Pressure oven based on semiconductor packaging automation

Abstract

The invention discloses a semiconductor packaging automation-based pressure oven, which comprises a pressure oven main body, the pressure oven main body comprises an outer oven body, a heating mechanism, a nitrogen module and a pressure module, the outer oven body is internally provided with an inner baking and pressing cavity and an assembly cavity, and the nitrogen module and the pressure module are configured in the assembly cavity; the heating mechanism is arranged in the inner baking and pressing cavity, a controller is arranged on the front portion of the outer baking oven body, and the nitrogen module and the pressure module are communicated with the inner baking and pressing cavity. According to the pressure oven based on semiconductor packaging automation, the heating mechanism, the nitrogen module and the pressure module can be heated through the controller, glue for semiconductor packaging is made to stand and be cured, and switching between low vacuum and high pressure at any time is achieved through the pressure module; the glue can be filled into welding gaps and the peripheries of elements which are easy to pollute as much as possible, cavities and bubbles of the glue are reduced, the quality and the reliability of products are integrally improved, and the yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging devices, and more particularly to a pressure oven based on semiconductor packaging automation. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips through the dicing process, and then the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resins to form the required circuits, and the outer ring of the chips is glued to ensure the firmness of the chips, and then the independent chips are encapsulated and protected by injection molding resin shells.

[0003] The Chinese invention patent with application number CN201810777963.0 discloses an oven for encapsulating semiconductor components and a method of using the oven, including a baking part, a driving part is provided on the upper part of the baking part, and four groups of elastic units are symmetrically provided at the bottom of the baking part, and the bottoms of the four groups of elastic units are all equipped with universal wheels. The present invention can realize the baking of semiconductor components in the packaging process by using different temperatures in layers, and can avoid the semiconductor components being contaminated by dust when being transferred from a low-temperature oven to a high-temperature oven, thereby ensuring the packaging quality of the semiconductor components. It can replace traditional low-temperature ovens and high-temperature ovens, and can effectively save the procurement cost of enterprises. It can save the process of transferring semiconductor components from a low-temperature oven to a high-temperature oven, which can not only reduce the labor intensity of workers, but also improve the packaging efficiency of semiconductor components. In addition, it has good shock absorption performance, and is easy to move and use, which is worthy of promotion and popularization.

[0004] However, the oven in the above technical solution mainly focuses on baking semiconductor components in layers using different temperatures during the packaging process. The influence of pressure is not considered during the semiconductor packaging process, which will inevitably lead to voids and bubbles in the glue during the curing process, thereby affecting the quality and performance and reducing the yield rate. Therefore, it is necessary to propose a pressure oven based on semiconductor packaging automation to at least partially solve the problems existing in the prior art. Summary of the invention

[0005] A series of simplified concepts are introduced in the Summary of the Invention, which will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0006] In order to at least partially solve the above problems, the present invention provides a pressure oven based on semiconductor packaging automation, comprising: a pressure oven body, the pressure oven body comprising an outer oven body, a heating mechanism, a nitrogen module, and a pressure module, the outer oven body having an inner baking pressure cavity and an assembly cavity, the nitrogen module and the pressure module being arranged in the assembly cavity, the heating mechanism being arranged in the inner baking pressure cavity, a controller being arranged at the front of the outer oven body, and the nitrogen module and the pressure module being respectively connected to the inner baking pressure cavity, and the heating mechanism, the nitrogen module, and the pressure module being respectively electrically connected to the controller.

[0007] According to the pressure oven based on semiconductor packaging automation according to an embodiment of the present invention, the pressure module includes a vacuum pressure part and a boost pressure part, both of which are arranged in the assembly cavity, and the vacuum pressure part and the boost pressure part are electrically connected to the controller respectively.

[0008] According to the pressure oven based on semiconductor packaging automation according to the embodiment of the present invention, a pushing rack is arranged in the inner baking pressure chamber, and the pushing rack is used for pushing the workpiece rack.

[0009] According to the pressure oven based on semiconductor packaging automation according to the embodiment of the present invention, the pushing rack includes a pushing main support seat, a side support seat, a plurality of pushing rotating rods and a pushing power unit, the side support seat is arranged on one side of the pushing main support seat, the plurality of pushing rotating rods are arranged between the pushing main support seat and the side support seat, and the pushing power unit is arranged at the bottom of the pushing main support seat, the pushing power unit is rotatably connected to the pushing rotating rod, and the pushing rotating rod can push the workpiece rack to move.

[0010] According to the pressure oven based on semiconductor packaging automation according to an embodiment of the present invention, a limiting mechanism is also arranged on the main pushing support seat, and the limiting mechanism includes a limiting seat and a vertical limiting frame. The limiting seat is arranged on the side wall of the main pushing support seat, and the vertical limiting frame is arranged on the limiting seat.

[0011] According to the pressure oven based on semiconductor packaging automation according to an embodiment of the present invention, the workpiece rack includes a top plate, a bottom plate, and two vertical side plates, the top plate and the bottom plate are arranged at the upper end and the lower end of the two vertical side plates, and the top plate and the bottom plate are arranged with a plurality of first hollow grooves, the vertical side plates are arranged with a plurality of second hollow grooves, and a workpiece plate is arranged between two second hollow grooves at the same level.

[0012] According to the pressure oven based on semiconductor packaging automation according to an embodiment of the present invention, the heating mechanism includes an inverted U-shaped frame, a fan, and multiple heating seats. The inverted U-shaped frame is arranged in an inner baking pressure cavity, and the inverted U-shaped frame has a guide cavity. The multiple heating seats are evenly distributed on the inner wall of the inverted U-shaped frame. The fan is arranged on the inner top of the inverted U-shaped frame, and the heating seat has a heating wire.

[0013] According to the pressure oven based on semiconductor packaging automation according to the embodiment of the present invention, the boosting pressure part includes a boosting pump group and a boosting guide tube, and the boosting pump group is connected to the inner baking pressure cavity through the boosting guide tube.

[0014] According to an embodiment of the present invention, a pressure oven based on semiconductor packaging automation also includes: a leak-proof joint assembly, wherein the leak-proof joint assembly includes a first leak-proof joint and a second leak-proof joint, wherein the first leak-proof joint is arranged on a partition plate, and has an outer protruding head, and the second leak-proof joint is arranged on an inner protruding head of a pressurized guide tube, and an accommodating groove is provided between the second leak-proof joint and the inner protruding head, and the outer protruding head can be plugged into the accommodating groove, and the outer wall of the outer protruding head has a plurality of outer locking grooves, and the second leak-proof joint has a plurality of inner locking mechanisms corresponding to the outer locking grooves.

[0015] According to the pressure oven based on semiconductor packaging automation according to an embodiment of the present invention, the inner wall of the outer extension head is provided with a plurality of anti-sway inner grooves, and the outer wall of the inner extension head is provided with anti-sway convex plates corresponding to the anti-sway inner grooves.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: The present invention provides a pressure oven based on semiconductor packaging automation, the pressure oven based on semiconductor packaging automation comprises a pressure oven body, the pressure oven body comprises an outer oven body, a heating mechanism, a nitrogen module, and a pressure module, wherein the outer oven body is provided with a partition, the outer oven body is divided into an inner baking pressure cavity and an assembly cavity by the partition, and then the nitrogen module and the pressure module are installed in the assembly cavity, and the nitrogen module and the pressure module are connected to the inner baking pressure cavity, the heating mechanism is installed in the inner baking pressure cavity, and the nitrogen module and the pressure module are connected to the inner baking pressure cavity respectively. The inner baking chamber is connected to the outer baking chamber, and a controller is installed at the front of the outer baking chamber. The heating mechanism, nitrogen module and pressure module are electrically connected to the controller respectively. Therefore, the heating mechanism, nitrogen module and pressure module can be started by the controller to provide heating, nitrogen and other working environments in the inner baking chamber, so that the glue of the semiconductor package can be left to stand and solidify. The pressure module can switch between low vacuum and high pressure at any time, so that the glue can be filled into the welding gap and around the components that are easily contaminated as much as possible, reduce the occurrence of cavities and bubbles in the glue, improve the quality and reliability of the product as a whole, and provide a good yield.

[0017] The other advantages, objectives and features of the pressure oven based on semiconductor packaging automation described in the present invention will be reflected in part through the following description, and in part will be understood by technicians in this field through research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a structural schematic diagram of the present invention.

[0019] Figure 2 It is a schematic diagram of the internal structure of the present invention.

[0020] Figure 3 It is a structural schematic diagram of the heating mechanism in the present invention.

[0021] Figure 4 The structure of the push rack in the present invention is shown in FIG. Figure 1 .

[0022] Figure 5 The structure of the push rack in the present invention is shown in FIG. Figure 2 .

[0023] Figure 6 It is a schematic diagram of the structure of the workpiece rack in the present invention.

[0024] Figure 7 The structure of the leak-proof joint assembly of the present invention is shown in FIG. Figure 1 .

[0025] Figure 8 The structure of the leak-proof joint assembly of the present invention is shown in FIG. Figure 2 .

[0026] Fig. 9 The structure of the second leak-proof joint in the present invention is shown in FIG. Figure 1 .

[0027] Fig.10 The structure of the second leak-proof joint in the present invention is shown in FIG. Figure 2 .

[0028] Fig.11 For the present invention Figure 7 Schematic diagram of the enlarged structure of the part A in the middle.

[0029] Fig.12 For the present invention Figure 8 Schematic diagram of the enlarged structure of the part B in the middle.

[0030] Fig.13 For the present invention Fig.10 Schematic diagram of the enlarged structure of the part C in the middle.

[0031] Fig.14 For the present invention Fig.10 Schematic diagram of the enlarged structure of the part D in the middle. DETAILED DESCRIPTION

[0032] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the description.

[0033] It should be understood that the terms such as “having”, “including” and “comprising” used herein do not exclude the existence or addition of one or more other elements or combinations thereof.

[0034] like Figure 1-Figure 3 As shown, the present invention provides a pressure oven based on semiconductor packaging automation, including: a pressure oven body 100, wherein the pressure oven body 100 includes an outer oven body 1, a heating mechanism 2, a nitrogen module 3, and a pressure module 4, wherein the outer oven body 1 has a partition 10, and the outer oven body 1 is divided into an inner baking pressure cavity 11 and an assembly cavity 12 by the partition 10, and then the nitrogen module 3 and the pressure module 4 are installed in the assembly cavity 12, and the nitrogen module 3 and the pressure module 4 are connected to the inner baking pressure cavity 11, the heating mechanism 2 is installed in the inner baking pressure cavity 11, and the nitrogen module 3 and the pressure module 4 are connected to the inner baking pressure cavity 11 respectively. The cavity 11 is connected, and a controller 101 is installed at the front of the outer oven body 1. The heating mechanism 2, the nitrogen module 3, and the pressure module 4 are electrically connected to the controller 101 respectively, so the heating mechanism 2, the nitrogen module 3, and the pressure module 4 can be started by the controller 101 to provide a heating, nitrogen and other working environments in the inner baking and pressure cavity 11, so that the glue of the semiconductor package can be left to stand and solidify, and the pressure module 4 can realize the switching of low vacuum and high pressure at any time, so that the glue can be filled into the welding gap and around the components that are easily contaminated as much as possible, reduce the occurrence of cavities and bubbles in the glue, improve the quality and reliability of the product as a whole, and provide a good yield.

[0035] Exemplary Heating Mechanisms Furthermore, some embodiments of the present invention provide a specific structure of the above-mentioned heating mechanism 2, wherein the heating mechanism 2 of this structure comprises an inverted U-shaped frame 21, a fan 22, and a plurality of heating seats 23, wherein the inverted U-shaped frame 21 is installed in the inner baking and pressure cavity 11 and is covered on the pushing frame 5, and the fan 22 is installed on the inner top of the inverted U-shaped frame 21. The fan 22 is designed in an internal manner, which can greatly save the space occupied by the inner baking and pressure cavity 11; a guide cavity 211 is opened in the inverted U-shaped frame 21, and a plurality of mounting grooves 212 are provided on the inner wall of the inverted U-shaped frame 21, and a plurality of heating seats 23 are respectively installed in the plurality of mounting grooves 212, so that the plurality of heating seats 23 can be evenly distributed on the inner wall of the inverted U-shaped frame 21, and a heating wire is provided in the heating seat 23, so that after the fan 22 is started, air is blown into the guide cavity 211, and then the heat in the heating seat 23 is blown to the workpiece rack 6 to evenly heat and package the semiconductor, thereby improving the packaging quality. Furthermore, a HEPA purification layer 24 is installed on the inner top of the inverted U-shaped frame 21 to meet the requirements of a dust-free welding environment.

[0036] Exemplary Pressure Module like Figure 2 As shown, further, some embodiments of the present invention provide a specific structure of the above-mentioned pressure module 4, where the pressure module 4 of this structure includes a vacuum pressure part 41 and a boost pressure part 42, wherein the vacuum pressure part 41 and the boost pressure part 42 are both installed in the assembly cavity 12, and the boost pressure part 42 and the vacuum pressure part 41 are respectively connected to the inner baking pressure cavity 11, and the vacuum pressure part 41 and the boost pressure part 42 can be started respectively by the controller to control the pressure in the inner baking pressure cavity 11, so as to realize the switching of low vacuum 15mbar and high pressure 1.0Mpa at any time, so that the glue can be filled into the welding gap and around the components that are easily contaminated as much as possible, reduce the occurrence of cavities and bubbles in the glue, improve the quality and reliability of the product as a whole, and provide a good yield.

[0037] Furthermore, the boost pressure unit 42 includes a boost pump group 43 and a boost guide tube 44, wherein the boost pump group 43 is connected to the inner grill pressure cavity 11 through the boost guide tube 44, and the inner grill pressure cavity 11 can be pressurized by starting the boost pump group 43, and a filter net can also be installed in the boost guide tube 44 to intercept dust.

[0038] Exemplary Push Rack like Figure 4-Figure 5 As shown, further, in some embodiments of the present invention, a push rack 5 is installed in the inner baking pressure chamber 11, and the push rack 5 can be used to push the workpiece rack 6, where a workpiece plate (not shown) can be placed in the workpiece rack 6, and the workpiece plate is arranged with the semiconductor to be packaged.

[0039] Furthermore, the push rack 5 comprises a main push support seat 51, a side support seat 52, a plurality of push rotating rods 53 and a push power unit 54, wherein the side support seat 52 is installed on one side of the main push support seat 51, and a plurality of push rotating rods 53 are arranged between the main push support seat 51 and the side support seat 52, and the three constitute the main structure of the push rack 5, and the push power unit 54 is installed at the bottom of the main push support seat 51, and the push power unit 54 can be rotatably connected with the plurality of push rotating rods 53 through a chain, so when the workpiece rack 6 is placed on the plurality of push rotating rods 53, the push power unit 54 is 4 is started and then drives the multiple push rotating rods 53 to rotate. Therefore, after the multiple push rotating rods 53 rotate in the same direction, the workpiece rack 6 is pushed into the interior of the baking and pressing cavity 11. In this way, when the heating mechanism 2 is started, the semiconductor in the workpiece rack 6 can be heated and packaged, and used in conjunction with the above-mentioned pressure module 4 to achieve low vacuum 15mbar and high pressure 1.0Mpa switching at any time, so that the glue can be filled into the welding gap and around the components that are easily contaminated as much as possible, reduce the occurrence of cavities and bubbles in the glue, improve the overall quality and reliability of the product, and provide a good yield.

[0040] Furthermore, a limiting mechanism 55 is also installed on the above-mentioned pushing main support seat 51, and the limiting mechanism 55 of the structure here includes a limiting seat 551 and a vertical limiting frame 552, wherein the limiting seat 551 is installed on the side wall of the pushing main support seat 51, and the vertical limiting frame 552 is installed on the limiting seat 551, so when the workpiece rack 6 is pushed on the workpiece rack 6 and contacts the vertical limiting frame 552, the pushing power unit 54 stops working, so that the workpiece rack 6 can be pushed to a suitable position in the inner baking pressure cavity 11.

[0041] It is understandable that a plurality of limit detection sensor modules 56 are also installed on the push rack 5. The limit detection sensor modules 56 can detect and limit the position of the workpiece rack 6 more effectively, thereby improving work efficiency.

[0042] Exemplary Workpiece Holder like Figure 6 As shown, further, some embodiments of the present invention provide a specific structure of the above-mentioned workpiece rack 6, where the workpiece rack 6 of this structure includes a top plate 61, a bottom plate 62, and two vertical side plates 63, wherein the top plate 61 and the bottom plate 62 are installed at the upper and lower ends of the two vertical side plates 63, and a plurality of first hollow grooves 621 are opened on the top plate 61 and the bottom plate 62, and a plurality of second hollow grooves 631 are opened on the vertical side plates 63, and a workpiece plate can be installed between the two second hollow grooves 631 at the same level, where the semiconductor to be packaged is arranged on the workpiece plate, and through the design of the above-mentioned first hollow grooves 621 and the second hollow grooves 631, heat can be easily introduced into the workpiece rack 6 and evenly distributed above and below the workpiece plate, so as to more evenly realize the packaging of the semiconductor, and cooperate with the use of the pressure module 4, so that the glue can be filled into the welding gaps and around the components that are easily contaminated as much as possible, thereby reducing the occurrence of cavities and bubbles in the glue, improving the quality and reliability of the product as a whole, and providing a yield rate.

[0043] Exemplary leak-proof joint assembly like Figure 7-Figure 14 As shown, further, in some embodiments of the present invention, the boost guide tube 44 is connected to the inner pressure cavity 11 through a leak-proof joint assembly 7, where the leak-proof joint assembly 7 includes a first leak-proof joint 71 and a second leak-proof joint 72. The first leak-proof joint 71 and the second leak-proof joint 72 can prevent air leakage and facilitate subsequent maintenance.

[0044] Specifically, the first leak-proof joint 71 is installed on the partition 10, and has an outer extension head 711 on the first leak-proof joint 71, and the second leak-proof joint 72 is installed on the inner extension head 441 of the cooling pipe 70, and the inner extension head 441 also has an inner leak-proof ring 443, wherein the second leak-proof joint 72 and the inner extension head 441 have a receiving groove 710, so when the first leak-proof joint 71 and the second leak-proof joint 72 are connected, the second leak-proof joint 72 is aligned with the first leak-proof joint 17 so that The protruding head 711 can be inserted into the accommodating groove 710. Furthermore, a plurality of external locking grooves 712 are provided on the outer wall of the protruding head 711, and a plurality of internal locking mechanisms 73 corresponding to the external locking grooves 712 are provided in the second leak-proof joint 72. Therefore, the internal locking mechanism 73 is stuck to the external locking groove 712 of the first leak-proof joint 17 to complete the locking, and at the same time, the first leak-proof joint 17 also presses against the internal leak-proof ring 443, so that a fixed leak-proof connection between the first leak-proof joint 17 and the second leak-proof joint 72 can be achieved.

[0045] Furthermore, a plurality of anti-sway inner grooves 713 are provided on the inner wall of the outer protruding head 711, and correspondingly, an anti-sway convex plate 442 corresponding to the anti-sway inner grooves 713 is provided on the outer wall of the inner protruding head 441. Therefore, when the outer protruding head 711 enters the accommodating groove 710, the anti-sway convex plate 442 corresponds to the anti-sway inner grooves 713, thereby facilitating the fixing of the outer protruding head 711 to the inner protruding head 441, and preventing the outer protruding head 711 from rotating circumferentially on the inner protruding head 441, thereby avoiding the misalignment of the inner locking mechanism 73 and the outer locking groove 712, thereby reducing the fixing and leak-proof effect between the first leak-proof joint 17 and the second leak-proof joint 72.

[0046] Exemplary Second Leak-Proof Joint like Figure 9-10 As shown, further, some embodiments of the present invention provide a specific structure of the second leak-proof joint 72, wherein the second leak-proof joint 72 of the structure includes a leak-proof sealing plate 721 and a leak-proof cone cap 722, wherein the leak-proof cone cap 722 is installed on the inner extension head 441 through an inner support member 720, the leak-proof sealing plate 721 is installed on the front end of the leak-proof cone cap 722, and the leak-proof sealing plate 721 has an inner opening 7211 corresponding to the inner extension head 441; When the locking cam 72 is in the closed position, the locking cam 723 is in the closed position, and the locking cam 723 is in the closed position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 723 is in the open position, and the locking cam 723 is in the open position, so that the locking cam 72

[0047] Furthermore, the above-mentioned internal support member 720 includes an inner support ring 7201 and multiple inner support support plates 7202. The inner support ring 7201 is fixed on the inner extension head 441. The multiple inner support support plates 7202 are evenly distributed on the inner extension head 441 and connected to the inner wall of the leak-proof cone cap 722. In this way, the leak-proof cone cap 722 is further fixed and supported on the inner extension head 441 through the above-mentioned internal support member 720.

[0048] Exemplary Lock Cylinder like Fig.13 As shown, further, some embodiments of the present invention provide a specific structure of the lock core part 75, where the lock core part 75 of the structure includes a lock core base plate 751, a first elastic member 752, a lock core clamping plate 753, and a second elastic member 754, wherein the first elastic member 752 is mounted on the inner end wall of the anti-leakage cone cap 722, and the lock core base plate 751 is mounted on the first elastic member 752, and the second elastic member 754 is mounted on the lock core base plate 751, the lock core clamping plate 753 is mounted on the second elastic member 754, and the lock core clamping plate 753 abuts against the outer lock groove 712; The lock core portion 75 can support the lock core base plate 751 through two first elastic members 752, and the lock core base plate 751 can support the lock core clamping plate 753 through two elastic members 754, so that the lock core clamping plate 753 can be clamped and pressed into the outer lock groove 712, and the first elastic member 752 and the second elastic member 754 also have a retraction function, thereby facilitating the subsequent separation of the lock core clamping plate 753 away from the outer lock groove 712, and facilitating the subsequent separation of the first anti-leakage joint 17 and the second anti-leakage joint 72 for maintenance.

[0049] The first elastic member 752 comprises a first cylinder 7521, a first inner support column 7522 and a first spring body 7523. The first cylinder 7521 is mounted on the inner end wall of the anti-leakage cone cap 722. The first inner support column 7522 is mounted in the first cylinder 7521 and connected to the lock core base plate 751. The first spring body 7523 is sleeved on the first cylinder 7521 and the first inner support column 7522, and is supported against the inner end wall of the lock core base plate 751 and the anti-leakage cone cap 722, so as to realize the support and contraction of the first elastic member 752. Similarly, the second elastic member 754 includes a second cylinder 7541, a second inner support column 7542, and a second spring body 7543. The second cylinder 7541 is installed on the lock core base plate 751, the second inner support column 7542 is installed in the second cylinder 7541, the lock core clamping plate 753 is installed on the second inner support column 7542, and the second spring body 7543 is sleeved on the second cylinder 7541 and the second inner support column 7542, and is supported between the lock core base plate 751 and the lock core clamping plate 753, so as to realize the support and contraction of the second elastic member 754.

[0050] Exemplary inner linkage Furthermore, some embodiments of the present invention provide a specific structure of the inner linkage part 74, wherein the inner linkage part 74 of the structure includes an inner circumference 741 and a linkage hinge 742, wherein the inner circumference 741 can be rotatably installed in the inner circumference groove of the leak-proof cone cap 722, and the linkage hinge 742 includes two hinge plates 743 and a hinge seat 744, wherein the hinge seat 744 is installed on the lock core seat plate 751, one end of the hinge plate 743 is connected to the first hinge shaft 745 on the hinge seat 744, and the other end is connected to the second hinge shaft 746 on the inner circumference 741, and a plurality of first convex tooth blocks 747 are provided on the inner circumference 741, and a plurality of second convex tooth blocks 747 are provided on the handle member 723 accordingly. When the locking cam 752 is in the unlocking state, the locking cam 752 is in the unlocking state, and the locking cam 752 is in the unlocking state.

[0051] Exemplary Locking and Anti-Moving Mechanisms like Fig.14As shown, further, in some embodiments of the present invention, a locking and anti-movement mechanism 75 is installed on the anti-leakage cone cap 722. The locking and anti-movement mechanism 75 can not only fix the handle 723 again to prevent it from moving, but also facilitate the subsequent movement away from the handle 723 to unlock the handle 723. Specifically, the locking anti-movement mechanism 75 of the above structure includes an anti-movement rod 751, an anti-movement seat 752, a third elastic member 753, a first anti-movement wedge 754, a fourth elastic member 755, and a second anti-movement wedge 756, wherein the anti-movement seat 752 is installed on the inner end wall of the leak-proof cone cap 722, and the anti-movement rod 751 is movably penetrated on the leak-proof cone cap 722, one end of the anti-movement rod 751 is connected to the first anti-movement wedge 754, and the third elastic member 753 is installed on the inner end wall of the leak-proof cone cap 722. Installed between the first anti-movement wedge block 754 and the anti-leakage cone cap 722, the fourth elastic member 755 is movably installed on the anti-movement seat 752, the second anti-movement wedge block 756 is installed at the bottom of the fourth elastic member 755, and corresponds to the plurality of third convex tooth blocks 725 on the handle member 723, further, the first anti-movement wedge block 754 has a first wedge-shaped wall 757 corresponding to the fourth elastic member 755, and the second anti-movement wedge block 756 has a second wedge-shaped wall 758; Therefore, when the handle 723 is rotated, the handle 723 rotates and the third protruding tooth block 725 abuts against the second wedge-shaped wall 758, so that the second anti-movement wedge block 756 moves upward and the fourth elastic member 755 also moves upward, so that the third protruding tooth block 725 rotates to the rear side of the second anti-movement wedge block 756, and the locking anti-movement mechanism 75 is implemented to fix the handle 723 again to prevent it from moving; Then, the anti-movement rod 751 can be pressed from the outside of the leak-proof cone cap 722, and the anti-movement rod 751 drives the first anti-movement wedge block 754 to move to the top of the fourth elastic member 755, and pushes the top of the fourth elastic member 755 upward, and then the fourth elastic member 755 drives the second anti-movement wedge block 756 below to move upward away from the third protruding tooth block 725, so as to facilitate the rotation of the handle member 723 again, realize the unlocking of the handle member 723, and then facilitate the rotation of the internal linkage part 74.

[0052] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation modes, and they can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A pressure oven based on semiconductor packaging automation, characterized in that: include: A pressure oven body (100), the pressure oven body (100) comprising an outer oven body (1), a heating mechanism (2), a nitrogen module (3), and a pressure module (4); the outer oven body (1) is provided with an inner baking pressure cavity (11) and an assembly cavity (12); the nitrogen module (3) and the pressure module (4) are arranged in the assembly cavity (12); the heating mechanism (2) is arranged in the inner baking pressure cavity (11); a controller is arranged at the front of the outer oven body (1); the nitrogen module (3) and the pressure module (4) are respectively connected to the inner baking pressure cavity (11); and the heating mechanism (2), the nitrogen module (3), and the pressure module (4) are respectively electrically connected to the controller.

2. A pressure oven based on semiconductor packaging automation according to claim 1, characterized in that: The pressure module (4) comprises a vacuum pressure section (41) and a boost pressure section (42); the vacuum pressure section (41) and the boost pressure section (42) are both arranged in the assembly cavity (12); and the vacuum pressure section (41) and the boost pressure section (42) are respectively electrically connected to a controller.

3. The pressure oven based on semiconductor packaging automation according to claim 1, characterized in that: A pushing rack (5) is arranged in the inner baking pressure cavity (11), and the pushing rack (5) is used to push the workpiece rack (6).

4. A pressure oven based on semiconductor packaging automation according to claim 3, characterized in that: The pushing frame (5) comprises a pushing main support seat (51), a side support seat (52), a plurality of pushing rotating rods (53) and a pushing power unit (54); the side support seat (52) is arranged on one side of the pushing main support seat (51); the plurality of pushing rotating rods (53) are arranged between the pushing main support seat (51) and the side support seat (52); and the pushing power unit (54) is arranged at the bottom of the pushing main support seat (51); the pushing power unit (54) is rotatably connected to the pushing rotating rod (53); and the pushing rotating rod (53) can push the workpiece frame (6) to move.

5. A pressure oven based on semiconductor packaging automation according to claim 4, characterized in that: The main push support seat (51) is also provided with a limiting mechanism (55), the limiting mechanism (55) comprising a limiting seat (551) and a vertical limiting frame (552), the limiting seat (551) being provided on a side wall of the main push support seat (51), and the vertical limiting frame (552) being provided on the limiting seat (551).

6. The pressure oven based on semiconductor packaging automation according to claim 3, characterized in that: The workpiece rack (6) comprises a top plate (61), a bottom plate (62), and two vertical side plates (63); the top plate (61) and the bottom plate (62) are arranged at the upper end and the lower end of the two vertical side plates (63); the top plate (61) and the bottom plate (62) are arranged with a plurality of first hollow grooves (621); the vertical side plates (63) are arranged with a plurality of second hollow grooves (631); and a workpiece plate is arranged between two second hollow grooves (631) at the same level.

7. The pressure oven based on semiconductor packaging automation according to claim 1, characterized in that: The heating mechanism (2) comprises an inverted U-shaped frame (21), a fan (22), and a plurality of heating seats (23); the inverted U-shaped frame (21) is arranged in the inner baking pressure cavity (11); the inverted U-shaped frame (21) has a flow guide cavity; the plurality of heating seats (23) are evenly distributed on the inner wall of the inverted U-shaped frame (21); the fan (22) is arranged on the inner top of the inverted U-shaped frame (21); and the heating seats (23) have heating wires.

8. The pressure oven based on semiconductor packaging automation according to claim 2, characterized in that: The boost pressure section (42) comprises a boost pump group (43) and a boost guide tube (44); the boost pump group (43) is connected to the internal baking pressure cavity (11) via the boost guide tube (44).

9. The pressure oven based on semiconductor packaging automation according to claim 8, characterized in that: Also includes: A leak-proof joint assembly (7), the leak-proof joint assembly (7) comprising a first leak-proof joint (71) and a second leak-proof joint (72), the first leak-proof joint (71) being arranged on a partition (10), the first leak-proof joint (71) having an outer extension head (711), the second leak-proof joint (72) being arranged on an inner extension head (441) of a booster guide tube (44), a receiving groove (710) being provided between the second leak-proof joint (72) and the inner extension head (441), the outer extension head (711) being insertable into the receiving groove (710), a plurality of outer locking grooves (712) being provided on an outer wall of the outer extension head (711), and a plurality of inner locking mechanisms (73) corresponding to the outer locking grooves (712) being provided in the second leak-proof joint (72).

10. The pressure oven based on semiconductor packaging automation according to claim 9, characterized in that: The inner wall of the outer extension head (711) is provided with a plurality of anti-sway inner grooves (713), and the outer wall of the inner extension head (441) is provided with an anti-sway convex plate (442) corresponding to the anti-sway inner grooves (713).

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