Chip taking and placing equipment for automatic die bonding and assembling equipment

Abstract

The invention belongs to the field of automatic die bonding assembly equipment, and particularly relates to chip taking and placing equipment for automatic die bonding assembly equipment, which comprises a fixing frame, a first servo motor is fixedly mounted at the side end of the top of the fixing frame, the output end of the first servo motor is connected with a reciprocating screw rod, the reciprocating screw rod is rotatably connected in the fixing frame, and the reciprocating screw rod is connected with a second servo motor. The chip taking and placing device comprises a fixed frame, a reciprocating screw rod is installed on the fixed frame, a batch taking and placing assembly is connected to the reciprocating screw rod, a pretreatment assembly is installed in the fixed frame, a feeding box is fixedly connected to the inner bottom end face of the fixed frame, and a feeding groove is formed in the feeding box. The problems that in the prior art, picking and placing of chip elements are mainly completed by a mechanism in which a mechanical arm provided with a suction nozzle performs rotation, translation and negative pressure adsorption, but rotation, translation and negative pressure adsorption of the mechanical arm need different hydraulic driving assemblies, the process is tedious, the number of used driving assemblies is large, and cost is high are solved.

Description

Technical Field

[0001] The invention relates to the field of automatic die bonding assembly equipment, in particular to a chip picking and placing device used for automatic die bonding assembly equipment. Background Art

[0002] With the rapid development of science and technology, semiconductor electronic devices are increasingly widely used. Semiconductor diodes, semiconductor triodes, etc. have higher and higher requirements for such semiconductor electronic devices, so their production process is becoming more and more stringent. With the improvement of science and technology, circuits are gradually developing towards high integration (commonly known as "integrated circuits"), and the core is integrated chips. Nowadays, due to the large-scale application of integrated circuits, the demand for integrated chips has also increased significantly. Since the size of integrated chips is very small, during the production process of integrated chips, it is necessary to use pick-and-place equipment to pick up chip components from the package and accurately place them in the corresponding position, and cooperate with automatic die-bonding assembly equipment to package the integrated chips;

[0003] In the working process of the chip picking and placing equipment used in the existing automatic die bonding assembly equipment, the picking and placing of chip components are mainly completed by the mechanical arm equipped with a suction nozzle to perform rotation, translation and negative pressure adsorption. However, different hydraulic drive components are required to realize the rotation, translation and negative pressure adsorption of the mechanical arm respectively. The process is cumbersome, the number of drive components used is large, the cost is high, and it is not possible to pick up and place multiple chips at one time, and it is not possible to automatically load multiple chips at the same time, and the work efficiency is low. Because the chip needs to be heated before the die bonding, this is to make the temperature of the chip meet the requirements of the die bonding. When the temperature of the chip reaches the requirements, it can be placed. The present invention relates to a chip picking and placing device for automatic die bonding assembly equipment, which can be used for bonding crystals, but the chip picking and placing device used in the existing automatic die bonding assembly equipment cannot automatically and stably preheat and clean the chips in the picking and placing process during operation, which leads to a long subsequent heating time of the chip, affecting the subsequent die bonding efficiency, and when dust or impurities are stuck to the bottom of the chip, it is very easy to cause the chip placement state to be unstable, affecting the subsequent packaging process, and the practicality is poor; the chip picking and placing device used in the existing automatic die bonding assembly equipment has poor applicability and cannot place the chip conveniently and stably in chip frames of different lengths. Therefore, it is necessary to provide a chip picking and placing device for automatic die bonding assembly equipment to meet the needs of users. Summary of the invention

[0004] The object of the present invention is to provide a chip pick-and-place device for automatic die-bonding assembly equipment to solve the problems raised by the above-mentioned background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a chip picking and placing device for automatic solid crystal assembly equipment, comprising a fixed frame, a first servo motor is installed and fixed on the top side end of the fixed frame, an output end of the first servo motor is connected to a reciprocating screw, the reciprocating screw is rotatably connected in the fixed frame, a batch picking and placing assembly is connected to the reciprocating screw, a pre-treatment assembly is installed in the fixed frame, a loading box is fixedly connected to the internal bottom end surface of the fixed frame, a loading trough is provided in the loading box, a return spring is fixedly connected to the internal bottom end surface of the loading trough, a support plate is fixedly connected to the top of the return spring, the support plate and the chip body are both limitedly slidably connected in the loading trough, a rubber frame is fixedly connected to the internal top of the loading trough, a transmission belt is connected to the reciprocating screw, the other end of the transmission belt is connected to the positioning and conveying assembly, and the positioning and conveying assembly is installed in the fixed frame.

[0006] As a preferred scheme of the present invention, wherein: the batch pick-and-place assembly includes a connecting plate and a second guide plate, the connecting plate is threadedly connected to the reciprocating screw, the bottom end surface of the connecting plate is fixedly connected to a first guide plate, a first guide groove is penetrated through the first guide plate, a guide rod is slidingly connected in the first guide groove, a contact head is installed and fixed on the guide rod, the second guide plate is fixedly connected in a fixed frame, a second guide groove is opened on the second guide plate, a sensor is installed and fixed at the bottom of the side end of the second guide groove, the first guide plate and the second guide plate are symmetrically distributed on both sides of the guide rod, the reciprocating screw is connected to the top middle part of the connecting plate, the contact heads are symmetrically distributed at both ends of the guide rod, and the sensors are symmetrically distributed at the bottom of both sides of the second guide groove.

[0007] As a preferred solution of the present invention, wherein: a support tube is fixedly connected to the guide rod, a fixed frame is fixedly connected to the bottom end of the support tube, the bottom end of the support tube is communicated with the fixed frame, a fixed tube is connected to the bottom end of the fixed frame, a rubber suction cup is fixed to the bottom end of the fixed tube, a connecting mesh plate is fixedly connected to the inner bottom end of the support tube, the top of the support tube is fixed to the middle part of the guide rod, the central axis of the support tube and the central axis of the fixed frame are located on the same vertical center line, the fixed tubes are equidistantly distributed at the bottom end of the fixed frame, and the fixed tubes correspond one-to-one to the rubber suction cup.

[0008] As a preferred solution of the present invention, wherein: a first hydraulic rod is fixedly installed on the top surface of the connecting mesh plate, the top of the first hydraulic rod is connected to a rubber piston, the rubber piston is limited and slidably connected in the support tube, a through hole is penetrated on the support tube, the bottom end surface of the connecting mesh plate, the bottom end surface of the support tube and the inner top end surface of the fixed frame are flush, the rubber piston fits with the inner wall of the support tube, the support tube is penetrated and slidably connected in the limit frame, the side end of the limit frame is fixedly connected with a rectangular limit rod, the rectangular limit rod is limited and slidably connected in the limit groove, the limit groove is opened on the second guide plate, and the length of the limit groove is greater than the length of the second guide groove.

[0009] As a preferred solution of the present invention, the pretreatment component comprises a ventilation cylinder, which is fixedly connected to the inner bottom end surface of the fixed frame, a support rod is fixedly connected in the ventilation cylinder, and the other end of the support rod is fixedly connected to a second servo motor, an exhaust fan and a large-aperture mesh plate are fixedly connected to the output shaft of the second servo motor, a rotating frame is fixedly connected to the large-aperture mesh plate, the rotating frame is rotatably connected to the top of the ventilation cylinder through a bearing, a flexible brush is fixedly connected to the inner bottom end surface of the rotating frame, the exhaust fans are equidistantly distributed on the output shaft of the second servo motor, the output shaft of the second servo motor is fixed at the bottom center of the large-aperture mesh plate, the flexible brushes are equiangularly distributed in the rotating frame, the depth of the rotating frame is less than the length of the flexible brush, a collecting mesh frame is slidably connected through the ventilation cylinder, a magnetic plate is fixedly connected to the side end of the collecting mesh frame, the magnetic plate is magnetically adsorbed and connected to the side wall of the ventilation cylinder, the inner wall of the ventilation cylinder fits the front and rear end surfaces of the collecting mesh frame, and the length and width of the magnetic plate are respectively greater than the length and width of the end of the collecting mesh frame.

[0010] As a preferred scheme of the present invention, wherein: an electric heating tube is installed and fixed in the ventilation tube, a guide tube is connected to the bottom side end of the ventilation tube, a connecting plate is connected to the top of the guide tube, the connecting plate is rotatably connected to the bottom end of the connecting frame through a sealed bearing, a small nozzle is connected to the top of the connecting frame, the connecting frame is fixedly connected to the rotating frame, a second hydraulic rod is installed and fixed at the bottom end of the ventilation tube, the bottom end of the second hydraulic rod is installed and fixed on the fixed frame, the electric heating tube, the connecting plate and the connecting frame are all in annular shape, the electric heating tubes are equidistantly distributed in the ventilation tube, the electric heating tubes and the exhaust fan are alternately distributed, the guide tubes are symmetrically distributed on both sides of the bottom of the ventilation tube, the small nozzles are distributed at equal angles on the connecting frame, and the top height of the small nozzles is smaller than the top height of the flexible brush.

[0011] As a preferred solution of the present invention, the feeding troughs are equidistantly distributed in the feeding box, the top surface of the rubber frame is flush with the top surface of the feeding box, and the elastic strength of the rubber frame is greater than the elastic strength of the reset spring.

[0012] As a preferred scheme of the present invention, wherein: the positioning and conveying assembly includes a rotating shaft and a connecting shaft, the rotating shaft is rotatably connected to the fixed frame, the rotating shaft is connected to the transmission belt, a turntable is fixedly connected to the rotating shaft, a positioning groove is provided on the turntable, a connecting spring is fixedly connected to the turntable, the other end of the connecting spring is fixedly connected to a clamping rod, the clamping rod is slidably connected in the turntable, the end of the clamping rod is clamped and connected in the clamping groove, the clamping groove is provided on the tooth block, the tooth block is clamped and connected in the positioning groove, the positioning grooves are distributed at equal angles on the turntable, the positioning grooves correspond to the clamping rods one by one, and the depth of the positioning grooves is less than the length of the tooth block.

[0013] As a preferred solution of the present invention, wherein: the connecting shaft is rotatably connected to the fixing frame and the mounting plate, the mounting plate is fixedly connected to the inner bottom end surface of the fixing frame, a circular gear is fixedly connected to the connecting shaft, a conveyor belt is connected to the connecting shaft, a flexible frame is fixedly connected to the conveyor belt, a threaded rod is threadedly connected to the flexible frame, the end of the threaded rod is fixedly connected to a limiting plate, and a chip frame is arranged in the flexible frame.

[0014] As a preferred solution of the present invention, wherein: the turntable is located directly above the circular gear, the diameter of the circular gear is larger than the diameter of the turntable, the turntable is meshed with the circular gear through a tooth block, the flexible frames are equidistantly distributed on the conveyor belt, and the threaded rod is connected to the middle part of the side end of the flexible frame.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. A batch pick-and-place component is provided, and the continuous rotation of the reciprocating screw rod can drive the first guide plate to reciprocate through the connecting plate, and the first guide groove can drive the guide rod to automatically and stably reciprocate along the second guide groove, and the sensor drive of the sensor and the contact head can form a negative pressure in each rubber suction cup through the rubber piston on the first hydraulic rod, and the reciprocating motion of the guide rod can automatically adsorb and pick up multiple chip bodies at the same time, and move them to the chip frame. The present application only needs to use the first servo motor and the first hydraulic rod to complete the efficient batch pick-and-place work of the chip, ensure the stability and convenience of the subsequent packaging work of the chip body, effectively improve the working efficiency of the pick-and-place equipment, reduce the use cost of the pick-and-place equipment, and reduce the energy consumption of the pick-and-place equipment, and at the same time can effectively improve the subsequent work efficiency of the automatic solid crystal assembly equipment.

[0017] 2. A pre-treatment component is provided. When the chip body is being picked up and placed, it can contact the flexible brush. At this time, the second servo motor can use the output shaft to drive each exhaust fan and the rotating frame on the large-aperture mesh plate to rotate simultaneously. While each flexible brush is rotating to clean the chip body, each exhaust fan can suck the dust and impurities generated by the cleaning into the ventilator, and use the collection mesh frame to filter and collect them conveniently and stably, thereby effectively avoiding dust and impurities sticking to the bottom of the chip body, resulting in an unstable subsequent placement state and affecting subsequent packaging processing. The magnetic plate can be used to conveniently and stably disassemble and install the collection mesh frame, thereby conveniently removing the collected dust and impurities. The quick and stable transfer process increases the diversity and convenience of the pick-and-place equipment. Under the heating effect of each electric heating tube, the air sucked by the exhaust fan can be automatically heated. The guide tubes on both sides can stably transport the reflux heated air to the connecting frame. In conjunction with the small nozzle, each chip body in the operation process can be automatically and evenly preheated, thereby ensuring the stability and efficiency of the subsequent solid crystal work of each chip body. After the hot air is transported, it can be sucked back again, so that the hot air can be recycled, which effectively improves the utilization rate of thermal energy, while increasing the diversity of use of the pick-and-place equipment and improving the subsequent work efficiency of the solid crystal equipment.

[0018] 3. A loading box and a support plate are provided. When each rubber suction cup absorbs and picks up the chip body on the top layer, the chip body on the next layer can be pushed to fit with the rubber frame under the elastic push of the reset spring and the support plate, ensuring that each rubber suction cup can absorb and pick up the chip body stably next time. By analogy, the batch loading of the chip body can be automatically completed, effectively improving the efficiency and convenience of the pick-and-place equipment.

[0019] 4. A positioning and conveying component is provided. During the rotation of the reciprocating screw, the transmission belt can be used to drive the rotating shaft to rotate stably. The tooth blocks on the turntable can drive the conveyor belt on the connecting shaft to rotate automatically and intermittently through the meshing circular gears. At this time, under the intermittent rotation of the conveyor belt, the taken chip body can be stably placed in the adjacent chip frame; since the lengths of chip frames of different batches are different, the chip frame can be conveniently positioned inside the flexible frame by the threaded rotation of the threaded rod in conjunction with the limit plate, and the number of tooth blocks can be conveniently adjusted by the cooperation of the clamping rod and the clamping slot, thereby conveniently adjusting the movement distance of the conveyor belt during the process of taking and placing the chip body. Therefore, when chip frames of different lengths are placed in the flexible frame, the spacing between adjacent chip frames is different. The adjusted movement distance of the conveyor belt can ensure that the chip body is stably placed in each chip frame of different batches, effectively improving the applicability of the pick-and-place equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in combination with the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0021] Figure 1 It is a schematic diagram of the overall three-dimensional structure of a chip pick-and-place device for automatic die-bonding assembly equipment of the present invention;

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of a material box on a chip pick-and-place device for automatic die-bonding assembly equipment of the present invention;

[0023] Figure 3 It is a schematic diagram of the three-dimensional structure of a chip pick-and-place device fixing frame for automatic die-bonding assembly equipment of the present invention;

[0024] Figure 4 It is a schematic diagram of the three-dimensional structure of a ventilator of a chip pick-and-place device for automatic die-bonding assembly equipment of the present invention;

[0025] Figure 5 It is a schematic diagram of the overall main structure of a chip pick-and-place device for automatic die-bonding assembly equipment of the present invention;

[0026] Figure 6 It is a schematic diagram of the structure of the second guide groove of a chip pick-and-place device for an automatic die-bonding assembly device of the present invention;

[0027] Figure 7 It is a schematic diagram of the structure of the first guide groove of a chip pick-and-place device for an automatic die-bonding assembly device of the present invention;

[0028] Figure 8 It is a schematic diagram of the structure of a rubber piston of a chip pick-and-place device for an automatic die-bonding assembly device of the present invention;

[0029] Fig. 9 It is a schematic diagram of the structure of a chip pick-and-place device support plate for automatic die-bonding assembly equipment of the present invention;

[0030] Fig.10 It is a schematic diagram of the structure of an exhaust fan of a chip pick-and-place device for automatic die-bonding assembly equipment of the present invention;

[0031] Fig.11 It is a schematic diagram of a top view of a flexible brush of a chip pick-and-place device for an automatic die-bonding assembly device of the present invention;

[0032] Fig.12 It is a schematic diagram of a positioning groove structure of a chip pick-and-place device for automatic die-bonding assembly equipment of the present invention;

[0033] Fig.13 It is a schematic diagram of the side view structure of a tooth block of a chip pick-and-place device for an automatic die-bonding assembly device of the present invention;

[0034] Fig.14 It is a schematic diagram of the side view structure of a conveyor belt of a chip pick-and-place device for automatic die-bonding assembly equipment of the present invention;

[0035] Fig.15 The present invention is a chip pick-and-place device for automatic die-bonding assembly equipment Fig.14 Schematic diagram of the structure at A in the middle;

[0036] Fig.16 It is a schematic diagram of the side view structure of a chip pick-and-place device sensor for automatic die-bonding assembly equipment of the present invention;

[0037] Fig.17 It is a schematic diagram of the side view structure of a chip pick-and-place device transmission belt for automatic die-bonding assembly equipment of the present invention;

[0038] Fig.18 It is a schematic diagram of the side view structure of a flow guide tube of a chip pick-and-place device for an automatic die-bonding assembly device of the present invention;

[0039] Fig.19 The present invention is a chip pick-and-place device for automatic die-bonding assembly equipment Fig.18 Schematic diagram of the structure at B in the middle;

[0040] Fig. 20 The present invention is a schematic diagram of the three-dimensional structure of a chip pick-and-place device connecting plate used in automatic die-bonding assembly equipment.

[0041] Numbers in the figure: 1, fixed frame; 2, first servo motor; 3, reciprocating screw; 4, batch pick-and-place assembly; 401, connecting plate; 402, first guide plate; 403, first guide groove; 404, guide rod; 405, contact head; 406, second guide plate; 407, second guide groove; 408, sensor; 409, support cylinder; 410, fixed frame; 411, fixed tube; 412, rubber suction cup; 413, connecting mesh plate; 414, first hydraulic rod; 415, rubber piston; 416, through hole; 5, limit frame; 6, rectangular limit rod; 7, limit groove; 8, pretreatment assembly; 801, ventilator; 802, support rod; 803, second servo motor; 804, exhaust fan; 805, large aperture mesh plate; 806, rotating frame; 807, flexible Sex brush; 808, collecting screen frame; 809, magnetic plate; 810, electric heating tube; 811, guide tube; 812, connecting plate; 813, connecting frame; 814, small nozzle; 815, second hydraulic rod; 9, feeding box; 10, feeding trough; 11, reset spring; 12, support plate; 13, rubber frame; 14, chip body; 15, transmission belt; 16, positioning and conveying assembly; 1601, rotating shaft; 1602, turntable; 1603, positioning groove; 1604, connecting spring; 1605, clamping rod; 1606, clamping groove; 1607, tooth block; 1608, connecting shaft; 1609, circular gear; 1610, mounting plate; 1611, conveyor belt; 1612, flexible frame; 1613, threaded rod; 1614, limit plate; 17, chip frame. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0043] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0044] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0045] Example

[0046] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0047] like Figure 1-20 As shown, a chip picking and placing device for automatic solid crystal assembly equipment comprises a fixed frame 1, a first servo motor 2 is fixedly installed on the top side end of the fixed frame 1, a reciprocating screw rod 3 is connected to the output end of the first servo motor 2, the reciprocating screw rod 3 is rotatably connected in the fixed frame 1, a batch picking and placing component 4 is connected to the reciprocating screw rod 3, a pre-treatment component 8 is installed in the fixed frame 1, a loading box 9 is fixedly connected to the inner bottom end surface of the fixed frame 1, a loading trough 10 is provided in the loading box 9, a reset spring 11 is fixedly connected to the inner bottom end surface of the loading trough 10, a support plate 12 is fixedly connected to the top of the reset spring 11, the support plate 12 and the chip body 14 are both limitedly slidably connected in the loading trough 10, a rubber frame 13 is fixedly connected to the inner top of the loading trough 10, a transmission belt 15 is connected to the reciprocating screw rod 3, and the transmission belt 15 The other end is connected to the positioning and conveying component 16, and the positioning and conveying component 16 is installed in the fixed frame 1. By utilizing the cooperation of the batch pick-up and placement component 4 and the loading box 9, the efficient batch pick-up and placement of chips can be completed, ensuring the stability and convenience of the subsequent packaging work of the chip body 14, effectively improving the working efficiency of the pick-up and placement equipment, and cooperating with the pretreatment component 8, the chip body 14 can be automatically and stably cleaned, which can effectively avoid dust and impurities sticking to the bottom of the chip body 14, resulting in unstable subsequent placement and affecting subsequent packaging processing. In addition, combined with the positioning and conveying component 16, the taken chip body 14 can be stably placed in the adjacent chip frame 17, and at the same time, it can ensure that the chip body 14 is stably placed in each chip frame 17 of different batches, effectively improving the applicability of the pick-up and placement equipment.

[0048] In this example, the batch pick-and-place assembly 4 includes a connecting plate 401 and a second guide plate 406. The connecting plate 401 is threadedly connected to the reciprocating screw rod 3. The bottom end surface of the connecting plate 401 is fixedly connected to the first guide plate 402. The first guide plate 402 is provided with a first guide groove 403. A guide rod 404 is limitedly slidably connected in the first guide groove 403. A contact head 405 is fixedly installed on the guide rod 404. The second guide plate 406 is fixedly connected to the fixed frame 1. The second guide plate 406 is provided with a second guide groove 407. The second guide A sensor 408 is fixedly mounted on the bottom of the side end of the groove 407, the first guide plate 402 and the second guide plate 406 are symmetrically distributed on both sides of the guide rod 404, the reciprocating screw rod 3 is connected to the top middle part of the connecting plate 401, the contact heads 405 are symmetrically distributed at both ends of the guide rod 404, the sensors 408 are symmetrically distributed at the bottom of both sides of the second guide groove 407, the guide rod 404 is fixedly connected with a support tube 409, the bottom end of the support tube 409 is fixedly connected with a fixed frame 410, and the bottom end of the support tube 409 is connected to the fixed frame 410. The bottom end of the fixed frame 410 is connected to a fixed tube 411, and a rubber suction cup 412 is fixed to the bottom end of the fixed tube 411. The inner bottom end of the support tube 409 is fixedly connected to a connecting mesh plate 413. The top of the support tube 409 is fixed to the middle part of the guide rod 404. The central axis of the support tube 409 and the central axis of the fixed frame 410 are located on the same vertical center line. The fixed tubes 411 are equidistantly distributed at the bottom end of the fixed frame 410. The fixed tubes 411 correspond to the rubber suction cups 412 one by one. By continuously rotating the reciprocating screw rod 3, the connecting plate 404 can be connected to the fixed tube 411. The first guide plate 402 is driven to reciprocate, and the first guide groove 403 is cooperated with to drive the guide rod 404 to automatically and stably reciprocate along the second guide groove 407. The sensor 408 and the contact head 405 are driven to form negative pressure in each rubber suction cup 412 through the rubber piston 415 on the first hydraulic rod 414. The reciprocating motion of the guide rod 404 can automatically absorb and pick up multiple chip bodies 14 at the same time, and can move them to the chip frame 17, which effectively improves the working efficiency of the device.

[0049] In this example, a first hydraulic rod 414 is fixedly mounted on the top surface of the connecting mesh plate 413, and a rubber piston 415 is connected to the top of the first hydraulic rod 414. The rubber piston 415 is limitedly slidably connected in the support cylinder 409, and a through hole 416 is opened on the support cylinder 409. The bottom end surface of the connecting mesh plate 413, the bottom end surface of the support cylinder 409 and the top end surface of the inner part of the fixed frame 410 are flush, and the rubber piston 415 fits with the inner wall of the support cylinder 409. The support cylinder 409 is slidably connected in the limit frame 5, and the side end of the limit frame 5 is fixedly connected with a rectangular The limiting rod 6, the rectangular limiting rod 6 is slidingly connected in the limiting groove 7, the limiting groove 7 is arranged on the second guide plate 406, and the length of the limiting groove 7 is greater than the length of the second guide groove 407. Only the first servo motor 2 and the first hydraulic rod 414 are needed to complete the efficient batch picking and placing of chips, thereby ensuring the stability and convenience of the subsequent packaging work of the chip body 14, effectively improving the working efficiency of the picking and placing equipment, reducing the use cost of the picking and placing equipment, and reducing the energy consumption of the picking and placing equipment, and at the same time can effectively improve the subsequent work efficiency of the automatic solid crystal assembly equipment.

[0050] In this example, the pretreatment component 8 includes a ventilation tube 801, which is fixedly connected to the inner bottom end surface of the fixed frame 1, a support rod 802 is fixedly connected inside the ventilation tube 801, and the other end of the support rod 802 is fixedly connected to a second servo motor 803, and an exhaust fan 804 and a large-aperture mesh plate 805 are fixedly connected to the output shaft of the second servo motor 803, and a rotating frame 806 is fixedly connected to the large-aperture mesh plate 805, and the rotating frame 806 is rotatably connected to the top of the ventilation tube 801 through a bearing, and the rotating frame 806 A flexible brush 807 is fixedly connected to the inner bottom end surface, and the exhaust fans 804 are equidistantly distributed on the output shaft of the second servo motor 803. The output shaft of the second servo motor 803 is fixed to the bottom center of the large-aperture mesh plate 805. The flexible brushes 807 are equiangularly distributed in the rotating frame 806. The depth of the rotating frame 806 is less than the length of the flexible brush 807. During the process of taking and placing the chip body 14, the chip body 14 can contact with the flexible brush 807. At this time, the second servo motor 803 can drive each exhaust fan by using the output shaft. The fan 804 and the rotating frame 806 on the large-aperture mesh plate 805 rotate simultaneously, and each flexible brush 807 can efficiently clean the chip body 14. A collecting mesh frame 808 is slidably connected through the ventilation tube 801, and a magnetic plate 809 is fixedly connected to the side end of the collecting mesh frame 808. The magnetic plate 809 is magnetically adsorbed and connected to the side wall of the ventilation tube 801. The inner wall of the ventilation tube 801 fits the front and rear end surfaces of the collecting mesh frame 808. The length and width of the magnetic plate 809 are respectively larger than the length and width of the end of the collecting mesh frame 808. Each exhaust fan 804 can suck the dust and impurities generated by cleaning into the ventilation tube 801, and use the collecting mesh frame 808 to filter and collect them conveniently and stably, thereby effectively avoiding dust and impurities sticking to the bottom of the chip body 14, resulting in an unstable subsequent placement state and affecting subsequent packaging processing. The magnetic plate 809 can be used to conveniently and stably disassemble and install the collecting mesh frame 808, so that the collected dust and impurities can be conveniently and stably transported, increasing the diversity and convenience of the use of the pick-and-place equipment.

[0051] In this example, an electric heating tube 810 is fixedly installed in the ventilation tube 801, a guide tube 811 is connected to the bottom side end of the ventilation tube 801, a connecting plate 812 is connected to the top of the guide tube 811, the connecting plate 812 is rotatably connected to the bottom end of the connecting frame 813 through a sealed bearing, a small nozzle 814 is connected to the top of the connecting frame 813, the connecting frame 813 is fixedly connected to the rotating frame 806, a second hydraulic rod 815 is fixedly installed at the bottom end of the ventilation tube 801, and the bottom end of the second hydraulic rod 815 is fixedly installed on the fixed frame 1, the electric heating tube 810, the connecting plate 812 and the connecting frame 813 are all in annular shape, the electric heating tube 810 is equidistantly distributed in the ventilation tube 801, and the electric heating The heat pipes 810 and the exhaust fans 804 are distributed alternately, the guide pipes 811 are symmetrically distributed on both sides of the bottom of the ventilator 801, and the small nozzles 814 are distributed at equal angles on the connecting frame 813. The top height of the small nozzles 814 is smaller than the top height of the flexible brush 807. Under the heating action of each electric heating tube 810, the air sucked by the exhaust fans 804 can be automatically heated. In conjunction with the guide pipes 811 on both sides, the reflux heated air can be stably transported to the connecting frame 813. In conjunction with the small nozzles 814, each chip body 14 in the operation process can be automatically and evenly preheated, thereby ensuring the stability and efficiency of the subsequent solid crystal work of each chip body 14.

[0052] In this example, the feeding troughs 10 are equidistantly distributed in the feeding box 9, the top end surface of the rubber frame 13 is flush with the top end surface of the feeding box 9, the elastic strength of the rubber frame 13 is greater than the elastic strength of the reset spring 11, and the positioning and conveying assembly 16 includes a rotating shaft 1601 and a connecting shaft 1608, the rotating shaft 1601 is rotatably connected to the fixed frame 1, the rotating shaft 1601 is connected to the transmission belt 15, a turntable 1602 is fixedly connected to the rotating shaft 1601, a positioning groove 1603 is provided on the turntable 1602, a connecting spring 1604 is fixedly connected to the turntable 1602, and the other end of the connecting spring 1604 is fixedly connected to a clamping rod 1605, the clamping rod 1605 is slidably connected in the turntable 1602, and the end of the clamping rod 1605 is clamped and connected to In the card slot 1606, the card slot 1606 is opened on the tooth block 1607, and the tooth block 1607 is engaged and connected in the positioning groove 1603. The positioning grooves 1603 are equiangularly distributed on the turntable 1602. The positioning grooves 1603 correspond to the card rods 1605 one by one. The depth of the positioning groove 1603 is less than the length of the tooth block 1607. During the rotation of the reciprocating screw 3, the transmission belt 15 can drive the rotating shaft 1601 to rotate stably. The tooth block 1607 on the turntable 1602 can drive the conveyor belt 1611 on the connecting shaft 1608 to rotate automatically and intermittently through the meshing circular gear 1609. At this time, under the intermittent rotation of the conveyor belt 1611, the taken chip body 14 can be stably placed in the adjacent chip frame 17.

[0053] In this example, the connecting shaft 1608 is rotatably connected to the fixing frame 1 and the mounting plate 1610, the mounting plate 1610 is fixedly connected to the inner bottom end surface of the fixing frame 1, the connecting shaft 1608 is fixedly connected to a circular gear 1609, the connecting shaft 1608 is connected to a conveyor belt 1611, the conveyor belt 1611 is fixedly connected to a flexible frame 1612, the flexible frame 1612 is threadedly connected to a threaded rod 1613, the end of the threaded rod 1613 is fixedly connected to a limiting plate 1614, a chip frame 17 is arranged in the flexible frame 1612, the turntable 1602 is located directly above the circular gear 1609, the diameter of the circular gear 1609 is larger than the diameter of the turntable 1602, and the turntable 1602 is connected to the tooth block 1607 The circular gear 1609 is meshed and connected, the flexible frame 1612 is evenly distributed on the conveyor belt 1611, and the threaded rod 1613 is connected to the middle part of the side end of the flexible frame 1612. The cooperation of the clamping rod 1605 and the clamping groove 1606 can conveniently adjust the number of tooth blocks 1607, and thus can conveniently adjust the movement distance of the conveyor belt 1611 during the process of taking and placing the chip body 14. Therefore, when chip frames 17 of different lengths are placed in the flexible frame 1612, the spacing between adjacent chip frames 17 is different. The adjusted movement distance of the conveyor belt 1611 can ensure that the chip body 14 is stably placed in each chip frame 17 of different batches, effectively improving the applicability of the placement equipment.

[0054] It should be noted that the present invention is a chip picking and placing device for automatic die-bonding assembly equipment. First, the staff can squeeze and transport the chip bodies 14 to be used to the various loading slots 10 on the loading box 9, and stack them. At this time, under the blocking effect of the rubber frame 13, the stability of the placement of each chip body 14 in each loading slot 10 on the loading box 9 can be ensured. Since the lengths of chip frames 17 of different batches are different, the staff can rotate the threaded rods 1613 on both sides of the flexible frame 1612. At this time, under the threaded rotation of the threaded rods 1613 on both sides, the corresponding limit plates 1614 can be pushed to move toward the middle, ensuring that the chip frames 17 of the same batch can be stably placed in the middle of the flexible frame 1612;

[0055] Then the staff can drive the first servo motor 2 on the fixed frame 1. At this time, under the driving action of the first servo motor 2, the reciprocating screw rod 3 can be driven to rotate stably in the fixed frame 1. At this time, under the continuous rotation of the reciprocating screw rod 3, the first guide plate 402 can be driven to perform convenient and stable left and right reciprocating motion through the threaded connecting plate 401. At this time, under the reciprocating motion of the first guide plate 402, the first guide groove 403 on the first guide plate 402 and the second guide groove 407 on the second guide plate 406 can be used to guide the guide rod 404 to move stably along the trajectory of the second guide groove 407. At this time, under the guiding action of the limit frame 5, the rectangular limit rod 6 and the limit groove 7, the support tube 409 on the guide rod 404 can be ensured to move stably along the trajectory of the second guide groove 407, thereby preventing the support tube 409 from rotating.

[0056] When the guide rod 404 moves to the bottom left end of the second guide groove 407, during the downward movement of the guide rod 404, the rubber suction cup 412 at the bottom of the fixed tube 411 can be driven by the fixed frame 410 at the bottom of the support tube 409 to stably insert into the loading groove 10, and then each chip body 14 in the loading groove 10 can be squeezed and pushed. At this time, the rubber suction cup 412 can be in close contact with the top layer of chip body 14, and when the guide rod 404 moves downward to the lowest end on the left side of the second guide groove 407, the contact head 405 on the guide rod 404 can contact the sensor 408 (model P11DDB-DULD) at the lowest end on the left side of the second guide groove 407, and then the first hydraulic rod 414 on the connecting mesh plate 413 can be driven. At this time, the first hydraulic rod 414 can drive the top rubber piston 415 to move upward in the support tube 409, cooperating with The air circulation of the through hole 416 can stably suck the air in each rubber suction cup 412 through each fixed tube 411 on the fixed frame 410. At this time, negative pressure is formed inside each rubber suction cup 412, so that the topmost chip body 14 can be adsorbed. Then the guide rod 404 can drive the support tube 409 to move to the upper right and right, and each rubber suction cup 412 can drive each chip body 14 to move away from the loading slot 10 on the loading box 9. Under the elastic pushing action of the reset spring 11 and the support plate 12, each chip body 14 in the loading slot 10 can be pushed to move upward until the chip body 14 of the second layer fits with the rubber frame 13. At this time, the rubber frame 13 can stably block it, ensuring that each rubber suction cup 412 can stably adsorb and take the chip body 14 next time. By analogy, the batch loading of the chip body 14 can be automatically completed;

[0057] When each rubber suction cup 412 can drive each chip body 14 to move to the right, each chip body 14 can contact with the flexible brush 807. At this time, under the driving action of the second servo motor 803, the output shaft can drive each exhaust fan 804 and the rotating frame 806 on the large-aperture mesh plate 805 to rotate simultaneously. At this time, under the rotation action of each flexible brush 807, each chip body 14 is cleaned conveniently and stably. At the same time, the rotation of each exhaust fan 804 can suck the dust and impurities generated by the cleaning into the ventilation hole. The dust and impurities are conveniently and stably filtered and collected by the collecting net frame 808, thereby effectively preventing the dust and impurities from sticking to the bottom of the chip body 14, causing the subsequent placement state to be unstable and affecting the subsequent packaging process. The collecting net frame 808 can be conveniently and stably disassembled and installed by the magnetic plate 809, thereby conveniently and stably transferring the collected dust and impurities. Under the heating effect of each electric heating tube 810, the air sucked by the exhaust fan 804 can be automatically heated, and the guide tubes 811 on both sides can be used to heat the air. The air after reflux heating can be stably delivered to the connecting frame 813, and during the rotation of the rotating frame 806, the connecting frame 813 can be driven to rotate stably. At this time, the bearing connection between the connecting frame 813 and the connecting plate 812 can be used to effectively avoid motion interference with the fixed guide tube 811. At this time, each small nozzle 814 can be used to automatically and evenly preheat each chip body 14 during the operation and cleaning process, thereby ensuring the stability and efficiency of the subsequent solid crystal work of each chip body 14. After the hot air is delivered, it can be sucked back again so that the hot air can be recycled, effectively improving the thermal energy utilization rate. The hydraulic drive of the second hydraulic rod 815 can push the ventilator 801 to move upward or downward stably, ensuring that each flexible brush 807 is in stable contact with the chip body 14 of different thicknesses, ensuring the stability of the subsequent cleaning and preheating treatment work, and the staff can adjust the closed and open states of each electric heating tube 810 to conveniently adjust the preheating temperature, thereby ensuring the efficiency and stability of the subsequent solid crystal work of the chip body 14.

[0058] Then, when each chip body 14 moves to the rightmost and lowest end along the trajectory of the second guide groove 407, each chip body 14 moves to the top of the chip frame 17 inside the flexible frame 1612. At this time, the contact head 405 on the guide rod 404 can contact the sensor 408 at the lowest end on the right side of the second guide groove 407, and then can drive the first hydraulic rod 414 on the connecting mesh plate 413 again. At this time, the first hydraulic rod 414 can drive the rubber piston 415 at the top to move downward and reset in the support cylinder 409, and cooperate with the air circulation of the through hole 416 to stably inflate each rubber suction cup 412 through each fixed tube 411 on the fixed frame 410. At this time, the internal air pressure of each rubber suction cup 412 is restored, and each chip body 14 can automatically move downward and detach from the rubber suction cup 412. At this time, each chip body 14 can stably fall into the chip frame 17;

[0059] During the continuous rotation of the reciprocating screw 3, the transmission belt 15 can drive the rotating shaft 1601 to rotate stably. At this time, the rotating shaft 1601 can drive the turntable 1602 to rotate stably. The tooth block 1607 on the turntable 1602 can drive the conveyor belt 1611 on the connecting shaft 1608 to automatically rotate intermittently through the meshing circular gear 1609. The clamping rod 1605 on the connecting spring 1604 cooperates with the positioning groove 1603 on the turntable 1602 to adjust the position of the tooth block 1607 conveniently and stably, ensuring that when each chip body 14 moves to the top of the chip frame 17, the conveyor belt 1611 is stopped. The flexible frame 1612 is in a state of stopping movement, so as to ensure the stability of subsequent unloading work. When loading another batch of chip frames 17, since the chip frames 17 of different lengths are placed in the flexible frame 1612, the spacing between adjacent chip frames 17 is different. The number of tooth blocks 1607 can be conveniently adjusted by the cooperation of the clamping rod 1605 and the clamping slot 1606, so that the movement distance of the conveyor belt 1611 can be conveniently adjusted during the process of taking and placing the chip body 14. The intermittent movement distance of the conveyor belt 1611 after adjustment can ensure that the chip body 14 is stably placed in each chip frame 17 of different batches.

[0060] At this time, under the intermittent rotation of the conveyor belt 1611, the taken chip body 14 can be stably placed in the adjacent chip frame 17; since the lengths of the chip frames 17 of different batches are different, the threaded rotation of the threaded rod 1613 can cooperate with the limit plate 1614 to conveniently position the chip frame 17 on one side of the inside of the flexible frame 1612, and the cooperation of the clamping rod 1605 and the clamping slot 1606 can conveniently adjust the number of tooth blocks 1607, and thus the movement distance of the conveyor belt 1611 during the process of taking and placing the chip body 14 can be conveniently adjusted. Therefore, when chip frames 17 of different lengths are placed in the flexible frame 1612, the spacing between adjacent chip frames 17 is different. The adjusted movement distance of the conveyor belt 1611 can ensure that the chip body 14 is stably placed in each chip frame 17 of different batches, effectively improving the applicability of the placement equipment.

[0061] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A chip pick-and-place device for an automatic die-bonding assembly device, comprising a fixing frame (1), characterized in that: A first servo motor (2) is fixedly mounted on the top side end of the fixed frame (1); a reciprocating screw rod (3) is connected to the output end of the first servo motor (2); the reciprocating screw rod (3) is rotatably connected in the fixed frame (1); a batch picking and placing assembly (4) is connected to the reciprocating screw rod (3); a pretreatment assembly (8) is installed in the fixed frame (1); a loading box (9) is fixedly connected to the inner bottom end surface of the fixed frame (1); a loading trough (10) is provided in the loading box (9); and the loading trough (10) is provided with a A return spring (11) is fixedly connected to the inner bottom end surface, a support plate (12) is fixedly connected to the top of the return spring (11), the support plate (12) and the chip body (14) are both limitedly slidably connected in the loading trough (10), a rubber frame (13) is fixedly connected to the top of the loading trough (10), a transmission belt (15) is connected to the reciprocating screw rod (3), the other end of the transmission belt (15) is connected to the positioning and conveying assembly (16), and the positioning and conveying assembly (16) is installed in the fixed frame (1).

2. A chip pick-and-place device for automatic die-bonding assembly equipment according to claim 1, characterized in that: The batch pick-and-place assembly (4) comprises a connecting plate (401) and a second guide plate (406), wherein the connecting plate (401) is threadedly connected to the reciprocating screw rod (3), a first guide plate (402) is fixedly connected to the bottom end surface of the connecting plate (401), a first guide groove (403) is formed through the first guide plate (402), a guide rod (404) is limitedly slidably connected in the first guide groove (403), a contact head (405) is fixedly mounted on the guide rod (404), and the second guide plate (406) is fixedly connected to the fixed guide rod (406). The frame (1) comprises a second guide plate (406) having a second guide groove (407) formed thereon, a sensor (408) being fixedly mounted at the bottom of the side end of the second guide groove (407), the first guide plate (402) and the second guide plate (406) being symmetrically distributed on both sides of the guide rod (404), the reciprocating screw rod (3) being connected to the middle part of the top of the connecting plate (401), the contact heads (405) being symmetrically distributed at both ends of the guide rod (404), and the sensors (408) being symmetrically distributed at the bottom of both sides of the second guide groove (407).

3. The chip pick-and-place device for automatic die bonding assembly equipment according to claim 2, characterized in that: The guide rod (404) is fixedly connected with a support tube (409), the bottom end of the support tube (409) is fixedly connected with a fixed frame (410), the bottom end of the support tube (409) is connected with the fixed frame (410), the bottom end of the fixed frame (410) is connected with a fixed tube (411), the bottom end of the fixed tube (411) is fixed with a rubber suction cup (412), the inner bottom end of the support tube (409) is fixedly connected with a connecting mesh plate (413), the top of the support tube (409) is fixed to the middle part of the guide rod (404), the central axis of the support tube (409) and the central axis of the fixed frame (410) are located on the same vertical center line, the fixed tubes (411) are equidistantly distributed at the bottom end of the fixed frame (410), and the fixed tubes (411) correspond one to one with the rubber suction cup (412).

4. The chip pick-and-place device for automatic die bonding assembly equipment according to claim 3, characterized in that: A first hydraulic rod (414) is fixedly mounted on the top surface of the connecting mesh plate (413), and a rubber piston (415) is connected to the top of the first hydraulic rod (414). The rubber piston (415) is slidably connected in a support tube (409) with a limited position. A through hole (416) is formed through the support tube (409). The bottom surface of the connecting mesh plate (413), the bottom surface of the support tube (409) and the top surface of the interior of the fixing frame (410) are The rubber piston (415) is flush with the inner wall of the support tube (409), the support tube (409) is slidably connected to the limit frame (5), the side end of the limit frame (5) is fixedly connected with a rectangular limit rod (6), the rectangular limit rod (6) is slidably connected to the limit groove (7), the limit groove (7) is provided on the second guide plate (406), and the length of the limit groove (7) is greater than the length of the second guide groove (407).

5. The chip pick-and-place device for automatic die-bonding assembly equipment according to claim 1, characterized in that: The pretreatment component (8) comprises a ventilation tube (801), wherein the ventilation tube (801) is fixedly connected to the inner bottom end surface of the fixed frame (1), a support rod (802) is fixedly connected inside the ventilation tube (801), the other end of the support rod (802) is fixedly connected to a second servo motor (803), an exhaust fan (804) and a large-aperture mesh plate (805) are fixedly connected to the output shaft of the second servo motor (803), a rotating frame (806) is fixedly connected to the large-aperture mesh plate (805), the rotating frame (806) is rotatably connected to the top of the ventilation tube (801) via a bearing, a flexible brush (807) is fixedly connected to the inner bottom end surface of the rotating frame (806), and the exhaust fan (804) is equidistantly distributed on the second servo motor (803). The output shaft of the motor (803) is fixed to the bottom center of the large-aperture mesh plate (805), and the flexible brushes (807) are distributed at equal angles in the rotating frame (806). The depth of the rotating frame (806) is less than the length of the flexible brush (807). A collecting mesh frame (808) is slidably connected through the ventilation duct (801). The side end of the collecting mesh frame (808) is fixedly connected with a magnetic plate (809). The magnetic plate (809) is magnetically adsorbed and connected to the side wall of the ventilation duct (801). The inner wall of the ventilation duct (801) fits the front and rear end surfaces of the collecting mesh frame (808). The length and width of the magnetic plate (809) are respectively greater than the length and width of the end of the collecting mesh frame (808).

6. The chip pick-and-place device for automatic die-bonding assembly equipment according to claim 5, characterized in that: An electric heating tube (810) is fixedly installed in the ventilation tube (801), a guide tube (811) is connected to the bottom side of the ventilation tube (801), a connecting plate (812) is connected to the top of the guide tube (811), the connecting plate (812) is rotatably connected to the bottom end of a connecting frame (813) via a sealing bearing, a small nozzle (814) is connected to the top of the connecting frame (813), the connecting frame (813) is fixedly connected to the rotating frame (806), a second hydraulic rod (815) is fixedly installed at the bottom end of the ventilation tube (801), and the second hydraulic rod (815) is connected to the bottom end of the ventilation tube (801). The bottom end of the pressure rod (815) is fixedly mounted on the fixing frame (1); the electric heating tube (810), the connecting plate (812) and the connecting frame (813) are all in annular shape; the electric heating tube (810) is evenly distributed in the ventilation tube (801); the electric heating tube (810) and the exhaust fan (804) are alternately distributed; the guide tube (811) is symmetrically distributed on both sides of the bottom of the ventilation tube (801); the small nozzles (814) are evenly distributed on the connecting frame (813); and the top height of the small nozzles (814) is less than the top height of the flexible brush (807).

7. The chip pick-and-place device for automatic die-bonding assembly equipment according to claim 1, characterized in that: The feeding grooves (10) are evenly distributed in the feeding box (9), the top end surface of the rubber frame (13) is flush with the top end surface of the feeding box (9), and the elastic strength of the rubber frame (13) is greater than the elastic strength of the return spring (11).

8. The chip pick-and-place device for automatic die-bonding assembly equipment according to claim 1, characterized in that: The positioning and conveying assembly (16) comprises a rotating shaft (1601) and a connecting shaft (1608), wherein the rotating shaft (1601) is rotatably connected to the fixed frame (1), the rotating shaft (1601) is connected to the transmission belt (15), a rotating disk (1602) is fixedly connected to the rotating shaft (1601), a positioning groove (1603) is provided on the rotating disk (1602), a connecting spring (1604) is fixedly connected to the rotating disk (1602), and the other end of the connecting spring (1604) is fixedly connected to the clamping rod (160 5), the clamping rod (1605) is slidably connected in the turntable (1602), the end of the clamping rod (1605) is snap-connected in the clamping groove (1606), the clamping groove (1606) is provided on the tooth block (1607), the tooth block (1607) is snap-connected in the positioning groove (1603), the positioning grooves (1603) are equiangularly distributed on the turntable (1602), the positioning grooves (1603) correspond one-to-one with the clamping rod (1605), and the depth of the positioning groove (1603) is less than the length of the tooth block (1607).

9. The chip pick-and-place device for automatic die-bonding assembly equipment according to claim 8, characterized in that: The connecting shaft (1608) is rotatably connected to the fixing frame (1) and the mounting plate (1610), the mounting plate (1610) is fixedly connected to the inner bottom end surface of the fixing frame (1), the connecting shaft (1608) is fixedly connected to a circular gear (1609), the connecting shaft (1608) is connected to a conveyor belt (1611), the conveyor belt (1611) is fixedly connected to a flexible frame (1612), the flexible frame (1612) is threadedly connected to a threaded rod (1613), the end of the threaded rod (1613) is fixedly connected to a limiting plate (1614), and a chip frame (17) is arranged in the flexible frame (1612).

10. The chip pick-and-place device for automatic die-bonding assembly equipment according to claim 9, characterized in that: The turntable (1602) is located directly above the circular gear (1609), the diameter of the circular gear (1609) is larger than the diameter of the turntable (1602), the turntable (1602) is meshedly connected with the circular gear (1609) via a tooth block (1607), the flexible frames (1612) are evenly distributed on the conveyor belt (1611), and the threaded rod (1613) is connected to the middle part of the side end of the flexible frame (1612).

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