Crystal oscillator, and production equipment and production process of crystal oscillator

Abstract

The invention discloses a crystal oscillator and a production device and a production process thereof, the crystal oscillator comprises a crystal oscillator, pins are arranged on the crystal oscillator, the crystal oscillator comprises a bottom frame, a pressurizing unit and a bending unit are arranged on the bottom frame, the pressurizing unit comprises a cylinder, a bearing table and a lifting part, the crystal oscillator is loaded on the bearing table, and the lifting part can drive the bearing table to move up and down. The bearing table moves upwards to enter the cylinder, air pressure in the cylinder is increased, a detector is further arranged on the bearing table, the detector makes contact with the pins and detects the resistance value of the crystal oscillator, the corner bending unit comprises a bending block, and the bending block moves forwards to abut against the pins. The invention provides a crystal oscillator, and a production device and a production process of the crystal oscillator, which can bend a pin when the crystal oscillator is subjected to pressurization detection, further detect whether the bent crystal oscillator is qualified or not, and automatically cut the end of the pin of the crystal oscillator after the air leakage crystal oscillator is detected, so that the production efficiency of the crystal oscillator is improved. And marking the air-leakage crystal oscillator and carrying out scrapping treatment on the air-leakage crystal oscillator.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal oscillator production, in particular to a crystal oscillator, a crystal oscillator production equipment and a production process. Background Art

[0002] Crystal oscillator is abbreviated as crystal oscillator. It is an electronic component that uses the piezoelectric effect of quartz crystal to generate high-precision oscillation frequency. Crystal oscillator is mainly composed of quartz wafer, base, shell, pins and other components. The base and shell cooperate to seal the quartz wafer. After the packaging is completed, airtightness testing is often required.

[0003] The existing airtightness test is to place the crystal oscillator in a sealed container such as the public patent document CN218524316U after packaging, pressurize the sealed container, and judge the airtightness by detecting the voltage change at the crystal oscillator pin. After the airtightness test is completed, the crystal oscillator pin is bent according to needs.

[0004] The above process has the following problem: the sealing of the crystal oscillator package may be damaged when the pins are bent. Summary of the invention

[0005] After the crystal oscillator is packaged, it is tested for sealing and then the legs are bent. The bending process can easily damage the sealing of the package, causing the crystal oscillator to have poor sealing when it leaves the factory.

[0006] The present invention aims at the deficiencies in the prior art and provides a crystal oscillator, a crystal oscillator production device and a production process.

[0007] To solve the above technical problems, the present invention solves the problems through the following technical solutions: crystal oscillator, crystal oscillator production equipment and production process, the crystal oscillator includes a packaging body for sealing and packaging crystal oscillator elements, the crystal oscillator elements are provided with pins, the pins extend outward from the packaging body and are bent.

[0008] The production equipment of crystal oscillators includes a base frame, on which a pressurizing unit and a bending unit are arranged. The pressurizing unit includes a cylinder, a carrying platform and a lifting member. The crystal oscillator is loaded on the carrying platform. The lifting member can drive the carrying platform to move up and down. The carrying platform moves up and enters into the cylinder, and the air pressure in the cylinder is increased. A detector is also arranged on the carrying platform. The detector contacts the pins to detect the resistance value of the crystal oscillator. The bending unit includes a bending block. The bending block moves forward and touches the pins, and cooperates with the limit block on the lifting member to bend the pins.

[0009] The beneficial effect is that the pins are bent when the crystal oscillator is subjected to pressure testing, thereby detecting whether the crystal oscillator is qualified after the bending.

[0010] In the above solution, preferably, an open slot for loading a crystal oscillator is provided on the support platform, and a blocking block for blocking the open slot is provided on the lifting member.

[0011] In the above scheme, preferably, a cutting block is elastically guided and slidably provided on the bending block, and a locking piece is provided on the cutting block, which can lock the cutting block and the bending block together or lock the cutting block and the blocking block together.

[0012] In the above scheme, preferably, the locking member is a bidirectional telescopic rod, and locking holes are provided on the upper end surface of the bending block and the lower end surface of the blocking block. The locking member is telescoped up and down to lock the cutting block with the bending block or the blocking block respectively.

[0013] The beneficial effect is that after a leaking crystal oscillator is detected, the pins of the crystal oscillator are automatically cut off, and then the leaking crystal oscillator is marked and scrapped.

[0014] In the above solution, preferably, the detector can detect the resistance of the crystal oscillator, and the central controller controls the upward extension or downward extension of the locking member through the change of the resistance value.

[0015] In the above solution, preferably, the gap between the upper end surface of the bending block and the lower end surface of the limiting block is greater than the thickness of the pin.

[0016] In the above solution, preferably, the upper end surface of the cutting block is flush with the lower end surface of the limiting block, and the cutting block moves together with the bending block to cooperate with the limiting block to cut off the pin.

[0017] Using the production process of crystal oscillator production equipment, S1: The crystal oscillator is loaded onto the carrier by a robot or manually, and the detector starts to monitor the crystal oscillator resistance R1.

[0018] S2: The lifting member pushes the carrier into the cylinder, increasing the air pressure inside the cylinder, and the lifting member stops moving after the air pressure rises to -standard atmospheric pressure, and the detector measures the crystal oscillator resistance R2.

[0019] S3: The bending block extends out to cooperate with the limit block to bend the pin, and the detector measures the crystal resistance R3.

[0020] In the above scheme, preferably, in S2, R2> R1, and it is determined that the crystal oscillator is leaking, then the locking member is controlled to lock the cutting block and the bending block, and the pin is cut off through S3.

[0021] Otherwise, the locking member is controlled to lock the cutting block and the supporting platform, and S3 is performed normally.

[0022] In the above scheme, preferably, in S3, R3> R1, it is determined that the crystal oscillator is leaking, and the locking member is controlled to release the lock of the cutting block and the blocking block, and the cutting block cuts off the pin under the action of the rear elastic member.

[0023] The beneficial effects of the present invention are as follows: the present invention provides a crystal oscillator, crystal oscillator production equipment and production process, which can bend the pins when the crystal oscillator is pressurized for testing, and then detect whether the crystal oscillator is qualified after the bending is completed. At the same time, after a leaking crystal oscillator is detected, the pins of the crystal oscillator are automatically cut off, and then the leaking crystal oscillator is marked and scrapped. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the present invention.

[0025] Figure 2 This is a cross-sectional view of the pressurized bending state of the present invention.

[0026] Figure 3 It is a schematic diagram of the supporting platform and the lifting member of the present invention.

[0027] Figure 4 Schematic diagram of the corner unit of the present invention.

[0028] Figure 5 It is a schematic diagram of the supporting platform and the bent crystal oscillator of the present invention.

[0029] Figure 6 This is a partial enlarged view of the corner unit in the pressurized bending state of the present invention.

[0030] Figure 7 This is a partial enlarged view of the release of the cutting block in the pressurized bending state of the present invention.

[0031] Figure 8 It is a schematic diagram of the locking member matching of the present invention. DETAILED DESCRIPTION

[0032] The present application determines whether there is leakage by measuring the change in resistance of the crystal oscillator under normal pressure and under pressurized conditions, then bends the pins and detects the resistance at the same time, and determines whether the crystal oscillator is qualified after the bending by comparing the change in resistance value.

[0033] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments: Figure 1-Figure 8 , Crystal oscillator, the crystal oscillator 1 is provided with a pin 11, and the pin 11 is in a bent state. The production equipment of the crystal oscillator includes a base frame, a detector, a pressurizing unit 2 and a bending unit 3. A platform plate is provided in the middle position of the base frame. The pressurizing unit 2 includes a cylinder 21, a bearing platform 22 and a lifting member 23. The cylinder 21 is fixedly arranged on the base frame 1 and is located above the platform plate. A guide rod is arranged at the lower end of the bearing platform 22, which is guided up and down and slidably arranged on the platform plate by the guide rod. The bearing platform 22 is located directly below the cylinder 21, and the peripheral wall of the bearing platform 22 is in contact with the peripheral wall of the inner cavity of the cylinder 21, and the bearing platform 22 moves in the cylinder 21 to perform piston motion.

[0034] A support platform is provided on the platform plate. The left and right sides of the carrier platform 22 are pressed against the support platform in the initial state, so that a certain space is left between the bottom surface of the carrier platform 22 and the platform plate. An opening groove 221 and a pin hole 222 are provided on the carrier platform 22. The pin hole 222 is located at the rear end of the opening groove 221. The width of the opening groove 221 is greater than the width of the pin 11. The size of the pin hole 222 is consistent with that of the pin 11. When the crystal oscillator is loaded on the carrier platform 22, the package of the crystal oscillator is pressed against the upper end surface of the carrier platform 22, and the pin 11 is located in the pin hole 222. The opening groove 221 is used for the pin 11 of the crystal oscillator to be able to move in and out laterally, especially after the pin 11 is bent, it can be moved out of the carrier platform laterally in cooperation with the space left between the bottom surface of the carrier platform 22 and the platform plate.

[0035] The lifting member 23 is a hydraulic cylinder, the bottom end of which is arranged at the bottom of the base frame, and the telescopic rod guide sliding is arranged on the platform plate, and a blocking block 231 is arranged at the top of the telescopic rod. When the telescopic rod is extended upward, the blocking block 231 is inserted into the open groove 221. At this time, the pin hole 222 is blocked by the pin 11 of the crystal oscillator, and the open groove 221 is blocked by the blocking block 231, so that the plane of the carrier 22 is in a complete state, and a detector probe is arranged on the side wall of the pin hole 222. At this time, the detector probe is in contact with the side wall of the pin 11, and the resistance R1 is measured.

[0036] At this time, the telescopic rod continues to extend upward, driving the support platform 22 to move upward and enter the cylinder 21. The support platform 22 and the blocking block 231 together form a piston ring. In the process of moving upward in the cylinder 21, the air above the support platform 22 is compressed, thereby increasing the air pressure acting on the package of the crystal oscillator 1. When the air pressure in the cylinder 1 rises to the required pressure, preferably 3-4 standard atmospheric pressures, the control system of the equipment controls the lifting member 23 to stop rising, and the detector measures the resistance R2.

[0037] Since the crystal oscillator is packaged in a vacuum state, the interior of the packaged crystal oscillator 1 is in a vacuum state. If the package of the crystal oscillator 1 is leaking, compressed air will enter the package under pressurized conditions to increase the internal air pressure, so that the resistance value R2 measured by the detector will be greater than R1.

[0038] The bending unit 3 includes a bending block 31, a cutting block 32, a locking member 33 and a pulling member 34, wherein the pulling member 34 is an electric hydraulic cylinder, which is controlled by the central controller of the equipment to extend and retract forward and backward, and the pulling member 34 is fixedly arranged on the upper end of the telescopic rod of the lifting member 23, and a linkage plate 341 is arranged at the front end of the telescopic rod of the pulling member 34, and the bending block 31 is fixedly arranged on the linkage plate 341. When the pulling member 34 contracts, the bending block 31 is driven to move toward the pin hole 222, and a guide column 342 is arranged on the linkage plate 341. The cutting block 32 is guided and slidably arranged on the guide column 342, and a guide plate 342 is sleeved on the guide column 342. There is a first elastic member 343, the two ends of which respectively touch the rear end of the cutting block 32 and the front end of the linkage plate 341, so that the cutting block 32 elastically touches the bending block 31, and the locking member 33 is fixedly arranged in the cutting block 32. The locking member 32 is a bidirectional telescopic rod. When the lower end extends out of the cutting block 32, the upper end is retracted into the cutting block 32. On the contrary, when the upper end extends out of the cutting block 32, the lower end is retracted into the cutting block 32. The locking head at the lower end of the locking member 32 is an elastic locking head. When it encounters an obstacle when extending downward, it can elastically touch the obstacle, so that the locking head at the upper end of the locking member 32 can be retracted normally.

[0039] A limit block 223 is also provided on the bottom surface of the supporting platform 22. The limit block 223 is located on one side of the pin 11, and the bending block 31 is located on the other side of the pin 11. The moving direction of the linkage plate 341 is toward the limit block 223. There is a height difference between the upper end surface of the bending block 31 and the lower end surface of the limit block 223. The height difference is greater than the thickness of the pin 11, and thus the movement of the bending block 31 toward the limit block 223 can drive the pin 11 to bend.

[0040] The cutting edge of the cutting block 32 is flush with the lower end surface of the limiting block 223 , so that the cutting block 32 moves toward the limiting block 223 and cooperates with the limiting block 223 to cut the pin 11 .

[0041] When the bending block 31 moves toward the limit block 223 under the action of the pulling member 34, it touches the pin 11. The upper end of the pin 11 touches the limit block 223 and does not deform, while the lower end is deformed under the action of the bending block 31, thereby completing the bending process of the pin 11.

[0042] The upper end surface of the bending block 31 and the bottom surface of the blocking block 231 are both provided with locking holes, the locking piece 33 rises upward, and the upper locking head of the locking piece 33 is inserted into the locking hole of the blocking block 231, thereby locking the cutting block 32 on the blocking block 231. When the bending block 31 moves forward, the cutting block 32 does not move, and the first elastic piece 343 is compressed.

[0043] The locking piece 33 extends downward, and the locking head at the lower end of the locking piece 33 is inserted into the locking hole of the bending block 31, locking the cutting block 32 and the bending block 31 with each other. When the bending block 31 moves forward, the cutting block 32 also moves with the bending block 31, and then in the process of moving forward, the cutting edge of the cutting block 32 cuts on the pin 11, cutting off the pin 11.

[0044] In the initial state, the locking piece 33 is raised upward. When the detector measures the resistance R2>R1, it is determined that the package of the crystal oscillator 1 is leaking. Then the central controller of the equipment controls the locking piece 33 to extend downward, so that the cutting block 32 moves with the bending block, and the pin 11 is automatically cut off during the bending process, so that the leaking crystal oscillator is marked and scrapped.

[0045] After the normal bending process, the detector measures the resistance R3. Since the interior of the packaged crystal oscillator 1 is in a vacuum state, the package leaks during the bending process of the pin 11. The air pressure in the external environment is greater than the internal air pressure. Therefore, the external air will enter the package, causing the internal air pressure to rise, and the measured R3 will also be greater than R1. Through reverse reasoning, when R3 is greater than R1, it is judged that the crystal oscillator 1 leaked when the pin 11 was bent.

[0046] The locking head at the lower end of the locking piece 33 is an elastic locking head. When R3 is greater than R1, the central processor of the device controls the locking piece 33 to extend and retract downward. At this time, the lower locking head is not aligned with the locking hole, so the lower locking head elastically touches the bending block 31, and the upper locking head retracts into the cutting block 32. The cutting block 32 is unlocked from the carrier platform 22. At this time, the elastic force of the first elastic piece 343 is released, pushing the cutting block 32 to move toward the pin 11, thereby cutting off the pin 11, and marking the leaking crystal oscillator 1 and scrapping it.

[0047] Its working principle or usage is as follows: First, the crystal oscillator 1 is loaded onto the support platform 22 by a robot or manually, the pin 11 is located in the pin hole 222, the lifting member 23 extends upward, and the blocking block 231 is inserted into the opening groove 221. The plane of the support platform 22 is in a complete state. At this time, the detector measures the crystal oscillator resistance to be R1.

[0048] The lifting member 23 continues to rise, and the support platform 22 cooperates with the cylinder 21 to form a piston device, so that the air pressure of the package of the crystal oscillator 1 located on the upper end surface of the support platform 22 increases. After reaching the set air pressure, the resistance R2 is measured.

[0049] When R2> R1, it is determined that the package of the crystal oscillator 1 is leaking, and the central controller of the equipment controls the locking piece 33 to extend downward, the cutting block 32 is locked with the bending block 31, and the cutting block 32 moves with the bending block 31, and automatically cuts off the pin 11 during the bending process, thereby marking the leaking crystal oscillator and scrapping it.

[0050] On the contrary, the locking piece 33 rises upward, the cutting block 32 is locked on the supporting platform 22, and the bending block 31 moves toward the limit block 223 under the action of the pulling piece 34, while the cutting block 32 does not move. The bending block 31 touches the pin 11, and the upper end of the pin 11 touches the limit block 223 and does not deform, while the lower end is deformed under the action of the bending block 31, thereby completing the bending process of the pin 11. After the bending process is completed, the detector measures the crystal resistance to be R3.

[0051] When R3>R1, it is determined that the crystal oscillator 1 leaked when the pin 11 was bent, and the central processor of the device controls the locking piece 33 to extend and retract downward, thereby unlocking the cutting block 32 and the carrier 22, and the elastic force of the first elastic piece 343 is released, pushing the cutting block 32 to move toward the pin 11, thereby cutting off the pin 11, and marking the leaking crystal oscillator 1 and scrapping it.

[0052] On the contrary, after the bending work is completed, the pulling member 34 is reset first, and then the lifting member 23 is reset, so that the left and right sides of the carrier 22 are pressed against the support platform, and the lifting member 23 continues to reset downward, and the blocking block 231 moves downward away from the opening groove 221, so that the bent crystal oscillator 1 can be taken out from the opening groove 221.

[0053] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A crystal oscillator, characterized in that: It comprises a packaging body (12) for sealing and packaging a crystal vibration element, wherein a pin (11) is provided on the crystal vibration element, and the pin protrudes out of the packaging body (12) and is bent.

2. A production equipment for producing the crystal oscillator according to claim 1, characterized in that: The invention comprises a base frame, on which a pressurizing unit (2) and an angle unit (3) are arranged, the pressurizing unit (2) comprises a cylinder (21), a bearing platform (22) and a lifting member (23), the crystal oscillator (1) is loaded on the bearing platform (22), the lifting member (23) can drive the bearing platform (22) to move up and down, the bearing platform (22) moves up into the cylinder (21), and increases the air pressure in the cylinder (21); A detector is also provided on the carrier platform (22), the detector being in contact with the pin (11) to detect the resistance value of the crystal oscillator (1); The bending unit (3) comprises a bending block (31), which is slidably arranged on the upper end of the telescopic rod of the lifting member (23). The bending block (31) slides forward to contact the pin (11) and can cooperate with a limit block (223) on the bottom surface of the supporting platform (22) to bend the pin (11).

3. The crystal oscillator production equipment according to claim 2, characterized in that: The bearing platform (22) is provided with an opening groove (221) for loading the crystal oscillator (1), and the lifting member (23) is provided with a blocking block (231) for blocking the opening groove (221).

4. The crystal oscillator production equipment according to claim 2, characterized in that: A cutting block (32) is also elastically guided and slidably provided on the bending block (31), and a locking member (33) is provided on the cutting block (32). The locking member (33) can lock the cutting block (32) and the bending block (31) together or lock the cutting block (32) and the blocking block (231) together.

5. The crystal oscillator production equipment according to claim 4, characterized in that: The locking member (33) is a bidirectional telescopic rod. The upper end surface of the bending block (31) and the lower end surface of the blocking block (231) are both provided with locking holes. The locking member (33) is telescopically moved up and down to lock the cutting block (32) with the bending block (31) or the blocking block (231) respectively.

6. The crystal oscillator production equipment according to claim 5, characterized in that: The detector can detect the resistance of the crystal oscillator (1), and the central controller controls the upward extension or downward extension of the locking member (33) through the change of the resistance value.

7. The crystal oscillator production equipment according to claim 5, characterized in that: The gap between the upper end surface of the bending block (31) and the lower end surface of the limiting block (223) is greater than the thickness of the pin (11).

8. The crystal oscillator production equipment according to claim 5, characterized in that: The upper end surface of the cutting block (32) is flush with the lower end surface of the limiting block (223); the cutting block (32) moves along with the bending block (31) and cooperates with the limiting block (223) to cut off the pin (11).

9. A production process for producing a crystal oscillator using the crystal oscillator production equipment as described in any one of claims 2 to 8, characterized in that: S1: The crystal oscillator (1) is loaded onto the carrier (22) by a robot or manually, and the detector starts to monitor the crystal oscillator resistance R1; S2: the lifting member (23) pushes the carrier platform (22) into the cylinder (21), so that the air pressure in the cylinder (21) increases, and the lifting member (23) stops moving after the air pressure rises to 2-5 standard atmospheric pressures, and the detector measures the crystal oscillator resistance R2; S3: The bending block (31) extends out to cooperate with the limiting block (223) to bend the pin (11), and the detector measures the crystal oscillator resistance R3.

10. The crystal oscillator production process according to claim 9, characterized in that: In the S2, R2>R1, it is determined that the crystal oscillator (1) is leaking, then the locking member (33) is controlled to lock the cutting block (32) and the bending block (31), and the pin (11) is cut off through S3; otherwise, the locking member (33) is controlled to lock the cutting block (32) and the supporting platform (22), and S3 is performed normally; In S3, R3>R1, and it is determined that the crystal oscillator (1) leaks during the bending process, so the locking member (33) is controlled to release the lock between the cutting block (32) and the blocking block (231), and the cutting block (32) cuts off the pin (11) under the action of the rear elastic member.

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