Heat dissipation structure and manufacturing method thereof, and chip packaging structure and packaging method thereof

Abstract

The invention provides a heat dissipation structure, a manufacturing method of the heat dissipation structure, a chip packaging structure and a packaging method of the chip packaging structure. The heat dissipation structure includes: a heat dissipation cover; the radiating fins are fixed on the bottom surface of the radiating cover; and the fixing structure comprises a plurality of metal wires, each metal wire crosses the radiating fin, two ends of each metal wire are fixed on the bottom surface of the radiating cover, and the radiating fin is fixed on the bottom surface of the radiating cover by the plurality of metal wires. According to the technical scheme, the second groove is formed in the heat dissipation cover, the heat dissipation sheet is fixed in the second groove through the metal wires, and the heat dissipation sheet is pre-fixed in the heat dissipation cover before packaging, so that the mounting precision is improved, the risk that the heat dissipation sheet deviates in the mounting process is reduced, and the product yield and the heat dissipation effect are improved.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a heat dissipation structure and a manufacturing method thereof, a chip packaging structure and a packaging method thereof. Background Art

[0002] With the development of electronic technology, miniaturization, high integration of structure and function have become the development trend of electronic components. More heat may be generated and accumulated in the packaging structure of electronic components. If the heat is not effectively dissipated, it will affect the performance of the semiconductor components in the packaging structure.

[0003] At present, in the field of semiconductor packaging technology, high thermal conductivity metal thermal interface material (TIM) is a commonly used heat dissipation material in packages with high heat dissipation requirements. When using this material, flux residue will cause metal voids to form during the reflow process, affecting the heat dissipation effect. In order to eliminate this effect, a new generation of surface-attached metal (Prefluxed Metal) TIM with no volatile flux has been developed to reduce the generation of metal voids. However, since this process abandons flux, it is easy to offset during the heat sink mounting process, thereby affecting the yield or reducing the heat dissipation efficiency.

[0004] Therefore, how to avoid the deviation of the heat sink during the mounting process, thereby affecting the yield or reducing the heat dissipation efficiency, is a problem that needs to be solved at present. Summary of the invention

[0005] The technical problem to be solved by the present invention is how to avoid the deviation during the heat sink mounting process, thereby affecting the yield or reducing the heat dissipation efficiency, and provide a heat dissipation structure and a manufacturing method thereof, a chip packaging structure and a packaging method thereof.

[0006] In order to solve the above problems, the present invention provides a heat dissipation structure, including: a heat dissipation cover; a heat sink fixed to the bottom surface of the heat dissipation cover; a fixing structure, including a plurality of metal wires, each of the metal wires spanning the heat sink and having both ends fixed to the bottom surface of the heat dissipation cover, and the plurality of metal wires fix the heat sink to the bottom surface of the heat dissipation cover.

[0007] In order to solve the above problems, the present invention provides a chip packaging structure, including: an initial structure, including a substrate and a chip arranged on the surface of the substrate, the chip including a back side and a functional side, and the functional side faces the surface of the substrate; a heat dissipation structure, arranged on the surface of the initial structure, the heat dissipation structure adopts the heat dissipation structure described in the present invention, the bottom surface of the heat dissipation cover of the heat dissipation structure faces the surface of the substrate, and the heat dissipation fins of the heat dissipation structure are arranged corresponding to the chip and in contact with the back side of the chip.

[0008] In order to solve the above problems, the present invention provides a method for manufacturing a heat dissipation structure, comprising the following steps: providing a heat dissipation cover; providing a heat sink and setting the heat sink on the bottom surface of the heat dissipation cover; using a wire bonding process to form a plurality of metal wires, each of the metal wires spanning the heat sink and having both ends fixed to the bottom surface of the heat dissipation cover, the plurality of metal wires fix the heat sink to the bottom surface of the heat dissipation cover, and the plurality of metal wires serve as a fixed structure.

[0009] In order to solve the above problems, the present invention provides a chip packaging method, comprising the following steps: providing an initial structure, comprising a substrate and a chip arranged on the surface of the substrate, the chip comprising a back side and a functional side, and the functional side faces the surface of the substrate; providing a heat dissipation structure and arranged on the surface of the initial structure, the heat dissipation structure adopts the heat dissipation structure described in the present invention, the bottom surface of the heat dissipation cover of the heat dissipation structure faces the surface of the substrate, and the heat dissipation fins of the heat dissipation structure are arranged corresponding to the chip and in contact with the back side of the chip.

[0010] The above technical solution pre-fixes the heat sink to the bottom surface of the heat sink cover through multiple metal wires, which can reduce the risk of the heat sink shifting during the mounting process, improve the mounting accuracy, and thus improve the heat dissipation effect and product yield.

[0011] It should be understood that the above general description and the detailed description below are exemplary and explanatory only and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but where appropriate, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following is a brief introduction to the drawings required for the description of the specific embodiments. Obviously, the drawings described below are only some specific embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 The figure is a schematic diagram of the structure of a chip packaging structure.

[0014] Figure 2 It is a bottom view structural schematic diagram of an embodiment of the heat dissipation structure of the present invention.

[0015] Figure 3 for Figure 2 Cross-sectional view along AA' direction.

[0016] Figure 4 It is a bottom view structural schematic diagram of an embodiment of the heat dissipation structure of the present invention.

[0017] Figure 5 It is a bottom view structural schematic diagram of an embodiment of the heat dissipation structure of the present invention.

[0018] Figure 6 It is a bottom view structural schematic diagram of an embodiment of the heat dissipation structure of the present invention.

[0019] Figure 7 It is a structural schematic diagram of an embodiment of the chip packaging structure of the present invention.

[0020] Figure 8 The present invention is a flowchart of one embodiment of a method for manufacturing a heat dissipation structure.

[0021] Fig. 9 A schematic structural diagram of a heat dissipation cover is provided for one embodiment of a method for manufacturing a heat dissipation structure of the present invention.

[0022] Fig.10 The present invention is a schematic structural diagram of providing a heat sink and disposing the heat sink in the second groove according to an embodiment of the method for manufacturing the heat dissipation structure of the present invention.

[0023] Fig.11 The figure is a flowchart of one embodiment of the chip packaging method of the present invention.

[0024] Fig.12 A schematic structural diagram of an initial structure is provided for an embodiment of the chip packaging method of the present invention. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0026] See also Figure 1 , which is a schematic diagram of a chip packaging structure. Figure 1 As shown, the chip packaging structure includes: a substrate 11, a chip 12, a heat sink 13, and a heat dissipation cover 14. During the packaging process, after the heat sink 13 is mounted on the surface of the chip 12, the heat dissipation cover 14 is packaged on the surface of the substrate 11. However, in the actual process, since there is no additional flux between the chip and the heat sink 13 to assist in the attachment, the heat sink 13 is prone to offset during the mounting process, which will affect the product yield or reduce the heat dissipation efficiency.

[0027] In order to improve the problem of easy deviation of the heat sink during mounting, the present invention provides a heat dissipation structure, which pre-fixes the heat sink in a heat dissipation cover before packaging to improve mounting accuracy and reduce the risk of deviation of the heat sink.

[0028] See also Figure 2-3 ,in, Figure 2 A bottom view schematic diagram of the structure of an embodiment of the heat dissipation structure of the present invention; Figure 3 for Figure 2 The cross-sectional view along the AA' direction. Figure 2-3 As shown, the heat dissipation structure includes: a heat dissipation cover 20, a heat sink 21, and a fixing structure. The heat sink 21 is fixed to the bottom surface S0 of the heat dissipation cover 20. The fixing structure includes a plurality of metal wires 220, each of which spans the heat sink 21 and has both ends fixed to the bottom surface S0 of the heat dissipation cover 20. The plurality of metal wires 220 fix the heat sink 21 to the bottom surface S0 of the heat dissipation cover 20.

[0029] The above technical solution pre-fixes the heat sink to the bottom surface of the heat sink cover through multiple metal wires, which can reduce the risk of the heat sink shifting during the mounting process, improve the mounting accuracy, and thus improve the heat dissipation effect and product yield.

[0030] In some embodiments, the material of the heat sink 21 may be a heat dissipation medium material, such as metal indium. Metal indium has strong thermal conductivity and is an ideal heat dissipation medium.

[0031] In some embodiments, the heat conduction performance of the heat sink 21 is better than that of the heat dissipation cover 20 , so that the heat on the chip surface can be quickly transferred to the heat dissipation cover through the heat sink, thereby achieving an ideal heat dissipation effect.

[0032] In some embodiments, the metal wire 220 is formed on the bottom surface S0 of the heat dissipation cover 20 by a wire bonding process. The wire bonding process is also called pressure welding, binding, bonding, and wire bonding, and is usually used for the connection between a chip and a circuit or a lead frame. Specifically, it refers to the use of metal wires (such as gold wires, aluminum wires, etc.) to complete the connection of the internal interconnection wiring of the solid-state circuit in the microelectronic device by using heat pressing or ultrasonic energy. This embodiment utilizes the fixing effect of the metal wire 220 to fix the heat sink 21 to the bottom surface S0 of the heat dissipation cover 20 by wire bonding. In the subsequent packaging process, the heat dissipation structure can be directly packaged on the initial structure to avoid the heat sink from shifting during the packaging process. At the same time, the packaging process is simplified and the packaging efficiency is improved.

[0033] In some embodiments, both ends of the metal wire 220 are heat-pressed and bonded to the heat dissipation cover 20 by a wire bonding process. In other embodiments, the portion of the metal wire 220 that crosses the heat sink 21 can also be heat-pressed and bonded to the heat sink 21 to form one or more bonding points to further fix the heat sink.

[0034] In this embodiment, if Figure 2-3 As shown, the heat sink 21 is rectangular, and the fixing structure includes four metal wires 220 , and the four metal wires 220 fix the four corners of the rectangle respectively.

[0035] In some embodiments, Figure 4 As shown, a plurality of metal wires 220 are disposed parallel to each other on the bottom surface S0 of the heat dissipation cover 20 .

[0036] In some embodiments, Figure 5 As shown, the fixing structure includes at least one metal wire 220 extending along the first direction D1 and at least one metal wire 220 extending along the second direction D2, and the metal wire 220 extending along the first direction D1 intersects with the metal wire 220 extending along the second direction D2, wherein the first direction D1 and the second direction D2 form an angle. For example, in this embodiment, the heat sink 21 is a rectangle, the first direction D1 and the second direction D2 are respectively two diagonal directions of the rectangle, and the fixing structure includes two metal wires 220, which are respectively arranged at the diagonals of the rectangle.

[0037] In some embodiments, Figure 6 As shown, the fixing structure includes a plurality of metal wires 220 extending along a first direction D1 and a plurality of metal wires 220 extending along a second direction D2, and the plurality of metal wires 220 extending along the first direction D1 and the plurality of metal wires 220 extending along the second direction D2 are arranged in a grid shape.

[0038] In this embodiment, if Figure 2-3 As shown, the heat dissipation cover 20 is bent to form a first groove 201, and the heat dissipation fin 21 is fixed to the bottom of the first groove 201. In other embodiments, the heat dissipation cover 20 may also be a flat plate, and the heat dissipation fin 21 is fixed to the bottom surface S0 of the heat dissipation cover 20.

[0039] In some embodiments, the first groove 201 is a groove that gradually increases from the bottom to the opening, and the bottom area of ​​the first groove 201 is smaller than the opening area of ​​the first groove 201. The area of ​​the heat sink 21 is smaller than the bottom area of ​​the first groove 201.

[0040] In this embodiment, a second groove 202 is further formed at the bottom of the first groove 201, and the heat sink 21 is located in the second groove 202. By providing the second groove 202 at the bottom of the first groove 201, the position of the heat sink 21 can be further limited, and the heat sink 21 can be prevented from being offset during the packaging process, and the heat sink 21 can also be prevented from being offset when the metal wire 220 for fixing the heat sink 21 is formed. In other embodiments, the bottom of the first groove 201 is a plane, and the second groove is not provided. The heat sink 21 is provided at the bottom of the first groove 201 and is fixed to the bottom of the first groove 201 by the metal wire 220.

[0041] In some embodiments, the second groove 202 is a rectangular groove, and the bottom area of ​​the second groove 202 is smaller than the bottom area of ​​the first groove 201 .

[0042] In some embodiments, the shape and size of the second groove 202 are adapted to the heat sink 21. In order to further limit the position of the heat sink 21 and prevent the position of the heat sink 21 in the second groove 202 from being too far away, the size of the bottom surface of the second groove 202 is set to be slightly larger than the size of the heat sink 21, so that the heat sink 21 can be placed in the second groove 202. If the size of the bottom surface of the second groove 202 is too large, the setting position of the heat sink 21 in the second groove 202 may be greatly offset from the pre-designed position, thereby affecting the heat conduction of the heat sink 21.

[0043] In some embodiments, the depth of the second groove 202 is less than or equal to the thickness of the heat sink 21, so that when the heat sink 21 is disposed in the second groove 202, the surface of the heat sink 21 is flush with or slightly higher than the bottom of the first groove 201, so as to ensure that the heat sink 21 is in full contact with the chip surface after packaging to avoid poor contact affecting heat dissipation.

[0044] In some embodiments, the heat dissipation cover 20 includes a plurality of the second grooves 202, the heat dissipation structure includes a plurality of the heat sinks 21, and the second grooves 202 correspond one to one with the heat sinks 21. Specifically, a plurality of second grooves 202 are arranged at intervals at the bottom of the first groove 201, and a heat sink 21 is arranged in each of the second grooves 202.

[0045] See also Figure 7 , which is a schematic diagram of the structure of an embodiment of the chip packaging structure of the present invention. Figure 7As shown, the chip packaging structure includes: an initial structure 70 and a heat dissipation structure 71. The initial structure 70 includes a substrate 701 and a chip 702 disposed on the surface of the substrate 701. The chip 702 includes a back surface S1 and a functional surface S2, and the functional surface S2 faces the surface of the substrate 701. The heat dissipation structure 71 is disposed on the surface of the initial structure 70. The heat dissipation structure 71 adopts the present invention. Figure 2-3 In the heat dissipation structure shown, the bottom surface S0 of the heat dissipation cover 20 of the heat dissipation structure 71 faces the surface of the substrate 701 , and the heat dissipation sheet 21 of the heat dissipation structure 71 is arranged corresponding to the chip 702 and contacts the back surface S1 of the chip 702 .

[0046] The above technical solution forms a heat dissipation structure by pre-fixing the heat sink in the heat dissipation cover. During the packaging process, the heat dissipation structure can be directly packaged on the initial structure to avoid the heat sink from shifting during the packaging process. At the same time, the packaging process is simplified and the packaging efficiency is improved.

[0047] In some embodiments, the substrate 701 is used to support the chip 702 and to electrically connect the chip 702 to an external circuit board. The substrate 701 includes, but is not limited to, any one of a silicon-based substrate, a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate. A conductive interconnect structure (not shown) is provided in the substrate 701, and the chip 702 is electrically connected to an external circuit board through the conductive interconnect structure. In some embodiments, a solder ball 703 is further provided on the lower surface of the substrate 701, and the solder ball 703 is electrically connected to the conductive interconnect structure in the substrate 701 to electrically lead out the conductive interconnect structure.

[0048] In some embodiments, the functional surface S2 of the chip 702 facing the substrate 701 is electrically connected to the substrate 701 through a conductive bump 704. The material of the conductive bump 704 can be a metal material, for example, one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver. In the package structure provided in the embodiment of the present invention, the chip 702 is electrically connected to the substrate 701 through the conductive bump 704, so that the chip 702 is flip-chip mounted on the substrate 701.

[0049] In some embodiments, the chip 702 is a chip 702 with a gold-plated back surface S1 to improve the heat dissipation effect of the back surface S1 of the chip 702. The back surface S1 of the chip 702 is connected to the heat sink 21, and the functional surface S2 of the chip 702 is the surface facing the substrate 701 and away from the heat sink 21.

[0050] In some embodiments, a receiving cavity 710 is formed between the heat dissipation structure 71 and the substrate 701 , and the chip 702 is located in the receiving cavity 710 .

[0051] In some embodiments, the initial structure 70 includes only one chip 702 .

[0052] In other embodiments, the initial structure 70 includes a plurality of chips 702 stacked or arranged in parallel, and the plurality of chips 702 are packaged to form a package. Correspondingly, the heat dissipation cover 20 includes a plurality of second grooves 202, and the heat dissipation structure 71 includes a plurality of heat sinks 21, and the second grooves 202 correspond to the heat sinks 21 one by one, and each second groove 202 corresponds to a chip 702 in the initial structure 70, so as to realize the packaging of the plurality of chips 702. It can be understood that the arrangement of the second grooves 202 can be set according to the arrangement of the chips 702 specified by the chip packaging structure.

[0053] In some embodiments, the area of ​​the heat sink 21 is greater than or equal to that of the chip 702 to fully ensure the heat dissipation effect. In other embodiments, the area of ​​the heat sink 21 may also be smaller than that of the chip 702.

[0054] Based on the same inventive concept, some embodiments of the present invention further provide a method for manufacturing a heat dissipation structure.

[0055] See also Figure 8 , which is a flowchart of the steps of an embodiment of the method for manufacturing the heat dissipation structure of the present invention. Figure 8 As shown, the manufacturing method of the heat dissipation structure includes the following steps: step S81, providing a heat dissipation cover; step S82, providing a heat sink and setting the heat sink on the bottom surface of the heat dissipation cover; step S83, using a wire bonding process to form a plurality of metal wires, each of the metal wires spanning the heat sink and having both ends fixed to the bottom surface of the heat dissipation cover, and the plurality of metal wires fix the heat sink to the bottom surface of the heat dissipation cover, and the plurality of metal wires serve as a fixed structure.

[0056] Please refer to Fig. 9 And step S81, providing a heat dissipation cover 20. In this embodiment, the heat dissipation cover 20 is bent to form a first groove 201, and the bottom of the first groove 201 is a plane.

[0057] In some embodiments, the first groove 201 is a groove that gradually increases from the bottom toward the opening, and the bottom area of ​​the first groove 201 is smaller than the area of ​​the opening of the first groove 201 .

[0058] Please refer to Fig.10And step S82 , providing a heat sink 21 and disposing the heat sink 21 on the bottom surface S0 of the heat dissipation cover 20 .

[0059] In this embodiment, the heat sink 21 is fixed to the bottom of the first groove 201. A second groove 202 is also formed at the bottom of the first groove 201, and the heat sink 21 is located in the second groove 202. By setting the second groove 202 at the bottom of the first groove 201, the position of the heat sink 21 can be further limited to prevent the heat sink 21 from shifting during the packaging process, and also prevent the heat sink 21 from shifting when the metal wire 220 for fixing the heat sink 21 is formed. The second groove 202 is a rectangular groove, and its cross-sectional area is smaller than the bottom area of ​​the first groove 201.

[0060] In some embodiments, the material of the heat sink 21 may be a heat dissipation medium material, such as metal indium. Metal indium has strong thermal conductivity and is an ideal heat dissipation medium.

[0061] Please refer to Figure 2 to Figure 6 And step S83, a plurality of metal wires 220 are formed by a wire bonding process, each of the metal wires 220 spans the heat sink 21 and has both ends fixed to the bottom surface S0 of the heat dissipation cover 20, and the plurality of metal wires 220 fix the heat sink 21 to the bottom surface S0 of the heat dissipation cover 20, and the plurality of metal wires 220 serve as a fixed structure. This embodiment utilizes the fixing function of the metal wires 220, and fixes the heat sink 21 to the bottom surface S0 of the heat dissipation cover 20 by wire bonding. In the subsequent packaging process, the heat dissipation structure can be directly packaged on the initial structure, so as to avoid the heat sink from being offset during the packaging process, and at the same time simplify the packaging process and improve the packaging efficiency.

[0062] In some embodiments, both ends of the metal wire 220 are heat-pressed and bonded to the heat dissipation cover 20 by a wire bonding process. In other embodiments, the portion of the metal wire 220 that crosses the heat sink 21 can also be heat-pressed and bonded to the heat sink 21 to form one or more bonding points to further fix the heat sink.

[0063] In some embodiments, Figure 2-3 As shown, the heat sink 21 is rectangular, and the fixing structure includes four metal wires 220 , and the four metal wires 220 fix the four corners of the rectangle respectively.

[0064] In some embodiments, Figure 4 As shown, a plurality of metal wires 220 are disposed parallel to each other on the bottom surface S0 of the heat dissipation cover 20 .

[0065] In some embodiments, Figure 5As shown, the fixing structure includes at least one metal wire 220 extending along the first direction D1 and at least one metal wire 220 extending along the second direction D2, and the metal wire 220 extending along the first direction D1 intersects with the metal wire 220 extending along the second direction D2, wherein the first direction D1 and the second direction D2 form an angle. For example, in this embodiment, the heat sink 21 is a rectangle, the first direction D1 and the second direction D2 are respectively two diagonal directions of the rectangle, and the fixing structure includes two metal wires 220, which are respectively arranged at the diagonals of the rectangle.

[0066] In some embodiments, Figure 6 As shown, the fixing structure includes a plurality of metal wires 220 extending along a first direction D1 and a plurality of metal wires 220 extending along a second direction D2, and the plurality of metal wires 220 extending along the first direction D1 and the plurality of metal wires 220 extending along the second direction D2 are arranged in a grid shape.

[0067] See also Fig.11 , which is a flow chart of the steps of an embodiment of the chip packaging method of the present invention. Fig.11 As shown, step S111, providing an initial structure, including a substrate and a chip arranged on the surface of the substrate, the chip including a back side and a functional side, and the functional side faces the surface of the substrate; step S112, providing a heat dissipation structure and setting it on the surface of the initial structure, the heat dissipation structure adopts the heat dissipation structure described in the present invention, the bottom surface of the heat dissipation cover of the heat dissipation structure faces the surface of the substrate, and the heat dissipation fins of the heat dissipation structure are arranged corresponding to the chip and in contact with the surface of the chip.

[0068] Please refer to Fig.12 And step S111 , providing an initial structure 70 , including a substrate 701 and a chip 702 disposed on the surface of the substrate 701 , wherein the chip 702 includes a back surface S1 and a functional surface S2 , and the functional surface S2 faces the surface of the substrate 701 .

[0069] In some embodiments, the substrate 701 is used to support the chip 702 and to electrically connect the chip 702 to an external circuit board. The substrate 701 includes, but is not limited to, any one of a silicon-based substrate, a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate. A conductive interconnect structure (not shown) is provided in the substrate 701, and the chip 702 is electrically connected to an external circuit board through the conductive interconnect structure. In some embodiments, a solder ball 703 is further provided on the lower surface of the substrate 701, and the solder ball 703 is electrically connected to the conductive interconnect structure in the substrate 701 to electrically lead out the conductive interconnect structure.

[0070] In some embodiments, the functional surface S2 of the chip 702 facing the substrate 701 is electrically connected to the substrate 701 through a conductive bump 704. The material of the conductive bump 704 can be a metal material, for example, one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver. In the package structure provided in the embodiment of the present invention, the chip 702 is electrically connected to the substrate 701 through the conductive bump 704, so that the chip 702 is flip-chip mounted on the substrate 701.

[0071] Please refer to Figure 7 And step S112, providing a heat dissipation structure 71 and setting it on the surface of the initial structure 70, the heat dissipation structure 71 adopts the present invention Figure 2-3 In the heat dissipation structure shown, the bottom surface S0 of the heat dissipation cover 20 of the heat dissipation structure 71 faces the surface of the substrate 701 , and the heat dissipation sheet 21 of the heat dissipation structure 71 is arranged corresponding to the chip 702 and contacts the back surface S1 of the chip 702 .

[0072] In some embodiments, the chip 702 is a chip 702 with a gold-plated back surface S1 to improve the heat dissipation effect of the back surface S1 of the chip 702. The back surface S1 of the chip 702 is connected to the heat sink 21, and the functional surface S2 of the chip 702 is the surface facing the substrate 701 and away from the heat sink 21.

[0073] In some embodiments, a receiving cavity 710 is formed between the heat dissipation structure 71 and the substrate 701 , and the chip 702 is located in the receiving cavity 710 .

[0074] In some embodiments, the initial structure 70 includes only one chip 702. In other embodiments, the initial structure 70 includes a plurality of chips 702 that are stacked or arranged in parallel, and the plurality of chips 702 are packaged to form a package body.

[0075] In some embodiments, the area of ​​the heat sink 21 is greater than or equal to that of the chip 702 to fully ensure the heat dissipation effect. In other embodiments, the area of ​​the heat sink 21 may also be smaller than that of the chip 702.

[0076] The above technical solution forms a heat dissipation structure by pre-fixing the heat sink in the heat dissipation cover. During the packaging process, the heat dissipation structure can be directly packaged on the initial structure to avoid the heat sink from shifting during the packaging process. At the same time, the packaging process is simplified and the packaging efficiency is improved.

[0077] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.

[0078] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0079] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present invention are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present invention. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0080] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A heat dissipation structure, characterized in that: include: Heat dissipation cover; A heat sink fixed to the bottom surface of the heat dissipation cover; The fixing structure includes a plurality of metal wires, each of which spans over the heat sink and has two ends fixed to the bottom surface of the heat sink cover. The plurality of metal wires fix the heat sink to the bottom surface of the heat sink cover.

2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation cover is bent to form a first groove, and the heat dissipation fin is fixed to the bottom of the first groove.

3. The heat dissipation structure according to claim 2, characterized in that: A second groove is also formed at the bottom of the first groove, and the heat sink is located in the second groove.

4. The heat dissipation structure according to claim 3, characterized in that: The depth of the second groove is less than or equal to the thickness of the heat sink.

5. The heat dissipation structure according to claim 1, characterized in that: The heat sink is rectangular, and the fixing structure includes four metal wires, which respectively fix four corners of the rectangle.

6. The heat dissipation structure according to claim 1, characterized in that: A plurality of metal wires are arranged parallel to each other on the bottom surface of the heat dissipation cover.

7. The heat dissipation structure according to claim 1, characterized in that: The fixing structure includes at least one metal wire extending along a first direction and at least one metal wire extending along a second direction, and the first direction forms an angle with the second direction.

8. A chip packaging structure, characterized in that: include: An initial structure includes a substrate and a chip disposed on a surface of the substrate, wherein the chip includes a back surface and a functional surface, and the functional surface faces the substrate surface; A heat dissipation structure is arranged on the surface of the initial structure, and the heat dissipation structure adopts the heat dissipation structure as described in any one of claims 1 to 7. The bottom surface of the heat dissipation cover of the heat dissipation structure faces the surface of the substrate, and the heat dissipation fins of the heat dissipation structure are arranged corresponding to the chip and in contact with the back of the chip.

9. The chip packaging structure according to claim 8, characterized in that: A receiving cavity is formed between the heat dissipation structure and the substrate, and the chip is located in the receiving cavity.

10. The chip packaging structure according to claim 8, characterized in that: The chip is a chip with gold-plated backside.

11. A method for manufacturing a heat dissipation structure, characterized in that: The steps include: Providing a heat dissipation cover; Providing a heat sink and arranging the heat sink on the bottom surface of the heat dissipation cover; A wire bonding process is used to form a plurality of metal wires, each of which spans the heat sink and has both ends fixed to the bottom surface of the heat sink cover. The plurality of metal wires fix the heat sink to the bottom surface of the heat sink cover, and the plurality of metal wires serve as a fixed structure.

12. The method according to claim 11, characterized in that The heat dissipation cover is bent to form a first groove, and the step of arranging the heat dissipation fin on the bottom surface of the heat dissipation cover further includes: arranging the heat dissipation fin at the bottom of the first groove.

13. The method according to claim 12, characterized in that A second groove is also formed at the bottom of the first groove, and the step of arranging the heat sink on the bottom surface of the heat sink cover further includes: arranging the heat sink in the second groove.

14. The method according to claim 13, characterized in that The depth of the second groove is less than or equal to the thickness of the heat sink.

15. The method according to claim 11, characterized in that The heat sink is rectangular, and the fixing structure includes four metal wires, which respectively fix four corners of the rectangle.

16. The method according to claim 11, characterized in that A plurality of metal wires are arranged parallel to each other on the bottom surface of the heat dissipation cover.

17. The method according to claim 11, characterized in that The fixing structure includes at least one metal wire extending along a first direction and at least one metal wire extending along a second direction, and the first direction forms an angle with the second direction.

18. A chip packaging method, characterized in that: The steps include: Providing an initial structure, including a substrate and a chip disposed on a surface of the substrate, wherein the chip includes a back surface and a functional surface, and the functional surface faces the substrate surface; A heat dissipation structure is provided and arranged on the surface of the initial structure, wherein the heat dissipation structure adopts the heat dissipation structure as described in any one of claims 1 to 7, the bottom surface of the heat dissipation cover of the heat dissipation structure faces the surface of the substrate, and the heat dissipation fin of the heat dissipation structure is arranged corresponding to the chip and contacts the back side of the chip.

Images