Water temperature estimation method and device, electronic equipment, storage medium and vehicle

Abstract

The application discloses a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle. The method comprises the following steps: obtaining the heat electric power of an electronic device and the temperature of a circuit board; calculating a cold start heat quantity coefficient according to the difference between the first heat dissipation temperature of the electronic device transferred to a heat dissipation element in a steady state stage and the second heat dissipation temperature of the electronic device transferred to the heat dissipation element at a current moment; when the electronic device is in a cold start stage, correcting the heat dissipation quantity of the electronic device under the heat electric power according to the cold start heat quantity coefficient to obtain a cold start corrected heat dissipation quantity; and estimating the water path end portion water temperature of the heat dissipation element according to the cold start corrected heat dissipation quantity. The heat dissipation quantity is corrected by the cold start heat quantity coefficient, so that the corrected heat dissipation quantity conforms to the temperature distribution in the cold start stage, and thus the accurate water path end portion water temperature of the heat dissipation element of the electronic device in the cold start stage can be estimated through the temperature of the temperature measuring point on the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicles, and particularly relates to a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle. BACKGROUND

[0002] When heat dissipation is performed on an electronic device, such as a chip, a temperature sensor is usually arranged to measure the temperature in order to monitor the temperature of the electronic device. In addition, the electronic device is connected to a heat dissipation element, and heat conduction is performed through water in the heat dissipation element to achieve heat dissipation.

[0003] In order to monitor the end water temperature in the water circuit of the heat dissipation element, such as the outlet water temperature and the inlet water temperature of the water circuit, the water temperature in the water circuit needs to be monitored.

[0004] In order to reduce the cost, the water circuit end water temperature of the heat dissipation element connected to the electronic device can be determined through a thermal resistance model of the electronic device, so as to reduce the use of the water temperature sensor.

[0005] However, when the electronic device is started, it will experience a cold start stage and a steady state stage. The existing thermal resistance model is based on a steady state heat flow, and has high accuracy after the temperature distribution is stable. However, in the cold start stage of the electronic device, the error is large. Therefore, the existing technology is inaccurate in estimating the water circuit end water temperature in the cold start stage of the electronic device. SUMMARY

[0006] Therefore, it is necessary to provide a water temperature estimation method, device, electronic equipment, storage medium and vehicle to solve the technical problem that the existing technology is inaccurate in estimating the water circuit end water temperature in the cold start stage of the electronic device.

[0007] The present application provides a water temperature estimation method, comprising:

[0008] The heat generation electric power of the electronic device and the circuit board temperature are obtained. The electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water circuit.

[0009] The difference between the first heat dissipation temperature transferred to the heat dissipation element by the electronic device in the steady state stage and the second heat dissipation temperature transferred to the heat dissipation element by the electronic device at the current moment is calculated to obtain a cold start heat quantity coefficient. The cold start heat quantity coefficient represents the heat conduction capacity of the electronic device in the cold start stage.

[0010] When the electronic device is in the cold start stage, the heat dissipation amount of the electronic device under the heat generation electric power is corrected according to the cold start heat quantity coefficient to obtain a cold start corrected heat dissipation amount. The cold start corrected heat dissipation amount is the heat dissipation amount of the electronic device under the heat generation electric power in the cold start stage.

[0011] The water temperature at the water channel end of the heat dissipation element is estimated according to the cold start correction heat dissipation amount and the circuit board temperature.

[0012] Further, the method further comprises:

[0013] The first heat dissipation temperature is calculated and the second heat dissipation temperature is calculated according to the circuit board temperature, an estimated water temperature estimated at a steady state stage and an electronic device estimated temperature estimated at a steady state stage, the estimated water temperature being an estimated value of the water temperature in the heat dissipation element connected with the electronic device at a steady state stage calculated according to the circuit board temperature, and the electronic device estimated temperature being an estimated value of the electronic device temperature calculated according to the circuit board temperature at a steady state stage.

[0014] Further, the calculation of the first heat dissipation temperature comprises:

[0015] A first heat conduction error function operator at the end of the cold start of the electronic device is calculated according to the distance between the electronic device and the water channel and the cold start time of the electronic device.

[0016] The first heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the first heat conduction error function operator.

[0017] Further:

[0018] The first heat conduction error function operator at the end of the cold start of the electronic device is calculated according to the distance between the electronic device and the water channel and the cold start time of the electronic device, comprising: the first heat conduction error function operator is calculated as wherein, is the first heat conduction error function operator, L x is the distance between the electronic device and the water channel, t e is the cold start time of the electronic device, and a is a temperature diffusion coefficient.

[0019] The first heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the first heat conduction error function operator, comprising: the first heat dissipation temperature is calculated as

[0020] wherein, T x,stable is the first heat dissipation temperature, T e ’ is the electronic device estimated temperature, T w ’ is the estimated water temperature, is a heat conduction error function operator, and e is a natural constant.

[0021] Further, the calculation of the second heat dissipation temperature comprises:

[0022] calculating a second heat conduction error function operator at the current moment during the cold start process of the electronic device according to the distance between the electronic device and the water path;

[0023] calculating the second heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator.

[0024] Further,

[0025] The calculating a second heat conduction error function operator at the current moment during the cold start process of the electronic device according to the distance between the electronic device and the water path comprises: calculating the second heat conduction error function operator as wherein, is the second heat conduction error function operator, L x is the distance between the electronic device and the water path, t is the time length passed since the cold start of the electronic device to the current time, and a is a temperature diffusion coefficient;

[0026] The calculating the second heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator comprises: calculating the second heat dissipation temperature as wherein, T x,t is the second heat dissipation temperature, T e ’ is the estimated temperature of the electronic device, T w ’ is the estimated water temperature, is a heat conduction error function operator, and e is a natural constant.

[0027] Further, the calculating a cold start heat quantity coefficient according to the difference between the first heat dissipation temperature transferred to the heat dissipation element by the electronic device in the steady state stage and the second heat dissipation temperature transferred to the heat dissipation element by the electronic device at the current moment comprises:

[0028] The calculating a cold start heat quantity coefficient comprises: wherein, k transient is the cold start heat quantity coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, and T w ’ is the estimated estimated water temperature in the steady state stage.

[0029] Further, the method further comprises:

[0030] When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state judgment value, it is judged that the current stage of the electronic device is a cold start stage, otherwise it is judged that the current stage of the electronic device is a steady state stage.

[0031] Clearing the current stage of the electronic device when the electronic device is powered off.

[0032] Further, the step of correcting the heat dissipation of the electronic device under the heat generating electric power according to the cold start heat coefficient to obtain a cold start corrected heat dissipation includes:

[0033] The cold start corrected heat dissipation is calculated as: Q transient = k transient Q, where Q transient is the heat dissipation of the electronic device per unit time calculated according to the heat generating electric power, k transient is the cold start heat coefficient.

[0034] Further, the step of correcting the heat dissipation of the electronic device under the heat generating electric power according to the cold start heat coefficient to obtain a cold start corrected heat dissipation includes:

[0035] The step of calculating the first heat dissipation of the electronic device to the heat dissipation element and the second heat dissipation of the electronic device to the circuit board according to the cold start corrected heat dissipation includes:

[0036] The step of estimating the water temperature at the end of the water channel of the heat dissipation element according to the cold start corrected heat dissipation and the temperature of the circuit board includes:

[0037] The step of calculating the temperature of the electronic device at the location of the electronic device according to the second heat dissipation and the temperature of the circuit board, based on the second thermal resistance between the temperature measuring point and the electronic device, includes:

[0038] The step of calculating the average heat exchange water temperature in the heat dissipation element according to the temperature of the electronic device and the first heat dissipation, based on the first thermal resistance between the electronic device and the water channel, includes:

[0039] The step of estimating the water temperature at the end of the water channel of the heat dissipation element according to the average heat exchange water temperature includes:

[0040] Further, the step of correcting the heat dissipation of the electronic device under the heat generating electric power according to the cold start heat coefficient to obtain a cold start corrected heat dissipation includes:

[0041] The step of calculating the first heat dissipation of the electronic device to the heat dissipation element and the second heat dissipation of the electronic device to the circuit board according to the cold start corrected heat dissipation includes:

[0042] The first heat dissipation is calculated as: Q1 = (1-k)Q transient , and the second heat dissipation is calculated as: Q2 = kQ transient , where Q1 is the first heat dissipation, Q2 is the second heat dissipation, and Q transient is the cold start corrected heat dissipation.

[0043] The electronic device temperature at the location of the electronic device is calculated according to the second heat dissipation amount and the circuit board temperature, based on a second thermal resistance between the temperature measuring point and the electronic device, including: calculating the electronic device temperature as T e = T2 + Q2 R2, wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance;

[0044] The average heat exchange water temperature in the heat dissipation element is calculated according to the electronic device temperature and the first heat dissipation amount, based on a first thermal resistance between the electronic device and the water channel, including: calculating the average heat exchange water temperature as T w = T e - R1 Q1, wherein T w is the average heat exchange water temperature, T e is the electronic device temperature, R1 is the first thermal resistance, and Q1 is the first heat dissipation amount.

[0045] Further, the water channel end water temperature of the heat dissipation element includes a water channel inlet water temperature, and the water channel end water temperature of the heat dissipation element is estimated according to the average heat exchange water temperature, including:

[0046] The thermal conduction thermal resistance between the electronic device and the heat dissipation element is calculated according to the structural thickness of each layer, the thermal conductivity of each layer, and the area of each layer, including: wherein R 1,cond is the thermal conduction thermal resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of the i-th layer, and n is the number of layers.

[0047] The wall temperature of the heat dissipation element in contact with water is calculated as T wall = T e - Q1 R 1,cond , wherein T wall is the wall temperature, T e is the electronic device temperature, Q1 is the first heat dissipation amount, and R 1,cond is the thermal conduction thermal resistance.

[0048] The water channel inlet water temperature is estimated as: wherein T in is the water channel inlet water temperature, α is the water heat exchange coefficient, is the water mass flow, Cp w is the water specific heat at constant pressure, A w is the water heat exchange area, and Tw T is the average heat exchange water temperature, wall T is the wall temperature.

[0049] Further, the water outlet temperature of the water channel end of the heat dissipation element also includes the water outlet temperature of the water channel, and the water outlet temperature of the water channel end of the heat dissipation element is estimated according to the average heat exchange water temperature, and specifically includes:

[0050] The water outlet temperature of the water channel is estimated as: T is the water outlet temperature of the water channel, R is the heat exchange area per unit length, and L is the length of the water channel. out T is the water outlet temperature of the water channel, R is the heat exchange area per unit length, and L is the length of the water channel.

[0051] The present application provides a water temperature estimation device, comprising:

[0052] The acquisition module is configured to acquire the heat generation electric power of the electronic device and the temperature of the circuit board.

[0053] The cold start correction coefficient calculation module is configured to calculate a cold start heat quantity coefficient according to a difference between a first heat dissipation temperature of the electronic device transferred to the heat dissipation element in a steady state stage and a second heat dissipation temperature of the electronic device transferred to the heat dissipation element at a current time.

[0054] The cold start correction module is configured to correct the heat dissipation quantity of the electronic device under the heat generation electric power according to the cold start heat quantity coefficient to obtain a cold start correction heat dissipation quantity when the electronic device is in a cold start stage.

[0055] The water channel end temperature calculation module is configured to estimate the water channel end temperature of the heat dissipation element according to the cold start correction heat dissipation quantity and the temperature of the circuit board.

[0056] The present application provides an electronic device, comprising:

[0057] at least one processor; and

[0058] a memory in communication with the at least one processor; wherein

[0059] The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the water temperature estimation method as described above.

[0060] The application provides a storage medium, which stores computer instructions, when the computer executes the computer instructions, all steps of the water temperature estimation method are executed.

[0061] The application provides a vehicle, which comprises the water temperature estimation device or the electronic device.

[0062] The application calculates the first heat dissipation temperature and the second heat dissipation temperature according to the estimated water temperature estimated in the steady state stage and the estimated temperature of the electronic device estimated in the steady state stage respectively, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in the steady state stage and the second heat dissipation temperature transferred to the heat dissipation element at the current moment, then corrects the heat dissipation amount of the electronic device under the heat generating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation amount, and estimates the water path end water temperature of the heat dissipation element according to the cold start corrected heat dissipation amount. Since the cold start heat coefficient represents the heat conduction capacity of the electronic device in the cold start stage, the heat dissipation amount is corrected by the cold start heat coefficient, so that the corrected heat dissipation amount conforms to the temperature distribution in the cold start stage, and thus the accurate water path end water temperature of the heat dissipation element in the cold start stage of the electronic device can be estimated by the temperature of the temperature measuring point on the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0063] Figure 1 The working flow chart of the water temperature estimation method of an embodiment of the application is shown in the figure;

[0064] Figure 2 The working flow chart of the water temperature estimation method of another embodiment of the application is shown in the figure;

[0065] Figure 3 The heat conduction model schematic diagram of an embodiment of the application is shown in the figure;

[0066] Figure 4 The working flow chart of the electronic device current stage judging of the best embodiment of the application is shown in the figure;

[0067] Figure 5 The water path flow model building schematic diagram of an example of the application is shown in the figure;

[0068] Figure 6 The calculation effect schematic diagram of an example of the application is shown in the figure;

[0069] Figure 7 The schematic diagram of the water temperature estimation device of an embodiment of the application is shown in the figure;

[0070] Figure 8 The hardware structure schematic diagram of the electronic device of the application is shown in the figure. DETAILED DESCRIPTION

[0071] The specific embodiments of the present application are further illustrated in the following description with reference to the accompanying drawings. Identical parts are denoted by the same reference numerals in the drawings. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer" refer to the directions towards or away from the geometric center of a particular component.

[0072] As Figure 1 Fig. 1 shows a flowchart of a water temperature estimation method according to an embodiment of the present application, which comprises the following steps:

[0073] In step S101, the heat generating electric power of an electronic device and the temperature of a circuit board are obtained. The electronic device is fixed on the circuit board, and the electronic device is connected with a heat dissipation element in contact with a water circuit.

[0074] In step S102, a cold start heat quantity coefficient is calculated according to the difference between a first heat dissipation temperature transferred from the electronic device to the heat dissipation element in a steady state stage and a second heat dissipation temperature transferred from the electronic device to the heat dissipation element at a current time. The cold start heat quantity coefficient represents the ability of heat conduction of the electronic device in a cold start stage.

[0075] In step S103, a cold start corrected heat dissipation quantity of the electronic device under the heat generating electric power is obtained according to the cold start heat quantity coefficient when the electronic device is in the cold start stage. The cold start corrected heat dissipation quantity is the heat dissipation quantity of the electronic device under the heat generating electric power in the cold start stage.

[0076] In step S104, the water temperature at the end of the water circuit of the heat dissipation element is estimated according to the cold start corrected heat dissipation quantity and the temperature of the circuit board.

[0077] Specifically, the present application can be applied to electronic devices with processing capabilities, such as electronic control unit (ECU) or extended domain control unit (XCU) of a vehicle.

[0078] Specifically, first, the electronic device performs step S101 to obtain the heat generating electric power of the electronic device and the temperature of the circuit board.

[0079] In some embodiments, the electronic device is a chip.

[0080] As Figure 3The heat conduction model schematic diagram of one embodiment of the present application is shown, including electronic device 1, circuit board 2 and heat dissipation element 3. Among them, the heat source is the heat generation electric power of electronic device 1, because it does not need to do work outside, so all is converted into heat. Connected with electronic device 1 is circuit board 2 (Printed Circuit Board, PCB), because the circuit board is very poor in heat conduction, so the heat dissipation Q 环 to the environment can be ignored. The heat generated by electronic device 1 is transmitted through circuit board 2 and through the connected heat dissipation element 3, and the heat dissipation element 3 is preferably a heat dissipation plate, such as a heat dissipation aluminum plate. The heat dissipation element is in contact with the cooling water in the water channel, and the heat is transmitted to the cooling water. Among them, the heat dissipation through the heat dissipation element 3 accounts for more than 90% of the total amount, and the electronic device 1 is connected with the heat dissipation element 3 through the heat conduction structure 4, and the heat dissipation of the electronic device 1 to the water through the heat dissipation element 3 is Q 水 .

[0081] A sensor is arranged at the temperature measurement point 21 of the circuit board 2, and the temperature of the circuit board is obtained through the sensor. The distance from the temperature measurement point 21 to the center position of the electronic device 1 is the sensor measurement distance L2.

[0082] Then, step S102 is executed, and the difference between the first heat dissipation temperature of the electronic device transmitted to the heat dissipation element in the steady state stage and the second heat dissipation temperature of the electronic device transmitted to the heat dissipation element at the current moment is calculated to obtain the cold start heat coefficient, which represents the heat conduction capacity of the electronic device in the cold start stage.

[0083] Among them, the state of the electronic device is in the steady state stage in normal use, and after power-off, the electronic device transits from the cold start stage to the steady state stage when power-on. In the cold start stage, the temperature changes greatly, and in the steady state stage, the temperature changes less. Therefore, by judging whether the electronic device is in the cold start stage, and in the cold start stage, the difference between the first heat dissipation temperature of the electronic device transmitted to the heat dissipation element in the steady state stage and the second heat dissipation temperature of the electronic device transmitted to the heat dissipation element at the current moment is calculated to obtain the cold start heat coefficient. The cold start heat coefficient represents the heat conduction capacity of the electronic device in the cold start stage, which is used to describe the difference between the temperature distribution in the cold start stage and the temperature distribution in the steady state stage.

[0084] In some embodiments, the difference between the first heat dissipation temperature of the electronic device transmitted to the heat dissipation element in the steady state stage and the second heat dissipation temperature of the electronic device transmitted to the heat dissipation element at the current moment is calculated to obtain the cold start heat coefficient, which includes:

[0085] According to the cold start heat transfer model, the cold start heat transfer coefficient at the current time is determined according to a difference between the first heat dissipation temperature and an estimated water temperature estimated at a steady state stage, and a difference between the second heat dissipation temperature and the estimated water temperature.

[0086] Then, when the current stage of the electronic device is a cold start stage, step S103 is performed to correct the heat dissipation amount of the electronic device under the heat generating electric power according to the cold start heat transfer coefficient to obtain a cold start corrected heat dissipation amount.

[0087] Specifically, the heat generating electric power of the electronic device can be taken as the heat dissipation amount per unit time of the electronic device. The heat dissipation amount is corrected by the cold start heat transfer coefficient correction to obtain the cold start corrected heat dissipation amount.

[0088] Finally, step S104 is performed to estimate the water path end portion water temperature of the heat dissipation element according to the cold start corrected heat dissipation amount and the circuit board temperature.

[0089] Specifically, the average heat exchange water temperature is calculated based on the cold start corrected heat dissipation amount calculated in step S103, and the water path end portion water temperature of the heat dissipation element is estimated according to the average heat exchange water temperature. The average heat exchange water temperature is the average value of the heat exchange temperatures of the heat dissipation element and the electronic device. Since the water flow in the heat dissipation element flows from the water path inlet, exchanges heat with the electronic device, and then flows out from the water path outlet, the water path end portion water temperature in the heat dissipation element is different from the average heat exchange water temperature. In order to obtain the water path end portion water temperature, the wall temperature of the heat dissipation element where the wall contacts with water can be calculated according to the average heat exchange water temperature. The steady state heat exchange refers to the temperature distribution of the entire heat exchange system, including the electronic device as a heat source and each heat transfer element for heat dissipation, which does not change, wherein the temperature distribution not changing means that the temperature at each point does not change or changes very slightly. Under the condition of uniform wall temperature, based on the wall temperature, the relationship between the average heat exchange water temperature and the water path end portion water temperature in the heat dissipation element can be obtained. Thus, the water path end portion water temperature in the heat dissipation element is estimated according to the average heat exchange water temperature.

[0090] In some embodiments, the water path end portion water temperature is the water path inlet water temperature or the water path outlet water temperature.

[0091] The application calculates the first heat dissipation temperature and the second heat dissipation temperature according to the estimated water temperature estimated in the steady state stage and the estimated temperature of the electronic device estimated in the steady state stage, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in the steady state stage and the second heat dissipation temperature transferred to the heat dissipation element at the current moment, corrects the heat dissipation amount of the electronic device under the heat generating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation amount, and estimates the water end water temperature of the heat dissipation element according to the cold start corrected heat dissipation amount. Since the cold start heat coefficient represents the heat conduction capacity of the electronic device in the cold start stage, the heat dissipation amount is corrected by the cold start heat coefficient, so that the corrected heat dissipation amount conforms to the temperature distribution in the cold start stage, so that the accurate water end water temperature of the heat dissipation element in the cold start stage of the electronic device can be estimated through the temperature of the temperature measuring point on the circuit board.

[0092] As Figure 2 The working flow chart of a water temperature estimation method in another embodiment of the application is shown, which comprises the following steps:

[0093] In step S201, the heat generating electric power of the electronic device and the circuit board temperature are obtained; the electronic device is fixed on the circuit board, and the heat dissipation element in contact with the water channel is connected to the electronic device.

[0094] In step S202, the first heat dissipation temperature and the second heat dissipation temperature are calculated according to the circuit board temperature, the estimated water temperature estimated in the steady state stage and the estimated temperature of the electronic device estimated in the steady state stage; the estimated water temperature is the estimated value of the water temperature in the heat dissipation element connected to the electronic device calculated according to the circuit board temperature in the steady state stage, and the estimated temperature of the electronic device is the estimated value of the electronic device temperature calculated according to the circuit board temperature in the steady state stage.

[0095] In one of the embodiments, the calculation of the first heat dissipation temperature comprises the following steps:

[0096] According to the distance between the electronic device and the water channel and the cold start time of the electronic device, the first heat conduction error function operator at the end of the cold start of the electronic device is calculated;

[0097] According to the estimated water temperature, the estimated temperature of the electronic device and the first heat conduction error function operator, the first heat dissipation temperature is calculated.

[0098] In one of the embodiments:

[0099] The first heat conduction error function operator at the end of the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway and the cold start time of the electronic device, and the first heat conduction error function operator is calculated as wherein, the first heat conduction error function operator is L x the distance between the electronic device and the waterway is t e the cold start time of the electronic device is a, and a is a temperature diffusion coefficient;

[0100] The first heat conduction error function operator at the end of the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway and the cold start time of the electronic device, and the first heat conduction error function operator is calculated as wherein, x,stable the first heat conduction error function operator is L e the estimated temperature of the electronic device is T w the estimated water temperature is T the heat conduction error function operator is e, and e is a natural constant.

[0101] In one of the embodiments, the second heat dissipation temperature is calculated by:

[0102] A second heat conduction error function operator at the current time during the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway.

[0103] The second heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator.

[0104] In one of the embodiments:

[0105] The second heat conduction error function operator at the current time during the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway, and the second heat conduction error function operator is calculated as wherein, the second heat conduction error function operator is L x the distance between the electronic device and the waterway is t, t is the time length elapsed since the cold start of the electronic device to the current time, and a is a temperature diffusion coefficient;

[0106] The second heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator. wherein, x,t the second heat conduction error function operator is L e the estimated temperature of the electronic device is T w the estimated water temperature is T is the error function operator for heat conduction, e is the natural constant.

[0107] In step S203, a cold start heat coefficient is calculated according to a difference between a first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transferred to the heat dissipation element at a current time.

[0108] In one embodiment, the cold start heat coefficient is calculated according to a difference between a first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transferred to the heat dissipation element at a current time, including:

[0109] The cold start heat coefficient is calculated as: wherein k transient is the cold start heat coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w ' is an estimated water temperature estimated in the steady state stage.

[0110] In step S204, when the electronic device is powered on, if an absolute value of a temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state judgment value, it is judged that a current stage of the electronic device is a cold start stage, otherwise, it is judged that the current stage of the electronic device is a steady state stage; when the electronic device is powered off, the current stage of the electronic device is cleared.

[0111] In step S205, when the current stage of the electronic device is the cold start stage, a cold start corrected heat dissipation quantity is obtained by correcting a heat dissipation quantity of the electronic device under the heat generating electric power according to the cold start heat coefficient.

[0112] In one embodiment, the cold start corrected heat dissipation quantity is obtained by correcting the heat dissipation quantity of the electronic device under the heat generating electric power according to the cold start heat coefficient, including:

[0113] The cold start corrected heat dissipation quantity is calculated as: Q transient = k transient Q, wherein Q transient is the cold start corrected heat dissipation quantity, Q is a heat generating quantity of the electronic device per unit time calculated according to the heat generating electric power, and k transient is the cold start heat coefficient.

[0114] In step S206, a first heat dissipation quantity of the electronic device to the heat dissipation element and a second heat dissipation quantity of the electronic device to the circuit board are calculated according to the cold start corrected heat dissipation quantity.

[0115] Step S207, calculating the electronic device temperature at the position of the electronic device according to the second heat dissipation amount and the circuit board temperature, based on the second thermal resistance between the temperature measuring point and the electronic device;

[0116] Step S208, calculating the average heat exchange water temperature in the heat dissipation element according to the electronic device temperature and the first heat dissipation amount, based on the first thermal resistance between the electronic device and the water path, the average heat exchange water temperature being the average of the heat exchange temperatures of the heat dissipation element and the electronic device.

[0117] In one of the embodiments,

[0118] The first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board according to the cold start correction heat dissipation amount include: calculating the first heat dissipation amount as Q1=(1-k)Q transient , and the second heat dissipation amount as Q2=kQ transient , wherein Q1 is the first heat dissipation amount, Q2 is the second heat dissipation amount, Q transient is the cold start correction heat dissipation amount.

[0119] The electronic device temperature at the position of the electronic device according to the second heat dissipation amount and the circuit board temperature, based on the second thermal resistance between the temperature measuring point and the electronic device, includes: calculating the electronic device temperature as T e =T2+Q2·R2, wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance.

[0120] The average heat exchange water temperature in the heat dissipation element according to the electronic device temperature and the first heat dissipation amount, based on the first thermal resistance between the electronic device and the water path, includes: calculating the average heat exchange water temperature as T w =T e -R1·Q1, wherein T w is the average heat exchange water temperature, T e is the electronic device temperature, and R1 is the first thermal resistance.

[0121] Step S209, estimating the water path end water temperature of the heat dissipation element according to the average heat exchange water temperature.

[0122] In one of the embodiments, the water path end water temperature of the heat dissipation element includes the water path inlet water temperature, and the estimation of the water path end water temperature of the heat dissipation element according to the average heat exchange water temperature includes:

[0123] According to the structure thickness of each layer between the electronic device and the heat dissipation element, the heat conduction coefficient of each layer, and the area of each layer, the heat conduction thermal resistance of the electronic device to the heat dissipation element is calculated as: wherein R 1,cond is the heat conduction thermal resistance, δ i is the structure thickness of the i-th layer, λ i is the heat conduction coefficient of the i-th layer, A i is the area of the i-th layer, and n is the number of layers.

[0124] The wall temperature of the heat dissipation element in contact with water is calculated as T wall = T e - Q1·R 1,cond wherein T wall is the wall temperature, T e is the electronic device temperature, Q1 is the first heat dissipation amount, R 1,cond is the heat conduction thermal resistance.

[0125] The water inlet temperature of the water channel is estimated as: wherein T in is the water inlet temperature of the water channel, α is the water heat exchange coefficient, is the water mass flow, Cp w is the specific heat of water at constant pressure, A w is the water heat exchange area, T w is the average heat exchange water temperature, and T wall is the wall temperature.

[0126] In one embodiment, the water channel end temperature of the heat dissipation element further includes the water channel outlet temperature, and the estimation of the water channel end temperature of the heat dissipation element according to the average heat exchange water temperature specifically includes:

[0127] The water channel outlet temperature is estimated as: wherein T out is the water channel outlet temperature, R is the heat exchange area per unit length, and L is the water channel length.

[0128] Specifically, first, step S201 is performed to obtain the heat generation electric power of the electronic device and the circuit board temperature.

[0129] Then, step S202 is performed to calculate the first heat dissipation temperature and calculate the second heat dissipation temperature according to the circuit board temperature, the estimated water temperature estimated in the steady state stage, and the electronic device estimated temperature estimated in the steady state stage.

[0130] The estimated water temperature is an estimated value of water temperature in the heat dissipation element connected with the electronic device according to the circuit board temperature in the steady state stage, and the estimated electronic device temperature is an estimated value of electronic device temperature according to the circuit board temperature in the steady state stage. In the steady state process, the thermal resistance between the chip and the water changes depending on the physical properties. Therefore, the chip operating temperature can be estimated according to the water temperature. Therefore, the estimated water temperature and the estimated electronic device temperature can be calculated in the steady state stage.

[0131] In some embodiments, the method further comprises:

[0132] calculating an estimated electronic device temperature in the steady state stage and a predicted water temperature in the heat dissipation element in the steady state stage according to the thermal resistance steady state model, taking the estimated electronic device temperature in the steady state stage as the estimated electronic device temperature, and taking the predicted water temperature in the heat dissipation element in the steady state stage as the estimated water temperature.

[0133] The thermal resistance steady state model comprises:

[0134] A first steady state heat dissipation quantity relationship: Q1'= (1-k)Q;

[0135] A second steady state heat dissipation quantity relationship: Q2'= kQ;

[0136] An electronic device temperature relationship in the steady state stage: T e ' = T2+ Q2'·R2;

[0137] A water temperature relationship for calculating a predicted water temperature in the heat dissipation element in the steady state stage: T w ' = T e '-R1·Q1';

[0138] The first steady state heat dissipation quantity Q1', the second steady state heat dissipation quantity Q2', the electronic device heat quantity Q calculated according to the heat generating electric power, the steady state heat transfer proportion k, the estimated electronic device temperature T e ', the sensor temperature T2, the second thermal resistance R2, the predicted water temperature T w ' in the heat dissipation element in the steady state stage, and the first thermal resistance R1.

[0139] After taking the estimated electronic device temperature in the steady state stage as the estimated electronic device temperature and taking the average heat exchange water temperature in the heat dissipation element in the steady state stage as the estimated water temperature, the first heat dissipation temperature is calculated and the second heat dissipation temperature is calculated, respectively.

[0140] In one of the embodiments, the calculation of the first heat dissipation temperature comprises:

[0141] According to the distance between the electronic device and the water channel, the cold start time of the electronic device, a first heat conduction error function operator at the end of the cold start of the electronic device is calculated;

[0142] According to the estimated water temperature, the electronic device estimated temperature and the first heat conduction error function operator, the first heat dissipation temperature is calculated.

[0143] Specifically, the heat conduction error function operator is:

[0144]

[0145] Wherein, L is the distance between the electronic device and the water channel, t is time, and a is the temperature diffusion coefficient. x L is the distance between the electronic device and the water channel, t is time, and a is the temperature diffusion coefficient.

[0146] The a in formula (1) is the temperature diffusion coefficient, which represents the temperature diffusion capacity, and the calculation method is:

[0147]

[0148] Wherein, ρ is the equivalent density of the heat transfer material between the electronic device and the water, λ is the equivalent heat conduction coefficient of the heat transfer material between the electronic device and the water, and C P The equivalent specific heat at constant pressure of the heat transfer material between the electronic device and the water. Specifically, the equivalent density can be the average density of each layer of heat transfer material between the electronic device and the water, the equivalent heat conduction coefficient can be the average heat conduction coefficient of each layer of heat transfer material between the electronic device and the water, and the equivalent specific heat at constant pressure can be the average specific heat at constant pressure of each layer of heat transfer material between the electronic device and the water.

[0149] In one of the embodiments:

[0150] The first heat conduction error function operator at the end of the cold start of the electronic device is calculated according to the distance between the electronic device and the water channel, the cold start time of the electronic device, including: calculating the first heat conduction error function operator as Wherein, L is the distance between the electronic device and the water channel, t is time, and a is the temperature diffusion coefficient. x L is the distance between the electronic device and the water channel, t is time, and a is the temperature diffusion coefficient. e The cold start time of the electronic device, and a is the temperature diffusion coefficient.

[0151] The first heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the first heat conduction error function operator, including: calculating the first heat dissipation temperature as Wherein, T x,stable The first heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the first heat conduction error function operator, including: calculating the first heat dissipation temperature as e The first heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the first heat conduction error function operator, including: calculating the first heat dissipation temperature asw T' is the estimated water temperature, is the heat conduction error function operator, and e is the natural constant.

[0152] Specifically, the test temperature point from the electronic device to the circuit board and the heat exchange wall of the waterway are equal-area conductor heat transfer, therefore, the distance L x from the waterway to the electronic device is estimated. e

[0153] Then, the distance L x from the waterway to the electronic device and the cold start time t e are substituted into formula (1) to obtain the first heat conduction error function operator wherein, T' is the estimated water temperature, x L is the distance from the electronic device to the waterway, e t is the cold start time of the electronic device, and a is the temperature diffusion coefficient.

[0154] Then, the first heat dissipation temperature of the heat dissipation element, that is, the temperature at the distance L x from the electronic device after the cold start time of the electronic device is determined. Therefore, the first heat dissipation temperature of the heat dissipation element is determined by integrating from 0 to the first heat conduction error function operator:

[0155]

[0156] wherein, T x,stable is the first heat dissipation temperature, e T' is the estimated temperature of the electronic device, w T' is the estimated water temperature, is the heat conduction error function operator, and e is the natural constant.

[0157] The first heat dissipation temperature of the heat dissipation element is determined by the heat conduction error function operator.

[0158] Meanwhile, the second heat dissipation temperature is calculated at each sampling time.

[0159] In one embodiment, the calculation of the second heat dissipation temperature comprises:

[0160] According to the distance from the electronic device to the waterway, a second heat conduction error function operator at the current time during the cold start process of the electronic device is calculated.

[0161] ​The second heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the second heat conduction error function operator.

[0162] Specifically, at each sampling time, the second heat conduction error function operator is calculated by formula (1), and then the second heat dissipation temperature is calculated by the second heat conduction error function operator.

[0163] In one embodiment,

[0164] The second heat conduction error function operator at the current time in the cold start process of the electronic device is calculated according to the distance between the electronic device and the waterway, including: the second heat conduction error function operator is calculated as Wherein, The second heat conduction error function operator, L x The distance between the electronic device and the waterway, t is the time length passed by the electronic device from the cold start to the current time, and a is the temperature diffusion coefficient.

[0165] The second heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the second heat conduction error function operator, including: the second heat dissipation temperature is calculated as Wherein, T x,t The second heat dissipation temperature, T e The electronic device estimated temperature, T w The estimated water temperature, The heat conduction error function operator, e is the natural constant.

[0166] Specifically, the distance L x From the waterway to the electronic device is substituted into formula (1), and the second heat conduction error function operator Wherein, The second heat conduction error function operator, L x The distance between the electronic device and the waterway, t is the time length passed by the electronic device from the cold start to the current time, and a is the temperature diffusion coefficient.

[0167] Then, the second heat dissipation temperature is the temperature of the electronic device at the current time, which is L x Therefore, the second heat dissipation temperature is determined by integrating from 0 to the second heat conduction error function operator:

[0168]

[0169] Wherein, T x,t The second heat dissipation temperature, T e The electronic device estimated temperature, T wT is the estimated water temperature, e is the natural constant.

[0170] The second heat dissipation temperature of the heat dissipation element is determined by the heat conduction error function operator.

[0171] Then, step S203 is performed to calculate the cold start heat quantity coefficient according to the difference between the first heat dissipation temperature of the electronic device in the steady state stage and the second heat dissipation temperature of the electronic device at the current moment.

[0172] The temperature difference between the heat transfer end and the water temperature determines the size of heat conduction, and therefore, the cold start heat quantity coefficient at the current moment is calculated according to the first heat dissipation temperature and the second heat dissipation temperature, which is used to calculate the heat exchange quantity in the cold start stage.

[0173] In one embodiment, the calculation of the cold start heat quantity coefficient according to the difference between the first heat dissipation temperature of the electronic device in the steady state stage and the second heat dissipation temperature of the electronic device at the current moment includes:

[0174] The calculation of the cold start heat quantity coefficient is: wherein k is the cold start heat quantity coefficient, T is the first heat dissipation temperature, T is the second heat dissipation temperature, and T is the estimated water temperature. transient is the estimated water temperature. x,stable is the first heat dissipation temperature. x,t is the second heat dissipation temperature. w is the estimated water temperature.

[0175] Specifically, the calculation of the cold start heat quantity coefficient is:

[0176]

[0177] wherein k is the cold start heat quantity coefficient, T is the first heat dissipation temperature, T is the second heat dissipation temperature, and T is the estimated water temperature. transient is the estimated water temperature. x,stable is the first heat dissipation temperature. x,t is the second heat dissipation temperature. w is the estimated water temperature.

[0178] The accurate cold start heat quantity coefficient is determined according to the second heat dissipation temperature and the first heat dissipation temperature.

[0179] Then, step S204 is performed to determine whether the current stage of the electronic device is a cold start stage. When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state determination value, it is determined that the current stage of the electronic device is a cold start stage, otherwise, it is determined that the current stage of the electronic device is a steady state stage. When the electronic device is powered off, the current stage of the electronic device is cleared.

[0180] Wherein, after the electronic device is powered on, the electronic device first experiences a cold start stage, and the temperature rises rapidly. Then, the temperature reaches a steady state, and the temperature difference dT between the circuit board temperatures at two consecutive sampling times is 0, and the steady state stage is entered and maintained. In the steady state stage, the temperature may have slight fluctuations, wherein, dT = 0 is a steady state, 0 < |dT| < T 阈值 is a quasi-steady state, and T 阈值 is a very small temperature threshold value. The steady state and the quasi-steady state are both steady state stages.

[0181] Specifically, as shown in Figure 4 the working flowchart of the best embodiment of the present application for determining the current stage of the electronic device, the electronic device is a chip, and the method comprises the following steps:

[0182] Step S401, if the chip is powered off, step S402 is performed, otherwise, the current stage of the chip is maintained as a steady state stage;

[0183] Step S402, the chip is put into hibernation;

[0184] Step S403, the chip is powered on;

[0185] Step S404, if |T2-T x,t | < Limit, it is determined as a steady state stage, otherwise, it is determined as a cold start stage.

[0186] Wherein, Limit is a preset state determination value, T2 is the circuit board temperature, and T x,t is the second heat dissipation temperature calculated according to formula (4). When the absolute value of the temperature difference between the two is less than the state determination value, the current stage of the chip is determined as a steady state. After entering the steady state, when the chip is powered off, the state is cleared, and the state is determined again after being powered on. When the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to the state determination value, the current stage of the chip is determined as a cold start state. In the whole process of the cold start, the second heat dissipation temperature is calculated at each sampling time and compared with the circuit board temperature to determine whether the current stage is still maintained as a cold start stage.

[0187] Then, when the current stage of the electronic device is a cold start stage, steps S205 to S208 are performed to calculate an average heat exchange water temperature in a heat dissipation element connected to the electronic device according to the cold start heat transfer coefficient, the heat generating electric power, and the circuit board temperature, the average heat exchange water temperature being an average of heat exchange temperatures of the heat dissipation element and the electronic device.

[0188] Specifically, the cold start heat transfer coefficient, the heat generating electric power, and the circuit board temperature are input into a thermal resistance cold start model to obtain an average heat exchange water temperature output by the thermal resistance cold start model as the average heat exchange water temperature, the thermal resistance cold start model taking the cold start heat transfer coefficient, the heat generating electric power, and the circuit board temperature as input variables and outputting the average heat exchange water temperature based on thermal resistance.

[0189] Specifically, the cold start heat transfer coefficient calculated by formula (5) at the current time, and the heat generating electric power and the circuit board temperature collected are input into a thermal resistance cold start model to obtain an average heat exchange water temperature output by the thermal resistance cold start model.

[0190] The thermal resistance cold start model at least includes a heat dissipation amount distribution relationship, a device temperature relationship, and a water temperature relationship, i.e., steps S205 to S208.

[0191] Step S205 is performed to correct the heat dissipation amount of the electronic device under the heat generating electric power according to the cold start heat transfer coefficient to obtain a cold start corrected heat dissipation amount when the current stage of the electronic device is a cold start stage.

[0192] In one embodiment, the correction of the heat dissipation amount of the electronic device under the heat generating electric power according to the cold start heat transfer coefficient to obtain a cold start corrected heat dissipation amount includes:

[0193] The correction of the heat dissipation amount of the electronic device under the heat generating electric power according to the cold start heat transfer coefficient to obtain a cold start corrected heat dissipation amount includes:

[0194] The cold start corrected heat dissipation amount is calculated as: Q transient = k transient Q, where Q transient is the heat dissipation amount of the electronic device per unit time calculated according to the heat generating electric power, k transient is the cold start heat transfer coefficient.

[0195] Specifically, the cold start corrected heat dissipation amount is calculated according to the cold start heat transfer coefficient as:

[0196] Q transient = k transient Q (6)

[0197] Q1 = (1 - k)Q transient Q is the electronic device heat generation per unit time calculated according to the heat generation electric power, k transient is the cold start heat generation coefficient.

[0198] Then step S206 is performed, the first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board are calculated according to the cold start correction heat dissipation amount.

[0199] In one embodiment, the first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board are calculated according to the cold start correction heat dissipation amount, including: the first heat dissipation amount is calculated as Q1 = (1 - k)Q transient , and the second heat dissipation amount is calculated as Q2 = kQ transient , wherein Q1 is the first heat dissipation amount, Q2 is the second heat dissipation amount, Q transient is the cold start correction heat dissipation amount

[0200] According to the current stage of the electronic device determined in step S204, it is determined whether to use Q or Q transient The following calculation process is used if it is a cold start stage: Q transient If it is a steady state stage, Q is used, and the following calculation is taken as an example of dynamic calculation.

[0201] Based on the heat generation electric power, the electronic device heat generation per unit time Q can be calculated as the product of the heat generation electric power and the unit time. Then the electronic device heat generation per unit time can be decomposed into the first heat dissipation amount Q1 through the heat dissipation element and the second heat dissipation amount Q2 through the circuit board. The heat dissipation element is preferably an aluminum plate.

[0202] The heat dissipation amount distribution relationship is:

[0203] Q1 = (1 - k)Q transient (7)

[0204] Q2 = kQ transient (8)

[0205] , wherein Q1 is the first heat dissipation amount, and Q2 is the second heat dissipation amount.

[0206] And if it is a steady state stage, Q1 = (1 - k)Q, and Q2 = kQ.

[0207] This embodiment combines the cold start correction heat dissipation amount to determine the first heat dissipation amount through the heat dissipation element and the second heat dissipation amount through the circuit board.

[0208] Then, step S207 is performed to calculate the electronic device temperature at the location of the electronic device according to the second heat dissipation amount and the circuit board temperature based on the second thermal resistance between the temperature measuring point and the electronic device.

[0209] In one embodiment, the calculating the electronic device temperature at the location of the electronic device according to the second heat dissipation amount and the circuit board temperature based on the second thermal resistance between the temperature measuring point and the electronic device comprises: calculating the electronic device temperature as T e = T2 + Q2·R2, wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance.

[0210] Specifically, assuming that the temperature distribution from the center of the electronic device to the circuit board conforms to a circular ring distribution in a steady state, the radial unit time heat dissipation amount is:

[0211]

[0212] wherein Q is the radial unit time heat dissipation amount of the electronic device, i.e., the heat generation electric power of the electronic device. R is the radial distance of the chip, δ is the thickness of the circuit board, λ is the heat conduction coefficient, A is the heat exchange area, and λ PCB is the heat conduction coefficient of the circuit board. The second thermal resistance between the temperature measuring point and the electronic device can be obtained by integrating formula (4) from L1 to L2, i.e.,

[0213]

[0214] wherein R2 is the second thermal resistance, L2 is the sensor measurement distance from the temperature measuring point to the center of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, and λ PCB is the heat conduction coefficient of the circuit board.

[0215] Then, in the cold start phase, the electronic device temperature can be obtained from the device temperature relationship, i.e., formula (11):

[0216] T e = T2 + Q2·R2 (11)

[0217] wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance.

[0218] The embodiment determines the accurate electronic device temperature through the second thermal resistance.

[0219] Then, step S208 is executed, and based on the temperature of the electronic device, the first heat dissipation, and the first thermal resistance between the electronic device and the water circuit, the average heat exchange temperature in the heat dissipation element is calculated. The average heat exchange temperature is the average value of the heat exchange temperature between the heat dissipation element and the electronic device.

[0220] In one embodiment, calculating the average hot water temperature within the heat dissipation element based on the electronic device temperature, the first heat dissipation, and the first thermal resistance between the electronic device and the water path includes: calculating the average hot water temperature as: T w =T e -R1·Q1, where T w The average water exchange temperature, T e R1 is the temperature of the electronic device, Q1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0221] Specifically, calculate the first thermal resistance. For example... Figure 3 As shown, the first thermal resistance is the thermal conduction resistance R from electronic device 1 to heat dissipation element 3. 1,cond The convective thermal resistance R between heat dissipation element 3 and water is related to the heat exchange. 1,conv sum.

[0222] In some embodiments, calculating the first thermal resistance includes:

[0223] Based on the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer, and the area of ​​each layer, the thermal resistance of the electronic device to the heat dissipation element is calculated. The electronic device is connected to the heat dissipation element through one or more thermally conductive structures. The layer includes multiple structural layers within the electronic device, one or more of the thermally conductive structures, and the heat dissipation element.

[0224] Calculate the convective heat transfer thermal resistance between the heat dissipation element and the water;

[0225] The first thermal resistance between the electronic device and the water in the heat dissipation element is calculated as the sum of the thermal conduction resistance and the convective heat transfer resistance, i.e., R1 = R 1,cond +R 1,conv Where R1 is the first thermal resistance, R 1,cond R is the thermal resistance for thermal conduction. 1,conv The convective heat transfer thermal resistance is given.

[0226] Specifically, electronic devices generally consist of multiple structural layers. Taking a chip as an example, the structural layers of a chip typically include: a substrate layer, a solder layer, a substrate layer, a heat source layer, an active region layer, and so on. Each structural layer has its own thickness and area, and depending on the material of different layers, each structural layer has its own thermal conductivity.

[0227] Therefore, the thermal conduction thermal resistance from the electronic device to the heat dissipation element is calculated according to the structure thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer, and the area of each layer. In addition, the layers between the electronic device and the heat dissipation element also include a heat conduction structure and a heat dissipation element. The heat conduction structure includes various existing heat conduction gels and heat conduction elements. Each heat conduction gel or heat conduction element is a layer. At the same time, since the heat dissipation element is generally a flat plate, the heat dissipation element is taken as a whole layer. Through the calculation of the related parameters of each layer between the electronic device and the heat dissipation element, the thermal conduction thermal resistance between the electronic device and the heat dissipation element is obtained.

[0228] In some embodiments, the thermal conduction thermal resistance from the electronic device to the heat dissipation element is calculated according to the structure thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer, and the area of each layer, including:

[0229] The thermal conduction thermal resistance is calculated as: wherein R 1,cond is the thermal conduction thermal resistance, δ i is the structure thickness of the i-th layer, λ i is the thermal conductivity coefficient of the i-th layer, A i is the area of the i-th layer, and n is the number of layers.

[0230] Specifically, the thermal conduction thermal resistance is calculated by formula (12):

[0231]

[0232] wherein R 1,cond is the thermal conduction thermal resistance, δ i is the structure thickness of the i-th layer, λ i is the thermal conductivity coefficient of the i-th layer, A i is the area of the i-th layer, and n is the number of layers.

[0233] The embodiment provides a method for calculating the thermal conductivity coefficient.

[0234] Then, the convective heat transfer thermal resistance of the heat dissipation element and water heat exchange is calculated. The convective heat transfer thermal resistance can be calculated according to the water heat exchange area.

[0235] In some embodiments, the convective heat transfer thermal resistance of the heat dissipation element and water heat exchange is calculated as: wherein R 1,conv is the convective heat transfer thermal resistance, A w is the water heat exchange area, and α is the water heat exchange coefficient.

[0236] Finally, the water temperature in the heat dissipation element can be calculated according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount. The water temperature in the heat dissipation element is the average heat exchange water temperature according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount.

[0237] The embodiment calculates the average heat exchange water temperature in the heat dissipation element according to the thermal resistance.

[0238] The water temperature relationship is:

[0239] T w = T e - R1·Q1 (13)

[0240] wherein T w is the average heat exchange water temperature, T e is the electronic device temperature, R1 is the first thermal resistance, and Q1 is the first heat dissipation amount.

[0241] Then, step S209 is performed, and the water temperature at the end of the water path of the heat dissipation element is estimated according to the average heat exchange water temperature based on steady-state heat exchange.

[0242] Specifically, the average heat exchange water temperature output by the thermal resistance steady-state model or the thermal resistance cold start model is taken as the average heat exchange water temperature. Since the water path sensor is usually arranged at the upstream or downstream, the inlet and outlet water temperatures need to be calculated by the average water temperature. The first step of calculating the water temperature is to calculate the wall temperature in contact with water.

[0243] In some embodiments, the wall temperature of the heat dissipation element wall is calculated according to the first heat dissipation amount and the thermal conduction thermal resistance.

[0244] In some embodiments, the calculation of the wall temperature of the heat dissipation element wall according to the first heat dissipation amount and the thermal conduction thermal resistance comprises:

[0245] The wall temperature of the heat dissipation element in contact with water is calculated as: wall = T e - Q1·R 1,cond wherein T wall is the wall temperature, T e is the electronic device temperature, Q1 is the first heat dissipation amount, and R 1,cond is the thermal conduction thermal resistance.

[0246] The first step of calculating the water temperature is to calculate the wall temperature in contact with water:

[0247] T wall = T e - Q1·R 1,cond (14)

[0248] wherein T wallT is the wall temperature e Q1 is the first heat dissipation amount, R 1,cond is the thermal conduction thermal resistance.

[0249] Then, the water temperature at the water path end of the heat dissipation element is estimated according to the average heat exchange water temperature and the wall temperature.

[0250] In some embodiments, the water temperature at the water path end of the heat dissipation element is the water path inlet water temperature, and the estimation of the water temperature at the water path end of the heat dissipation element according to the average heat exchange water temperature and the wall temperature comprises:

[0251] The estimation of the water path inlet water temperature is: wherein T in is the water path inlet water temperature, a is the water heat exchange coefficient, is the water mass flow, Cp w is the water specific heat at constant pressure, A w is the water heat exchange area, T w is the average heat exchange water temperature, T wall is the wall temperature.

[0252] Specifically, under the condition of uniform wall temperature, the heat exchange in the control volume can be expressed as follows:

[0253]

[0254] wherein a is the water heat exchange coefficient, is the water mass flow, R is the heat exchange area per unit length, Cp w is the water specific heat at constant pressure, T0 is the water temperature at position 0, generally taking the inlet as position 0, T L is the water temperature at position L, dT water is the water temperature difference of length differential, dx is the length differential, and L is the water path length. From the inlet to the position with length x is simply referred to as position x, and then the integral from the inlet to position x is:

[0255]

[0256] wherein T x is the temperature at position x, T in is the water path inlet water temperature, i.e. the water temperature at position 0 T0.

[0257] Then the temperature at position x is:

[0258]

[0259] Then the average heat exchange water temperature can be calculated as:

[0260]

[0261] The water inlet temperature of the water path can be obtained from equation (18):

[0262]

[0263] where T in is the water inlet temperature of the water path, a is the water heat exchange coefficient, is the water mass flow rate, Cp w is the specific heat capacity of water at constant pressure, A w is the water heat exchange area, T w is the average heat exchange water temperature, T wall is the wall temperature.

[0264] After obtaining the water inlet temperature of the water path, the water outlet temperature of the water path can be calculated according to equation (17), and the water outlet temperature of the water path T out is actually the temperature T L at a position with a length of L from the inlet, and thus the water outlet temperature of the water path is:

[0265]

[0266] where T out is the water outlet temperature of the water path.

[0267] In some embodiments, a water flow rate model is built by a neural network model to obtain the water mass flow rate.

[0268] The neural network model is built according to experimental data to obtain physical model data, and then extended from the physical model data.

[0269] Specifically, the water mass flow rate of the heating element in different states is certain. The heating element is an electronic device as a heat source, and thus an existing water flow rate model building method can be used to build a water flow rate model, and the corresponding water mass flow rate is obtained when the state of the heating element is determined. As shown in FIG. 5, first, experimental data 501 is obtained, then modeling correction is performed, and a GT Power (engine working process simulation calculation software) model 502 is input, a mapping database 503 is obtained through DoE, an ANN flow static model 504 is obtained through feature screening, training and verification, and a flow dynamic model 505 is obtained through a time constant. Figure 5

[0270] As an example, the water flow rate model is built as follows:

[0271] 1. Key flow data in the experiment is obtained, and parameters such as water pump pressure rise, component pressure drop and along-the-way loss are corrected, a physical model is built, and correction is performed according to key experimental data.

[0272] ​2. According to the experimental data, a physical model is built to extend the experimental data, which can calculate the branch flow that is not measured in the experiment but is relevant to the simulation. Specifically, a physical model is built through the GT Power software. Then a database is mapped through the Design of Experiment (DOE). The mapped database can be regarded as a large number of mapping data corresponding to the input-output pairs, and a neural network model can be established.

[0273] 3. On the basis of the data obtained in step 2, the control quantities in the system are taken as modeling features, and the features are extended according to the physical meaning, as shown in Table 1. The extension basis can be the order relationship between the water pump speed and the lift, the temperature and the radiant heat exchange, and the instantaneous energy and the cumulative energy entering the system interior, etc.

[0274] Control quantity Extended feature Water pump speed Speed 2, speed 3, Temperature Water temperature 2, water temperature 3, water temperature 4 Valve opening Opening, opening 3 Engine speed, torque Engine speed * torque, ∫ engine speed * torque

[0275] On the basis of the extended features, feature screening is performed, and the screening method is based on the generalized neural network GRNN of the joint probability distribution.

[0276] The screening process is as follows:

[0277] 4.1 All the selected features are put into the selected set, and the selected set is an empty set at this time;

[0278] 4.2 The features in the selected set are used to approximate the output value through the GRNN, the features in the selected set are traversed, and the feature with the smallest Mean Squared Error (MSE) is selected into the selected set;

[0279] 4.3 An iterative process is performed thereafter, and the fitting target is changed to the remaining information after fitting the output value through the features in the selected set, and the feature with the smallest MSE is selected into the selected set;

[0280] 4.4 Iteration is performed in turn until the features in the selected set are traversed.

[0281] The GRNN is based on probability, and can better reflect the one-to-one correspondence between the control quantities as the model input and the state quantities as the model output.

[0282] 5. According to the feature order given by the screening result, the first four features are selected to make the GRNN fitting MSE reduce to 0, that is, the accuracy is ensured, and feature redundancy can be avoided.

[0283] 6. The data obtained in step 2 are randomly divided into a training set and a test set, a neural network model is established according to the selected features, the accuracy of the model is obtained through the K test, and the best flow model is selected according to the training accuracy and the test accuracy, that is, Figure 5 the flow static model.

[0284] 7. The steady-state heat exchange model of the heat exchange component in the building system, such as the steady-state heat exchange model of the present application, or various steady-state heat exchange models in the prior art, absorbs heat under the steady-state condition, which causes the temperature change

[0285]

[0286] The heat source is the heating element and the water flow heat exchange, so there are:

[0287] Q 吸 = a dA (T B -T w ) = a L c dx (T B -T w ) (22)

[0288] Where Q 吸 is the absorbed heat, C p is the specific heat of the cooling water at constant pressure, is the cooling water flow, T w is the water temperature, T B is the heating element temperature, L C is the characteristic length of the heat exchange component, which represents the heat exchange area corresponding to each unit length, a is the heat exchange coefficient, dA is the differential of the heat exchange area, and dx is the differential of the heat exchange length. By combining formula (21) and formula (22) and integrating the length from the inlet to the outlet of the heat exchange component, we obtain

[0289]

[0290] Where T w,out is the outlet water temperature, T w,in is the inlet water temperature, and A is the heat exchange area.

[0291] Because the thermal mass of the heat exchange component is relatively large compared to the heat exchange amount in a unit step, it can be considered that the temperature of the heat exchange component in a unit step does not change.

[0292] 8. The heat exchange coefficient is fitted according to the mass flow, which ensures that the heat exchange coefficient in the water path is within a reasonable range, and the trend is correct.

[0293] 9. Calculate the heat exchange heat Q 吸 in a unit time step, calculate the temperature change of the heat exchange component in the step through formula (21), and update the temperature of the heat exchange element when calculating the next step.

[0294] 10. Identify the characteristic length of the heat exchange element through experimental data, compensate for the lack of flow accuracy, calibrate the flow model, and obtain Figure 5The flow dynamic model is a model obtained by adding filtering to the static model of the neural network. According to the flow dynamic model, the water mass flow of the cooling water in different states of the heat generating element, i.e., the electronic device, can be determined.

[0295] After the water mass flow is determined, the water heat exchange coefficient can be fitted according to the water mass flow or the Reynolds number can be calculated according to the dimensionless method, and then the water heat exchange coefficient can be determined according to the relationship between the Prandtl number and the Nusselt number.

[0296] The water heat exchange coefficient can be fitted by a second-order polynomial, and the formula is as follows:

[0297]

[0298] wherein, α is the water heat exchange coefficient, is the water mass flow, C1, C2, and C3 are fitting coefficients, which need to be fitted according to experimental values.

[0299] The dimensionless method involves two flow states, namely, laminar flow state and turbulent flow state, and the two flow states are distinguished according to the Reynolds number. The formula for calculating the Reynolds number is as follows:

[0300]

[0301] The formula for calculating the Nusselt number is as follows:

[0302]

[0303] In the formula, V is the water flow rate, L is the heat exchange length, v is the dynamic viscosity of water, and λ is the thermal conductivity of water. Then, the water heat exchange coefficient can be obtained as follows:

[0304]

[0305] In the formula, Pr is the Prandtl number of water, and f(Re, Pr) is an empirical function for calculating the Nusselt number. Due to the different internal structures of the water path, the Nu calculation in the laminar flow, transition state, and turbulent flow needs to be identified according to the experimental temperature data.

[0306] In some embodiments, the method further comprises:

[0307] obtaining a plurality of experimental data, wherein the experimental data includes a measured value of the inlet temperature of the water path;

[0308] estimating the initial value of the Nusselt number according to the empirical function, obtaining the initial value of the water heat exchange coefficient according to the initial value of the Nusselt number, and estimating the inlet water temperature of the water path of the heat dissipating element according to the average heat exchange water temperature and the wall temperature, specifically, calculating the inlet water temperature of the water path according to formula (14);

[0309] Adjust the Nusselt number, so as to adjust the water heat exchange coefficient, until the estimated water inlet temperature of the water path is consistent with the experimental water inlet temperature of the water path.

[0310] As Figure 6 The calculation effect diagram of one example of the present application is shown, including the main loop test water temperature curve 61, the water temperature curve 62 calculated in the pure steady state, and the water temperature curve 63 predicted by the method of the present embodiment. The abscissa is time, unit: s, and the ordinate is temperature, unit: ℃. From Figure 6 It can be seen that at the beginning of the trip, the electronic device, in this example, the chip, uploads the temperature in the initialization process as the last trip temperature, so there is a certain fluctuation at the beginning. After the fluctuation period, it can be seen from the effect that the model after dynamic correction can better predict the water temperature change in the cold start process of the chip.

[0311] The present embodiment dynamically corrects the water temperature prediction of the heat dissipation element of the electronic device in the cold start stage, solves the delay problem of the existing prediction method. The present embodiment simplifies the heat transfer model of the electronic device, inversely calculates the water inlet temperature through the change of the device temperature, improves the accuracy through correction, reduces the demand for sensors, and thus reduces the cost.

[0312] Based on the same inventive concept, as Figure 7 The schematic diagram of a water temperature estimation device of one embodiment of the present application is shown, including:

[0313] The acquisition module 701 is configured to acquire the heat generation electric power of the electronic device and the circuit board temperature; the electronic device is fixed on the circuit board, and the electronic device is connected with the heat dissipation element in contact with the water path;

[0314] The cold start correction coefficient calculation module 702 is configured to calculate a cold start heat quantity coefficient according to the difference between the first heat dissipation temperature of the electronic device transferred to the heat dissipation element in the steady state stage and the second heat dissipation temperature of the electronic device transferred to the heat dissipation element at the current moment, the cold start heat quantity coefficient representing the heat conduction capacity of the electronic device in the cold start stage;

[0315] The cold start correction module 703 is configured to correct the heat dissipation quantity of the electronic device under the heat generation electric power according to the cold start heat quantity coefficient to obtain a cold start correction heat dissipation quantity when the electronic device is in the cold start stage, the cold start correction heat dissipation quantity being the heat dissipation quantity of the electronic device under the heat generation electric power in the cold start stage;

[0316] The water path end water temperature calculation module 704 is configured to estimate the water path end water temperature of the heat dissipation element according to the cold start correction heat dissipation quantity and the circuit board temperature.

[0317] The application calculates the first heat dissipation temperature and the second heat dissipation temperature according to the estimated water temperature estimated in the steady state stage and the estimated electronic device temperature estimated in the steady state stage respectively, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transferred to the heat dissipation element by the electronic device in the steady state stage and the second heat dissipation temperature transferred to the heat dissipation element by the electronic device at the current moment, corrects the heat dissipation amount of the electronic device under the heat generating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation amount, and estimates the waterway end water temperature of the heat dissipation element according to the cold start corrected heat dissipation amount. Since the cold start heat coefficient represents the heat conduction capacity of the electronic device in the cold start stage, the heat dissipation amount is corrected by the cold start heat coefficient, so that the corrected heat dissipation amount conforms to the temperature distribution in the cold start stage, thereby the accurate waterway end water temperature of the heat dissipation element of the electronic device in the cold start stage can be estimated through the temperature of the temperature measuring point on the circuit board.

[0318] In one of the embodiments, the device further comprises a heat dissipation temperature calculation module for:

[0319] The first heat dissipation temperature and the second heat dissipation temperature are calculated according to the circuit board temperature, the estimated water temperature estimated in the steady state stage and the estimated electronic device temperature estimated in the steady state stage, the estimated water temperature is an estimated value of the water temperature in the heat dissipation element connected with the electronic device calculated according to the circuit board temperature in the steady state stage, and the estimated electronic device temperature is an estimated value of the electronic device temperature calculated according to the circuit board temperature in the steady state stage.

[0320] In one of the embodiments, the calculation of the first heat dissipation temperature comprises:

[0321] The first heat conduction error function operator at the end of the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway and the cold start time of the electronic device;

[0322] The first heat dissipation temperature is calculated according to the estimated water temperature, the estimated electronic device temperature and the first heat conduction error function operator.

[0323] In one of the embodiments:

[0324] The first heat conduction error function operator at the end of the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway and the cold start time of the electronic device, comprising: the first heat conduction error function operator is calculated as wherein, is the first heat conduction error function operator, L x is the distance between the electronic device and the waterway, t ea is a temperature diffusion coefficient, and t is a time interval from the cold start to the current time.

[0325] The first heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the first heat conduction error function operator. wherein, T x,stable is the first heat dissipation temperature, T e ' is the electronic device estimated temperature, T w ' is the estimated water temperature, is a heat conduction error function operator, and e is a natural constant.

[0326] In one of the embodiments, the second heat dissipation temperature is calculated according to the difference between the first heat dissipation temperature and the second heat dissipation temperature.

[0327] The second heat conduction error function operator at the current time during the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway.

[0328] The second heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the second heat conduction error function operator.

[0329] In one of the embodiments, the second heat dissipation temperature is calculated according to the difference between the first heat dissipation temperature and the second heat dissipation temperature.

[0330] The second heat conduction error function operator at the current time during the cold start of the electronic device is calculated according to the distance between the electronic device and the waterway. wherein, is the second heat conduction error function operator, L x is the distance between the electronic device and the waterway, t is the time interval from the cold start to the current time, and a is a temperature diffusion coefficient.

[0331] The second heat dissipation temperature is calculated according to the estimated water temperature, the electronic device estimated temperature and the second heat conduction error function operator. wherein, T x,t is the second heat dissipation temperature, T e ' is the electronic device estimated temperature, T w ' is the estimated water temperature, is a heat conduction error function operator, and e is a natural constant.

[0332] In one of the embodiments, the second heat dissipation temperature is calculated according to the difference between the first heat dissipation temperature and the second heat dissipation temperature.

[0333] The cold start heat quantity coefficient is calculated as follows: wherein k transient is the cold start heat quantity coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w is the estimated water temperature estimated at the steady state stage.

[0334] In one of the embodiments, the device further comprises a judging module for:

[0335] When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state judging value, it is judged that the current stage of the electronic device is a cold start stage, otherwise it is judged that the current stage of the electronic device is a steady state stage.

[0336] When the electronic device is powered off, the current stage of the electronic device is cleared.

[0337] In one of the embodiments, the cold start heat quantity coefficient is used to correct the heat dissipation quantity of the electronic device under the heat generating electric power to obtain a cold start corrected heat dissipation quantity, comprising:

[0338] The cold start corrected heat dissipation quantity is calculated as follows: Q transient =k transient Q, wherein Q transient is the cold start corrected heat dissipation quantity, Q is the heat generating quantity of the electronic device per unit time calculated according to the heat generating electric power, k transient is the cold start heat quantity coefficient.

[0339] In one of the embodiments:

[0340] The cold start heat quantity coefficient is used to correct the heat dissipation quantity of the electronic device under the heat generating electric power to obtain a cold start corrected heat dissipation quantity, comprising:

[0341] The first heat dissipation quantity of the electronic device to the heat dissipation element and the second heat dissipation quantity of the electronic device to the circuit board are calculated according to the cold start corrected heat dissipation quantity;

[0342] The water temperature at the end of the water channel of the heat dissipation element is estimated according to the cold start corrected heat dissipation quantity and the circuit board temperature, comprising:

[0343] The electronic device temperature at the location of the electronic device is calculated according to the second heat dissipation quantity and the circuit board temperature, based on the second thermal resistance between the temperature measuring point and the electronic device;

[0344] calculating an average heat exchange water temperature in the heat dissipation element according to the electronic device temperature and the first heat dissipation amount based on a first thermal resistance between the electronic device and the water path, the average heat exchange water temperature being an average of heat exchange temperatures of the heat dissipation element and the electronic device;

[0345] estimating a water path end water temperature of the heat dissipation element according to the average heat exchange water temperature.

[0346] In one of the embodiments:

[0347] The first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board are calculated according to the cold start correction heat dissipation amount, including: calculating the first heat dissipation amount as Q1=(1-k)Q transient , and the second heat dissipation amount as Q2=kQ transient , wherein Q1 is the first heat dissipation amount, Q2 is the second heat dissipation amount, Q transient is the cold start correction heat dissipation amount;

[0348] The electronic device temperature at the location of the electronic device is calculated according to the second heat dissipation amount and the circuit board temperature based on a second thermal resistance between the temperature measuring point and the electronic device, including: calculating the electronic device temperature as T e =T2+Q2·R2, wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance;

[0349] The average heat exchange water temperature in the heat dissipation element is calculated according to the electronic device temperature and the first heat dissipation amount based on a first thermal resistance between the electronic device and the water path, including: calculating the average heat exchange water temperature as T w =T e -R1·Q1, wherein T w is the average heat exchange water temperature, T e is the electronic device temperature, R1 is the first thermal resistance, and Q1 is the first heat dissipation amount.

[0350] In one of the embodiments, the water path end water temperature of the heat dissipation element includes a water path inlet water temperature, and the water path end water temperature of the heat dissipation element is estimated according to the average heat exchange water temperature, including:

[0351] The thermal conduction thermal resistance between the electronic device and the heat dissipation element is calculated according to the structure thickness of each layer, the thermal conductivity of each layer, and the area of each layer, as: wherein R 1,cond is the thermal conduction thermal resistance, δ iis the structure thickness of the i-th layer, λ i is the heat transfer coefficient of the i-th layer, A i is the area of the i-th layer, n is the number of layers;

[0352] The wall temperature of the heat dissipation element in contact with water is calculated as: T wall = T e - Q1·R 1,cond , wherein T wall is the wall temperature, T e is the electronic device temperature, Q1 is the first heat dissipation amount, R 1,cond is the heat transfer thermal resistance;

[0353] The water inlet temperature of the water channel is estimated as: , wherein T in is the water inlet temperature of the water channel, α is the water heat transfer coefficient, is the water mass flow, Cp w is the water specific heat at constant pressure, A w is the water heat transfer area, T w is the average heat transfer water temperature, T wall is the wall temperature.

[0354] In one of the embodiments, the water channel end water temperature of the heat dissipation element further includes a water channel outlet water temperature, and the water channel end water temperature of the heat dissipation element is estimated according to the average heat transfer water temperature, specifically comprising:

[0355] The water channel outlet water temperature is estimated as: , wherein T out is the water channel outlet water temperature, R is the heat transfer area per unit length, and L is the water channel length.

[0356] As to the device in the above-mentioned embodiments, the specific manner in which each module performs the operation has been described in detail in the embodiments related to the method, and will not be described in detail here.

[0357] As Figure 8 shown is a hardware structure schematic diagram of an electronic device, comprising:

[0358] at least one processor 801; and,

[0359] a memory 802 in communication connection with the at least one processor 801; wherein,

[0360] the memory 802 stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the water temperature estimation method as described above.

[0361] Figure 8Take the 801 processor as an example.

[0362] The electronic device may also include an input device 803 and a display device 804.

[0363] The processor 801, memory 802, input device 803 and display device 804 can be connected by a bus or other means. The figure shows an example of connection by bus.

[0364] The memory 802, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules corresponding to the water temperature estimation method in the embodiments of this application, for example, Figure 1 , Figure 2 The method flow is shown. The processor 801 executes various functional applications and data processing by running non-volatile software programs, instructions, and modules stored in the memory 802, thereby realizing the water temperature estimation method in the above embodiment.

[0365] Memory 802 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application program required for at least one function; the data storage area may store data created based on the use of the water temperature estimation method, etc. Furthermore, memory 802 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some embodiments, memory 802 may optionally include memory remotely located relative to processor 801, and these remote memories may be connected via a network to the apparatus performing the water temperature estimation method. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0366] The input device 803 can receive user clicks and generate signal inputs related to user settings and function control for water temperature estimation methods. The display device 804 may include a display screen or other display equipment.

[0367] The one or more modules are stored in the memory 802, and when run by the one or more processors 801, they execute the water temperature estimation method in any of the above method embodiments.

[0368] The present application calculates the first heat dissipation temperature and the second heat dissipation temperature according to the estimated water temperature estimated in the steady state stage and the estimated temperature of the electronic device estimated in the steady state stage respectively, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transferred to the heat dissipation element by the electronic device in the steady state stage and the second heat dissipation temperature transferred to the heat dissipation element by the electronic device at the current moment, then corrects the heat dissipation amount of the electronic device under the heat generating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation amount, and estimates the waterway end water temperature of the heat dissipation element according to the cold start corrected heat dissipation amount. Since the cold start heat coefficient represents the heat conduction capacity of the electronic device in the cold start stage, the present application corrects the heat dissipation amount by the cold start heat coefficient, so that the corrected heat dissipation amount conforms to the temperature distribution in the cold start stage, thereby being able to estimate the accurate waterway end water temperature of the heat dissipation element of the electronic device in the cold start stage through the temperature of the temperature measuring point on the circuit board.

[0369] An embodiment of the present application provides a storage medium, which stores computer instructions, when a computer executes the computer instructions, all steps of the water temperature estimation method as described above are executed.

[0370] In the context of the present disclosure, the storage medium can be a tangible medium, which can contain or store programs for use by or in connection with an instruction execution system, apparatus or device. The storage medium can be a machine-readable signal medium or a machine-readable storage medium. Optionally, the storage medium can be a non-transitory computer-readable storage medium, for example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a compact disc read-only memory (CD-ROM), a magnetic tape, a floppy disk and an optical data storage device, etc.

[0371] An embodiment of the present application provides a vehicle, which comprises the water temperature estimation apparatus as described above or the electronic device as described above. It can be understood that the vehicle can also comprise a processor, a memory and a computer program. The computer program is stored in the memory and is configured to be executed by the processor to implement the water temperature estimation method provided by the embodiments of the present application. The processor and the memory have been described in the foregoing embodiments and will not be described here. Figure 7 The parts illustrated in the embodiments are not described here.

[0372] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A method for estimating water temperature, characterized in that, include: The heating power of the electronic device and the temperature of the circuit board are obtained; the electronic device is fixed on the circuit board and is connected to a heat dissipation element that is in contact with the water channel; The cold start thermal coefficient is calculated based on the difference between the first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in a steady state and the second heat dissipation temperature transferred to the heat dissipation element at the current moment. The cold start thermal coefficient characterizes the ability of the electronic device to conduct heat during the cold start phase. When the electronic device is in the cold start stage, the heat dissipation of the electronic device under the heating power is corrected according to the cold start heat coefficient to obtain the cold start corrected heat dissipation, which is the heat dissipation of the electronic device under the heating power during the cold start stage. The water temperature at the water circuit end of the heat dissipation element is estimated based on the cold start correction heat dissipation and the circuit board temperature.

2. The water temperature estimation method according to claim 1, characterized in that, The method further includes: Based on the circuit board temperature, the estimated water temperature estimated under steady-state conditions, and the estimated electronic device temperature estimated under steady-state conditions, the first heat dissipation temperature and the second heat dissipation temperature are calculated. The estimated water temperature is the estimated water temperature in the heat dissipation element connected to the electronic device, calculated based on the circuit board temperature under steady-state conditions. The estimated electronic device temperature is the estimated electronic device temperature calculated based on the circuit board temperature under steady-state conditions.

3. The water temperature estimation method according to claim 2, characterized in that, The calculation of the first heat dissipation temperature includes: Based on the distance between the electronic device and the waterway and the cold start time of the electronic device, calculate the first heat conduction error function operator at the end of the cold start of the electronic device; The first heat dissipation temperature is calculated based on the estimated water temperature, the estimated temperature of the electronic device, and the first heat conduction error function operator.

4. The water temperature estimation method according to claim 3, characterized in that: The step of calculating the first thermal conduction error function operator at the end of the cold start of the electronic device based on the distance between the electronic device and the waterway and the cold start time of the electronic device includes: calculating the first thermal conduction error function operator as follows: in, Let L be the first heat conduction error function operator. x t represents the distance between the electronic device and the waterway. e Let be the cold start time of the electronic device, and 'a' be the temperature diffusion coefficient. The step of calculating the first heat dissipation temperature based on the estimated water temperature, the estimated temperature of the electronic device, and the first heat conduction error function operator includes: calculating the first heat dissipation temperature as: Among them, T x,stable T is the first heat dissipation temperature. e Estimate the temperature of the electronic device, T w 'For the estimated water temperature, Let be the heat conduction error function operator, and e be the natural constant.

5. The water temperature estimation method according to claim 2, characterized in that, The calculation of the second heat dissipation temperature includes: Based on the distance between the electronic device and the waterway, calculate the second heat conduction error function operator at the current moment during the cold start process of the electronic device; The second heat dissipation temperature is calculated based on the estimated water temperature, the estimated temperature of the electronic device, and the second heat conduction error function operator.

6. The water temperature estimation method according to claim 5, characterized in that: The step of calculating the second heat conduction error function operator at the current moment during the cold start process of the electronic device based on the distance between the electronic device and the waterway includes: calculating the second heat conduction error function operator as follows: in, L is the second heat conduction error function operator. x The distance between the electronic device and the waterway is t, the time elapsed from the start of the cold start to the present time is t, and the temperature diffusion coefficient is a. The step of calculating the second heat dissipation temperature based on the estimated water temperature, the estimated temperature of the electronic device, and the second heat conduction error function operator includes: calculating the second heat dissipation temperature. Among them, T x,t T is the second heat dissipation temperature. e Estimate the temperature of the electronic device, T w 'For the estimated water temperature, Let be the heat conduction error function operator, and e be the natural constant.

7. The water temperature estimation method according to claim 1, characterized in that, The calculation of the cold start thermal coefficient based on the difference between the first heat dissipation temperature transferred from the electronic device to the heat dissipation element during the steady-state phase and the second heat dissipation temperature transferred from the electronic device to the heat dissipation element at the current moment includes: The cold start heat coefficient is calculated as follows: Where, k transient T is the cold start heat coefficient. x,stable T is the first heat dissipation temperature. x,t T is the second heat dissipation temperature. w 'This is the estimated water temperature under steady-state conditions.' 8. The water temperature estimation method according to claim 1, characterized in that, The method further includes: When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to the preset state judgment value, then the current stage of the electronic device is judged to be the cold start stage; otherwise, the current stage of the electronic device is judged to be the steady state stage. Clear the current stage of the electronic device when it is powered off.

9. The water temperature estimation method according to claim 1, characterized in that, The step of correcting the heat dissipation of the electronic device under the heating power based on the cold start thermal coefficient to obtain the cold start corrected heat dissipation includes: The cold start corrected heat dissipation is calculated as: Q transient =k transient Q, where Q transient The cold start correction heat dissipation is given by Q, where Q is the heat generated per unit time of the electronic device calculated based on the heat dissipation power, and k is the heat dissipation. transient The cold start heat coefficient is denoted as .

10. The water temperature estimation method according to claim 1, characterized in that: The step of correcting the heat dissipation of the electronic device under the heating power based on the cold start thermal coefficient to obtain the cold start corrected heat dissipation includes: Calculate the first heat dissipation amount by which the electronic device dissipates heat to the heat dissipation element, and the second heat dissipation amount by which the electronic device dissipates heat to the circuit board, based on the cold start corrected heat dissipation amount; The step of estimating the water temperature at the water circuit end of the heat dissipation element based on the cold start corrected heat dissipation and the circuit board temperature includes: Based on the second heat dissipation and the circuit board temperature, and using the second thermal resistance between the temperature measurement point and the electronic device, the temperature of the electronic device at the location of the electronic device is calculated. Based on the temperature of the electronic device and the first heat dissipation, and based on the first thermal resistance between the electronic device and the water path, the average heat exchange temperature in the heat dissipation element is calculated. The average heat exchange temperature is the average value of the heat exchange temperature between the heat dissipation element and the electronic device. The water temperature at the end of the heat dissipation element is estimated based on the average heat exchange water temperature.

11. The water temperature estimation method according to claim 10, characterized in that: The step of calculating the first heat dissipation amount by the electronic device to the heat dissipation element and the second heat dissipation amount by the electronic device to the circuit board based on the cold start corrected heat dissipation amount includes: calculating the first heat dissipation amount as: Q1=(1-k)Q transient The second heat dissipation is: Q2 = kQ transient Where Q1 is the first heat dissipation, Q2 is the second heat dissipation, and Q... transient Correct the heat dissipation for the cold start; The step of calculating the electronic device temperature at the location of the electronic device based on the second heat dissipation and the circuit board temperature, and the second thermal resistance between the temperature measurement point and the electronic device, includes: calculating the electronic device temperature as: T e =T² + Q²·R², where T e T1 is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance. The step of calculating the average hot water temperature within the heat dissipation element based on the electronic device temperature, the first heat dissipation, and the first thermal resistance between the electronic device and the water path includes: calculating the average hot water temperature as: T w =T e -R1·Q1, where T w The average water exchange temperature, T e R1 is the temperature of the electronic device, Q1 is the first thermal resistance, and Q1 is the first heat dissipation.

12. The water temperature estimation method according to claim 10, characterized in that, The water temperature at the water outlet of the heat dissipation element includes the water inlet temperature. Estimating the water temperature at the water outlet of the heat dissipation element based on the average heat exchange water temperature includes: Based on the structural thickness, thermal conductivity coefficient, and area of ​​each layer between the electronic device and the heat dissipation element, the thermal resistance of the electronic device to the heat dissipation element is calculated as follows: Among them, R 1,cond For the thermal resistance of the heat conduction, δ i Let λ be the structural thickness of the i-th layer. i Let A be the thermal conductivity coefficient of the i-th layer. i Let n be the area of ​​the i-th layer, and n be the number of layers. The wall temperature of the heat dissipation element in contact with water is calculated as: T wall =T e -Q1·R 1,cond T wall T is the wall temperature. e The temperature of the electronic device is given by R, Q1 is the first heat dissipation, and R is the first heat dissipation. 1,cond The thermal resistance is the thermal conductivity. The estimated water inlet temperature is: Among them, T in The inlet water temperature is α, and the heat transfer coefficient of the water is α. Cp is the water mass flow rate. w For the specific heat of water at constant pressure, A w For the water heat exchange area, T w The average water exchange temperature, T wall The wall temperature is [value].

13. The water temperature estimation method according to claim 12, characterized in that, The water temperature at the water outlet of the heat dissipation element also includes the water temperature at the water outlet. Estimating the water temperature at the water outlet of the heat dissipation element based on the average hot water exchange temperature specifically includes: The estimated water outlet temperature is: Among them, T out R is the water outlet temperature, R is the heat exchange area per unit length, and L is the length of the water channel.

14. A water temperature estimation device, characterized in that, include: An acquisition module is used to acquire the heating power of electronic devices and the temperature of the circuit board; the electronic devices are fixed on the circuit board and are connected to heat dissipation elements that are in contact with the water channel; The cold start correction coefficient calculation module is used to calculate the cold start heat coefficient based on the difference between the first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in a steady state and the second heat dissipation temperature transferred to the heat dissipation element at the current moment. The cold start heat coefficient characterizes the ability of the electronic device to conduct heat during the cold start phase. A cold start correction module is used to correct the heat dissipation of the electronic device under the heating power according to the cold start thermal coefficient when the electronic device is in the cold start stage to obtain the cold start corrected heat dissipation, wherein the cold start corrected heat dissipation is the heat dissipation of the electronic device under the heating power when the electronic device is in the cold start stage. The water temperature calculation module at the end of the water circuit is used to estimate the water temperature at the end of the water circuit of the heat dissipation element based on the cold start correction heat dissipation and the circuit board temperature.

15. An electronic device, characterized in that, include: At least one processor; as well as, A memory communicatively connected to at least one of the processors; wherein, The memory stores instructions that can be executed by at least one of the processors to enable at least one of the processors to perform the water temperature estimation method as described in any one of claims 1 to 13.

16. A storage medium, characterized in that, The storage medium stores computer instructions that, when executed by the computer, are used to perform all the steps of the water temperature estimation method as described in any one of claims 1 to 13.

17. A vehicle, characterized in that, This includes the water temperature estimation device as described in claim 14, or the electronic device as described in claim 15.

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