal, and the sealing effect is further guaranteed when the fluid seal is achieved in different directions, different forms, and different action parts at the same time.

[0027] The third sealing part and the second sealing part are located on the outer peripheral side of the gap, and the defined sealing area is larger. At the same time, the third sealing part and the second sealing part contact the upper end surface of the cup body before the first sealing part, which can ensure a better sealing effect.

[0028] Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or be understood by implementing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic structural diagram of a substrate holding device according to an embodiment of the present invention is shown;

[0031] Figure 2 A schematic diagram of a partial structure of a sealing member according to an embodiment of the present invention is shown;

[0032] Figure 3 A schematic diagram showing the relative position structure of the sealing member and the pressure plate according to an embodiment of the present invention is shown;

[0033] Figure 4 A schematic diagram of the assembly structure of the seal and the pressure plate according to an embodiment of the present invention is shown;

[0034] Figure 5 It shows a schematic structural diagram of the state of the sealing member when the pressure plate and the cup body abut against each other according to an embodiment of the present invention;

[0035] Figure 6 Another schematic structural diagram of a substrate holding device according to an embodiment of the present invention is shown;

[0036] Figure 7 A schematic diagram of a three-dimensional structure of a pressure plate with through holes according to an embodiment of the present invention is shown;

[0037] Figure 8 A bottom view of a pressure plate according to an embodiment of the present invention is shown; and

[0038] Fig. 9 A schematic diagram of a bump structure according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The present invention proposes a substrate holding device, please refer to Figure 1 , Figure 1The schematic diagram of the structure of the substrate holding device 100 according to the embodiment of the present invention is shown. The substrate holding device 100 includes a cup body 101, a pressure plate 102, a pressure plate driving device 106 and a sealing member 107. The cup body 101 is configured to carry a substrate 400. The pressure plate 102 is configured to press against the back side (upper surface in the figure) of the substrate 400 so that the substrate 400 and the cup body 101 are relatively fixed to hold the substrate 400. The pressure plate driving device 106 is connected to the pressure plate 102, and the pressure plate 102 is driven to descend or ascend so that the pressure plate 102 is pressed against the back side of the substrate 400 to clamp the substrate 400 or to make the pressure plate 102 leave the back side of the substrate 400. The bottom of the cup body 101 is wrapped with a sealing lip 105. When the cup body 101 contains the substrate 400 and the pressure plate driving device 106 provides a vertical force between the cup body 101 and the pressure plate 102, so that the substrate 400 is fixed in the cup body 101 by the pressure plate 102, the substrate 400 abuts against the sealing lip 105 to form a fluid seal to isolate the edge of the substrate 400 from the plating solution. The cup body 101 is supported by a support rod 103, and the support rod 103 is connected to the top plate 104. For the purpose of discussion, the assembly including components 101-107 is collectively referred to as a substrate holding device 100. However, it is noted that the concept of "substrate holding device" generally extends to various combinations and sub-combinations of components that abut against the substrate 400 and allow it to move and position.

[0041] As described above, the cup body 101 is supported via the support rods 103 and the top plate 104. Generally, the cup body 101 provides a support member 1011 on which the substrate 400 can be placed. The cup body 101 includes an opening through which the plating solution can contact the electroplating surface of the substrate 400. Note that the substrate 400 has a front side (the lower surface in the figure) and the electroplating is performed on the front side. The periphery of the substrate 400 is placed on the support member 1011 of the cup body 101, and the pressure plate 102 is pressed down on the back side of the substrate 400 to hold the substrate 400 between the pressure plate 102 and the cup body 101.

[0042] In order to load the substrate 400 onto the substrate holding device 100, the platen 102 is lifted from its depicted position via the platen drive 106, and a certain accommodation space is created between the cup 101 and the platen 102, into which the substrate 400 can be inserted, thereby being loaded into the cup 101. Then, as depicted, the platen 102 is lowered to abut against the outer periphery of the cup 101 while the lower end face of the platen 102 abuts against the substrate 400. The platen drive 106 transmits a vertical force for causing the platen 102 to abut against the substrate 400. These transmitted forces are Figure 1 As indicated by the arrow in .

[0043] In one embodiment, the sealing lip 105 provided at the bottom of the cup body 101 is an elastic body with a certain deformation ability. When the pressure plate 102 is lowered to abut against the cup body 101, and the two cooperate to clamp the substrate 400, the sealing lip 105 is elastically deformed by the squeezing effect of the substrate 400, and the sealing lip 105 is in close contact with the substrate 400 to form a seal. The sealing lip 105 can prevent the electrolyte from contacting the back of the substrate 400, thereby ensuring the quality of electroplating.

[0044] In one embodiment, the seal 107 is an elastomer, and the material for preparing the seal 107 in the embodiment of the present invention is selected to be fluororubber (such as perfluoro or fluororubber), silicone rubber, etc. Specifically, the seal 107 can be made of different materials according to different process applications. For example, when electroplating copper, a semi-fluororubber (such as Viton fluororubber) with good sealing and low hardness can be used, while in high-temperature electroplating processes such as electroplating nickel or gold, perfluororubber can be used. In other embodiments, the seal 107 is hydrophobic by performing a hydrophobic treatment on the seal 107 to make the seal 107 hydrophobic, thereby reducing the adhesion of the plating solution on the surface of the seal 107. The seal 107 can be hydrophobic in a variety of ways, for example: 1) the seal 107 uses a hydrophobic material (such as Teflon); 2) a hydrophobic coating (such as Teflon coating) is made on the surface of the seal 107; 3) a hydrophobic material (such as Teflon) is mixed in the seal 107.

[0045] like Figure 1 As shown, when the edge of the pressure plate 102 and the upper area of ​​the cup body 101 are in contact, the seal 107 is located on the peripheral side of the pressure plate 102 and forms a seal with the upper end surface of the cup body 101 to protect the back side of the substrate 400 and prevent any electrolyte that may enter the interior of the substrate holding device 100 from the gap 200. Here, the gap 200 is the space between the upper end surface of the cup body 101 and the peripheral side of the pressure plate 102 when the pressure plate 102 and the upper end surface area of ​​the cup body 101 are in contact.

[0046] The seal 107 is a three-dimensional annular structure as a whole, and more details of the seal 107 will be described in detail below. Figure 2 A schematic diagram of a partial structure of a sealing member according to an embodiment of the present invention is shown; Figure 3 FIG. 2 shows a schematic diagram of the relative position structure of the sealing member and the pressure plate according to an embodiment of the present invention. Figure 2 and Figure 3As shown, the seal 107 includes a fixing portion 1071 and a first sealing portion 1072. The fixing portion 1071 is the main body of the seal 107, which is fixed to the circumferential side of the pressure plate 102, and the first sealing portion 1072 protrudes downward from the fixing portion 1071. The cross-sectional shape of the first sealing portion 1072 is the same as the cross-sectional shape of the gap 200. When the pressure plate 102 abuts against the cup body 101, and the edge of the pressure plate 102 abuts against the upper area of ​​the cup body 101, the gap 200 is formed between the circumferential side of the pressure plate 102 and the upper area of ​​the cup body 101. Exemplarily, as Figure 3 As shown, when the cross-sectional shape of the gap 200 is a triangle, the shape of the first sealing portion 1072 is approximately a prism, and its cross-sectional shape is a triangle that matches the cross-sectional shape of the gap 200. It should be understood that when the cross-sectional shape of the gap 200 is a rectangle, the first sealing portion 1072 is a cuboid, and its cross-sectional shape is a rectangle. The cross-sectional shape of the gap 200 can be designed according to actual needs. Therefore, the shape of the first sealing portion 1072 can be any shape that matches the gap 200. When the first sealing portion 1072 is pressed by the pressure plate 102, it abuts against the upper end surface of the cup body 101 to block the gap 200, so as to define a sealing area, and the electroplating solution is substantially excluded from the sealing area during the electroplating process. For details, please continue to refer to Figure 2 and Figure 3 The fixing portion 1071 includes a limiting groove 109A disposed on the inner side wall of the fixing portion 1071, and the outer side wall of the pressure plate 102 is provided with a limiting protrusion 109B matching the limiting groove 109A. The limiting groove 109A and the limiting protrusion 109B are matched and arranged to limit and fix the sealing member 107 to the peripheral side of the pressure plate 102. Figure 1 When the pressure plate 102 is driven to abut against the cup body 101 by the vertical force provided by the pressure plate driving device 106, the vertical force from the pressure plate 102 compresses the seal 107 to form a fluid seal. The cross-sectional shape of the first sealing portion 1072 of the seal 107 matches the cross-sectional shape of the gap 200 between the circumference of the pressure plate 102 and the upper end surface of the cup body 101. Therefore, when the pressure plate 102 and the cup body 101 are abutted, the first sealing portion 1072 is tightly pressed between the gap 200 to form a fluid seal, preventing the electroplating solution from entering the interior of the substrate holding device 100 through the gap 200 between the pressure plate 102 and the cup body 101, thereby affecting the electroplating quality.

[0047] For further information, please refer to Figure 4 The top of the fixing portion 1071 is clamped in the fixing groove 109C provided on the lower end surface of the pressure plate 102. The sealing member 107 is fixed in the left and right directions by clamping the fixing portion 1071 in the fixing groove 109C; the sealing member 107 is fixed in the up and down directions by matching the limiting groove 109A with the limiting protrusion 109B, thereby ensuring the stability of the sealing member 107 during installation.

[0048] In another embodiment, the sealing member 107 further includes a second sealing portion 1073 extending downward and outward from the outer edge of the fixing portion 1071. Figure 2 Combined with Figure 4 , the second sealing part 1073 extends downward and outward from the outer edge of the fixing part 1071 and is designed as a slope. Furthermore, the lower end surface of the second sealing part 1073 is lower than the lower end surface of the first sealing part 1072, that is, when the pressure plate 102 moves from the top plate 104 to the cup body 101, the second sealing part 1073 first contacts the cup body 101. This design enables the second sealing part 1073 to have a sealing function as well as a blocking function. When the plating liquid splashes onto the upper end surface of the cup body 101, it directly falls onto the flattened upper end surface of the second sealing part 1073. When the platen driving device 106 drives the platen 102 to move toward the top plate 104, the second sealing portion 1073 returns to the inclined shape, thereby draining the plating liquid falling on the second sealing portion 1073 to the outside of the cup body 101, preventing the sputtered plating liquid from being retained on the upper end surface of the cup body 101, thereby eliminating the possibility of the plating liquid flowing into the cup body 101. Secondly, the second sealing portion 1073 is an elastic body with an inclined design. When the platen 102 is against the cup body 101, the vertical force from the platen 102 compresses the seal 107, so that the second sealing portion 1073 becomes horizontally set to fit tightly against the upper end surface of the cup body 101 to form a fluid seal. The first sealing portion 1072 and the second sealing portion 1073 of the seal 107 form a secondary seal under the joint action of the first sealing portion 1072 and the second sealing portion 1073, so that the sealing effect is better.

[0049] Furthermore, in order to further ensure that when the platen driving device 106 drives the platen 102 to move toward the top plate 104, the electroplating solution falling on the second sealing portion 1073 is drained to the outside of the cup body 101, the end of the second sealing portion 1073 pressed to a horizontal state is required to be substantially flush with the edge of the cup body 101. It should be understood that, in some cases, the distance between the end of the second sealing portion 1073 pressed to a horizontal state and the edge of the cup body 101 in the horizontal direction may be between about 0.01-5 mm.

[0050] refer to Figure 2In another embodiment, the sealing member 107 further includes a third sealing portion 1074 formed by protruding downward from the lower end surface of the sealing member 107 (more specifically, the fixing portion 1071). The third sealing portion 1074 is located between the first sealing portion 1072 and the second sealing portion 1073. Furthermore, the lower end surface of the third sealing portion 1074 is lower than the lower end surface of the first sealing portion 1072. When the pressure plate 102 moves from the top plate 104 toward the cup body 101, the second sealing portion 1073 first comes into close contact with the upper end surface of the cup body 101 to achieve the first sealing; when the pressure plate 102 continues to move toward the cup body 101, the lower end surface of the third sealing portion 1074 then comes into close contact with the upper end of the cup body 101 to achieve the second sealing; as the pressure plate 102 continues to move toward the cup body 101, the first sealing portion 1072 comes into contact with the upper end surface of the cup body 101 and is pressed between the gap 200 to achieve the third sealing; when the pressure plate 102 abuts against the cup body 101, the vertical force from the pressure plate 102 further compresses the seal 107 to form a fluid seal. When the pressure plate driving device 106 drives the pressure plate 102 to completely abut against the cup body 101, and the first sealing portion 1072, the second sealing portion 1073 and the third sealing portion 1074 all form a seal with the upper end surface of the cup body 101, as shown in FIG5, Figure 5 The schematic diagram of the structure of the sealing member when the pressure plate of the embodiment of the present invention abuts against the cup body is shown. Multiple seals are formed by the joint action of the first sealing part 1072, the second sealing part 1073 and the third sealing part 1074 of the sealing member 107. The sealing effect is further guaranteed when the fluid sealing effect is achieved in different directions, different forms and different action parts at the same time. The third sealing part 1074 and the second sealing part 1073 are located on the outer peripheral side of the gap 200, and the defined sealing area is larger. At the same time, the third sealing part 1074 and the second sealing part 1073 contact the upper end surface of the cup body 101 before the first sealing part 1072, which can ensure a better sealing effect.

[0051] Furthermore, there are two or more third sealing parts 1074. The sealing member 107 is an elastic body with a certain elasticity, and can be slightly deformed under the vertical pressure of the pressure plate 102, so that the multiple sealing parts of the sealing member 107 can simultaneously achieve fluid sealing with the upper end surface of the cup body 101, thereby achieving multi-level sealing between the cup body 101 and the pressure plate 102, and achieving a better sealing effect.

[0052] For further information, please refer to Figure 6, the platen 102 also includes a protective cover 500, which is formed at the edge of the platen 102 and surrounds the outer side of the platen drive device 106. The protective cover 500 can be manufactured integrally with the platen 102, or it can be independently arranged relative to the platen 102, and the platen 102 is fixedly connected to the protective cover 500 by a fixing member. Exemplarily, in this embodiment, the protective cover 500 is fixedly connected to the platen 102 by bolts. The protective cover 500 can protect the platen 102 and the platen drive device 106 connected to the platen 102, prevent the electroplating liquid from splashing onto the upper end surface of the platen 102, and further prevent the electroplating liquid from corroding the platen 102 and the platen drive device 106 connected to the platen 102 under a long-term process environment, thereby affecting the safety and service life of the equipment. In the depicted embodiment, the protective cover 500 is a straight cylinder, sleeved on the outer side of the platen 102, and fixedly connected to the platen 102 by bolts. When the pressure plate driving device 106 drives the pressure plate 102 to move up and down, the protective cover 500 moves up and down following the pressure plate 102 .

[0053] Furthermore, in order to prevent the protective cover 500 from affecting the normal operation of the substrate holding device 100 itself, a certain distance is set between the inner wall of the protective cover 500 and the edge of the top plate 104. Exemplarily, the distance between the inner wall of the protective cover 500 and the edge of the top plate 104 is 2 mm.

[0054] For further information, please refer to Figure 1 and Figure 7 , at least one through hole 1021 is provided on the side wall of the pressure plate 102. When the pressure plate 102 abuts against the cup body 101, the sealing lip 105 provided at the bottom of the cup body 101 and the sealing member 107 provided between the pressure plate 102 and the cup body 101 simultaneously play a role of fluid sealing, and a negative pressure environment is formed in the space 300 (compared to the pressure in the electroplating equipment during the electroplating process). When the pressure plate 102 needs to be separated from the substrate 400, the substrate 400 is easily sucked by the pressure plate 102, which is not convenient for the pressure plate 102 to be separated from the substrate 400. Therefore, after the through hole 1021 is provided, the air pressure in the space 300 can be balanced with the air pressure of the electroplating environment in the external electroplating equipment, so as to facilitate the separation of the pressure plate 102 from the substrate 400.

[0055] Further, see Figure 8 and Fig. 9, the lower surface of the pressure plate 102 is also provided with a convex block 1022 protruding toward the substrate 400. When the pressure plate 102 contacts the substrate 400, only the convex block 1022 on the lower surface of the pressure plate 102 contacts the back surface of the substrate 400, while the rest of the lower surface of the pressure plate 102 does not contact the substrate 400. This design can reduce the contact area between the pressure plate 102 and the substrate 400, reduce scratches and stains on the back surface of the substrate 400, and on the other hand, it is conducive to the pressure on the back surface of the substrate 400 being equal to the ambient pressure, so as to facilitate the separation of the substrate 400 from the pressure plate 102 when unloading. During the process, it was found that the design of the bump 1022 can effectively reduce the scratches and contamination on the back of the substrate 400. However, when the substrate 400 is unloaded, the bump 1022 still occasionally sticks to the substrate 400, resulting in the substrate 400 and the platen 102 not being separated in an ideal state. To address this phenomenon, the R&D personnel opened a groove 1023 on the lower surface of the bump 1022 to further reduce the contact area between the bump 1022 and the substrate 400, thereby further reducing the possibility of scratches and contamination on the back of the substrate 400 and further facilitating the separation of the substrate 400 from the platen 102 when unloading. It is worth noting that when the groove 1023 is opened, the groove 1023 should be symmetrically arranged about the center of the bump 1022 to ensure that the bump 1022 and the substrate 400 are in more stable and uniform contact.

[0056] In another embodiment, reference Figure 6 , the sealing member 107 is disposed on the protective cover 500. When the sealing member 107 is disposed on the protective cover 500, the manner of the arrangement is the same as that of the arrangement on the pressure plate 102, and no further description is given here.

[0057] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate holding device, characterized in that: include: A cup body configured to carry a substrate; A pressure plate, configured to press against the back side of the substrate to fix the substrate relative to the cup body, so as to hold the substrate; A pressure plate driving device, connected to the pressure plate, and driving the pressure plate to descend or ascend, so that the pressure plate is pressed on the back side of the substrate to clamp the substrate or the pressure plate is moved away from the back side of the substrate; A sealing member, disposed on the pressure plate; Wherein, the sealing element comprises: A fixing portion fixed on the pressure plate; A first sealing portion protrudes downward from the fixing portion, wherein the cross-sectional shape of the first sealing portion is the same as the cross-sectional shape of the gap between the peripheral side of the pressure plate and the cup body when the pressure plate abuts against the cup body, and the first sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

2. The substrate holding device according to claim 1, characterized in that: The sealing element is an elastomer.

3. The substrate holding device according to claim 2, characterized in that: The sealing member further includes a second sealing portion extending downwardly and outwardly from an outer edge of the fixing portion.

4. The substrate holding device according to claim 3, characterized in that: Before the pressure plate abuts against the cup body, the lower end surface of the second sealing portion is lower than the lower end surface of the first sealing portion, and the second sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

5. The substrate holding device according to claim 4, characterized in that: When the second sealing portion abuts against the upper end surface of the cup body, part of the second sealing portion is pressed to a horizontal state, and the end of the second sealing portion is substantially flush with the edge of the cup body.

6. The substrate holding device according to claim 3, characterized in that: The sealing member further includes a third sealing portion which is formed by protruding downward from a lower end surface of the fixing portion, and the third sealing portion is located between the first sealing portion and the second sealing portion.

7. The substrate holding device according to claim 6, characterized in that: Before the pressure plate abuts against the cup body, the lower end surface of the third sealing portion is lower than the lower end surface of the first sealing portion.

8. The substrate holding device according to claim 1, characterized in that: The sealing member is disposed on the peripheral side of the pressure plate.

9. The substrate holding device according to claim 8, characterized in that: The fixing part comprises a limiting groove, the limiting groove is arranged on the inner side wall of the fixing part, the outer side wall of the pressure plate is provided with a limiting protrusion, the limiting groove matches the limiting protrusion to fix the fixing part to the peripheral side of the pressure plate.

10. The substrate holding device according to claim 9, characterized in that: The top end of the fixing portion is clamped in a fixing groove formed on the lower end surface of the pressure plate.

11. The substrate holding device according to claim 1, characterized in that: The pressure plate further includes a protective cover formed at an edge of the pressure plate and surrounding an outer side of the pressure plate driving device.

12. The substrate holding device according to claim 11, characterized in that: The sealing member is arranged on the protective cover in the corresponding area of ​​the upper end surface of the cup body.

13. The substrate holding device according to claim 1, characterized in that: A through hole is provided on the side wall of the pressure plate.

14. The substrate holding device according to claim 1, characterized in that: The lower surface of the pressure plate is provided with a protrusion extending downward.

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