Cathode copper surface particle detection method and detection system

Abstract

The invention relates to a cathode copper surface particle detection method and detection system. The detection method comprises the following steps: respectively acquiring first point cloud data of cathode copper surface particles, a first reference plane and second point cloud data corresponding to the first side, a second reference plane and third point cloud data corresponding to the second side and a third reference plane corresponding to the third side from the first side, the second side and the third side of cathode copper; obtaining a first three-dimensional data model according to the first point cloud data and the first reference plane; acquiring a second three-dimensional data model according to the second point cloud data and the second reference plane; acquiring a third three-dimensional data model according to the third point cloud data and a third reference plane; performing coordinate alignment and data fusion on the first three-dimensional model, the second three-dimensional model and the third three-dimensional model to obtain a three-dimensional data model of the cathode copper surface particles; and comparing the three-dimensional data model with a preset threshold value to obtain a detection result. The method can avoid shielding, and is higher in adaptability.

Description

Technical Field

[0001] The invention relates to the technical field of electrolytic copper detection equipment, and in particular to a cathode copper surface particle detection method and a detection system. Background Art

[0002] The particles on the surface of cathode copper will affect the qualified rate of electrolytic copper. Therefore, it is necessary to detect the particles on the surface of cathode copper, such as the number of particles, particle size, particle shape, particle position, etc. At present, there are three commonly used detection methods: 1. Relying on manual judgment in the operating room, due to distance and position reasons, there are problems such as only one side can be observed and human omissions; 2. Offline manual inspection, because it has been packed and compacted, there are problems such as obstructed vision and inability to fully inspect, and manual unpacking and re-stacking after inspection; 3. From a certain angle in front of both sides of the cathode copper, use a line scan camera to collect surface images. Due to the compact layout and occlusion of the unit, there is no suitable position to arrange the camera, the framing is incomplete, and it is difficult to transform on the existing unit. The above problems need to be solved urgently. Summary of the invention

[0003] The invention discloses a cathode copper surface particle detection method and a detection system, aiming to solve the technical problems existing in the prior art.

[0004] The present invention adopts the following technical solutions:

[0005] In a first aspect, the present invention provides a method for detecting cathode copper surface particles, the method being used for detecting cathode copper surface particles transported horizontally; comprising the following steps:

[0006] Acquire first point cloud data of particles on the cathode copper surface and a first reference plane corresponding to the first side from the first side of the cathode copper;

[0007] Acquire a first three-dimensional data model of the cathode copper surface particles according to the first point cloud data and the first reference plane;

[0008] Acquire second point cloud data of particles on the cathode copper surface and a second reference plane corresponding to the second side from the second side of the cathode copper;

[0009] Acquire a second three-dimensional data model of the cathode copper surface particles according to the second point cloud data and the second reference plane;

[0010] Acquire third point cloud data of particles on the cathode copper surface and a third reference plane corresponding to the third side from a third side of the cathode copper;

[0011] Acquire a third three-dimensional data model of the cathode copper surface particles according to the third point cloud data and the third reference plane;

[0012] Aligning the coordinates of the first three-dimensional model, the second three-dimensional model and the third three-dimensional model and fusing the data to obtain a three-dimensional data model of the cathode copper surface particles;

[0013] The three-dimensional data model is compared with a preset threshold to obtain a detection result.

[0014] In a cathode copper surface particle detection method of the present invention, the first side is located on one side of the cathode copper transmission line, the second side is located on the other side of the cathode copper transmission line, the third side is located in front of the cathode copper transmission line, and the first side, the second side and the third side are located in the same plane as the cathode copper.

[0015] In a cathode copper surface particle detection method of the present invention, the first point cloud data includes first direction point cloud data perpendicular to the cathode copper conveying line, second direction point cloud data at an angle to the first direction and toward the discharge side of the cathode copper conveying line, and third direction point cloud data at an angle to the first direction and toward the feed side of the cathode copper conveying line.

[0016] In a cathode copper surface particle detection method of the present invention, the second point cloud data includes fourth direction point cloud data perpendicular to the cathode copper conveying line, fifth direction point cloud data at an angle to the fourth direction and toward the discharge side of the cathode copper conveying line, and sixth direction point cloud data at an angle to the fourth direction and toward the feed side of the cathode copper conveying line.

[0017] In a cathode copper surface particle detection method of the present invention, the third point cloud data includes seventh direction point cloud data parallel to the cathode copper transmission line, eighth direction point cloud data forming an angle with the seventh direction and toward one side of the cathode copper transmission line, and ninth direction point cloud data forming an angle with the seventh direction and toward the other side of the cathode copper transmission line.

[0018] In a cathode copper surface particle detection method of the present invention, the step of obtaining a first reference plane corresponding to the first side includes:

[0019] Selecting a first reference area on the first side of the cathode copper;

[0020] Acquire point cloud data within the first reference area;

[0021] Processing the point cloud data in the first reference area by the least square method to obtain a first reference plane equation;

[0022] The first reference plane is obtained according to the first reference plane equation.

[0023] In a cathode copper surface particle detection method of the present invention, the step of obtaining a second reference plane corresponding to the second side includes:

[0024] Selecting a second reference area on the second side of the cathode copper;

[0025] Acquire point cloud data within the second reference area;

[0026] Processing the point cloud data in the second reference area by the least square method to obtain a second reference plane equation;

[0027] The second reference plane is obtained according to the second reference plane equation.

[0028] In a cathode copper surface particle detection method of the present invention, the step of obtaining a third reference plane corresponding to the third side includes:

[0029] Selecting a third reference area on the third side surface of the cathode copper;

[0030] Acquire point cloud data within the third reference area;

[0031] Processing the point cloud data in the third reference area by the least square method to obtain a third reference plane equation;

[0032] The third reference plane is obtained according to the third reference plane equation.

[0033] In a cathode copper surface particle detection method of the present invention, in the data fusion step, the aligned first three-dimensional model, the second three-dimensional model and the third three-dimensional model are fused using point cloud registration technology.

[0034] In a cathode copper surface particle detection method of the present invention, it also includes the step of re-detecting the cathode copper with an unqualified detection result;

[0035] The re-detection step comprises:

[0036] The unqualified cathode copper is manually sampled.

[0037] If the sampling result is qualified, the image in the corresponding database is retrieved for comparison and the cause of the error is analyzed.

[0038] In a second aspect, the present invention also provides a cathode copper surface particle detection system, which includes a first laser camera, a second laser camera, a third laser camera and a processor;

[0039] The first laser camera is used to obtain first point cloud data of particles on the surface of the cathode copper from the first side of the cathode copper, and to generate point cloud data of a first reference plane;

[0040] The second laser camera is used to obtain second point cloud data of particles on the surface of the cathode copper from the second side of the cathode copper, and to generate point cloud data of a second reference plane;

[0041] The third laser camera is used to obtain third point cloud data of particles on the surface of the cathode copper from a third side of the cathode copper, and to generate point cloud data of a third reference plane;

[0042] The processor is electrically connected to the first laser camera, the second laser camera and the third laser camera, respectively, and executes any of the above-mentioned detection methods when performing detection.

[0043] The technical solution adopted by the present invention can achieve the following beneficial effects:

[0044] The present invention mainly provides a cathode copper surface particle detection method, which is based on respectively obtaining point cloud data of the cathode copper surface particles from a first side, a second side and a third side, and then fusing a first three-dimensional data model, a second three-dimensional data model and a third three-dimensional data model to obtain three-dimensional data of the cathode copper surface particles. The method of obtaining data from multiple angles and fusing the data to obtain a final three-dimensional model can avoid occlusion areas, so that the obtained three-dimensional model is more comprehensive and more adaptable; and compared with the manual inspection method, the method is more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments, which constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions explain the present invention and do not constitute improper limitations on the present invention. In the drawings:

[0046] Figure 1 It is a structural schematic diagram of a cathode copper surface particle detection system of the present invention.

[0047] Description of reference numerals:

[0048] 1. First laser camera; 2. Second laser camera; 3. Third laser camera; 4. Processor. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. In the description of the present invention, it should be noted that the term "or" is usually used in the sense of including "and / or", unless the content clearly indicates otherwise.

[0050] Unless expressly indicated to the contrary, the numerical parameters in this specification and the appended claims may be approximate values ​​and can be changed according to the desired properties obtained by the content of the present invention. Specifically, all numbers used in the specification and claims to express the content of the composition, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. In general, the meaning of the expression is to include a change of ±10% in some embodiments, a change of ±5% in some embodiments, a change of ±1% in some embodiments, and a change of ±0.5% in some embodiments by a specific number.

[0051] Furthermore, the word "comprising" does not exclude the presence of materials or steps not listed in the claims. Ordinal numbers such as "first", "second", "third" and Arabic numerals, letters, etc. used in the specification and claims to modify corresponding elements or steps do not themselves mean the order of the manufacturing method. The use of these ordinals is only used to make the steps clearly distinguishable.

[0052] In addition, unless the steps are specifically described or must occur in sequence, the order of the above steps is not limited to the above list, and can be changed or rearranged according to the required design. And the above embodiments can be mixed and matched with each other or with other embodiments based on design and reliability considerations, that is, the technical features in different embodiments can be freely combined to form more embodiments.

[0053] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] In order to solve the problems existing in the prior art, the embodiments of the present application provide a cathode copper surface particle detection method and detection system.

[0055] Example 1

[0056] This embodiment provides a method for detecting cathode copper surface particles, which is used to detect cathode copper surface particles transported horizontally; the method comprises the following steps:

[0057] The first point cloud data of the cathode copper surface particles and the first reference plane corresponding to the first side are obtained from the first side of the cathode copper; specifically, the first point cloud data includes height, depth and width data of the surface particles.

[0058] Acquire a first three-dimensional data model of cathode copper surface particles based on the first point cloud data and the first reference plane; specifically, take the first reference plane as the reference plane, process the first point cloud data, and obtain a first three-dimensional data model with the first reference plane as the reference plane;

[0059] Acquire second point cloud data of cathode copper surface particles and a second reference plane corresponding to the second side from the second side of the cathode copper; specifically, the second point cloud data includes height, depth (i.e., distance from the laser camera to determine the position of the particles) and width data of the surface particles;

[0060] Acquire a second three-dimensional data model of cathode copper surface particles based on the second point cloud data and the second reference plane; specifically, process the second point cloud data with the second reference plane as the reference plane to obtain a second three-dimensional data model with the second reference plane as the reference plane;

[0061] Acquire third point cloud data of cathode copper surface particles and a third reference plane corresponding to the third side from a third side of the cathode copper; specifically, the third point cloud data includes height, depth and width data of the surface particles;

[0062] A third three-dimensional data model of cathode copper surface particles is obtained based on the third point cloud data and the third reference plane; specifically, the third point cloud data is processed with the third reference plane as the reference plane to obtain a second three-dimensional data model with the third reference plane as the reference plane;

[0063] The first three-dimensional model, the second three-dimensional model and the third three-dimensional model are aligned and data fused (such as data fusion through point cloud registration technology (such as ICP algorithm)) to obtain a three-dimensional data model of the cathode copper surface particles; specifically, the first reference plane, the second reference plane and the third reference plane are located at three adjacent side surfaces of the cathode copper, thereby, the first reference plane, the second reference plane and the third reference plane can be coordinate transformed, and then the first three-dimensional model, the second three-dimensional model and the third three-dimensional model are aligned.

[0064] The three-dimensional data model is compared with the preset threshold to obtain the detection result; that is, the parameters of the surface particles are obtained by analyzing the three-dimensional data model, and specifically, the number of particles, particle size, particle shape, and particle position can be obtained by analyzing the three-dimensional data model. For example, the depth data in the acquired point cloud data is compared with the preset threshold to obtain the comparison result.

[0065] A cathode copper surface particle detection method of the present invention is based on respectively acquiring point cloud data of the cathode copper surface particles from a first side, a second side and a third side, and then fusing a first three-dimensional data model, a second three-dimensional data model and a third three-dimensional data model to obtain three-dimensional data of the cathode copper surface particles. The method of acquiring data from multiple angles and fusing the data to obtain a final three-dimensional model can avoid occlusion areas, so that the acquired three-dimensional model is more comprehensive and more adaptable; and compared with the manual inspection method, the method is more efficient.

[0066] In some preferred embodiments, the first side is located on one side of the cathode copper conveying line, the second side is located on the other side of the cathode copper conveying line, and the third side is located in front of the cathode copper conveying line, and the first side, the second side and the third side are located in the same plane as the cathode copper; thereby, it is possible to simultaneously detect both sides of the cathode copper; Figure 1 As shown, A is the first side, B is the second side, and C is the third side.

[0067] In some preferred embodiments, the first point cloud data includes first direction point cloud data perpendicular to the cathode copper conveying line, second direction point cloud data at an angle to the first direction and toward the discharge side of the cathode copper conveying line, and third direction point cloud data at an angle to the first direction and toward the feed side of the cathode copper conveying line. The first direction point cloud data, the second direction point cloud data, and the third direction point cloud data are fused to obtain the first point cloud data; based on multi-angle shooting on each side, the occlusion problem between particles can be avoided.

[0068] Preferably, the angle between the first direction and the second direction and between the first direction and the third direction is 5°; at this angle value, it is possible to avoid occlusion between surface particles without affecting coordinate alignment and data fusion between three-dimensional models acquired from each side.

[0069] In some preferred embodiments, the second point cloud data includes point cloud data in a fourth direction perpendicular to the cathode copper conveying line, point cloud data in a fifth direction at an angle to the fourth direction and toward the discharge side of the cathode copper conveying line, and point cloud data in a sixth direction at an angle to the fourth direction and toward the feed side of the cathode copper conveying line. The fourth direction point cloud data, the fifth direction point cloud data, and the sixth direction point cloud data are fused to obtain the second point cloud data; based on multi-angle shooting on each side, the occlusion problem between particles can be avoided.

[0070] Preferably, the angle between the fourth direction and the fifth direction and between the fourth direction and the sixth direction is 5°; at this angle value, it is possible to avoid occlusion between surface particles without affecting coordinate alignment and data fusion between three-dimensional models acquired from each side.

[0071] In some preferred embodiments, the third point cloud data includes seventh direction point cloud data parallel to the cathode copper transmission line, eighth direction point cloud data at an angle to the seventh direction and toward one side of the cathode copper transmission line, and ninth direction point cloud data at an angle to the seventh direction and toward the other side of the cathode copper transmission line. The seventh direction point cloud data, the eighth direction point cloud data, and the ninth direction point cloud data are fused to obtain the third point cloud data; based on multi-angle shooting on each side, the occlusion problem between particles can be avoided.

[0072] Preferably, the angle between the seventh direction and the seventh direction and the angle between the seventh direction and the ninth direction is 5°; at this angle value, it is possible to avoid occlusion between surface particles without affecting coordinate alignment and data fusion between three-dimensional models acquired from each side.

[0073] In some preferred embodiments, the step of acquiring a first reference plane corresponding to the first side comprises:

[0074] Selecting a first reference area on the first side of the cathode copper; the first side of the cathode copper is the side of the cathode copper adjacent to the surface; the first reference area is a relatively flat area on the first side;

[0075] Acquire point cloud data within the first reference area;

[0076] Processing the point cloud data in the first reference area by the least square method to obtain the first reference plane equation;

[0077] The first reference plane is obtained according to the first reference plane equation.

[0078] In some preferred embodiments, the step of acquiring a second reference plane corresponding to the second side comprises:

[0079] Select a second reference area on the second side of the cathode copper; the second side of the cathode copper is the side of the cathode copper adjacent to the surface; the second reference area is a relatively flat area on the second side;

[0080] Acquire point cloud data within the second reference area;

[0081] Processing the point cloud data in the second reference area by the least square method to obtain the second reference plane equation;

[0082] The second reference plane is obtained according to the second reference plane equation.

[0083] In some preferred embodiments, the step of acquiring a third reference plane corresponding to the third side comprises:

[0084] Select a third reference area on the third side of the cathode copper; the third side of the cathode copper is the side of the cathode copper adjacent to the surface; the third reference area is a relatively flat area on the third side;

[0085] Acquire point cloud data within the third reference area;

[0086] Process the point cloud data in the third reference area by the least square method to obtain the third reference plane equation;

[0087] The third datum plane is obtained according to the third datum plane equation.

[0088] In some preferred embodiments, in the data fusion step, the aligned first three-dimensional model, the second three-dimensional model and the third three-dimensional model are fused using point cloud registration technology.

[0089] In some preferred embodiments, the step of retesting the cathode copper with unqualified test results is also included;

[0090] The retesting steps include:

[0091] The unqualified cathode copper is manually sampled.

[0092] If the sampling result is qualified, the image in the corresponding database is retrieved for comparison, the cause of the error is analyzed, and the detection steps are optimized based on the error cause obtained by analysis. For example, if the particle height is judged to be too high but it is actually not high, there may be insufficient light or errors in image processing. It is necessary to supplement the light or correct the image processing during shooting. The specific processing process can refer to the existing technology; based on this, the accuracy of detection can be improved.

[0093] In some preferred embodiments, point cloud data is acquired by a laser camera, wherein the depth data of the particle is determined by calculating the time (or phase difference) of laser beam propagation to determine the distance to the surface, thereby obtaining the depth information of the particle; in a three-dimensional model, the laser camera provides the height of each point relative to the reference plane (i.e., the edge of the cathode copper surface with particles) to form a height map (or elevation map), and further analyzes the height of the particle. The particle height can be obtained by image processing the image taken by the laser camera, and the specific reference can be made to the prior art; the width is obtained by fusing the fourth direction point cloud data, the fifth direction point cloud data, and the sixth direction point cloud data. The second point cloud data is often acquired by the laser camera when scanning horizontally (left and right). When the laser camera scans from the side (left or right), the distance occupied by the particle in the horizontal direction at a specific height can be measured. This can be achieved by identifying the edge of the particle in the point cloud, and an image processing algorithm (such as edge detection) is usually used to extract the particle outline. Once the edge of the particle is determined, the width of the particle on a certain height plane can be calculated.

[0094] Example 2

[0095] This embodiment provides a cathode copper surface particle detection system, such as Figure 1 As shown, it includes a first laser camera 1, a second laser camera 2, a third laser camera 3 and a processor 4;

[0096] The first laser camera 1 is used to obtain first point cloud data of particles on the surface of the cathode copper from the first side of the cathode copper, and to generate point cloud data of a first reference plane;

[0097] The second laser camera 2 is used to obtain second point cloud data of particles on the cathode copper surface from the second side of the cathode copper, and to generate point cloud data of a second reference plane;

[0098] The third laser camera 3 is used to obtain third point cloud data of cathode copper surface particles from a third side of the cathode copper, and to generate point cloud data of a third reference plane;

[0099] The processor 4 is electrically connected to the first laser camera 1 , the second laser camera 2 and the third laser camera 3 , respectively, and executes the detection method in Example 1 when performing detection.

[0100] A cathode copper surface particle detection system of the present invention is based on respectively obtaining point cloud data of the cathode copper surface particles by a first laser camera 1, a second laser camera 2 and a third laser camera 3, and then fusing the obtained first three-dimensional data model, the second three-dimensional data model and the third three-dimensional data model through a processor 4 to obtain three-dimensional data of the cathode copper surface particles. The first laser camera 1, the second laser camera 2 and the third laser camera 3 obtain data from multiple angles and fuse them to obtain a final three-dimensional model, which can avoid occlusion areas and thus obtain a more comprehensive three-dimensional model; and compared with manual inspection, the method is more efficient.

[0101] Preferably, the first laser camera 1 , the second laser camera 2 and the third laser camera 3 are line scan cameras or area array cameras.

[0102] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A method for detecting cathode copper surface particles, the method being used for detecting cathode copper surface particles transported horizontally; characterized in that: The steps include: Acquire first point cloud data of particles on the cathode copper surface and a first reference plane corresponding to the first side from the first side of the cathode copper; Acquire a first three-dimensional data model of the cathode copper surface particles according to the first point cloud data and the first reference plane; Acquire second point cloud data of particles on the cathode copper surface and a second reference plane corresponding to the second side from the second side of the cathode copper; Acquire a second three-dimensional data model of the cathode copper surface particles according to the second point cloud data and the second reference plane; Acquire third point cloud data of particles on the cathode copper surface and a third reference plane corresponding to the third side from a third side of the cathode copper; Acquire a third three-dimensional data model of the cathode copper surface particles according to the third point cloud data and the third reference plane; Aligning the coordinates of the first three-dimensional model, the second three-dimensional model and the third three-dimensional model and fusing the data to obtain a three-dimensional data model of the cathode copper surface particles; The three-dimensional data model is compared with a preset threshold to obtain a detection result.

2. A method for detecting cathode copper surface particles according to claim 1, characterized in that: The first side is located on one side of the cathode copper transmission line, the second side is located on the other side of the cathode copper transmission line, the third side is located in front of the cathode copper transmission line, and the first side, the second side and the third side are located in the same plane as the cathode copper.

3. A cathode copper surface particle detection method according to claim 1, characterized in that: The first point cloud data includes first direction point cloud data perpendicular to the cathode copper conveying line, second direction point cloud data at an angle to the first direction and toward the discharge side of the cathode copper conveying line, and third direction point cloud data at an angle to the first direction and toward the feed side of the cathode copper conveying line.

4. A method for detecting cathode copper surface particles according to claim 1, characterized in that: The second point cloud data includes point cloud data in a fourth direction perpendicular to the cathode copper conveying line, point cloud data in a fifth direction at an angle to the fourth direction and toward the discharge side of the cathode copper conveying line, and point cloud data in a sixth direction at an angle to the fourth direction and toward the feed side of the cathode copper conveying line.

5. A cathode copper surface particle detection method according to claim 1, characterized in that: The third point cloud data includes seventh direction point cloud data parallel to the cathode copper conveying line, eighth direction point cloud data forming an angle with the seventh direction and facing one side of the cathode copper conveying line, and ninth direction point cloud data forming an angle with the seventh direction and facing the other side of the cathode copper conveying line.

6. A method for detecting cathode copper surface particles according to claim 1, characterized in that: The step of acquiring a first reference plane corresponding to the first side comprises: Selecting a first reference area on the first side of the cathode copper; Acquire point cloud data within the first reference area; Processing the point cloud data in the first reference area by the least square method to obtain a first reference plane equation; The first reference plane is obtained according to the first reference plane equation.

7. A method for detecting cathode copper surface particles according to claim 1, characterized in that: The step of acquiring a second reference plane corresponding to the second side comprises: Selecting a second reference area on the second side of the cathode copper; Acquire point cloud data within the second reference area; Processing the point cloud data in the second reference area by the least square method to obtain a second reference plane equation; The second reference plane is obtained according to the second reference plane equation.

8. A method for detecting cathode copper surface particles according to claim 1, characterized in that: The step of acquiring a third reference plane corresponding to the third side comprises: Selecting a third reference area on the third side surface of the cathode copper; Acquire point cloud data within the third reference area; Processing the point cloud data in the third reference area by the least square method to obtain a third reference plane equation; The third reference plane is obtained according to the third reference plane equation.

9. A method for detecting cathode copper surface particles according to claim 1, characterized in that: In the data fusion step, point cloud registration technology is used to fuse the aligned first three-dimensional model, the second three-dimensional model and the third three-dimensional model.

10. A method for detecting cathode copper surface particles according to claim 1, characterized in that: The step also includes retesting the cathode copper that has an unqualified test result; The re-detection step comprises: The unqualified cathode copper is manually sampled. If the sampling result is qualified, the image in the corresponding database is retrieved for comparison and the cause of the error is analyzed.

11. A cathode copper surface particle detection system, characterized in that: comprising a first laser camera, a second laser camera, a third laser camera and a processor; The first laser camera is used to obtain first point cloud data of particles on the surface of the cathode copper from the first side of the cathode copper, and to generate point cloud data of a first reference plane; The second laser camera is used to obtain second point cloud data of particles on the surface of the cathode copper from the second side of the cathode copper, and to generate point cloud data of a second reference plane; The third laser camera is used to obtain third point cloud data of particles on the surface of the cathode copper from a third side of the cathode copper, and to generate point cloud data of a third reference plane; The processor is electrically connected to the first laser camera, the second laser camera and the third laser camera, respectively, and executes the detection method described in any one of claims 1 to 10 when performing detection.

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