Circuit board through hole equipment

Abstract

The invention relates to the technical field of circuit board manufacturing, and discloses a circuit board through hole device, the circuit board through hole device comprises a cleaning component, the cleaning component comprises a supporting assembly used for supporting a circuit board, and the circuit board is provided with a process hole; the air blowing assembly comprises an air blowing part and a first power part which are connected, the air blowing part is provided with an air blowing hole, and the first power part is connected with the air blowing part and used for driving the air blowing part to be close to the circuit board in the first direction, so that an opening of the air blowing hole corresponds to an orifice of the fabrication hole. According to the circuit board through hole equipment provided by the invention, the problems that the efficiency is not high when a through hole jig is adopted to dredge the process hole in the related technology, and extra manufacturing and maintenance cost exists due to the fact that a special through hole jig needs to be manufactured can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a circuit board through-hole device. Background Art

[0002] When the printed circuit board (PCB) is integrally formed using a stamping die, the copper foil corresponding to the punching needle and the process hole will adhere together due to the extrusion effect. When the punching needle is withdrawn after the punching is completed, the copper foil that has been punched out will be brought back into the process hole, causing the hole to be blocked. Therefore, the process hole needs to be unblocked.

[0003] The traditional through-hole method generally uses a through-hole jig to dredge the process hole. Among them, the through-hole jig is on a piece of bakelite board, and a small-sized needle smaller than the process hole is inserted into the corresponding position of the hole of the circuit board. When in use, the needle on the through-hole jig passes through the process hole of the circuit board to dredge the process hole. This method is not only inefficient, but also has additional production and maintenance costs because a special through-hole jig needs to be made. Summary of the invention

[0004] The present application provides a circuit board through-hole device, which can solve the problem that the use of through-hole jigs to clear process holes in the related art is not only inefficient, but also has additional production and maintenance costs due to the need to make special through-hole jigs.

[0005] The embodiment of the present application provides a circuit board through-hole device, the circuit board through-hole device includes a cleaning component, and the cleaning component includes:

[0006] A supporting assembly, used for supporting a circuit board, wherein the circuit board has a process hole;

[0007] The blowing assembly includes a connected blowing member and a first power member, wherein the blowing member has a blowing hole, and the first power member is connected to the blowing member and is used to drive the blowing member to approach the circuit board along a first direction so that the opening of the blowing hole corresponds to the orifice of the process hole.

[0008] In some embodiments, the blowing member is provided with a slide groove extending along the second direction, and the opening of the blowing hole is formed on the inner wall of the slide groove; the blowing assembly also includes an adjusting member, which can be slidably arranged in the slide groove and cover at least part of the opening, and the adjusting member can be moved relative to the blowing member to increase or decrease the area of ​​the opening covered by the adjusting member.

[0009] In some embodiments, the blowing assembly further includes a threaded member and a bracket, the threaded member is passed through the bracket and the two are threadedly matched, the axis of the threaded member is parallel to the second direction, and the threaded member is connected to the adjusting member.

[0010] In some embodiments, at least two adjusting members are provided, and the two adjusting members are sequentially provided along the second direction and are respectively located at two ends of the sliding groove.

[0011] In some embodiments, the blowing member is provided with a first sealing portion, the first sealing portion is used to define a portion of the channel connecting the opening with the process hole, and the first sealing portion is used to abut against the circuit board; and / or, the adjusting member is provided with a second sealing portion, the second sealing portion is used to define a portion of the channel connecting the opening with the process hole, and the second sealing portion is used to abut against the circuit board.

[0012] In some embodiments, the blowing assembly further includes a first guide member extending along the first direction, and the blowing member is slidably matched with the first guide member.

[0013] In some embodiments, the support assembly includes a plurality of support plates, which are arranged in sequence and at intervals, at least two of the support plates are used to jointly support the circuit board and a gap between the two support plates is connected to the process hole.

[0014] In some embodiments, the support assembly includes a hopper, which is disposed at the bottom of the support plate, and an inner space of the hopper is communicated with the gap.

[0015] In some embodiments, the cleaning component includes two clamping plate assemblies, which are respectively arranged on both sides of the supporting assembly, and the two clamping plate assemblies can be moved toward each other to clamp the circuit board.

[0016] In some of the embodiments, the clamping plate assembly includes a clamping member and a power seat connected to each other, and the power seat is used to drive the clamping member to move closer to or away from the circuit board.

[0017] In some embodiments, the power seat is used to drive the clamping member to move along the first direction; and / or, the power seat is used to drive the clamping member to move along a third direction, which is perpendicular to the first direction and perpendicular to the arrangement direction of the two clamping plate assemblies.

[0018] In some embodiments, the circuit board through-hole device further includes a loading component, and the loading component is used to move the circuit board from a first preset position to the supporting assembly.

[0019] In some embodiments, the loading component includes an upper plate transverse movement mechanism and an upper plate lifting mechanism, the upper plate lifting mechanism is used to move the circuit board from the first preset position along the first loading path to the first transfer position, and the upper plate transverse movement mechanism is used to move the circuit board from the first transfer position along the second loading path to the support assembly, and the second loading path is not parallel to the first loading path.

[0020] In some embodiments, the supporting assembly has a blowing position and a loading position spaced apart from each other, the first power member is used to drive the blowing member to approach the circuit board located at the blowing position along a first direction, and the loading member is used to move the circuit board from the first preset position to the loading position; the cleaning member also includes a first conveying assembly and a limiting assembly, the limiting assembly is arranged between the loading position and the blowing position, and the first conveying assembly is used to move the circuit board from the loading position to contact with the limiting assembly to limit the position of the circuit board in at least one direction.

[0021] In some embodiments, the limiting assembly includes a limiting member and a second power member connected to each other, the limiting member is used to contact the circuit board, and the second power member is used to drive the limiting member away from the circuit board.

[0022] In some embodiments, the loading component also includes an upper plate clapping mechanism, and the upper plate clapping mechanism includes two loading clapping plates. The two loading clapping plates can be close to each other to clamp the circuit board in contact with the limiting component.

[0023] In some embodiments, the circuit board through-hole equipment also includes a detection component, which includes a photographic component and a second conveying component, wherein the second conveying component is used to move the circuit board to the field of view of the photographic component, and the photographic component is used to take photos and detect the interior of the process hole.

[0024] In some embodiments, the circuit board through-hole device further includes a blanking component, and the blanking component is used to move the circuit board on the second conveying assembly to a second preset position.

[0025] In some embodiments, the unloading component includes a lower plate transverse movement mechanism and a lower plate lifting mechanism, the lower plate transverse movement mechanism is used to move the circuit board from the conveying component along the first unloading path to the second transfer position, and the lower plate lifting mechanism is used to move the circuit board from the second transfer position along the second unloading path to the second preset position, and the second unloading path is not parallel to the first unloading path.

[0026] In some embodiments, the second preset position includes a good product area and a waste product area; two lower plate lifting mechanisms are provided, and one of the lower plate lifting mechanisms is used to move the circuit board from the second transfer position to the good product area, and the other lower plate lifting mechanism is used to move the circuit board from the second transfer position to the waste product area.

[0027] The circuit board through-hole device provided in the embodiment of the present application has the beneficial effect that: since the circuit board through-hole device includes a cleaning component, the cleaning component includes a supporting component and a blowing component, and the blowing component includes a connected blowing member and a first power member, the blowing member has a blowing hole, and the first power member is connected to the blowing member, so the circuit board can be placed on the supporting component first, and then the first power member is used to drive the blowing member to approach the circuit board along the first direction, so that the opening of the blowing hole corresponds to the orifice of the process hole, and the process hole can be blown and cleared by the blowing member, the efficiency is high, there is no need to make a special through-hole jig, and the production and maintenance costs are low. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] Figure 1 This is a schematic diagram of the structure of a circuit board through-hole device and a circuit board in one of the embodiments of the present application;

[0030] Figure 2 yes Figure 1 A schematic diagram of the structure of a cleaning component in a circuit board through-hole device shown;

[0031] Figure 3 yes Figure 2 A schematic diagram of the structure of the air blowing assembly in the cleaning component shown;

[0032] Figure 4 yes Figure 3 A schematic structural diagram of the blowing assembly from another perspective shown;

[0033] Figure 5 yes Figure 4 A partial enlarged view of the middle A;

[0034] Figure 6 yes Figure 2 A schematic structural diagram of a support assembly, a clamping plate assembly, a first conveying assembly and a limiting assembly in the cleaning component shown;

[0035] Figure 7 yes Figure 6 A partial enlarged view of point B in the middle;

[0036] Figure 8 yes Figure 6 A partial enlarged view of point C in the middle;

[0037] Fig. 9 yes Figure 6 The front view of the support assembly, the clamping plate assembly, the first conveying assembly and the limiting assembly shown;

[0038] Fig.10 yes Figure 1 A schematic structural diagram of a feeding component in a circuit board through-hole device shown;

[0039] Fig.11 yes Fig.10 The structural schematic diagram of the upper plate transverse movement mechanism in the feeding component shown;

[0040] Fig.12 yes Fig.10 The schematic diagram of the structure of the upper plate lifting mechanism and the upper plate clapping mechanism in the feeding component shown;

[0041] Fig.13 yes Fig.12 The front view of the upper plate lifting mechanism and the upper plate clapping mechanism shown;

[0042] Fig.14 yes Fig.12 A top view of the upper plate lifting mechanism and the upper plate clapping mechanism shown;

[0043] Fig.15 yes Figure 1 A schematic diagram of the structure of the detection component in the circuit board through-hole device shown;

[0044] Fig.16 yes Figure 1 A schematic structural diagram of a blanking component in a circuit board through-hole device shown;

[0045] Fig.17 yes Fig.16 The schematic diagram of the structure of the lower plate transverse movement mechanism in the blanking component is shown.

[0046] The meanings of the marks in the figure are:

[0047] 1000. Circuit board through-hole equipment;

[0048] 100. Clean the parts;

[0049] 10. Support assembly; 11. Support plate; 12. Gap; 13. Hopper;

[0050] 20. Blowing assembly; 21. Blowing member; 211. Opening; 212. Slide groove; 213. First sealing part; 22. First power member; 23. Adjusting member; 231. Second sealing part; 24. Threaded member; 25. Bracket; 26. First guide member; 27. Mounting frame;

[0051] 30. Clamp assembly; 31. Clamping member; 32. First driving member; 33. Second driving member; 34. Third driving member;

[0052] 40. first conveying assembly; 41. transmission belt; 42. conveying roller;

[0053] 50. Limiting assembly; 51. Limiting member; 52. Second power member;

[0054] 200, feeding parts;

[0055] 210, upper plate transverse movement mechanism; 2101, first suction cup; 2102, fourth driving member; 2103, fifth driving member;

[0056] 220. Upper plate lifting mechanism;

[0057] 221, fixed seat; 222, upper plate driving member; 223, lifting platform; 224, lead screw nut; 225, upper plate lead screw; 226, second guide member; 227, guide rail slider;

[0058] 230. Upper board and applauding mechanism;

[0059] 2301, feeding clapper; 2302, clapper driving part; 2303, clapper belt;

[0060] 300. Detection components;

[0061] 310, camera assembly; 320, second conveying assembly;

[0062] 400, blanking parts;

[0063] 410, lower plate transverse movement mechanism; 411, second suction cup; 412, sixth driving member; 413, seventh driving member; 414, eighth driving member;

[0064] 420, lower plate lifting mechanism;

[0065] 500, rack;

[0066] 2000. Circuit board. DETAILED DESCRIPTION

[0067] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0068] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0069] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0070] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0071] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.

[0072] Please refer to Figures 1 to 5 An embodiment of the present application provides a circuit board through-hole device 1000 , which includes a cleaning component 100 , and the cleaning component 100 includes a supporting component 10 and a blowing component 20 .

[0073] The supporting assembly 10 is used to support a circuit board 2000 , and the circuit board 2000 has a process hole.

[0074] The blowing assembly 20 includes a connected blowing member 21 and a first power member 22, the blowing member 21 having a blowing hole, the first power member 22 is connected to the blowing member 21 and is used to drive the blowing member 21 to approach the circuit board 2000 along a first direction so that the opening 211 of the blowing hole corresponds to the orifice of the process hole.

[0075] The blowing member 21 may include a blowing head or a high-pressure air knife, etc. The first power member 22 may include a cylinder, a hydraulic cylinder or a motor, etc. Multiple process holes and blowing members 21 may be provided, and one blowing member 21 may be provided corresponding to one or more process holes. When multiple blowing members 21 are provided, all blowing members 21 may be connected together. One or more first power members 22 may be provided. The first direction may be the negative Z direction in the figure.

[0076] After the first power member 22 drives the blowing member 21 to approach the circuit board 2000 along the first direction, high-pressure gas can be blown into the process hole through the blowing member 21 to clear the process hole. The first power member 22 can also drive the blowing member 21 away from the circuit board 2000 in a direction opposite to the first direction.

[0077] The circuit board through-hole device 1000 provided in the embodiment of the present application includes a cleaning component 100, the cleaning component 100 includes a supporting component 10 and a blowing component 20, and the blowing component 20 includes a blowing piece 21 and a first power piece 22 connected to each other, the blowing piece 21 has a blowing hole, and the first power piece 22 is connected to the blowing piece 21, so the circuit board 2000 can be placed on the supporting component 10 first, and then the first power piece 22 is used to drive the blowing piece 21 to approach the circuit board 2000 along the first direction, so that the opening 211 of the blowing hole corresponds to the orifice of the process hole, and the process hole can be blown and cleared through the blowing piece 21, the efficiency is high, there is no need to make a special through-hole fixture, and the production and maintenance costs are low.

[0078] In this embodiment, the blowing member 21 is provided with a slide groove 212 extending along the second direction, and the opening 211 of the blowing hole is formed on the inner wall of the slide groove 212; the blowing assembly 20 also includes an adjusting member 23, which can be slidably arranged in the slide groove 212 and cover at least part of the opening 211, and the adjusting member 23 can be moved relative to the blowing member 21 to increase or decrease the area of ​​the opening 211 covered by the adjusting member 23.

[0079] By adopting the above-mentioned scheme, the adjusting member 23 can be moved relative to the blowing member 21 according to the size of the circuit board 2000 to increase or decrease the area of ​​the opening 211 covered by the adjusting member 23, so that the opening 211 of the blowing hole corresponds to the orifice of the process hole, thereby improving the versatility of the circuit board through-hole device 1000.

[0080] It is understandable that the hole diagram data and size information of the process holes of the generated circuit board 2000 can be first imported into the circuit board through-hole device 1000 equipment system, and then the position of the adjustment member 23 can be adjusted according to the width of the circuit board 2000 so that the area of ​​the opening 211 remains consistent with the circuit board 2000.

[0081] It should be noted that the second direction may be perpendicular to the first direction. The second direction may be the Y direction in the figure. When a plurality of blowing members 21 are provided, a plurality of adjusting members 23 may also be provided, and the blowing members 21 and the adjusting members 23 are provided in a one-to-one correspondence.

[0082] It should also be noted that the traditional solution of using a through-hole jig requires switching different types of through-hole jigs for different types of circuit boards 2000, and it also takes a certain amount of time to adjust the relative position of the through-hole jig and the circuit board 2000, which is not efficient enough. The circuit board through-hole device 1000 provided in the embodiment of the present application does not have this problem.

[0083] Optionally, the blowing assembly 20 further includes a threaded member 24 and a bracket 25 , the threaded member 24 is passed through the bracket 25 and the two are threadedly matched, the axis of the threaded member 24 is parallel to the second direction, and the threaded member 24 is connected to the adjusting member 23 .

[0084] With such a configuration, the adjusting member 23 can be moved relative to the blowing member 21 by simply rotating the screw member 24 relative to the bracket 25 to increase or decrease the area of ​​the opening 211 covered by the adjusting member 23 . The operation is simple and convenient.

[0085] It should be noted that, when a plurality of blowing members 21 are provided, all blowing members 21 may be connected to the threaded member 24. The bracket 25 may be connected to the first power member 22.

[0086] Optionally, at least two adjusting members 23 are provided, and the two adjusting members 23 are sequentially arranged along the second direction and are respectively located at two ends of the sliding groove 212 .

[0087] With such a configuration, the area of ​​the opening 211 shielded by the adjusting member 23 can be adjusted more conveniently, so as to better adapt to different circuit boards 2000 and prevent air leakage during blowing and poor dredging effect due to the circuit board 2000 being too narrow and the opening 211 being too wide.

[0088] Please refer to Figures 3 to 5 , wherein the blowing member 21 is provided with a first sealing portion 213, the first sealing portion 213 is used to define a partial channel connecting the opening 211 with the process hole, and the first sealing portion 213 is used to abut against the circuit board 2000; and / or, the adjusting member 23 is provided with a second sealing portion 231, the second sealing portion 231 is used to define a partial channel connecting the opening 211 with the process hole, and the second sealing portion 231 is used to abut against the circuit board 2000.

[0089] By adopting the above solution, the connection between the opening 211 of the blowing hole and the orifice of the process hole can be more sealed, so that the process hole can be better cleared through the blowing piece 21 .

[0090] It should be noted that both the first sealing portion 213 and the second sealing portion 231 may be made of rubber rings or the like.

[0091] Optionally, the blowing assembly 20 further includes a first guide member 26 , the first guide member 26 extends along the first direction, and the blowing member 21 is slidably matched with the first guide member 26 .

[0092] Such an arrangement enables the blowing member 21 to move more smoothly when the first power member 22 drives the blowing member 21 to move closer to or away from the circuit board 2000 .

[0093] It should be noted that a plurality of first guide members 26 may be provided, and the blowing assembly 20 may further include a mounting frame 27 . The first power member 22 and the first guide member 26 are both connected to the mounting frame 27 , and the blowing member 21 is disposed inside the mounting frame 27 .

[0094] Please refer to Figure 2 as well as Figures 6 to 9 In this embodiment, the support assembly 10 includes a plurality of support plates 11, and the plurality of support plates 11 are arranged in sequence and at intervals, and at least two support plates 11 are used to jointly support the circuit board 2000, and the gap 12 between the two support plates 11 is connected to the process hole.

[0095] By adopting the above solution, the copper sheet and other debris in the process hole can fall into the gap 12 between the two support plates 11, so as to facilitate the dredging of the process hole.

[0096] It should be noted that the width of the gap 12 between the two support plates 11 can be consistent with the width of the support plate 11, and the width of the gap 12 between the two support plates 11 can also be consistent with the width of the slot of the slide groove 212. While effectively supporting the circuit board 2000, the debris in the process hole can also smoothly leak out from the gap 12.

[0097] Optionally, the support assembly 10 includes a hopper 13 , which is disposed at the bottom of the support plate 11 , and an inner space of the hopper 13 is communicated with the gap 12 .

[0098] Such an arrangement can collect the copper sheet and other debris in the process hole.

[0099] Please refer to Figures 6 to 9 , wherein the cleaning component 100 includes two clamping plate assemblies 30 , the two clamping plate assemblies 30 are respectively arranged on both sides of the supporting assembly 10 , and the two clamping plate assemblies 30 can be moved toward each other to clamp the circuit board 2000 .

[0100] By adopting the above solution, the circuit board 2000 can be clamped by two clamping plate assemblies 30 to fix the circuit board 2000, and then the process hole can be cleared by the blowing member 21 to prevent the circuit board 2000 from moving randomly during the clearing process.

[0101] It is understandable that the two clamping plate assemblies 30 can also be moved away from each other to avoid interference with the blowing member 21 when the blowing member 21 is pressed down.

[0102] Optionally, the clamping plate assembly 30 includes a clamping member 31 and a power seat connected to each other, and the power seat is used to drive the clamping member 31 to move closer to or away from the circuit board 2000 .

[0103] With such an arrangement, the clamping member 31 can be driven to move by the power seat to adapt to circuit boards 2000 of different sizes, thereby improving the versatility of the clamping plate assembly 30 .

[0104] Optionally, the power base is used to drive the clamping member 31 to move along a first direction; and / or, the power base is used to drive the clamping member 31 to move along a third direction, which is perpendicular to the first direction and perpendicular to the arrangement direction of the two clamping plate assemblies 30. The power base is used to drive the clamping member 31 to move to adapt to circuit boards 2000 of different sizes.

[0105] With such an arrangement, the clamping member 31 can be driven by the power seat to move in different directions to accommodate circuit boards 2000 of different sizes, thereby further improving the versatility of the clamping member 30. The power seat can also drive the clamping member 31 to transport the circuit board 2000 along a third direction, while at the same time allowing the clamping member 30 to be moved away from the circuit board 2000 to avoid interference with the blowing member 21 when the blowing member 21 is pressed down.

[0106] It should be noted that the arrangement direction of the two clamping plate assemblies 30 may be parallel to the Y direction in the figure, and the third direction may be along the X direction in the figure.

[0107] For example, one or more clamping members 31 may be provided. The power base may include a first driving member 32, a second driving member 33 and a third driving member 34, wherein the first driving member 32 is used to drive the clamping member 31 to move along a first direction, the second driving member 33 is used to drive the clamping member 31 and the first driving member 32 to approach or move away from the circuit board 2000, and the third driving member 34 is used to drive the clamping member 31, the first driving member 32 and the second driving member 33 to move along a third direction. The first driving member 32, the second driving member 33 and the third driving member 34 may all include a cylinder, a hydraulic cylinder or a motor.

[0108] For example, the power seat can drive the clamping member 31 to move in three directions.

[0109] This includes lateral movement along the board feeding direction through the third driving member 34. Specifically, the synchronous belt can be driven by a motor to drive the synchronous wheel to move. The base connected to the second driving member 33 is fixed on the clamping slider on one side and fixed to the synchronous belt on the other side. When the synchronous belt moves, it drives the base, the clamping member 31, the first driving member 32 and the second driving member 33 to move together. The clamping slider is installed on the guide rail, so that the base, the clamping member 31, the first driving member 32 and the second driving member 33 can be moved laterally along the guide rail through the clamping slider.

[0110] The second driving member 33 is connected to the clamping screw through a coupling, and the clamping screw cooperates with the connecting member. The clamping member 31 and the first driving member 32 are both connected to the connecting member. The second driving member 33 drives the clamping screw to rotate, and then drives the clamping member 31 and the first driving member 32 to approach or move away from the circuit board 2000. This is designed to adapt to circuit boards 2000 of different widths.

[0111] The clamping member 31 may include a finger cylinder and a splint, which is fixed to the finger cylinder, which is fixed to the connecting member, and the first driving member 32 is configured as a cylinder, which is connected and fixed to the telescopic rod of the first driving member 32. When the telescopic rod of the first driving member 32 moves up and down, it drives the connecting member to move up and down. The splint at the front end of the cylinder finger moves downward and can be hidden in the gap 12 of the support plate 11. This is to enable the splint to release the circuit board 2000 and move outward and downward when the blowing member 21 is pressed down, so as to avoid interference with the blowing member 21.

[0112] Please refer to Figure 1 as well as Figures 6 to 10 In this embodiment, the circuit board through-hole device 1000 further includes a loading component 200 , and the loading component 200 is used to move the circuit board 2000 from the first preset position to the supporting assembly 10 .

[0113] By adopting the above solution, the loading component 200 can be used to move the circuit board 2000 from the first preset position to the supporting component 10, so that the subsequent blowing component 20 can blow and clean the circuit board 2000.

[0114] Among them, the loading component 200 includes an upper plate transverse movement mechanism 210 and an upper plate lifting mechanism 220. The upper plate lifting mechanism 220 is used to move the circuit board 2000 from a first preset position along a first loading path to a first transfer position. The upper plate transverse movement mechanism 210 is used to move the circuit board 2000 from the first transfer position along a second loading path to the support assembly 10. The second loading path is not parallel to the first loading path.

[0115] By adopting the above solution, the circuit board 2000 can be moved to the support assembly 10 along the non-parallel second loading path and the first loading path through the loading component 200, and the operation is simple and convenient.

[0116] It should be noted that the first feeding path may be substantially parallel to the Z direction in the figure, and the second feeding path may be substantially parallel to the negative X direction in the figure.

[0117] Please refer to Fig.11 For example, the upper plate transverse movement mechanism 210 includes a first suction cup 2101, a fourth driving member 2102 and a fifth driving member 2103 connected in sequence, the first suction cup 2101 is used to absorb the circuit board 2000, and multiple first suction cups 2101 can be provided, and multiple first suction cups 2101 are fixed on the first suction cup frame, the fourth driving member 2102 is used to drive the first suction cup 2101 to move along the Z direction and the negative Z direction in the figure, and the fifth driving member 2103 is used to drive the fourth driving member 2102 and the first suction cup 2101 to move along the X direction and the negative X direction in the figure. The fourth driving member 2102 and the fifth driving member 2103 can both include a cylinder, a hydraulic cylinder or a motor.

[0118] Such an arrangement can make the structure of the upper plate transverse movement mechanism 210 relatively simple.

[0119] The upper plate transverse movement mechanism 210 may further include an optical axis slider and an optical axis, one end of the optical axis is fixed on the first suction cup frame, and the other end passes through the optical axis slider.

[0120] Please refer to Fig.12 The upper plate lifting mechanism 220 includes a fixed seat 221, an upper plate driving member 222, a lifting platform 223, a screw nut 224, an upper plate screw 225, a second guide member 226 and a guide rail slider 227. The upper plate driving member 222 can be connected to the upper plate screw 225 through a coupling. The upper plate driving member 222 can be a motor. The upper plate screw 225 and the second guide member 226 both extend along the Z direction in the figure. The screw nut 224 is cooperatively sleeved on the upper plate screw 225. The guide rail slider 227 is slidably sleeved on the second guide member 226. The screw nut 224 and the guide rail slider 227 are both connected to the lifting platform 223. The lifting platform 223 is used to support the circuit board 2000.

[0121] Such a configuration can make the structure of the upper plate lifting mechanism 220 relatively simple, and the upper plate lifting mechanism 220 can move the circuit board 2000 from the first preset position along the first loading path to the first transfer position more smoothly.

[0122] Please refer to Figures 1 to 14In this embodiment, the support assembly 10 has a blowing position and a loading position spaced apart from each other, the first power member 22 is used to drive the blowing member 21 to approach the circuit board 2000 located at the blowing position along a first direction, and the loading member 200 is used to move the circuit board 2000 from the first preset position to the loading position; the cleaning member 100 also includes a first conveying assembly 40 and a limiting assembly 50, the limiting assembly 50 is arranged between the loading position and the blowing position, and the first conveying assembly 40 is used to move the circuit board 2000 from the loading position to contact with the limiting assembly 50, so as to limit the position of the circuit board 2000 in at least one direction.

[0123] By adopting the above solution, after the loading component 200 moves the circuit board 2000 from the first preset position to the loading position, the first conveying assembly 40 and the limiting assembly 50 can be used to limit the position of the circuit board 2000.

[0124] Optionally, the first conveying assembly 40 includes a motor, a transmission belt 41 and a conveying roller 42. The conveying roller 42 can be located in the gap 12 between the two support plates 11 and slightly higher than the support plates 11, and can effectively generate friction with the circuit board 2000 to convey the circuit board 2000. A plurality of conveying rollers 42 can be provided, and the motor drives the conveying rollers 42 to rotate through the transmission belt 41, so as to move the circuit board 2000 on the conveying roller 42 from the loading position to the contact with the limit assembly 50 and then stop, and then the clamping plate assembly 30 clamps the circuit board 2000 and transports it to the blowing position.

[0125] The limiting assembly 50 includes a limiting member 51 and a second power member 52 connected to each other. The limiting member 51 is used to contact the circuit board 2000 located at the loading position, and the second power member 52 is used to drive the limiting member 51 away from the circuit board 2000.

[0126] Such a configuration can make contact with the limiting member 51 to limit the position of the circuit board 2000 in at least one direction, and the second power member 52 can be used to drive the limiting member 51 away from the circuit board 2000 .

[0127] It should be noted that the second power member 52 may include a cylinder, a hydraulic cylinder or a motor.

[0128] For example, the limit member 51 is located in the gap 12 between the two support plates 11 and is slightly higher than the support plates 11. When the limit member 51 contacts the circuit board 2000, the initial position of the circuit board 2000 can be limited. Then, the limit member 51 can be driven by the second power member 52 to enter the gap 12 to move away from the circuit board 2000, thereby facilitating the subsequent clamping plate assembly 30 to accurately clamp and move the circuit board 2000 to avoid interference from the limit member 51.

[0129] Optionally, the loading component 200 further includes an upper plate clapping mechanism 230 , and the upper plate clapping mechanism 230 includes two loading clapping plates 2301 . The two loading clapping plates 2301 can be brought close to each other to clamp the circuit board 2000 in contact with the limiting assembly 50 .

[0130] With such arrangement, the circuit board 2000 can be limited to a position in contact with the limiting assembly 50 by the upper plate paving mechanism 230, so as to facilitate subsequent accurate blowing and unblocking of the process holes.

[0131] For example, the upper board clapper mechanism 230 also includes a clapper drive 2302 and a clapper belt 2303. The clapper drive 2302 can be a motor. The clapper drive 2302 is used to drive the clapper belt 2303 to rotate around two synchronous wheels. Two feeding clappers 2301 are respectively connected to the two sides of the belt, and the feeding clapper 2301 is slidably connected to the fixed seat 221. When the clapper drive 2302 drives the clapper belt 2303 to rotate forward around the two synchronous wheels, the feeding clappers 2301 can approach each other to limit the circuit board 2000 to the feeding position. When the clapper drive 2302 drives the clapper belt 2303 to rotate reversely around the two synchronous wheels, the feeding clappers 2301 can move away from each other.

[0132] It should be noted that in order to ensure the high pressure of the blowing component 20, the opening 211 of the blowing component 21 cannot be made too large. Theoretically, the opening 211 cannot completely cover the circuit board 2000 at one time, and two blowing operations are required, one blowing half of the area of ​​the circuit board 2000. The clamping plate component 30 needs to clamp the circuit board 2000 and move it precisely to prevent the two blowing operations from blowing to the repeated area and failing to effectively pass the hole. Therefore, the position of the circuit board 2000 needs to be accurately limited by the first conveying component 40, the limiting component 50 and the upper plate clamping mechanism 230.

[0133] Please refer to Fig.11 and Fig.15 In one embodiment, the circuit board through-hole device 1000 also includes a detection component 300, and the detection component 300 includes a photographic component 310 and a second conveying component 320. The second conveying component 320 is used to move the circuit board 2000 to the field of view of the photographic component 310, and the photographic component 310 is used to take pictures and detect the inside of the process hole.

[0134] By adopting the above scheme, the camera assembly 310 can be used to take photos of the inside of the process hole of the circuit board 2000 after cleaning and dredging by the cleaning component 100 to determine whether the expected dredging effect is achieved, that is, whether the hole is blocked.

[0135] It should be noted that the clamping assembly 30 can clamp the circuit board 2000 from the position in contact with the limiting assembly 50 to the blowing position, and the clamping assembly 30 can also clamp the circuit board 2000 from the blowing position to the second conveying assembly 320, and the second conveying assembly 320 is used to move the circuit board 2000 to the field of view of the photographic assembly 310.

[0136] Optionally, the second conveying assembly 320 may include two sets of conveyor belts and the two sets of conveyor belts are respectively arranged on both sides of the camera assembly 310. The conveyor belt is fixed by front and rear rollers, and the motor drives the synchronous belt to move through the synchronous wheel, thereby driving the roller to move to drive the synchronous belt, and two sets of driven rollers may be installed in the middle.

[0137] The camera assembly 310 may include an industrial camera and a light bar. The light bar may be installed between and below the two conveyor belts, and a long industrial camera may be installed above. The light from the light bar shines through the process of the circuit board 2000 onto the industrial camera. The industrial camera generates an actual hole map of the circuit board 2000 based on the lighting conditions, and then compares the actual hole map with the data to detect whether there is any hole blockage.

[0138] Please refer to the figure, Fig.16 as well as Fig.17 In this embodiment, the circuit board through-hole device 1000 further includes a blanking component 400, and the blanking component 400 is used to move the circuit board 2000 on the second conveying component 320 to a second preset position.

[0139] By adopting the above solution, after the inside of the process hole is photographed and inspected by the inspection component 300, the unloading component 400 can be used to move the circuit board 2000 on the second conveying component 320 to the second preset position.

[0140] Optionally, the unloading component 400 includes a lower plate transverse movement mechanism 410 and a lower plate lifting mechanism 420. The lower plate transverse movement mechanism 410 is used to move the circuit board 2000 from the conveying component along the first unloading path to the second transfer position, and the lower plate lifting mechanism 420 is used to move the circuit board 2000 from the second transfer position along the second unloading path to the second preset position. The second unloading path is not parallel to the first unloading path.

[0141] With such arrangement, the circuit board 2000 can be moved to the second preset position along the second non-parallel feeding path and the first feeding path by the feeding component 400, and the operation is simple and convenient.

[0142] It should be noted that the first material unloading path may be substantially parallel to the X direction in the figure, and the second material loading path may be substantially parallel to the Z direction in the figure.

[0143] For example, the lower plate transverse movement mechanism 410 includes a second suction cup 411, a sixth driving member 412, a seventh driving member 413 and an eighth driving member 414 connected in sequence, the second suction cup 411 is used to absorb the circuit board 2000, and a plurality of second suction cups 411 may be provided, and the plurality of second suction cups 411 are fixed on the second suction cup frame, the sixth driving member 412 is used to drive the second suction cup 411 to move along the Z direction and the negative Z direction in the figure, the seventh driving member 413 is used to drive the sixth driving member 412 and the second suction cup 411 to move along the Y direction and the negative Y direction in the figure, and the eighth driving member 414 is used to drive the seventh driving member 413, the sixth driving member 412 and the second suction cup 411 to move along the X direction and the negative X direction in the figure. The sixth driving member 412, the seventh driving member 413 and the eighth driving member 414 may all include a cylinder, a hydraulic cylinder or a motor.

[0144] Such an arrangement can make the structure of the lower plate transverse movement mechanism 410 relatively simple.

[0145] The lower plate transverse movement mechanism 410 may further include an optical axis slider and an optical axis, one end of the optical axis is fixed on the second suction cup frame, and the other end passes through the optical axis slider.

[0146] The specific structure of the lower plate lifting mechanism 420 may be similar to that of the upper plate lifting mechanism 220 .

[0147] Optionally, the second preset position includes a good product area and a waste product area; two lower plate lifting mechanisms 420 are provided, and one of the lower plate lifting mechanisms 420 is used to move the circuit board 2000 from the second transfer position to the good product area, and the other lower plate lifting mechanism 420 is used to move the circuit board 2000 from the second transfer position to the waste product area.

[0148] With such arrangement, the good circuit boards 2000 detected by the detection component 300 (circuit boards 2000 whose process holes are completely unblocked) can be moved to one of the lower plate lifting mechanisms 420 through the lower plate transverse movement mechanism 410, and further moved to the good product area; and the defective circuit boards 2000 (circuit boards 2000 whose process holes are not completely unblocked) detected by the detection component 300 can be moved to another lower plate lifting mechanism 420 through the lower plate transverse movement mechanism 410, and further moved to the defective area, so that the circuit boards 2000 can be classified and stored.

[0149] Optionally, the circuit board through-hole device 1000 further includes a control component, and the detection component 300 and the blanking component 400 are both connected to the control component, and the control component may include a programmable logic controller or a single-chip microcomputer.

[0150] With such arrangement, the circuit boards 2000 can be automatically detected and stored in categories through the control component.

[0151] For example, when the circuit board through-hole device 1000 provided in the embodiment of the present application is in use, the circuit board 2000 can be stacked and placed on the upper plate lifting mechanism 220 first, and the circuit board through-hole device 1000 starts to run automatically. The upper plate transverse movement mechanism 210 adsorbs and transports the circuit board 2000 to the loading position of the support component 10. Under the action of the first conveying component 40, the circuit board 2000 will move forward, and at the same time, the limit member 51 will rise to block the circuit board 2000. Thereafter, the upper plate patting mechanism 230 will pat the circuit board 2000 in the center. The purpose of this is to unify one side of the circuit board 2000 with the baffle as the reference position starting point, so as to facilitate the subsequent blowing component 20 to clear the process hole and blow away the chips with accuracy.

[0152] After the circuit board 2000 is positioned by the limit assembly 50 and the upper plate clamping mechanism 230, the clamping assembly 30 is moved horizontally to clamp the circuit board 2000. After clamping, the circuit board 2000 is moved to the bottom of the blowing assembly 20, the clamping part 31 is released, and the blowing part 21 moves downward to press the circuit board 2000, and then releases high-pressure gas to blow out the debris in the process holes in the corresponding area of ​​the circuit board 2000.

[0153] In order to improve the chip blowing effect, the area covered by the blowing member 21 may not be large, and it is not necessary to blow the entire circuit board 2000 at one time. It can be done in two times. After one chip blowing, the blowing member 21 rises, the clamping plate assembly 30 rises to clamp the circuit board 2000, moves forward a distance of the width of the opening 211 of the blowing hole, and then releases the clamp again. The blowing member 21 presses down again to blow the chips. After the chip blowing is completed, the blowing member 21 rises, and the clamping plate assembly 30 can clamp the circuit board 2000 after the chip blowing is completed and place it on the first conveying assembly 40. The circuit board 2000 passes through the first conveying assembly 40, will pass through the camera assembly 310, the camera assembly 310 can detect whether there is any blocked hole in the circuit board 2000, and the circuit board 2000 after the detection will be adsorbed by the lower plate transverse movement mechanism 410 and transferred to the lower plate lifting mechanism 420. There are two lower plate lifting mechanisms 420, which are used to receive good products (OK boards) and waste products (NG boards) respectively. The result of OK or NG is judged by the camera assembly 310 according to whether there is still any blocked hole, and the lower transverse movement mechanism moves the circuit board 2000 to the corresponding lower plate lifting mechanism 420 according to this result.

[0154] In addition to using machinery to replace manual labor, the circuit board through-hole device 1000 provided in the embodiment of the present application can also be applicable to circuit boards 2000 of different models. Replacing the material number of the circuit board 2000 is quick and convenient, and there is no need for special jigs, which can save the cost of jig generation and maintenance.

[0155] Optionally, the circuit board through-hole device 1000 further includes a frame 500 , and the cleaning component 100 , the loading component 200 , the detection component 300 and the unloading component 400 are all connected to the frame 500 .

[0156] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A circuit board through-hole device, characterized in that: The circuit board through-hole device includes a cleaning component, and the cleaning component includes: A supporting assembly, used for supporting a circuit board, wherein the circuit board has a process hole; The blowing assembly includes a connected blowing member and a first power member, wherein the blowing member has a blowing hole, and the first power member is connected to the blowing member and is used to drive the blowing member to approach the circuit board along a first direction so that the opening of the blowing hole corresponds to the orifice of the process hole.

2. The circuit board through-hole device according to claim 1, characterized in that: The blowing member is provided with a slide groove extending along the second direction, and the opening of the blowing hole is formed on the inner wall of the slide groove; the blowing assembly also includes an adjusting member, which can be slidably arranged in the slide groove and cover at least part of the opening, and the adjusting member can move relative to the blowing member to increase or decrease the area of ​​the opening covered by the adjusting member.

3. The circuit board through-hole device according to claim 2, characterized in that: The blowing assembly further includes a threaded member and a bracket, wherein the threaded member is inserted through the bracket and the two are threadably matched, an axis of the threaded member is parallel to the second direction, and the threaded member is connected to the adjusting member.

4. The circuit board through-hole device according to claim 2, characterized in that: At least two adjusting members are provided, and two of the adjusting members are arranged in sequence along the second direction and are respectively located at two ends of the sliding groove.

5. The circuit board through-hole device according to claim 2, characterized in that: The blowing member is provided with a first sealing portion, the first sealing portion is used to define a portion of the channel connecting the opening with the process hole, and the first sealing portion is used to abut against the circuit board; and / or, the adjusting member is provided with a second sealing portion, the second sealing portion is used to define a portion of the channel connecting the opening with the process hole, and the second sealing portion is used to abut against the circuit board.

6. The circuit board through-hole device according to claim 1, characterized in that: The blowing assembly further includes a first guide member extending along the first direction, and the blowing member is slidably matched with the first guide member.

7. The circuit board through-hole device according to claim 1, characterized in that: The support assembly includes a plurality of support plates, which are arranged in sequence and at intervals, and at least two of the support plates are used to jointly support the circuit board, and a gap between the two support plates is connected to the process hole.

8. The circuit board through-hole device according to claim 7, characterized in that: The support assembly comprises a hopper, the hopper is arranged at the bottom of the support plate, and the inner space of the hopper is communicated with the gap.

9. The circuit board through-hole device according to claim 1, characterized in that: The cleaning component comprises two clamping plate assemblies, which are respectively arranged on both sides of the supporting assembly, and the two clamping plate assemblies can approach each other to clamp the circuit board.

10. The circuit board through-hole device according to claim 9, characterized in that: The clamping plate assembly comprises a clamping member and a power seat connected to each other, and the power seat is used to drive the clamping member to approach or move away from the circuit board.

11. The circuit board through-hole device according to claim 10, characterized in that: The power seat is used to drive the clamping member to move along the first direction; and / or, the power seat is used to drive the clamping member to move along a third direction, which is perpendicular to the first direction and perpendicular to the arrangement direction of the two clamping plate assemblies.

12. The circuit board through-hole device according to any one of claims 1 to 11, characterized in that: The circuit board through-hole device further comprises a loading component, and the loading component is used to move the circuit board from a first preset position to the supporting assembly.

13. The circuit board through-hole device according to claim 12, characterized in that: The loading component includes an upper plate transverse movement mechanism and an upper plate lifting mechanism, the upper plate lifting mechanism is used to move the circuit board from the first preset position along the first loading path to the first transfer position, and the upper plate transverse movement mechanism is used to move the circuit board from the first transfer position along the second loading path to the support assembly, and the second loading path is not parallel to the first loading path.

14. The circuit board through-hole device according to claim 12, characterized in that: The supporting assembly has a blowing position and a loading position spaced apart from each other, the first power member is used to drive the blowing member to approach the circuit board located at the blowing position along a first direction, and the loading member is used to move the circuit board from the first preset position to the loading position; the cleaning member also includes a first conveying assembly and a limiting assembly, the limiting assembly is arranged between the loading position and the blowing position, and the first conveying assembly is used to move the circuit board from the loading position to contact with the limiting assembly to limit the position of the circuit board in at least one direction.

15. The circuit board through-hole device according to claim 14, characterized in that: The limiting assembly includes a limiting member and a second power member connected to each other, wherein the limiting member is used to contact the circuit board, and the second power member is used to drive the limiting member to move away from the circuit board.

16. The circuit board through-hole device according to claim 14, characterized in that: The feeding component also includes an upper plate clapping mechanism, which includes two feeding clapping plates. The two feeding clapping plates can be close to each other to clamp the circuit board in contact with the limiting component.

17. The circuit board through-hole device according to any one of claims 1 to 11, characterized in that: The circuit board through-hole equipment also includes a detection component, which includes a camera assembly and a second conveying assembly. The second conveying assembly is used to move the circuit board to the field of view of the camera assembly, and the camera assembly is used to take photos and detect the inside of the process hole.

18. The circuit board through-hole device according to claim 17, characterized in that: The circuit board through-hole device further comprises a blanking component, and the blanking component is used to move the circuit board on the second conveying assembly to a second preset position.

19. The circuit board through-hole device according to claim 18, characterized in that: The unloading component includes a lower plate transverse movement mechanism and a lower plate lifting mechanism. The lower plate transverse movement mechanism is used to move the circuit board from the conveying component along the first unloading path to the second transfer position. The lower plate lifting mechanism is used to move the circuit board from the second transfer position along the second unloading path to the second preset position. The second unloading path is not parallel to the first unloading path.

20. The circuit board through-hole device according to claim 19, characterized in that: The second preset position includes a good product area and a waste product area; two lower plate lifting mechanisms are provided, and one of the lower plate lifting mechanisms is used to move the circuit board from the second transfer position to the good product area, and the other lower plate lifting mechanism is used to move the circuit board from the second transfer position to the waste product area.

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