Semiconductor package for PCB

Abstract

A semiconductor package for a PCB is disclosed. The semiconductor package includes a die mount, a die, a connector, an anchor pad, and an encapsulation. The die is coupled to the die mount. And a connector coupled to the die, the connector including a plurality of leads for attachment to the PCB. The anchor pad is for attachment to the PCB. The encapsulation at least partially surrounds the die. The anchor pad extends across at least a portion of the die.

Description

Technical Field

[0001] The present invention relates to a semiconductor package for a PCB, a method of manufacturing the semiconductor package, a method of attaching the semiconductor package to a PCB, an offset support for a semiconductor package, and an integrated drain clip and offset support for a semiconductor package. Background Art

[0002] Semiconductor packages (such as transistors) are manufactured as a layered assembly that includes components such as a die pad, a die, a connector, and an encapsulation (e.g., a housing). The semiconductor package is attached to a printed circuit board (PCB) by coupling leads of the connector of the semiconductor package to the PCB (e.g., using solder).

[0003] Semiconductor packages are typically attached to PCBs only via the leads of a connector. In operation, the solder joints between the leads and the PCB, as well as the leads themselves, may be subject to thermal fatigue cycles and associated plastic strains, and may be susceptible to failure if not robust enough.

[0004] There exists a need to overcome the disadvantages associated with existing semiconductor assemblies and associated manufacturing methods, whether or not mentioned in this document. Summary of the invention

[0005] According to a first aspect of the present invention, there is provided a semiconductor package for a PCB, the semiconductor package comprising:

[0006] Die holder;

[0007] a die coupled to a die pad;

[0008] a connector coupled to the die, the connector including a plurality of leads for attachment to the PCB;

[0009] an anchor pad for attachment to a PCB; and

[0010] an encapsulation body at least partially surrounding the tube core; wherein

[0011] The anchor pad extends across at least a portion of the die.

[0012] The semiconductor package may be a transistor.The semiconductor package may take the form of a dual in-line (DIL) package (eg, having two rows of leads, each row occupying a different opposing side of the package).

[0013] The die pad may also be described as a plate of conductive material. The die pad may be made of a copper alloy or entirely of copper.

[0014] The die may be a single component or may include multiple constituent components. The die is preferably coupled to the die pad using solder. The die coupling to the die pad may also be described as the die being attached to the die pad. The die may be a silicon chip. One die may be coupled to each die pad.

[0015] The connector may include a clip. The connector may be wire bonded to the die, or coupled using any other internal connector (e.g., a strip). The clip may include one or more leads. The connector (e.g., a clip) may be described as an electrical conductor through which the semiconductor package is connected or connectable to an external circuit in use. The connector (e.g., a clip) may be coupled to the die holder by means of coupling to the die. In other words, the connector may be described as being indirectly coupled to the die holder. The clip is preferably coupled to the die by solder. The connector may be a multi-part connector. For example, the connector may include a drain clip, a gate clip, and a source clip (e.g., multiple clips). In some embodiments, the connector may not include a drain clip. When this portion of the connector is first coupled to the die, the gate clip and the source clip (e.g.,) may be combined with each other. The gate clip and the source clip may be separated during the trimming, forming, and singulation (TFS) step of the manufacturing process. In a preferred embodiment, there is a single gate lead and multiple source and drain leads. Preferably, there is one more drain lead than gate lead (the gate leads and source leads are preferably provided along one side of the semiconductor package).

[0016] The plurality of leads may be displaced leads (e.g., gull-wing leads, including a change in direction along their extent). It has been advantageously found that the displaced leads provide improved board-level reliability by acting as stress relievers when the semiconductor package is mounted in a circuit. A "lead" may also be described as an extension (e.g., extending beyond the package). Each lead may define a respective leg.

[0017] The anchor pad may form part of the offset support. Alternatively, the anchor pad may form part of the integrated drain clip and the offset support. The anchor pad is preferably coupled to the die seat (e.g., via solder). The anchor pad may be coupled to the die seat and offset relative to the die seat. The anchor pad is preferably attached to the die seat by one or more legs extending from the anchor pad. The anchor pad is different from the multiple leads of the connector for at least the following reasons. First, the anchor pad has a relatively larger surface area than each of the legs of the lead. The anchor pad is also preferably located within the footprint of the encapsulation. In other words, unlike the multiple leads that at least partially extend beyond the footprint of the encapsulation (e.g., and therefore extend from the encapsulation), the anchor pad does not extend from the encapsulation or does not extend beyond the encapsulation. Therefore, the anchor pad does not increase the overall size of the semiconductor package. In at least some embodiments, the anchor pad also preferably occupies the central area of ​​the semiconductor package. In other words, the encapsulation extends around each of the sides of the anchor pad. In a preferred embodiment, the anchor pad extends across a majority of the die (eg, over at least about 70% of the die by surface area). The anchor pad is preferably plated in a manner similar to the legs of the plurality of leads.

[0018] The encapsulation may also be described as a housing or shield. The encapsulation may be described as wrapping the die. The encapsulation advantageously reduces the risk of contaminants, such as moisture, penetrating into the semiconductor package. The encapsulation preferably extends between the first and second principal faces of the die holder (however, at least one principal face of the die holder may remain exposed (e.g., as a thermal pad, as a heat sink)). The encapsulation may be a plastic. The encapsulation may also be described as being made of a polymer. The encapsulation is preferably manufactured using an injection molding process in which at least partially molten material is molded into a desired encapsulation shape. The plastic may be a thermoplastic (e.g., a thermosetting polymer).

[0019] Advantageously, the anchor pad provides a further attachment point by which the semiconductor package can be secured to the PCB. In known arrangements, the semiconductor package is attached to the PCB only via a plurality of leads, in particular the legs of the leads. It has been found that this increases the risk of the solder joint failing reliability testing, in particular for top-cooled embodiments (e.g., where the die pad is provided near the upper surface of the semiconductor package in use (i.e., distal ends of the leads)). Also by attaching the semiconductor package to the PCB via the anchor pad, the robustness of the connection is improved, and the semiconductor package is more reliably held on the PCB.

[0020] The anchor pad may be coupled to the drain terminal.

[0021] The coupling of the anchor pad to the drain terminal may also be described as the anchor pad being coupled to the drain pad. The anchor pad may be described as being coupled to the die pad via the drain terminal.

[0022] The anchor pad may be electrically connected to the drain terminal.

[0023] An anchor pad being electrically connected to a drain terminal may also be described as the anchor pad being electrically connected to a drain pad. The anchor pad may be electrically connected to one or more drain pads. The anchor pad may be described as being in electrical communication with a drain terminal.

[0024] In the case where the anchor pad is electrically connected to the drain terminal, the anchor pad can also be used to make an electrical connection to the semiconductor package of the PCB in operation. Advantageously, the anchor pad thus forms part of the circuit. However, in other embodiments, the anchor pad can be electrically isolated from the semiconductor package or attached to the PCB, but the PCB does not have a corresponding terminal or connection for electrically communicating with the anchor pad.

[0025] The anchor pad may be a solid body of material.

[0026] The anchor pad is a solid body of material and can also be described as a continuous body of material. In other words, the anchor pad does not incorporate any openings or other recesses. Advantageously, the anchor pad is a solid body of material that provides a larger surface area through which the semiconductor package can be attached to the PCB.

[0027] The anchor pad may include an opening.

[0028] The anchor pad comprising an opening may also be described as the anchor pad not being defined by a solid body of material. The anchor pad may comprise a single opening or a plurality of openings.

[0029] Advantageously, the anchor pad including an aperture provides an inspection window through which other internal components of the semiconductor package (e.g., the die and / or the connector) can be viewed. For example, by incorporating the aperture, an inspection window can be defined through which an operator can view the alignment of the connector relative to the die. Thus, the aperture advantageously improves the quality control process.

[0030] The anchor pad may have a substantially rectangular outer perimeter.

[0031] A substantially rectangular outer perimeter is intended to mean an outer perimeter generally defined by two pairs of parallel sides.The corners of the rectangular perimeter may be rounded and this is still considered to define a substantially rectangular outer perimeter.

[0032] The anchor pad may extend across a majority of the die.

[0033] The anchor pad extending across a majority of the die advantageously means that there is more surface area on the anchor pad available for attaching the semiconductor package to the PCB.An example of the anchor pad extending across a majority of the die is the anchor pad extending across at least 70% of the surface area of ​​the die.

[0034] One or more legs may extend from the anchor pad.

[0035] The one or more legs of the anchor pad may include a plurality of legs. The one or more legs are described as extending from an edge of the anchor pad. A leg may extend from each of the plurality of edges of the anchor pad. The anchor pad may take the form of a cantilever arrangement (e.g., a single leg extends from only one side of the anchor pad) or may take the form of a bridge, wherein a plurality of legs extend from opposite sides of the anchor pad.

[0036] Advantageously, the one or more legs provide a feature by which the anchor pad can be offset from the die pad. In other words, the one or more legs can vertically offset the anchor pad from the die pad. Advantageously, for top-cooled embodiments (wherein the die pad is disposed near the top side of the semiconductor package), the anchor pad can therefore be disposed near the bottom side of the semiconductor package.

[0037] The two legs may extend from opposite sides of the anchor pad.

[0038] The two legs extending from opposite sides of the anchor pad may also be described as a bridge embodiment. Advantageously, it has been found that the two legs extending from opposite sides of the anchor pad (e.g., one leg extending from each side) provide an improvement in the robustness of the connection of the anchor pad to the die seat. More generally, it has been found that the result is an associated improvement in the robustness of the connection between the semiconductor package and the PCB. Each of the legs may be substantially identical. Alternatively, the leg or one or more legs may be different from each other. For example, one leg may be relatively thinner in the longitudinal direction than another leg.

[0039] One or more of the legs may include a substantially vertical bend.

[0040] One or more legs comprising a substantially perpendicular bend may include each of the plurality of legs comprising a substantially perpendicular bend. Perpendicular bends are intended to refer to a complementary pair of angles, wherein the larger of the two angles is in the range of 60 to 120 degrees.

[0041] A substantially vertical bend may include a vertical bend (eg, a 90 degree bend).

[0042] It has been advantageously found that incorporating a substantially vertical bend improves the robustness of the attachment of the anchor pad to the semiconductor package.

[0043] The anchor pad may be integral with the drain clip.

[0044] The anchor pad being integrated with the drain clip may also be described as the anchor pad forming part of an integral drain clip and offset support. The anchor pad being integrated with the drain clip may also be described as the anchor pad defining one or more drain leads.

[0045] According to a second aspect of the present invention, there is provided a method for manufacturing a semiconductor package according to the first aspect of the present invention, the method comprising:

[0046] coupling the die to the die pad;

[0047] coupling the connector to the die;

[0048] coupling the anchor pad to the die paddle; and

[0049] An encapsulant is molded at least partially over the die.

[0050] Coupling the connector to the die may include coupling a combined gate and source clip to the die.

[0051] Coupling the anchor pad to the die paddle may include coupling an integral drain clip to the die paddle.

[0052] According to a third aspect of the present invention, there is provided a method of attaching a semiconductor package according to the first aspect of the present invention to a PCB, the method comprising:

[0053] Applying solder to multiple leads and anchor pads, or applying solder to multiple locations on a PCB; and

[0054] A plurality of leads and anchor pads are coupled to the PCB to attach the semiconductor package to the PCB.

[0055] Applying solder to multiple leads can also be described as applying solder to the corresponding legs of multiple leads. In some embodiments, solder is applied to multiple locations on the PCB, and then the semiconductor package (e.g., the legs of the leads and the anchor pad) is placed thereon.

[0056] The method may further include a reflow step in which the solder is solidified.

[0057] According to a fourth aspect of the present invention, there is provided an offset support for a semiconductor package, the offset support comprising:

[0058] An anchor pad for attachment to a PCB;

[0059] One or more legs extend from the anchor pad, the one or more legs having an attachment portion substantially parallel to the anchor pad for attachment to the die paddle.

[0060] According to a fifth aspect of the present invention, there is provided an integrated drain clip and offset support for a semiconductor package, the integrated drain clip and offset support comprising:

[0061] An anchor pad for attachment to a PCB;

[0062] one or more legs extending from the anchor pad, the one or more legs having an attachment portion substantially parallel to the anchor pad for attachment to the die pad; and

[0063] One or more leads define at least a portion of a drain clip of the semiconductor package.

[0064] The optional and / or preferred features set out herein for each aspect of the invention may also apply to any other appropriate aspect of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

[0066] Figure 1 is a perspective view of a semiconductor package according to an embodiment of the present invention;

[0067] Figure 2 yes Figure 1 Alternative perspective views of semiconductor packages;

[0068] Figure 3 yes Figure 1 and Figure 2 an end view of a semiconductor package;

[0069] Figure 4 is the one in which the encapsulation is omitted Figures 1 to 3 A perspective view of a semiconductor package;

[0070] Figure 5 yes Figures 1 to 4 A side view of a semiconductor package of , wherein the encapsulation body is shown in a partially transparent view;

[0071] Figure 6 is a perspective view of an offset support member according to an embodiment of the present invention, the offset support member forming Figures 1 to 5 a portion of a semiconductor package;

[0072] Figure 7 yes Figure 6 A plan view of the offset support;

[0073] Figure 8 yes Figure 6 and Figure 7 A side view of an offset support member;

[0074] Fig. 9 is a perspective view of an offset support member according to another embodiment of the present invention;

[0075] Fig.10 It is combined Fig. 9 A perspective view of a semiconductor package with an offset support member;

[0076] Figures 11a to 11i Schematic diagram of the manufacturing Fig.10 A method for semiconductor packaging;

[0077] Fig.12 is a perspective view of a semiconductor package according to another embodiment of the present invention;

[0078] Fig.13 yes Fig.12 Alternative perspective views of semiconductor packages;

[0079] Fig.14 yes Fig.12 and Fig.13 an end view of a semiconductor package;

[0080] Fig.15 is the one in which the encapsulation is omitted Figure 12 to Figure 14 A perspective view of a semiconductor package;

[0081] Fig.16 yes Fig.15 an end view of a semiconductor package of , wherein the encapsulation is shown in a partially transparent view;

[0082] Fig.17 and Fig.18 is an alternative perspective view of an integrated drain clip and offset support according to another embodiment, the integrated drain clip and offset support forming Figures 12 to 16 a portion of a semiconductor package;

[0083] Fig.19 yes Fig.17 and Fig.18 A plan view of an integrated drain clip and an offset support member;

[0084] Fig. 20 yes Figures 17 to 19 An end view of an integrated drain clip and offset support member;

[0085] Figures 21a to 21i Schematic diagram of the manufacturing Figure 12 to Figure 14 A method for semiconductor packaging;

[0086] Fig. 22 is a perspective view of a semiconductor package in which an encapsulation body is omitted according to another embodiment;

[0087] Fig.23 yes Fig. 22 an end view of a semiconductor package;

[0088] Fig.24 is a perspective view of a semiconductor assembly according to another embodiment of the present invention in which an encapsulation body is omitted;

[0089] Fig.25 yes Fig.24 An end view of a semiconductor package. DETAILED DESCRIPTION

[0090] Go to Figure 1 , provides a perspective view of a semiconductor package 2 according to an embodiment of the present invention. The semiconductor package 2 is used for a printed circuit board (PCB) as long as the semiconductor package can be attached to the PCB to form a part of an operating circuit. The semiconductor package 2 is in the form of a transistor.

[0091] like Figure 1 As shown, the semiconductor package 2 includes a die base 4, a plurality of leads 6 and a package 8. The semiconductor package 2 includes Figure 1 There are some other components that cannot be observed in the figure, which will be described in detail later in this document.

[0092] Starting with the die pad 4, the die pad 4 is preferably made of copper or a copper alloy, but other electronically conductive materials may also be used. The die pad 4 is generally a plate-like component and is generally quadrilateral. The die pad 4 can be considered to form a kind of foundation in the manufacture of the semiconductor package 2, because the internal components of the semiconductor package 2 are built on the die pad 4. The die pad 4 includes a first tab 4a and a second tab 4b, by which the die pad 4 is connected to the lead frame during the manufacturing process, and then removed from the lead frame (see Figures 11a to 11i ).

[0093] Turning to the leads 6, reference numeral 6 generally refers to all leads. The leads 6 are used to attach the semiconductor package 2 to a PCB.

[0094] Among the leads 6, there are three types of leads. First, there is a gate lead 10 (e.g., a switch lead). Second, there are a plurality of source leads 12 (in Figure 1 Not visible in , but in Figure 2 Finally, there are multiple drain leads 14. It is noteworthy that although there is only a single gate lead 10, there are multiple source leads 12 and multiple drain leads 14. Figure 1 In the semiconductor package 2 shown, the gate lead 10 and the source lead 12 are located on the same side of the semiconductor package 2. The drain lead 14 is provided on the opposite side of the semiconductor package 2.

[0095] All leads 6 are in the form of gull-wing leads, provided there is a change of direction along their extent (e.g. there is an angular change of direction). The specific function of the leads will not be described in detail here. However, the gate leads, source leads and drain leads operate in a manner known to those skilled in the art of semiconductor packaging.

[0096] Turning to the description of the encapsulation body 8, the encapsulation body 8 may also be described as a shell. The encapsulation body 8 at least partially surrounds the die (eg, the internal components of the semiconductor package 2, which will be described in detail below) and provides a protective function. Figures 11a to 11i The internal components of the semiconductor package 2 and the assignment and location of the leads are shown and described. Figures 11a to 11i A method of manufacturing a semiconductor package 2 is schematically shown.

[0097] It is also worth noting that Figure 1 The semiconductor package 2 shown may be referred to as a top-cooled semiconductor package. This is because the surface of the die pad 4 is exposed at the top side of the package, which may be referred to as a thermal pad. In other words, the die pad 4 is at least partially exposed at the top side of the semiconductor package 2. To aid in explanation, Figure 1 , the lower side or first main surface of the semiconductor package 2 is marked as 16, and the upper side or second main surface is marked as 18. The first side and the second side of the semiconductor package 2 are marked as 20, 22, and the gate lead 10 and the source lead 12 and the drain lead 14 extend from the first side and the second side, respectively. The first end and the second end of the semiconductor package 2 extending between the first side 20 and the second side 22 are marked as 24, 26, respectively.

[0098] from Figure 1 It should be appreciated that the encapsulation 8 only extends across a portion of the second main face 18 of the semiconductor package 2. The area not covered by the encapsulation 8 leaves a portion of the die pad 4 exposed, which provides a cooling function (eg, a heat sink).

[0099] Go to Figure 2 , providing an alternative perspective view of semiconductor package 2. Although Figure 1 It is generally taken from the perspective of the first main surface 18, but Figure 2 The viewing angle is taken from the second main surface 18. Figure 2 Seen in Figure 1 Features that are not visible in Figure 2 The bottom or underside of the semiconductor package 2 shown (eg the first main face 16 ) is the side that is attached to the PCB in use.

[0100] exist Figure 2In FIG. 4 , a relatively small portion of the die pad 4 is visible. Only the first tab 4 a is visible. The second tab 4 b is disposed at an opposite end (eg, the second end 26) of the semiconductor package 2, but at Figure 2 Not visible in.

[0101] The gate lead 10 and the source lead 12 extending along the first side 20 are visible. Similarly, the drain lead 14 extending along the second side 22 is also visible. Figure 1 Differently, and of particular relevance to the present invention, the anchor pad 28 is visible.

[0102] The anchor pad 28 is used to attach to the PCB. That is, the anchor pad 28 and the leads 10, 12, 14 are another feature that can be used to fix the semiconductor package 2 to the PCB. The bonding pad 28 is particularly advantageous because, in particular in applications where the semiconductor package 2 is a top cooling arrangement (e.g., as in the current case), the various leads 10, 12, 14 used to attach the semiconductor package 2 to the PCB may be subjected to stresses at a level that does not meet the reliability of the solder joint. Similarly, the solder joint pads used to connect the leads to the PCB may be subjected to excessive stress. This may cause the semiconductor package 2 to fail to meet the solder joint reliability requirements (e.g., not sufficiently robustly attached to the PCB). Advantageously, by bonding the anchor pad 28, the surface area of ​​the semiconductor package 2 used to attach to the PCB is greatly increased. This in turn reduces the stress induced in the associated pads at the leads 10, 12, 14 and their legs. Therefore, the thermal fatigue performance of the semiconductor package 2 is improved, especially for the gate lead. The anchor pad 28 can also advantageously provide a heat dissipation function, dissipating heat from the semiconductor package 2 by conduction.

[0103] Anchor pad 28 extends across at least a portion of the die (at Figure 2 8, but will be described in detail later). In addition, the anchor pad 28 is contained within the footprint defined by the encapsulation 8. In other words, advantageously, the anchor pad 28 does not extend beyond the encapsulation 8, which means that the overall size of the semiconductor package 2 is not increased. The anchor pad 28 also does not extend beyond the point where the leads 10, 12, 14 extend from the encapsulation.

[0104] from Figure 2 It should be understood that the anchor pad 28 is not covered by the encapsulant 8. As such, the anchor pad 28 remains exposed even after the molding process in which the encapsulant 8 (typically a polymer such as plastic) is molded to form the semiconductor package 2. See also Fig.11e and Fig.11f , which will be described in detail below.

[0105] As will be described throughout this document, other geometries and embodiments of pads may also be used. Figure 1 and Figure 2 As shown, anchor pad 28 is a solid body of material (eg, does not include an opening) and also has a substantially rectangular outer perimeter. Similarly, anchor pad 28 extends across a majority of the die. However, these are optional features.

[0106] In the illustrated embodiment, the anchor pad 28 forms part of an offset support 30. The offset support 30 is also Figures 4 to 8 The optional views shown in (including Figures 6 to 8 ), and further details will be provided in conjunction with these figures.

[0107] Although not a necessary feature, in an advantageous embodiment, anchor pad 28 is coupled to the drain terminal, and in particular is electrically connected to the drain terminal. Anchor pad 28 thus forms part of the circuitry of semiconductor package 2. However, this is not essential, and even if not electrically connected to the drain terminal, the presence of anchor pad 28 still provides the advantage of holding semiconductor package 2 more securely on the PCB.

[0108] Go to Figure 3 , providing an end view of the semiconductor package 2 generally taken from the first end 24 . Figure 3 The first tab 4a of the die pad 4, the encapsulation 8, and the gate lead 10 and the drain lead 14 are shown extending through / out of the encapsulation 8. Figure 3 The anchor pad 24 is not visible in the end view shown.

[0109] Go to Figure 4 , provides a perspective view of the semiconductor package 2 in which the encapsulation body 8 is omitted.

[0110] In this way, more features of the offset support 30 of which the anchor pad 28 forms a part are visible. Figure 4 In the figure, the first leg 32 and the second leg 40 of the offset support 30 are visible. The legs 32, 40 may also be described as extensions.

[0111] The first leg 32 is disposed near the first end 24 of the semiconductor package 2. The first leg 32 includes a corresponding foot 34 (at Figure 4 More generally, the legs 32, and the anchor pads 28 and the offset support 30 are coupled to the die pad 4 via the legs. The legs can also be described as attachment portions. The legs are substantially parallel to the anchor pads 28. This also combines Figure 5 Shown.

[0112] Go to Figure 4It should be appreciated that the first leg 32 extends along only a portion of the corresponding first edge 36 of the anchor pad 34. Rather, a gap 38 is provided along the first edge 36 (along which the leg 32 does not extend) to allow space for the underlying connector.

[0113] The second leg 40 is disposed near the second end 26 of the semiconductor package 2. The second leg 40 includes a corresponding foot 42, and more generally, the leg 40, and the anchor pad 28 and the offset support 30 are coupled to the die pad 4 by the foot. The foot can also be described as an attachment portion. The foot 42 is substantially parallel to the anchor pad 28. This also combines Figure 5 Shown.

[0114] The second leg 40 also extends only along a portion of a corresponding second edge 44 of the anchor pad 28. A gap 46 is provided along the second edge 44 (along which the leg 40 does not extend) to allow space for an underlying connector.

[0115] The anchor pads 28 are preferably symmetrically distributed between the first side 20 and the second side 22 of the semiconductor package. This is due to the presence of leads disposed along each side of the semiconductor package.

[0116] Go to Figure 5 , provides an end view of a semiconductor package 2, wherein the encapsulation body 8 is shown as partially transparent, the leads 6 are omitted, and generally from the Figure 4 and Figure 2 Start on the first side marked 20.

[0117] It should be appreciated from the different extents of the gaps 38 , 46 that the second leg 40 is relatively wider in the longitudinal direction than the first leg 32 .

[0118] Go to Figure 5 , providing a side view of the semiconductor package 2, and also providing the encapsulation body 8 in a partially transparent view. Figure 5 Schematically shows the first main surface 16 and the second main surface 18 of the semiconductor package 2. Figure 5 The orientation of the semiconductor package 2 corresponds to Figure 2 Orientation shown.

[0119] The first leg 32 and the second leg 40 are shown extending from the anchor pad 28. In addition, respective legs 34, 42 are shown provided at the ends of the legs 32, 40. Respective solder pads 48, 50 are also shown located between the die paddle 4 and the first leg 34 and the second leg 42, respectively. By means of the solder pads 48, 50, the offset support 30 is attached to the die paddle 4.

[0120] Figure 5The legs 32, 40 of the offset support 30 are also shown to include substantially vertical bends 52, 54. In the illustrated embodiment, the (larger) angle defined between the anchor pad 28 and the legs 32, 40 corresponding to the first bend 52 and the second bend 54 is approximately 110°. Substantially vertical bends are intended to include any pair of complementary angles where the larger angle is between about 60° and about 120°. In some embodiments, the legs may include vertical bends as long as the bends are equal to 90°. In combination Figure 8 Provide more details about the angle.

[0121] Figure 5 Also shown is a die 56, which is coupled to the die pad 4. The corresponding (first) solder pad coupling the die 56 to the die pad 4 is labeled 58. On the other side of the die 56, a (fifth) solder pad is labeled 60. A connector 90 is coupled to the die 56 via the solder pads 60.

[0122] From e.g. Fig.11d It should be understood that connector 90 includes a plurality of leads for attachment to a PCB. Figure 5 The portion of connector 90 visible in FIG. 1 includes gate lead 10 and source lead 12 (although both are shown in FIG. 1 ). Figure 5 are not visible in the ).

[0123] Advantageously, the semiconductor package 2 including the two legs 32, 40 extending from opposite sides of the anchor pad 28 improves the robustness of the coupling between the anchor pad 28 and the die pad 4. In turn, when the anchor pad 28 is attached to the PCB, the result is improved overall robustness of the attachment of the semiconductor package 2 to the PCB (via the anchor pad 28 and the associated legs of each of the gate lead 10, source lead 12, and drain lead 14).

[0124] Go to Figure 6 , providing a perspective view of a separate offset support 30 .

[0125] As previously described, the offset support 30 includes an anchor pad 28 and a first leg 32 and a second leg 40 extending from a first edge 36 and a second edge 44 of the anchor pad 28. Each of the first leg 32 and the second leg 40 includes a respective leg 34, 42 at its end, and the respective leg and the offset support 30 are generally attached to the PCB by the respective leg. Each of the first leg 32 and the second leg 40 also includes one or more openings disposed therein. The openings advantageously improve the flow of the mold material (i.e., the encapsulation 8) and provide a mold locking feature (which reduces the risk of delamination). Therefore, the openings improve the manufacturing and robustness of the encapsulation 8.

[0126] Go to Figure 7 , providing a plan view of the offset support 30. Thus, the plan view shows each of the first leg 32 and the second leg 40 extending from the anchor pad 28. Gaps 38, 46 provided at each of the first edge 36 and the second edge 44 of the anchor pad 28 (i.e., along which the first leg 32 and the second leg 40, respectively, do not extend) are also visible. In other words, Figure 7 The different longitudinal extents of the first leg 34 and the second leg 40 are shown in FIG.

[0127] Figure 7 Also shown is a first leg 32 comprising one opening, while a second leg 40 comprises three (eg a plurality) of openings. The openings take the form of diamond-shaped (eg elliptical) openings, although other geometric shapes may be used.

[0128] Go to Figure 8 , providing a side view of the offset support 30. Thus, Figure 8 Provide with Figure 5 The view shown is similar to that of the offset support member 30 , but other features of the semiconductor package are omitted.

[0129] Figure 8 Schematically labeled is a first plane 66 extending through the midpoint of the thickness at the anchor pad 28. Also labeled is a second plane 68 extending through the midpoint of the thickness of the first leg 32, and a third plane 70 extending through the midpoint of the thickness of the second leg 40. Thus, each of the first plane, the second plane, and the third plane indicates the direction in which each of the anchor pad 28, the first leg 32, and the second leg 40 extends. A first complementary angle 72 and a second complementary angle 74 are schematically labeled between the first plane 66 and the second plane 68. From Figure 8 It should be understood that in the illustrated embodiment, the first angle 72 is greater than the second angle 74. As previously described, the bend 52 is a substantially vertical bend. A substantially vertical bend is intended to mean that the larger of the first complementary angle 72 and the second complementary angle 74 falls within the range of 60 to 120 degrees. Any angle beyond this range means that the bend is no longer substantially vertical. It should be understood that in some embodiments, the bend can be a vertical bend, in which case the angles 72, 74 will be equal to 90 degrees. For example, the first angle 72 can be between 90 and 120 degrees, and the second angle 74 can be between 60 and 90 degrees.

[0130] Although the angle is schematically represented as foot 34, it should be understood that similar logic applies to the angular relationship between foot 34 and leg 32. In addition, it should also be understood that first plane 66 and third plane 70 are substantially parallel to each other. This is intended to mean that the angular offset between planes 66, 70 is less than about 5 degrees.

[0131] Although not numbered with respect to the corresponding second leg 40, the above description applies equally to the second leg 40. However, it will be appreciated that the angles are mirrored where appropriate.

[0132] Go to Fig. 9 , provides a perspective view of an offset support member 30a according to another embodiment. It is worth noting that the offset support member 30a is combined with Figures 4 to 8 The offset supports 30 described and shown share many common features. As such, for the sake of brevity, the common features will not be described in detail.

[0133] In short, like the offset support 30, the offset support 30a includes the first leg 32 and the second leg 40 and the anchor pad 28a. The main difference between the offset support 30a and the offset support 30 is that the anchor pad 28a includes an opening 76. The opening 76 is a centrally located rectangular opening. As a result, in this embodiment, the pad 28a is not a solid body of material, but includes the opening 76. The anchor pad 28a therefore takes the form of a generally rectangular ring. The anchor pad 28a can also be described as having a thickness or border extending around the opening 76. Apart from this difference, all other features of the offset support 30a are shared with the offset support 30, and therefore the previous description is equally applicable to the offset support 30a.

[0134] As will be understood and described in conjunction with later embodiments, an advantage of support member 30a is that aperture 76 provides an inspection window through which the alignment of other components that form part of a semiconductor package incorporating offset support member 30a can be assessed. The incorporation of aperture 76 means that an inspection window can be used while still providing all of the other associated advantages of anchor pad 28 (e.g., improving the robustness of the connection of the semiconductor package to the PCB). In particular, gate clip (94—at Fig.11d The alignment of the die (as seen in FIG. 1 ) is sensitive relative to the die, and it is desirable to be able to check this alignment via opening 76.

[0135] Go to Fig.10 , provides a perspective view of the generally underside of a semiconductor package 2a according to another embodiment. The semiconductor package 2a incorporates an offset support member 30a, but is otherwise similar to the incorporation Figures 1 to 3 The semiconductor packages 2 shown and described share many common features. In addition, except for the differences associated with the anchor pad 28 (28a), Fig.10 The semiconductor package 2a shown in FIG. Figure 2 The views shown are very similar. Therefore, for the sake of brevity, the description common to both embodiments will not be repeated here, and only the differences will be described in detail.

[0136] Similar to combining Figure 2 , the lower side (eg, first main side) of the semiconductor package 2a includes an anchor pad 28a. However, unlike the previous embodiment, due to the opening ( Fig. 9 76), a portion 78 of the encapsulation body 8 also extends within the anchor pad 28a. In other words, Fig. 9 The opening 76 shown is effectively filled or covered by the enclosure 8. This defines a portion 78 of the enclosure that fills the opening. This portion 78 can be said to cover the opening 76.

[0137] By covering the opening 76, the portion 78 of the encapsulation body 8 still protects the internal components of the semiconductor package 2a in the usual manner for an encapsulation body. However, as previously described, this functionality is advantageously provided in conjunction with the fact that: i) an anchor pad is incorporated; and ii) inspection of the internal components of the semiconductor package 2a may be more easily performed as part of the assembly and verification process.

[0138] Go to Figures 11a to 11i , schematically showing the manufacturing process corresponding to Fig.10 The semiconductor package 2a is shown as a method for semiconductor packaging. The method can also be described as a process flow.

[0139] from Fig.11a Initially, a lead frame 80 is shown in a perspective plan view. The lead frame 80 is actually a piece of material from which material is selectively removed, such as by stamping or etching, to define one or more die pads (in Fig.11a Only one is shown and is labeled 4). Leadframe 80 may also be described as a common leadframe (eg, in embodiments where leadframe 80 defines multiple die pads).

[0140] Fig.11a Also shown is the die paddle 4 attached to the lead frame 80 by the first and second tabs 4a, 4b. In a singulation step, the first and second tabs 4a, 4b are severed or cut to separate the die paddle 4 and the associated semiconductor package from the lead frame 80 in a subsequent step of the manufacturing process.

[0141] Fig.11a The manufacturing steps beyond the lead frame 80 are shown separately. Fig.11a In FIG. 4 , solder has been printed in multiple locations on the die pad 4 before further features are coupled to the die pad 4. Specifically, the first (die) pad 53 occupies most of the surface area of ​​the die pad 4. The second (drain) pad 84 is also printed along one side of the die pad 4. The second pad 84 is elongated and can be described as a strip. As can be seen from FIG. Fig.11dIt should be appreciated that drain pad 84 is a solder pad to which drain clip 92 (eg, part of connector 90) is coupled. Return to Fig.11a , the third pad 48 and the fourth pad 50 are also printed, generally at either end of the second pad 84. The surface area of ​​the third pad 48 and the fourth pad 50 is smaller than the second pad. In the embodiment shown, the third pad 48 is also smaller than the fourth pad 50. Fig.11e As shown, the third pad 48 and the fourth pad 50 are positions corresponding to the first leg 34 and the second leg 42 of the offset support member 30a (see also Figure 5 In this way, the offset support 30 a is coupled to the die pad 4 via the third pad 48 and the fourth pad 50 .

[0142] Fig.11a The steps shown in can be described as printing a solder layer on one or each die pad. The solder layer can be applied by a screen printing method. The solder layer can be described as being dispensed or applied to the die pad 4. The solder layer is preferably applied to all die pads (if appropriate) in this single method step.

[0143] Fig.11b Another step is shown, in which the die 56 is coupled to the die pad 4. Specifically, the die 56 including the semiconductor material is placed on the first solder pad 58. Coupling the die 56 can be described as placing the die 56 on the solder layer 58. As described above, the solder layer 58 is sequentially provided on the die pad 4. Fig.11b In the die coupling step, each of the plurality of die pads is provided with a die. It is noteworthy that the second pad 84, the third pad 48 and the fourth pad 50 are still exposed in this step, and the die 56 is not attached to these pads. Therefore, after the die 56 is attached, the second pad 84, the third pad 48 and the fourth pad 50 are still available, or "vacant".

[0144] Go to Fig.11c , shows a further step of the method in which another solder layer is printed, this time on die 56. Solder layer 64 may also be described as being printed or applied to die 64. Similar to Fig.11a In the step shown, solder is applied to each die (for a lead frame including multiple die pads). Fig.11a The solder layer 64 is preferably applied to all the dies in this single method step. The solder layer is preferably applied to all the dies simultaneously. The solder layer can be applied to the dies in a continuous manner (e.g., one die after another). The solder layer 64 can be described as a fifth pad. Fig.11bAs described above, the second pad 84, the third pad 48 and the fourth pad 50 are still exposed in this step, and the tube die 56 is not attached to these pads. Therefore, after the tube die 56 is attached, the second pad 84, the third pad 48 and the fourth pad 50 are still available, or "idle".

[0145] Go to Fig.11d , shows another step of the method, in which a connector 90 is coupled to the subassembly. In the illustrated embodiment, the connector 90 includes a drain clip 92, a gate clip 94, and a source clip 96. Fig.11d As shown, drain clip 92 is separate from gate clip 94 and source clip 96. Thus, connector 90 may be described as a multi-part connector including a first part (e.g., drain clip 92) and a second part (e.g., a combined gate clip 94 and source clip 96). Fig.11d In FIG. 1 , the gate clip 94 and the source clip 96 are in a united state, but are separated from each other in a subsequent step.

[0146] Starting from the drain clip 92, the drain clip 92 is coupled to the die pad 4 via the second pad 84 (see Figures 11a to 11c ). The gate clip 94 portion of the combined clip is connected via Fig.11c The exposed portion of the die 56 labeled 56a in FIG. 1 is coupled to the die 56. The source clip 96 portion of the combined clip is coupled to the die 56 via the fifth pad 64 (see FIG. 1 ). Fig.11c ).

[0147] like Fig.11d The extensions shown extending from each of the clips 92, 94, 96 define a Fig.11h and Fig.11i Leads 10, 12, 14 are shown. In this embodiment, after the drain clip 92 is attached, the third pad 48 and the fourth pad 50 remain exposed, or "vacant."

[0148] Go to Fig.11e , showing a step of the manufacturing method, in which the offset support 30a is attached. Fig.11e Not marked in, but see Fig.11d ) couples the offset support member 30a to the die pad 4. Specifically, the first leg 32 and the second leg 40 are connected to the first leg 34 and the second leg 42 (42 at Fig.11e The offset support 30a is thus attached to the subassembly. Fig.11eAs shown, the opening 76 provides a window through which the alignment of the source clip 96 and indeed the alignment of other "internal" components of the subassembly can be observed. The anchor pad 28a extends across a majority of the die 56 and can be described as extending over and across the source clip 96. The anchor pad 28a is also vertically offset from the die pad 4 by means of the legs 32, 40 of the offset support 30a. Fig.11e As shown, it is desirable that anchor pad 28a not overlap gate clip 94. This is at least because the alignment of gate clip 94 relative to die 56 is particularly sensitive. Additionally, this reduces the risk of copper exposure after the encapsulation is molded.

[0149] Go to Fig.11f , showing the molding steps of the method. Fig.11f In the embodiment of the present invention, the encapsulation body 8 is molded over the die 56 (and various other components). The molding process is performed by injection molding. For the sake of completeness, Fig.11f The mold / mold cavity is not shown in FIG. Even after molding, the anchor pad 28a remains visible or exposed. Thus, the opening 76 (eg, Fig.11e as shown), thereby defining a portion 78 of the enclosure.

[0150] exist Figure 11g , the deashing and plating steps are shown. In the illustrated embodiment, exposed copper features (such as the extensions of the various clips, anchor pads 28a, etc.) are plated to improve robustness and reduce the risk of corrosion in this step. Plating also improves the adhesion of the solder to the leads. More generally, the lead frame 80 is also plated. These components are generally plated with tin (Sn).

[0151] Fig.11h The method is shown after the trimming, forming, and singulation (TFS) steps have been performed. TFS is a (multi-stage) stamping process in which the dams between the leads are removed, the leads are defined, and then the leads are shaped (formed into gull-wing (e.g., shifted) leads). TFS also singulates the semiconductor package 2a (e.g., separates it from the surrounding lead frame 80 of the previous figure). Fig.11h A gate lead 10, a source lead 12, and a drain lead 14 are labeled.

[0152] Fig.11i The semiconductor package 2a is shown from an underside perspective. In the final singulated semiconductor package 2a, the anchor pad 28a remains exposed (although plated). Furthermore, the anchor pad 28a lies in the same plane as the legs of the various leads.

[0153] During one or more of the above steps, or in intermittent steps therebetween, one or more reflux steps may be performed, in which the Fig.11a and Fig.11c The solder layer applied in the step shown is subjected to a reflow soldering process. Specifically, the semiconductor package 2a or a subassembly thereof may be subjected to controlled high temperatures, such as through a reflow oven or passing under an infrared lamp, to produce a permanent solder joint to "cure" the semiconductor package 2a.

[0154] Go to Figure 12 to Figure 14 , two perspective views and one end view of a semiconductor package 102 according to another embodiment are provided. Figure 12 to Figure 14 The semiconductor package 102 is shown with Figures 1 to 3 The semiconductor package 2 shown is of almost the same nature and no further description will be provided in conjunction with these figures. Figures 1 to 3 The description of applies here as well.

[0155] Go to Fig.15 , showing a perspective view of a semiconductor package 102 in which the encapsulation body 8 is omitted. Figure 4 The perspective view shown, for the aforementioned embodiment, Fig.15 The view shown shows the die holder 4, the die 56 coupled to the die holder, and the gate clip 94 and the source clip 96 coupled to the die 56. Also like the previous embodiments, the semiconductor package 102 includes an anchor pad 28. However, unlike the previous embodiments, the anchor pad 28 forms part of an integrated drain clip and offset support 130. As the name implies, in addition to providing the offset support function previously described (e.g., an additional attachment point for securing the semiconductor package 102 to a PCB), the integrated drain clip and offset support 130 also provides the functionality of a drain clip. In other words, the integrated support 130 also includes a plurality of leads 110 that define drain leads of the semiconductor package 102. The plurality of leads 110 are particularly displaced leads (e.g., gull-wing leads).

[0156] Yet another difference of anchor pad 28 is the manner in which it is coupled to semiconductor package 102. While in the previous embodiments, the first leg and the second leg extend from opposite edges of anchor pad 28, the integral support and drain clip 130 are in the form of a cantilever. Fig.15In the illustrated embodiment, a single leg 106 extends from an edge 108 of the anchor pad 28. As such, the anchor pad 28 is fully supported by one leg 106. However, additional legs may be incorporated. Furthermore, in the previous embodiment, multiple legs extend from the short sides of the anchor pad, whereas in this embodiment, the leg 106 extends from a single long edge 108 of the anchor pad 28. As such, the anchor pad 28 is electrically connected and coupled to a drain terminal (e.g., a drain pad) of the semiconductor package 102.

[0157] Go to Fig.16 , providing an end view of the semiconductor package 102. In addition, the encapsulation body 8 is shown in a partially transparent view.

[0158] In addition to the above differences, Fig.16 The view and Figure 5 The views shown share many common features (except in opposite orientations). For example, the die 56 is coupled to the die paddle 4 via a first die bond pad 58. The gate lead 10 is defined by a gate clip 94, which is coupled to the die 56.

[0159] However, unlike the previous embodiments, Fig.16 The legs 106 of the integral clip and support 130 are shown extending at a perpendicular angle to the anchor plate 28. In addition, a U-shaped portion 110 at one end of the leg 106 defines a foot by which the integral clip and support 130 is coupled to the die pad 4. The drain lead 14 extends from the U-shaped portion 110.

[0160] Go to Fig.17 and Fig.18 , providing two perspective views of the integrated drain clip and offset support 130 shown separately.

[0161] As combined Fig.15 and Fig.16 As depicted, the integrated clip and offset support 130 takes the form of a cantilever, wherein a single leg 106 extends at a perpendicular angle from the drain pad 28 (particularly its long edge 108). The U-shaped portion 110 defines a leg by which the integrated support 130 can be attached to a semiconductor package. A plurality of drain leads 14 extend from opposite sides of the U-shaped portion 110. The drain leads 14 define a drain clip of the semiconductor package.

[0162] In this embodiment, the anchor pad 28 is in the form of a solid body of material, as there is no opening through the anchor pad 28. However, in other embodiments, other means of incorporating openings (e.g., incorporating Fig. 9 76). Like the previous embodiments, the anchor pad 28 has a rectangular outer perimeter and also extends across a majority of the die.

[0163] Fig.19 is a plan view of an integrated drain clip and offset support 130 .

[0164] As combined Fig. 20 As shown, the leg 106 includes three perpendicular bends: a first bend 52 adjacent the anchor pad 28 , a second bend 112 disposed at a first end of the U-shaped portion 110 , and a third bend 114 disposed at an opposite end of the U-shaped portion 110 .

[0165] Go to Figures 21a to 21i , schematically illustrating a method for manufacturing a semiconductor package 102. It is worth noting that, as described in conjunction with the semiconductor package 2a, these method steps are similar to those described in conjunction with the semiconductor package 2a. Figures 11a to 11i Many common details and features are shared, which for the sake of brevity will not be repeated here. Instead, only the differences will be described in detail.

[0166] Figures 21a to 21c The steps shown correspond exactly to Figures 11a to 11c However, if Fig.11a As shown, the third pad 48 and the fourth pad 50 are Fig.21a This is due to the different embodiments of the integrated drain clip and offset support 130 used in the semiconductor package 102 being attached only to the second pad 84 .

[0167] Go to Fig.21d , which is the first method step, and Fig.11d The corresponding steps shown are slightly different. Fig.21d , the connector 190 is coupled to the subassembly (ie, specifically, to the die pad 4). However, Fig.11d Unlike connector 90 shown, connector 190 does not include a drain clip. Instead, connector 190 includes only gate clip 94 and source clip 96. Similar to Fig.11d , the gate clip 94 and the source clip 96 are Fig.21d In this way, the connector 190 is as follows. Fig.21d A one-piece connector attached to the Fig.21d As shown, after the connector 190 has been attached, the second pad 84 remains exposed.

[0168] Go to Fig.21e , showing a step in which the integrated drain clip and the offset support 130 are attached (eg, attached to the die pad 4). The integrated drain clip and the offset support 130 are attached to the second pad 84 (at Fig.21e Not visible in , but in Fig.21d ) is coupled to the die holder 4. Specifically, the U-shaped portion 110 of the leg 106 contacts the second pad 84. Fig.11d In contrast to the subassembly shown in Fig.21d , drain clip 92 is thus incorporated into the integral offset support 130. In addition, anchor pad 28 extends across and over gate clip 94 and source clip 96. In other embodiments, it should be appreciated that connector 190 and integral drain clip and offset support 130 may be attached simultaneously. However, for ease of installation, particularly given that anchor pad 28 preferably at least partially overlaps gate clip 96 (and thus connector 190), integral drain clip and offset support 130 is preferably coupled to die pad 4 after connector 190 has been coupled to die pad 4.

[0169] Go to Fig.21f , similar to combining Fig.11f As described, a molding step is shown in which the encapsulation body 8 is molded at least partially over the die and various other components of the semiconductor package 102. Due to the geometry of the mold ( Fig.21f ), the anchor pad 28 remains exposed even after molding (ie, the encapsulation does not cover the anchor pad 28).

[0170] Figure 21g to Figure 21i Roughly corresponds to Figure 11g to Figure 11i , and therefore will not be described in detail. Figure 21h and 21i In the final, singulated semiconductor package 102 shown, except for the opening in the anchor pad 28a, the finished product is the same as for the Fig.11h and Fig.11i As shown in the semiconductor package 2a.

[0171] Providing an integral offset support with the drain clip 130 is advantageous for a number of reasons. By combining the anchor pad 28 with the drain clip, manufacturing efficiency can be improved. Notably, the anchor pad is preferably combined only with the drain clip and not with the gate and / or source clips, as it has been found that combining the anchor pad as part of the source clip increases the RDS (e.g., resistance) of the package and correspondingly degrades performance.

[0172] Go to Fig. 22 , provides a perspective view of a semiconductor package 202 according to another embodiment in which the encapsulation body is omitted. The semiconductor package 202 is shown in combination with Figures 12 to 16 Many features of the semiconductor package 102 are shown and described. Therefore, many of the previous descriptions also apply here, and only the differences will be described in detail.

[0173] The semiconductor package 202 includes an integrated drain clip and offset support 230. The integrated drain clip and offset support 230 includes an anchor pad 228 formed from a solid body of material (but may be combined with an aperture in some embodiments). Like other embodiments, the anchor pad 228 extends across at least a portion of the tube core 56. However, unlike the previous embodiments, the anchor pad 228 is relatively small and extends across only a portion of the tube core 56 (i.e., as opposed to extending across a majority of the tube core 56). In addition, the legs 232 extending from the anchor pad 228 do not include a substantially vertical bend. Instead, the legs 232 extend at a shallow angle (e.g., 45 to 60 degrees). However, other than this difference, the semiconductor package 202 shares many common features with the previous embodiments in other respects. A slight height difference is shown between the anchor pad 228 and the pads of the gate 10 and the drain 14. This can be achieved by grinding the encapsulation to expose the anchor pad 228.

[0174] Fig.24 FIG. 3 is a perspective view of another embodiment of a semiconductor package 302. The semiconductor package 302 is Fig. 22 and Fig.23 The semiconductor package 302 shown in FIG. Figures 12 to 16 The semiconductor packages 102 shown in FIG. 1 share various common features. Therefore, much of the previous description applies equally, and only the differences will be described in detail.

[0175] The semiconductor package 302 includes an integrated drain clip and offset support 330. The integrated drain clip and offset support 330 includes an anchor pad 328 that extends across at least a portion of the die 56. In addition, a leg 332 extends from the anchor pad 328. The leg 332 includes a substantially vertical bend 333 near the anchor pad 328. A U-shaped portion 334 is provided at the other end of the leg 332. The U-shaped portion defines an attachment portion that the integrated drain clip and offset support 330 can be used to attach to the die pad 4.

[0176] Anchor pad 328 does not extend across a majority of die 56, but rather only extends across a portion of die 56 (e.g., less than about 50% of the die surface area, more preferably less than about 30%). Integral offset support 330 also has a cantilever design due to single leg 332. Anchor pad 328 extends along the entire long edge 336 of die 56.

[0177] Throughout this document, any bend defined by an offset support or an integrated drain clip and offset support may include one or more openings. The openings may be perforations. Advantageously, the openings facilitate the formation of the bend when the assembly is manufactured. The offset support and the integrated drain clip and offset support are preferably made of copper or a copper alloy. The offset support and the integrated drain clip and offset support are preferably manufactured using a stamping or forming method.

[0178] The invention described herein may be used in conjunction with a range of semiconductor packages including: gallium nitride devices, silicon carbide devices, metal oxide semiconductor devices and clip bonded products.

Claims

1. A semiconductor package for a printed circuit board (PCB), comprising: Die holder; a die coupled to the die pad; a connector coupled to the die, the connector comprising a plurality of leads for attachment to the PCB; an anchor pad for attaching to the PCB; as well as an encapsulation body at least partially surrounding the tube core; in The anchor pad extends across at least a portion of the die. 2 . The semiconductor package of claim 1 , wherein the anchor pad is coupled to a drain terminal. The semiconductor package according to claim 2 , wherein the anchor pad is electrically connected to the drain terminal.

4. A semiconductor package according to any preceding claim, wherein the anchor pad is a solid body of material. 5 . The semiconductor package according to claim 1 , wherein the anchor pad comprises an opening.

6. A semiconductor package according to any preceding claim, wherein the anchor pad has a substantially rectangular outer perimeter.

7. A semiconductor package as claimed in any preceding claim, wherein the anchor pad extends across a majority of the die.

8. A semiconductor package according to any preceding claim, wherein one or more legs extend from the anchor pad. 9 . The semiconductor package of claim 8 , wherein two legs extend from opposite sides of the anchor pad.

10. The semiconductor package of claim 8 or 9, wherein the one or more legs include a substantially vertical bend.

11. A semiconductor package according to any preceding claim when dependent directly or indirectly on claim 3, wherein the anchor pad is integral with the drain clip.

12. A method of manufacturing a semiconductor package according to any preceding claim, comprising: coupling the die to the die pad; coupling the connector to the die; coupling the anchor pad to the die pad; as well as The encapsulant is molded at least partially over the die.

13. A method of attaching a semiconductor package according to any one of claims 1 to 11 to the PCB, the method comprising: applying solder to the plurality of leads and the anchor pads, or applying solder to a plurality of locations on the PCB; as well as The plurality of leads and the anchor pads are coupled to the PCB to attach the semiconductor package to the PCB.

14. An offset support for a semiconductor package, comprising: An anchor pad for attaching to a printed circuit board PCB; One or more legs extend from the anchor pad, the one or more legs having an attachment portion substantially parallel to the anchor pad for attachment to a die paddle.

15. An integrated drain clip and offset support for a semiconductor package, comprising: An anchor pad for attaching to a printed circuit board PCB; one or more legs extending from the anchor pad, the one or more legs having an attachment portion substantially parallel to the anchor pad for attachment to a die paddle; and One or more leads define at least a portion of a drain clip of the semiconductor package.

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