Single-sided pin alloy resistor packaging equipment based on large substrate and production process thereof

Abstract

The invention provides single-sided pin alloy resistor packaging equipment based on a large substrate and a production process of the single-sided pin alloy resistor packaging equipment. The single-sided pin alloy resistor packaging equipment based on the large substrate comprises a machine body, a feeding sliding rail, a workbench and a packaging assembly, wherein the feeding sliding rail, the workbench and the packaging assembly are located on the machine body. The feeding sliding rail is used for driving the workbench to be close to or away from the packaging assembly. The packaging assembly comprises a distance adjusting support, a liquid injection pump and a coating frame, the distance adjusting support is used for driving the coating frame to be close to the workbench, a plurality of coating heads are arranged on the coating frame, and the liquid injection pump conveys insulating media to the coating heads. By means of the single-face pin alloy resistor packaging equipment machine production technology based on the large substrate, the badness caused by curing of an insulating medium in the alloy resistor production process is reduced.

Description

Technical Field

[0001] The invention relates to the field of resistor production, in particular to a single-sided pin alloy resistor packaging device based on a large substrate. Background Art

[0002] Figure 1 The substrate 20 is used to make a single-sided lead alloy resistor. The substrate 20 is a composite plate made of copper and a resistor alloy through a rolling process. The substrate 20 has a plurality of longitudinally extending grooves 21 and a plurality of rows of holes 22 spaced apart on the extending path of the grooves 21. The portion within the range of the dividing line 1 in the figure is a single-sided lead alloy resistor 23. The rows of holes 22 penetrate the substrate 20, forming a plurality of unconnected structures on the grooves 21, so that adjacent single-sided lead alloy resistors 23 are physically divided, so as to facilitate the adjustment of the alloy resistor and the testing of the resistance value before graining.

[0003] When preparing the single-sided lead alloy resistor 23, it is necessary to process the above-mentioned grooves 21 and holes 22 on the surface of the substrate 20, and fill the grooves 21 and holes 22 with insulating medium 24. After the insulating medium 24 is solidified, the structure of the substrate 20 is as follows: Figure 2 As shown, at this time, by cutting the substrate 20 along the dividing line 2, a single-sided lead alloy resistor 23 can be obtained.

[0004] In the existing process, the insulating medium 24 is filled into the groove 21 and the row of holes 22 by silk screen printing or glue injection. After filling, it is necessary to stand and bake to solidify the insulating medium 24. However, the groove 21 and the row of holes 22 have a certain depth. Bubbles are easily generated during the solidification process of the insulating medium 24, resulting in an incomplete insulating layer obtained by solidification. On the other hand, the depths of the groove 21 and the row of holes 22 are different, and the thickness of the insulating medium 24 filled therein is different. The thickness of the insulating medium 24 in the row of holes 22 is greater, so the solidification speed is lower than that of the insulating medium 24 in the groove 21. In addition, among the insulating medium 24 filled in the groove 21 and the row of holes 22, the solidification speed of the parts in contact with the substrate 20 and the peripheral parts is faster than that of the central position of the insulating medium 24. The difference in solidification speed leads to an uneven surface of the obtained insulating layer, and hollowing is easily generated in the insulating layer, resulting in poor resistance of the obtained alloy. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a single-sided pin alloy resistor packaging device based on a large substrate and a production process thereof, and reduce the defects caused by the solidification of the insulating medium during the production process of the alloy resistor.

[0006] The objective of the present invention is achieved through the following technical solutions:

[0007] A single-sided pin alloy resistor packaging device based on a large substrate comprises: a body and a feed slide rail, a workbench, and a packaging component located on the body;

[0008] The feed slide rail is used to drive the workbench to approach or move away from the packaging component;

[0009] The packaging assembly includes a spacing bracket, a liquid injection pump and a coating rack. The spacing bracket is used to drive the coating rack to approach the workbench. The coating rack is provided with a plurality of coating heads. The liquid injection pump transports insulating medium to the coating heads.

[0010] In one embodiment, the distance-adjustable bracket includes a lifting slide rail and a horizontal slide rail.

[0011] In one embodiment, the workbench includes a base, a movable seat, a heat conduction plate and a transmission module. The base is located on the feed slide rail, the transmission module is arranged in the base, the movable seat is arranged on the base, the transmission module is used to drive the movable seat to reciprocate in the horizontal direction, the heat conduction plate is arranged on the top of the movable seat, and a heating tube is arranged in the heat conduction plate.

[0012] In one embodiment, the transmission module includes a slider and a motor, a pulley, a first gear, a second gear, a rotating shaft, a connecting rod, and a track located in the base. The pulley and the first gear are both arranged on the rotating shaft. The first gear is meshed with the second gear. One end of the connecting rod is connected to the end surface of the second gear, and the other end of the connecting rod is connected to the slider. The connecting rod is used to pull the slider to reciprocate along the track, and the top of the slider is connected to the movable seat.

[0013] In one embodiment, a diameter of the first gear is smaller than a diameter of the second gear.

[0014] In one of the embodiments, an operation panel is provided on the body.

[0015] In one embodiment, the coating frame and the distance-adjusting bracket are detachably connected.

[0016] A production process of alloy resistors, based on the above-mentioned single-sided pin alloy resistor packaging equipment based on a large substrate, comprises the following steps:

[0017] Step 1: preparing a substrate by rolling copper and a resistance alloy;

[0018] Step 2: opening a plurality of grooves on the copper layer of the substrate, each of the grooves extending along the long side direction of the substrate;

[0019] Step 3: opening a plurality of rows of holes along the extending direction of the groove, wherein the extending direction of the rows of holes is perpendicular to the extending direction of the groove;

[0020] Step 4: Clamp the substrate on the heat conducting plate, and transfer it to the packaging assembly by the workbench;

[0021] Step 5: The adjustable distance bracket drives the coating head to extend into the row holes, and a layer of insulating medium is filled in the row holes. The movable seat drives the substrate to shake horizontally and heats the heat conducting plate at the same time until the insulating medium is solidified, and another layer of insulating medium is filled, and the cycle is repeated until the height of the insulating medium is flush with the bottom of the groove;

[0022] Step 6: The adjustable distance bracket drives the coating head to extend into the groove, and a layer of insulating medium is filled in the groove and the row of holes. The movable seat shakes horizontally again, and heats the heat conducting plate until the insulating medium is solidified, and another layer of insulating medium is filled, and the cycle is repeated until the groove and the row of holes are filled with insulating medium.

[0023] Step 7: cutting the substrate to obtain alloy resistor monomers.

[0024] Through the single-sided pin alloy resistor packaging equipment machine production process based on a large substrate, the defects caused by the solidification of the insulating medium in the alloy resistor production process can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 Schematic diagram of the distribution of grooves and rows of holes in the substrate;

[0027] Figure 2 It is a schematic diagram of the structure of the substrate after being filled with insulating medium;

[0028] Figure 3 It is a structural schematic diagram of a single-sided pin alloy resistor packaging device based on a large substrate;

[0029] Figure 4 It is a structural schematic diagram of the transmission module;

[0030] Figure 5 is a schematic cross-sectional view of a substrate;

[0031] Figure 6It is a schematic diagram of the structure of the substrate after the insulating medium is filled in the row holes in step 5;

[0032] Figure 7 for Figure 6 A schematic cross-sectional view of the substrate in the state shown;

[0033] Figure 8 A schematic diagram of the structure of the substrate after the holes and grooves are filled with insulating medium;

[0034] Fig. 9 for Figure 8 Schematic cross-sectional view of the substrate in the shown state. DETAILED DESCRIPTION

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0036] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0038] See also Figure 3 The present invention provides a single-sided lead alloy resistor packaging device 10 based on a large substrate, which includes: a body 100 and a feed slide rail 200, a workbench 300, and a packaging component 400 located on the body 100. When producing a single-sided lead alloy resistor, the substrate 20 is clamped on the workbench 300, and the packaging component 400 fills the groove 21 and the row of holes 22 of the substrate 20 with an insulating medium 24, and the insulating medium 24 is solidified thereon to form an insulating layer.

[0039] The feed slide rail 200 can drive the workbench 300 to approach or move away from the packaging component 400;

[0040] The packaging assembly 400 includes a spacing bracket 410, a liquid injection pump 420 and a coating rack 430. The coating rack 430 is provided with a plurality of coating heads 440. The liquid injection pump 420 delivers the insulating medium 24 to the coating heads 440. The spacing bracket 410 includes a lifting rail 411 and a horizontal rail 412, so that the spacing bracket 410 can drive the coating rack 430 to horizontally move and change the position of the coating head 440, so that the coating head 440 faces the groove 21 or the row of holes 22. The lifting rail 411 can drive the coating rack 430 to approach the workbench 300 to fill the insulating medium 24 on the substrate 20 thereon.

[0041] See also Figure 3 and Figure 4 The workbench 300 includes a base 310, a movable seat 320, a heat conducting plate 330 and a transmission module 340. The base 310 is located on the feed slide rail 200. The transmission module 340 is arranged in the base 310. The movable seat 320 is arranged on the base 310. The transmission module 340 is used to drive the movable seat 320 to reciprocate in the horizontal direction. The heat conducting plate 330 is arranged on the top of the movable seat 320. A heating pipe (not shown) is arranged in the heat conducting plate 330. The heat conducting plate 330 is used to carry the substrate 20, and after the insulating medium 24 is filled, the heating pipe in it starts heating to accelerate the curing efficiency of the insulating medium 24.

[0042] See also Figure 4 The transmission module 340 includes a slider 341 and a motor 342, a pulley 343, a first gear 344, a second gear 345, a rotating shaft 346, a connecting rod 347, and a track 348 located in the base 310. The pulley 343 and the first gear 344 are both arranged on the rotating shaft 346. The first gear 344 is meshed with the second gear 345. One end of the connecting rod 347 is connected to the end surface of the second gear 345, and the other end of the connecting rod 347 is connected to the slider 341. The connecting rod 347 is used to pull the slider 341 to reciprocate along the track 348. The top of the slider 341 is connected to the movable seat 320. The slider 341, the second gear 345, the connecting rod 347, and the track 348 cooperate to form a crank slider structure. When the motor 342 is started, the slider 341 can be driven to reciprocate on the track 348. The slider 341 is connected to the movable seat 320. Therefore, when the motor 342 is started, the movable seat 320 will be driven to shake horizontally, thereby shaking the insulating medium 24 filled in the groove 21 and the row of holes 22, thereby eliminating the bubbles generated when the heat conducting plate 330 dries the insulating medium 24, and making the insulating medium 24 filled in the groove 21 and the row of holes 22 smoother.

[0043] The diameter of the first gear 344 is smaller than the diameter of the second gear 345 , thereby reducing the speed.

[0044] An operation panel 110 is disposed on the body 100 , and a user controls the filling process of the insulating medium 24 through the operation panel 110 .

[0045] The coating rack 430 and the distance-adjusting bracket 410 are detachably connected. When producing resistors of different specifications, the corresponding coating rack 430 can be replaced, thereby improving the universality of the equipment and facilitating the maintenance of the coating head 440.

[0046] A production process of alloy resistors, based on the above-mentioned single-sided pin alloy resistor packaging device 10 based on a large substrate, comprises the following steps:

[0047] Step 1: Prepare the substrate 20 by rolling copper and a resistance alloy; the obtained substrate 20 has a copper layer and an alloy resistance layer.

[0048] Step 2: A plurality of grooves 21 are formed on the copper layer of the substrate 20, and each groove 21 extends along the long side direction of the substrate 20;

[0049] The grooves 21 are formed on the copper layer to expose the alloy resistor layer on the substrate 20. When adjusting the resistance, the remaining amount of the alloy resistor layer can be controlled by adjusting the depth of the grooves 21, thereby adjusting the resistance value. The grooves 21 are parallel to each other, and there are gaps between adjacent grooves 21.

[0050] Step 3: A plurality of rows of holes 22 are formed along the extending direction of the groove 21 , wherein the extending direction of the rows of holes 22 is perpendicular to the extending direction of the groove 21 ;

[0051] The row of holes 22 penetrates the substrate 20, dividing the groove 21 into several sections. The area between two adjacent rows of holes 22 on the same groove 21 is the prototype of the alloy resistor 23, as shown in FIG. Figure 1 As shown by the dividing line 1. After the holes 22 are opened, the prototype of the alloy resistor 23 needs to be adjusted to detect the resistance value of the prototype of the alloy resistor 23. If the resistance value is too large, the depth of the groove 21 can be further deepened; if the resistance value of the prototype of the alloy resistor 23 is too low, a bad mark is engraved.

[0052] Step 4: Clamp the substrate 20 onto the heat conducting plate 330 and transfer it to the packaging assembly 400 from the workbench 300;

[0053] Step 5: The adjustable bracket 410 drives the coating head 440 to extend into the row hole 22, and fills a layer of insulating medium 24 in the row hole 22. The movable seat 320 drives the substrate 20 to shake horizontally and heats the heat conducting plate 330 at the same time until the layer of insulating medium 24 solidifies, and then fills another layer of insulating medium 24, and the cycle continues until the height of the insulating medium 24 in the row hole 20 is flush with the bottom of the groove 21;

[0054] See also Figure 5 , Figure 6 and Figure 7, the filling action is divided into multiple times, each time only one layer of insulating medium 24 is filled in the row holes 22, and after filling, the substrate 20 is shaken to shake the insulating medium 24 evenly, so that it is evenly spread in the row holes 22, and ensure that the surface of the insulating layer is flat after solidification. While shaking the substrate 20, the heat conducting plate 330 bakes the insulating medium 24 to increase the solidification speed of the insulating medium 24. After the previous layer of insulating medium 24 is solidified, the next layer of insulating medium 24 is filled into the row holes 22, and the insulating medium 24 in the row holes 20 is stopped when the height of the insulating medium 24 in the row holes 20 is flush with the bottom of the groove 21;

[0055] Step 6: The adjustable bracket 410 drives the coating head 440 to extend into the groove 21, and fills a layer of insulating medium 24 in the groove 21 and the row holes 22. The movable seat 320 shakes horizontally again, and heats the heat conducting plate 330 until the layer of insulating medium 24 solidifies, and then fills another layer of insulating medium 24, and the cycle continues until the groove 21 and the row holes 22 are filled with insulating medium 24.

[0056] See also Figure 8 and Fig. 9 It should be emphasized that in step 5, the insulating medium 24 is first filled in the row holes 22, and the insulating layer formed after curing is flush with the bottom of the groove 21. Therefore, in step 6, the insulating medium 24 is coated in the groove 21 and the row holes 22, and the insulating layer formed after curing covers the groove 21 and the row holes 22, making the insulating layer continuous and flat.

[0057] Step 7: Cut the substrate 20 to obtain the alloy resistor 23 monomers.

[0058] along Figure 2 By cutting the substrate 20 along the dividing line 2 shown in the figure, a plurality of alloy resistors 23 can be obtained. At this time, these alloy resistors 23 need to be electroplated, tested, and sorted, and qualified products are packaged and shipped.

[0059] It should be noted that the insulating medium 24 is filled into the grooves 21 and the rows of holes 22 in a layered filling manner, where only one layer of insulating medium 24 is filled each time, and the substrate 20 is shaken by the movable seat 320 to form a thin layer of insulating medium 24 in the grooves 21 and the rows of holes 22. Since the amount of the filled insulating medium 24 is small, it can be quickly heated by the heat conducting plate 330 so that it can be quickly solidified, thereby improving the solidification efficiency of the insulating medium 24. At the same time, since the amount of the filled insulating medium 24 is small, bubbles are not easily generated during heating. Even if bubbles are generated and the insulating layer is hollowed out, the hollowed-out part can be filled in the next filling operation to ensure the integrity of the insulating layer and reduce poor alloy resistance caused by defects in the insulating layer.

[0060] It can be seen from steps 5 and 6 that the insulating medium 24 in the groove 21 and the row of holes 22 is filled separately, and a layered filling method is adopted. The amount of insulating medium 24 filled each time is consistent, and the curing speed is controllable, thereby avoiding the problem of inconsistent curing speed due to depth difference, and making the surface of the obtained insulating layer smooth.

[0061] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A single-sided lead alloy resistor packaging device based on a large substrate, characterized in that: include: A fuselage and a feed slide rail, a workbench, and a packaging assembly located on the fuselage; The feed slide rail is used to drive the workbench to approach or move away from the packaging component; The packaging assembly includes a spacing bracket, a liquid injection pump and a coating rack. The spacing bracket is used to drive the coating rack to approach the workbench. The coating rack is provided with a plurality of coating heads. The liquid injection pump transports insulating medium to the coating heads.

2. The single-sided lead alloy resistor packaging device based on a large substrate according to claim 1 is characterized in that: The distance-adjusting bracket comprises a lifting slide rail and a horizontal slide rail.

3. The single-sided lead alloy resistor packaging device based on a large substrate according to claim 1 is characterized in that: The workbench includes a base, a movable seat, a heat conduction plate and a transmission module. The base is located on the feed slide rail, the transmission module is arranged in the base, the movable seat is arranged on the base, the transmission module is used to drive the movable seat to reciprocate in the horizontal direction, the heat conduction plate is arranged on the top of the movable seat, and a heating tube is arranged in the heat conduction plate.

4. The single-sided lead alloy resistor packaging device based on a large substrate according to claim 3 is characterized in that: The transmission module includes a slider and a motor, a pulley, a first gear, a second gear, a rotating shaft, a connecting rod, and a track located in the base. The pulley and the first gear are both arranged on the rotating shaft. The first gear is meshed with the second gear. One end of the connecting rod is connected to the end surface of the second gear, and the other end of the connecting rod is connected to the slider. The connecting rod is used to pull the slider to reciprocate along the track. The top end of the slider is connected to the movable seat.

5. The single-sided lead alloy resistor packaging device based on a large substrate according to claim 4 is characterized in that: A diameter of the first gear is smaller than a diameter of the second gear.

6. The single-sided lead alloy resistor packaging device based on a large substrate according to claim 1, characterized in that: An operation panel is arranged on the machine body.

7. The single-sided lead alloy resistor packaging device based on a large substrate according to claim 1, characterized in that: The coating frame and the distance-adjusting bracket are detachably connected.

8. A production process of alloy resistors, based on the single-sided pin alloy resistor packaging equipment based on a large substrate as described in any one of claims 3 to 4, comprising the following steps: Step 1: preparing a substrate by rolling copper and a resistance alloy; Step 2: opening a plurality of grooves on the copper layer of the substrate, each of the grooves extending along the long side direction of the substrate; Step 3: opening a plurality of rows of holes along the extending direction of the groove, wherein the extending direction of the rows of holes is perpendicular to the extending direction of the groove; Step 4: Clamp the substrate on the heat conducting plate, and transfer it to the packaging assembly by the workbench; Step 5: The adjustable distance bracket drives the coating head to extend into the row holes, and a layer of insulating medium is filled in the row holes. The movable seat drives the substrate to shake horizontally and heats the heat conducting plate at the same time until the insulating medium is solidified, and another layer of insulating medium is filled, and the cycle is repeated until the height of the insulating medium is flush with the bottom of the groove; Step 6: The adjustable distance bracket drives the coating head to extend into the groove, and a layer of insulating medium is filled in the groove and the row of holes. The movable seat shakes horizontally again, and heats the heat conducting plate until the insulating medium is solidified, and another layer of insulating medium is filled, and the cycle is repeated until the groove and the row of holes are filled with insulating medium. Step 7: cutting the substrate to obtain alloy resistor monomers.

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