Processing method of packaging carrier plate

Abstract

The invention provides a processing method of a packaging carrier plate, which comprises the following steps: premixing a resin raw material and a functional component, monitoring the dynamic viscosity, and ensuring that the viscosity is within a preset viscosity range to obtain a prefabricated coating; the surface of a substrate is coated with the prefabricated coating, a release film is attached, and a pretreated carrier plate is obtained; placing the pretreated support plate in curing equipment, detecting the curing degree, and when the preset semi-curing degree is reached, stopping curing and cooling to obtain a support plate monomer; and carrying out vacuum lamination on the at least two carrier plate monomers to obtain the packaging carrier plate. Therefore, smooth continuous production is realized, stable product quality in large-scale production is ensured, and the production yield and the processing efficiency are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a processing method of a packaging carrier. Background Art

[0002] Vacuum bonding technology is widely used in semiconductor packaging. It mainly improves the quality of the bonding interface by removing air or other gases to ensure close bonding between multi-layer structures. In the multi-layer packaging process, if bubbles or gaps remain between layers, it may cause the following problems: reduced dielectric properties, impaired signal transmission, stress concentration between layers, and affect the mechanical strength of the package. By using vacuum bonding technology, the bonding materials can be more fully contacted and cured, thereby eliminating bubbles or gaps, improving the bonding strength between layers, and ensuring the consistency and reliability of the entire package.

[0003] However, during the vacuum bonding operation, if the fluidity of the bonding material is too high or too low, glue overflow or local gaps may occur under the vacuum bonding pressure, resulting in uneven interface thickness, affecting the bonding quality, and causing relative slippage or misalignment between the carriers. The interlayer accuracy after bonding cannot meet the process requirements, affecting the electrical performance, mechanical properties and packaging reliability of the multi-layer carrier, resulting in a decrease in the yield of the packaging carrier.

[0004] In the related art, bubbles are eliminated by post-processing, such as by mechanical extrusion or rolling to physically remove the interface bubbles. Although post-processing can improve the performance of the packaging substrate, it will add unnecessary processes, affect the processing continuity of the packaging substrate, and reduce the processing efficiency. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method for processing a packaging carrier, aiming to solve the problem of how to improve the yield and processing efficiency of the packaging carrier without affecting the processing continuity.

[0006] To solve the above technical problems, the present invention is implemented as follows. The present invention provides a method for processing a packaging carrier, the steps comprising: S1. Premixing the resin raw materials and functional components, monitoring the dynamic viscosity, ensuring that the viscosity is within a preset viscosity range, and obtaining a prefabricated coating; Step S1 includes: S1.1, place the resin raw material in a vacuum dryer, dry and mix; S1.2, placing the resin raw material in a mixing device, and then gradually adding the functional components, using a rheometer to monitor the dynamic viscosity to ensure that the viscosity is within the preset viscosity range, wherein the preset viscosity range is 100~500cP, and the mixing time is 20~30min; S1.3, transferring the kneaded mixture to a cooling device, and obtaining a prefabricated coating after cooling; S2, coating the prefabricated coating on the surface of the substrate and applying a release film to obtain a pretreated carrier; S3, placing the pretreated carrier in a curing device, and detecting the degree of curing, and when the predetermined semi-curing degree is reached, stopping the curing and cooling to obtain a carrier monomer; S4, vacuum bonding at least two of the carrier board monomers to obtain a packaging carrier board.

[0007] In some embodiments of the present invention, step S1 comprises: S1.1. Place the solid additives in the functional components in a vacuum dryer, dry and mix; S1.2, placing the resin raw material in a mixing device, and then gradually adding the additives in the functional components, using a rheometer to monitor the dynamic viscosity to ensure that the viscosity is within the preset viscosity range, wherein the preset viscosity range is 100~500cP, and the mixing time is 20~30min; S1.3, the kneaded mixture is transferred to a cooling device, and the prefabricated coating is obtained after cooling.

[0008] In some embodiments of the present invention, the resin raw material includes at least one of bisphenol A epoxy resin, glycidyl ether epoxy resin, and bismaleimide-triazine resin, and the functional component includes at least one of diethylenetriamine, toluene diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, and a silane coupling agent.

[0009] In some embodiments of the present invention, step S2 comprises: S2.1. Place the substrate in a plasma cleaning device, using a mixed gas of argon and oxygen as the working medium, and the processing time is 5 to 10 minutes to remove surface particles and organic pollutants, wherein the power density of the plasma cleaning device is set to 0.625 to 0.815 W / cm², and the flow ratio of argon and oxygen is 2 to 3:1; S2.2, place the prefabricated coating in a dynamic constant temperature device, maintain the temperature at 40-60°C for 10-15 minutes, and then use a vacuum degasser to stir for 5-10 minutes in a vacuum environment to remove bubbles; S2.3, placing the deaerated prefabricated coating on a coating device and coating the substrate surface at a speed of 1-3 m / min, the adjustment spacing of the coating device is 105-110% of the target thickness, and then performing leveling treatment in a low-vibration environment through a leveling device, the leveling time is 30-60s, and the surface inclination of the leveling device is controlled to be 1-3° to obtain a coating layer; S2.4. The release film is first subjected to low-temperature plasma treatment to remove surface contaminants, and the release film is evenly covered on the surface of the coating layer through an electrostatic film-sticking device to obtain a pretreated carrier, wherein the electrostatic field strength of the electrostatic film-sticking device is 20~25 kV / m.

[0010] In some embodiments of the present invention, the substrate includes at least one of glass, silicon, bismaleimide-triazine resin, polyimide, aluminum oxide, aluminum nitride, and silicon nitride.

[0011] In some embodiments of the present invention, the prefabricated coating comprises a marker, the amount of the marker added is 0.5-2.0 wt% of the weight of the prefabricated coating, and the marker is at least one of butanone, methyl isobutyl ketone, and solvent benzene; Step S3 includes: S3.1. Place the pre-treated carrier with the release film removed in a curing device at a curing temperature of 80 to 120°C. The curing device has a circulating hot air or infrared heating function, and the internal air flow rate of the curing device is maintained at 1 to 2 m / s. S3.2, obtaining concentration change data of the marker in the curing device, wherein a gas chromatograph or a volatile organic compound detection device is provided inside the curing device; S3.3. Record the curve of the change of the concentration of the marker over time. When the concentration of the marker meets the preset concentration range and reaches the preset semi-curing degree, stop the operation of the curing equipment, remove the pretreated carrier from the curing equipment, and perform low-temperature vacuum treatment for 10 to 15 minutes to obtain a carrier monomer.

[0012] In some embodiments of the present invention, step S3 includes: S3.1. Place the pretreated carrier with the release film removed in a curing device at a curing temperature of 80 to 120°C. The curing device has a circulating hot air or infrared heating function, and the air flow rate inside the curing device is 1 to 3 m / s. S3.2, obtaining the absorption peak intensity change data of the characteristic chemical bonds in the prefabricated coating, wherein the curing device is provided with an infrared spectrometer, and the infrared spectrometer is used to detect the absorption intensity of the characteristic chemical bonds; S3.3, record the change curve of the absorption intensity over time, calculate the curing reaction conversion rate through the absorption intensity, when the curing reaction conversion rate meets the preset range and reaches the preset semi-curing degree, stop running the curing equipment, remove the pretreated carrier from the curing equipment, and obtain the carrier monomer after cooling.

[0013] In some embodiments of the present invention, in step S3.3, the calculation formula of the curing reaction conversion rate is: ,in, is the curing reaction conversion rate, is the characteristic absorption peak intensity in the initial stage, is the characteristic absorption peak intensity at time t, where t is time.

[0014] In some embodiments of the present invention, step S4 includes: S4.1. Treat the surface of the carrier monomer using an electrostatic neutralization device to remove particles adsorbed by static electricity; S4.2, transferring the processed carrier monomer to the preparation chamber of the vacuum laminating machine, and preheating the carrier monomer; S4.3, transferring the carrier board monomers to the operating chamber of a vacuum laminating machine, injecting an inert atmosphere, laminating at least two of the carrier board monomers, and obtaining a packaging carrier board after light curing.

[0015] Compared with the prior art, the processing method of the packaging carrier in the present invention has the following beneficial effects: The semi-cured coating has appropriate viscosity and fluidity, and can fully adhere to the adjacent carrier surface, reduce the misalignment, bubble generation or delamination problems in the vacuum bonding process, reduce the rework rate, and improve production efficiency. Ensure the consistency and reliability of multi-layer carrier bonding. Precisely control the process parameters of the semi-curing degree so that the adhesion performance and fluidity of each carrier are consistent. The semi-curing control of the curing equipment is seamlessly connected with the subsequent vacuum bonding, avoiding the extra time consumption of cooling, storage or re-pretreatment, and realizing smooth continuous production, thereby ensuring the stability of product quality in large-scale production and improving production yield and processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic flow chart of a method for processing a packaging carrier in one embodiment of the present invention. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0018] Please refer to Figure 1 The present invention provides a method for processing a packaging carrier, the steps comprising: S1. Premixing the resin raw materials and functional components, monitoring the dynamic viscosity, ensuring that the viscosity is within a preset viscosity range, and obtaining a prefabricated coating; S2, coating the prefabricated coating on the surface of the substrate and applying a release film to obtain a pretreated carrier; S3, placing the pretreated carrier in a curing device and detecting the degree of curing. When the pre-set semi-curing degree is reached, curing is stopped and cooling is performed to obtain a carrier monomer; S4, vacuum bonding at least two carrier board monomers to obtain a packaging carrier board.

[0019] The semi-cured state refers to the cross-linking reaction in the coating to a certain extent, which not only has a certain mechanical strength and adhesion, but also maintains the necessary flexibility and fluidity to facilitate subsequent bonding. The release film provides protection in the semi-cured stage to prevent surface contamination, oxidation or over-curing of the coating, and helps maintain the stability of adhesion and fluidity.

[0020] The semi-cured coating has appropriate viscosity and fluidity, and can fully adhere to the adjacent carrier surface, reduce the misalignment, bubble generation or delamination problems in the vacuum bonding process, reduce the rework rate, and improve production efficiency. Ensure the consistency and reliability of multi-layer carrier bonding.

[0021] The semi-cured coating surface forms a good interface contact with the adjacent substrate, avoiding interface failure (such as debonding) caused by excessive curing or material migration and delamination caused by insufficient curing, optimizing the interface adhesion, improving the mechanical strength of the package substrate, ensuring that there is no residual stress or crack risk at the interlayer interface, and optimizing the overall structural uniformity of the substrate. The fluidity of the coating in a semi-cured state can fill microscopic defects (such as depressions or micropores) on the surface of the substrate, ensure the overall uniformity after multi-layer bonding, improve the appearance quality and sealing performance of the packaging substrate, avoid functional failures caused by surface unevenness, and enhance the service life of the packaging substrate.

[0022] The semi-cured coating is fully cured after lamination to form a stable multi-layer composite structure, which effectively prevents delamination, cracking or failure, improves heat resistance and chemical resistance, enhances the adaptability of the carrier to complex working environments, and achieves stability and repeatability of the production process.

[0023] In one embodiment, step S1 includes: S1.1. Place the resin raw materials in a vacuum dryer, dry and mix.

[0024] S1.2, placing the resin raw material in a mixing device, and then gradually adding the functional components, using a rheometer to monitor the dynamic viscosity, ensuring that the viscosity is within a preset viscosity range, wherein the preset viscosity range is 100-500 cP, for example, 100 cP, 300 cP, 500 cP, and the mixing time is 20-30 min, for example, 20 min, 25 min, 30 min. The specific structure of the mixing device is known to those skilled in the art and will not be described in detail here.

[0025] Gradually adding functional components can effectively avoid agglomeration or uneven dispersion caused by one-time addition, ensuring uniform distribution of each component in the coating. The dynamic viscosity is monitored in real time by a rheometer and controlled within the range of 100~500cP to ensure that the coating has suitable fluidity, facilitate subsequent coating operations, and improve the uniformity of the coating film. Control of the viscosity range can directly affect the coating thickness, curing uniformity, and final physical properties (such as adhesion, wear resistance, etc.) of the coating, improving the stability of the finished product quality. The mixing time is controlled at 20~30min to prevent local overheating of the material due to long-term mixing, which may cause degradation or premature cross-linking, and ensure the stability of the coating.

[0026] S1.3, transferring the kneaded mixture to a cooling device, and obtaining a prefabricated coating after cooling. The specific structure of the cooling device is known to those skilled in the art, and will not be described in detail here.

[0027] Timely cooling can inhibit premature reaction or cross-linking of heat-sensitive materials (such as thermosetting resins) after mixing, maintaining the processability of the coating. The cooled coating can quickly enter a stable state, avoiding chemical reactions or decomposition at high temperatures, and improving the shelf life and quality consistency of prefabricated coatings.

[0028] The viscosity and fluidity of the cooled coating are more stable, which facilitates uniform coating and operation in subsequent coating processes. The cooling process helps to reduce the residual stress that may be generated during the mixing process and improve the overall performance of the coating.

[0029] In one embodiment, step S2 includes: S2.1. Place the substrate in a plasma cleaning device, use a mixed gas of argon and oxygen as the working medium, and the processing time is 5 to 10 minutes, for example, 5 minutes, 8 minutes, and 10 minutes, to remove surface particles and organic pollutants, wherein the power density of the plasma cleaning device is set to 0.625 to 0.815 W / cm², for example, 0.625W / cm², 0.7W / cm², and 0.815W / cm², and the flow ratio of argon and oxygen is 2 to 3:1, for example, 2:1, 2.5:1, and 3:1. Plasma is a partially ionized state generated by high-energy excitation of gas (such as high-frequency electric field, microwave, etc.), containing electrons, ions, neutral particles, and excited molecules. When plasma acts on the surface of the material, high-speed moving ions or particles bombard the surface to remove pollutants or oxides. The plasma cleaning device includes a vacuum chamber, a gas supply system, a radio frequency / microwave power supply, a sample carrier, a control system, etc. The specific structure is known to those skilled in the art and will not be repeated here.

[0030] Plasma cleaning can effectively remove particles, organic pollutants and oxides on the surface of the substrate, improve the surface cleanliness of the substrate, and thus enhance the adhesion of the coating. Plasma mixed with oxygen and argon can form active groups (such as hydroxyl or carboxyl) on the surface of the substrate through surface etching and chemical oxidation, thereby enhancing the chemical bonding of the coating. Efficient cleaning and activation of the substrate surface can reduce the unevenness of the surface energy distribution and reduce the defects of subsequent coatings, such as pinholes, bubbles and other problems.

[0031] S2.2, placing the prefabricated coating in a dynamic constant temperature device, maintaining the temperature at 40-60°C for 10-15 minutes, for example, maintaining at 40°C for 15 minutes, 50°C for 13 minutes, and 60°C for 10 minutes, and then using a vacuum degasser to stir for 5-10 minutes in a vacuum environment, for example, 5 minutes, 8 minutes, and 10 minutes, to remove bubbles. The specific structure of the dynamic constant temperature device is known to those skilled in the art and will not be repeated here.

[0032] Dynamic constant temperature treatment makes the viscosity of the coating moderate, ensuring its excellent fluidity and flatness during the coating process, avoiding flow marks or unevenness. Vacuum degassing can eliminate tiny bubbles in the prefabricated coating, avoid pores or defects in the coating during the curing process, and improve the density and mechanical properties of the coating. Dynamic stirring combined with a constant temperature environment can further improve the dispersion effect of the functional components in the coating and enhance the functional consistency of the coating.

[0033] S2.3, the deaerated prefabricated coating is placed on the coating device and coated on the substrate surface at a speed of 1~3 m / min, for example, 1m / min, 2m / min, 3m / min, the adjustment spacing of the coating device is 105~110% of the target thickness, and then the leveling device is used for leveling treatment in a low vibration environment, the leveling time is 30~60s, for example, 30s, 40s, 60s, the surface inclination of the leveling device is controlled to 1~3°, for example, 1°, 2°, 3°, to obtain a coating layer. Among them, the target thickness can be 10~70 μm, the adjustment spacing of the coating device can be 105%, 108%, 110% of the target thickness, etc., the specific structure of the coating device is known to those skilled in the art, and will not be repeated here.

[0034] The spacing of the coating device is controlled to 105~110% of the target thickness, which can compensate for the thinning of the coating after leveling and ensure that the final coating thickness meets the design requirements. By controlling the inclination angle and low vibration environment of the leveling device, surface defects such as ripples and flow marks can be effectively eliminated to form a uniform, dense, and flawless coating layer. The coating speed is controlled at 1~3 m / min, combined with the leveling time and inclination optimization parameters, the consistency of coating performance in large-scale production can be achieved.

[0035] S2.4. The release film is first subjected to low-temperature plasma treatment to remove surface contaminants, and the release film is evenly covered on the surface of the coating layer through an electrostatic film-sticking device to obtain a pre-treated carrier. The electrostatic field strength of the electrostatic film-sticking device is 20~25kV / m, for example, 20 kV / m, 23 kV / m, 25 kV / m.

[0036] Low-temperature plasma treatment removes pollutants and electrostatically adsorbed particles on the surface of the release film, prevents contamination from being transferred to the surface of the coating layer, and maintains the high purity of the coating. The electrostatic film laminating device uses electric field adsorption to allow the release film to be evenly and wrinkle-freely covered on the surface of the coating layer, improving the integrity and lamination quality of the interface. Release film coverage can effectively isolate the coating layer from contact with the external environment, prevent the coating from secondary contamination or physical damage, and provide a stable surface state for subsequent processes.

[0037] The substrate includes at least one of glass, silicon, bismaleimide-triazine resin, polyimide, aluminum oxide, aluminum nitride, and silicon nitride.

[0038] Packaging technology has different requirements in different fields, and the selection of substrate materials must meet specific mechanical, electrical and thermal properties. The following is a specific application analysis of substrate materials in three packaging technologies: FCBGA, GLASS (glass) substrate, and FOPCP: FCBGA (Flip Chip Ball Grid Array) is a high-performance packaging technology that directly connects to the substrate through flip chips and then achieves electrical connection through solder balls. It is used to handle high-power and high-density chip interconnections, requiring the substrate to have excellent thermal properties, mechanical strength and low thermal expansion coefficient. Bismaleimide as a substrate material can provide thermal stability and low thermal expansion coefficient, polyimide as a substrate material can be used in high temperature or flexible areas, and aluminum oxide and aluminum nitride provide heat dissipation performance, which is suitable for high-power packaging.

[0039] Glass substrates are suitable for high-precision, high-density packaging applications (such as wafer-level packaging and optical packaging) due to their extremely low thermal expansion coefficient and high flatness. They are mainly used for thinning silicon wafer post-processing, micro-optical applications or for special circuit packaging. Glass is the main material used in glass substrate packaging and is suitable for high-frequency, high-precision chip packaging, such as millimeter wave, optical communication, etc. Its extremely low thermal expansion coefficient (about 3.2 ppm / °C) matches well with silicon chips, and its high dielectric properties make it suitable for high-frequency signal transmission. Its excellent flatness supports high-density wiring. Alumina can be used as an additional layer of glass substrates to improve thermal performance and enhance heat dissipation, making it suitable for high-power optical device packaging. Silicon nitride is used as a local strengthening layer of glass substrates to improve mechanical strength.

[0040] FOPCP (Fan-Out Panel-Level Packaging) is an advanced packaging technology that embeds chips into substrates and achieves high-density interconnection through panel-level processes. It is suitable for ultra-thin, miniaturized and multi-chip packaging.

[0041] Bismaleimide-triazine resin is used as substrate material for FOPCP substrate layer, providing high-density wiring and stable mechanical properties. Its low thermal expansion coefficient is suitable for multi-chip bonding, and its electrical properties are excellent and suitable for high-speed signal transmission.

[0042] Polyimide is used as a substrate material, and is used as the insulating layer or flexible area material of FOPCP. With good flexibility and heat resistance, it is suitable for areas that need to be bent in panel-level packaging, and provides stable dielectric properties.

[0043] Aluminum nitride as substrate material is suitable for high-power FOPCP packaging to improve thermal performance. High thermal conductivity and electrical insulation, suitable for high-power chip packaging.

[0044] Silicon is used as a substrate material to support high-density interconnections. Its thermal expansion coefficient is similar to that of the chip, which reduces thermal stress and has high strength and high flatness.

[0045] In one embodiment, the prefabricated coating includes a marker, and the amount of the marker added is 0.5-2.0wt% of the weight of the prefabricated coating, for example, it can be 0.5wt%, 1wt%, 2wt%, and the marker is at least one of butanone, methyl isobutyl ketone, and solvent benzene. The marker has volatility and clear concentration change characteristics, and can be used as a progress indicator of the curing reaction. By monitoring the change in the concentration of the marker, the semi-curing degree of the prefabricated coating can be accurately judged.

[0046] Step S3 includes: S3.1, placing the pre-treated carrier with the release film removed in a curing device, the curing temperature is 80-120°C, for example, 80°C, 90°C, 120°C, the curing device has a circulating hot air or infrared heating function, and the internal air flow rate of the curing device is 1-2 m / s, for example, 1m / s, 1.5m / s, 2m / s. The specific structure of the curing device is known to those skilled in the art and will not be described in detail here.

[0047] Through the circulating hot air or infrared heating function, heat can be evenly transferred to the surface and inside of the coating, accelerating the curing process of the prefabricated coating and ensuring uniform curing. Maintaining an air flow rate of 1~2 m / s can effectively remove volatiles, prevent volatiles from accumulating on the surface of the coating, and avoid local overheating or surface defects. Uniform heating and appropriate air flow rate optimize the curing environment, reduce energy waste, and improve production efficiency.

[0048] S3.2. Obtain the concentration change data of the marker in the curing device. The curing device is provided with a gas chromatograph or a volatile organic compound detection device.

[0049] Through gas chromatography or volatile organic compound detection device, the concentration change of markers is monitored in real time to provide data support to judge the degree of curing. The concentration change curve of the marker can reflect the dynamic process of solvent volatilization and resin reaction in the coating, thereby providing accurate curing status information. The uncertainty caused by the fixed curing time of the traditional coating is eliminated, and the curing degree of the coating is directly reflected by detecting the concentration of the marker. It avoids the degradation of material properties caused by over-curing, or the subsequent processing defects caused by insufficient curing, thereby improving the quality of the finished product.

[0050] Gas chromatography is an analytical method that separates and detects gas or volatile components. The separation is achieved based on the difference in the distribution of the sample between the gas mobile phase and the stationary phase (column packing or coating), and the separated components are then detected and quantified by the detector. The specific structure of the gas chromatography detector is known to those skilled in the art and will not be described here.

[0051] The volatile organic compound detection device is mainly based on gas sensing technology, and uses different detection principles (such as photoionization, electrochemistry or infrared absorption) to monitor the concentration of volatile organic compounds (VOCs) in the air in real time. Photoionization detection (PID): Use a high-energy ultraviolet lamp (can be 10.6 eV) to irradiate the air sample to stimulate the ionization of VOCs molecules and generate ion current. The size of the ion current is proportional to the concentration of VOCs. It has high sensitivity and is suitable for the detection of a variety of volatile organic compounds. Infrared absorption detection (IR): Based on the absorption of specific wavelengths of infrared light by VOCs molecules, the concentration is calculated by detecting the change in light absorption intensity. It is suitable for the detection of single or specific types of VOCs. Electrochemical detection: The chemical reaction of VOCs and electrode materials is used to generate electrical signals, and the signal intensity is related to the concentration. It is suitable for small portable detection devices. The specific structure of the above-mentioned equipment or devices is known to those skilled in the art and will not be repeated here.

[0052] S3.3. Record the curve of the change of the concentration of the marker over time. When the concentration of the marker meets the preset concentration range and reaches the preset semi-curing degree, stop running the curing equipment, remove the pretreated carrier from the curing equipment, and perform low-temperature vacuum treatment for 10 to 15 minutes, for example, 10 minutes, 13 minutes, and 15 minutes, to obtain a carrier monomer.

[0053] When the concentration of the marker reaches a preset range (such as complete volatilization or dynamic equilibrium), the curing equipment is stopped to ensure that the coating reaches the best semi-cured state, with appropriate fluidity and no adhesion. Precise control of the semi-curing degree ensures optimal adhesion and fluidity during subsequent vacuum bonding, reduces bonding defects (such as bubbles or warping), and improves the interface quality between packaging layers. After stopping the curing, low-temperature vacuum treatment can quickly stabilize the coating state and remove residual volatiles, providing stable substrate monomers for subsequent processes and avoiding performance differences between different batches of products.

[0054] Combined with actual production conditions and material characteristics, the preset concentration range can be set as follows: MEK (boiling point 79.6°C), initial concentration (at the beginning of curing): about 500~800 ppm, preset concentration range for semi-curing: 50~150 ppm. At this concentration, most of the MEK has volatilized, leaving only a small amount to maintain the processability and interface wettability of the coating.

[0055] Methyl isobutyl ketone (boiling point 116°C), initial concentration: about 300~600 ppm, preset concentration range for semi-curing degree: 30~100 ppm. Methyl isobutyl ketone evaporates slowly, and its lower target concentration ensures that the coating provides a certain mechanical stability while maintaining fluidity.

[0056] Solvent benzene (boiling point 80.1°C), initial concentration: about 600~1000 ppm, preset concentration range of semi-curing degree: 50~200 ppm. Due to the strong volatility of benzene, the target concentration is appropriately controlled in a lower range to reduce the interference of solvent residues on subsequent processes.

[0057] In another embodiment, step S3 comprises: S3.1. Place the pre-treated carrier with the release film removed in a curing device at a curing temperature of 80-120°C. The curing device has a circulating hot air or infrared heating function. The internal air flow rate of the curing device is maintained at 1-3 m / s. S3.2. Obtain the absorption peak intensity change data of the characteristic chemical bonds in the prefabricated coating. An infrared spectrometer is provided inside the curing equipment, and the infrared spectrometer is used to detect the absorption intensity of the characteristic chemical bonds.

[0058] By detecting the absorption peak intensity of characteristic chemical bonds (such as functional groups such as C=O, NH or OH), the infrared spectrometer can reflect the progress of the curing reaction and provide real-time data support. By monitoring the conversion rate of characteristic groups (such as the consumption of epoxy groups or the generation of amide bonds), the actual progress of the curing reaction can be directly quantified to avoid errors caused by insufficient time or temperature control. The non-contact detection method does not require sampling, avoiding material waste or performance loss that may be caused by traditional detection methods. Whether it is epoxy resin, polyurethane or other thermosetting materials, as long as the corresponding characteristic absorption peak is determined, it can be flexibly applied.

[0059] The resin raw material includes at least one of bisphenol A epoxy resin, glycidyl ether epoxy resin and bismaleimide-triazine resin, and the additives of the functional components include at least one of diethylenetriamine, toluene diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate and silane coupling agent.

[0060] During the curing process of the prefabricated coating in the packaging substrate, the changes in the absorption peak intensity of different groups can show the degree of semi-curing. The key lies in selecting characteristic chemical bonds that can directly reflect the progress of the curing reaction.

[0061] For example, COC (epoxy group) in bisphenol A epoxy resin in prefabricated coatings has an absorption peak frequency of 1250~1270 cm⁻¹ (epoxy tension vibration). The absorption peak frequency is used to indicate the position of the infrared absorption peak of the epoxy group (COC). During the curing reaction, the epoxy group (COC) gradually opens the ring and reacts with the curing agent (such as amine or hydroxyl) to form alcohols and cross-linked structures. In the semi-cured state, the absorption peak intensity of the epoxy group is partially weakened, but not completely disappeared, reflecting that some epoxy groups have reacted and some are still retained.

[0062] The N=C=O (isocyanate group) in isocyanate materials has an initial absorption peak frequency of 2270~2330 cm⁻¹ (stretching vibration of isocyanate N=C=O). During the curing process, the isocyanate group reacts with the hydroxyl or amine group to form polyurethane or polyurea. In the semi-cured state, the absorption peak of N=C=O is partially weakened, indicating that some isocyanate groups have reacted but have not completely disappeared.

[0063] Siloxy and silanol groups in silane coupling agents, Si-O-Si (silanol bond): 1000~1100 cm⁻¹ (silanol bond stretching vibration), Si-OH (silanol hydroxyl): 3500~3700 cm⁻¹ (silanol hydroxyl stretching vibration).

[0064] Si-OH condenses to form a Si-O-Si network structure during the curing process. In the semi-curing stage, the absorption peak of Si-O-Si gradually increases, while the absorption peak of Si-OH decreases, but does not disappear completely.

[0065] S3.3. Record the curve of absorption intensity changing with time, calculate the curing reaction conversion rate through the absorption intensity, when the curing reaction conversion rate meets the preset range and reaches the preset semi-curing degree, stop running the curing equipment, remove the pretreated carrier from the curing equipment, and obtain the carrier monomer after cooling.

[0066] By calculating the conversion rate of the curing reaction, it is ensured that the coating reaches the optimal semi-cured state, with sufficient mechanical strength and a certain fluidity to adapt to subsequent processing. The preset range of the curing reaction conversion rate is 50%~70%. The change curve of the absorption intensity provides complete dynamic information of the curing process, which helps to optimize process parameters (such as temperature, time, airflow rate) and improve production efficiency. When the curing conversion rate reaches the preset range, the equipment is stopped immediately to avoid problems such as over-curing causing the coating to become brittle or insufficient curing causing excessive viscosity, thereby ensuring the quality stability of subsequent processing (such as lamination or final curing). The carrier monomer obtained after cooling achieves consistency in physical properties (such as hardness, thickness uniformity) and chemical properties (such as surface adhesion), providing high-quality substrates for subsequent processes.

[0067] Specifically, in step S3.3, the calculation formula of the curing reaction conversion rate is: ,in, is the curing reaction conversion rate, is the characteristic absorption peak intensity in the initial stage, is the characteristic absorption peak intensity at time t, and t is time. and It is expressed as absorbance and is dimensionless.

[0068] In one embodiment, step S4 includes: S4.1. Use an electrostatic neutralization device to treat the surface of the carrier monomer to remove particles adsorbed by static electricity.

[0069] The electrostatic neutralization device uses a high-voltage electric field to ionize the air to generate positive and negative ions. The positive and negative ion flow emitted by the electrostatic neutralization device will neutralize the excess charge on the electrostatically charged surface. The electrostatic neutralization device can effectively remove the static charge on the surface of the carrier, thereby reducing particle contamination caused by electrostatic adsorption and avoiding interface defects (such as bubbles, gaps or delamination) caused by particles during the bonding process. Reduce surface particle impurities, improve the interface quality after bonding, and enhance the interlayer bonding strength. Avoid process defects caused by particle contamination, thereby reducing rework and scrap rates and improving packaging quality.

[0070] S4.2, transferring the processed carrier monomer to the preparation chamber of the vacuum laminating machine, and preheating the carrier monomer.

[0071] Preheating can soften the surface coating of the substrate monomer, reduce the viscosity of the coating, promote better contact between the two substrate monomers during bonding, and reduce the bonding time. Preheating can reduce the temperature difference between the substrate monomer and the bonding equipment, avoid thermal stress caused by temperature gradient during bonding, and thus improve stability after bonding. The coating has improved fluidity under heating conditions, making it easier to fill small gaps and form a denser bonding interface.

[0072] S4.3, transfer the carrier monomer to the operating chamber of the vacuum laminating machine, inject an inert atmosphere, laminate at least two carrier monomers, and obtain a package carrier after light curing. A photoinitiator may also be added to the prefabricated coating, such as 2-hydroxy-2-methylpropiophenone, benzoyl benzoate, phenyl ethanedione, etc., and the absorption wavelength may be 250-400 nm.

[0073] Operating in an inert atmosphere (such as nitrogen or argon) can effectively prevent the coating surface from being affected by oxidation or environmental pollution and affect the bonding quality, which is especially suitable for coatings or functional layers that are sensitive to the surface. The vacuum environment can remove gas and bubbles from the bonding interface, avoid stratification or insufficient bonding strength caused by residual bubbles, and ensure the uniformity of the packaging layer. During the light curing process, the cross-linking reaction of the coating further enhances the mechanical strength and chemical bonding between the layers, improving the overall performance and reliability of the packaging substrate. The vacuum bonding technology is suitable for multi-layer bonding of multiple substrate monomers, which helps to achieve high-density packaging and expand the application range of the product.

[0074] The specific structures of all the equipment or devices used in step S4 are known to those skilled in the art and will not be described in detail here.

[0075] When two carrier board monomers are bonded together, the coating layer of one carrier board monomer may be connected to the substrate of another carrier board monomer, or the coating layer of one carrier board monomer may be connected to the coating layer of another carrier board monomer.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for processing a packaging carrier, characterized in that the steps include: S1. Premixing the resin raw materials and functional components, monitoring the dynamic viscosity, ensuring that the viscosity is within a preset viscosity range, and obtaining a prefabricated coating; Step S1 includes: S1.1, place the resin raw material in a vacuum dryer, dry and mix; S1.2, placing the resin raw material in a mixing device, and then gradually adding the functional components, using a rheometer to monitor the dynamic viscosity to ensure that the viscosity is within the preset viscosity range, wherein the preset viscosity range is 100~500cP, and the mixing time is 20~30min; S1.3, transferring the kneaded mixture to a cooling device, and obtaining a prefabricated coating after cooling; S2, coating the prefabricated coating on the surface of the substrate and applying a release film to obtain a pretreated carrier; S3, placing the pretreated carrier in a curing device, and detecting the degree of curing, and when the predetermined semi-curing degree is reached, stopping the curing and cooling to obtain a carrier monomer; S4, vacuum bonding at least two of the carrier board monomers to obtain a packaging carrier board.

2. The method for processing a package carrier according to claim 1, characterized in that: The resin raw material includes at least one of bisphenol A epoxy resin, glycidyl ether epoxy resin, and bismaleimide-triazine resin, and the functional component includes at least one of diethylenetriamine, toluene diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, and a silane coupling agent.

3. The method for processing a package carrier according to claim 1, characterized in that: Step S2 includes: S2.

1. Place the substrate in a plasma cleaning device, using a mixed gas of argon and oxygen as the working medium, and the processing time is 5 to 10 minutes to remove surface particles and organic pollutants, wherein the power density of the plasma cleaning device is set to 0.625 to 0.815 W / cm², and the flow ratio of argon and oxygen is 2 to 3:1; S2.2, place the prefabricated coating in a dynamic constant temperature device, maintain the temperature at 40-60°C for 10-15 minutes, and then use a vacuum degasser to stir for 5-10 minutes in a vacuum environment to remove bubbles; S2.3, placing the deaerated prefabricated coating on a coating device and coating the substrate surface at a speed of 1-3 m / min, the adjustment spacing of the coating device is 105-110% of the target thickness, and then performing leveling treatment in a low-vibration environment through a leveling device, the leveling time is 30-60s, and the surface inclination of the leveling device is controlled to be 1-3° to obtain a coating layer; S2.

4. The release film is first subjected to low-temperature plasma treatment to remove surface contaminants, and the release film is evenly covered on the surface of the coating layer through an electrostatic film-sticking device to obtain a pretreated carrier, wherein the electrostatic field strength of the electrostatic film-sticking device is 20~25 kV / m.

4. The method for processing a package carrier according to claim 3, characterized in that: The substrate includes at least one of glass, silicon, bismaleimide-triazine resin, polyimide, aluminum oxide, aluminum nitride, and silicon nitride.

5. The method for processing a package carrier according to claim 1, characterized in that: The prefabricated coating comprises a marker, the addition amount of the marker is 0.5-2.0 wt% of the weight of the prefabricated coating, and the marker is at least one of butanone, methyl isobutyl ketone, and solvent benzene; Step S3 includes: S3.

1. Place the pre-treated carrier with the release film removed in a curing device at a curing temperature of 80 to 120°C. The curing device has a circulating hot air or infrared heating function, and the internal air flow rate of the curing device is maintained at 1 to 2 m / s. S3.2, obtaining concentration change data of the marker in the curing device, wherein a gas chromatograph or a volatile organic compound detection device is provided inside the curing device; S3.

3. Record the curve of the change of the concentration of the marker over time. When the concentration of the marker meets the preset concentration range and reaches the preset semi-curing degree, stop the operation of the curing equipment, remove the pretreated carrier from the curing equipment, and perform low-temperature vacuum treatment for 10 to 15 minutes to obtain a carrier monomer.

6. The method for processing a package carrier according to claim 1, characterized in that: Step S3 includes: S3.

1. Place the pretreated carrier with the release film removed in a curing device at a curing temperature of 80 to 120°C. The curing device has a circulating hot air or infrared heating function, and the air flow rate inside the curing device is 1 to 3 m / s. S3.2, obtaining the absorption peak intensity change data of the characteristic chemical bonds in the prefabricated coating, wherein the curing device is provided with an infrared spectrometer, and the infrared spectrometer is used to detect the absorption intensity of the characteristic chemical bonds; S3.3, record the change curve of the absorption intensity over time, calculate the curing reaction conversion rate through the absorption intensity, when the curing reaction conversion rate meets the preset range and reaches the preset semi-curing degree, stop running the curing equipment, remove the pretreated carrier from the curing equipment, and obtain the carrier monomer after cooling.

7. The method for processing a package carrier according to claim 6, characterized in that: In step S3.3, the calculation formula of the curing reaction conversion rate is: ,in, is the curing reaction conversion rate, is the characteristic absorption peak intensity in the initial stage, is the characteristic absorption peak intensity at time t, where t is time.

8. The method for processing a package carrier according to claim 1, characterized in that: Step S4 includes: S4.

1. Treat the surface of the carrier monomer using an electrostatic neutralization device to remove particles adsorbed by static electricity; S4.2, transferring the processed carrier monomer to the preparation chamber of the vacuum laminating machine, and preheating the carrier monomer; S4.3, transferring the carrier monomer to the operating chamber of a vacuum laminating machine, injecting an inert atmosphere, laminating at least two of the carrier monomers, and obtaining a packaging carrier after light curing.

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