Mold pressing mechanism, display module and packaging method of module lamp panel
By setting a flexible contact area in the molding mechanism of the Mini LED display and performing preset molding operations, a black molding adhesive layer is formed, and combined with the mounting of a black functional film, the problem that the module lamp panel in the prior art cannot take into account both light transmittance and contrast, and better lamp surface performance is achieved.
Patent Information
- Application Number
- CN202411825271.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-03-28
AI Technical Summary
The packaging process of the existing Mini LED display cannot take into account the light transmittance and contrast requirements of the lamp surface of the module lamp board, resulting in the problem of color difference and ink color inconsistent on the lamp surface.
A molding mechanism is adopted, in which a flexible contact area is provided on one side surface of the lower die core toward the upper die core. The preset molding operation is performed by the mold clamping module to form a black molding adhesive layer with a thickness less than or equal to the height of the lamp beads, and a black functional film is attached on this basis.
It effectively avoids the phenomenon of dead lights during molding, and at the same time improves the ink color consistency of the lamp surface of the module lamp board to meet the contrast requirements. Through the black functional film, the requirements of taking into account both the light transmittance and the contrast are realized.
Smart Images
Figure CN119730485A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a molding mechanism, a display module, and a packaging method for a module light panel. Background Art
[0002] The packaging process of Mini LED display screens is mainly based on COB packaging. With the development of Mini LED and market demand, a variety of packaging methods have emerged. Among them, a more common packaging method is the molding + film pasting process. The molding + film pasting process mainly uses a molding machine to first use the molding glue to package the lamp surface of the module light board, and then uses a rolling device to apply a black functional film to the lamp surface of the packaged module light board. The upper and lower mold cores of the existing molding machine are both rigid structures, that is, during the molding process, the contact between them and the module light board is rigid. Therefore, in order to avoid the phenomenon of dead lights during the molding process, after the existing molding glue is packaged, the thickness of the molding glue on the surface of the lamp bead must be at least 100μm. In this way, the existing molding glue generally does not add black materials to avoid the uneven thickness of the molding glue on the surface of the lamp bead, which leads to color difference on the lamp surface of the module light board. Therefore, the final transmittance and The contrast can only depend on the thickness of the black functional film on the surface, but the two are inversely proportional, that is, when the thickness of the black functional film is too thin, although it can well meet the transmittance requirements of the lamp surface of the module light board, it cannot guarantee the ink color consistency of the lamp surface of the module light board, that is, it cannot meet the contrast requirements of the lamp surface of the module light board; when the thickness of the black functional film is too thick, although it can well meet the ink color consistency of the lamp surface of the module light board, that is, it meets the contrast requirements of the lamp surface of the module light board, but it does not meet the transmittance requirements of the lamp surface of the module light board. Summary of the invention
[0003] The embodiments of the present application provide a molding mechanism, a display module and a packaging method for a module light board, aiming to improve the molding method of the module light board of the existing display module, and solve the technical problem that the module light board finally packaged cannot well take into account the requirements of the light transmittance and contrast of the lamp surface of the module light board.
[0004] To this end, an embodiment of the present application provides a molding mechanism, which is used in the packaging operation of a module light panel, including a mold closing module and a mold closing power mechanism that drives the mold closing module to perform a mold closing operation, the mold closing module includes an upper mold core and a lower mold core, the upper mold core and the lower mold core are relatively spaced apart in the vertical direction, and a flexible contact area is provided on the surface of the lower mold core on one side facing the upper mold core.
[0005] Optionally, in some embodiments of the present application, a light board placement groove is recessed on one side surface of the lower mold core facing the upper mold core, and a flexible pad is laid on the bottom wall of the light board placement groove so that the bottom wall of the light board placement groove forms the flexible contact area.
[0006] Optionally, in some embodiments of the present application, the flexible pad is any one of a silicone pad, a rubber pad, an EVA (Ethylene-Vinyl Acetate) pad, and a TPE (Thermoplastic Elastomer) pad.
[0007] In addition, the embodiment of the present application also provides a packaging method for a module light board, comprising the following steps:
[0008] Providing the above-mentioned molding mechanism and the first lamp board prototype, placing the lamp surface of the first lamp board prototype downward on the lower mold core, and making the lamp surface of the first lamp board prototype abut against the flexible contact area;
[0009] Providing black molding glue, injecting the black molding glue between the lamp surface of the first lamp board prototype and the flexible contact area, and performing a preset molding operation on the first lamp board prototype through the mold clamping module, so that the gaps between the lamp beads of the first lamp board prototype are all formed with a black molding glue layer with a thickness less than or equal to the height of the lamp beads, so as to obtain a second lamp board prototype;
[0010] A black functional film is provided, and the black functional film is attached to the lamp surface of the second lamp panel prototype in a preset manner to obtain a target module lamp panel.
[0011] Optionally, in some embodiments of the present application, the step of placing the lamp surface of the first lamp board prototype downward on the lower mold core and making the lamp surface of the first lamp board prototype abut against the flexible contact area includes:
[0012] A release film is provided, and after the release film is placed on the flexible contact area, the lamp surface of the first lamp board prototype is placed on the release film with the lamp surface facing downward, so that the lamp surface of the first lamp board prototype abuts against the flexible contact area through the release film.
[0013] Optionally, in some embodiments of the present application, the black molded glue is mixed with a glue body, a black material and a diffusion material, and the glue body is any one of epoxy glue, silicone glue and polyurethane glue;
[0014] The black material is any one of carbon black, carbon powder and black dye, and the proportion of the black material in the black molding glue is 3% to 10%;
[0015] The diffusion material is any one of glass beads, silicon dioxide and silicone, and the proportion of the diffusion material in the black molded glue is 5% to 15%.
[0016] Optionally, in some embodiments of the present application, the step of performing a preset molding operation on the first light board prototype by the mold clamping module so that gaps between the lamp beads of the first light board prototype are all formed with a black molded adhesive layer to obtain the second light board prototype includes:
[0017] The mold clamping module is driven by the mold clamping power mechanism to perform a mold clamping operation, so that the upper mold core abuts against a side surface of the first lamp panel prototype away from the lamp surface;
[0018] Controlling the temperature in the mold clamping module so that the temperature in the mold clamping module maintains a first preset temperature within a first preset time, thereby allowing the black molded glue to flow evenly to all gaps between the lamp beads of the first lamp board prototype;
[0019] The temperature inside the mold clamping module is controlled so that the temperature inside the mold clamping module maintains a second preset temperature within a second preset time, thereby allowing the black molded glue to cool and solidify to obtain the second lamp panel prototype.
[0020] Optionally, in some embodiments of the present application, the step of attaching the black functional film to the lamp surface of the second lamp board prototype in a preset manner to obtain a target module lamp board includes:
[0021] A rolling device is provided to place the black functional film on the lamp surface of the second lamp board prototype, and after the black functional film is bonded to the lamp surface of the second lamp board prototype by the rolling device, a high-temperature degassing treatment is performed to obtain the target module lamp board.
[0022] Optionally, in some embodiments of the present application, the black functional film includes an anti-glare layer and an adhesive layer, wherein:
[0023] The thickness of the anti-glare layer is 75-100 μm;
[0024] The thickness of the adhesive layer is 50-100 μm, and the light transmittance of the adhesive layer is 30% to 70%.
[0025] In addition, an embodiment of the present application further provides a display module, including a module light board, and the module light board is manufactured by the above-mentioned packaging method.
[0026] The technical solution provided by the present application is that when the module light board is molded with molding glue through a molding mechanism, a flexible contact area is provided on the surface of the lower mold core of the molding mechanism facing the upper mold core, so that during the above-mentioned molding operation, the lamp surface of the first lamp board prototype always maintains flexible contact with the lower mold core of the molding mechanism. In this way, the dead lamp phenomenon that occurs during the molding process can be effectively avoided, and the gaps between the lamp beads of the first lamp board prototype are formed with a black molded glue layer whose thickness is lower than the height of the lamp beads. In this way, the module light board of the present application can effectively cover the base color of the module light board through the black molded glue layer to improve the ink color consistency of the lamp surface of the module light board to meet the contrast requirements of the lamp surface of the module light board, and the setting of the black functional film only needs to consider the transmittance requirements. Therefore, in the present technical solution, the lamp surface of the module light board can simultaneously take into account the requirements of transmittance and contrast. It can be seen that the present technical solution can effectively improve the molding method of the module light board of the existing display module. The module light board finally packaged therein cannot well take into account the technical problem of the transmittance and contrast requirements of the lamp surface of the module light board. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0028] Figure 1 It is a structural schematic diagram of the clamping module of the molding mechanism in the embodiment of the present application;
[0029] Figure 2 This is a flowchart of a packaging method for a module light board in an embodiment of the present application;
[0030] Figure 3 This is a schematic diagram of the structure of the module light board in the embodiment of the present application;
[0031] Figure 4 for Figure 2 The flowchart of step S120 of the packaging method of the module light board is shown. DETAILED DESCRIPTION
[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0033] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0034] In addition, the descriptions of "first", "second", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.
[0035] In one embodiment, Figure 1 As shown, an embodiment of the present application provides a molding mechanism, which mainly includes a mold clamping module 100 and a mold clamping power mechanism (not shown) for driving the mold clamping module 100 to perform a mold clamping operation. The mold clamping module 100 includes an upper mold core 110 and a lower mold core 120. The upper mold core 110 and the lower mold core 120 are relatively spaced apart in the vertical direction, and a flexible contact area (not shown in the figure) is provided on the surface of the lower mold core 120 facing the upper mold core 110.
[0036] It can be understood that the molding mechanism in the embodiment of the present application is mainly used in the molding and packaging operation of the module light board 200, that is, by placing the module light board 200 in the mold cavity 10 formed by its closing mold 100, and then injecting the corresponding molding glue, the corresponding molding operation is performed, so that the molding glue is cured on the lamp surface of the module light board 200, and the packaging of the lamp surface of the module light board 200 is achieved. The main structure and working principle of the molding mechanism in the embodiment of the present application are basically the same as those of the conventional molding mechanism. For example, the upper mold core 110 can be fixed to the inner side of the upper mold cavity 140 by the upper mold base 130, and the lower mold core 120 can be fixed to the inner side of the lower mold cavity 160 by the lower mold base 150. The upper mold cavity 140 is connected to the lower mold cavity 160, and they are jointly enclosed to form the mold cavity 10. In order to ensure the sealing performance of the mold cavity 10, a sealing ring 170 is provided at the connection between the upper mold cavity 140 and the lower mold cavity 160. The main difference between the two lies in that in the molding mechanism of the embodiment of the present application, a flexible contact area is provided on the surface of the lower mold core 120 of the closing mold 100 facing the upper mold core 110, so that during the above-mentioned molding process, the lower mold core 120 is always in contact with the lamp surface of the module light board 200 through the flexible contact area, so as to effectively protect the lamp surface of the module light board 200, so that there is no need to form a certain thickness of molding glue on the lamp surface of the module light board 200, and the dead lamp phenomenon occurring during the molding process can be effectively avoided.
[0037] In this way, the molding mechanism in the embodiment of the present application, through the setting of the flexible contact area of the lower mold core 120, can effectively protect the lamp surface of the module lamp board 200 during the molding process, so that there is no need to form a certain thickness of molding glue on the lamp surface of the module lamp board 200, and the dead lamp phenomenon that occurs during the molding process can be effectively avoided.
[0038] In some examples, such as Figure 1As shown, a lamp board placement groove 121 is recessed on the surface of the lower mold core 120 facing the upper mold core 110, and a flexible pad 122 is laid on the bottom wall of the lamp board placement groove 121, so that the bottom wall of the lamp board placement groove 121 forms a flexible contact area. In this way, through the above-mentioned structural setting, when the module lamp board 200 is placed in the corresponding lamp board placement groove 121, since the lamp surface is generally set downward, the lamp surface of the module lamp board 200 always maintains flexible contact with the flexible pad 122 during the molding process, thereby effectively protecting the lamp surface of the module lamp board 200, so that there is no need to form a certain thickness of molding glue on the lamp surface of the module lamp board 200, and the dead lamp phenomenon during the molding process can also be effectively avoided. Furthermore, the flexible pad is any one of a silicone pad, a rubber pad, an EVA pad, and a TPE pad. In this way, through the above-mentioned structural setting, the soft characteristics of the silicone pad, rubber pad, EVA pad, and TPE pad can be utilized to ensure that during the molding process, the lamp surface of the module light board 200 always maintains flexible contact with the lower mold core 120 to effectively protect the lamp surface of the module light board 200.
[0039] In one embodiment, Figure 2 As shown, the embodiment of the present application also provides a packaging method for a module light board, comprising the following steps:
[0040] Step S110: provide the molding mechanism and the first lamp board prototype in the above embodiment, place the lamp surface of the first lamp board prototype downward on the lower mold core, and make the lamp surface of the first lamp board prototype abut against the flexible contact area.
[0041] It is understandable that if Figure 1 and Figure 3 As shown, the packaging method of the embodiment of the present application can be specifically applied to the packaging of the module light board 200 of the display module. The molding mechanism in the steps of this method specifically refers to the molding mechanism in the above-mentioned embodiment, that is, a flexible contact area is provided on its lower mold core 120. The first lamp board prototype in the steps of this method specifically refers to the module light board before the molding packaging is performed, which includes a lamp board body 210, a plurality of lamp beads 220 (that is, a plurality of LED chip units, each LED chip unit may specifically include three chips of R / G / B) arranged on the surface of one side of the lamp board body 210, and a plurality of driver ICs 130 (their setting method is the same as that of the lamp beads 220, and both can adopt conventional component patch settings, which will not be repeated here to ensure the normal display function drive of the module light board) arranged on the surface of the other side of the lamp board body 210. Therefore, the lamp surface of the first lamp board prototype in the present method step mainly refers to the top side surfaces of the plurality of lamp beads 220, so that when the lamp surface of the first lamp board prototype is placed face down on the lower mold core 120 in the present method step, the lamp surface of the first lamp board prototype, that is, the top side surfaces of the plurality of lamp beads 220, abuts against the flexible contact area, thereby forming an effective protection for the plurality of lamp beads 220.
[0042] Step S120: Provide black molding glue, inject the black molding glue between the lamp surface and the flexible contact area of the first lamp board prototype, and perform a preset molding operation on the first lamp board prototype through the mold assembly, so that the gaps between the lamp beads of the first light board prototype are formed with a black molded glue layer with a thickness less than or equal to the height of the lamp beads, so as to obtain a second light board prototype.
[0043] It is understandable that if Figure 1 and Figure 3 As shown, after the above-mentioned method steps are used to place the lamp surface of the first lamp board prototype facing downward on the lower mold core 120, and the lamp surface of the first lamp board prototype is made to abut against the flexible contact area, black molding glue can be further provided to inject the black molding glue between the lamp surface of the first light board prototype and the flexible contact area, and the first light board prototype is subjected to a preset molding operation through the closing mold module 100, so that the gaps between the lamp beads of the first light board prototype are formed with a black molded glue layer 230 with a thickness less than or equal to the height of the lamp beads, so as to obtain a second light board prototype.
[0044] It should be noted that, in the second lamp panel prototype obtained after molding, the thickness of the black molded adhesive layer 230 is less than or equal to the height of the lamp bead 220, that is, the black molded adhesive layer 230 will not cover the surface of the lamp bead 220, and thus will not cause any adverse effect on the light transmittance of the lamp bead 220. At the same time, even if the molded glue forming the black molded adhesive layer 230 is added with black material, it can reduce the light transmittance of the black molded adhesive layer 230 as much as possible without causing any adverse effect on the light transmittance of the lamp bead 220, thereby avoiding the color difference caused by the different thickness of the molded adhesive on the surface of the lamp bead.
[0045] Step S130: providing a black functional film, and attaching the black functional film to the lamp surface of the second lamp panel prototype in a preset manner to obtain a target module lamp panel.
[0046] It is understandable that if Figure 1 and Figure 3 As shown, after the second lamp board prototype is obtained through the above method steps, a black functional film 240 can be further provided, and the black functional film 240 can be attached to the lamp surface of the second lamp board prototype in a preset manner to obtain a target module lamp board.
[0047] It should be noted that, since the black molded adhesive layer 230 formed in the previous method step has solved the contrast requirement of the target module light board, that is, ensuring its ink color consistency, the thickness setting of the black functional film in this method step only needs to consider meeting the transmittance requirement of the target module light board.
[0048] In this way, through the above method steps, when the module light board is molded with molding glue through the molding mechanism, the lower mold core of the molding mechanism is provided with a flexible contact area on the side surface facing the upper mold core, so that during the above molding operation, the lamp surface of the first lamp board prototype always maintains flexible contact with the lower mold core of the molding mechanism. In this way, the dead lamp phenomenon that occurs during the molding process can be effectively avoided, and the gaps between the lamp beads of the first lamp board prototype are formed with a black molded glue layer whose thickness is lower than the height of the lamp beads. In this way, the module light board of the present application can effectively cover the base color of the module light board through the black molded glue layer to improve the ink color consistency of the lamp surface of the module light board to meet the contrast requirements of the lamp surface of the module light board, and the setting of the black functional film only needs to consider the transmittance requirements. Therefore, in the present technical solution, the lamp surface of the module light board can simultaneously take into account the requirements of transmittance and contrast.
[0049] In some examples, such as Figure 1 and Figure 3 As shown, the thickness of the black molded adhesive layer 230 in the above method steps is specifically between two-thirds and four-fifths of the height of the lamp bead 220. In this way, by setting the above thickness, it is possible to avoid the black molded adhesive layer 230 being too thin, resulting in insufficient protection and reliability, and being unfavorable for the subsequent lamination of the black functional film, which is prone to bubbles and weak adhesion. It is also possible to avoid the black molded adhesive layer 230 being too thick, which is easy to have a significant impact on the light output of the lamp bead 220 (including affecting its light emitting angle and brightness, etc.).
[0050] In some examples, such as Figure 1 and Figure 3 As shown, the specific process of performing the above step S110 is as follows: provide a release film 300, place the release film 300 in the flexible contact area, and then place the lamp surface of the first lamp board prototype downward on the release film 300, so that the lamp surface of the first lamp board prototype abuts the flexible contact area through the release film 300. In this way, the structural setting of the release film 300 can greatly facilitate the demolding of the module lamp board 200 after the molding and packaging operation.
[0051] In some examples, the black molded glue mentioned in the above method steps is mixed with a glue body, a black material and a diffusion material, and the glue body is any one of epoxy glue, silicone glue and polyurethane glue. The black material is any one of carbon black, carbon powder and black dye, and the proportion of black material in the black molded glue is 3% to 10%. The diffusion material is any one of glass beads, silica and silicone, and the proportion of diffusion material in the black molded glue is 5% to 15%. In this way, the black film glue 230 finally formed by the black molded glue can be arranged through the above structure, and the transmittance is less than 10% at a thickness of 20μm. At the same time, because the black molded glue adds diffusion material, it can have a certain modification effect on the side light of the lamp bead 220, so as to ultimately improve the display effect of the module light board 220.
[0052] In some examples, such as Figure 4 As shown, the specific process of executing step S120 of the above method is as follows:
[0053] Step S121: driving the mold clamping module to perform a mold clamping operation through the mold clamping power mechanism, so that the upper mold core abuts against a side surface of the first lamp panel prototype away from the lamp surface.
[0054] Step S122: Control the temperature inside the mold clamping module so that the temperature inside the mold clamping module maintains a first preset temperature within a first preset time, thereby allowing the black molded glue to flow evenly to all gaps between the lamp beads of the first lamp board prototype.
[0055] Step S123: Control the temperature inside the mold clamping module so that the temperature inside the mold clamping module maintains a second preset temperature within a second preset time, thereby cooling and solidifying the black molded glue to obtain a second lamp panel prototype.
[0056] It is understood that the first preset temperature in the above method step is preferably 150°C to 180°C. The first preset time in the above method step is preferably 5min to 30min. The second preset temperature in the above method step is preferably 50°C to 80°C. The first preset time in the above method step is preferably 20min to 50min.
[0057] In this way, through the above method steps, it can be effectively ensured that the black molded glue evenly fills the gaps between the lamp beads of the first lamp board prototype, while ensuring that the gaps between the lamp beads of the first light board prototype are formed with a black molded glue layer 230 with a thickness less than or equal to the height of the lamp beads 220, so as to obtain the second light board prototype.
[0058] In some examples, such as Figure 3As shown, the specific process of performing the above method step S120 is as follows: provide a rolling device (not shown), place the black functional film 240 on the lamp surface of the second lamp board prototype, and use the rolling device to make the black functional film 240 and the lamp surface of the second lamp board prototype fit together, and then perform high-temperature degassing treatment to obtain the target module lamp board. In this way, through the above method step setting, the tight fit between the black functional film 240 and the lamp surface of the second lamp board prototype can be further ensured.
[0059] In some examples, such as Figure 3 As shown, the black functional film 240 includes an anti-glare layer 241 and an adhesive layer 242, wherein the thickness of the anti-glare layer 241 is 75-100 μm. The thickness of the adhesive layer 242 is 50-100 μm, and the light transmittance of the adhesive layer is 30% to 70%, preferably 40% to 50%. In this way, by setting the above parameters, the anti-glare properties of the black functional film 240 can be ensured while the light transmittance of the black functional film 240 can better meet the light transmittance requirements of the module light board 200.
[0060] In one embodiment, Figure 3 As shown, an embodiment of the present application further provides a display module, which may specifically include a module light board 200, and the module light board 200 is manufactured by the packaging method of the module light board in the above embodiment.
[0061] It is understandable that the display module of the embodiment of the present application can be used for independent display or can be specifically applied to a display screen, so that a number of display modules are arranged in a certain manner to form a corresponding display screen. The display module of the embodiment of the present application can adopt a bottom shell structure design or a bottom shell-free structure design. When it adopts a bottom shell structure design, in addition to the module light board 200, it also includes a module bottom shell, and the module bottom shell is installed on the side surface of the module light board 200 away from the lamp beads 220.
[0062] In this way, since the display module in the embodiment of the present application has a module light board manufactured using the method steps in the above method embodiment, it has the same functions and technical effects as the above method embodiment, and will not be repeated here.
[0063] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A molding mechanism, used in the packaging operation of a module light panel, characterized in that: It includes a mold closing module and a mold closing power mechanism for driving the mold closing module to perform a mold closing operation, the mold closing module includes an upper mold core and a lower mold core, the upper mold core and the lower mold core are arranged in layers with relative spacing in the vertical direction, and a flexible contact area is arranged on the side surface of the lower mold core facing the upper mold core.
2. The molding mechanism according to claim 1, characterized in that: A lamp board placement groove is recessed on a surface of the lower mold core on one side facing the upper mold core, and a flexible pad is laid on the bottom wall of the lamp board placement groove so that the bottom wall of the lamp board placement groove forms the flexible contact area.
3. The molding mechanism according to claim 2, characterized in that: The flexible pad body is any one of a silicone pad body, a rubber pad body, an EVA pad body, and a TPE pad body.
4. A packaging method for a module light panel, characterized in that: The following steps are involved: Providing the molding mechanism as described in any one of claims 1 to 3 and a first lamp board prototype, placing the lamp surface of the first lamp board prototype downward on the lower mold core, and making the lamp surface of the first lamp board prototype abut against the flexible contact area; Providing black molding glue, injecting the black molding glue between the lamp surface of the first lamp board prototype and the flexible contact area, and performing a preset molding operation on the first lamp board prototype through the mold clamping module, so that the gaps between the lamp beads of the first lamp board prototype are all formed with a black molding glue layer with a thickness less than or equal to the height of the lamp beads, so as to obtain a second lamp board prototype; A black functional film is provided, and the black functional film is attached to the lamp surface of the second lamp panel prototype in a preset manner to obtain a target module lamp panel.
5. The packaging method according to claim 4, characterized in that: The step of placing the lamp surface of the first lamp board prototype downward on the lower mold core and making the lamp surface of the first lamp board prototype abut against the flexible contact area comprises: A release film is provided, and after the release film is placed on the flexible contact area, the lamp surface of the first lamp board prototype is placed on the release film with the lamp surface facing downward, so that the lamp surface of the first lamp board prototype abuts against the flexible contact area through the release film.
6. The packaging method according to claim 4, characterized in that: The black molded glue is made by mixing glue body, black material and diffusion material, wherein: The glue body is any one of epoxy glue, silicone glue and polyurethane glue; The black material is any one of carbon black, carbon powder and black dye, and the proportion of the black material in the black molding glue is 3% to 10%; The diffusion material is any one of glass beads, silicon dioxide and silicone, and the proportion of the diffusion material in the black molded glue is 5% to 15%.
7. The packaging method according to claim 4, characterized in that: The step of performing a preset molding operation on the first lamp board prototype by the mold clamping module so that the gaps between the lamp beads of the first lamp board prototype are all formed with a black molded adhesive layer to obtain the second lamp board prototype comprises: The mold clamping module is driven by the mold clamping power mechanism to perform a mold clamping operation, so that the upper mold core abuts against a side surface of the first lamp panel prototype away from the lamp surface; Controlling the temperature in the mold clamping module so that the temperature in the mold clamping module maintains a first preset temperature within a first preset time, thereby allowing the black molded glue to flow evenly to all gaps between the lamp beads of the first lamp board prototype; The temperature inside the mold clamping module is controlled so that the temperature inside the mold clamping module maintains a second preset temperature within a second preset time, thereby allowing the black molded glue to cool and solidify to obtain the second lamp panel prototype.
8. The packaging method according to claim 4, characterized in that: The step of attaching the black functional film to the lamp surface of the second lamp panel prototype in a preset manner to obtain a target module lamp panel includes: A rolling device is provided to place the black functional film on the lamp surface of the second lamp board prototype, and after the black functional film is bonded to the lamp surface of the second lamp board prototype by the rolling device, a high-temperature degassing treatment is performed to obtain the target module lamp board.
9. The packaging method according to any one of claims 4 to 8, characterized in that: The black functional film comprises an anti-glare layer and an adhesive layer, wherein: The thickness of the anti-glare layer is 75-100 μm; The thickness of the adhesive layer is 50-100 μm, and the light transmittance of the adhesive layer is 30% to 70%.
10. A display module, characterized in that: It comprises a module light board, and the module light board is packaged by the packaging method according to any one of claims 4 to 9.