Electronic device and manufacturing method thereof

Abstract

An electronic device includes: a first substrate, where the first substrate has flexibility; the second substrate is arranged corresponding to the first substrate, and the second substrate has flexibility; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first bonding part; and a second conductive pattern for receiving a second electrode signal and including a second connection portion. The electronic device further comprises a second conductive layer arranged on the second substrate and electrically connected with the second conductive pattern; and the first metal layer is arranged between the first substrate and at least one of the first connecting part and the second connecting part, and is electrically connected with at least one of the first connecting part and the second connecting part.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to electronic devices, and more particularly, to using metal layers to assist signal transmission. Background Art

[0002] Electronic devices have been widely used in different fields such as communication, display, automobile or aviation. With the vigorous development of electronic devices, electronic devices are being developed towards being lighter and thinner, so the reliability or quality requirements of electronic devices are higher. Summary of the invention

[0003] An electronic device includes: a first substrate, wherein the first substrate is flexible; a second substrate, arranged corresponding to the first substrate, wherein the second substrate is flexible; and a first conductive layer, arranged on the first substrate. The first conductive layer includes: a first conductive pattern, used to receive a first electrode signal, and including a first connecting portion; and a second conductive pattern, used to receive a second electrode signal, and including a second connecting portion. The electronic device further includes: a second conductive layer, arranged on the second substrate, and electrically connected to the second conductive pattern; and a first metal layer, arranged between the first substrate and at least one of the first connecting portion and the second connecting portion, and electrically connected to at least one of the first connecting portion and the second connecting portion.

[0004] An electronic device includes: a first substrate; a second substrate, arranged corresponding to the first substrate; and a first conductive layer, arranged on the first substrate. The first conductive layer includes: a first conductive pattern, used to receive a first electrode signal, and including a first connecting portion; and a second conductive pattern, used to receive a second electrode signal, and including a second connecting portion. The electronic device further includes: a second conductive layer, arranged on the second substrate, and electrically connected to the second conductive pattern; a first metal layer, arranged between the first substrate and at least one of the first connecting portion and the second connecting portion; a passivation layer, arranged on the first metal layer; and a second metal layer, arranged on the passivation layer. The passivation layer has an opening, and the second metal layer fills the opening and is electrically connected to the first metal layer.

[0005] A method for manufacturing an electronic device includes: providing a first carrier; forming a first substrate on the first carrier, wherein the first substrate is flexible; providing a second carrier; and forming a second substrate on the second carrier, wherein the second substrate is flexible. The method for manufacturing the electronic device further includes: combining the first substrate and the second substrate through a first sealant and a second sealant; removing the first carrier; removing the second carrier; and cutting off the second sealant. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The following will be described in detail with reference to the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the sizes of various components can be arbitrarily enlarged or reduced to clearly show the features of the embodiments of the present disclosure.

[0007] Figure 1 is a top view of an electronic device according to some embodiments of the present disclosure.

[0008] Figure 2 to Figure 5 is a cross-sectional schematic diagram of an electronic device according to some embodiments of the present disclosure.

[0009] Figure 6 and Figure 7 is a schematic cross-sectional view of an electronic device at other positions according to some embodiments of the present disclosure.

[0010] Fig. 8A and Figure 8B is a top view of components of electronic devices having various designs according to some embodiments of the present disclosure.

[0011] Fig. 9 and Fig.10 is a cross-sectional schematic diagram of an electronic device according to some embodiments of the present disclosure.

[0012] Fig.11 is a top view of an electronic device according to other embodiments of the present disclosure.

[0013] Fig.12 and Fig.13 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present disclosure.

[0014] Fig.14 is a top view of an electronic device according to other embodiments of the present disclosure.

[0015] Fig.15 and Fig.16 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present disclosure.

[0016]

Explanation of symbols

[0017] 10,20,30,40: Electronic devices

[0018] 100,200:Carrier board

[0019] 110,210:Substrate

[0020] 115: Mark

[0021] 120,140:Metal layer

[0022] 120-1: Main body

[0023] 120-2: Loop segment

[0024] 120A, 120B, 120C: sub-segment

[0025] 130: passivation layer

[0026] 130V: Open

[0027] 150,250: conductive layer

[0028] 152: first conductive pattern

[0029] 152-1: Main body

[0030] 152-2: Connection

[0031] 152-3: Protrusion

[0032] 154: second conductive pattern

[0033] 154-1: Circulation Department

[0034] 154-2,154-3: Connection

[0035] 154-4: Isolation Department

[0036] 160,170: Frame glue

[0037] 162: Support structure

[0038] 164: Adhesive layer

[0039] 180:Metal Wire

[0040] 182: Metal

[0041] 184: Adhesive layer

[0042] 190: Flexible printed circuit

[0043] 260:LCD

[0044] 300,400:Polarizer

[0045] A-A',B-B',C-C',D-D',E-E': line segments

[0046] C: Wrinkles

[0047] F: Crack

[0048] L: Connecting cable

[0049] S: interval DETAILED DESCRIPTION

[0050] The following disclosure provides many different embodiments or examples for implementing different components of the embodiments of the present disclosure. Specific examples of components and configurations are described below to simplify the embodiments of the present disclosure. Of course, these are merely examples and are not intended to limit the embodiments of the present disclosure. For example, the description mentions that the first component is formed on the second component, which may include an embodiment in which the first and second components are in direct contact, and may also include an embodiment in which an additional component is formed between the first and second components so that the first and second components are not in direct contact. In addition, the embodiments of the present disclosure may repeat component symbols and / or letters in different examples. Such repetition is for the purpose of simplicity and clarity, and does not itself dominate the relationship between the various embodiments and / or configurations discussed.

[0051] Directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right" and similar terms, are only used with reference to the directions of the accompanying drawings. Therefore, the directional terms used are used to illustrate rather than to limit the present disclosure.

[0052] In addition, in some embodiments of the present disclosure, terms such as "connection", "interconnection", etc., unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, with other structures being disposed between the two structures. Terms related to bonding and connection may also include situations where both structures are movable, or where both structures are fixed. In addition, the terms "electrically connected" and "coupled" include any direct and indirect electrical connection means.

[0053] In addition, the terms "first", "second" and the like mentioned in the specification or claims are only used to name different components or distinguish different embodiments or ranges, and are not used to limit the upper or lower limit of the number of components, nor are they used to limit the manufacturing order or setting order of the components.

[0054] The terms "about", "approximately", and "generally" used herein generally mean within ±20% of a given value, preferably within ±10%, and more preferably within ±5%, or within ±3%, or within ±2%, or within ±1%, or within 0.5%. The numerical values ​​given herein are approximate values, that is, in the absence of specific description of "about", "approximately", and "generally", the given numerical values ​​may still imply the meaning of "about", "approximately", and "generally".

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art to which the present disclosure belongs. It is understood that these terms, such as those defined in common dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0056] Some variations of the embodiments are described below. In the embodiments of the different drawings and descriptions, similar component symbols are used to indicate similar components. It is understood that additional operations can be provided before, during, and after the method, and some of the described operations can be replaced or deleted for other embodiments of the method.

[0057] In this article, each direction is not limited to rectangular coordinates (such as three axes of X-axis, Y-axis, and Z-axis), and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the convenience of explanation, hereinafter, the X-axis direction is the length direction, the Y-axis direction is the width direction, and the Z-axis direction is the thickness direction. In an embodiment of the present disclosure, the Z-axis direction is the normal direction of the substrate. In an embodiment of the present disclosure, the top view refers to a schematic diagram for observing the XY plane. In some embodiments, the dimensions in different directions can be measured by optical images (such as scanning electron microscope (SEM) images).

[0058] In the present disclosure, the electronic device may include a display device, a backlight device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat, or ultrasound, but is not limited thereto. The electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode (LED) or a photodiode (PD). The light emitting diode may, for example, include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini light emitting diode), a micro light emitting diode (μLED), or a quantum dot light emitting diode (quantum dot light emitting diode), but is not limited thereto. The splicing device may, for example, be a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device can be any combination of the above, but is not limited thereto. The following will use a display device as an electronic device or a splicing device to illustrate the present disclosure, but is not limited thereto.

[0059] In addition, the appearance of the electronic device can be rectangular, circular, polygonal, with curved edges, or other suitable shapes. The electronic device can have peripheral systems such as a processing system, a drive system, a control system, a light source system, a shelf system, etc. to support the display device or the splicing device. It should be noted that the electronic device can be any combination of the foregoing, but is not limited thereto.

[0060] Figure 1 is a top view of an electronic device according to some embodiments of the present disclosure. For clarity of description, Figure 1 Only some components are shown by way of example. In some embodiments, additional components may be added to the electronic device described below. In some embodiments, some components of the electronic device 10 described below may be replaced or omitted. In some embodiments, additional operating steps may be provided before, between, and / or after the method of forming the electronic device 10. In some embodiments, some of the operating steps described may be replaced or omitted, and the order of some of the operating steps described may be interchangeable.

[0061] Figure 2 to Figure 5 is a cross-sectional schematic diagram of an electronic device 10 according to some embodiments of the present disclosure. It should be noted that: Figure 2 for Figure 1 Schematic cross-sectional view obtained by line segment A-A'. In some embodiments, the electronic device 10 may include a carrier 100, a substrate 110, a metal layer 120, a conductive layer 150, a sealant 160, a sealant 170, a metal line 180, a flexible printed circuit (FPC) 190, a carrier 200, a substrate 210, a conductive layer 250, and a liquid crystal 260. The conductive layer 150 may include a first conductive pattern 152 and a second conductive pattern 154. The sealant 160 may include a support structure 162 and a glue layer 164. For illustrative purposes, Figure 1 Only components above the substrate 110 are shown, including the conductive layer 150 , the sealant 160 , the sealant 170 , the metal wire 180 , and the flexible printed circuit 190 .

[0062] Reference Figure 2 , a carrier 100 and a carrier 200 are provided. A substrate 110 and a substrate 210 are respectively arranged on the carrier 100 and the carrier 200. A metal layer 120 is arranged on the substrate 110, and a conductive layer 150 (including a first conductive pattern 152 and a second conductive pattern 154) is arranged on the substrate 110 and the metal layer 120. A sealant 160 (including a support structure 162 and a sealant layer 164), a sealant 170, and a flexible printed circuit 190 are arranged on the conductive layer 150. In addition, a conductive layer 250 is arranged on the substrate 210, and a liquid crystal 260 is arranged on the conductive layer 250.

[0063] According to some embodiments of the present disclosure, the carrier 100 may be used to carry the substrate 110. The carrier 100 may be made of a relatively hard material, such as glass, to effectively fix the substrate 110.

[0064] According to some embodiments of the present disclosure, the substrate 110 may be flexible. The substrate 110 may include a flexible material and an inorganic layer, wherein the flexible material and the inorganic layer may be a single layer or multiple layers. In some embodiments, the substrate 110 may be a multi-layer flexible material and a plurality of inorganic layers arranged alternately. The flexible material may include polyethylene terephthalate (PET) resin, polycarbonate (PC) resin, polyimide (PI) resin, polymethylmethacrylates (PMMA), polystyrene resin (polystyrene) resin, polyethersulfone (PES) resin, polythiophene (PT) resin, phenol novolac (PN), other similar organic materials, or combinations thereof, but not limited thereto. The inorganic layer may include silicon oxide (SiO), silicon nitride (SiN), silicon carbide (SiC), silicon carbonitride (SiCN), silicon oxynitride (SiON), silicon oxynitrocarbide (SiO x N y C 1-x-y ), or a combination thereof, but not limited thereto. In some embodiments, the substrate 110 may be glass.

[0065] In some embodiments, the substrate 110 is formed on the carrier 100 by slit-coating, spin-on coating, chemical vapor deposition (CVD), atomic layer deposition (ALD), or a combination thereof, but is not limited thereto.

[0066] In some embodiments, a metal layer 120 is formed on the substrate 110. The material of the metal layer 120 may include cobalt (Co), ruthenium (Ru), aluminum (Al), tungsten (W), copper (Cu), titanium (Ti), tantalum (Ta), silver (Ag), gold (Au), platinum (Pt), nickel (Ni), palladium (Pd), zinc (Zn), chromium (Cr), molybdenum (Mo), niobium (Nb), beryllium (Be), strontium (Sr), or a combination thereof, but is not limited thereto.

[0067] In some embodiments, the metal layer 120 is formed by chemical vapor deposition, atomic layer deposition, physical vapor deposition (PVD), evaporation, plating, sputtering, or a combination thereof, but is not limited thereto. A patterning process may be used, which includes a photolithography process and an etching process, other suitable processes, or a combination thereof, to form the metal layer 120 into a plurality of metal patterns separated from each other, which overlap and electrically connect the plurality of connection portions of the first conductive pattern 152 and / or the second conductive pattern 154.

[0068] In some embodiments, the conductive layer 150 covers the substrate 110 and the metal layer 120. In other words, the metal layer 120 is disposed between the substrate 110 and the conductive layer 150. The conductive layer 150 can transmit electrode signals. The conductive layer 150 may include indium (III) oxide (In2O3), zinc oxide (ZnO), indium oxide-zinc oxide, aluminum-doped zinc oxide (AZO), gallium zinc oxide (GZO), indium tin oxide (ITO), indium zinc oxide (IZO), antimony tin oxide (ATO), indium gallium tin oxide (IGTO), tin oxide (tin (IV) oxide, SnO2), or a combination thereof, but is not limited thereto. In some embodiments, the conductive layer 150 may be, for example, a transparent conductive material. The formation method of the conductive layer 150 may be similar to that of the metal layer 120, which is not repeated here. In some embodiments, the ductility of the metal layer 120 is higher than the ductility of the conductive layer 150 .

[0069] In some embodiments, the conductive layer 150 may be patterned into a first conductive pattern 152 and a second conductive pattern 154 by a patterning process. When viewed from the normal direction (e.g., the Z axis) of the substrate 110, the second conductive pattern 154 surrounds the first conductive pattern 152. In some embodiments, the first conductive pattern 152 transmits a lower electrode signal and serves as a lower electrode of the electronic device, while the second conductive pattern 154 transmits an upper electrode signal.

[0070] The first conductive pattern 152 may include a main body 152-1 and a connecting portion 152-2, and the second conductive pattern 154 may include a loop portion 154-1, a connecting portion 154-2, and a connecting portion 154-3. The main body 152-1 and the connecting portion 152-2 may be an integrally formed structure, and the loop portion 154-1, the connecting portion 154-2, and the connecting portion 154-3 may be an integrally formed structure.

[0071] From another point of view, the connecting portion 152-2 extends outward from the main body 152-1, while the connecting portion 154-2 and the connecting portion 154-3 extend outward from the circulation portion 154-1. In detail, the circulation portion 154-1 in the present disclosure is a non-closed shape, so that the connecting portion 154-2 and the connecting portion 154-3 can extend outward from the two end points of the circulation portion 154-1. Among them, the connecting portion 152-2, the connecting portion 154-2, and the connecting portion 154-3 can be parallel to each other and extend in the same direction. It is worth noting that due to the different electrode signals transmitted, the first conductive pattern 152 and the second conductive pattern 154 are separated from each other by a spacing S.

[0072] According to some embodiments of the present disclosure, the metal layer 120 is located between the substrate 110 and at least one of the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3, and is electrically connected to at least one of the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3. For example, the metal layer 120 is disposed under the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3, and the metal layer 120 is electrically connected to the three connection portions respectively. In some embodiments, the metal layer 120 is disposed under one or both of the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3, and the metal layer 120 is electrically connected to one or two connection portions respectively. It is worth noting that the metal layer 120 is located outside the active area to prevent the metal layer 120 from affecting the performance of the active area of ​​the electronic device, such as affecting the light penetration effect of the electronic device.

[0073] In some embodiments, the flexible printed circuit 190 is electrically connected to the conductive layer 150. For example, the flexible printed circuit 190 may be located on the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3, and supply the lower electrode signal to the first conductive pattern 152 and the upper electrode signal to the second conductive pattern 154.

[0074] According to some embodiments of the present disclosure, the carrier 200 may be used to carry the substrate 210. The materials and forming methods of the carrier 200 and the substrate 210 are similar to those of the carrier 100 and the substrate 110, respectively, and are not described in detail herein.

[0075] In some embodiments, the conductive layer 250 may be disposed on the substrate 210 and is not patterned. According to some embodiments of the present disclosure, the conductive layer 250 may transmit electrode signals and serve as an upper electrode of the electronic device 10. The conductive layer 250 may be electrically connected to the second conductive pattern 154 of the conductive layer 150. The material and formation method of the conductive layer 250 may be similar to those of the conductive layer 150, and are not described in detail herein.

[0076] According to some embodiments of the present disclosure, the liquid crystal 260 is disposed on the conductive layer 250. The liquid crystal 260 can be rotated to a desired angle in the presence of an electric field. The liquid crystal 260 may include a nematic liquid crystal, a vertical alignment (VA) liquid crystal, a smectic liquid crystal, an electrically controlled birefringence (ECB) liquid crystal, an in plane switching (IPS) liquid crystal, a fringe field switching (FFS) liquid crystal, a cholesterol liquid crystal, or a discotic liquid crystal, but is not limited thereto.

[0077] Reference Figure 3 , the carrier 100 and the carrier 200 are combined. More specifically, the substrate 110 and the substrate 210 are paired through the sealant 160 and the sealant 170, so that the liquid crystal 260 is located between the substrate 110, the substrate 210, and the sealant 160. The sealant 160 can be disposed between the conductive layer 150 and the conductive layer 250. The support structure 162 of the sealant 160 can support the substrate 110 and the substrate 210 and maintain the gap between the liquid crystal 260, and the glue layer 164 of the sealant 160 can ensure the adhesion between the conductive layer 150 and the conductive layer 250. The sealant 170 can be disposed between the conductive layer 150 and the conductive layer 250. Observed from the normal direction of the substrate 110 (e.g., the Z axis), the sealant 170 surrounds the conductive layer 150 (including the first conductive pattern 152 and the second conductive pattern 154) to ensure that the substrate 110 has a certain degree of adhesion in the portion surrounded by the sealant 170, thereby protecting the substrate 110 from deformation (e.g., wrinkles) during subsequent processes. In some embodiments, the sealant 170 can define the range of the subsequent cutting process.

[0078] In some embodiments, the frame glue 160 can define the active area of ​​the electronic device (or the display area of ​​the display device). More specifically, the substrate 110, the frame glue 160, and the substrate 210 define the active area of ​​the electronic device (or the display area of ​​the display device), and the liquid crystal 260 is confined therein. In some embodiments, the frame glue 160 can be disposed on at least one of the main body 152-1, the circulation part 154-1, and the interval S. In other words, the active area of ​​the electronic device can be confined to the area of ​​the first conductive pattern 152, or across the first conductive pattern 152, the interval S, and the second conductive pattern 154, but is not limited thereto. It should be understood that the area outside the active area can be regarded as a peripheral area. For example, the metal layer 120 and the flexible printed circuit 190 are located in the peripheral area. It is worth noting that the flexible printed circuit 190 does not contact the conductive layer 250 when viewed from a normal line (e.g., the Y axis) perpendicular to the substrate 110.

[0079] When viewed from above, the frame glue 160 may be annular or other suitable shapes. The material of the support structure 162 of the frame glue 160 may include glass fiber, silica, other similar materials, or a combination thereof, but is not limited thereto. The material of the glue layer 164 of the frame glue 160 may include epoxy resins, a hardener, other similar materials, or a combination thereof, but is not limited thereto. The material of the frame glue 170 may be different from the material of the frame glue 160. In some embodiments, the material of the frame glue 170 may be the same as the material of the frame glue 160 to save manufacturing time. For example, the frame glue 170 also includes a support structure and a glue layer. The frame glue 170 and the frame glue 160 may be formed by any suitable process described above, which will not be repeated here.

[0080] It should be understood that although the present embodiment initially shows that the sealant 160 and the sealant 170 are on the substrate 110, and the liquid crystal 260 is on the substrate 210, it is not limited thereto. For example, the sealant 160, the sealant 170, and the liquid crystal 260 may be formed on one substrate (e.g., the substrate 110), and then the sealant 160, the sealant 170, and the liquid crystal 260 may be combined with another substrate (e.g., the substrate 210). Alternatively, the liquid crystal 260 may be formed on the substrate 210, and the sealant 160 and the sealant 170 may be formed on both the substrate 110 and the substrate 210, and then the two substrates may be combined.

[0081] In some embodiments, when a voltage is applied through the lower electrode and the upper electrode of the electronic device 10 to generate an electric field, the liquid crystal 260 can rotate to a desired angle. For example, the electronic device 10 may include a liquid crystal module with a privacy function. In the absence of any bias, the liquid crystal 260 does not rotate, so that the electronic device 10 appears transparent at any viewing angle. When a bias is applied, the liquid crystal 260 rotates, so that the electronic device 10 is transparent only at a positive viewing angle (such as the viewing angle in the normal direction of the substrate (such as the Z axis)), and is non-transparent at a side viewing angle, achieving a privacy effect. If the conductive layer 150 cannot transmit the electrode signal normally, the liquid crystal unit of the electronic device 10 may lose the function of rotating, causing the electronic device to fail.

[0082] Reference Figure 4 , remove the carrier 100 and the carrier 200. According to some embodiments of the present disclosure, the carrier 100 and the carrier 200 may be removed by a laser lift-off (LLO) process. The bond between the substrate and the carrier is broken by irradiating a laser, thereby separating the substrate 110 from the carrier 100, and separating the substrate 210 from the carrier 200. However, the high temperature in the process of removing the carrier 100 and the carrier 200 may cause the substrate to deform (e.g., generate wrinkles), that is, the originally flat film layer will become a wavy film layer (i.e., a structure that rises and falls along the normal direction of the substrate (e.g., the Z axis)).

[0083] It should be understood that the laser lift-off process will make the materials of substrate 110 and substrate 210 fragile and thus prone to deformation. However, the film layer surrounded by the sealant 170 can be protected by the sealant 170 to avoid deformation. Figure 4 , the film layer on one side of the frame glue 170 (for example, the film layer corresponding to the main body 152-1) does not have a wrinkle C. In some embodiments, since the substrate 110, the metal layer 120, and the connecting portion 152-2 adjacent to the flexible printed circuit 190 are not surrounded by the frame glue 170, they cannot be protected by the frame glue 170 during the laser stripping process and wrinkles C or further cracks F are generated. The number of wrinkles C and cracks F can be one or more. When the number of cracks F is too large or continues to expand and the entire connecting portion 152-2 is broken, the electronic device 10 may not be able to effectively transmit electrode signals. Therefore, in the present disclosure, the metal layer 120 can be provided as a mechanism to avoid failure of the electronic device. In this way, when the connecting portion 152-2 cannot transmit the electrode signal, the electrode signal transmission can still be completed through the metal layer 120 below the connecting portion 152-2, which has higher ductility and is less prone to breakage.

[0084] Continue to refer to Figure 4A polarizer 300 and a polarizer 400 are formed on the other surface of the substrate 110 relative to the conductive layer 150 and on the other surface of the substrate 210 relative to the conductive layer 250, respectively. According to some embodiments of the present disclosure, the polarizer 300 and the polarizer 400 can filter light in a specific direction so that only light in a desired direction can pass through.

[0085] Reference Figure 5 , the electronic device 10 can be subjected to a cutting process to remove the sealant 170 and the film layer outside the ring corresponding to the sealant 170. Since the electrode signal needs to be transmitted from the flexible printed circuit 190 to the main body 152-1 through the connecting portion 152-2, the connection between the main body 152-1, the connecting portion 152-2, and the flexible printed circuit 190 cannot be cut off. Furthermore, as mentioned above, the connecting portion 152-2 is not surrounded by the sealant 170, so the configuration of the main body 152-1, the connecting portion 152-2, and the flexible printed circuit 190 is retained on the substrate 110. In contrast, the flexible printed circuit 190 is not provided on the substrate 210, so the redundant part of the substrate 210 can be cut. As a result, after the cutting process, the substrate 110 and the substrate 210 are not cut flush. For example, the edge of the substrate 110 exceeds the edge of the substrate 210. The cutting process in the present disclosure may include laser cutting, wheel cutting, or a combination thereof, but is not limited thereto. After the cutting process is completed, the manufacturing of the electronic device 10 is completed.

[0086] Figure 6 and Figure 7 is a cross-sectional schematic diagram of the electronic device 10 at other positions according to some embodiments of the present disclosure. It should be noted that: Figure 6 for Figure 1 The cross-sectional view obtained by the line segment B-B' is shown in FIG. Figure 7 for Figure 1 The cross-sectional view obtained by the line segment CC' of the carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the sealant 160, the sealant 170, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260 are shown in FIG. Figure 1 and Figure 2 The above is similar to what is shown, so I will not repeat it here.

[0087] Reference Figure 6 , showing a cross-sectional view of the completed electronic device 10 at line segment BB'. Figure 2 to Figure 4 Compared to Figure 5 , Figure 6The second conductive pattern 154 (e.g., the connecting portion 154-3) is shown. The metal layer 120 is formed between the substrate 110 and the second conductive pattern 154 (e.g., the connecting portion 154-3). Due to the different electrode signals transmitted, the first conductive pattern 152 and the second conductive pattern 154 are separated from each other by a gap S. The connecting portion 154-3 of the second conductive pattern 154 extends from one end of the loop portion 154-1 toward the flexible printed circuit 190.

[0088] Continue to refer to Figure 6 , since the connection part 154-3, the substrate 110 corresponding to the connection part 154-3, and the metal layer 120 are not surrounded by the frame glue 170, wrinkles C are generated, or further cracks F are generated, resulting in the inability to effectively transmit electrode signals. In the present disclosure, the metal layer 120 can be provided as a mechanism to avoid failure of the electronic device. In this way, when the connection part 154-3 cannot transmit the electrode signal, the electrode signal transmission can still be completed through the metal layer 120 below the connection part 154-3, which has higher ductility and is less prone to breakage. In this way, the flexible printed circuit 190 can transmit the electrode signal to the first conductive pattern 152 and the second conductive pattern 154 through the metal layer 120, control the correct rotation of the liquid crystal, reduce the risk of failure of the electronic device 10, and improve the yield and reliability of the electronic device 10.

[0089] Reference Figure 7 , showing a cross-sectional view of the completed electronic device 10 at line segment CC'. Figure 2 to Figure 4 Compared to Figure 5 , Figure 7 The area without any connection portion is shown. In this embodiment, part of the sealant 160 is disposed on the first conductive pattern 152 (e.g., the main body 152-1), and part of the sealant 160 is disposed on one section of the second conductive pattern 154 (e.g., the loop portion 154-1). A metal line 180 is formed on another section of the second conductive pattern 154 (e.g., the loop portion 154-1).

[0090] Continue to refer to Figure 7 , a mark 115 is formed in the section of the loop portion 154-1 corresponding to the metal line 180, but the position of the mark 115 is not limited thereto. When viewed from the top, the mark 115 may have a cross shape or other suitable shapes. According to some embodiments of the present disclosure, the mark 115 may provide alignment for the formation of the metal line 180. The material and formation method of the mark 115 may be similar to the material and formation method of the metal layer 120, and will not be repeated here.

[0091] Reference Figure 7, the metal wire 180 may be located on a section of the second conductive pattern 154 (e.g., the loop portion 154-1). In some embodiments, the metal wire 180 does not extend onto the connecting portion 154-2 and the connecting portion 154-3 of the second conductive pattern 154. The metal wire 180 may further transmit the electrode signal of the connecting portion 154-2 and / or the connecting portion 154-3 to the conductive layer 250. Although the metal wire 180 is disposed on one side of the loop portion 154-1, the position and length of the metal wire 180 are not limited thereto. For example, the metal wire 180 may be extended to other sides of the loop portion 154-1, or the metal wire 180 may be shortened. However, since the laser lift-off process may cause the substrate 110 to bend, the metal wire 180 needs to maintain a certain length to ensure the conduction of the signal.

[0092] The metal line 180 may include a metal 182 and a glue layer 184. According to some embodiments of the present disclosure, the metal 182 may conduct electrode signals, and the glue layer 184 may ensure adhesion between the conductive layer 150 and the conductive layer 250. The material of the metal 182 includes metal particles formed by gold, silver, or other metals, but is not limited thereto. The material and formation method of the glue layer 184 may be similar to those of the glue layer 164, and will not be described in detail herein. The metal 182 and the glue layer 184 may be formed by any suitable process described above.

[0093] Continue to refer to Figure 7 , the metal wire 180 can be disposed between the conductive layer 150 and the conductive layer 250. Since the conductive layer 150 is surrounded by the sealant 170, the cross-sectional schematic diagram of the conductive layer 150 at the line segment CC' does not have a wrinkle C. Since the cutting process can remove the sealant 170 and the portion outside the ring of the sealant 170. As a result, after the cutting process, the substrate 110 and the substrate 210 are cut flush.

[0094] Fig. 8A and Figure 8B FIG. 1 is a top view of a metal layer 120 of an electronic device having various designs according to some embodiments of the present disclosure. Figure 1 , the metal layer 120 disposed under the conductive layer 150 may have a mesh structure. In some embodiments, the metal layers 120 corresponding to the connecting portion 152-2, the connecting portion 154-2, and the connecting portion 154-3 may have mesh structures of different designs. Figure 1 and Figure 2 The above is similar to what is shown, so I will not repeat it here.

[0095] Reference Fig. 8A, the metal layer 120 may include a main body segment 120-1 and a loop segment 120-2 on both sides of the main body segment 120-1. Through the metal layer 120 of this design, multiple signal transmission paths can be provided, further avoiding the problem of electronic device failure caused by the signal transmission being affected by the break of the metal layer 120. For example, if a crack F occurs in the main body segment 120-1 and affects the electrode signal transmission, the electrode signal transmission can still be completed through the loop segment 120-2 on at least one side. In some embodiments, the portion of the conductive layer 150 corresponding to the metal layer 120 can, for example, apply the same pattern design. For example, the connecting portion 152-2 can have a mesh structure that corresponds to the mesh structure of the metal layer 120. The mesh structure of the connecting portion 154-2 is the same as and overlaps with the mesh structure of the metal layer 120 corresponding to the connecting portion 154-2.

[0096] Reference Figure 8B , the metal layer 120 may include a sub-segment 120A, a sub-segment 120B, a sub-segment 120C, and a plurality of connecting lines L. In some embodiments, the extending direction of the connecting line L is different from the extending direction of the sub-segment 120A, the sub-segment 120B, and the sub-segment 120C. In this way, the metal layer 120 can provide multiple signal transmission paths, further avoiding the problem of electronic device failure caused by the breakage of the metal layer 120 affecting signal transmission, thereby improving the yield and reliability of the electronic device. In some embodiments, the portion of the conductive layer 150 corresponding to the metal layer 120 can, for example, apply the same pattern design.

[0097] Fig. 9 and Fig.10 is a cross-sectional schematic diagram of an electronic device 20 according to some embodiments of the present disclosure. Figure 2 The electronic device 20 further includes a passivation layer 130 and a metal layer 140. The characteristics of the carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the sealant 160, the sealant 170, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260 are similar to those of the carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the sealant 160, the sealant 170, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260. Figure 2 The above is similar to what is shown, so I will not repeat it here.

[0098] Reference Fig. 9 , a passivation layer 130 is formed between the metal layer 120 and the first conductive pattern 152 (eg, the connecting portion 152-2). According to some embodiments of the present disclosure, the passivation layer 130 can isolate the metal layer 120 from the upper metal layer 140. The material of the passivation layer 130 can be, for example, an organic layer, an inorganic layer, or a combination thereof.

[0099] Continue to refer to Fig. 9 , an opening 130V is formed in the passivation layer 130 . According to some embodiments of the present disclosure, a subsequently formed metal layer 140 may fill the opening 130V so that the metal layer 120 is electrically connected to the metal layer 140 .

[0100] Reference Fig. 9 , a metal layer 140 is formed on the passivation layer 130. In some embodiments, the metal layer 140 may cover the passivation layer 130 and the opening 130V, and further fill the opening 130V to connect the metal layer 120. The material and formation method of the metal layer 140 may be similar to the material and formation method of the metal layer 120, and will not be repeated here. By setting two metal layers or multiple metal layers, the yield and reliability of the electronic device can be enhanced.

[0101] Reference Fig.10 , showing a cross-sectional schematic diagram of the completed electronic device 20. For simplicity, Figure 3 and Figure 4 step. For example, because the connection portion 152-2 is not surrounded by the frame glue 170, the film layer corresponding to the connection portion 152-2 (such as the substrate 110, the metal layer 120, the passivation layer 130, the metal layer 140) and the connection portion 152-2 generate wrinkles C, or further generate cracks F, resulting in the electronic device 20 being unable to effectively transmit electrode signals. Therefore, in the present disclosure, the metal layer 120 and the metal layer 140 can be provided as a mechanism to avoid failure of the electronic device. In this way, when, for example, the connection portion 152-2 cannot transmit the electrode signal, the electrode signal transmission can still be completed through the metal layer 120 and the metal layer 140 below the connection portion 152-2, which have higher ductility and are less prone to fracture.

[0102] Fig.11 is a top view of an electronic device according to another embodiment of the present disclosure. Figure 1, the first conductive pattern 152 further includes a protrusion 152-3 extending outward from the main body 152-1. In addition, the metal layer 120 may extend from below the connection portion 152-2 toward the protrusion 152-3, and extend to below the protrusion 152-3. The section of the metal layer 120 extending from below the connection portion 152-2 to below the protrusion 152-3 is not covered by the conductive layer 150. For example, when viewed from a top view, the metal layer 120 is disposed on at least a portion of the section below the connection portion 152-2 (including a section adjacent to the main body 152-1, a section adjacent to the flexible circuit 190, or a combination thereof), at least a portion of the section below the protrusion 152-3, and a section extending from the connection portion 152-2 to the protrusion 152-3. In some embodiments, the first conductive pattern 152 further includes a section (not shown) extending from the connecting portion 152-2 to the protruding portion 152-3, so that the metal layer 120 will be covered by the first conductive pattern 152 and will not be exposed to avoid oxidation of the metal layer 120. In some embodiments, the metal layer 120 may be U-shaped, but is not limited to this. Due to the setting of the protruding portion 152-3, the second conductive pattern 154 may further have an isolation portion 154-4 isolated from the circulation portion 154-1. The metal line 180 is also conformably arranged on the isolation portion 154-4 and on part of the circulation portion 154-1. From a top view, the isolation portion 154-4 is located between the connecting portion 152-2 and the protruding portion 152-3. Alternatively, the metal layer 120 under the protruding portion 152-3 may be laterally arranged between the circulation portion 154-1 and the isolation portion 154-4. In some embodiments, the second conductive pattern 154 may not have the isolation portion 154 - 4 , or the metal line 180 may not be disposed on the isolation portion 154 - 4 .

[0103] Fig.12 and Fig.13 is a cross-sectional schematic diagram of an electronic device 30 according to another embodiment of the present disclosure. It should be noted that, Fig.12 for Fig.11 The cross-sectional view obtained by the line segment D-D' of the carrier 100, the substrate 110, the metal layer 120, the conductive layer 150, the sealant 160, the sealant 170, the flexible printed circuit 190, the carrier 200, the substrate 210, the conductive layer 250, and the liquid crystal 260 are shown in FIG. Figure 2 The above is similar to what is shown, so I will not repeat it here.

[0104] Reference Fig.12, a metal layer 120 is formed between the substrate 110 and the first conductive pattern 152 (e.g., the protrusion 152-3). Compared with the connecting portion 152-2, the protrusion 152-3 extends from the main body 152-1 and is still surrounded by the frame glue 170. According to some embodiments of the present disclosure, the portion of the metal layer 120 located below the first conductive pattern 152 (e.g., the protrusion 152-3) can provide an additional path for the electrode signal to be transmitted to the lower electrode. In some embodiments, when viewed from a top view, the metal line 180 may include two portions, one on each side of the protrusion 152-3.

[0105] Reference Fig.13 , showing a cross-sectional view of the completed electronic device 30 along line segment D-D'. Figure 3 and Figure 4 Since the conductive layer 150 is surrounded by the sealant 170, the cross-sectional view of the conductive layer 150 along the line segment DD' does not have a wrinkle C. The cutting process can remove the sealant 170 and the portion outside the ring of the sealant 170. As a result, after the cutting process, the substrate 110 and the substrate 210 are cut flush.

[0106] Fig.14 is a top view of an electronic device according to another embodiment of the present disclosure. Fig.11 , in addition to the metal layer 120, the conductive layer 150 further includes a passivation layer 130 and a metal layer 140 below the connection portion 152-2. However, the metal layer 120 and the passivation layer 130 can extend from below the connection portion 152-2 to the new signal transmission path together, and pass directly below the circulation portion 154-1. The sections of the metal layer 120 and the passivation layer 130 extending outward from below the connection portion 152-2 are not covered by the conductive layer 150. In some embodiments, a metal layer 120 may be disposed between the substrate 110 and the connection portion 154-2. In some embodiments, a metal layer 120 is not disposed between the substrate 110 and the connection portion 154-3. In some embodiments, another metal layer (not shown) is further included, which is disposed on the passivation layer 130, wherein the other metal layer may be disposed corresponding to at least one of the connection portion 152-2, the connection portion 154-2, and the connection portion 154-3, but is not limited thereto.

[0107] Fig.15 and Fig.16 is a cross-sectional schematic diagram of an electronic device 40 according to another embodiment of the present disclosure. It should be noted that, Fig.15 for Fig.14 The cross-sectional view of the carrier 100, substrate 110, metal layer 120, conductive layer 150, sealant 160, sealant 170, metal wire 180, flexible printed circuit 190, carrier 200, substrate 210, conductive layer 250, and liquid crystal 260 is shown in FIG. Figure 7 The above is similar to what is shown, so I will not repeat it here.

[0108] Reference Fig.15 , a metal layer 120 is formed between the substrate 110 and the second conductive pattern 154 (e.g., the loop portion 154-1), and a passivation layer 130 is formed between the metal layer 120 and the second conductive pattern 154 (e.g., the loop portion 154-1). Compared with the connecting portion 152-2, the section of the metal layer 120 and the passivation layer 130 extending through the second conductive pattern 154 (e.g., the loop portion 154-1) is surrounded by the frame glue 170. According to some embodiments of the present disclosure, the section of the metal layer 120 extending through the loop portion 154-1 can provide an additional path for the electrode signal to be transmitted to the lower electrode, reduce the risk of failure of the electronic device 10, and improve the yield and reliability of the electronic device 10. In this embodiment, the passivation layer 130 is added to isolate the metal layer 120 from the metal wire 180 above, and protect the metal layer 120 from oxidation. Therefore, the loop portion 154-1 and the metal wire 180 on the same side as the connecting portion 152-2 do not need to be disconnected.

[0109] Reference Fig.16 , showing a cross-sectional schematic diagram of the completed electronic device 40. For simplicity, Figure 3 and Figure 4 Since the conductive layer 150 is surrounded by the sealant 170, the cross-sectional view of the conductive layer 150 along the line segment EE' does not have a wrinkle C. The cutting process can remove the sealant 170 and the portion outside the ring of the sealant 170. As a result, after the cutting process, the substrate 110 and the substrate 210 are cut flush.

[0110] During the manufacturing process of electronic devices, the substrate and other film layers on the substrate are prone to deformation (such as wrinkles), cracks, or even fractures, resulting in the inability to transmit electrode signals. The electronic device disclosed herein sets a metal layer between the flexible substrate and the conductive layer. Since the ductility of the metal layer is higher than that of other film layers on the substrate (such as the conductive layer), it is less likely to break during the manufacturing process, which helps to assist in transmitting electrode signals, reduce the risk of failure of the electronic device, and improve the yield and reliability of the electronic device.

[0111] The features of several embodiments are summarized above so that those skilled in the art can better understand the concepts of the embodiments of the present disclosure. Those skilled in the art should understand that other processes and structures can be easily designed or modified based on the embodiments of the present disclosure to achieve the same purposes and / or advantages as the embodiments introduced herein. Those skilled in the art should also understand that such equivalent structures do not deviate from the spirit and scope of the present disclosure, and various changes, substitutions and replacements can be made without violating the spirit and scope of the present disclosure.

Claims

1. An electronic device, comprising: a first substrate, wherein the first substrate is flexible; a second substrate, disposed corresponding to the first substrate, wherein the second substrate is flexible; A first conductive layer, disposed on the first substrate, comprises: A first conductive pattern, used for receiving a first electrode signal, and comprising a first bonding part; as well as a second conductive pattern, used for receiving a second electrode signal, and comprising a second connecting portion; a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and A first metal layer is disposed between the first substrate and at least one of the first connection portion and the second connection portion, and electrically connects at least one of the first connection portion and the second connection portion.

2. The electronic device according to claim 1, wherein: In a cross-sectional direction, a portion of the first substrate corresponding to at least one of the first connecting portion and the second connecting portion has a wrinkle.

3. The electronic device according to claim 1, wherein: The first connecting portion has a crack.

4. The electronic device according to claim 1, wherein: In a top-view direction, a portion of the first metal layer corresponding to at least one of the first connecting portion and the second connecting portion has a mesh structure. 5 . The electronic device as claimed in claim 1 , further comprising a seal disposed between the first conductive layer and the second conductive layer.

6. The electronic device as claimed in claim 1, wherein: The first conductive pattern further includes a protruding portion, and the first metal layer extends from below the first connecting portion to below the protruding portion.

7. The electronic device as claimed in claim 1, further comprising: a passivation layer disposed between the first metal layer and the first conductive layer, wherein the passivation layer has an opening; as well as A second metal layer is disposed between the passivation layer and at least one of the first connection portion and the second connection portion, wherein the second metal layer fills the opening and is electrically connected to the first metal layer.

8. An electronic device comprising: a first substrate; a second substrate, disposed corresponding to the first substrate; A first conductive layer, disposed on the first substrate, comprises: a first conductive pattern, used for receiving a first electrode signal, and comprising a first connecting portion; and a second conductive pattern, used for receiving a second electrode signal, and comprising a second connecting portion; a second conductive layer, disposed on the second substrate and electrically connected to the second conductive pattern; a first metal layer disposed between the first substrate and at least one of the first connecting portion and the second connecting portion; a passivation layer disposed on the first metal layer, wherein the passivation layer has an opening; and A second metal layer is disposed on the passivation layer, wherein the second metal layer fills the opening and is electrically connected to the first metal layer.

9. The electronic device as claimed in claim 8, characterized in that: The first conductive pattern further includes a protruding portion, and the first metal layer extends from below the first connecting portion to below the protruding portion of the first conductive pattern.

10. A method for manufacturing an electronic device, comprising: Providing a first carrier; Forming a first substrate on the first carrier, wherein the first substrate is flexible; Providing a second carrier board; forming a second substrate on the second carrier, wherein the second substrate is flexible; Combining the first substrate and the second substrate through a first frame glue and a second frame glue; removing the first carrier board; removing the second carrier board; and The second sealant is removed.

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