Signal processing method and device, electronic equipment, chip and storage medium

Abstract

The invention provides a signal processing method and device, electronic equipment, a chip and a storage medium, and the method comprises the steps: converting an electric signal corresponding to the temperature collected by a collection circuit into a time level signal of the temperature, replacing a voltage analog signal with the time level signal of the temperature, and transmitting the time level signal of the temperature; as the time level signal of the temperature is not an analog signal such as voltage, transmission errors caused by parasitic resistance and parasitic capacitance in the transmission process are not introduced, and the signal transmission precision is improved.

Description

Technical Field

[0001] The present application relates to the field of signal processing technology, and in particular to a signal processing method, device, electronic device, chip and storage medium. Background Art

[0002] With the advancement of technology, the size requirements of electronic devices are getting smaller and smaller, so the temperature sensors with local-remote architecture configured in electronic devices will tend to be miniaturized and integrated to adapt to a wider range of application scenarios.

[0003] In the related technology, the temperature sensor with Local-Remote architecture transmits the temperature voltage signal collected by the acquisition circuit at the Remote end to the Local end for processing to obtain temperature data. However, the method of transmitting voltage signals will introduce large errors in the transmission process and reduce the accuracy of signal transmission. Summary of the invention

[0004] The present application aims to solve one of the technical problems in the related art at least to some extent.

[0005] To this end, the present application proposes a signal processing method, device, electronic device, chip and storage medium to reduce the error caused by the transmission line and improve the accuracy of signal transmission.

[0006] In one aspect, an embodiment of the present application provides a signal processing method, including:

[0007] Collect the temperature information of the area where the target acquisition circuit in the chip is located to obtain an electrical signal corresponding to the temperature;

[0008] Converting the electrical signal into a time level signal;

[0009] The time level signal is transmitted to the processing circuit in the chip.

[0010] Another aspect of the present application provides a signal processing device, including:

[0011] The acquisition module is used to collect the temperature information of the area where the target acquisition circuit in the chip is located, and obtain an electrical signal corresponding to the temperature;

[0012] A conversion module, used for converting the electrical signal into a time level signal;

[0013] The transmission module is used to transmit the time level signal to the processing circuit in the chip.

[0014] Another aspect of the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method described in the above aspect is implemented.

[0015] Another aspect of the present application provides a non-transitory computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the method described in the aforementioned aspect is implemented.

[0016] Another aspect of the present application provides a chip, which includes at least one acquisition circuit and a processing circuit, and any one of the acquisition and processing circuits is configured to execute the method described in the aforementioned aspect.

[0017] Another aspect of the present application provides a computer program product on which a computer program is stored. When the program is executed by a processor, the method described in the above aspect is implemented.

[0018] The signal processing method, device, electronic device, chip and storage medium proposed in the present application convert the electrical signal corresponding to the temperature collected by the acquisition circuit into a time level signal, and use the time level signal to replace analog signals such as voltage for transmission. Since the time level signal is not an analog signal such as voltage, it will not introduce transmission errors caused by parasitic resistance and parasitic capacitance during the transmission process, thereby improving the accuracy of signal transmission.

[0019] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0021] Figure 1 A schematic diagram of the structure of a temperature sensor with a Local-Remote architecture provided in an embodiment of the present application;

[0022] Figure 2 A flowchart of a signal processing method provided in an embodiment of the present application;

[0023] Figure 3 A flowchart of another signal processing method provided in an embodiment of the present application;

[0024] Figure 4 One of the schematic diagrams of a time level signal transmission provided in an embodiment of the present application;

[0025] Figure 5A second schematic diagram of a time level signal transmission provided in an embodiment of the present application;

[0026] Figure 6 A third schematic diagram of a time level signal transmission provided in an embodiment of the present application;

[0027] Figure 7 A fourth schematic diagram of a time level signal transmission provided in an embodiment of the present application;

[0028] Figure 8 A fifth schematic diagram of a time level signal transmission provided in an embodiment of the present application;

[0029] Fig. 9 A sixth schematic diagram of a time level signal transmission provided in an embodiment of the present application;

[0030] Fig.10 A schematic diagram of the structure of a signal processing device provided in an embodiment of the present application;

[0031] Fig.11 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0033] In one implementation of an embodiment of the present application, a temperature sensor with a Local-Remote architecture is provided in the chip based on the requirement of integration, wherein Remote refers to an acquisition circuit for collecting temperature data, and the acquisition circuit includes at least one, and taking the example of including multiple acquisition circuits, multiple acquisition circuits can be provided in different acquisition areas of the chip to collect temperature data at different positions of the circuits or functional modules that need to be monitored. Figure 1 A schematic diagram of a temperature sensor with a Local-Remote architecture provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, in this chip, there are 8 Remote acquisition circuits, namely Remote101A, Remote101B, Remote101C, Remote101D, Remote101E, Remote101F, Remote101G and Remote101H. The acquisition circuits of each Remote have the same function, which is to collect temperature information of the area where the acquisition circuit is located. Figure 1As shown, the acquisition circuits of each Remote are arranged in different areas, so as to realize the acquisition of the temperature of different areas, and transmit the temperature information collected by the acquisition circuits of each Remote to the same processing circuit in the form of voltage signals. Exemplarily, the processing circuit may include a local hub LOCAL HUB, and the temperature value is obtained by processing through the LOCAL HUB, which reduces the number of processing circuits, reduces the area of ​​the chip, and realizes the demand for chip integration.

[0034] In the process of transmitting analog signals such as voltage through transmission lines, taking voltage signals as an example, due to the parasitic resistance of the transmission line and the coupling voltage generated by the flipping of the digital circuit transmitted, there will be an error between the temperature voltage signal obtained in the LOCAL HUB and the temperature voltage signal collected by the remote acquisition circuit. This error cannot be processed as a system error, thereby reducing the accuracy of signal transmission, where the transmission line is, for example, a wire.

[0035] In order to improve the accuracy of signal transmission, the embodiments of the present application provide a signal processing method, device, electronic device, chip and storage medium, which convert the electrical signal corresponding to the temperature collected by the acquisition circuit into a time level signal, and use the time level signal to replace analog signals such as voltage for transmission. Since the time level signal is not an analog signal such as voltage, it will not introduce transmission errors caused by parasitic resistance and parasitic capacitance during the transmission process, thereby improving the accuracy of signal transmission.

[0036] The signal processing method, device, electronic device, chip and storage medium of the embodiments of the present application are described below with reference to the accompanying drawings.

[0037] Figure 2 A flowchart of a signal processing method provided in an embodiment of the present application.

[0038] The signal processing method of the embodiment of the present application can be configured in a signal processing device, and the signal processing device can be applied to any chip or electronic device so that the chip or electronic device can perform a signal processing function.

[0039] Among them, the electronic device can be any device with computing capabilities, such as a mobile terminal. The mobile terminal can be, for example, a mobile phone, a tablet computer, a personal digital assistant, a wearable device, and other hardware devices with various operating systems, touch screens and / or display screens.

[0040] Among them, the chips include image signal processing chip (Image Signal Processor, ISP), central processing unit (Central Processing Unit, CPU), application-specific integrated circuit (Application-Specific Integrated Circuit, ASIC), microprocessor (Digital Signal Processor, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), system on chip (System On A Chip, SOC), reduced instruction set computer RISC (Reduced Instruction Set Computer, reduced instruction set computer), etc., which are not listed one by one this time.

[0041] like Figure 2 As shown, the method may include the following steps:

[0042] Step 201 , collecting temperature information of a region where a target collection circuit of a chip is located, and obtaining an electrical signal corresponding to the temperature.

[0043] Exemplarily, the temperature sensor of the chip may be a Local-Remote architecture, and the target acquisition circuit is any one of the multiple acquisition circuits in the chip, for example, Figure 1 The system includes 8 acquisition circuits, among which Remote101A is the target acquisition circuit, which will not be described in detail in this embodiment.

[0044] The temperature information includes an electrical signal corresponding to the temperature. The electrical signal may be a voltage signal or a current signal, which is not limited in the embodiments of the present application.

[0045] In one implementation of the embodiment of the present application, in response to the processing circuit being started, the target acquisition circuit collects temperature information of the area to obtain an electrical signal corresponding to the temperature, and the electrical signal corresponding to the temperature can represent the temperature information.

[0046] In another implementation method of the embodiment of the present application, the target acquisition circuit can periodically collect temperature information of the area where it is located, obtain an electrical signal corresponding to the temperature, retain the electrical signal corresponding to the temperature collected in the current period, and transmit it based on the electrical signal corresponding to the collected temperature when the processing circuit is started.

[0047] Step 202: convert the electrical signal into a time level signal.

[0048] In an implementation of the embodiment of the present application, based on a set mapping relationship, the electrical signal corresponding to the temperature is converted into a time level signal corresponding to the temperature.

[0049] Among them, the time level signal of temperature includes a pulse signal, and the pulse width of the pulse signal represents the temperature information. The pulse width refers to the time length of the pulse signal from the beginning (usually the rising edge) to the end (usually the falling edge). The larger the electrical signal corresponding to the temperature, the longer the pulse width, that is, the longer the pulse width, the higher the temperature value.

[0050] Step 203, transmitting the time level signal to the processing circuit of the chip.

[0051] In an embodiment of the present application, a set transmission line is used to transmit the time level signal to the processing circuit of the chip, so that the processing circuit of the chip can restore the temperature value based on the received time level signal. Since the time level signal will not be affected by parasitic resistance and parasitic capacitance during the transmission process, the impact of errors that cannot be recognized by the processing circuit is reduced, thereby improving the accuracy of signal transmission, and then improving the accuracy of temperature data restoration.

[0052] The signal processing method provided in the embodiment of the present application converts the electrical signal corresponding to the temperature collected by the acquisition circuit into a time level signal of the temperature, and uses the time level signal to replace analog signals such as voltage for transmission. Since the time level signal of the temperature is not an analog signal such as voltage, it will not introduce transmission errors caused by parasitic resistance and parasitic capacitance during the transmission process, thereby improving the accuracy of signal transmission.

[0053] It should be noted that in the related art, the use of analog signal transmission such as voltage will introduce transmission errors caused by parasitic resistance and parasitic capacitance during the transmission process. In order to reduce the introduced transmission errors, a three-dimensional shielding 3D-shielding method is adopted on the transmission line to reduce the temperature characteristics of the parasitic resistance of the routing and the influence of the coupling voltage generated by the parasitic capacitance on the sampling accuracy. However, the 3D-shielding method increases the area of ​​the chip and increases the difficulty of integration. In the present application, the temperature time level signal is used instead of the voltage signal for transmission. Since the time level signal corresponding to the temperature is not an analog signal such as voltage, it will not introduce transmission errors caused by parasitic resistance and parasitic capacitance during the transmission process, and 3D-shielding is also avoided, which greatly reduces the difficulty of chip integration.

[0054] Based on the above embodiments, Figure 3 A flow chart of another signal processing method provided in an embodiment of the present application is shown as follows: Figure 3 As shown, the method comprises the following steps:

[0055] Step 301, collecting temperature information of the area where the target acquisition circuit in the chip is located, and obtaining an electrical signal corresponding to the temperature.

[0056] Among them, step 301 can refer to the relevant explanations of the aforementioned embodiment, and the principle is the same, which will not be repeated here.

[0057] Step 302: determine the conversion circuit included in the target acquisition circuit.

[0058] Among them, the conversion circuit is a front-end sensing circuit of the target acquisition circuit, which is used to convert the electrical signal corresponding to the temperature into a time level signal of the temperature.

[0059] Step 303: convert the electrical signal corresponding to the temperature into a time level signal through a conversion circuit.

[0060] In one implementation of an embodiment of the present application, the electrical signal corresponding to the temperature is a voltage signal, and thus the conversion circuit refers to a circuit that can convert the voltage signal of the temperature into a time level signal, such as a voltage-to-time conversion circuit (VTC), wherein the pulse width of the time level signal is proportional to the voltage signal.

[0061] In another implementation of the embodiment of the present application, the electrical signal corresponding to the temperature is a current signal, and thus the conversion circuit refers to a circuit that can convert the current signal of the temperature into a time level signal, such as a current-time conversion circuit, wherein the pulse width of the time level signal is proportional to the current signal.

[0062] Step 304, transmitting the time level signal to the processing circuit in the chip.

[0063] In one implementation of the embodiment of the present application, there is one electrical signal, and the electrical signal is used to characterize the temperature collected by the target acquisition circuit. Thus, the single electrical signal of the temperature is converted into a single time level signal by the conversion circuit. As an example, Figure 4 One of the schematic diagrams of a time level signal transmission provided in an embodiment of the present application, such as Figure 4 As shown, there is one time level signal, which is transmitted to the processing circuit of the chip, so that the processing circuit restores the temperature value based on the single time level signal.

[0064] In another implementation of the embodiment of the present application, the temperature of the area where the target acquisition circuit is located corresponds to multiple electrical signals. The multiple electrical signals can be electrical signals collected by the target acquisition circuit at different times, or they can be electrical signals collected by different sub-circuits included in the target acquisition circuit. That is to say, the temperature collected by the target acquisition circuit is characterized by multiple electrical signals. Among them, each of the multiple electrical signals is determined based on the device in the target acquisition circuit that outputs the temperature information as an electrical signal, such as the voltage Vbe between the base and the emitter of the BJT tube, the voltage Vgs between the gate and the source of the MOS tube working in the subthreshold region, and the voltage difference between resistors with different temperature coefficients. For the convenience of explanation, in the subsequent embodiments of the present application, the electrical signal is explained by taking the voltage Vbe between the base and the emitter of the BJT tube as an example. The implementation principles of other types of electrical signals are similar and will not be repeated in this embodiment. As an implementation method, the voltage is used as an electrical signal; as another implementation method, the voltage is converted into a current and the current is used as an electrical signal. In the following embodiments, the electrical signal is explained as a voltage. For the case where the electrical signal is a current, refer to the explanation of the voltage. The principle is the same and will not be repeated in the embodiments of the present application. Thus, for each electrical signal, a conversion circuit is used to convert the electrical signal into a time level signal corresponding to the electrical signal, thereby obtaining multiple time level signals, and the multiple time level signals are used to characterize the temperature collected by the target acquisition circuit. Among them, the multiple electrical signals are different, so the pulse width lengths of the multiple time level signals obtained are different. In the case where there are multiple time level signals used to characterize the temperature collected by the target acquisition circuit, they can be transmitted in a variety of ways, which are explained below for different scenarios.

[0065] In the first scenario of an embodiment of the present application, the difference between multiple time level signals represents the temperature collected by the target acquisition circuit, the multiple time level signals are spliced ​​into a first target time level signal, and the first target time level signal is sent to the processing circuit of the chip through a single transmission line.

[0066] As a first example, there are two multiple time level signals, namely T1 and T2, and the difference between T1 and T2 represents the temperature information collected by the target acquisition circuit. In the case where the first target time level signal includes two time level signals, the receiving time level signal received by the processor includes a first receiving time level signal and a second receiving time level signal. Since the first receiving time level signal and the second receiving time level signal are transmitted to the processing circuit through the same receiving line, there is a small transmission loss, and the transmission loss or error in the same line is the same, the transmission loss or error can be eliminated by subtraction, and the time level signal corresponding to the real temperature of the acquisition area corresponding to the target acquisition circuit is obtained, which not only realizes the transmission of the signal, but also can realize accurate restoration to obtain the corresponding temperature value, thereby improving the accuracy of the temperature value determination.

[0067] As a second example, there are three multiple time level signals, and the time level signal corresponding to the electrical signal corresponding to the actual temperature is T0, which includes T1 greater than T0, T2 less than T0, and T3 less than T0, and T0=T1-T2-T3. Figure 5 A second schematic diagram of a time level signal transmission provided in an embodiment of the present application is shown in FIG. Figure 5 As shown, there are three time level signals, namely, time level signal T1, time level signal T2 and time level signal T3. The time level signal T1, time level signal T2 and time level signal T3 are spliced ​​to obtain Figure 5 The first target time level signal transmitted in.

[0068] It should be noted that after the first target time level signal is sent to the processing circuit through a single transmission line, for the purpose of identification, the time level signal received by the processing circuit is called a receiving time level signal. The processing circuit divides the received receiving time level signal into a first receiving time level signal, a second receiving time level signal and a third receiving time level signal, and subtracts the second receiving time level signal and the third receiving time level signal from the first receiving time level signal in sequence to obtain a difference value. Furthermore, since the transmission line is determined, the transmission loss of the transmission line can be determined in advance by testing, and the difference in the obtained level signal is subtracted from the set transmission loss to obtain a target receiving time level signal indicating the temperature. The target receiving time level signal is used for decoding by the processing circuit to obtain the temperature value of the corresponding area collected by the target acquisition circuit.

[0069] In the second scenario of the embodiment of the present application, the difference between the multiple time level signals represents the temperature information collected by the target acquisition circuit, such as the temperature value. For each of the multiple time level signals, it is sent to the processing circuit of the chip through the corresponding transmission line. As an implementation method, there is one transmission line, and each of the multiple time level signals is sequentially transmitted to the processing circuit of the chip through the transmission line. As another implementation method, there are multiple identical transmission lines, that is, the transmission lines corresponding to each time level signal are the same, and each time level signal is sent to the processing circuit using the transmission line corresponding to each time level signal.

[0070] As an example, Figure 6 A third schematic diagram of a time level signal transmission provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, the two time level signals are called T4 and T5 respectively. There are two transmission lines, namely transmission line 1 and transmission line 2. T4 is transmitted to the processing circuit through transmission line 1, and T4+ΔT is obtained. 1 , T5 is transmitted to the processing circuit through transmission line 2, and the received time level signal is T5+ΔT 1 , transmission line 1 is the same as transmission line 2. Therefore, the processing circuit subtracts the received time level signal to obtain T4-T5, and uses the difference between T4 and T5 as the time level signal corresponding to the real temperature of the acquisition area corresponding to the target acquisition circuit. The transmission of the time level signal not only does not introduce the transmission error caused by parasitic resistance and parasitic capacitance during the transmission process, but also realizes the precise elimination of the error of the transmission line, thereby accurately restoring the corresponding temperature value and improving the accuracy of the temperature value determination.

[0071] In the third scenario of the embodiment of the present application, the difference between multiple time level signals characterizes the temperature information collected by the target acquisition circuit. As an example, the multiple electrical signals are determined based on the device in the target acquisition circuit that outputs the temperature information as an electrical signal, such as the voltage Vbe between the base and the emitter of the BJT tube. Based on different circuit design methods and control methods, the voltage signal of the collected temperature information is determined by the combination of multiple Vbe. As an example, the target acquisition circuit includes multiple Vbe, for example, 4 Vbe, respectively Vbe1, Vbe2, Vbe3 and Vbe4, wherein, according to the rule of the target acquisition circuit collecting the electrical signal corresponding to the temperature, wherein Vbe1 and Vbe2 are a group, Vbe3 and Vbe4 are a group, by calculating the difference: ΔVbe1 = Vbe1-Vbe2, ΔVbe2 = Vbe3-Vbe4, and ΔVbe = ΔVbe1-ΔVbe2, wherein ΔVbe is the difference between the determined multiple electrical signals, which is used to characterize the temperature information collected by the target acquisition circuit. In the embodiment of the present application, the electrical signal is converted into a time level signal. When each electrical signal is converted into a corresponding time level signal, similarly, the difference between multiple time level signals can be determined, and the difference can also characterize the temperature collected by the target acquisition circuit. According to the rules for collecting electrical signals set by the circuit, multiple groups are obtained from the multiple time level signals, wherein the time level signals included in each group are different. The time level signals included in each group are sent to the processing circuit of the chip using the corresponding transmission line.

[0072] There may be one transmission line to achieve sequential transmission and save the number of transmission lines. Alternatively, the number of packets and the number of transmission lines may be the same to achieve synchronous transmission and improve transmission efficiency.

[0073] In the embodiment of the present application, a case where there are multiple transmission lines and each group includes at least two time level signals is used as an example for explanation. As a first implementation method, a differential signal between at least two time level signals in each group is obtained according to at least two time level signals included in each group, and multiple differential signals are sent to the processing circuit of the chip using corresponding transmission lines, so as to realize differential processing of the time level signal in the target acquisition circuit, realize transmission of the differential signal, reduce the data processing amount of the processing circuit, and use differential signal transmission to eliminate the influence of process, voltage and temperature (PVT) on the transmission time level, thereby improving the transmission accuracy.

[0074] As an example, Figure 7 A fourth schematic diagram of a time level signal transmission provided in an embodiment of the present application, such as Figure 7As shown, the target acquisition circuit acquires four electrical signals, and the corresponding four time level signals are T11, T10, T9 and T8, respectively. Among them, T11 and T10 are a group, and T9 and T8 are a group. The actual level signal corresponding to the temperature of the acquisition area corresponding to the target acquisition circuit is the difference of (T9-T8)-(T11-T10). When transmitting, the time level signal corresponding to the difference of (T9-T8) is transmitted, and the time level signal corresponding to the difference of (T11-T10) is transmitted. Therefore, when the processing circuit receives the time level signal corresponding to the difference of (T9-T8) and the time level signal corresponding to the difference of (T11-T10), it determines the difference of (T9-T8)-(T11-T10). The difference is used to characterize the real temperature information. At the same time, when the difference is determined by subtraction, the loss and error of the transmission line are eliminated. The difference can be used to accurately restore the temperature value of the acquisition area of ​​the target acquisition circuit, thereby improving the accuracy of the temperature value determination.

[0075] As a second implementation method, according to at least two time level signals included in each group, a second target time level signal is obtained by splicing at least two time level signals in each group, and multiple second target time level signals are sent to the processing circuit of the chip through multiple transmission lines.

[0076] As an example, taking each group including two time level signals as an example, Figure 8 A fifth schematic diagram of a time level signal transmission provided in an embodiment of the present application, such as Figure 8 As shown, T9 and T8 are spliced ​​into a time level signal, and T11 and T10 are spliced ​​into a time level signal, which are transmitted using two output lines. Therefore, when the processing circuit receives a time level signal spliced ​​from T9 and T8, and a time level signal spliced ​​from T11 and T10, it determines the difference between (T9-T8)-(T11-T10), which is used to characterize the real temperature information. At the same time, when the difference is determined by subtraction, the loss and error of the transmission line are eliminated. The difference can be used to accurately restore the temperature value of the acquisition area of ​​the target acquisition circuit, thereby improving the accuracy of the temperature value determination.

[0077] The aforementioned scenario describes the case where the transmission line loss is the same. The fourth scenario of the embodiment of the present application describes how to transmit when there are multiple time level signals, multiple transmission lines, and different transmission losses corresponding to each transmission line, so as to eliminate the loss of the transmission path. As an implementation method, at each transmission time in the same transmission cycle, each time level signal is transmitted to the processing circuit using a corresponding transmission line, wherein at each transmission time, each time level signal uses a different transmission line.

[0078] The transmission cycle refers to the time corresponding to the completion of the transmission of the time level signals corresponding to the multiple electrical signals collected by the target acquisition circuit. The transmission cycle includes multiple transmission times, and at each transmission time, different transmission lines are controlled to transmit each time level signal, at least ensuring that each transmission line transmits multiple time level signals.

[0079] As an example, Fig. 9 A sixth schematic diagram of a time level signal transmission provided in an embodiment of the present application, such as Fig. 9 As shown, there are two time level signals, namely T12 and T13, and two transmission lines, namely line 1 and line 2. In the first transmission time of the current transmission cycle, line 1 is used to transmit T12, and the processing circuit obtains T12+C1, where C1 is the transmission loss of transmission line 1. Line 2 is used to transmit T13, and the processing circuit obtains T13+C2, where C2 is the transmission loss of transmission line 2. In the second transmission time, line flipping is used to realize line 2 to transmit T12, and the processing circuit obtains T12+C2. Line 1 is used to transmit T13, and the processing circuit obtains T13+C1. Through line flipping, line 1 transmits T12 and T13, and line 2 transmits T12 and T13. The target receiving time level signal corresponding to the processing circuit is determined by the following calculation:

[0080] (T12+C2)-(T13+C1)=T12-T13+C2-C1;

[0081] (T12+C1)-(T13+C2)=T12-T13+C1-C2;

[0082] (T12-T13+C2-C1)+(T12-T13+C1-C2)=2(T12-T13).

[0083] Among them, the difference between T2-T1 represents the temperature value of the acquisition area of ​​the target acquisition circuit, that is, the difference and the temperature value have a set mapping relationship. At the same time, this transmission method can directly eliminate the loss in the transmission route, and there is no need to predict the line loss through experiments in advance, which reduces the complexity of processing and improves the accuracy of signal transmission.

[0084] As another example, there are three time level signals, namely T1, T2 and T3, and three transmission lines, namely transmission line 1, transmission line 2 and transmission line 3. The following table indicates the transmission of the time level signal at each transmission time in the current transmission cycle, wherein the loss of each transmission line is fixed and is a set value, as shown in Table 1:

[0085] Transmission line 1 Transmission line 2 Transmission line 3 First transmission time T12 T13 T14 Second transmission time T13 T14 T12 The third transmission time T14 T12 T13

[0086] Thus, the time level signal received by the first transmission time processing circuit is: T12-T13-T14+C2-C1-C3;

[0087] The time level signal received by the second transmission time processing circuit is: T12-T13-T14+C1-C2-C3;

[0088] The time level signal received by the third transmission time processing circuit is: T12-T13-T14+C3-C2-C1;

[0089] The time level signals received by the three transmission time processing circuits are added together to obtain a target receiving time level signal of 3(T2-T1-T3)-C1-C2-C3.

[0090] Among them, since the line loss is a set value, the losses of the three transmission lines can be determined through preliminary experimental results, and the influence of the three path losses can be removed from the target receiving time level signal obtained from the processing circuit to achieve diversified transmission line solutions. At the same time, the accuracy of line transmission is improved, and the accuracy of temperature data determination is improved.

[0091] In the signal processing method of the embodiment of the present application, the electrical signal corresponding to the temperature collected by the acquisition circuit is converted into a time level signal, and the time level signal is used instead of analog signals such as voltage for transmission. Since the time level signal is not an analog signal such as voltage, the transmission error caused by parasitic resistance and parasitic capacitance in the transmission process will not be introduced, thereby improving the accuracy of signal transmission. Transmission is carried out through a variety of transmission methods, providing diversified transmission methods to meet the transmission needs in different scenarios. At the same time, the loss of the transmission route that cannot be eliminated by the system will not be introduced. The loss of the transmission route can be eliminated, thereby improving the transmission accuracy.

[0092] In order to implement the above embodiment, the embodiment of the present application also proposes a signal processing device.

[0093] Fig.10 A schematic diagram of the structure of a signal processing device provided in an embodiment of the present application.

[0094] like Fig.10 As shown, the device may include:

[0095] The acquisition module 111 is used to acquire temperature information of the area where the target acquisition circuit in the chip is located, and obtain an electrical signal corresponding to the temperature;

[0096] The conversion module 112 is used to convert the electrical signal into a time level signal;

[0097] The transmission module 113 is used to transmit the time level signal to the processing circuit in the chip.

[0098] Furthermore, in one implementation of the embodiment of the present application, the conversion module 112 is further configured to:

[0099] Determining a conversion circuit included in the target acquisition circuit;

[0100] The electrical signal corresponding to the temperature is converted into the time level signal through the conversion circuit.

[0101] In an implementation of the embodiment of the present application, the temperature of the area where the target acquisition circuit is located corresponds to multiple electrical signals, and the transmission module 113 is further used to:

[0102] splicing a plurality of time level signals corresponding to the plurality of electrical signals into a first target time level signal;

[0103] The first target time level signal is transmitted to the processing circuit in the chip through a single transmission line.

[0104] In an implementation of the embodiment of the present application, the temperature of the area where the target acquisition circuit is located corresponds to multiple electrical signals, and the transmission module 113 is further used to:

[0105] Each of the multiple time level signals corresponding to the multiple electrical signals is transmitted to the processing circuit in the chip through the corresponding transmission line.

[0106] In an implementation of the embodiment of the present application, the temperature of the area where the target acquisition circuit is located corresponds to multiple electrical signals, and the transmission module 113 is further used to:

[0107] Combining a plurality of time level signals corresponding to the plurality of electrical signals to determine a plurality of groups;

[0108] The time level signals included in each group are transmitted to the processing circuit in the chip using corresponding transmission lines.

[0109] In an implementation of the embodiment of the present application, each group includes at least two time level signals, and the transmission module 113 is further used to:

[0110] According to at least two time level signals included in each group, a differential signal between at least two time level signals in each group is obtained;

[0111] The plurality of differential signals are transmitted to the processing circuit in the chip using corresponding transmission lines.

[0112] In an implementation of the embodiment of the present application, each group includes at least two time level signals, and the transmission module 113 is further used to:

[0113] splicing at least two time level signals included in each group to obtain a second target time level signal corresponding to each group;

[0114] The plurality of second target time level signals are transmitted to the processing circuit of the chip through a plurality of transmission lines.

[0115] In an implementation of the embodiment of the present application, the temperature of the area where the target acquisition circuit is located corresponds to multiple electrical signals, and the transmission module 113 is further used to:

[0116] At each transmission time in the same transmission cycle, each of the time level signals is transmitted to the processing circuit using a corresponding transmission line; wherein, at each transmission time, each of the time level signals uses a different transmission line.

[0117] It should be noted that the above explanation of the method embodiment is also applicable to the device of this embodiment, and will not be repeated here.

[0118] In the signal processing device of the embodiment of the present application, the electrical signal corresponding to the temperature collected by the acquisition circuit is converted into a time level signal of the temperature, and the time level signal of the temperature is used to replace analog signals such as voltage for transmission. Since the time level signal of the temperature is not an analog signal such as voltage, the transmission error caused by parasitic resistance and parasitic capacitance during the transmission process will not be introduced, thereby improving the accuracy of signal transmission.

[0119] In order to implement the above embodiments, the present application also proposes a non-temporary computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the method described in the above method embodiments is implemented.

[0120] In order to implement the above embodiments, the present application also proposes a computer program product on which a computer program is stored. When the computer program is executed by a processor, the method described in the above method embodiments is implemented.

[0121] In order to implement the above embodiments, the present application also proposes an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method described in the above method embodiments is implemented.

[0122] Fig.11This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. For example, the electronic device 800 may be a mobile phone, a computer, a digital broadcast terminal, a message transceiver device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0123] Reference Fig.11 , the electronic device 800 may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output (I / O) interface 812 , a sensor component 814 , and a communication component 816 .

[0124] The processing component 802 generally controls the overall operation of the electronic device 800, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0125] The memory 804 is configured to store various types of data to support operations on the electronic device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0126] The power component 806 provides power to the various components of the electronic device 800. The power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.

[0127] The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the electronic device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0128] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), and when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 804 or sent via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0129] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0130] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the electronic device 800. For example, the sensor assembly 814 can detect the open / closed state of the electronic device 800, the relative positioning of the components, such as the display and keypad of the electronic device 800, and the sensor assembly 814 can also detect the position change of the electronic device 800 or a component of the electronic device 800, the presence or absence of contact between the user and the electronic device 800, the orientation or acceleration / deceleration of the electronic device 800, and the temperature change of the electronic device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0131] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as WiFi, 4G or 5G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0132] In an exemplary embodiment, the electronic device 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above methods.

[0133] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, and the instructions can be executed by a processor 820 of an electronic device 800 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0134] In order to implement the above embodiments, the present application further proposes a chip, which includes at least one acquisition circuit and a processing circuit, and any one of the acquisition and processing circuits is configured to execute the method provided in the above embodiments.

[0135] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0136] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0137] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or more executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0138] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute the instructions), or in combination with these instruction execution systems, devices or apparatuses. For the purpose of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in combination with these instruction execution systems, devices or apparatuses. More specific examples of computer-readable media (a non-exhaustive list) include the following: an electrical connection with one or more wires (electronic device), a portable computer disk box (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), a fiber optic device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or processing in other suitable ways if necessary, and then stored in a computer memory.

[0139] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0140] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0141] In addition, each functional unit in each embodiment of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0142] The storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art may change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A signal processing method, characterized in that: include: The temperature of the area where the target acquisition circuit in the chip is located is collected to obtain an electrical signal corresponding to the temperature; Converting the electrical signal into a time level signal; The time level signal is transmitted to the processing circuit in the chip.

2. The method according to claim 1, characterized in that The step of converting the electrical signal into a time level signal comprises: Determining a conversion circuit included in the target acquisition circuit; The electrical signal corresponding to the temperature is converted into the time level signal through the conversion circuit.

3. The method according to claim 1, characterized in that The temperature of the area where the target acquisition circuit is located corresponds to a plurality of electrical signals, and the time level signal is transmitted to the processing circuit in the chip, including: splicing a plurality of time level signals corresponding to the plurality of electrical signals into a first target time level signal; The first target time level signal is sent to the processing circuit in the chip through a single transmission line.

4. The method according to claim 1, characterized in that The temperature of the area where the target acquisition circuit is located corresponds to a plurality of electrical signals, and the time level signal is transmitted to the processing circuit in the chip, including: Each of the multiple time level signals corresponding to the multiple electrical signals is transmitted to the processing circuit in the chip through the corresponding transmission line.

5. The method according to claim 1, characterized in that The temperature of the area where the target acquisition circuit is located corresponds to a plurality of electrical signals, and the time level signal is transmitted to the processing circuit in the chip, including: Combining a plurality of time level signals corresponding to the plurality of electrical signals to determine a plurality of groups; The time level signals included in each group are transmitted to the processing circuit in the chip using corresponding transmission lines.

6. The method according to claim 5, characterized in that Each group includes at least two time level signals, and the time level signals included in each group are transmitted to the processing circuit in the chip using a corresponding transmission line, including: According to at least two time level signals included in each group, a differential signal between at least two time level signals in each group is obtained; The plurality of differential signals are transmitted to the processing circuit in the chip using corresponding transmission lines.

7. The method according to claim 5, characterized in that Each group includes at least two time level signals, and the time level signals included in each group are transmitted to the processing circuit in the chip using a corresponding transmission line, including: splicing at least two time level signals included in each group to obtain a second target time level signal corresponding to each group; The plurality of second target time level signals are transmitted to the processing circuit in the chip through a plurality of transmission lines.

8. The method according to claim 1, characterized in that The temperature of the area where the target acquisition circuit is located corresponds to a plurality of electrical signals, and sending the time level signal to the processing circuit in the chip includes: At each transmission time in the same transmission cycle, each of the time level signals is transmitted to the processing circuit using a corresponding transmission line; wherein, at each transmission time, each of the time level signals uses a different transmission line.

9. A signal processing device, characterized in that: include: The acquisition module is used to collect the temperature information of the area where the target acquisition circuit in the chip is located, and obtain an electrical signal corresponding to the temperature; A conversion module, used for converting the electrical signal into a time level signal; The transmission module is used to transmit the time level signal to the processing circuit in the chip.

10. An electronic device, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method according to any one of claims 1 to 8 is implemented.

11. A chip, characterized in that: The chip comprises at least one acquisition circuit and a processing circuit, and any one of the acquisition and processing circuits is configured to execute the method according to any one of claims 1-8.

12. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 8 is implemented.

13. A computer program product, characterized in that The invention comprises a computer program, which, when executed by a processor, implements the method according to any one of claims 1 to 8.

Images