A method, system, apparatus, and media for post-lamination dimensional stability control

Abstract

The embodiment of the application provides a method, system, device and medium for controlling the size stability after lamination, the method comprising: constructing a training sample set and an initial model group for different model group factors; for each initial model group, performing multiple rounds of iterative training on the initial model group by using the corresponding training sample set to obtain a corresponding target model group; obtaining a model group factor of a product, determining a target model group corresponding to the product according to the model group factor, inputting the to-be-processed expansion and contraction change data of the product into the target model group corresponding to the product, performing calculation on the to-be-processed expansion and contraction change data by using the target model group to obtain a predicted expansion and contraction range of the PCB after lamination, and adjusting and controlling the expansion and contraction coefficient of the product according to the predicted expansion and contraction range of the PCB after lamination. The method realizes automatic adjustment and control of the expansion and contraction coefficient and improves the efficiency of adjusting the expansion and contraction coefficient.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a method, system, device and medium for controlling dimensional stability after lamination. Background Technology

[0002] During the manufacturing process of printed circuit boards (PCBs), multiple factors influence the dimensional shrinkage of the product. These factors primarily include differences in product structure, such as the type of materials used, the combination of prepregs, residual copper content, and board thickness. Furthermore, variations in the manufacturing process, particularly the thermal effects caused by heating and the stress changes generated during mechanical stretching, further exacerbate the complexity and unpredictability of PCB dimensional expansion and contraction.

[0003] As printed circuit board (PCB) technology continues to evolve towards miniaturization and high-density stacking, the requirements for dimensional and alignment accuracy of PCB products are becoming increasingly stringent. Therefore, achieving accurate prediction and control of PCB dimensional expansion and contraction is crucial to meeting these high demands. However, in existing technologies, achieving accurate prediction and control of PCB dimensional expansion and contraction typically relies on failure analysis and iterative testing to obtain compensation coefficients. This process is often time-consuming, resource-intensive, and requires specialized technical personnel, resulting in low efficiency and high labor and material costs. Summary of the Invention

[0004] The main objective of this application is to provide a method, system, device, and medium for controlling the dimensional stability after lamination, aiming to automatically adjust and control the expansion and contraction coefficient and improve the efficiency of adjusting the expansion and contraction coefficient.

[0005] To achieve the above objectives, a first aspect of this application provides a method for controlling dimensional stability after lamination, the method comprising:

[0006] Training sample sets and initial model sets are constructed for different model group factors. The training sample sets include the expansion and contraction change data corresponding to the model group factors and the actual expansion and contraction range corresponding to the expansion and contraction change data. Different initial model sets process PCB lamination with different expansion and contraction size transformation ranges.

[0007] For each initial model group, the initial model group is trained in multiple rounds of iterative training using the corresponding training sample set to obtain the corresponding target model group;

[0008] Obtain the model group factors of the product, and determine the target model group corresponding to the product based on the model group factors;

[0009] Input the expansion and contraction change data corresponding to the product into the target model group corresponding to the product, so as to perform calculations on the expansion and contraction change data to be processed through the target model group to obtain the predicted expansion and contraction range after PCB lamination.

[0010] The expansion and contraction coefficient of the product is adjusted and controlled based on the predicted expansion and contraction range after PCB lamination.

[0011] The method provided in the first aspect can automatically adjust and control the expansion and contraction coefficient, thereby improving the efficiency of adjusting the expansion and contraction coefficient. This avoids the problems of long time consumption, high resource consumption, low efficiency, and high labor and material costs that are usually caused by relying on failure analysis and repeated experiments to obtain the compensation coefficient in the existing technology.

[0012] In one possible implementation, the expansion / contraction data corresponding to the model group factors and the expansion / contraction data to be processed are measured by an X-ray measuring device.

[0013] In one possible implementation, the model group factors include the PCB stack composition and the PCB manufacturing process factors.

[0014] In one possible implementation, the step of performing multiple rounds of iterative training on the initial model set using the corresponding training sample set to obtain the corresponding target model set includes:

[0015] Input the inflation / contraction change data corresponding to the model group factors into the initial model group corresponding to the model group factors to obtain the predicted inflation / contraction range;

[0016] Based on the predicted range of expansion and contraction and the actual range of expansion and contraction, the loss of the initial model group is determined, and the model parameters of the initial model group are tuned based on the loss.

[0017] In one possible implementation, adjusting and controlling the expansion and contraction coefficient of the product based on the predicted expansion and contraction range after PCB lamination includes the following steps:

[0018] Determine whether the predicted expansion and contraction range after PCB lamination exceeds the expansion and contraction range required by the product. If it does not exceed the range, output the expansion and contraction coefficient of the PCB normally. If it exceeds the range, calculate the corrected expansion and contraction coefficient based on the expansion and contraction range required by the product, compensate the corrected expansion and contraction coefficient into the drill tape, and output the corrected drill tape expansion and contraction coefficient based on the allowable corrected expansion and contraction coefficient value.

[0019] In one possible implementation, the output of the corrected drill strip expansion coefficient based on a permissible expansion coefficient value includes:

[0020] The system limits the allowable expansion and contraction coefficient, and determines whether the corrected expansion and contraction coefficient of the drill strip is within the allowable range. If it exceeds the range, an error is automatically reported; otherwise, the corrected expansion and contraction coefficient of the drill strip is output.

[0021] To achieve the above objectives, a second aspect of this application provides a system for controlling dimensional stability after lamination, the system comprising:

[0022] X-ray measurement module: used to measure the expansion and contraction data corresponding to the model group factors and the expansion and contraction data to be processed;

[0023] The construction module is used to construct training sample sets and initial model sets for different model group factors. The training sample set includes the expansion and contraction change data corresponding to the model group factors and the actual expansion and contraction range corresponding to the expansion and contraction change data. Different initial model sets process PCB lamination with different expansion and contraction size transformation ranges.

[0024] Model training module: used to perform multiple rounds of iterative training on each initial model group using the corresponding training sample set to obtain the corresponding target model group;

[0025] Model group factor acquisition module: Acquires the model group factors of the product, and determines the target model group corresponding to the product based on the model group factors;

[0026] Expansion and contraction change data processing module: used to input the expansion and contraction change data to be processed corresponding to the product into the target model group corresponding to the product, so as to perform calculation on the expansion and contraction change data to be processed through the target model group to obtain the predicted expansion and contraction range after PCB lamination;

[0027] The expansion / contraction coefficient adjustment module is used to determine whether the predicted expansion / contraction range after PCB lamination exceeds the expansion / contraction range required by the product. If it does not exceed the range, the expansion / contraction coefficient of the PCB drill tape is output normally. If it exceeds the range, a corrected expansion / contraction coefficient is calculated based on the expansion / contraction range required by the product, and the corrected expansion / contraction coefficient is compensated into the drill tape. The corrected drill tape expansion / contraction coefficient is output based on the allowable correction value.

[0028] The second aspect of the system enables automatic adjustment and control of the expansion and contraction coefficient, improving the efficiency of adjustment, reducing labor costs and the scrap costs caused by excessive expansion and contraction, thus enhancing product quality and capability and effectively increasing product yield. It avoids the problems of existing technologies that typically rely on failure analysis and repeated testing to obtain compensation coefficients, resulting in long processing times, high resource consumption, low efficiency, and high labor and material costs.

[0029] In one possible implementation, the output of the corrected drill strip expansion coefficient based on a permissible expansion coefficient value includes:

[0030] The system limits the allowable expansion and contraction coefficient, and determines whether the corrected expansion and contraction coefficient of the drill strip is within the allowable range. If it exceeds the range, an error is automatically reported; otherwise, the corrected expansion and contraction coefficient of the drill strip is output.

[0031] Thirdly, an electronic device is provided, comprising: a memory and a processor, the memory storing a computer program, the processor executing the computer program to implement a method for controlling post-lamination dimensional stability as described in any possible implementation of the first and second aspects.

[0032] Fourthly, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements a method for controlling post-lamination dimensional stability as described in any possible implementation of the first and second aspects.

[0033] As can be seen from the technical solutions provided in one or more embodiments of this specification, the method for controlling the dimensional stability after lamination provided in this application constructs training sample sets and initial model sets for different model group factors. For each initial model set, multiple rounds of iterative training are performed on the initial model set using the corresponding training sample set to obtain the corresponding target model set. The model group factors of the product are obtained, and the target model set corresponding to the product is determined based on the model group factors. The expansion and contraction change data to be processed corresponding to the product is input into the target model set corresponding to the product. The expansion and contraction change data to be processed is calculated using the target model set to obtain the predicted expansion and contraction range after PCB lamination. The expansion and contraction coefficient of the product is adjusted and controlled based on the predicted expansion and contraction range after PCB lamination. This achieves automatic adjustment and control of the expansion and contraction coefficient, improving the efficiency of adjusting the expansion and contraction coefficient. It avoids the problems of long time consumption, high resource consumption, low efficiency, and high labor and material costs that are usually obtained by failure analysis and repeated experiments in the prior art. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in one or more embodiments or prior art of this specification, the accompanying drawings used in the description of one or more embodiments or prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1A flowchart illustrating the method for controlling post-lamination dimensional stability provided in an embodiment of this application;

[0036] Figure 2 This is a logical diagram illustrating how the target model group calculates and adjusts the entered product information.

[0037] Figure 3 A schematic diagram for establishing an initial model set for big data-based derivation and model set factors;

[0038] Figure 4 This is a logic diagram illustrating the adjustment and control of the product's expansion and contraction coefficient based on the predicted expansion and contraction range after PCB lamination.

[0039] Figure 5 This is a structural block diagram of an electronic device according to an embodiment of this application. Detailed Implementation

[0040] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in one or more embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described one or more embodiments are merely some embodiments of this specification, and not all embodiments. All other embodiments obtained by those skilled in the art based on one or more embodiments of this specification without creative effort should fall within the protection scope of this document.

[0041] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0043] It should be noted that in all specific embodiments of this application, when processing data related to user identity or characteristics, such as user information, user behavior data, user historical data, and user location information, user permission or consent is obtained first. Furthermore, the collection, use, and processing of this data comply with relevant laws, regulations, and standards of the relevant countries and regions. In addition, when embodiments of this application require access to sensitive personal information of users, separate permission or consent from the user is obtained through pop-ups or redirects to confirmation pages. Only after obtaining the user's separate permission or consent is the necessary user-related data for the proper functioning of the embodiments of this application obtained.

[0044] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0045] Figure 1 This is an optional flowchart illustrating a method for controlling dimensional stability after lamination provided in an embodiment of this application. Figure 1 The method may include, but is not limited to, steps S100 to S500.

[0046] Firstly, such as Figure 1 As shown, a method for controlling dimensional stability after lamination is provided, the method comprising:

[0047] S100. Construct training sample sets and initial model sets for different model group factors. The training sample sets include the expansion and contraction change data corresponding to the model group factors and the actual expansion and contraction range corresponding to the expansion and contraction change data. Different initial model sets process PCB lamination with different expansion and contraction size transformation ranges.

[0048] It should be noted that by constructing diverse training sample sets, the model can better adapt to different data distributions and scenarios, learn more features and patterns, thereby reducing the risk of overfitting, enhancing the model's generalization ability, and improving the accuracy of expansion and contraction range prediction and classification. The expansion and contraction size transformation range after different PCB laminations varies due to factors such as material properties, manufacturing processes, design structures, and temperature changes. Therefore, different initial model groups are set to handle different expansion and contraction size transformation ranges after PCB lamination, meaning that the product stack composition and processing flow are similar within the same initial model group.

[0049] S200. For each initial model group, use the corresponding training sample set to perform multiple rounds of iterative training on the initial model group to obtain the corresponding target model group.

[0050] It's important to note that each iteration of training allows the model to further learn the features and patterns in the training dataset. As the number of iterations increases, the model gradually adjusts its internal parameters to better fit the training data. However, in practical applications, too many iterations can lead to overfitting, preventing the model from generalizing well to new data. Therefore, it's necessary to select the number of iterations based on actual needs and use methods such as validation sets or cross-validation to monitor the model's performance to ensure good generalization ability.

[0051] S300. Obtain the model group factors of the product, and determine the target model group corresponding to the product based on the model group factors.

[0052] S400: Input the expansion and contraction change data to be processed corresponding to the product into the target model group corresponding to the product, so as to perform calculations on the expansion and contraction change data to be processed through the target model group to obtain the predicted expansion and contraction range after PCB lamination.

[0053] S500: Adjust and control the product's expansion and contraction coefficient based on the predicted expansion and contraction range after PCB lamination.

[0054] It should be noted that, as Figure 2 As shown, based on the expansion and contraction change data corresponding to the model group factors and the actual expansion and contraction range corresponding to the expansion and contraction change data, the initial model group undergoes multiple rounds of iterative training to improve the model's capabilities and obtain the corresponding target model group. The target model group that meets the model's capabilities automatically acquires the product's model group factors to determine the target model group corresponding to the product. Then, the target model group performs calculations on the expansion and contraction change data corresponding to the input product to obtain the predicted expansion and contraction range after PCB lamination and determines whether it meets the product specifications. If it does, the expansion and contraction coefficient is output; if not, the product's expansion and contraction coefficient is adjusted and controlled according to the product's required expansion and contraction range and specifications, and the adjusted expansion and contraction coefficient that meets the product specifications is output. If the adjusted expansion and contraction coefficient still does not meet the product rules, the process returns to improve the model's capabilities and repeats the above steps. The entire process is fully automated, requiring no manual intervention, significantly reducing the time and cost of manual operation, thereby greatly improving production efficiency, avoiding delays and errors caused by human factors, improving product quality, and reducing cost waste due to errors.

[0055] The method provided in the first aspect can automatically adjust and control the expansion and contraction coefficient, thereby improving the efficiency of adjusting the expansion and contraction coefficient. This avoids the problems of long time consumption, high resource consumption, low efficiency, and high labor and material costs that are usually caused by relying on failure analysis and repeated experiments to obtain the compensation coefficient in the existing technology.

[0056] In one possible implementation, the expansion / contraction data corresponding to the model group factors and the expansion / contraction data to be processed are measured by an X-ray measuring device.

[0057] X-rays can penetrate PCB materials, generating images of their internal structure and enabling high-resolution imaging of expansion and contraction changes. This imaging technology allows manufacturers to clearly observe minute changes within the PCB, including interlayer misalignment and soldering defects. X-ray images allow for precise measurement of positional changes at key points on the PCB, thus calculating expansion and contraction variations. X-ray measurement is a non-destructive testing technique. It does not damage the PCB or components, allowing for multiple inspections without disassembling the product, preserving the PCB's integrity and enabling continued use in subsequent production processes, reducing production costs and waste. Furthermore, X-ray inspection is fast, capturing high-resolution images quickly. This significantly improves inspection efficiency, and the high degree of automation in X-ray measurement equipment further enhances efficiency and reduces errors caused by human factors.

[0058] In one possible implementation, the model group factors include the PCB stack composition and the PCB manufacturing process factors.

[0059] It should be noted that, as Figure 3 As shown, the model group factors affect the dimensional expansion and contraction changes of the product after lamination. The model group factors include the PCB stack-up composition and the PCB manufacturing process factors. The PCB stack-up composition includes residual copper ratio, core board thickness, PP thickness, copper thickness, material type, rigidity, etc. The PCB manufacturing process factors include reflow soldering, resin via plugging, POFV, leaded tin plating, lead-free tin plating, plasma soldering, baking, etc. In addition, it is understood that the embodiments of this application do not limit the types and number of model group factors.

[0060] In one possible implementation, the step of performing multiple rounds of iterative training on the initial model set using the corresponding training sample set to obtain the corresponding target model set includes:

[0061] Input the inflation / contraction change data corresponding to the model group factors into the initial model group corresponding to the model group factors to obtain the predicted inflation / contraction range; based on the predicted inflation / contraction range and the actual inflation / contraction range, determine the loss of the initial model group, and perform model parameter tuning on the initial model group based on the loss.

[0062] It's important to note that determining the initial model loss based on the predicted and actual expansion / contraction ranges for parameter tuning allows the model to better fit the training data and enhances its generalization ability. Tuning parameters using the actual expansion / contraction range helps the model better handle various complex situations in real-world applications. Furthermore, each iteration of training provides the model with an opportunity to further learn the features and patterns in the training dataset. As the number of iterations increases, the model gradually adjusts its internal parameters to better fit the training data. However, in practice, too many iterations can lead to overfitting, preventing the model from generalizing well to new data. Therefore, it's necessary to select the number of iterations according to actual needs and use methods such as validation sets or cross-validation to monitor model performance to ensure good generalization ability.

[0063] like Figure 4 As shown, in one possible implementation, adjusting and controlling the expansion and contraction coefficient of the product based on the predicted expansion and contraction range after PCB lamination includes the following steps:

[0064] Determine whether the predicted expansion and contraction range after PCB lamination exceeds the expansion and contraction range required by the product. If it does not exceed the range, output the expansion and contraction coefficient of the PCB normally. If it exceeds the range, calculate the corrected expansion and contraction coefficient based on the expansion and contraction range required by the product, compensate the corrected expansion and contraction coefficient into the drill tape, and output the corrected drill tape expansion and contraction coefficient based on the allowable corrected expansion and contraction coefficient value.

[0065] It should be noted that, in order to improve product manufacturing efficiency and quality, it is necessary to precisely control the expansion and contraction of the board material, that is, to adjust and control the expansion and contraction coefficient of the product. Traditional expansion and contraction compensation methods based on manual experience suffer from problems such as outdated updates, insufficient targeting and accuracy, and are difficult to meet the high precision requirements of current PCB manufacturing. Therefore, the operation process of adjusting and controlling the expansion and contraction coefficient of the product based on the predicted expansion and contraction range after PCB lamination provided in this application embodiment is fully automated, without relying on manual assistance. Furthermore, it determines whether the predicted expansion and contraction range after PCB lamination exceeds the expansion and contraction range required by the product, thereby determining whether to output the expansion and contraction coefficient of the PCB normally or after correcting the expansion and contraction coefficient, which can better adapt to the manufacturing needs of different batches and specifications of PCBs.

[0066] like Figure 4 As shown, in one possible implementation, the step of outputting the corrected drill strip expansion coefficient based on the allowable expansion coefficient value includes: limiting the allowable expansion coefficient, determining whether the corrected drill strip expansion coefficient is within the range of the allowable expansion coefficient, and if it exceeds the range, automatically reporting an error; if it does not exceed the range, then outputting the corrected drill strip expansion coefficient.

[0067] It should be noted that due to the limitations of drill tape compensation and the complexity and variability of PCB manufacturing processes, the corrected expansion and contraction coefficient cannot be fully compensated for in the drill tape. Therefore, it is necessary to limit different allowable expansion and contraction coefficients based on the actual situation to determine whether the corrected drill tape expansion and contraction coefficient is within the set range. If it exceeds the range, an error will be automatically reported; if it does not exceed the range, the corrected drill tape expansion and contraction coefficient will be output.

[0068] To achieve the above objectives, a second aspect of this application provides a system for controlling dimensional stability after lamination, the system comprising:

[0069] X-ray measurement module: used to measure the expansion and contraction data corresponding to the model group factors and the expansion and contraction data to be processed.

[0070] It's important to note that X-rays can penetrate PCB materials, generating images of their internal structure and enabling high-resolution imaging of expansion and contraction changes. This imaging technology allows manufacturers to clearly observe minute changes within the PCB, including interlayer misalignment and soldering defects. X-ray images allow for precise measurement of positional changes at key points on the PCB, thus calculating expansion and contraction variations. X-ray measurement is a non-destructive testing technique. It does not damage the PCB or components, allowing for multiple inspections without disassembling the product, preserving the PCB's integrity and enabling continued use in subsequent production processes, reducing production costs and waste. Furthermore, X-ray inspection is fast, capturing high-resolution images quickly. This significantly improves inspection efficiency, and the high degree of automation in X-ray measurement equipment further enhances efficiency and reduces errors caused by human factors.

[0071] The construction module is used to construct training sample sets and initial model sets for different model group factors. The training sample set includes the expansion and contraction change data corresponding to the model group factors and the actual expansion and contraction range corresponding to the expansion and contraction change data. Different initial model sets process PCB lamination with different expansion and contraction size transformation ranges.

[0072] Model training module: used to perform multiple rounds of iterative training on each initial model group using the corresponding training sample set to obtain the corresponding target model group.

[0073] The process of iteratively training the initial model group using the corresponding training sample set to obtain the target model group includes: predicting the range of fluctuations based on the fluctuation data corresponding to the model group factors; determining the model loss based on the predicted and actual fluctuation ranges; and tuning the model parameters of the initial model group based on the model loss. Determining the model loss based on the predicted and actual fluctuation ranges for parameter tuning allows the model to better fit the training data and enhances its generalization ability. Tuning the model parameters using the actual fluctuation ranges helps the model better cope with various complex situations in practical applications. It is important to note that each iteration of training gives the model the opportunity to further learn the features and patterns in the training dataset. As the number of iterations increases, the model gradually adjusts its internal parameters to better fit the training data. However, in practical applications, too many iterations may lead to overfitting, preventing the model from generalizing well to new data. Therefore, it is necessary to select the number of iterations according to actual needs and use methods such as validation sets or cross-validation to monitor the model's performance to ensure good generalization ability.

[0074] Model group factor acquisition module: Acquires the model group factors of the product, and determines the target model group corresponding to the product based on the model group factors.

[0075] Expansion and contraction change data processing module: used to input the expansion and contraction change data to be processed corresponding to the product into the target model group corresponding to the product, so as to perform calculations on the expansion and contraction change data to be processed through the target model group to obtain the predicted expansion and contraction range after PCB lamination.

[0076] The expansion / contraction coefficient adjustment module is used to determine whether the predicted expansion / contraction range after PCB lamination exceeds the expansion / contraction range required by the product. If it does not exceed the range, the expansion / contraction coefficient of the PCB drill tape is output normally. If it exceeds the range, a corrected expansion / contraction coefficient is calculated based on the expansion / contraction range required by the product, and the corrected expansion / contraction coefficient is compensated into the drill tape. The corrected drill tape expansion / contraction coefficient is output based on the allowable correction value.

[0077] It should be noted that the model group factor acquisition module automatically acquires the model group factors of the product to determine the target model group corresponding to the product. Then, the target model group in the expansion and contraction change data processing module performs calculations on the expansion and contraction change data to be processed corresponding to the input product to obtain the predicted expansion and contraction range after PCB lamination. The expansion and contraction coefficient adjustment module determines whether it will exceed the expansion and contraction range required by the product, and then adjusts and controls the expansion and contraction coefficient of the product according to the expansion and contraction range required by the product. The entire system achieves full automation without any manual intervention, significantly reducing the time and cost of manual operation, thereby greatly improving production efficiency, avoiding delays and errors caused by human factors, improving product quality, and reducing cost waste caused by errors.

[0078] The second aspect of the system enables automatic adjustment and control of the expansion and contraction coefficient, improving the efficiency of adjustment, reducing labor costs and the scrap costs caused by excessive expansion and contraction, thus enhancing product quality and capability and effectively increasing product yield. It avoids the problems of existing technologies that typically rely on failure analysis and repeated testing to obtain compensation coefficients, resulting in long processing times, high resource consumption, low efficiency, and high labor and material costs.

[0079] In one possible implementation, the step of outputting the corrected drill strip expansion coefficient based on the allowed expansion coefficient value includes: limiting the allowed expansion coefficient, determining whether the corrected drill strip expansion coefficient is within the range of the allowed expansion coefficient, and if it exceeds the range, automatically reporting an error; if it does not exceed the range, then outputting the corrected drill strip expansion coefficient.

[0080] Due to the limitations of drill tape compensation and the complexity and variability of PCB manufacturing processes, the corrected expansion and contraction coefficient cannot be fully compensated for in the drill tape. Therefore, it is necessary to limit different allowable expansion and contraction coefficients based on the actual situation to determine whether the corrected drill tape expansion and contraction coefficient is within the set range. If it exceeds the range, an error will be automatically reported; if it does not exceed the range, the corrected drill tape expansion and contraction coefficient will be output.

[0081] This application also provides an electronic device, such as... Figure 5 As shown, the electronic device 1400 includes:

[0082] One or more processors 1410;

[0083] The memory 1420 stores one or more programs that, when executed by one or more processors 1410, enable the one or more processors 1410 to implement the method for controlling post-lamination dimensional stability provided in any embodiment of this application.

[0084] Memory 1420, as a non-transitory network system, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory 1420 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory 1420 may optionally include remotely located memories 1420 relative to processor 1410, which can be connected to processor 1410 via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0085] The memory 1420 can be implemented as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1420 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 1420 and is called and executed by the processor 1410.

[0086] The processor 1410 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0087] In some embodiments, the electronic device further includes:

[0088] Input / output interfaces are used to implement information input and output;

[0089] The communication interface is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0090] The bus transmits information between various components of the device (e.g., processor 1410, memory 1420, input / output interface, and communication interface);

[0091] The processor 1410, memory 1420, input / output interface, and communication interface can communicate with each other within the device via a bus.

[0092] An embodiment of this application also provides a computer-readable storage medium storing computer-executable instructions for performing a method for controlling post-lamination dimensional stability provided in any embodiment of this application.

[0093] An embodiment of this application also provides a computer program product, including a computer program or computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer program or computer instructions from the computer-readable storage medium and executes the computer program or computer instructions, causing the computer device to perform a method for controlling the dimensional stability after lamination provided in any embodiment of this application.

[0094] The system architecture and application scenarios described in this application are intended to more clearly illustrate the technical solutions of this application and do not constitute a limitation on the technical solutions provided in this application. Those skilled in the art will understand that as system architectures evolve and new application scenarios emerge, the technical solutions provided in this application are also applicable to similar technical problems.

[0095] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAM bus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0096] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0097] The above description, with reference to the accompanying drawings, illustrates some embodiments of this application, but does not limit the scope of the invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and spirit of this invention should be considered within the scope of this application.

[0098] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0099] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0100] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0101] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0102] The foregoing has described specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are possible or may be advantageous.

[0103] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A method for controlling dimensional stability after lamination, characterized in that, The method includes: Training sample sets and initial model sets are constructed for different model group factors. The training sample sets include the expansion and contraction change data corresponding to the model group factors and the actual expansion and contraction range corresponding to the expansion and contraction change data. Different initial model sets process PCB lamination with different expansion and contraction size transformation ranges. For each initial model group, the initial model group is trained in multiple rounds of iterative training using the corresponding training sample set to obtain the corresponding target model group; Obtain the model group factors of the product, and determine the target model group corresponding to the product based on the model group factors; the model group factors include the stack-up composition of the PCB and the process flow factors of the PCB. Input the expansion and contraction change data corresponding to the product into the target model group corresponding to the product, so as to perform calculations on the expansion and contraction change data to be processed through the target model group to obtain the predicted expansion and contraction range after PCB lamination. The expansion and contraction coefficient of the product is adjusted and controlled based on the predicted expansion and contraction range after PCB lamination. in: The step of performing multiple rounds of iterative training on the initial model group using the corresponding training sample set to obtain the corresponding target model group includes: Input the inflation / contraction change data corresponding to the model group factors into the initial model group corresponding to the model group factors to obtain the predicted inflation / contraction range; Based on the predicted range of expansion and contraction and the actual range of expansion and contraction, the loss of the initial model group is determined, and the model parameters of the initial model group are tuned based on the loss.

2. The method according to claim 1, characterized in that, The expansion and contraction data corresponding to the model group factors and the expansion and contraction data to be processed are measured by X-ray measurement equipment.

3. The method according to claim 1, characterized in that, The adjustment and control of the product's expansion and contraction coefficient based on the predicted expansion and contraction range after PCB lamination includes the following steps: Determine whether the predicted expansion and contraction range after PCB lamination exceeds the expansion and contraction range required by the product. If it does not exceed the range, output the expansion and contraction coefficient of the PCB normally. If it exceeds the range, calculate the corrected expansion and contraction coefficient based on the expansion and contraction range required by the product, compensate the corrected expansion and contraction coefficient into the drill tape, and output the corrected drill tape expansion and contraction coefficient based on the allowable corrected expansion and contraction coefficient value.

4. The method according to claim 3, characterized in that, The drill strip expansion coefficient output based on the allowed expansion coefficient value includes: Define the allowable expansion and contraction coefficient, and determine whether the corrected drill strip expansion and contraction coefficient is within the range of the allowable expansion and contraction coefficient. If it exceeds the range, an error is automatically reported; if it does not exceed the range, the corrected drill strip expansion and contraction coefficient is output.

5. A system for controlling dimensional stability after lamination, characterized in that, The system includes: X-ray measurement module: used to measure the expansion and contraction data corresponding to the model group factors and the expansion and contraction data to be processed; The construction module is used to construct training sample sets and initial model sets for different model group factors. The training sample set includes the expansion and contraction change data corresponding to the model group factors and the actual expansion and contraction range corresponding to the expansion and contraction change data. Different initial model sets process PCB lamination with different expansion and contraction size transformation ranges. Model training module: used to perform multiple rounds of iterative training on each initial model group using the corresponding training sample set to obtain the corresponding target model group; Model group factor acquisition module: Acquires the model group factors of the product, and determines the target model group corresponding to the product based on the model group factors; the model group factors include the PCB stack-up composition and the PCB manufacturing process factors; Expansion and contraction change data processing module: used to input the expansion and contraction change data to be processed corresponding to the product into the target model group corresponding to the product, so as to perform calculation on the expansion and contraction change data to be processed through the target model group to obtain the predicted expansion and contraction range after PCB lamination; The expansion and contraction coefficient adjustment module is used to determine whether the predicted expansion and contraction range after PCB lamination exceeds the expansion and contraction range required by the product. If it does not exceed the range, the expansion and contraction coefficient of the PCB drill tape is output normally. If it exceeds the range, the corrected expansion and contraction coefficient is calculated based on the expansion and contraction range required by the product, and the corrected expansion and contraction coefficient is compensated into the drill tape. The corrected drill tape expansion and contraction coefficient is output based on the allowable correction value. in: The step of performing multiple rounds of iterative training on the initial model group using the corresponding training sample set to obtain the corresponding target model group includes: Input the inflation / contraction change data corresponding to the model group factors into the initial model group corresponding to the model group factors to obtain the predicted inflation / contraction range; Based on the predicted range of expansion and contraction and the actual range of expansion and contraction, the loss of the initial model group is determined, and the model parameters of the initial model group are tuned based on the loss.

6. The system according to claim 5, characterized in that, The drill strip expansion coefficient output based on the allowed expansion coefficient value includes: The system limits the allowable expansion and contraction coefficient, and determines whether the corrected expansion and contraction coefficient of the drill strip is within the allowable range. If it exceeds the range, an error is automatically reported; otherwise, the corrected expansion and contraction coefficient of the drill strip is output.

7. An electronic device, characterized in that, The electronic device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the method for controlling dimensional stability after lamination as described in any one of claims 1 to 4.

8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method for controlling post-lamination dimensional stability as described in any one of claims 1 to 4.

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