Mounting device and mounting method

Abstract

The invention provides a mounting device and a mounting method capable of reducing the difference of the bonding strength of each electronic component. A mounting device (1) according to an embodiment is provided with: a mounting unit (3) for directly mounting an electronic component (C) held by a mounting head (31) on a substrate (S); a supply unit (6) for supplying the electronic component (C); a pick-up unit (71) that picks up the electronic component (C) from the supply unit (6) by means of a pick-up head (700) and transfers the electronic component (C) to the mounting head (31); a moving mechanism (73) that moves the mounting head (31) and the pick-up head (700) relative to each other; a substrate support unit (2) that supports and moves the substrate (S); a first irradiation unit (8) that irradiates ultraviolet rays on the electronic components (C) before mounting; and a second irradiation unit (9) that irradiates ultraviolet light to each of the mounting regions (B) on the substrate (S) where the electronic component (C) is to be mounted.

Description

Technical Field

[0001] The invention relates to a mounting device and a mounting method. Background Art

[0002] Electronic components such as semiconductor chips are picked up from a wafer or tray, transported to a substrate, and pressed and mounted on the substrate.

[0003] Here, in the so-called direct bonding in which the electronic component is directly bonded to the substrate, an adhesive or the like is not used, and bonding is performed by mutual contact on the basis of cleaning and activating the bonding surface of the substrate or the electronic component. For example, as shown in Patent Document 1, a substrate or an electronic component is subjected to plasma treatment in a chamber after decompression, thereby cleaning and activating the mounting surface of the substrate or the electronic component. In addition, activation here refers to a state in which the mounting surface of the substrate or the electronic component is terminated with a hydroxyl group to form a state in which water molecules are easily bonded.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2020-021966 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] For example, the cleaning and activation state of the bonding surface of the substrate or electronic components affects the bonding strength. However, the state of the bonding surface decreases in cleanliness or activity over time. In the prior art as described above, the bonding surface on the surface of the substrate is cleaned and activated in a plasma processing device, and the bonding surfaces of the electronic components on the surface of the wafer singulated and attached to the wafer sheet or placed on a tray are uniformly cleaned and activated, and then transported to a bonding device to install the electronic components on the substrate one by one. In this way, the time from cleaning and activation to installing the electronic components on the substrate is different for each electronic component. After a period of time has passed after the cleaning and activation treatment, the state in which water molecules are easily combined is gradually lost, or the possibility of organic matter adhering to the surface increases. Therefore, the cleanliness or activity is different for each electronic component, and the bonding strength is different for each electronic component. In particular, in a bonding apparatus, there is a large time difference between the cleaning and activation process and the bonding of electronic components that have started to be supplied from a wafer sheet or a tray and those that have finished being supplied, and the bonding strength of the electronic components also varies greatly.

[0009] An object of the embodiments of the present invention is to provide a mounting device and a mounting method that can reduce the variation in the bonding strength of each electronic component.

[0010] [Technical means to solve the problem]

[0011] In order to achieve the above-mentioned purpose, the mounting device of the embodiment comprises: a mounting part, which directly mounts the electronic components held by the mounting head on the substrate; a supply part, which supplies the electronic components; a picking part, which picks up the electronic components from the supply part by using a picking head and delivers them to the mounting head; a moving mechanism, which enables the mounting head and the picking head to move relative to each other; a substrate supporting part, which supports and moves the substrate; a first irradiation part, which irradiates ultraviolet rays individually to the electronic components before mounting; and a second irradiation part, which irradiates ultraviolet rays individually to the mounting areas of the substrate where the electronic components are to be mounted.

[0012] The installation method of the embodiment is to directly install the electronic components on the substrate. In the installation method, the picking head of the picking part picks up the electronic components from the supply part that supplies the electronic components, the mounting head of the mounting part receives the electronic components from the picking head, and the received and held electronic components are installed on the substrate supported by the substrate support part. Before the installation, the first irradiation part irradiates the electronic components located in the supply part or the electronic components held by the mounting head with ultraviolet rays, and before the installation, the second irradiation part irradiates the mounting area of ​​the substrate where the electronic components are to be installed with ultraviolet rays.

[0013] [Effects of the Invention]

[0014] According to the embodiment of the present invention, the difference in bonding strength between electronic components can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front view showing the schematic structure of the mounting device according to the embodiment.

[0016] Figure 2 It is a plan view showing the schematic structure of the mounting device.

[0017] Figure 3 (A) and Figure 3 (B) is an enlarged view showing the reverse action of the electronic component, with the left side being a front view and the right side being a plan view.

[0018] Figure 4 (A)~ Figure 4 (D) is a left side view showing the picking-up operation of the electronic component by the picking-up unit.

[0019] Figure 5 (A)~ Figure 5 (F) in FIG. 1 is an explanatory diagram showing the operation from when the pickup head picks up the electronic component to when the mounting head mounts the electronic component.

[0020] Figure 6 This is a flowchart showing the sequence until electronic components are picked up and mounted.

[0021] Figure 7 (A) and Figure 7 (B) is an enlarged view showing the reversing action of a modified example in which two first irradiation units are provided on a rotating body via a pickup head, the left side being a front view and the right side being a plan view.

[0022] Figure 8 Is based on Figure 7 (A) and Figure 7 (B) is a plan view of a pickup sequence of electronic components according to a modified example.

[0023] Fig. 9 (A) and Fig. 9 (B) is an enlarged view showing the reversing action of a modified example in which the first irradiation unit is provided on the arm portion, the left side being a front view and the right side being a plan view.

[0024] Fig.10 (A) and Fig.10 (B) is an enlarged view showing the reversing action of a modified example in which two first irradiation units are provided on the arm with the pickup head interposed therebetween, the left side being a front view and the right side being a plan view.

[0025] Fig.11 (A)~ Fig.11 (D) is an explanatory diagram showing the operation of irradiating ultraviolet rays to each electronic component to be picked up.

[0026] Fig.12 (A) is an explanatory diagram showing an example of irradiating ultraviolet light when an electronic component is delivered to a mounting head. Fig.12 (B) is an explanatory diagram showing an example of irradiating ultraviolet rays when delivering electronic components using a first irradiation unit provided separately from the pickup unit.

[0027] Fig.13 It is a plan view showing a second illuminating unit provided separately from the moving body.

[0028] Fig.14 (A) is an explanatory diagram showing an example of irradiating ultraviolet rays before picking up an electronic component using a first irradiation unit provided separately from a pickup unit, Fig.14 (B) is an explanatory diagram showing an example of picking up electronic components while irradiating them with ultraviolet rays using a first irradiation unit provided separately from the pickup unit when delivering the electronic components. Fig.14 (C) is an explanatory diagram of irradiating ultraviolet rays to electronic components before picking up using the first irradiation unit provided in the pickup head.

[0029] Fig.15(A) is a cross-sectional view showing a pickup head having a first irradiation unit built therein, Fig.15 (B) is a cross-sectional view showing a pickup head in which a first irradiation unit is assembled.

[0030] Fig.16 This is a front view showing the schematic structure of another form of the mounting device.

[0031] Fig.17 (A)~ Fig.17 (D) is an explanatory diagram showing an example in which ultraviolet rays are simultaneously irradiated to both the electronic component immediately before mounting and the mounting area.

[0032] Fig.18 (A)~ Fig.18 (D) is an explanatory diagram showing an example in which ultraviolet rays are sequentially irradiated to both the mounting region before mounting and the electronic component immediately before mounting.

[0033] [Explanation of Symbols]

[0034] 1: Install the device

[0035] 2: Substrate support

[0036] 3: Installation

[0037] 4: First Filming Department

[0038] 5: Second shooting department

[0039] 6: Supply Department

[0040] 7: Transfer Department

[0041] 8: First irradiation section

[0042] 8a, 9a: Arm

[0043] 9: Second irradiation section

[0044] 11: Support table

[0045] 11a: Receiving hole

[0046] 21: Carrier

[0047] 22, 32, 62: Driving mechanism

[0048] 22a, 22b, 33a, 34a, 35a, 62a, 62b: Guide rails

[0049] 23: Mobile board

[0050] 23a: Through hole

[0051] 31: Installation Head

[0052] 31a: Hollow part

[0053] 31b: Holding part

[0054] 31c, 702a: Suction hole

[0055] 33, 34, 35: Mobile

[0056] 61: Support mechanism

[0057] 61a: Ring retainer

[0058] 71: Pickup Department

[0059] 72: Arm

[0060] 72a: Extension

[0061] 72b: Base

[0062] 73: Mobile mechanism

[0063] 100: Control device

[0064] 700: Pickup head

[0065] 701: Support

[0066] 701a: Ventilation Path

[0067] 702: Collet

[0068] 703: Loading and unloading department

[0069] 704: Window

[0070] 710: Reversal

[0071] 711: Drive unit

[0072] 712: Rotating body

[0073] 731: Fixed body

[0074] 732: First drive unit

[0075] 732a: First driving source

[0076] 732b: First sliding part

[0077] 733: Mobile

[0078] 734: Second drive unit

[0079] 734a: Second driving source

[0080] 734b: Second sliding part

[0081] B: Installation area

[0082] C: Electronic parts

[0083] DP: Delivery position

[0084] OA: Installation location

[0085] PU: Pickup Position

[0086] R: Wafer Ring

[0087] S: Substrate

[0088] S101, S102, S103, S104, S105, S106, S107, S108, S109, S110: Steps

[0089] WS: Wafer Sheet

[0090] X, Y, Z: Axis DETAILED DESCRIPTION

[0091] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 and Figure 2 1 is a mounting device 1 for mounting electronic components C on a substrate S as shown in the schematic configuration. The drawings are schematic diagrams, and the dimensions (hereinafter also referred to as sizes), shapes, and ratios of the dimensions of the components to each other may differ from the actual ones.

[0092] [Electronic parts]

[0093] First, the electronic parts C to be installed in this embodiment include semiconductor elements such as logic devices, memories, and image sensors. This embodiment uses a rectangular parallelepiped semiconductor chip as a semiconductor element. A semiconductor chip is a bare chip that is singulated by cutting a semiconductor wafer. The bare chip has a functional surface that functions as a semiconductor element on one side of the front and back. Electrodes are provided on the surface of the functional surface side, and are installed by flip-chip connection bonded to electrode pads on the substrate S.

[0094] The electronic component C has a plurality of marks for positioning provided on the surface on which the electrodes are formed, that is, the face of the electronic component C. The present embodiment is an example of a face-down mounting device for mounting the electronic component C with the face side facing the substrate S.

[0095] [Substrate]

[0096] In this embodiment, the substrate S on which the electronic component C is mounted is a plate-shaped member such as a resin having printed wiring, or a silicon substrate having a circuit pattern, etc. The substrate S is provided with an area for mounting the electronic component C, namely, a mounting area B, and a plurality of marks for positioning are provided outside the mounting area B.

[0097] [Installation device]

[0098] The mounting device 1 of the present embodiment is a device that directly mounts electronic components C and substrates S whose bonding surfaces have been cleaned and activated by plasma treatment or the like without using adhesives or the like. Figure 1 and Figure 2 As shown, the mounting device 1 comprises: a substrate supporting portion 2, which supports and moves the substrate S; a mounting portion 3, which directly mounts the electronic component C on the substrate S; a first photographing portion 4, which photographs the mark of the electronic component C held by the mounting portion 3 from below; a second photographing portion 5, which photographs the mark of the substrate S from a position above the mounting portion 3; a supply portion 6, which supplies the electronic component C; a transfer portion 7, which transfers the electronic component C from the supply portion 6 to the mounting position OA; a first irradiation portion 8, which irradiates ultraviolet light to the electronic component C before installation; a second irradiation portion 9, which irradiates ultraviolet light to the mounting area B of the substrate S; and a control device 100, which controls the operation of the mounting device 1.

[0099] In the following description, the direction in which the mounting portion 3 moves in order to mount the electronic component C on the substrate S is referred to as the Z axis, and the two axes orthogonal to each other in the plane orthogonal to the Z axis are referred to as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction following gravity is referred to as the bottom, the direction against gravity is referred to as the top, and the position on the Z axis is referred to as the height. In addition, the X axis and the Y axis are on a horizontal plane, and the X axis and the Y axis are on a horizontal plane. Figure 1 When viewed from the front side, the X axis is the left-right direction and the Y axis is the depth direction. The present invention is not limited to the above-mentioned setting direction. Regardless of the setting direction, the side where the electronic component C is mounted is referred to as the upper side, and the opposite side is referred to as the lower side, based on the substrate S or the substrate support portion 2.

[0100] The substrate support part 2 is a mechanism for supporting and moving the substrate S on which the electronic component C is mounted, and is a so-called substrate stage. The mounting part 3 is a mechanism for mounting the electronic component C directly on the substrate S. The mounting part 3 has a mounting head 31 for holding the electronic component C. The mounting head 31 has a transmission part that can transmit and recognize the mark of the substrate S facing the electronic component C while holding the electronic component C.

[0101] In addition, the substrate support part 2 and the mounting part 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the mark captured by the first imaging part 4 and the second imaging part 5. The above-mentioned components of the mounting device 1 are mounted on a support table 11 provided on the installation surface. The top surface of the support table 11 is a horizontal surface.

[0102] The supply unit 6 supplies the electronic component C. The transfer unit 7 transfers the electronic component C from the supply unit 6 to the mounting position OA. The transfer unit 7 includes a pickup unit 71 and a moving mechanism 73. The pickup unit 71 includes a pickup head 700, which picks up the electronic component C from the supply unit 6 at the pickup position PU and delivers it to the mounting head 31. The moving mechanism 73 moves the mounting head 31 and the pickup head 700 relative to each other. The moving mechanism 73 of the present embodiment moves the pickup unit 71 to the following space, that is, the space formed by the substrate support unit 2 causing the substrate S to retreat from the mounting position OA and is positioned at the mounting position OA.

[0103] The first irradiation unit 8 irradiates ultraviolet light to the electronic components C before mounting. The first irradiation unit 8 of the present embodiment is provided so as to be movable together with the pickup head 700 by the moving mechanism 73. The second irradiation unit 9 irradiates ultraviolet light to the mounting area B of the substrate S where the electronic components C are to be mounted. By such ultraviolet light irradiation, the bonding surface of the electronic components C and the mounting area B is cleaned and activated.

[0104] The control device 100 controls the operation of the installation device 1. The control device 100 includes, for example, an electronic circuit or a computer running according to a prescribed program. That is, the control device 100 is a processing device such as a programmable logic controller (PLC) that reads a program and data from a storage device to execute control of the installation device 1. The following describes each part in detail.

[0105] (Substrate support part)

[0106] like Figure 1 and Figure 2 As shown, the substrate support part 2 is arranged on the support table 11, and has a stage 21 and a driving mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The driving mechanism 22 is a two-axis moving mechanism, and the two-axis moving mechanism has, for example, a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and uses a rotary motor (not shown) as a driving source to move the stage 21 in a horizontal plane through a ball screw or a linear motor. The driving mechanism 22 functions as a positioning mechanism for positioning the substrate S. In addition, although the illustration is omitted, the driving mechanism 22 includes a θ driving mechanism that rotates and moves the stage 21 in a horizontal plane.

[0107] The driving mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22 b. A through hole 23 a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

[0108] In addition, although not shown in the figure, a loader / unloader for supplying / storing the substrate S on the stage 21 is provided at one of the moving ends in the X-axis direction of the stage 21 of the substrate support 2 (specifically, the moving end on the right side in the figure). Therefore, the substrate support 2 receives the substrate S supplied from the loader or transfers the substrate S to the unloader in a state where the stage 21 is moved to the moving end.

[0109] (Installation Department)

[0110] The mounting portion 3 includes a mounting head 31 and a driving mechanism 32. The mounting head 31 is roughly in the shape of a rectangular parallelepiped, and includes a hollow portion 31a as a transmission portion and a holding portion 31b. The hollow portion 31a is a cylindrical through hole formed with the Z-axis direction as an axis. The holding portion 31b is a plate-like member capable of transmitting light for photographing, and is assembled in a manner that blocks the opening of the hollow portion 31a on the side facing the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool that holds the electronic component C.

[0111] A suction hole 31c connected to a suction path formed in the holding portion 31b is formed in the center of the holding portion 31b. The suction path inside the holding portion 31b is a flow path for connecting the suction hole 31c to a negative pressure source not shown in the figure, and is arranged in a manner that the electronic component C can be adsorbed and held by generating negative pressure in the suction hole 31c. The area where the holding portion 31b adsorbs and holds the electronic component C and its surroundings can be photographed through the electronic component C held by the pickup head 700. In addition, even when the holding portion 31b adsorbs and holds the electronic component C, the mark of the substrate S can be photographed through. That is, the mounting head 31 has a transparent portion so that the mark of the substrate S can be photographed by the second photographing unit 5.

[0112] The driving mechanism 32 includes a moving body 33, a moving body 34, and a moving body 35, and is a mechanism for driving the mounting head 31. The moving body 33 is provided so as to be movable along a guide rail 33a provided in the Y-axis direction of the support table 11. The moving body 34 is provided so as to be movable along a guide rail 34a provided in the X-axis direction on the top surface of the moving body 33. The moving body 35 is provided so as to be movable along a guide rail 35a provided in the Z-axis direction on the front surface of the moving body 34. The moving body 35 is formed in a generally concave shape when viewed from above. These moving bodies 33, 34, and 35 are driven by a ball screw or a linear motor or the like using a rotary motor as a driving source.

[0113] The mounting head 31 is provided at the lower part of the moving body 35 that moves along the Z-axis direction. The moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31b of the mounting head 31 on the substrate S. In addition, the moving body 35 provided with the mounting head 31 moves along the X-axis direction and the Y-axis direction by the movement of the moving bodies 33 and 34. Thus, the driving mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. In addition, although not shown in the figure, the driving mechanism 32 includes a θ driving mechanism that causes the mounting head 31 to rotate and move in a horizontal plane.

[0114] (First Filming Section)

[0115] The first imaging unit 4 includes a camera, a lens, a lens barrel, a light source, etc., and is fixed to a receiving hole 11a provided in the support table 11. The first imaging unit 4 arranges the optical axis of the camera in a direction capable of photographing the mark of the electronic component C held by the mounting head 31. Specifically, the optical axis is arranged in a vertical direction.

[0116] (Second Filming Department)

[0117] The second imaging unit 5 includes a camera, a lens, a lens barrel, a light source, etc., and is supported and fixed by a frame (not shown) or the like above the support table 11, more specifically, above the mounting head 31. The second imaging unit 5 arranges the optical axis of the camera in a direction that allows the camera to penetrate the holding portion 31b of the mounting head 31 and to photograph the marks around the mounting area B of the substrate S. That is, the optical axis is arranged in a vertical direction.

[0118] (Supply Department)

[0119] The supply unit 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device for supporting the wafer sheet WS to which the electronic component C is attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. In this embodiment, the electronic component C is obtained by dividing the wafer attached to the wafer sheet WS into individual pieces. The wafer sheet WS is attached to the wafer ring R (see Figure 4 (A)~ Figure 4 (D)). The support mechanism 61 has a ring holder 61a on which the wafer ring R is mounted. The support mechanism 61 is annular and the inner side of the wafer ring R is hollow. In addition, the ring holder 61a is also formed in the same ring shape as the wafer ring R. Thus, a space is formed below the wafer attached to the wafer sheet WS.

[0120] Although not shown in the figure, a loader / unloader for supplying / storing the wafer ring R to / into the ring holder 61a is provided at one of the moving ends in the Y-axis direction of the support mechanism 61 (specifically, the moving end on the front side in the figure). When the support mechanism 61 moves to the moving end, it receives the wafer ring R supplied from the loader or transfers the wafer ring R to the unloader.

[0121] Although not shown, the support mechanism 61 includes an expansion mechanism that creates a gap between the electronic components C by stretching the wafer sheet WS using the ring holder 61a, and an upward push mechanism that separates the electronic components C from the wafer sheet WS by clamping the stretched wafer sheet WS and pushing up the electronic components C from the bottom. Furthermore, the support mechanism 61 includes a θ drive mechanism that rotates the ring holder 61a in a horizontal plane. In addition, the upward push mechanism is fixedly arranged on the support table 11 inside the ring-shaped support mechanism 61, and receives the electronic components C from the supply unit 6 at the position (pickup position PU) using the transfer unit 7, that is, picks them up.

[0122] The driving mechanism 62 moves the supporting mechanism 61 in a predetermined direction. For example, the driving mechanism 62 is a mechanism that has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and moves the supporting mechanism 61 in the X-axis and Y-axis directions in a horizontal plane by a ball screw or a linear motor or the like using a rotary motor (not shown) as a driving source. The driving mechanism 62 functions as a positioning mechanism for positioning the electronic component C relative to the pickup unit 71.

[0123] (Transfer Department)

[0124] The transfer unit 7 moves the mounting head 31 and the pickup head 700 relative to each other. The transfer unit 7 includes a pickup unit 71, an arm 72, and a moving mechanism 73. Figure 3 (A) Figure 3 As shown in (B), the pickup unit 71 has a pickup head 700 and a reversing unit 710. The pickup head 700 is a component that sucks and holds the electronic component C and releases the electronic component C by releasing the suction and holding. In this embodiment, the pickup head 700 is moved by the transfer unit 7 and the electronic component C is transferred to the mounting head 31. The movement for transfer only needs to be relative movement, and either or both of the pickup head 700 and the mounting head 31 can move. In addition, Figure 1 and Figure 2 In FIG. 1 , the dotted line in the figure indicates that the pickup unit 71 moves to a position where it delivers the electronic component C to the mounting head 31 located at the mounting position OA.

[0125] like Figure 3 (A) Figure 3As shown in (B), the pickup head 700 has a support portion 701, a collet 702, and a loading and unloading portion 703. The support portion 701 is a prism assembled to the reversing portion 710. The collet 702 is a rectangular member made of metal. A suction hole 702a is provided in the collet 702 as a through hole for sucking the electronic component C by negative pressure. The loading and unloading portion 703 is provided at one end of the support portion 701, and can hold the collet 702 in a loading and unloading manner. The loading and unloading portion 703 has a magnet inside, and the collet 702 is held by the attraction force of the magnet. The contact surfaces of the loading and unloading portion 703 and the collet 702 are provided with concave and convex that fit together to prevent displacement. The suction hole 702a of the collet 702 is connected to a negative pressure generating circuit including a vacuum pump, a valve, etc. via an unillustrated ventilation path and piping provided in the loading and unloading portion 703 and the support portion 701.

[0126] The reversing section 710 reverses the pickup head 700. By the reversal, the electronic component C held by the pickup head 700 is reversed in the vertical direction. In addition, in the present embodiment, the first irradiation section 8 is provided at the reversing section 710. That is, the pickup head 700 and the first irradiation section 8 are provided so as to be rotatable between the direction toward the wafer sheet WS and the direction toward the mounting head 31 by the reversing section 710.

[0127] The reversing unit 710 includes a driving unit 711 and a rotating body 712. The driving unit 711 may be, for example, a rotating motor. The rotating body 712 is connected to the driving unit 711 and is arranged so as to be rotatable around an axis in the Y direction. The pickup head 700 and the first irradiation unit 8 are assembled to the rotating body 712 via the support unit 701 and are arranged so as to be rotatable together with the rotating body 712 (reversible). The pickup head 700 is arranged adjacent to the first irradiation unit 8 so that the first irradiation unit 8 can irradiate ultraviolet rays to the electronic component C adjacent to the electronic component C picked up by the pickup head 700.

[0128] The arm portion 72 is a member having a pickup portion 71 disposed at one end. Figure 2 As shown, the arm portion 72 includes an extension portion 72a and a base portion 72b. The extension portion 72a is an L-shaped member formed by a rectangular parallelepiped member extending linearly along the Y-axis direction toward the front and a rectangular parallelepiped member extending linearly along the X-axis direction toward the mounting portion 3. The reversing portion 710 is provided at one end of the extension portion 72a facing the mounting portion 3 in such a manner that the rotation axis of the driving portion 711 becomes in the Y-axis direction. The pickup head 700 and the first irradiation portion 8 are arranged to be rotatable by assembling the pickup head 700 and the first irradiation portion 8 on the rotation axis of the driving portion 711 via the rotating body 712. The base portion 72b is a plate-like body parallel to the X-axis direction and is fixed to the other end of the extension portion 72a (refer to Figure 4 (A)~ Figure 4 (D)).

[0129] The moving mechanism 73 moves the pickup portion 71 between the supply portion 6 and the mounting position OA by driving the arm portion 72. Figure 4 (A)~ Figure 4 As shown in (D), the moving mechanism 73 includes a fixed body 731, a first driving unit 732, a moving body 733, and a second driving unit 734. Figure 4 (A)~ Figure 4 In (D), the first irradiation unit 8 is omitted. The fixed body 731 is fixed to the support table 11 (see Figure 2 ) and is a rectangular parallelepiped member extending in the X-axis direction. The position of the fixed body 731 is fixed relative to the mounting position OA.

[0130] The first driving unit 732 drives the arm 72 along the X-axis direction. The first driving unit 732 includes a first driving source 732a and a first sliding unit 732b. The first driving source 732a is a linear motor extending along the X-axis direction and is provided along the upper surface (surface parallel to the XY plane) of the fixed body 731. The first sliding unit 732b is a linear guide extending along the X-axis direction and is provided on the front surface (surface parallel to the XZ plane) of the fixed body 731.

[0131] The moving body 733 is a rectangular parallelepiped block, and is provided so as to be able to slide and move along the X-axis direction along with the operation of the first driving source 732a by assembling the rotor of the first driving source 732a and the slider of the first sliding portion 732b.

[0132] The second driving unit 734 drives the arm 72 along the Z-axis direction. The second driving unit 734 includes a second driving source 734a and a second sliding unit 734b. The second driving source 734a is a linear motor extending along the Z-axis direction and is provided on the moving body 733. The second sliding unit 734b is a linear guide extending along the Z-axis direction and is provided on the moving body 733.

[0133] The base portion 72 b of the arm portion 72 is provided so as to be slidable in the Z-axis direction by assembling the rotor of the second driving source 734 a and assembling the slider of the second sliding portion 734 b .

[0134] (First irradiation section)

[0135] The first irradiation unit 8 uses, for example, a light emitting diode (LED) element that outputs ultraviolet light as a light source. The first irradiation unit 8 of this embodiment irradiates the electronic component C located in the supply unit 6 with ultraviolet light before the pickup head 700 picks up the electronic component C from the supply unit 6. That is, the electronic component C mounted on the wafer sheet WS of the supply unit 6 is irradiated with ultraviolet light. As described above, the first irradiation unit 8 is arranged in a manner that can be moved together with the pickup head 700 through the moving mechanism 73. More specifically, as Figure 3 (A) Figure 3 As shown in (B), the first irradiation unit 8 is assembled at a position adjacent to the pickup head 700 in the rotating body 712. The adjacent position mentioned here refers to a position where the first irradiation unit 8 can irradiate ultraviolet rays to the electronic component C adjacent to the electronic component C picked up by the pickup head 700 (refer to Figure 5 (A) in FIG. 1 ). The electronic component C adjacent to the picked-up electronic component C is the next electronic component C to be picked up. The first irradiation unit 8 is connected to the control device 100 via wiring (not shown) to control light emission.

[0136] (Second Irradiation Section)

[0137] The second irradiation unit 9 uses, for example, an LED element that outputs ultraviolet light as a light source. The second irradiation unit 9 of the present embodiment is arranged on the side of the movable body 35 provided with the mounting head 31 in such a manner that ultraviolet light can be irradiated downward. The mounting area B of the substrate S supported by the stage 21 of the substrate support unit 2 is positioned below the second irradiation unit 9 by the driving mechanism 22, and ultraviolet light is irradiated before the electronic component C is about to be mounted in the mounting area B. Thus, the time from ultraviolet light (UV) irradiation to mounting can be shortened. The second irradiation unit 9 is connected to the control device 100 via wiring not shown in the figure to control the light emission.

[0138] (Control device)

[0139] The control device 100 controls the first imaging unit 4 , the second imaging unit 5 , the transfer unit 7 , the negative pressure generating circuit, the positioning mechanism, and the like.

[0140] In addition, the control device 100 controls the moving mechanism 73 of the transfer unit 7 and the driving mechanism 62 of the supply unit 6 based on the mapping information indicating the position coordinates of the electronic component C on the wafer sheet WS, thereby positioning the electronic component C to be picked up at the picking position PU in sequence. Picking up here means separating and receiving the electronic component C from a member on which the electronic component C is placed, such as the wafer sheet WS.

[0141] Furthermore, the control device 100 controls as follows: positioning of the pick-up head 700 of the pick-up unit 71 and the first irradiation unit 8 to the pick-up position PU; irradiation of the electronic component C with ultraviolet light by the first irradiation unit 8; holding of the electronic component C by the pick-up head 700; reversal of the pick-up head 700 by the reversing unit 710; movement of the pick-up unit 71 to the mounting position OA where the mounting head 31 waits by the moving mechanism 73; transfer of the electronic component C from the pick-up head 700 to the mounting head 31; irradiation of the mounting area B with ultraviolet light by the second irradiation unit 9; positioning of the mounting area B of the substrate S to the mounting position OA by the substrate support unit 2; installation of the electronic component C to the mounting area B by the mounting head 31, etc.

[0142] [action]

[0143] In addition to referring to Figure 1 to Figure 5 (A)~ Figure 5 In addition to (F), refer to Figure 6 The flowchart of the embodiment as described above explains the operation of the present embodiment. In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support 2, and the substrate S is withdrawn from the position facing the mounting head 31, that is, the mounting position OA, together with the stage 21. Figure 4 (A)~ Figure 4 In (D), the wafer sheet WS, the electronic components C and the wafer ring R in which the wafers attached to the wafer sheet WS are singulated are shown in a cross section in the Y direction at the pickup position PU. Figure 5 (A)~ Figure 5 In (F), the wafer sheet WS, the electronic components C and the wafer ring R of the wafers attached to the wafer sheet WS, and the substrate S of the mounting area B are schematically shown in the X-direction cross section at the pickup position PU. For easy understanding, Figure 4 (A)~ Figure 4 (D) and Figure 5 (A)~ Figure 5 The pickup position PU in the wafer sheet WS of (F) is different. In addition, the mounting area B of the electronic component C and the substrate S irradiated with ultraviolet rays described later is indicated by hatching.

[0144] The wafer ring R to which the wafer sheet WS is attached is mounted on the ring holder 61a (see FIG. 6 ) of the support mechanism 61 in the supply unit 6 by the automatic loader. Figure 2 ) Electronic components C obtained by dividing the wafer into individual pieces are attached to the wafer sheet WS.

[0145] First, the support mechanism 61 moves along the X-axis direction and the Y-axis direction to position the electronic component C to be mounted at the pickup position PU. Figure 5As shown in (A) in FIG. 1 , the first irradiation unit 8 is positioned at the pickup position PU. That is, the first irradiation unit 8 is positioned just above the electronic component C to be picked up, and the electronic component C to be picked up is irradiated with ultraviolet rays (step S101).

[0146] Next, the arm 72 is moved in the X-axis direction to position the front end of the pickup head 700 of the pickup unit 71 at the pickup position PU, that is, directly above the electronic component C to be picked up. Figure 5 As shown in (B) in FIG. 1 , the first irradiation unit 8 is positioned directly above the electronic component C adjacent to the electronic component C to be picked up. The electronic component C adjacent to the electronic component C to be picked up is the next electronic component C to be picked up. Figure 5 (A)~ Figure 5 (F) in FIG. 1 shows that the electronic component C on the wafer sheet WS is picked up from the right end to the left. In the state, the first irradiation unit 8 irradiates the electronic component C directly below with ultraviolet light, and the pickup head 700 adsorbs the electronic component C pushed up by the push-up mechanism (not shown) at the pickup position PU (step S102).

[0147] After the pickup head 700 adsorbs and holds the electronic component C, it moves in the Z-axis direction away from the wafer sheet WS, thereby Figure 5 As shown in (C) in FIG. 1 , the electronic component C is separated from the wafer sheet WS and picked up (step S103 ).

[0148] Then, if Figure 3 (A) Figure 3 As shown in (B), the reversing unit 710 rotates the pickup head 700 by 180° to reverse the electronic component C. Figure 1 , Figure 5 As shown in (D) in the figure, the arm 72 moves along the X-axis direction, thereby the pickup head 700 of the pickup portion 71 comes to a position facing the holding portion 31b of the mounting head 31 (mounting position OA), and the arm 72 moves along the Z-axis direction, thereby bringing the electronic component C close to the holding portion 31b.

[0149] The electronic component C is held by the holding portion 31b of the mounting head 31 through suction from the suction hole 31c of the mounting head 31, and the electronic component C is delivered to the holding portion 31b by releasing the suction of the pickup head 700 on the electronic component C (step S104). When the delivery of the electronic component C is completed and the pickup head 700 retreats from directly under the mounting head 31, the first photographing unit 4 photographs the mark of the electronic component C held by the mounting head 31, and the control device 100 calculates the offset between the position of the mark photographed by the first photographing unit 4 and the position of the reference position, and operates the drive mechanism 32 to eliminate the offset, thereby positioning the electronic component C. In addition, after the photographing by the first photographing unit 4 is completed, as shown in Figure 5 As shown in (E) in FIG. 1 , the substrate supporting portion 2 positions the mounting region B where the electronic component C is to be mounted at a position facing the second irradiating portion 9 , and the second irradiating portion 9 irradiates the mounting region B with ultraviolet rays.

[0150] In addition, in the above description, after the electronic component C is delivered to the mounting head 31, the mounting area B of the substrate S is irradiated with ultraviolet rays. However, as long as the pickup head 700 is not located at the mounting position OA, the substrate S may be moved and the mounting area B may be irradiated with ultraviolet rays. Figure 5 (B) Figure 5 In the state of (C), ultraviolet rays are irradiated in advance to the installation area B. In this way, if ultraviolet rays are irradiated in advance, installation can be performed immediately after handover, thereby shortening the takt time.

[0151] After irradiating the mounting area B with ultraviolet rays, the substrate support unit 2 moves the mounting area B where the electronic component C is to be mounted to the mounting position OA. At this time, the second imaging unit 5 captures the mark of the substrate S visible in the transmission area around the electronic component C through the mounting head 31. The control device 100 obtains the offset between the position of the mark captured by the second imaging unit 5 and the position of the reference position, and operates the drive mechanism 22 to eliminate the offset, thereby positioning the substrate S. Figure 5 As shown in (F) in FIG. 1 , the mounting head 31 is driven toward the substrate S by the driving mechanism 32 , and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S105 ).

[0152] If the next electronic component C is not the last electronic component C to be picked up (NO in step S106), the processing after step S102 is repeated. In this way, the transfer of the electronic component C from the wafer sheet WS, the delivery of the electronic component C to the mounting head 31, the positioning of the electronic component C and the substrate S, and the mounting are repeated, thereby sequentially mounting the electronic component C in each mounting area B of the substrate S. The substrate S after mounting a predetermined number of electronic components C is transported by the substrate support unit 2 and stored in the unloader.

[0153] When the next electronic component C is the last electronic component C to be picked up (Yes in step S106), the pickup head 700 adsorbs the electronic component C, but does not irradiate the electronic component C with ultraviolet light by the first irradiation unit 8 (step S107). Then, after the electronic component C is picked up (step S108), the electronic component C is delivered, and the ultraviolet light is irradiated by the second irradiation unit 9 (step S109), the electronic component C is installed (step S110) in the same manner as described above. After all the electronic components C to be installed are picked up, the wafer sheet WS is transported and stored in the unloader by the support mechanism 61.

[0154] [Effects]

[0155] (1) The mounting device 1 of this embodiment comprises: a mounting portion 3, which directly mounts the electronic component C held by the mounting head 31 on the substrate S; a supply portion 6, which supplies the electronic component C; a pick-up portion 71, which picks up the electronic component C from the supply portion 6 using the pick-up head 700 and transfers it to the mounting head 31; a moving mechanism 73, which enables the mounting head 31 and the pick-up head 700 to move relative to each other; a substrate supporting portion 2, which supports and moves the substrate S; a first irradiation portion 8, which irradiates ultraviolet light individually to the electronic components C before mounting; and a second irradiation portion 9, which irradiates ultraviolet light individually to the mounting areas B of the substrate S where the electronic components C are to be mounted.

[0156] In addition, the present embodiment is an installation method for directly installing an electronic component C on a substrate S, wherein the pickup head 700 of the pickup portion 71 picks up the electronic component C from the supply portion 6 that supplies the electronic component C, the mounting head 31 of the mounting portion 3 receives the electronic component C from the pickup head 700, and the received and held electronic component C is installed on the substrate S supported by the substrate support portion 2. Before installation, the first irradiation portion 8 irradiates ultraviolet light to the electronic component C located in the supply portion 6 or the electronic component C held by the mounting head 31, and before installation, the second irradiation portion 9 irradiates ultraviolet light to the mounting area B of the substrate S where the electronic component C is to be installed.

[0157] Before supplying the electronic component C or the substrate S to the mounting device 1, when cleaning and activating the bonding surface required for the installation of directly bonding the electronic component C to the substrate S are uniformly performed on multiple electronic components C or multiple mounting areas B of the substrate S carrying multiple electronic components C, there are problems such as the following. That is, since the electronic components C are installed one by one in the mounting device 1, the state of the bonding surface changes according to the time elapsed from the initial installation of the electronic component C to the final installation of the electronic component C. As time passes after the cleaning and activation treatment, the state in which water molecules are easily bonded is gradually lost, or the possibility of organic matter adhering to the surface increases. Therefore, in the mounting surface of the electronic component C on standby and the mounting area B of the substrate S, the cleaning and activation state is reduced, and the bonding strength between the electronic component C and the substrate S after installation is reduced. In the installation in the present embodiment, as described above, before the electronic components C are installed in the installation area B of the substrate S, they can be individually irradiated with ultraviolet rays for cleaning and activation. Therefore, the time from the cleaning and activation of each electronic component C to the installation is not easy to differ, and the difference in the bonding strength of each electronic component C can be reduced.

[0158] (2) The first irradiation unit 8 irradiates the electronic components C located in the supply unit 6 with ultraviolet rays before the pickup head 700 picks up the electronic components C from the supply unit 6. That is, the electronic components C mounted on the wafer sheet WS in the supply unit 6 are irradiated with ultraviolet rays. Therefore, there is no difference in the time from when each electronic component C is cleaned and activated to when it is mounted.

[0159] (3) The first irradiation unit 8 is provided so as to be movable together with the pickup head 700 by the moving mechanism 73. Therefore, the first irradiation unit 8 can be positioned relative to the electronic component C by the moving mechanism 73 common to the pickup head 700, so that the device structure can be simplified.

[0160] (4) The first irradiation unit 8 is disposed adjacent to the pickup head 700 so that the electronic component C adjacent to the electronic component C picked up by the pickup head 700 can be irradiated with ultraviolet light. Therefore, since the electronic component C can be picked up by the pickup head 700 and the adjacent electronic component C can be irradiated with ultraviolet light, it is not necessary to set a time for irradiation separately from picking up.

[0161] (5) The pickup section 71 has a reversing section 710 for reversing the pickup head 700, and the first irradiation section 8 is provided at the reversing section 710 so as to be reversible together with the pickup head 700. Therefore, the first irradiation section 8 can be provided adjacent to the reversed pickup head 700 without hindering the movement of the reversed pickup head 700, and the first irradiation section 8 can easily irradiate the electronic component C adjacent to the picked-up electronic component C with ultraviolet rays.

[0162] [Modifications]

[0163] (1) Two first irradiation units 8 may be arranged with the pickup head 700 interposed therebetween. Figure 7 (A) Figure 7 As shown in (B), the two first irradiation units 8 are assembled to the rotating body 712 via the pickup head 700. Figure 8 As shown, even if the relative movement direction for picking up the electronic component C is reversed, the next electronic component C to be picked up adjacent to the picked up electronic component C can be irradiated with ultraviolet rays by any one of the first irradiation units 8 .

[0164] In addition, the first irradiation unit 8 may not necessarily be disposed on the rotating body 712. Fig. 9 (A) Fig. 9 As shown in (B), the first irradiation unit 8 may be fixed to the extension portion 72a of the arm portion 72. In the above case, Fig.10 (A) Fig.10 As shown in (B), two first irradiation units 8 may be arranged with the pickup head 700 interposed therebetween.

[0165] (2) The first irradiation unit 8 can irradiate the electronic component C picked up by the pickup head 700 with ultraviolet rays. That is, after the first irradiation unit 8 irradiates the electronic component C as the pickup target before picking up at the pickup position PU ( Fig.11 (A)), the pickup head 700 picks up the electronic component C just after being irradiated at the pickup position PU ( Fig.11 (B)), and then transferred to the mounting head 31 for mounting (refer to Figure 5 (D)~ Figure 5 During the installation by the mounting head 31, the electronic component C to be picked up is positioned at the pickup position PU. Similarly, after the first irradiation unit 8 irradiates the electronic component C with ultraviolet rays before picking up ( Fig.11 (C)), the pickup head 700 picks up the electronic component C ( Fig.11 (D)), handed over to the mounting head 31 and installed (refer to Figure 5 (D)~ Figure 5 (F) in the figure). Thus, the time from when each electronic component C is irradiated with ultraviolet rays to when it is mounted can be shortened.

[0166] (3) The first irradiation unit 8 may irradiate the electronic component C held by the mounting head 31 with ultraviolet rays after the pickup head 700 delivers the electronic component C to the mounting head 31. Fig.12 As shown in (A), after the electronic component C is transferred from the pickup head 700 to the mounting head 31, the pickup head 700 may be moved so that the adjacent first irradiation unit 8 is directed toward the electronic component C, so that the ultraviolet rays are irradiated by the first irradiation unit 8. Thus, the time from irradiating the electronic component C with ultraviolet rays to mounting can be shortened.

[0167] Furthermore, if Fig.12 As shown in (B), the first irradiation unit 8 may be provided at the front end of the arm 8a swingably provided on the support table 11, and the electronic component C is delivered from the pickup head 700 to the mounting head 31. After the pickup head 700 retreats from directly below the mounting head 31, the arm 8a is swung so that the first irradiation unit 8 faces the electronic component C, so that the first irradiation unit 8 irradiates ultraviolet light. Since the electronic component C can be irradiated with ultraviolet light during the period from when the next electronic component C is picked up and delivered to the mounting head 31, including the time when the pickup head 700 returns to pick up the next electronic component C, until the next electronic component C is picked up and delivered to the mounting head 31, the cycle time can be shortened. In addition, the time required for irradiation of ultraviolet light for cleaning and activation can be reliably ensured.

[0168] Furthermore, in the case described above, in a state where the first irradiation unit 8 is located directly below the mounting head 31 in order to irradiate the electronic component C with ultraviolet rays, it is easy to move the substrate S using the stage 21 so that the second irradiation unit 9 is located in the mounting area B irradiated with ultraviolet rays, so that the stage 21 does not interfere with the first irradiation unit 8. Thus, the electronic component C can be irradiated with ultraviolet rays by the first irradiation unit 8, and the mounting area B can be irradiated with ultraviolet rays by the second irradiation unit 9, so the cycle time can be further shortened. In this way, if the first irradiation unit 8 is set separately from the pickup head 700, the electronic component C picked up or the electronic component C adjacent thereto can be irradiated regardless of the pickup direction, so one first irradiation unit 8 can also be used to cope with any pickup direction. In addition, as long as the first irradiation unit 8 can be positioned so as to irradiate the electronic component C held by the mounting head 31 with ultraviolet rays, the movement for this purpose is not limited to swinging.

[0169] (4) The second irradiation unit 9 is not limited to the case where it is provided on the moving body 35. For example, Fig.13 As shown, it can be provided at the front end of the swinging arm 9a provided on the support table 11, and can be provided in a manner that can irradiate ultraviolet rays to the mounting area B of the substrate S supported by the substrate support part 2. In the case, after the electronic component C is delivered to the holding part 31b and the photographing by the first photographing part 4 is completed, the arm 9a is swung, and the second irradiation part 9 moves to the upper part of the substrate S on the stage 21. Then, the substrate support part 2 positions the mounting area B where the electronic component C is to be mounted at a position facing the second irradiation part 9, and the second irradiation part 9 irradiates ultraviolet rays corresponding to the mounting area B where the electronic component C is to be mounted.

[0170] After irradiating the mounting area B with ultraviolet rays, the substrate support unit 2 moves the mounting area B where the electronic component C is to be mounted to the mounting position OA. At this time, the second imaging unit 5 captures the mark of the substrate S visible in the transmission area around the electronic component C through the mounting head 31 and positions the substrate S. Then, the mounting head 31 is driven toward the substrate S by the driving mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the substrate S.

[0171] Furthermore, in the above, after the electronic component C is delivered to the mounting head 31, the mounting area B of the substrate S is irradiated with ultraviolet rays. However, before the electronic component C is delivered to the mounting head 31, the arm 9a and the substrate support portion 2 may be moved to irradiate the mounting area B with ultraviolet rays. In the above case, even if the pickup head 700 is located at the mounting position OA, the mounting area B of the substrate S may be irradiated with ultraviolet rays. In this way, if the mounting area B of the substrate S is irradiated with ultraviolet rays in advance, the electronic component C can be installed immediately after being delivered to the mounting head 31, thereby shortening the cycle time. In addition, the electronic component C held by the mounting head 31 may be irradiated with ultraviolet rays by the first irradiation portion 8, and the mounting area B may be irradiated with ultraviolet rays by the second irradiation portion 9 at the same time. In particular, in the combination Fig.12 In the case of the pickup head 700 and the first irradiation unit 8 illustrated in (A), the tact time can be further shortened.

[0172] Fig.14 In (A), the second irradiation unit 9 is provided at the front end of the arm 9a, and the first irradiation unit 8 is provided at the front end of the swinging arm 8a, so that the electronic component C before picking up can be irradiated with ultraviolet rays. Fig.14 As shown in (A), the electronic component C before picking up can be irradiated with ultraviolet light by the first irradiation unit 8 provided on the arm 8a, and the mounting area B can be irradiated with ultraviolet light by the second irradiation unit 9 provided on the arm 9a. Fig.14 (B) is a combination of Fig.12 The embodiment shown in (B) is an example of an embodiment in which the second irradiation unit 9 is provided at the front end of the arm 9a. In the above case, the electronic component C held by the mounting head 31 can be irradiated with ultraviolet light by the first irradiation unit 8, and the mounting area B can be irradiated with ultraviolet light by the second irradiation unit 9 at the same time.

[0173] (5) The first irradiation unit 8 may also be provided on the pickup head 700. In the above case, Fig.14 As shown in (C), the electronic component C before picking up can be irradiated with ultraviolet light by the first irradiation unit 8 provided on the arm 8a, and the mounting area B can be irradiated with ultraviolet light by the second irradiation unit 9 provided on the arm 9a. As a form in which the first irradiation unit 8 is provided in the pickup head 700, for example, Fig.15 As shown in (A), the light source of the first irradiation unit 8 is provided in the ventilation path 701a provided in the mounting and dismounting portion 703 and the support portion 701. The mounting and dismounting portion 703 and the collet 702 are made of a material that can transmit ultraviolet rays. Fig.15As shown in (B), a window portion 704 capable of transmitting ultraviolet rays may be provided at the end of the support portion 701 on the opposite side to the collet 702, and a light source of the first irradiation portion 8 may be provided on the window portion 704. In addition, if the first irradiation portion 8 is provided in the pickup head 700 in this way, the picked-up electronic component C or the electronic component C adjacent thereto may be irradiated regardless of the pickup direction, so one first irradiation portion 8 may be used to cope with any pickup direction. In addition, the electronic component C may be irradiated with ultraviolet rays after being delivered to the holding portion 31b.

[0174] (6) Fig.16 As shown, the mounting device 1 may also be a device as follows: the mounting head 31 moves to the delivery position DP, receives the electronic component C from the pickup head 700, returns to the mounting position OA, and mounts the electronic component C in the mounting area B. In the case, a first irradiation unit 8 for irradiating ultraviolet rays toward the electronic component C held by the mounting head 31 and a second irradiation unit 9 for irradiating ultraviolet rays toward the substrate S supported by the substrate support unit 2 are provided at the front end of an arm 8a swingably provided on the support table 11.

[0175] In the case described, Fig.17 (A) Fig.17 As shown in (B) in FIG. 1 , the pickup head 700 picks up the electronic component C and delivers it to the mounting head 31 at the delivery position DP. Fig.17 As shown in (C) in FIG. 1 , when the mounting head 31 returns to the mounting position OA, the first irradiation unit 8 and the second irradiation unit 9 irradiate ultraviolet light to both the electronic component C held by the mounting head 31 and the mounting area B of the substrate S. Then, as shown in FIG. Fig.17 As shown in (D) in FIG. 1 , the mounting head 31 descends to mount the electronic component C on the mounting area B. By irradiating both the electronic component C and the mounting area B with ultraviolet rays immediately before mounting, the time from ultraviolet irradiation to mounting can be shortened significantly.

[0176] Furthermore, the mounting head 31 does not move to the mounting device 1 (such as the one in FIG. 1 ) at the transfer position DP in order to receive the electronic component C. Figure 1 The form shown) can also be applied Fig.16 The first irradiation unit 8 and the second irradiation unit 9 are shown. In this case, the interval between the mounting head 31 and the substrate S at the mounting position OA may be set to an interval into which the first irradiation unit 8 and the second irradiation unit 9 can be inserted.

[0177] Furthermore, it is not necessary to irradiate both at the same time. Fig.18 (A) Fig.18 As shown in (B) in FIG. 1 , when the pickup head 700 picks up the electronic component C and delivers it to the mounting head 31 at the delivery position DP, the second irradiation unit 9 irradiates the mounting area B of the substrate S with ultraviolet rays. Fig.18 As shown in (C) in FIG. 1 , when the mounting head 31 returns to the mounting position OA, the electronic component C held by the mounting head 31 is irradiated with ultraviolet light by the first irradiation unit 8. Then, as shown in FIG. Fig.18 As shown in (D) in FIG. 8 , the mounting head 31 descends to mount the electronic component C in the mounting area B.

[0178] (7) The supply unit 6 is not limited to a device that supplies electronic components C attached to the wafer sheet WS. For example, it may be a device that supplies electronic components C arranged on a tray. In addition, the structure of the moving mechanism 73 can be any structure as long as it can pick up and transfer electronic components C individually from the supply unit 6. Therefore, it may be a structure in which the arm 72 moves along the X-axis and Y-axis directions, or it may be a structure in which the arm 72 and the support mechanism 61 move along the X-axis and Y-axis directions.

[0179] [Other embodiments]

[0180] The present invention is not limited to the embodiments described. In the implementation stage, the structural elements may be deformed and embodied within the scope of the main purpose. In addition, various inventions may be formed by appropriate combinations of multiple structural elements disclosed in the embodiments described. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, the structural elements in different embodiments may be appropriately combined.

Claims

1. A mounting device, characterized in that: have: A mounting section that mounts the electronic components held by the mounting head directly on the substrate; A supply unit for supplying the electronic components; A picking unit, which picks up the electronic component from the supply unit using a picking head and delivers it to the mounting head; A moving mechanism enables the mounting head and the pickup head to move relative to each other; A substrate supporting part, supporting and moving the substrate; A first irradiation unit irradiates ultraviolet rays individually to the electronic components before mounting; as well as The second irradiation unit irradiates ultraviolet rays individually to mounting regions of the substrate where the electronic components are to be mounted.

2. The mounting device according to claim 1, characterized in that: The first irradiation unit irradiates the electronic component located in the supply unit with ultraviolet rays before the pickup head picks up the electronic component from the supply unit.

3. The mounting device according to claim 1, characterized in that: The first irradiation unit irradiates ultraviolet rays to the electronic component held by the mounting head after the pickup head delivers the electronic component to the mounting head.

4. The mounting device according to claim 1, characterized in that: The electronic component is irradiated with ultraviolet rays by the first irradiation unit, and the mounting area is irradiated with ultraviolet rays by the second irradiation unit.

5. The mounting device according to claim 1, characterized in that: The first irradiation unit is provided so as to be movable together with the pickup head by the moving mechanism.

6. The mounting device according to claim 5, characterized in that: The first irradiation unit is provided adjacent to the pickup head so as to irradiate the electronic component adjacent to the electronic component picked up by the pickup head with ultraviolet rays.

7. The mounting device according to claim 5, characterized in that: The first irradiation unit is provided adjacent to the pickup head so as to irradiate the electronic component picked up by the pickup head with ultraviolet rays.

8. The mounting device according to claim 5, characterized in that: The pickup portion has a reversing portion for reversing the pickup head. The first irradiation unit is provided at the reversing unit so as to be reversible together with the pickup head.

9. A mounting method for mounting an electronic component directly on a substrate, wherein the mounting method is characterized in that: Picking up the electronic component from a supply unit that supplies the electronic component using a pickup head of a pickup unit, The mounting head of the mounting part receives the electronic component from the pickup head, and mounts the received and held electronic component on the substrate supported by the substrate supporting part. Before mounting, a first irradiation unit irradiates ultraviolet light to the electronic component located in the supply unit or the electronic component held by the mounting head. Before mounting, the second irradiation unit irradiates ultraviolet rays to a mounting region of the substrate where the electronic component is to be mounted.

Images