Semiconductor wafer surface treatment equipment

Abstract

The invention relates to the technical field of semiconductor device manufacturing, in particular to semiconductor wafer surface treatment equipment which comprises a workbench, a cleaning box, a main shaft, a shaft seat, a material frame, a sub-driving mechanism and the like. A cleaning box is fixedly connected to the workbench, a main shaft is rotationally connected to the cleaning box, a material frame is rotationally connected to the main shaft through a shaft seat, a wafer to be cleaned is placed in the material frame, a sub-driving mechanism is installed on the workbench, the sub-driving mechanism can drive the main shaft to rotate slowly after being started, and after the wafer in the material frame is cleaned, the sub-driving mechanism can drive the material frame to rotate rapidly. According to the equipment, the sub-driving mechanism can drive the main shaft to rotate slowly, so that the main shaft drives the material frame to be immersed into the cleaning box for a long time, sufficient cleaning time is guaranteed, the material frame is in a static state during cleaning so as to prevent cleaning liquid from being splashed out, and when the material frame moves to the upper side of the main shaft, the cleaning liquid is not splashed out. And the sub-driving mechanism drives the material frame to quickly rotate so as to spin-dry the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device manufacturing, and in particular to a semiconductor wafer surface processing device. Background Art

[0002] Wafers are the basic materials used to manufacture semiconductor devices. They are usually round thin slices made of high-purity silicon. The preparation process requires multiple process steps such as slicing, grinding, and polishing. In order to ensure the cleanliness, chemical stability and physical integrity of the wafer surface, the surface of the wafer needs to be cleaned during the preparation process.

[0003] At present, wafers are usually placed in a special tray first, and then the tray with the wafers is placed in an ultrasonic cleaning tank for cleaning. After cleaning, workers will take out the tray and place the tray with the cleaned wafers in a spin dryer for drying.

[0004] A Chinese patent with patent announcement number CN116230588B discloses a continuous conveying cleaning method for semiconductor silicon wafers. The technical solution of this patent is only used for cleaning wafers.

[0005] A Chinese patent with patent announcement number CN117410214B discloses a wafer manufacturing post-cleaning spin drying device, and the technical solution of the patent is only used to spin dry the cleaned wafers.

[0006] Defects in the prior art: When the wafers need to be dried after cleaning, they need to be taken and placed and the workstations need to be moved, which increases the production process and the physical exertion of the workers. In addition, secondary contamination or unexpected situations may occur during the transfer process, increasing unknown risks. Summary of the invention

[0007] The present invention provides a semiconductor wafer surface treatment device, which can overcome the disadvantages of the prior art that when the wafer needs to be dried after cleaning, the wafer needs to be placed and the workstation needs to be transferred.

[0008] The technical solution of the present invention is: a semiconductor wafer surface processing equipment, including a workbench, a cleaning box, a spindle, a shaft seat, a material frame and a sub-drive mechanism, the workbench is fixedly connected to the cleaning box, the cleaning box is rotatably connected to the spindle, the spindle is rotatably connected to the material frame through the shaft seat, the material frame is used to place the wafers to be cleaned, and the workbench is installed with a sub-drive mechanism, which will drive the spindle to rotate slowly after being started, and when the wafers in the material frame are cleaned, the sub-drive mechanism will drive the material frame to rotate rapidly.

[0009] As a preferred technical solution of the present invention, the sub-drive mechanism includes a side support, a motor, a main gear, a sub-gear, a dehydration gear, an outer gear, an inner gear and an immersion gear. The side support is fixedly connected to the workbench, and the main gear and the sub-gear are coaxially rotatably connected to the side support. The motor for driving the main gear and the sub-gear to rotate is fixedly connected to the side support. The dehydration gear is fixedly connected to the material frame. During the rotation of the main shaft, the dehydration gear can engage with the sub-gear to drive the material frame to rotate rapidly. The side support is also coaxially fixed with an outer gear and an inner gear, and the main gear can engage with the outer gear during rotation. The immersion gear is connected to the main shaft, and the internal gear can engage with the immersion gear to drive the main shaft to rotate slowly.

[0010] As a preferred technical solution of the present invention, both the main gear and the internal gear are gears with missing teeth, and the diameter of the external gear is greater than the diameter of the main gear.

[0011] As a preferred technical solution of the present invention, it also includes a circular clamping mechanism for fixing the chip in the material frame, the circular clamping mechanism includes a circular clamping plate, a secondary spring and a circular clamping block, the material frame is slidably connected with the circular clamping plate, and the circular clamping plate slides radially, the guide rod of the circular clamping plate is sleeved with a secondary spring, and the circular clamping block for fixing the chip is fixedly connected to the circular clamping plate.

[0012] As a preferred technical solution of the present invention, it also includes an anti-slip mechanism for preventing the circular card plate from loosening when the wafer is spun dry. The anti-slip mechanism includes an anti-slip plate, a side spring and a stop plate. The material frame is slidably connected with the anti-slip plate. The anti-slip plate is used to limit the sliding of the circular card plate through the raised structure thereon to prevent the fixation of the wafer from loosening. The guide rod of the anti-slip plate is sleeved with a side spring, and the side support is fixedly connected with the stop plate. During the rotation of the main shaft, the stop plate will squeeze the anti-slip plate to limit the sliding of the circular card plate.

[0013] As a preferred technical solution of the present invention, it also includes an anti-collision mechanism to prevent the secondary gear and the dehydration gear from colliding. The anti-collision mechanism includes an anti-collision guide rod, an anti-collision spring, a support shaft and a locking assembly. Every three shaft seats are slidably connected in the same annular groove opened on the main shaft, and the three shaft seats are slidably connected with the anti-collision guide rod. The anti-collision guide rod is sleeved with an anti-collision spring for keeping the three shaft seats distributed in an annular array. The support shaft is fixedly connected to the main shaft, and the main shaft is rotatably connected to the cleaning box through the support shaft. The immersion gear is fixedly connected to the support shaft, and a locking assembly is installed on the main shaft. The locking assembly allows the secondary gear and the dehydration gear to engage normally by limiting the sliding of two of the shaft seats.

[0014] As a preferred technical solution of the present invention, the locking assembly includes a guide seat, a locking block, a small spring, a locking head, an unlocking plate and an unlocking rod. The main shaft is slidably connected to the locking block through the guide seat. Each locking block corresponds to an axle seat. A small spring is sleeved on the guide rod of the locking block. A locking head is fixedly connected to the axle seat. The locking block and the locking head are engaged with each other to limit the sliding of the axle seat. An unlocking plate is fixedly connected to the cleaning box. An unlocking rod is fixedly connected to the locking block. During the rotation of the main shaft, the unlocking plate squeezes the unlocking rod to disengage the locking block and the corresponding lock head.

[0015] As a preferred technical solution of the present invention, it also includes a material-removing mechanism for removing the chip, the material-removing mechanism includes a front support, a reversing shaft, a slide, a clamping plate and a handle, the front support is fixedly connected to the workbench, the front support is rotatably connected to the reversing shaft, the slide is fixedly connected to the reversing shaft, the slide is slidably connected to the clamping plate, a suction cup for sucking the chip is installed on the clamping plate, and a handle for easy grasping is fixedly connected to the guide rod of the clamping plate.

[0016] As a preferred technical solution of the present invention, the material picking mechanism also includes a material loosening rod and a pressure rod. The material loosening rod is fixedly connected to the clamping plate, and the pressure rod is fixedly connected to the circular clamping plate. The material loosening rod and the pressure rod are squeezed together to drive the circular clamping block and the chip out of contact.

[0017] As a preferred technical solution of the present invention, it also includes an upper bracket and a carrier plate for placing chips. Two sets of slides, clamping plates and handles are provided on the reversing shaft. The upper bracket is fixedly connected to the front support, and the carrier plate is fixedly connected to the upper bracket. The carrier plate cooperates with the clamping plate located on the upper side to support and place the chips to be cleaned.

[0018] Beneficial effects: 1. The drive mechanism in the device can drive the spindle to rotate slowly, so that the spindle drives the material frame to be immersed in the cleaning box for a long time, ensuring sufficient cleaning time, and the material frame is in a stationary state during cleaning to prevent the cleaning liquid from splashing out. When the material frame moves to the upper side of the spindle, the drive mechanism will drive the material frame to rotate quickly to spin the wafer dry, simplifying the production process and solving the shortcomings of the prior art that when the wafer needs to be dried after cleaning, it is necessary to take and place the wafer and transfer the workstation; 2. The auxiliary spring prevents the wafer from falling by pushing the circular clamping plate, which solves the technical difficulty of wires or pneumatic tubes being easily entangled when using the electric or pneumatic clamping method in the prior art, and reduces the difficulty of equipment installation on the basis of achieving the function; 3. The push plate can squeeze the anti-drop plate before the secondary gear and the dehydration gear mesh, so that the anti-drop plate is clamped on both sides of the clamping circular plate in advance to prevent the clamping circular plate from moving away from the wafer when the material frame rotates quickly, causing the wafer to fall off, so that the secondary spring can be set to a spring with a smaller elastic force, which is convenient for placing the wafer and can prevent the wafer from being clamped; 4. The unlocking plate squeezes the unlocking rod to switch one of the shaft seats to a slidable state, while the other two shaft seats remain locked, so that the anti-collision spring can provide a reset force for the shaft seat, which not only prevents the secondary gear and the dehydration gear from having a hard collision, but also ensures the meshing of the secondary gear and the dehydration gear; 5. The combination of the clamping plate and the carrier plate facilitates the placement of the wafers to be cleaned in advance, and the cleaned wafers and the wafers to be cleaned can be quickly taken out and placed by pushing and pulling the clamping plate, so that time can be fully utilized and the efficiency of cleaning the wafer surface is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0020] Figure 2 It is a schematic diagram of the cross-sectional structure of the cleaning box of the present invention.

[0021] Figure 3 It is a schematic diagram of the positional relationship between the side support and the front support of the present invention.

[0022] Figure 4 It is a schematic diagram of the position relationship of the circular clamping plate of the present invention.

[0023] Figure 5 It is a schematic diagram of the circular plate structure of the present invention.

[0024] Figure 6 It is a schematic diagram of the position relationship of the locking block of the present invention.

[0025] Figure 7 It is a schematic diagram of the position relationship of the lock head of the present invention.

[0026] Figure 8 Schematic diagram of the position relationship of the slide of the present invention.

[0027] The markings in the figure are: 10-workbench, 11-cleaning box, 12-spindle, 13-axle seat, 14-material frame, 20-side support, 21-motor, 22-main gear, 23-secondary gear, 24-dehydration gear, 25-external gear, 26-internal gear, 27-immersion gear, 30-card plate, 31-secondary spring, 32-card block, 33-support plate, 40-anti-slip plate, 41-side spring, 4 2-abut plate, 50-annular groove, 51-anti-collision guide rod, 52-anti-collision spring, 53-support shaft, 60-guide seat, 61-locking block, 62-small spring, 63-locking head, 64-unlocking plate, 65-unlocking rod, 70-front support, 71-reversing shaft, 72-slide, 73-clamping plate, 74-handle, 80-loosening rod, 81-pressure rod, 90-upper bracket, 91-carrying plate. DETAILED DESCRIPTION

[0028] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

[0029] Embodiment 1: A semiconductor wafer surface treatment device, such as Figure 1 and Figure 2 As shown, it includes a workbench 10, a cleaning box 11, a spindle 12, a shaft seat 13, a material frame 14 and a drive mechanism. The workbench 10 is fixedly connected with the cleaning box 11, and the cleaning box 11 is an ultrasonic cleaning machine in the prior art. The cleaning box 11 is rotatably connected with the spindle 12, and the cleaning box 11 is connected with the spindle 12. Figure 1 From the perspective of left to right in the figure, the main shaft 12 can only rotate counterclockwise. Figure 2 It can be seen that two groups of shaft seats 13 are symmetrically installed on the main shaft 12, each group of shaft seats 13 has three shaft seats, and the three shaft seats 13 are distributed in a circular array. Two opposite shaft seats 13 in the two groups are connected to a material frame 14 that rotates together. There are three material frames 14 in total. The material frame 14 is used to place wafers to be cleaned. A separate drive mechanism is installed on the workbench 10. After the separate drive mechanism is started, it will drive the main shaft 12 to rotate slowly, so that the wafers in the material frame 14 can be immersed in the cleaning liquid in the cleaning box 11, and when the material frame 14 rotates to the upper side of the main shaft 12, the separate drive mechanism will drive the material frame 14 to rotate quickly to spin the wafers dry.

[0030] When the surface of the chip needs to be cleaned, the chip is placed in the material frame 14 on the upper side, and then the sub-drive mechanism is started. The sub-drive mechanism drives the main shaft 12 to rotate slowly, and the main shaft 12 drives the material frame 14 and the chip to be immersed in the cleaning liquid in the cleaning box 11 through the shaft seat 13, so that the surface of the chip is cleaned by the ultrasonic cleaning machine. When one of the material frames 14 is about to rotate to the top of the main shaft 12, the sub-drive mechanism will start to drive the material frame 14 to rotate quickly, so as to spin dry the chip through centrifugal force. At the same time, the sub-drive mechanism will continue to drive the main shaft 12 to rotate slowly. After the material frame 14 rotates for a certain period of time, the sub-drive mechanism stops driving the material frame 14 to rotate, and then the chip that has been spun dry on the material frame 14 is taken out, and the chip to be cleaned is replaced.

[0031] like Figure 1-Figure 3 As shown, the drive mechanism includes a side support 20, a motor 21, a main gear 22, a secondary gear 23, a dehydration gear 24, an outer gear 25, an inner gear 26 and a water immersion gear 27. Figure 1 It can be seen that a side support 20 is fixedly connected to the right side of the top of the workbench 10, and the side support 20 is located on the right side of the cleaning box 11. A motor 21 is fixedly connected to the side support 20. Figure 3 It can be seen that the main gear 22 and the sub-gear 23 are coaxially connected to the side support 20, the output shaft of the motor 21 is fixedly connected to the rotating shafts of the main gear 22 and the sub-gear 23, and the main gear 22 is a gear with missing teeth. Figure 2It can be seen that the right end of the material frame 14 is fixedly connected to a dehydration gear 24. During the rotation of the main shaft 12, the dehydration gear 24 can mesh with the sub-gear 23 to drive the material frame 14 to rotate rapidly. Figure 3 It can be seen that the side support 20 is coaxially fixed with an outer gear 25 and an inner gear 26, the inner gear 26 is also a gear without teeth, the main gear 22 can mesh with the outer gear 25 during rotation, and the diameter of the outer gear 25 is larger than the diameter of the main gear 22. Figure 2 It can be seen in the figure that a submerged gear 27 is connected to the right side of the main shaft 12, and the internal gear 26 can mesh with the submerged gear 27 during rotation to drive the main shaft 12 to rotate slowly.

[0032] The side support 20 is located on the right side. Figure 1 From the perspective from left to right, when the motor 21 rotates, it will drive the main gear 22 and the sub-gear 23 to rotate rapidly counterclockwise in synchronization. Since the main gear 22 and the internal gear 26 are both gears without teeth, the main gear 22 will drive the main shaft 12 to rotate slowly counterclockwise through the external gear 25, the internal gear 26 and the immersion gear 27. When the material frame 14 is about to rotate to the top of the main shaft 12, the sub-gear 23 will begin to engage with the dehydration gear 24, and the sub-gear 23 will drive the dehydration gear 24 to rotate rapidly, thereby spinning the wafers through centrifugal force. Since the main shaft 12 continues to rotate, the dehydration gear 24 will gradually disengage from the sub-gear 23 to facilitate the removal of the wafers after spinning.

[0033] Embodiment 2: Based on embodiment 1, Figure 2 and Figure 4 As shown, it also includes a circular clamping mechanism for fixing the wafer in the material frame 14, the circular clamping mechanism is installed on the material frame 14, the circular clamping mechanism includes a circular clamping plate 30, a secondary spring 31, a circular clamping block 32 and a support plate 33, the material frame 14 is formed by two circular plates and two straight rods fixedly connected, the two circular plates are located on both sides of the straight rod, and the circular plates are rotatably connected to the shaft seat 13 on the same side, the two straight rods are slidably connected with the circular clamping plates 30, and the two ends of the circular clamping plates 30 pass through the circular plates of the material frame 14 and extend outward, from Figure 4 It can be seen that the circular card plate 30 is located on the opposite side of the two straight rods, and the circular card plate 30 slides radially. A secondary spring 31 is sleeved on the guide rod of the circular card plate 30. When the two circular card plates 30 move away from each other, the secondary spring 31 will be compressed. A plurality of circular card blocks 32 are fixedly connected at opposite ends of the two circular card plates 30 at equal distances. The circular card blocks 32 are provided with grooves for accommodating chips. The two opposite circular card blocks 32 cooperate to fix the chips. A support plate 33 is fixedly connected to the two circular plates. The support plate 33 is used to support the chips for easy placement.

[0034] When it is necessary to place a chip into the material frame 14, first push the two circular clamping plates 30 on the same material frame 14 to move away from each other, the auxiliary spring 31 will be compressed, and then place the chip between the two circular clamping plates 30 and the support plate 33. After placement, release the circular clamping plates 30, the auxiliary spring 31 will push the circular clamping plates 30 to move relative to each other, and the circular clamping blocks 32 will be clamped on both sides of the chip to prevent the chip from falling or being thrown out during the rotation of the main shaft 12 and the material frame 14. Although there are electric and pneumatic clamping methods in the prior art, wires or pneumatic tubes need to be arranged when used. In the present invention, the main shaft 12 and the material frame 14 will rotate independently, resulting in entanglement of the wires or pneumatic tubes, and the actual installation is difficult. Therefore, a circular clamping mechanism needs to be set to restrict the chip.

[0035] like Figure 1-Figure 5 As shown, it also includes an anti-slip mechanism for preventing the circular card plate 30 from loosening when the wafer is dried. The anti-slip mechanism is connected to the material frame 14. The anti-slip mechanism includes an anti-slip plate 40, a side spring 41 and a stop plate 42. Figure 2 and Figure 4 It can be seen that the right side of the material frame 14 is slidably connected to the anti-slip plate 40 along the axial direction, and the rotating shaft on the right side of the material frame 14 passes through the anti-slip plate 40 and is rotatably connected to the shaft seat 13. Figure 4 and Figure 5 It can be seen that the side of the anti-slip plate 40 close to the card circular plate 30 is provided with two protrusions, which are used to be clamped on the opposite sides of the two card circular plates 30. The guide rod of the anti-slip plate 40 is sleeved with a side spring 41. When the anti-slip plate 40 slides in the direction close to the card circular plate 30, the side spring 41 will be compressed. Figure 1 and Figure 3 It can be seen that a support plate 42 is fixedly connected to one side of the side support 20 close to the material frame 14, and Figure 3 It can be seen from the figure that one end of the abutment plate 42 is a curved surface, and during the rotation of the spindle 12 , the curved surface of the abutment plate 42 will squeeze the anti-slip plate 40 toward the direction of the clamping circular plate 30 .

[0036] In order to facilitate the pushing of the circular clamping plates 30 to move in opposite directions to place the wafer and prevent the wafer from being clamped, the elastic force of the auxiliary spring 31 cannot be too large. The elastic force is only enough to prevent the wafer from falling out of the material frame 14 during the slow rotation of the main shaft 12, so as to drive the wafer to be immersed in the cleaning box 11 normally. However, if the elastic force of the auxiliary spring 31 is not large, when the material frame 14 rotates quickly to dry the wafer, the two circular clamping plates 30 may move away from the wafer under the action of centrifugal force, thereby causing the wafer to be at risk of being thrown out. Therefore, an anti-slip mechanism is required to prevent the wafer from falling out when the auxiliary gear 23 and the dehydration gear 24 are about to engage. When the dehydration gear 24 and the sub-gear 23 are disengaged, the push plate 42 will gradually disengage from the anti-slip plate 40, and the side spring 41 will push the anti-slip plate 40 to reset in the direction away from the card plate 30, so as to facilitate the removal of the wafer after drying.

[0037] Embodiment 3: Based on embodiment 2, Figure 2 and Figure 6 As shown, it also includes an anti-collision mechanism to prevent the secondary gear 23 and the dehydration gear 24 from colliding. The anti-collision mechanism is connected to the shaft seat 13. The anti-collision mechanism includes an anti-collision guide rod 51, an anti-collision spring 52, a support shaft 53 and a locking assembly. Annular grooves 50 are provided on both sides of the main shaft 12. Every three shaft seats 13 slide in an annular groove 50, and the three shaft seats 13 are slidably connected with an anti-collision guide rod 51. The anti-collision guide rod 51 is circular, and an anti-collision spring 52 is provided between two adjacent shaft seats 13, and the anti-collision spring 52 is sleeved on the anti-collision guide rod 51. The anti-collision spring 52 is used to keep the three shaft seats 13 distributed in an annular array. Figure 2 It can be seen that the two ends of the main shaft 12 are fixedly connected with support shafts 53, and the main shaft 12 is rotatably connected to the cleaning box 11 through the support shaft 53. The immersion gear 27 is fixedly connected to the outer end of the right support shaft 53. A cavity for installing a locking assembly is reserved between the support shaft 53 and the main shaft 12. A locking assembly is installed at the right end of the main shaft 12. The locking assembly limits the sliding of two of the shaft seats 13 so that the sub-gear 23 and the dehydration gear 24 can engage normally.

[0038] like Figure 2 , Figure 6 and Figure 7 As shown, the locking assembly includes a guide seat 60, a locking block 61, a small spring 62, a lock head 63, an unlocking plate 64 and an unlocking rod 65. Figure 6 and Figure 7It can be seen that three guide seats 60 are fixedly connected to the right end of the main shaft 12 in an annular array, and a locking block 61 is slidably connected to each guide seat 60. The sliding direction of the locking block 61 is perpendicular to the axial direction of the main shaft 12, and each locking block 61 corresponds to an axle seat 13. A small spring 62 is sleeved on the guide rod of the locking block 61. When the locking block 61 slides in a direction away from the axle seat 13, the small spring 62 will be compressed, thereby Figure 7 It can be seen that a lock head 63 is fixedly connected to the right end of the shaft seat 13, and a groove is provided on the end of the locking block 61 facing the lock head 63, so that the lock head 63 can be stuck in the groove on the locking block 61 to limit the sliding of the shaft seat 13. Figure 2 It can be seen that the unlocking plate 64 is fixedly connected to the upper side of the cleaning box 11. Figure 6 The specific shape of the unlocking plate 64 can be seen in the figure. Each locking block 61 is fixedly connected to an unlocking rod 65. During the rotation of the main shaft 12, the unlocking plate 64 squeezes the unlocking rod 65 to disengage the locking block 61 and the corresponding lock head 63, so that the corresponding shaft seat 13 can slide normally.

[0039] Since the secondary gear 23 always maintains a relatively fast rotation speed, direct hard contact between the dehydration gear 24 and the secondary gear 23 may cause damage. Therefore, an anti-collision mechanism is required to prevent the secondary gear 23 and the dehydration gear 24 from having a hard collision, while ensuring the meshing of the dehydration gear 24 and the secondary gear 23; the small spring 62 is used to push the locking block 61 to be stuck on the lock head 63, so that the corresponding shaft seat 13 cannot slide. When the dehydration gear 24 is about to mesh with the secondary gear 23, the unlocking plate 64 will contact an unlocking rod 65 corresponding to the dehydration gear 24, and the unlocking plate 64 squeezes the unlocking rod 65 to make the corresponding locking block 61 away from the lock head 63, thereby One of the shaft seats 13 corresponding to the wheel 24 can slide to prevent hard collision, but the other two shaft seats 13 are in a locked state that cannot slide, so the anti-collision spring 52 can be compressed, and the anti-collision spring 52 applies a reset force to the shaft seat 13 through the elastic force, so that the dehydration gear 24 can mesh and rotate with the sub-gear 23. When the dehydration gear 24 and the sub-gear 23 are disengaged, the unlocking rod 65 will be out of contact with the unlocking plate 64. At this time, the small spring 62 can push the locking block 61 to reset, and the shaft seat 13 will be reset under the action of the anti-collision spring 52, so that the reset locking block 61 can be stuck on the lock head 63 of the corresponding shaft seat 13, thereby continuing to limit the sliding of the shaft seat 13.

[0040] Embodiment 4: Based on embodiment 3, Figure 3 and Figure 8As shown, it also includes a material taking mechanism for removing the wafer, which is installed on the workbench 10. The material taking mechanism includes a front support 70, a reversing shaft 71, a slide 72, a clamping plate 73 and a handle 74. The workbench 10 is fixedly connected to the front support 70, and the reversing shaft 71 is connected to the front support 70 in a damping rotation manner. The reversing shaft 71 cannot rotate at will through the damping effect. The reversing shaft 71 is fixedly connected to the slide 72, and the clamping plate 73 is slidably connected to the slide 72, and the sliding direction of the clamping plate 73 is perpendicular to the axial direction of the reversing shaft 71. A plurality of suction cups for adsorbing wafers are evenly spaced on the clamping plate 73. Figure 8 It can be seen that there are multiple protrusion structures at equal intervals on the clamping plate 73, which is a schematic suction cup structure. In the prior art, commonly used suction cups for clamping chips include vacuum suction cups, electrostatic suction cups and Bernoulli suction cups, and technicians can choose according to actual conditions. A handle 74 for easy grasping is fixed to the guide rod of the clamping plate 73.

[0041] like Figure 4 and Figure 8 As shown, the material taking mechanism also includes a material loosening rod 80 and a pressure rod 81. Figure 8 It can be seen that four loosening rods 80 are symmetrically fixed to the clamping plate 73, and an inclined surface is provided on the loosening rod 80 at one end away from the clamping plate 73. Figure 4 It can be seen that two compression rods 81 are symmetrically fixed to each circular clamping plate 30, and an inclined surface is provided on the end of the compression rod 81 away from the circular clamping plate 30. The loosening rod 80 is used to squeeze the compression rod 81 to drive the circular clamping block 32 to break contact with the wafer.

[0042] like Figure 3 and Figure 8 As shown, it also includes an upper bracket 90 and a carrier plate 91 for placing chips. Two groups of slides 72, clamping plates 73 and handles 74 are provided on the reversing shaft 71, and the two groups are symmetrical with each other. The upper bracket 90 is fixedly connected to the front support 70, and the carrier plate 91 is fixedly connected to the upper bracket 90. The carrier plate 91 cooperates with the clamping plate 73 located on the upper side to support and place the chips to be cleaned.

[0043] When the spindle 12 rotates to clean the wafers, the worker places the wafers to be cleaned on the clamping plate 73 on the upper side. The clamping plate 73 and the carrier plate 91 on the upper side can support the wafers so that the wafers will not fall down when the suction cups are not started. After the placement is completed, the suction cups on the clamping plate 73 are controlled to absorb the wafers. When one of the material frames 14 rotates to face the clamping plate 73 on the lower side, the motor 21 is stopped first, and the worker pushes the clamping plate 73 on the lower side close to the material frame 14 through the handle 74. The loosening rod 80 will squeeze the pressure rod 81 on both sides, so that the circular plate 30 moves away from each other to loosen the clamping of the wafers, and then the suction cups on the clamping plate 73 are controlled to absorb the dried wafers in the material frame 14. The worker then pulls back the clamping plate 73 to take the wafer out of the material frame 14. After pulling it back, the worker can place the tray for storing the wafers opposite the clamping plate 73 so that the suction cup on the clamping plate 73 stops adsorbing and the wafer can fall directly into the tray for easy transfer or storage. The reversing shaft 71 is then rotated 180 degrees clockwise to rotate the wafer placed on the upper side to the lower side, and the clamping plate 73 is pushed toward the material frame 14 to transport the wafer placed on the clamping plate 73 into the material frame 14. In the process of pulling back the clamping plate 73, the material release rod 80 will be out of contact with the pressure rod 81, so that the circular plate 30 can be reset under the push of the auxiliary spring 31 to prevent the wafer from falling out of the material frame 14.

[0044] Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solutions obtained by equivalent replacement or equivalent transformation shall fall within the protection scope of the present invention.

Claims

1. A semiconductor wafer surface treatment device, comprising a workbench (10) and a cleaning box (11), characterized in that: The invention also comprises a main shaft (12), a shaft seat (13), a material frame (14) and a drive mechanism. A cleaning box (11) is fixedly connected to the workbench (10). The cleaning box (11) is rotatably connected to the main shaft (12). The main shaft (12) is rotatably connected to the material frame (14) via the shaft seat (13). The material frame (14) is used to place wafers to be cleaned. The drive mechanism is installed on the workbench (10). When the drive mechanism is started, it drives the main shaft (12) to rotate slowly. When the wafers in the material frame (14) are cleaned, the drive mechanism drives the material frame (14) to rotate rapidly.

2. A semiconductor wafer surface processing device as claimed in claim 1, characterized in that: The drive mechanism comprises a side support (20), a motor (21), a main gear (22), a sub gear (23), a dewatering gear (24), an outer gear (25), an inner gear (26) and a water immersion gear (27); the side support (20) is fixedly connected to the workbench (10); the main gear (22) and the sub gear (23) are coaxially rotatably connected to the side support (20); the motor (21) for driving the main gear (22) and the sub gear (23) to rotate is fixedly connected to the side support (20); the material frame (14 ) is fixedly connected to a dehydrating gear (24), and during the rotation of the main shaft (12), the dehydrating gear (24) can mesh with the auxiliary gear (23) to drive the material frame (14) to rotate rapidly. The side support (20) is also coaxially fixedly connected to an external gear (25) and an internal gear (26), and during the rotation of the main gear (22), the main gear (22) can mesh with the external gear (25). The main shaft (12) is connected to a water immersion gear (27), and the internal gear (26) can mesh with the water immersion gear (27) to drive the main shaft (12) to rotate slowly.

3. A semiconductor wafer surface processing device as claimed in claim 2, characterized in that: The main gear (22) and the internal gear (26) are both gears with missing teeth, and the diameter of the external gear (25) is greater than the diameter of the main gear (22).

4. A semiconductor wafer surface processing equipment as claimed in claim 1, characterized in that: The invention also comprises a circular clamping mechanism for fixing the wafer in the material frame (14), the circular clamping mechanism comprising a circular clamping plate (30), a secondary spring (31) and a circular clamping block (32), the material frame (14) is slidably connected with the circular clamping plate (30), and the circular clamping plate (30) slides in the radial direction, the secondary spring (31) is sleeved on the guide rod of the circular clamping plate (30), and the circular clamping block (32) for fixing the wafer is fixedly connected to the circular clamping plate (30).

5. A semiconductor wafer surface processing equipment as claimed in claim 4, characterized in that: The invention also includes an anti-slipping mechanism for preventing the circular card plate (30) from loosening when the wafer is spun dry. The anti-slipping mechanism includes an anti-slipping plate (40), a side spring (41) and a stop plate (42). The material frame (14) is slidably connected with the anti-slipping plate (40). The anti-slipping plate (40) is used to limit the sliding of the circular card plate (30) through a protruding structure thereon to prevent the fixation of the wafer from being loosened. The guide rod of the anti-slipping plate (40) is sleeved with a side spring (41). The stop plate (42) is fixedly connected to the side support (20). During the rotation of the main shaft (12), the stop plate (42) will squeeze the anti-slipping plate (40) to limit the sliding of the circular card plate (30).

6. A semiconductor wafer surface processing equipment as claimed in claim 2, characterized in that: The invention also includes an anti-collision mechanism for preventing the secondary gear (23) and the dehydration gear (24) from colliding. The anti-collision mechanism includes an anti-collision guide rod (51), an anti-collision spring (52), a support shaft (53) and a locking assembly. Every three shaft seats (13) are slidably connected in the same annular groove (50) opened on the main shaft (12), and the three shaft seats (13) are slidably connected with the anti-collision guide rod (51). The anti-collision guide rod (51) is sleeved with an anti-collision spring (52) for keeping the three shaft seats (13) distributed in an annular array. The support shaft (53) is fixedly connected to the main shaft (12). The main shaft (12) is rotatably connected to the cleaning box (11) through the support shaft (53). The immersion gear (27) is fixedly connected to the support shaft (53). The main shaft (12) is installed with a locking assembly. The locking assembly allows the secondary gear (23) and the dehydration gear (24) to mesh normally by limiting the sliding of two of the shaft seats (13).

7. A semiconductor wafer surface processing equipment as claimed in claim 6, characterized in that: The locking assembly comprises a guide seat (60), a locking block (61), a small spring (62), a locking head (63), an unlocking plate (64) and an unlocking rod (65). The main shaft (12) is slidably connected to the locking block (61) through the guide seat (60). Each locking block (61) corresponds to an axle seat (13). The guide rod of the locking block (61) is sleeved with a small spring (62). The axle seat (13) is fixedly connected to the locking head (63). The locking block (61) and the locking head (63) are engaged with each other to limit the sliding of the axle seat (13). The cleaning box (11) is fixedly connected to the unlocking plate (64). The locking block (61) is fixedly connected to the unlocking rod (65). When the main shaft (12) rotates, the unlocking plate (64) presses the unlocking rod (65) to disengage the locking block (61) and the corresponding locking head (63).

8. A semiconductor wafer surface processing equipment as claimed in claim 3, characterized in that: The invention also includes a material taking mechanism for removing the wafer, the material taking mechanism includes a front support (70), a reversing shaft (71), a slide (72), a clamping plate (73) and a handle (74), the front support (70) is fixedly connected to the workbench (10), the reversing shaft (71) is rotatably connected to the front support (70), the reversing shaft (71) is fixedly connected to the slide (72), the clamping plate (73) is slidably connected to the slide (72), a suction cup for sucking the wafer is installed on the clamping plate (73), and a handle (74) for easy grasping is fixedly connected to the guide rod of the clamping plate (73).

9. A semiconductor wafer surface processing device as claimed in claim 8, characterized in that: The material taking mechanism also includes a material loosening rod (80) and a pressure rod (81). The material loosening rod (80) is fixedly connected to the clamping plate (73), and the pressure rod (81) is fixedly connected to the circular clamping plate (30). The material loosening rod (80) and the pressure rod (81) are pressed together to drive the circular clamping block (32) to break contact with the wafer.

10. A semiconductor wafer surface processing device as claimed in claim 9, characterized in that: It also includes an upper bracket (90) and a carrier plate (91) for facilitating the placement of wafers. Two sets of slides (72), a clamping plate (73) and a handle (74) are provided on the reversing shaft (71). The upper bracket (90) is fixedly connected to the front support (70). The upper bracket (90) is fixedly connected to the carrier plate (91). The carrier plate (91) cooperates with the clamping plate (73) located on the upper side to support and place the wafer to be cleaned.

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