Semiconductor packaging quality nondestructive testing device and method and pressing clamp

Abstract

The invention provides a semiconductor packaging quality nondestructive testing device and method and a pressing clamp, and relates to the technical field of semiconductor packaging detection. The clamp assembly comprises a pressing assembly, the pressing assembly comprises a first part and a second part which are rotatably connected, the first part is arranged on the carrier plate, the first part is provided with a pressing groove which is used for placing a semiconductor package, the second part is provided with a protruding block, when the pressing assembly is in a closed state, the second part abuts against the first part, and the protruding block can be located in the pressing groove; the bump is used for limiting the semiconductor package; the at least three first strip lines are arranged on the carrier plate, at least two first strip lines are used for being connected with a frequency sweeping source, and at least one first strip line is used for being grounded; and the at least two first connectors are arranged on the carrier plate and are used for connecting the first strip line and the sweep frequency source. According to the technical scheme, the pressing clamp not only meets the requirement for quality detection of semiconductor packaging, but also can achieve the effects of no damage and no soldering tin residue.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging testing technology, and in particular to a semiconductor packaging quality non-destructive testing device, method and pressing fixture. Background Art

[0002] In the related art, the soldering interconnection method will cause residual solder on the pins of the semiconductor package, which is not suitable for the pollution-free and non-destructive testing requirements of the packaging factory. Therefore, how to design a test fixture that can meet the requirements of quality inspection of semiconductor packages and can be non-destructive and free of solder residue is an urgent problem to be solved. Summary of the invention

[0003] In order to solve or improve at least one of the above technical problems, an object of the present invention is to provide a pressing clamp.

[0004] Another object of the present invention is to provide a semiconductor packaging quality nondestructive testing device having the above-mentioned pressing fixture.

[0005] Another object of the present invention is to provide a method for nondestructive testing of semiconductor packaging quality.

[0006] To achieve the above-mentioned purpose, the first aspect of the present invention provides a pressing fixture, including a carrier and a fixture assembly. The fixture assembly includes a pressing assembly, a torsion spring, at least three first strip lines and at least two first connectors. The pressing assembly includes a first part and a second part that are rotatably connected, the first part is arranged on the carrier, and the first part is detachably connected to the carrier. The pressing assembly has a closed state and an open state, the second part is rotatably connected to the first part through a first connecting shaft, and the second part can rotate relative to the first part around the axis of the first connecting shaft, so that the pressing assembly switches from a closed state to an open state, or from an open state to a closed state. The first part is provided with a pressing groove, and the pressing groove is used to place a semiconductor package. The second part is provided with a convex block. When the pressing assembly is in a closed state, the second part abuts against the first part, the convex block can be in the pressing groove, and the convex block is used to limit the semiconductor package. The torsion spring is sleeved on the first connecting shaft, one end of the torsion spring abuts against or is connected to the first part; the other end of the torsion spring abuts against or is connected to the second part. Under the elastic force of the torsion spring, the pressing component has a movement tendency to switch from an open state to a closed state. In addition, at least three first strip lines are arranged on the carrier board, at least two first strip lines are used to connect the sweep frequency source, and at least one first strip line is used for grounding. At least two first connectors are arranged on the carrier board, each first connector is connected to a corresponding first strip line, and the first connector is used to connect the sweep frequency source.

[0007] The present invention aims to provide a pressing fixture. By setting a pressing component, the staff can place the semiconductor package to be tested into the pressing groove of the pressing component and limit it by the protrusion. Compared with the traditional frequency domain measurement method in which the semiconductor package needs to be connected to the test fixture by welding, this design method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0008] The pressing fixture is used to perform quality inspection on semiconductor packages. Optionally, the semiconductor package is a SIP (System In a Package) package module. It should be noted that the SIP package module integrates multiple functional wafers, including processors, memory and other functional wafers, into one package according to application scenarios, the number of packaging substrate layers and other factors, thereby realizing a basic and complete functional packaging solution.

[0009] Semiconductor packaging can be seen everywhere in daily life and is widely used in consumer electronics, computers and peripherals, network communications, automotive electronics and other fields. SIP packaging modules (System In a Package) are in a harsh working environment for a long time (subjected to electrical, thermal and vibration shocks for a long time), and are prone to aging, resulting in reduced reliability, which in turn affects the normal operation of the system. Therefore, it is particularly important to study and test the reliability of SIP packaging modules.

[0010] Frequency Domain Reflectometer (FDR) technology has been applied in the fields of reliability testing (failure detection) and quality grade screening of SIP package modules. Different from the previous failure detection and quality grade screening by identifying the changes in the electrical parameters of the SIP package module, the frequency domain reflection measurement technology does not require the SIP package module to be powered on. It can quickly identify the failure type and damage degree of the SIP package module by measuring the frequency domain reflection impedance. This technology can effectively avoid the interference of the chip junction temperature on the test results, and does not require the establishment of additional test circuits. The advantages are very obvious.

[0011] However, along with the extremely high accuracy of frequency domain reflection measurement technology, there is also the problem of impedance matching, that is, the swept frequency source and SIP package module require a special test fixture for signal interconnection between the swept frequency input port, output port and ground and the pins of the SIP package module to be tested (DC+, DC- and GND pins, i.e. positive, negative and ground pins). The design of this test fixture needs to strictly guarantee the characteristic impedance requirement of 50Ω, and the input port, output port and ground need to be interconnected with the pins of the SIP package module to be tested through solder.

[0012] In the related art, the soldering interconnection method will cause residual solder on the pins of the SIP package module, which is not suitable for the non-contamination and non-destructive testing requirements of the packaging factory. Therefore, how to design a test fixture that can meet the requirements of quality inspection of semiconductor packaging and can be non-destructive and free of solder residue is an urgent problem to be solved.

[0013] The pressing fixture defined in the present invention not only meets the requirements for quality inspection of semiconductor packaging, but also can be non-destructive and free of solder residue.

[0014] The pressing fixture includes a carrier board and a fixture assembly. The carrier board is a PCB (Printed Circuit Board). When the transmission signal is below 1G, the carrier board is made of FR4 (a code for a flame retardant material grade). When the transmission signal is above 1G, the carrier board is made of Rogers board (a high-frequency board).

[0015] In addition, the clamp assembly includes a pressing assembly, a torsion spring, at least three first strip lines and at least two first connectors. Specifically, the pressing assembly includes a first part and a second part, the first part and the second part are rotatably connected, and the first part is arranged on the carrier.

[0016] Optionally, the connection between the first part and the carrier is a detachable connection, which is convenient for staff to disassemble and assemble the pressing assembly, and is conducive to maintenance or replacement. When the first part and the carrier are in a connected state, the first part and the carrier are relatively fixed, and the second part can rotate relative to the carrier.

[0017] Optionally, a groove is provided on the surface of the carrier, and at least a portion of the first part is provided in the groove to achieve a detachable connection between the first part and the carrier. Optionally, the first part and the carrier are detachably connected by bolts or other types of connectors. Optionally, the first part and the carrier are detachably connected by bonding.

[0018] It should be noted that the first part and the second part can be of any shape, such as a cube, a cuboid, a cylinder, etc.

[0019] The pressing component has a closed state and an open state, and the second part can rotate relative to the first part to switch the pressing component from the closed state to the open state, or from the open state to the closed state.

[0020] Optionally, the second part is rotatably connected to the first part via a first connecting shaft. The second part can rotate relative to the first part around the axis of the first connecting shaft.

[0021] Optionally, the pressing assembly further includes a torsion spring, which is sleeved on the first connecting shaft, one end of the torsion spring abuts against or is connected to the first part, and the other end of the torsion spring abuts against or is connected to the second part. Under the elastic force of the torsion spring, the pressing assembly has a movement tendency to switch from an open state to a closed state. In other words, by providing the torsion spring, the second part has a movement tendency to rotate toward the first part, so that when the pressing assembly is in a closed state, the second part and the first part can fit tightly.

[0022] The first part is provided with a pressing groove, which is used to place the semiconductor package. The second part is provided with a bump. When the pressing assembly is in a closed state, the second part abuts against the first part, and the bump can be in the pressing groove, and the bump is used to limit the semiconductor package.

[0023] It should be noted that the thickness of the bump is less than the depth of the pressing groove. This design ensures that the bump can limit the semiconductor package placed in the pressing groove without causing damage to the semiconductor package. In addition, by designing the thickness of the bump and the depth of the pressing groove, it can ensure that the pressing height of the semiconductor package is consistent each time.

[0024] Optionally, a probe is provided in the first part, the probe is a conductor, and an end of the probe extends out of the bottom wall of the pressing groove. The probe is used to abut against a pin of the semiconductor package to achieve circuit conduction.

[0025] The pressing fixture provided by the present invention is provided with a pressing component, and when the pressing component is in a closed state, the probe in the first part can stably contact the pin of the semiconductor package. Compared with the method in which the semiconductor package needs to be connected to the test fixture by welding in the traditional frequency domain measurement, this method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0026] At least three first strip lines are arranged on the carrier board, at least three first strip lines are connected to the first part, at least two first strip lines are used to connect to the sweep frequency source, and at least one first strip line is used to ground.

[0027] Optionally, the first stripline is connected to a probe in the first portion.

[0028] It should be emphasized that the number of the first strip lines is at least three, that is, the first strip lines can be three or more, and the first strip lines can be flexibly set according to actual needs. By setting the connecting line as a strip line, the stable transmission of the circuit signal can be ensured, which is conducive to improving the accuracy of quality inspection of semiconductor packaging.

[0029] At least two first connectors are arranged on the carrier board, each of the first connectors is connected to a corresponding first strip line, and the first connectors are used to connect to the sweep frequency source.

[0030] The number of the first connectors is at least two, that is, there can be two or more first connectors, and the first connectors can be flexibly set according to actual needs.

[0031] Optionally, the connection between the first connector and the carrier board is a detachable connection, which is convenient for staff to disassemble and assemble the pressing component and is conducive to maintenance or replacement.

[0032] Optionally, the carrier has a first side and a second side arranged opposite to each other along a first direction. Optionally, the first direction is a width direction of the carrier. At least one first connector is arranged on the first side of the carrier, and at least one first connector is arranged on the second side of the carrier. At least one first stripline is connected to the first connector arranged on the first side of the carrier; at least one first stripline is connected to the first connector arranged on the second side of the carrier; at least one first stripline is used for grounding.

[0033] By providing the first connector, it is beneficial to achieve a stable connection between the fixture component and the port of the frequency sweep source, thereby ensuring the accuracy of quality inspection of semiconductor packaging.

[0034] Optionally, the swept frequency source is a vector network analyzer or an impedance analyzer.

[0035] The present invention aims to provide a pressing fixture. By setting a pressing component, the staff can place the semiconductor package to be tested into the pressing groove of the pressing component and limit it by the protrusion. Compared with the traditional frequency domain measurement method in which the semiconductor package needs to be connected to the test fixture by welding, this design method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0036] The pressing fixture provided by the present invention solves the problem of realizing fast frequency domain measurement of semiconductor packaging in a non-soldering interconnection manner, successfully expands the frequency domain measurement technology to the field of online quality screening and online quality inspection of semiconductor packaging, and is suitable for the needs of non-contamination, non-destructive and fast inspection of semiconductor packaging. It avoids the traditional frequency domain measurement that relies on soldering to complete the connection between the measuring fixture and the module to be measured, solves the problem of difficult control of solder volume, reduces cumbersome operation procedures, and greatly reduces the difficulty, time and cost of frequency domain measurement.

[0037] In addition, when the pressing component is in the closed state, the second part is against the first part, and the bump can be in the pressing groove, and the bump is used to limit the semiconductor package. This design method realizes a test requirement for press-type installation frequency domain measurement suitable for semiconductor packaging, ensuring the consistency of the pressing height of the semiconductor package each time, thereby ensuring high repeatability and non-destructive, no solder residue measurement requirements. This design method meets the special needs of high-precision frequency domain measurement.

[0038] In addition, the above technical solution provided by the present invention may also have the following additional technical features: In some technical solutions, optionally, the clamp assembly further includes: at least three sliding switches disposed on the carrier board, each sliding switch being disposed on a corresponding first strip line, and the sliding switch being used to control the on-off of a circuit of the first strip line.

[0039] In this technical solution, the number of the sliding switches is at least three, that is, the sliding switches can be three or more, and the sliding switches can be flexibly set according to actual needs.

[0040] Optionally, the connection between the sliding switch and the carrier plate is a detachable connection, which is convenient for staff to disassemble and assemble the pressing component and is conducive to maintenance or replacement.

[0041] By setting the sliding switch, the free connection and disconnection between each pin of the pressing fixture and the ground plane and the signal line can be achieved, which meets the needs of frequency domain measurement of multi-pin semiconductor packages and has the characteristics of high versatility testing.

[0042] In some technical solutions, optionally, the first part is provided with at least three probes, one end of the probe extends out of the bottom wall of the pressing groove, and each probe is connected to a corresponding first strip line.

[0043] In this technical solution, when the pressing component is in the closed state, the probe in the first part can stably contact the pin of the semiconductor package to achieve circuit conduction. Compared with the traditional frequency domain measurement method in which the semiconductor package needs to be connected to the test fixture by welding, this method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0044] In some technical solutions, optionally, the pressing fixture also includes a SOLT (Short, Open, Load, Through) de-embedding calibration fixture. The SOLT de-embedding calibration fixture includes a first de-embedding structure, a second de-embedding structure, a third de-embedding structure and a fourth de-embedding structure. The first de-embedding structure includes two second strip lines of equal length, the second strip lines are arranged on a carrier, and the two second strip lines are not connected. The second de-embedding structure includes two third strip lines of equal length, the third strip lines are arranged on a carrier, the two third strip lines are not connected, and one end of the third strip line is used to connect the first resistor. The third de-embedding structure includes two fourth strip lines of equal length, the fourth strip lines are arranged on a carrier, the two fourth strip lines are not connected, and one end of the fourth strip line is used to connect the second resistor. The fourth de-embedding structure includes a fifth strip line, and the fifth strip line is arranged on the carrier.

[0045] In this technical solution, the first de-embedding structure is a Short de-embedding structure, i.e., a short-circuit de-embedding structure. The second de-embedding structure is an Open de-embedding structure, i.e., an open-circuit de-embedding structure. The third de-embedding structure is a Load de-embedding structure, i.e., a load de-embedding structure. The fourth de-embedding structure is a Through de-embedding structure, i.e., a through de-embedding structure.

[0046] By adding a SOLT de-embedding calibration fixture, the measurement plane of the frequency domain measurement is calibrated from the signal output port of the swept frequency source to the two ends of the fixture assembly (the first side and the second side of the carrier board), which can eliminate most of the measurement errors introduced by the fixture assembly and the swept frequency source system.

[0047] The present invention defines a press fixture with a built-in SOLT de-embedding structure, which eliminates the need for expensive external dedicated calibration components, and can calibrate the measurement plane from the output position of the sweep source signal to the pin plane of the module to be tested, which greatly reduces the test cost and improves the measurement accuracy. In addition, the SOLT de-embedding structure is integrated in the press fixture, which is more convenient to carry and easy to promote and use.

[0048] In some technical solutions, optionally, the first de-embedding structure further includes: two second connectors, which are respectively arranged on two sides of the carrier board, and each second connector is connected to a corresponding second strip line.

[0049] In this technical solution, among the two second connectors, one second connector is arranged on the first side of the carrier board, and the other second connector is arranged on the second side of the carrier board.

[0050] The second connector is provided to facilitate stable connection between the first de-embedding structure and the port of the frequency sweep source, thereby ensuring the accuracy of quality inspection of semiconductor packaging.

[0051] Optionally, the second connector is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the frequency sweep source. This connection method is conducive to improving the stability of the connection between the first de-embedding structure and the port of the frequency sweep source, and ensuring the accuracy of quality inspection of semiconductor packaging.

[0052] In some technical solutions, optionally, the second de-embedding structure further includes: two third connectors, which are respectively arranged on two sides of the carrier board, and each third connector is connected to a corresponding third strip line.

[0053] In this technical solution, among the two third connectors, one third connector is arranged on the first side of the carrier board, and the other third connector is arranged on the second side of the carrier board.

[0054] The third connector is provided to facilitate stable connection between the second de-embedding structure and the port of the frequency sweep source, thereby ensuring the accuracy of quality inspection of semiconductor packaging.

[0055] Optionally, the third connector is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the frequency sweep source. This connection method is conducive to improving the stability of the connection between the second de-embedding structure and the port of the frequency sweep source, and ensuring the accuracy of quality inspection of semiconductor packaging.

[0056] In some technical solutions, optionally, the third de-embedding structure further includes: two fourth connectors, which are respectively arranged on two sides of the carrier board, and each fourth connector is connected to a corresponding fourth strip line.

[0057] In this technical solution, among the two fourth connectors, one fourth connector is arranged on the first side of the carrier board, and the other fourth connector is arranged on the second side of the carrier board.

[0058] The fourth connector is provided to facilitate stable connection between the third de-embedding structure and the port of the frequency sweep source, thereby ensuring the accuracy of quality inspection of semiconductor packaging.

[0059] Optionally, the fourth connector is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the frequency sweep source. This connection method is conducive to improving the stability of the connection between the third de-embedding structure and the port of the frequency sweep source, and ensuring the accuracy of quality inspection of semiconductor packaging.

[0060] In some technical solutions, optionally, the fourth de-embedding structure further includes: two fifth connectors, which are respectively arranged on two sides of the carrier board, and each fifth connector is connected to a corresponding fifth strip line.

[0061] In this technical solution, among the two fifth connectors, one fifth connector is arranged on the first side of the carrier board, and the other fifth connector is arranged on the second side of the carrier board.

[0062] The fifth connector is provided to facilitate stable connection between the fourth de-embedding structure and the port of the frequency sweep source, thereby ensuring the accuracy of quality inspection of semiconductor packaging.

[0063] Optionally, the fifth connector is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the frequency sweep source. This connection method is conducive to improving the stability of the connection between the fourth de-embedding structure and the port of the frequency sweep source, and ensuring the accuracy of quality inspection of semiconductor packaging.

[0064] A second aspect of the present invention provides a semiconductor packaging quality nondestructive testing device, comprising a frequency sweeping source and a pressing fixture in any of the above technical solutions, wherein the pressing fixture is connected to the frequency sweeping source.

[0065] Since the semiconductor packaging quality nondestructive testing device includes any one of the pressing fixtures in the first aspect above, it has the beneficial effects of any one of the above technical solutions, which will not be described in detail here.

[0066] The third aspect of the present invention provides a semiconductor packaging quality non-destructive testing method, which is used in the semiconductor packaging quality non-destructive testing device in the above technical solution. The semiconductor packaging quality non-destructive testing method includes: In the first step, the semiconductor package is placed in a pressing groove of a pressing fixture of a semiconductor package quality non-destructive testing device, and the semiconductor package is limited by a protrusion of the pressing fixture.

[0067] The second step is to adjust the slide switch of the pressing fixture according to the test requirements for the semiconductor package.

[0068] The third step is to connect the first connector of the pressing fixture to the sweep frequency source of the semiconductor packaging quality non-destructive testing device to achieve signal interconnection between the pressing fixture and the sweep frequency source.

[0069] The fourth step is to perform frequency domain testing on the semiconductor package according to a preset frequency sweep range to complete the quality inspection of the semiconductor package.

[0070] The present invention aims to provide a method for nondestructive testing of semiconductor package quality. By setting a pressing component, a worker can place the semiconductor package to be tested into the pressing groove of the pressing component and limit it by a bump. Compared with the traditional frequency domain measurement method in which the semiconductor package needs to be connected to the test fixture by welding, this design method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0071] Additional aspects and advantages of the technical solutions of the present invention will become apparent in the following description or will be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] Figure 1 A schematic structural diagram of a pressing fixture according to an embodiment of the present invention is shown; Figure 2 A schematic structural diagram of a clamp assembly according to an embodiment of the present invention is shown; Figure 3 shows a side view of a pressing assembly according to one embodiment of the present invention; Figure 4 shows a top view of a pressing assembly according to one embodiment of the present invention; Figure 5 A schematic structural diagram of a SOLT de-embedding calibration fixture according to an embodiment of the present invention is shown; Figure 6 A structural block diagram of a semiconductor packaging quality nondestructive testing device according to an embodiment of the present invention is shown; Figure 7 A schematic structural diagram of a pressing fixture according to another embodiment of the present invention is shown; Figure 8 A flow chart of a semiconductor package quality nondestructive testing method according to an embodiment of the present invention is shown.

[0073] in, Figures 1 to 7 The corresponding relationship between the reference numerals and the component names is as follows: 100: pressing fixture; 110: carrier; 111: first side; 112: second side; 120: fixture assembly; 121: pressing assembly; 1211: first part; 1212: pressing groove; 1213: probe; 1214: second part; 1215: bump; 123: first strip line; 124: slide switch; 125: first connector; 126: first connecting axis; 127: torsion spring; 130: SOLT de-embedding calibration fixture; 131: first de-embedding structure; 1311: second strip line ; 1312: second connector; 132: second de-embedding structure; 1321: third strip line; 1322: third connector; 1323: first resistor; 133: third de-embedding structure; 1331: fourth strip line; 1332: fourth connector; 1333: second resistor; 134: fourth de-embedding structure; 1341: fifth strip line; 1342: fifth connector; 200: semiconductor package quality non-destructive testing device; 210: swept frequency source; 300: semiconductor package; a: first direction. DETAILED DESCRIPTION

[0074] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present invention, the embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0075] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0076] Refer to the following Figures 1 to 8A pressing fixture 100 , a semiconductor package quality nondestructive testing device 200 , and a semiconductor package quality nondestructive testing method according to some embodiments of the present invention are described.

[0077] The pressing fixture 100 is used to perform quality inspection on the semiconductor package 300. Optionally, the semiconductor package 300 is a SIP (System In a Package) package module. It should be noted that the SIP package module integrates multiple functional wafers, including processors, memories and other functional wafers, into one package according to application scenarios, the number of layers of the package substrate and other factors, thereby realizing a packaging solution with basic complete functions.

[0078] Semiconductor packages 300 can be seen everywhere in daily life and are widely used in consumer electronics, computers and peripherals, network communications, automotive electronics and other fields. SIP package modules (System In a Package) are in a harsh working environment for a long time (subjected to electrical, thermal and vibration shocks for a long time), and are prone to aging, resulting in reduced reliability, which in turn affects the normal operation of the system. Therefore, it is particularly important to study and test the reliability of SIP package modules.

[0079] Frequency Domain Reflectometer (FDR) technology has been applied in the fields of reliability testing (failure detection) and quality grade screening of SIP package modules. Different from the previous failure detection and quality grade screening by identifying the changes in the electrical parameters of the SIP package module, the frequency domain reflection measurement technology does not require the SIP package module to be powered on. It can quickly identify the failure type and damage degree of the SIP package module by measuring the frequency domain reflection impedance. This technology can effectively avoid the interference of the chip junction temperature on the test results, and does not require the establishment of additional test circuits. The advantages are very obvious.

[0080] However, along with the extremely high accuracy of the frequency domain reflection measurement technology, there is also the problem of impedance matching, that is, the sweep source 210 and the SIP package module require a special test fixture for signal interconnection between the sweep input port, the output port and the ground and the pins (DC+, DC- and GND pins, i.e., the positive, negative and ground pins) of the SIP package module to be tested. The test fixture needs to strictly guarantee the characteristic impedance requirement of 50Ω when designing, and the input port, the output port and the ground need to be interconnected with the pins of the SIP package module to be tested through solder.

[0081] In the related art, the soldering interconnection method will cause residual solder on the pins of the SIP package module, which is not suitable for the non-contamination and non-destructive testing requirements of the packaging factory. Therefore, how to design a test fixture that can meet the requirements of quality inspection of the semiconductor package 300 and can be non-destructive and free of solder residue is a problem that needs to be solved urgently.

[0082] The pressing fixture 100 defined in the present invention not only meets the requirements of quality inspection of the semiconductor package 300, but also can be non-destructive and free of solder residue.

[0083] In one embodiment according to the present invention, Figure 1 As shown, the pressing fixture 100 includes a carrier board 110 and a fixture assembly 120. The carrier board 110 is a PCB (Printed Circuit Board).

[0084] In addition, if Figure 1 , Figure 2 and Figure 7 As shown, the clamp assembly 120 includes a pressing assembly 121, a torsion spring 127, at least three first strip lines 123 and at least two first connectors 125. Specifically, the pressing assembly 121 includes a first portion 1211 and a second portion 1214, the first portion 1211 and the second portion 1214 are rotatably connected, and the first portion 1211 is disposed on the carrier 110.

[0085] Optionally, the connection between the first part 1211 and the carrier 110 is a detachable connection, which is convenient for the staff to disassemble and assemble the pressing assembly 121, which is convenient for maintenance or replacement. When the first part 1211 and the carrier 110 are in a connected state, the first part 1211 and the carrier 110 are relatively fixed, and the second part 1214 can rotate relative to the carrier 110.

[0086] Optionally, a groove is provided on the surface of the carrier 110, and at least a portion of the first portion 1211 is disposed in the groove to achieve a detachable connection between the first portion 1211 and the carrier 110. Optionally, the first portion 1211 and the carrier 110 are detachably connected by bolts or other types of connectors. Optionally, the first portion 1211 and the carrier 110 are detachably connected by bonding.

[0087] It should be noted that the first portion 1211 and the second portion 1214 can be any shape, such as a cube, a cuboid, a cylinder, etc.

[0088] The pressing assembly 121 has a closed state and an open state, and the second portion 1214 can rotate relative to the first portion 1211 to switch the pressing assembly 121 from the closed state to the open state, or from the open state to the closed state.

[0089] Alternatively, if Figure 2 and Figure 4 As shown, the second part 1214 is rotatably connected to the first part 1211 via the first connecting shaft 126. The second part 1214 can rotate relative to the first part 1211 around the axis of the first connecting shaft 126.

[0090] Alternatively, if Figure 3 and Figure 4 As shown, the pressing assembly 121 further includes a torsion spring 127, which is sleeved on the first connecting shaft 126, one end of the torsion spring 127 is against or connected to the first part 1211, and the other end of the torsion spring 127 is against or connected to the second part 1214. Under the elastic force of the torsion spring 127, the pressing assembly 121 has a movement tendency to switch from an open state to a closed state. In other words, by providing the torsion spring 127, the second part 1214 has a movement tendency to rotate toward the first part 1211, so that when the pressing assembly 121 is in a closed state, the second part 1214 can fit tightly with the first part 1211.

[0091] like Figure 2 , Figure 3 , Figure 4 and Figure 7 As shown, the first part 1211 is provided with a pressing groove 1212, and the pressing groove 1212 is used to place the semiconductor package 300. The second part 1214 is provided with a bump 1215. When the pressing component 121 is in a closed state, the second part 1214 abuts against the first part 1211, and the bump 1215 can be in the pressing groove 1212, and the bump 1215 is used to limit the semiconductor package 300.

[0092] It should be noted that the thickness of the bump 1215 is less than the depth of the pressing groove 1212. This design ensures that the bump 1215 limits the semiconductor package 300 placed in the pressing groove 1212 without causing damage to the semiconductor package 300. In addition, by designing the thickness of the bump 1215 and the depth of the pressing groove 1212, it can ensure that the pressing height of the semiconductor package 300 is consistent each time.

[0093] Optionally, the edge of the bump 1215 is chamfered.

[0094] Optionally, a circular arc transition surface is provided at the edge of the protrusion 1215. By providing the circular arc transition surface, it can play a guiding role to a certain extent, so that the protrusion 1215 can smoothly enter the pressing groove 1212 during the process of switching the pressing assembly 121 from the open state to the closed state. Figure 2 and Figure 4As shown, a probe 1213 is disposed in the first portion 1211. The probe 1213 is a conductor, and its end extends out of the bottom wall of the pressing groove 1212. The probe 1213 is used to abut against the pin of the semiconductor package 300 to achieve circuit conduction.

[0095] The pressing fixture 100 provided by the present invention is provided with a pressing component 121, and when the pressing component 121 is in a closed state, the probe 1213 in the first part 1211 can stably contact the pin of the semiconductor package 300. Compared with the method in which the semiconductor package 300 needs to be connected to the test fixture by welding in the traditional frequency domain measurement, this method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0096] At least three first strip lines 123 are disposed on the carrier 110. At least three first strip lines 123 are connected to the first portion 1211. At least two first strip lines 123 are used to connect to the swept frequency source 210, and at least one first strip line 123 is used to be grounded.

[0097] Optionally, the first strip line 123 is connected to a probe 1213 in the first portion 1211 .

[0098] It should be emphasized that the number of the first strip lines 123 is at least three, that is, the first strip lines 123 can be three or more, and the first strip lines 123 can be flexibly set according to actual needs. By setting the connecting line as a strip line, the stable transmission of the circuit signal can be ensured, which is conducive to improving the accuracy of quality inspection of the semiconductor package 300.

[0099] like Figure 1 and Figure 2 As shown, at least two first connectors 125 are disposed on the carrier board 110. Each first connector 125 is connected to a corresponding strip line, and the first connector 125 is used to connect to the swept frequency source 210.

[0100] It should be emphasized that the number of the first connectors 125 is at least two, that is, the number of the first connectors 125 can be two or more, and the first connectors 125 can be flexibly set according to actual needs.

[0101] Optionally, the first connector 125 and the carrier board 110 are connected in a detachable manner, so that the staff can disassemble and assemble the pressing component 121 conveniently, which is beneficial for maintenance or replacement.

[0102] Optionally, the first connector 125 and the carrier board 110 are detachably connected by bolts or other types of connectors. Optionally, the first connector 125 and the carrier board 110 are detachably connected by bonding.

[0103] Optionally, the carrier 110 has a first side 111 and a second side 112 that are oppositely disposed along a first direction a. Optionally, the first direction a is a width direction of the carrier 110. At least one first connector 125 is disposed on the first side 111 of the carrier 110, and at least one first connector 125 is disposed on the second side 112 of the carrier 110. At least one first stripline 123 is connected to the first connector 125 disposed on the first side 111 of the carrier 110; at least one first stripline 123 is connected to the first connector 125 disposed on the second side 112 of the carrier 110; and at least one first stripline 123 is used for grounding.

[0104] In a specific embodiment, the number of the first connectors 125 is two, and the number of the first strip lines 123 is three. One of the first connectors 125 is disposed on the first side 111 of the carrier 110, and the other first connector 125 is disposed on the second side 112 of the carrier 110. Among the three first strip lines 123, one first strip line 123 is connected to the first connector 125 disposed on the first side 111 of the carrier 110; one first strip line 123 is connected to the first connector 125 disposed on the second side 112 of the carrier 110; and one first strip line 123 is used for grounding.

[0105] The first connector 125 is provided to facilitate stable connection between the fixture assembly 120 and the port of the frequency sweep source 210 , thereby ensuring accuracy of quality inspection of the semiconductor package 300 .

[0106] Optionally, the first connector 125 is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the sweep source 210. This connection method is conducive to improving the stability of the connection between the fixture assembly 120 and the port of the sweep source 210, and ensuring the accuracy of quality inspection of the semiconductor package 300.

[0107] Optionally, the swept frequency source 210 is a vector network analyzer or an impedance analyzer.

[0108] The present invention aims to provide a pressing fixture 100. By setting a pressing component 121, a staff member can place a semiconductor package 300 to be tested into a pressing groove 1212 of the pressing component 121 and limit it by a bump 1215. Compared with the traditional frequency domain measurement method in which the semiconductor package 300 needs to be connected to the test fixture by welding, this design method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0109] The pressing fixture 100 provided by the present invention solves the problem of realizing fast frequency domain measurement of semiconductor package 300 in a non-soldering interconnection manner, successfully expands the frequency domain measurement technology to the field of online quality screening and online quality inspection of semiconductor package 300, and is suitable for the needs of non-contamination, non-destructive and fast inspection of semiconductor package 300. It avoids the traditional frequency domain measurement that relies on soldering to complete the connection between the measuring fixture and the module to be measured, solves the problem of difficult control of solder amount, reduces cumbersome operation procedures, and greatly reduces the difficulty, time and cost of frequency domain measurement.

[0110] In addition, when the pressing component 121 is in the closed state, the second part 1214 abuts against the first part 1211, and the bump 1215 can be in the pressing groove 1212, and the bump 1215 is used to limit the semiconductor package 300. This design method realizes a test requirement for frequency domain measurement of a press-type installation suitable for the semiconductor package 300, ensures the consistency of the pressing height of the semiconductor package 300 each time, thereby ensuring high repeatability and non-destructive, no solder residue measurement requirements, and this design method meets the special needs of high-precision frequency domain measurement.

[0111] In some embodiments, optionally, Figure 1 , Figure 2 and Figure 7 As shown, the fixture assembly 120 further includes at least three slide switches 124. The at least three slide switches 124 are disposed on the carrier 110. Each slide switch 124 is disposed on a corresponding first strip line 123, and the slide switch 124 is used to control the on and off of the circuit of the first strip line 123.

[0112] It should be emphasized that the number of the sliding switches 124 is at least three, that is, the sliding switches 124 can be three or more, and the sliding switches 124 can be flexibly set according to actual needs.

[0113] Optionally, the connection between the sliding switch 124 and the carrier plate 110 is a detachable connection, which is convenient for staff to disassemble and assemble the pressing component 121 and is conducive to maintenance or replacement.

[0114] Optionally, a mounting groove is provided on the surface of the carrier 110, and at least a portion of the sliding switch 124 is disposed in the mounting groove to achieve a detachable connection between the sliding switch 124 and the carrier 110. Optionally, the sliding switch 124 and the carrier 110 are detachably connected by bolts or other types of connectors. Optionally, the sliding switch 124 and the carrier 110 are detachably connected by bonding.

[0115] Optionally, the slide switch 124 has a first state and a second state, wherein the first state is a working state and the second state is a non-working state. When the slide switch 124 is in the first state, the circuit of the first strip line 123 is turned on; when the slide switch 124 is in the second state, the circuit of the first strip line 123 is turned off.

[0116] Optionally, the slide switch 124 includes a connecting portion and a sliding portion. The connecting portion is used to connect to the carrier 110. The sliding portion is movably disposed on the connecting portion, and the sliding portion can move relative to the connecting portion. When the sliding portion moves to a first position, the slide switch 124 is in a first state; when the sliding portion moves to a second position, the slide switch 124 is in a second state.

[0117] In a specific embodiment, there are three first strip lines 123 and three slide switches 124. Each slide switch 124 is disposed on a corresponding first strip line 123. Two first strip lines 123 are respectively connected to the first port (port1) and the second port (port2) of the sweep frequency source 210. Another first strip line 123 is used for grounding.

[0118] By setting the sliding switch 124, free connection and disconnection between each pin of the pressing fixture 100 and the ground plane and the signal line is achieved, meeting the requirements of frequency domain measurement of multi-pin semiconductor package 300, and having the characteristics of high universality test.

[0119] In some embodiments, optionally, Figure 2 and Figure 4 As shown, the first portion 1211 is provided with at least three probes 1213 , one end of the probe 1213 extends out of the bottom wall of the pressing groove 1212 , and each probe 1213 is connected to a corresponding first strip line 123 .

[0120] When the pressing component 121 is in the closed state, the probe 1213 in the first part 1211 can stably contact the pin of the semiconductor package 300 to achieve circuit conduction. Compared with the traditional frequency domain measurement method in which the semiconductor package 300 needs to be connected to the test fixture by welding, this method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0121] In some embodiments, optionally, Figure 1 , Figure 5 and Figure 7As shown, the pressing fixture 100 also includes a SOLT (Short, Open, Load, Through) de-embedding calibration fixture. The SOLT de-embedding calibration fixture 130 includes a first de-embedding structure 131, a second de-embedding structure 132, a third de-embedding structure 133 and a fourth de-embedding structure 134.

[0122] The first de-embedding structure 131 includes two second strip lines 1311 of equal length. The second strip lines 1311 are disposed on the carrier 110, and the two second strip lines 1311 are not connected.

[0123] Optionally, the second stripline 1311 is used to connect to the first port of the swept frequency source 210 .

[0124] Optionally, the two second strip lines 1311 are collinearly arranged, and the sum of the lengths of the two second strip lines 1311 is smaller than the dimension of the carrier 110 in the first direction a. Optionally, the sum of the lengths of the two second strip lines 1311 is smaller than the width of the carrier 110 .

[0125] Optionally, one end of one of the second strip lines 1311 is disposed on the first side 111 of the carrier 110, and the other end extends toward the second side 112 of the carrier 110. Another end of the second strip line 1311 is disposed on the second side 112 of the carrier 110, and the other end extends toward the first side 111 of the carrier 110.

[0126] The two second strip lines 1311 are not connected, that is, the two second strip lines 1311 are designed to be disconnected and isolated.

[0127] It should be noted that the first de-embedding structure 131 is a Short de-embedding structure, that is, a short-circuit de-embedding structure.

[0128] The second de-embedding structure 132 includes two third strip lines 1321 of equal length. The third strip lines 1321 are disposed on the carrier 110 . The two third strip lines 1321 are not connected. One end of the third strip line 1321 is used to connect to the first resistor 1323 .

[0129] Optionally, the third stripline 1321 is used to connect to the second port of the swept frequency source 210 .

[0130] Optionally, the two third strip lines 1321 are collinearly arranged, and the sum of the lengths of the two third strip lines 1321 is smaller than the dimension of the carrier 110 in the first direction a. Optionally, the sum of the lengths of the two third strip lines 1321 is smaller than the width of the carrier 110 .

[0131] Optionally, one end of one of the third strip lines 1321 is disposed on the first side 111 of the carrier 110, and the other end extends toward the second side 112 of the carrier 110. Another end of another third strip line 1321 is disposed on the second side 112 of the carrier 110, and the other end extends toward the first side 111 of the carrier 110.

[0132] Optionally, the first resistor 1323 is an isolation resistor. The resistance of the first resistor 1323 is greater than 50 GΩ to ensure complete isolation of signal transmission.

[0133] It should be noted that the second de-embedding structure 132 is an Open de-embedding structure, that is, an open circuit de-embedding structure.

[0134] The third de-embedding structure 133 includes two fourth strip lines 1331 of equal length. The fourth strip lines 1331 are disposed on the carrier 110 , the two fourth strip lines 1331 are not connected, and one end of the fourth strip line 1331 is used to connect the second resistor 1333 .

[0135] The fourth strip line 1331 is used to connect to the third port of the swept frequency source 210 .

[0136] Optionally, the two fourth strip lines 1331 are collinearly arranged, and the sum of the lengths of the two fourth strip lines 1331 is smaller than the dimension of the carrier 110 in the first direction a. Optionally, the sum of the lengths of the two fourth strip lines 1331 is smaller than the width of the carrier 110 .

[0137] Optionally, one end of one of the fourth strip lines 1331 is disposed on the first side 111 of the carrier 110, and the other end extends toward the second side 112 of the carrier 110. Another end of the fourth strip line 1331 is disposed on the second side 112 of the carrier 110, and the other end extends toward the first side 111 of the carrier 110.

[0138] Optionally, the second resistor 1333 is at least two surface mount resistors connected in parallel. Optionally, the second resistor 1333 is two surface mount resistors connected in parallel and having a resistance of 100Ω, so as to achieve 50Ω impedance matching.

[0139] It should be noted that by using two surface mount resistors with a resistance of 100Ω in parallel, a 50Ω effect is achieved in parallel, thereby meeting the 50Ω impedance matching requirement. The 50Ω impedance matching here means that the devices, lines, and equipment in the entire circuit loop are all 50Ω, in order to reduce signal reflection.

[0140] It should be noted that the third de-embedding structure 133 is a Load de-embedding structure, that is, a load de-embedding structure.

[0141] The fourth de-embedding structure 134 includes a fifth strip line 1341 . The fifth strip line 1341 is disposed on the carrier 110 .

[0142] The fifth strip line 1341 is used to connect to the fourth port of the swept frequency source 210 .

[0143] Optionally, the length of the fifth strip line 1341 is equal to the dimension of the carrier 110 in the first direction a. Optionally, the length of the fifth strip line 1341 is equal to the width of the carrier 110 .

[0144] Optionally, one end of the fifth strip line 1341 is disposed on the first side 111 of the carrier 110 , and the other end of the fifth strip line 1341 is disposed on the second side 112 of the carrier 110 .

[0145] Optionally, the impedance of the fifth stripline 1341 is 50Ω. The 50Ω impedance matching here means that the impedance of the devices, lines, and equipment in the entire circuit loop is kept at 50Ω to reduce unnecessary reflection of the signal.

[0146] It should be noted that the fourth de-embedding structure 134 is a Through de-embedding structure, that is, a direct de-embedding structure.

[0147] In the first de-embedding structure 131, one end of at least one second stripline 1311 is disposed on the first side 111 of the carrier 110, and one end of at least one second stripline 1311 is disposed on the second side 112 of the carrier 110; in the second de-embedding structure 132, one end of at least one third stripline 1321 is disposed on the first side 111 of the carrier 110, and one end of at least one third stripline 1321 is disposed on the second side 112 of the carrier 110; in the third de-embedding structure 133, one end of at least one fourth stripline 1331 is disposed on the first side 111 of the carrier 110, and one end of at least one fourth stripline 1331 is disposed on the second side 112 of the carrier 110; in the fourth de-embedding structure 134, one end of a fifth stripline 1341 is disposed on the first side 111 of the carrier 110, and the other end of the fifth stripline 1341 is disposed on the second side 112 of the carrier 110.

[0148] By adding a SOLT de-embedding calibration fixture 130, the measurement plane of the frequency domain measurement is calibrated from the signal output port position of the swept frequency source 210 to the two ends of the fixture assembly 120 (the first side 111 and the second side 112 of the carrier 110), which can eliminate most of the measurement errors introduced by the fixture assembly 120 and the swept frequency source 210 system.

[0149] The process of quality inspection of semiconductor package 300 is as follows: In the first step, the SOLT de-embedding calibration fixture 130 is used to complete the de-embedding process of the swept frequency source 210, and the measurement plane of the frequency domain measurement is calibrated from the signal output port position of the swept frequency source 210 to the two ends of the fixture assembly 120 (the first side 111 and the second side 112 of the carrier 110).

[0150] In the second step, the semiconductor package 300 to be tested is stably pressed onto the fixture assembly 120 , so that the semiconductor package 300 is disposed in the pressing groove 1212 and is limited by the protrusion 1215 .

[0151] The third step is to adjust the slide switch 124 to match the test requirements of the multi-pin semiconductor package 300 .

[0152] In the fourth step, the fixture assembly 120 and the swept frequency source 210 are interconnected by signals through the SMA connectors located on both sides of the carrier board 110 .

[0153] In the fifth step, after the transmission signal is stabilized, a frequency domain test is performed on the semiconductor package 300 according to a preset frequency sweep range.

[0154] The present invention defines a press fixture 100, which has a built-in SOLT de-embedding structure, eliminating the need for expensive external dedicated calibration components, and can calibrate the measurement plane from the signal output position of the sweep source 210 to the pin plane of the module to be tested, which greatly reduces the test cost and improves the measurement accuracy. In addition, the SOLT de-embedding structure is integrated in the press fixture 100, making it more convenient to carry and easy to promote and use.

[0155] In some embodiments, optionally, Figure 1 and Figure 5 As shown, the first de-embedding structure 131 further includes two second connectors 1312 . The two second connectors 1312 are respectively disposed on two sides of the carrier board 110 , and each second connector 1312 is connected to a corresponding second strip line 1311 .

[0156] Optionally, the second connector 1312 is connected to the carrier board 110 in a detachable manner, so that it is convenient for staff to disassemble and assemble the first de-embedding structure 131 , which is beneficial for maintenance or replacement.

[0157] Optionally, the second connector 1312 is detachably connected to the carrier board 110 by bolts or other types of connectors. Optionally, the second connector 1312 is detachably connected to the carrier board 110 by bonding.

[0158] Optionally, among the two second connectors 1312 , one second connector 1312 is disposed on the first side 111 of the carrier 110 , and the other second connector 1312 is disposed on the second side 112 of the carrier 110 .

[0159] The second connector 1312 is provided to facilitate stable connection between the first de-embedding structure 131 and the port of the swept frequency source 210 , thereby ensuring accuracy of quality inspection of the semiconductor package 300 .

[0160] Optionally, the second connector 1312 is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the frequency sweep source 210. This connection method is conducive to improving the stability of the connection between the first de-embedding structure 131 and the port of the frequency sweep source 210, and ensuring the accuracy of the quality inspection of the semiconductor package 300.

[0161] In some embodiments, optionally, Figure 1 and Figure 5 As shown, the second de-embedding structure 132 further includes two third connectors 1322 . The two third connectors 1322 are respectively disposed on two sides of the carrier 110 , and each third connector 1322 is connected to a corresponding third strip line 1321 .

[0162] Optionally, the third connector 1322 is connected to the carrier board 110 in a detachable manner, so that the staff can disassemble and assemble the second de-embedding structure 132 , which is convenient for maintenance or replacement.

[0163] Optionally, the third connector 1322 is detachably connected to the carrier board 110 by bolts or other types of connectors. Optionally, the third connector 1322 is detachably connected to the carrier board 110 by bonding.

[0164] Optionally, among the two third connectors 1322 , one third connector 1322 is disposed on the first side 111 of the carrier 110 , and the other third connector 1322 is disposed on the second side 112 of the carrier 110 .

[0165] The third connector 1322 is provided to facilitate stable connection between the second de-embedding structure 132 and the port of the swept frequency source 210 , thereby ensuring accuracy of quality inspection of the semiconductor package 300 .

[0166] Optionally, the third connector 1322 is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the frequency sweep source 210. This connection method is conducive to improving the stability of the connection between the second de-embedding structure 132 and the port of the frequency sweep source 210, and ensuring the accuracy of the quality inspection of the semiconductor package 300.

[0167] In some embodiments, optionally, Figure 1 and Figure 5As shown, the third de-embedding structure 133 further includes two fourth connectors 1332 . The two fourth connectors 1332 are respectively disposed on two sides of the carrier 110 , and each fourth connector 1332 is connected to a corresponding fourth strip line 1331 .

[0168] Optionally, the fourth connector 1332 is connected to the carrier board 110 in a detachable manner, so that it is convenient for staff to disassemble and assemble the third de-embedding structure 133 , which is beneficial for maintenance or replacement.

[0169] Optionally, the fourth connector 1332 is detachably connected to the carrier board 110 by bolts or other types of connectors. Optionally, the fourth connector 1332 is detachably connected to the carrier board 110 by bonding.

[0170] Optionally, among the two fourth connectors 1332 , one fourth connector 1332 is disposed on the first side 111 of the carrier 110 , and the other fourth connector 1332 is disposed on the second side 112 of the carrier 110 .

[0171] The fourth connector 1332 is provided to facilitate stable connection between the third de-embedding structure 133 and the port of the swept frequency source 210 , thereby ensuring accuracy of quality inspection of the semiconductor package 300 .

[0172] Optionally, the fourth connector 1332 is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the swept frequency source 210. This connection method is conducive to improving the stability of the connection between the third de-embedding structure 133 and the port of the swept frequency source 210, and ensuring the accuracy of quality inspection of the semiconductor package 300.

[0173] In some embodiments, optionally, Figure 1 and Figure 5 As shown, the fourth de-embedding structure 134 further includes two fifth connectors 1342 . The two fifth connectors 1342 are respectively disposed on two sides of the carrier 110 , and each fifth connector 1342 is connected to a corresponding fifth strip line 1341 .

[0174] Optionally, the fifth connector 1342 is connected to the carrier board 110 in a detachable manner, so that it is convenient for staff to disassemble and assemble the fourth de-embedding structure 134 , which is beneficial for maintenance or replacement.

[0175] Optionally, the fifth connector 1342 and the carrier board 110 are detachably connected by bolts or other types of connectors. Optionally, the fifth connector 1342 and the carrier board 110 are detachably connected by bonding.

[0176] Optionally, among the two fifth connectors 1342 , one fifth connector 1342 is disposed on the first side 111 of the carrier 110 , and the other fifth connector 1342 is disposed on the second side 112 of the carrier 110 .

[0177] The fifth connector 1342 is provided to facilitate stable connection between the fourth de-embedding structure 134 and the port of the swept frequency source 210 , thereby ensuring accuracy of quality inspection of the semiconductor package 300 .

[0178] Optionally, the fifth connector 1342 is an SMA connector (SubMiniature version A, SMA port), which is threadedly connected to the port of the swept frequency source 210. This connection method is conducive to improving the stability of the connection between the fourth de-embedding structure 134 and the port of the swept frequency source 210, and ensuring the accuracy of quality inspection of the semiconductor package 300.

[0179] In one embodiment according to the present invention, Figure 6 As shown, the semiconductor package quality nondestructive testing device 200 includes a sweep frequency source 210 and a pressing fixture 100 in any of the above embodiments. The sweep frequency source 210 is connected to the pressing fixture 100. Specifically, the first connector 125, the second connector 1312, the third connector 1322, the fourth connector 1332 and the fifth connector 1342 of the pressing fixture 100 are respectively connected to the respective ports of the sweep frequency source 210.

[0180] Since the semiconductor package quality nondestructive testing device 200 includes the pressing fixture 100 in any of the above embodiments, it has the beneficial effects of any of the above embodiments, which will not be described in detail herein.

[0181] In one embodiment according to the present invention, a semiconductor packaging quality nondestructive testing method is used in the semiconductor packaging quality nondestructive testing device in the above embodiment. Figure 8 As shown, the steps of the semiconductor packaging quality non-destructive testing method include: S802, placing the semiconductor package in a pressing groove of a pressing fixture of a semiconductor package quality non-destructive testing device, and limiting the semiconductor package by a protrusion of the pressing fixture.

[0182] The pressing assembly includes a first portion and a second portion.

[0183] The pressing component has a closed state and an open state, and the second part can rotate relative to the first part to switch the pressing component from the closed state to the open state, or from the open state to the closed state.

[0184] When the pressing assembly is in a closed state, the second part abuts against the first part, and the protrusion can be in the pressing groove. The protrusion is used to limit the semiconductor package.

[0185] The pressing fixture provided by the present invention is provided with a pressing component, and when the pressing component is in a closed state, the probe in the first part can stably contact the pin of the semiconductor package. Compared with the method in which the semiconductor package needs to be connected to the test fixture by welding in the traditional frequency domain measurement, this method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0186] S804, adjusting the slide switch of the pressing fixture according to the test requirements for the semiconductor package.

[0187] By setting the sliding switch, the free connection and disconnection between each pin of the pressing fixture and the ground plane and the signal line can be achieved, which meets the needs of frequency domain measurement of multi-pin semiconductor packages and has the characteristics of high versatility testing.

[0188] S806, connecting the first connector of the pressing fixture to the sweep frequency source of the semiconductor packaging quality nondestructive testing device to achieve signal interconnection between the pressing fixture and the sweep frequency source.

[0189] This step is the preparation before frequency domain testing.

[0190] S808, performing frequency domain testing on the semiconductor package according to a preset frequency sweep range to complete quality inspection of the semiconductor package.

[0191] After the signal is stable, adjust the preset sweep frequency range according to the test requirements, and perform frequency domain testing on the semiconductor package according to the preset sweep frequency range.

[0192] The present invention aims to provide a method for nondestructive testing of semiconductor package quality. By setting a pressing component, a worker can place the semiconductor package to be tested into the pressing groove of the pressing component and limit it by a bump. Compared with the traditional frequency domain measurement method in which the semiconductor package needs to be connected to the test fixture by welding, this design method has the technical advantages of high convenience, high repeatability, non-destructiveness, and no solder residue.

[0193] In some embodiments, optionally, before S802 (placing the semiconductor package in a pressing groove of a pressing fixture of a semiconductor package quality non-destructive testing device, and limiting the semiconductor package by a bump of the pressing fixture), the steps of the semiconductor package quality non-destructive testing method further include: S801, using the SOLT de-embedding calibration fixture to complete the de-embedding process of the swept frequency source, and calibrate the measurement plane of the frequency domain measurement from the signal output port position of the swept frequency source to the two ends of the fixture assembly (the first side and the second side of the carrier board).

[0194] The purpose of this step is to complete the de-embedding calibration before performing frequency domain testing.

[0195] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0196] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “front” and “back” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0197] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0198] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A pressing fixture, characterized in that: Used for quality inspection of semiconductor package (300), comprising: Carrier plate (110); The clamp assembly (120) comprises: The pressing assembly (121) comprises a first part (1211) and a second part (1214) which are rotatably connected, wherein the first part (1211) is arranged on the carrier plate (110), and the first part (1211) and the carrier plate (110) are detachably connected, and the pressing assembly (121) has a closed state and an open state, and the second part (1214) and the first part (1211) are rotatably connected via a first connecting shaft (126), and the second part (1214) can rotate relative to the first part (1211) around the axis of the first connecting shaft (126), so that the pressing assembly (121) is The closed state is switched to the open state, or the open state is switched to the closed state, the first part (1211) is provided with a pressing groove (1212), the pressing groove (1212) is used to place the semiconductor package (300), the second part (1214) is provided with a convex block (1215), when the pressing component (121) is in the closed state, the second part (1214) abuts against the first part (1211), the convex block (1215) can be located in the pressing groove (1212), and the convex block (1215) is used to limit the semiconductor package (300); a torsion spring (127) sleeved on the first connecting shaft (126), one end of the torsion spring (127) being against or connected to the first part (1211), and the other end of the torsion spring (127) being against or connected to the second part (1214), and under the elastic force of the torsion spring (127), the pressing component (121) has a movement tendency to switch from the open state to the closed state; At least three first strip lines (123) are provided on the carrier board (110), at least two of the first strip lines (123) are used to connect to the frequency sweep source (210), and at least one of the first strip lines (123) is used to be grounded; At least two first connectors (125) are provided on the carrier board (110), each of the first connectors (125) is connected to a corresponding first strip line (123), and the first connector (125) is used to connect to the swept frequency source (210).

2. The pressing fixture according to claim 1, characterized in that: The clamp assembly (120) further includes: At least three slide switches (124) are arranged on the carrier board (110), each of the slide switches (124) is arranged on a corresponding first strip line (123), and the slide switch (124) is used to control the on / off of the circuit of the first strip line (123).

3. The pressing fixture according to claim 1, characterized in that: The first part (1211) is provided with at least three probes (1213), one end of each of the probes (1213) protrudes out of the bottom wall of the pressing groove (1212), and each of the probes (1213) is connected to a corresponding first strip line (123).

4. The pressing fixture according to any one of claims 1 to 3, characterized in that: Also includes: SOLT de-embedding calibration fixture (130), including: A first de-embedding structure (131) comprising two second strip lines (1311) of equal length, wherein the second strip lines (1311) are arranged on the carrier board (110), and the two second strip lines (1311) are not connected; A second de-embedding structure (132) comprises two third strip lines (1321) of equal length, the third strip lines (1321) being arranged on the carrier (110), the two third strip lines (1321) being disconnected, and one end of the third strip line (1321) being used to connect to a first resistor (1323); A third de-embedding structure (133), comprising two fourth strip lines (1331) of equal length, the fourth strip lines (1331) being arranged on the carrier (110), the two fourth strip lines (1331) being disconnected, and one end of the fourth strip line (1331) being used to connect to a second resistor (1333); The fourth de-embedding structure (134) comprises a fifth stripline (1341), wherein the fifth stripline (1341) is arranged on the carrier board (110).

5. The pressing fixture according to claim 4, characterized in that: The first de-embedding structure (131) further comprises: Two second connectors (1312) are respectively arranged on two sides of the carrier board (110), and each of the second connectors (1312) is connected to a corresponding second strip line (1311).

6. The pressing fixture according to claim 4, characterized in that: The second de-embedding structure (132) further comprises: Two third connectors (1322) are respectively arranged on two sides of the carrier board (110), and each of the third connectors (1322) is connected to a corresponding third strip line (1321).

7. The pressing fixture according to claim 4, characterized in that: The third de-embedding structure (133) further comprises: Two fourth connectors (1332) are respectively arranged on two sides of the carrier board (110), and each of the fourth connectors (1332) is connected to a corresponding fourth strip line (1331).

8. The pressing fixture according to claim 4, characterized in that: The fourth de-embedding structure (134) further comprises: Two fifth connectors (1342) are respectively arranged on two sides of the carrier board (110), and each of the fifth connectors (1342) is connected to a corresponding fifth strip line (1341).

9. A semiconductor packaging quality nondestructive testing device, characterized in that: include: Sweep frequency source; The pressing fixture according to any one of claims 1 to 8, connected to the swept frequency source.

10. A method for nondestructive testing of semiconductor packaging quality, characterized in that: For the semiconductor packaging quality nondestructive testing device as claimed in claim 9, the semiconductor packaging quality nondestructive testing method comprises: Placing the semiconductor package in the pressing groove of the pressing fixture of the semiconductor package quality non-destructive testing device, and limiting the semiconductor package by the convex block of the pressing fixture; According to the test requirements of the semiconductor package, adjusting the slide switch of the pressing fixture; Connecting the first connector of the pressing fixture to the swept frequency source of the semiconductor packaging quality nondestructive testing device to achieve signal interconnection between the pressing fixture and the swept frequency source; The semiconductor package is tested in the frequency domain according to a preset frequency sweep range to complete the quality inspection of the semiconductor package.

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