Immersion equipment and photoetching system

Abstract

The invention relates to immersion equipment and a photoetching system, and the immersion equipment comprises a base station, an immersion cover and an auxiliary part; the base station is used for placing a to-be-photoetched element; the immersion cover is arranged above the base station; the auxiliary part is arranged at the bottom of the immersion cover, and a hydrophobic coating is arranged on the auxiliary part; according to the immersion equipment disclosed by the invention, the auxiliary part is arranged at the bottom of the immersion cover, so that liquid in the photoetching process is positioned between the auxiliary part and the base station, and the auxiliary part is coated with the hydrophobic coating, so that after the liquid between the auxiliary part and the base station is discharged, the liquid is not easy to remain on the auxiliary part; the problem that the to-be-photoetched element and the base station are damaged due to the fact that residual liquid drips onto the to-be-photoetched element and the base station is solved; the photoetching system comprises the photoetching equipment and the immersion equipment, and the photoetching system disclosed by the invention solves the problem that the to-be-photoetched element and the base station are damaged due to the fact that residual liquid drips onto the to-be-photoetched element and the base station in the photoetching system by utilizing the hydrophobic characteristic of the auxiliary part of the immersion equipment.

Description

Technical Field

[0001] The present application relates to the technical field of photolithography machines, and in particular to immersion equipment and photolithography systems. Background Art

[0002] Photolithography is a commonly used manufacturing process that transfers the pattern on a mask onto the photosensitive material of the component to be photolithographically processed to manufacture integrated circuits.

[0003] The lithography system mainly includes a lithography device and an immersion device. The immersion device includes a body, a base and an immersion hood. The base and the immersion hood are both arranged on the body, and the immersion hood is located above the base. The lithography device can be arranged above the immersion device and is configured to guide light onto the element to be photolithographically placed on the base to transfer the pattern to the element to be photolithographic.

[0004] During use, the aforementioned photolithography system uses a liquid with a refractive index greater than 1 between the lithography apparatus, immersion hood, and base plate to improve the resolution of the solubility pattern transferred from the photomask to the photosensitive layer. This results in residual liquid remaining in the immersion hood after use. If this residual liquid drips onto the element being photolithographically processed, it may damage the pattern features on the element and negatively impact subsequent processing steps, leading to defects in the finished product. Furthermore, if this residual liquid drips onto the base plate, it can also damage the base plate, affecting its subsequent performance. Summary of the Invention

[0005] Based on this, it is necessary to provide an immersion device and a photolithography system to address the problem that the residual liquid is likely to damage the components to be photolithographically processed and the base.

[0006] An immersion device comprising:

[0007] A base for placing the components to be photoetched;

[0008] an immersion hood disposed above the base; and

[0009] An auxiliary component is arranged on a side of the immersion hood facing the base platform, and a hydrophobic coating is provided on a surface of the auxiliary component facing the base platform.

[0010] In one embodiment, a placement area for placing the element to be photolithographically processed is provided on the top surface of the base, and the orthographic projection of the auxiliary component on the base is arranged around the placement area.

[0011] In one embodiment, the orthographic projection area of ​​the auxiliary component on the immersion hood is equal to the area of ​​the bottom of the immersion hood.

[0012] In one embodiment, the auxiliary component is in the shape of a sheet.

[0013] In one embodiment, the surface of the auxiliary component facing the base is a smooth plane.

[0014] In one embodiment, the auxiliary component is made of silicon crystal material.

[0015] In one embodiment, the hydrophobic coating is a hexamethyldisilazane coating.

[0016] In one embodiment, the immersion hood is provided with a liquid inlet channel and a liquid outlet channel, and the auxiliary component is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid inlet channel, and the liquid outlet is communicated with the liquid outlet channel.

[0017] The above-mentioned immersion equipment, by arranging an auxiliary part at the bottom of the immersion hood, allows the liquid in the photolithography process to be located between the auxiliary part and the base. Since the auxiliary part is coated with a hydrophobic coating, after the liquid between the auxiliary part and the base is discharged, it is not easy for liquid to remain on the auxiliary part, thereby solving the problem of residual liquid damaging the component to be photolithography and the base due to dripping onto the component to be photolithography and the base.

[0018] A photolithography system comprises a photolithography apparatus and the immersion apparatus of any one of the above embodiments, wherein the photolithography apparatus is arranged above the immersion apparatus to carry out photolithography of an element.

[0019] In one embodiment, the immersion hood is provided with a working channel for the photolithography equipment to guide light onto the base, and the auxiliary component is provided with a through opening communicating with the working channel.

[0020] The above-mentioned photolithography system, by using an immersion device equipped with auxiliary parts, can utilize the hydrophobic properties of the auxiliary parts of the immersion device to solve the problem of residual liquid dripping onto the components to be photolithography and the base, thereby damaging the components to be photolithography and the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of the immersion equipment of some embodiments of the present application.

[0022] Figure 2 Schematic diagram of the structure of the lithography system of some embodiments of the present application.

[0023] Figure 3 Schematic diagram of multiple watermark tests of existing immersion equipment.

[0024] Figure 4 Schematic diagram of multiple watermark tests of an immersion device in some embodiments of the present application.

[0025] Figure 5 Schematic diagram of particle testing using existing immersion equipment.

[0026] Figure 6 Schematic diagram of a particle test using an immersion device according to some embodiments of the present application.

[0027] Reference numerals:

[0028] 1. Base; 2. Immersion hood; 3. Auxiliary parts; 4. Hydrophobic coating; 5. Photolithography equipment. DETAILED DESCRIPTION

[0029] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0031] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0032] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0033] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0035] Current photolithography systems include immersion photolithography systems and dry photolithography systems. Both immersion photolithography systems and dry photolithography systems have a photolithography apparatus for directing light onto the photosensitive layer of a semiconductor element to be photolithographically processed. In a dry photolithography system, only air is between the photolithography apparatus and the semiconductor element to be photolithographically processed. In an immersion photolithography system, the semiconductor element to be photolithographically processed is placed on a base of the immersion apparatus, which is filled with liquid. This creates a gap between the photolithography apparatus and the semiconductor element to be photolithographically processed, thereby improving the resolution of the solubility pattern transferred from the photomask to the photosensitive layer of the semiconductor element to be photolithographically processed. Because the resolution of the solubility pattern transferred to the photosensitive layer is related to the refractive index of the liquid used in the immersion photolithography process, the liquid used in immersion photolithography typically has a refractive index greater than 1.

[0036] After the immersion lithography system is used, residual liquid is likely to remain on the immersion hood of the immersion equipment. As the semiconductor element to be photolithography moves around, the residual liquid may remain on the element to be photolithography and is not removed from the element to be photolithography through the output pipe of the immersion equipment. The residual liquid may damage the features on the element to be photolithography (semiconductor substrate or wafer), and have a negative impact on future processing steps. In other words, if the residual liquid drips onto the element to be photolithography, it may damage the features on the element to be photolithography and have a negative impact on subsequent processing steps, leading to defects in the finished product. In addition, after the element to be photolithography is removed from the base, the residual liquid on the immersion hood may drip onto the base. If the residual liquid drips onto the base, it is also easy to damage the base, affecting the subsequent use of the base.

[0037] Therefore, an immersion device and a photolithography system are urgently needed to solve the above problems.

[0038] See Figure 1 One embodiment of the present application provides an immersion apparatus, comprising: a base 1, an immersion hood 2, and an auxiliary component 3. The base 1 is used to place an element to be photolithographically processed, and the immersion hood 2 is used to allow liquid to enter between the photolithographic apparatus 5 and the element to be photolithographically processed. The liquid between the photolithographic apparatus 5 and the element to be photolithographically processed improves the resolution of the solubility pattern transferred from the photomask to the photosensitive layer of the element to be photolithographically processed. The auxiliary component 3 is used to prevent residual liquid from accumulating in the immersion hood 2, thereby preventing damage to the element to be photolithographically processed and the base 1 due to residual liquid dripping onto the element to be photolithographically processed and the base 1.

[0039] In a specific configuration, the immersion hood 2 is positioned above the base 1. The immersion hood 2 can be positioned above the base 1 via a telescopic bracket (not shown), which allows for adjustment of the distance between the immersion hood 2 and the base 1. When the immersion apparatus is in use, the telescopic bracket can be used to first move the immersion hood 2 away from the base 1, allowing the operator to place the component to be photolithographically processed on the base 1. Once placed, the telescopic bracket can then be used to move the immersion hood 2 back over the base 1, allowing for subsequent liquid injection between the immersion hood 2 and the base 1. This ensures that liquid exists between the photolithographic apparatus 5, the immersion hood 2, and the component to be photolithographically processed, thereby improving the resolution of the solubility pattern transferred from the photomask to the photosensitive layer of the component to be photolithographically processed.

[0040] It can be understood that in the embodiment of the present application, the telescopic bracket is a bracket having a cylinder or an electric push rod.

[0041] The auxiliary component 3 is positioned on the side of the immersion hood 2 facing the base 1. A hydrophobic coating 4 is applied to the surface of the auxiliary component 3 facing the base 1. Specifically, the auxiliary component 3 is positioned between the base 1 and the immersion hood 2 and connected to the bottom of the immersion hood 2. The auxiliary component 3 has a bottom surface facing the base 1 and is coated with a hydrophobic coating 4. The volume of the hydrophobic coating 4 is preferably 0.5 cubic millimeters. The hydrophobic properties of the hydrophobic coating 4 prevent residual liquid from remaining on the auxiliary component 3 after the liquid between the immersion hood 2 and the base 1 is drained, thus preventing liquid from dripping onto the base 1 and the base 1.

[0042] Specifically, in one embodiment, a hydrophobic coating 4 is provided on both the top and bottom surfaces of the auxiliary member 3, and the top surface of the auxiliary member 3 is in contact with the bottom of the immersion hood 2. When liquid is injected into the immersion hood 2, the auxiliary member 3 faces the element to be photolithographically processed and the base 1, and liquid exists between the lithographic equipment 5, the auxiliary member 3, and the element to be photolithographically processed. When the liquid in the immersion hood 2 is drained, the hydrophobic coating 4 on the auxiliary member 3 prevents liquid residue from remaining on the auxiliary member 3, and thus prevents residual liquid from dripping onto the element to be photolithographically processed and the base 1.

[0043] In another embodiment, the auxiliary member 3 is provided with a hydrophobic coating 4 on both the top and bottom surfaces. The auxiliary member 3 is mounted on the bottom of the immersion hood 2 via a fixing bracket, with a gap between the top surface of the auxiliary member 3 and the bottom of the immersion hood 2. When liquid is injected into the immersion hood 2, the auxiliary member 3 faces the element to be photolithographically processed and the base 1, and liquid exists between the photolithographic apparatus 5, the immersion hood 2, the auxiliary member 3, and the element to be photolithographically processed. When the liquid in the immersion hood 2 is drained, the auxiliary member 3 is provided with the hydrophobic coating 4, so that liquid residue is unlikely to remain on the bottom surface of the auxiliary member 3, and thus, residual liquid is unlikely to drip onto the element to be photolithographically processed and the base 1. The top surface of the auxiliary member 3 can receive residual liquid that drips from the immersion hood 2, so that residual liquid on the immersion hood 2 will not drip onto the element to be photolithographically processed and the base 1. In addition, to ensure that residual liquid received by the auxiliary member 3 does not flow out, a groove can be provided on the top surface of the auxiliary member 3 to contain the dripping residual liquid.

[0044] Furthermore, in one embodiment, the auxiliary component 3 is fixedly connected to the immersion hood 2. In another embodiment, the auxiliary component 3 is detachably connected to the immersion hood 2. The fixed connection effectively ensures the stability between the auxiliary component 3 and the immersion hood 2, while the detachable connection facilitates maintenance and replacement of either the auxiliary component 3 or the immersion hood 2.

[0045] In one application scenario of the present application, the element to be photolithographically processed by the immersion equipment can be photographed and the photographed image can be viewed. If a large number of watermark defects appear in the image, it may indicate that a large amount of residual liquid has dripped onto the element to be photolithographic. Using the immersion equipment may easily damage the features on the element to be photolithographic, which will have a negative impact on future processing steps and may also easily cause damage to the base 1, affecting the subsequent use of the base 1.

[0046] After multiple comparative tests between the existing immersion equipment and the immersion equipment of the present application, the test results are as follows: Figure 3 and Figure 4 As shown, Figure 3 Schematic diagram of multiple watermark tests on a component to be photoetched after being processed by an existing immersion device. Figure 4 Schematic diagram of multiple watermark tests on a component to be photoetched after being processed by the immersion equipment of the present application. Figure 3 and Figure 4 The comparison shows that Figure 3 All five schematic diagrams have heavy watermark traces, and Figure 4 No obvious watermark traces were found in any of the six schematic diagrams.

[0047] In summary, it can be determined that the immersion equipment of the present application can solve the problem of residual liquid damaging the element to be photolithography and the base 1 due to dripping onto the element to be photolithography and the base 1 by providing an auxiliary component 3 with a hydrophobic coating 4.

[0048] See Figure 1 and Figure 2 When the immersion device of the present application is used, the element to be photolithographically processed can be placed on the base 1 first, and then the immersion hood 2 is covered on the upper side of the base 1, so that the auxiliary part 3 faces the element to be photolithographically processed and the base 1. Then, liquid is injected into the immersion hood 2 so that liquid exists between the photolithography device 5, the element to be photolithographically processed and the auxiliary part 3. Then, the photolithography device 5 is controlled to transfer the solubility pattern from the photomask to the photosensitive layer of the element to be photolithographically processed to form various features. The above-mentioned immersion device is provided with the auxiliary part 3 at the bottom of the immersion hood 2, so that the auxiliary part 3 replaces the bottom of the immersion hood 2 and faces the element to be photolithographically processed and the base 1. Since the auxiliary part 3 is coated with a hydrophobic coating 4, after the liquid between the auxiliary part 3 and the base 1 is discharged during the photolithography process, it is not easy for the auxiliary part 3 to retain liquid, and it is not easy for the residual liquid to drip onto the element to be photolithographically processed and the base 1, thereby solving the problem of residual liquid damaging the element to be photolithographically processed and the base 1 due to dripping onto the element to be photolithographically processed and the base 1.

[0049] See Figure 1 In one embodiment, a placement area for placing the component to be photolithographically processed is provided on the top surface of the base 1, and the orthographic projection area of ​​the auxiliary component 3 on the immersion hood 2 surrounds the placement area. In other words, the orthographic projection area of ​​the auxiliary component 3 on the base 1 is greater than or equal to the orthographic projection area of ​​the placement area on the base 1.

[0050] Specifically, a mounting base is provided on the top surface of the base 1, with the placement area located on the top surface of the mounting base. When the immersion apparatus is in use, the component to be photolithographically processed can be placed on the mounting base for securement. The orthographic projection area of ​​the auxiliary component 3 on the base 1 is greater than or equal to the orthographic projection area of ​​the mounting base on the base 1. This ensures that the auxiliary component 3 remains above the mounting base and faces the component to be photolithographically processed on the mounting base during operation of the immersion apparatus, preventing residual liquid from dripping onto the component.

[0051] Furthermore, a mounting base is slidably disposed on the top surface of the base 1 to drive the element to be photoetched to move on the base 1, so that the pattern can be transferred to a desired area of ​​the element to be photoetched. It will be appreciated that in an embodiment of the present application, an electric push rod connected to the mounting base can be provided on the base 1, and the electric push rod drives the mounting base to move on the base 1 to adjust the position of the element to be photoetched on the mounting base on the base 1.

[0052] In one embodiment, the orthographic projection area of ​​the auxiliary member 3 on the immersion hood 2 is equal to the area of ​​the bottom of the immersion hood 2. Since the larger the area of ​​the auxiliary member 3, the greater the coverage area of ​​the element to be photolithographically processed and the base 1, by making the orthographic projection area of ​​the auxiliary member 3 on the immersion hood 2 equal to the area of ​​the bottom of the immersion hood 2, the auxiliary member 3 can cover the element to be photolithographically processed and the base 1 to the greatest extent within the available space, thereby preventing residual liquid from dripping onto the element to be photolithographically processed and the base 1 and damaging them.

[0053] In one embodiment, the surface of the auxiliary part 3 facing the base 1 is a smooth plane. The smooth surface makes it easier to spray the hydrophobic coating 4 and makes it easier for the liquid to leave the smooth bottom surface sprayed with the hydrophobic coating 4, so that it is less likely for liquid to remain on the auxiliary part 3, thereby solving the problem of residual liquid damaging the element to be photolithography and the base 1 due to dripping onto the element to be photolithography and the base 1.

[0054] In one embodiment, the auxiliary member 3 is constructed in a sheet-like shape. Specifically, the top and bottom surfaces of the auxiliary member 3 are both planar. The bottom surface of the immersion hood 2 is also planar. The auxiliary member 3 is positioned on the bottom surface of the immersion hood 2, and the top surface of the auxiliary member 3 is in contact with the bottom surface of the immersion hood 2. The planar top surface facilitates contact between the top surface of the auxiliary member 3 and the bottom surface of the immersion hood 2. The flatter bottom surface also facilitates the escape of liquid from the smooth bottom surface coated with the hydrophobic coating 4, preventing residual liquid from remaining on the auxiliary member 3. This prevents residual liquid from dripping onto the component to be photolithographically processed and the base 1, potentially damaging the component to be photolithographically processed and the base 1.

[0055] In one embodiment, the auxiliary component 3 is made of silicon crystal material. Specifically, the auxiliary component 3 is made of silicon wafer.

[0056] After a finished component is removed from the base 1, the temperature of the base 1 drops rapidly. This requires the base 1 to be heated again before processing a new component, which not only increases processing time but also energy consumption. Therefore, by using a silicon wafer made of the same material as the component to be photoetched as the auxiliary component 3, the auxiliary component 3 can replace the component to be photoetched and contact the base 1 after the component is removed, slowing the temperature drop of the base 1.

[0057] In one embodiment, the hydrophobic coating 4 is a hexamethyldisilazane coating. When the auxiliary component 3 is made of silicon crystal material, hexamethyldisilazane is applied to the surface of the silicon crystal material and then heated in an oven. This reacts to form a compound mainly composed of siloxane on the surface of the silicon crystal material, successfully changing the surface of the silicon crystal material from hydrophilic to hydrophobic, making the auxiliary component 3 hydrophobic.

[0058] Furthermore, when an immersion lithography system is in use, dust, particles, or other contaminants are easily present on the immersion hood 2 and the base 1 of the immersion equipment. These dust, particles, or other contaminants may form images on the component being photolithographically processed, thereby affecting the quality of the finished product. The hexamethyldisilazane coating has a certain degree of adhesion, allowing the hexamethyldisilazane-coated auxiliary component 3 to adsorb dust, particles, or other contaminants on the immersion hood 2 and the base 1, thereby reducing the occurrence of defects.

[0059] In one application scenario of the present application, the element to be photolithographically processed by the immersion equipment can be photographed and the photographed image can be viewed. If there are many particle problems in the image, it may mean that there is a lot of dust, particles or other contaminants imaging on the element to be photolithographic. Using the immersion equipment may easily damage the features on the element to be photolithographic, which will have a negative impact on future processing steps.

[0060] After multiple comparative tests between the existing immersion equipment and the immersion equipment of the present application, the test results are as follows: Figure 5 and Figure 6 As shown, Figure 5 This is a schematic diagram of a particle test on a component to be photoetched after being processed by an existing immersion device. Figure 6 This is a schematic diagram of a particle test of a component to be photoetched after being processed by the immersion equipment of this application. Figure 5 and Figure 6 The comparison shows that Figure 5 There are more particle traces in the Figure 6 Has fewer grain traces.

[0061] In summary, it can be determined that the immersion equipment of the present application can adsorb dust, particles or other pollutants on the immersion hood 2 and the base 1 by providing the auxiliary component 3 with a hexamethyldisilazane coating, thereby reducing the occurrence of defects.

[0062] In one embodiment, the immersion hood 2 is provided with a liquid inlet channel and a liquid outlet channel, and the auxiliary component 3 is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid inlet channel, and the liquid outlet is communicated with the liquid outlet channel.

[0063] Specifically, the immersion hood 2 is provided with a liquid inlet channel for injecting liquid onto the component to be photolithographically processed, and the auxiliary component 3 is provided with a liquid inlet port connected to the liquid inlet channel, so that liquid can be injected into the component to be photolithographically processed through the liquid inlet channel and the liquid inlet port, ensuring that the provision of the auxiliary component 3 does not affect the liquid injection effect. The immersion hood 2 is provided with a liquid outlet channel for discharging the injected liquid, and the auxiliary component 3 is provided with a liquid outlet port connected to the liquid outlet channel, so that liquid can be discharged through the liquid outlet port and the liquid outlet channel, ensuring that the provision of the auxiliary component 3 does not affect the liquid discharge effect.

[0064] See Figure 2An embodiment of the present application further provides a lithography system, comprising a lithography device 5 and the immersion device of any of the above embodiments, wherein the lithography device 5 is arranged above the above immersion device and is configured to guide light onto the element to be photolithographically placed on the base 1.

[0065] Specifically, the photolithography apparatus 5 comprises a light source, a lens, and a photomask arranged in order from top to bottom. The immersion hood 2 provides a working channel for the photolithography apparatus 5 to direct light to the base 1. The auxiliary component 3 is provided with an opening communicating with the working channel. During use, the bottom of the photolithography apparatus 5 can be positioned within the working channel, and light from the light source is directed through the working channel and the opening to the element to be photolithographically processed.

[0066] When the lithography system of the present application is in use, by using an immersion device provided with an auxiliary part 3, the hydrophobic properties of the auxiliary part 3 of the immersion device can be utilized to solve the problem of residual liquid in the lithography system damaging the element to be photoetched and the base 1 due to dripping onto the element to be photoetched and the base 1.

[0067] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An immersion device, characterized in that: include: A base, used to place the components to be photolithographic; An immersion hood is disposed above the base; as well as An auxiliary component is arranged on a side of the immersion hood facing the base, and a hydrophobic coating is provided on a surface of the auxiliary component facing the base.

2. The immersion device according to claim 1, characterized in that A placement area for placing the element to be photoetched is provided on the top surface of the base, and the orthographic projection of the auxiliary component on the base is arranged around the placement area.

3. The immersion device according to claim 1, characterized in that The orthographic projection area of ​​the auxiliary component on the immersion hood is equal to the area of ​​the bottom of the immersion hood.

4. The immersion device according to claim 1, characterized in that The auxiliary component is in the form of a sheet.

5. The immersion device according to claim 1, characterized in that The surface of the auxiliary component facing the base is a smooth plane.

6. The immersion device according to claim 1, characterized in that The material of the auxiliary component includes silicon crystal material.

7. The immersion device according to claim 6, characterized in that The hydrophobic coating is a hexamethyldisilazane coating.

8. The immersion device according to claim 1, characterized in that The immersion hood is provided with a liquid inlet channel and a liquid outlet channel, and the auxiliary component is provided with a liquid inlet port and a liquid outlet port, the liquid inlet port is communicated with the liquid inlet channel, and the liquid outlet port is communicated with the liquid outlet channel.

9. A photolithography system, characterized in that: The invention comprises a photolithography device and an immersion device as claimed in any one of claims 1 to 8, wherein the photolithography device is arranged above the immersion device to carry out photolithography.

10. The photolithography system according to claim 9, characterized in that: The immersion hood is provided with a working channel for the photolithography equipment to guide light onto the base, and the auxiliary component is provided with a through opening communicating with the working channel.

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