Driving substrate, chip transfer method and display panel

Abstract

The invention belongs to the technical field of display, and particularly relates to a driving substrate, a chip transfer method and a display panel, and the driving substrate comprises a substrate and a plurality of electrode units arranged on the substrate in an array. The electrode unit comprises a driving electrode and a shading structure arranged around the driving electrode, the driving electrode is configured to be connected with the connecting electrode of the light-emitting chip, the shading structure at least comprises a flowable shading layer in an initial state, and the top surface of the flowable shading layer does not exceed the top surface of the driving electrode in the initial state. The target driving force is applied to the driving substrate to control the flowable shading layer to flow to the driving electrode corresponding to the flowable shading layer, so that the flowable shading layer can be utilized to shield the laser deviating to the area outside the position where the light-emitting chip is located, and the situation that the laser irradiates the hot melt adhesive layer and causes the hot melt adhesive layer to be melted is avoided; therefore, the risk of position deviation of the light-emitting chip in the transfer process can be avoided.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and in particular relates to a driving substrate, a chip transfer method and a display panel. Background Art

[0002] Among the current display panel technologies, the most common mass transfer technology is laser transfer technology, which uses laser to release the light-emitting chips from the transfer substrate and then transfer them in batches to the drive substrate. Laser transfer technology has high transfer efficiency and a flexible single transfer area.

[0003] During the transfer process, a hot melt adhesive layer is usually provided between the transfer substrate and the driving substrate to buffer the light-emitting chip and the driving electrode. Since the laser irradiation range is difficult to accurately control when using laser glass light-emitting chips, the hot melt adhesive layer may easily melt under the irradiation of the laser. The melted hot melt adhesive layer is fluid, which may easily cause the light-emitting chip to shift in position, thereby affecting the manufacturing yield of the display panel. Summary of the invention

[0004] The purpose of the present application is to provide a driving substrate, a chip transfer method and a display panel. By setting a flowable shading layer surrounding the driving electrode, the shading range of the flowable shading layer can be flexibly adjusted according to the offset range of the laser, so as to avoid the risk of position displacement of the light-emitting chip during the transfer process caused by the melting of the hot melt adhesive layer.

[0005] The present disclosure provides a driving substrate, comprising:

[0006] substrate;

[0007] A plurality of electrode units are arranged in an array on the substrate, the electrode units include a driving electrode and a light shielding structure arranged around the driving electrode, the driving electrode is configured to be connected to the connection electrode of the light-emitting chip; the light shielding structure includes at least a flowable light shielding layer in an initial state, and the top surface of the flowable light shielding layer does not exceed the top surface of the driving electrode in the initial state;

[0008] The flowable shading layer is configured to flow toward the corresponding driving electrode under the action of the target driving force so as to switch from the initial state to the working state. The top surface of the flowable shading layer is higher than the driving electrode when in the working state.

[0009] In an exemplary embodiment of the present disclosure, the light shielding structure further includes an encapsulation layer, which is disposed around the driving electrode and encapsulates the flowable light shielding layer on the substrate;

[0010] Wherein, the top surface of the flowable light-shielding layer has a gap with the top wall bottom surface of the encapsulation layer when in the initial state, and the top surface of the flowable light-shielding layer is connected with the top wall bottom surface of the encapsulation layer when in the working state.

[0011] In an exemplary embodiment of the present disclosure, the side walls of two adjacent packaging layers are in contact with each other; and / or

[0012] A height difference between a top surface of a top wall of the encapsulation layer and a top surface of the driving electrode is less than or equal to a height of a connecting electrode of the light-emitting chip.

[0013] In an exemplary embodiment of the present disclosure, the side walls of two adjacent encapsulation layers are spaced apart, and an adhesive portion is formed between the side walls of two adjacent encapsulation layers, and the adhesive portion is bonded to the encapsulation layer and the substrate.

[0014] In an exemplary embodiment of the present disclosure, a top surface of the bonding portion is flush with a top surface of a top wall of the packaging layer.

[0015] In an exemplary embodiment of the present disclosure, the target driving force is a magnetic attraction force, and the material of the flowable light-shielding layer includes a magnetic material.

[0016] The present disclosure provides a chip transfer method, the method comprising:

[0017] Providing a transfer substrate, the transfer substrate comprising a base and a plurality of light-emitting chips arranged in an array and at intervals;

[0018] A driving substrate is provided, the driving substrate comprising a substrate and a plurality of electrode units arranged in an array on the substrate, the electrode unit comprising a driving electrode and a light shielding structure arranged around the driving electrode, the light shielding structure at least comprising a flowable light shielding layer in an initial state, and a top surface of the flowable light shielding layer does not exceed a top surface of the driving electrode in the initial state;

[0019] Coating a hot melt adhesive layer on the driving substrate, wherein the hot melt adhesive layer at least includes a bonding portion covering the top surface of the driving electrode;

[0020] Placing the transfer substrate and the drive substrate opposite to each other so that the light emitting chip is connected to the drive electrode through the joint portion;

[0021] irradiating the transfer substrate with laser to peel off the base and transfer each of the light-emitting chips to the drive substrate;

[0022] Among them, after the transfer substrate and the driving substrate are placed opposite to each other, a target driving force is applied to the driving substrate, and the flowable shading layer flows toward the corresponding driving electrode under the action of the target driving force to switch from the initial state to the working state. When the flowable shading layer is in the working state, its top surface is higher than the driving electrode and is arranged around the joint.

[0023] In an exemplary embodiment of the present disclosure, the light shielding structure includes a plurality of encapsulation layers, the encapsulation layers are arranged around the driving electrodes, and the flowable light shielding layers are encapsulated on the substrate; the encapsulation layers are light-transmissive;

[0024] Wherein, the top surface of the flowable light-shielding layer has a gap with the top wall bottom surface of the encapsulation layer when in the initial state, and the top surface of the flowable light-shielding layer is connected with the top wall bottom surface of the encapsulation layer when in the working state.

[0025] In an exemplary embodiment of the present disclosure, after the light-emitting chip is transferred onto the driving substrate, the hot melt adhesive layer is heated to remove the hot melt adhesive layer from the substrate; and / or

[0026] The target driving force is a magnetic attraction force, and the step of applying the target driving force to the driving substrate includes:

[0027] A magnetron device is provided, which has a plurality of electrode groups, wherein the electrode groups correspond one-to-one to the shading structures; a voltage is applied to the electrode groups, and the electrode groups form a target driving force on the driving substrate to drive the corresponding flowable shading layer to switch between the initial state and the working state.

[0028] The present disclosure provides a display panel, the display panel comprising a light emitting chip and any one of the driving substrates described above, the light emitting chip is correspondingly connected to the driving electrodes in the driving substrate to realize the display function of the display panel; or

[0029] The display panel includes a light-emitting chip, a magnetic control device and a driving substrate as described above. The light-emitting chip is correspondingly connected to the driving electrodes in the driving substrate to realize the display function of the display panel. The magnetic control device is used to form a target driving force on the driving substrate to control the flowable shading layer to switch from an initial state to a working state.

[0030] This application scheme has the following beneficial effects:

[0031] The present disclosure provides a flowable light shielding layer surrounding the driving electrode on the driving substrate, wherein the flowable light shielding layer can flow toward the driving electrode corresponding thereto under the action of the target driving force, thereby switching the flowable light shielding layer from an initial state to a working state. The flowable light shielding layer in the working state can shield the laser that is offset to an area outside the position of the light-emitting chip, so as to avoid the situation where the laser irradiates the hot-melt adhesive layer and causes the hot-melt adhesive layer to melt, thereby avoiding the risk of positional displacement of the light-emitting chip during the transfer process.

[0032] Moreover, since the flowable shading layer is arranged around the driving electrode and the top surface of the flowable shading layer is higher than the driving electrode in the working state, even if part of the laser is reflected or diffracted, resulting in partial melting of the hot melt adhesive layer, the flowable shading layer in the working state can limit the flow of the hot melt adhesive material to a certain extent, thereby reducing or avoiding the problem of position displacement of the light-emitting chip.

[0033] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0034] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0036] Figure 1 It is a structural schematic diagram when laser deviation occurs in the related technology.

[0037] Figure 2 It is a schematic diagram of the structure in which laser causes the hot melt adhesive layer to melt in the related technology.

[0038] Figure 3 It is a structural schematic diagram of the position offset of the light-emitting chip in the related art.

[0039] Figure 4 A schematic diagram of the structure of a driving substrate in an embodiment of the present disclosure.

[0040] Figure 5 It is a schematic diagram of the structure when the driving substrate has a packaging layer in an embodiment of the present disclosure.

[0041] Figure 6It is a schematic diagram of the structure of the abutment between two adjacent packaging layers in the embodiment of the present disclosure.

[0042] Figure 7 It is a schematic diagram of the structure when the top surface of the flowable light-shielding layer is flush with the top surface of the connecting electrode in the embodiment of the present disclosure.

[0043] Figure 8 It is a structural schematic diagram of a bonding portion provided between two adjacent flowable shading layers in the embodiment of the present disclosure.

[0044] Fig. 9 Another structural schematic diagram of a bonding portion provided between two adjacent flowable shading layers in the disclosed embodiment.

[0045] Fig.10 Schematic diagram of the chip transfer method in the embodiment of the present disclosure.

[0046] Fig.11 It is a schematic diagram of the structure when the transfer substrate and the drive substrate are opposite to each other in the embodiment of the present disclosure.

[0047] Fig.12 It is a structural schematic diagram of the flowable light-shielding layer on the transfer substrate in the initial state in the embodiment of the present disclosure.

[0048] Fig.13 It is a structural schematic diagram of the flowable light-shielding layer on the transfer substrate in the working state in the embodiment of the present disclosure.

[0049] Fig.14 It is a structural schematic diagram of setting a fixed light-shielding layer on a transfer substrate in an embodiment of the present disclosure.

[0050] Fig.15 It is another structural schematic diagram of setting a fixed light-shielding layer on the transfer substrate in an embodiment of the present disclosure.

[0051] Fig.16 The figure is a schematic diagram of a process for forming a driving substrate in an embodiment of the present disclosure.

[0052] Fig.17 Another schematic diagram of a process for forming a driving substrate in an embodiment of the present disclosure is shown.

[0053] Fig.18 It is a structural schematic diagram of a laser detection device for detecting a laser offset position in an embodiment of the present disclosure.

[0054] Fig.19 It is a structural schematic diagram of the light-emitting chip having a manufacturing offset phenomenon in an embodiment of the present disclosure.

[0055] Fig. 20 Schematic diagram of the structure of the magnetron device in the embodiment of the present disclosure.

[0056] Description of reference numerals:

[0057] 11. Light-emitting chip; 111. Connecting electrode; 112. Main body; 12. Hot-melt adhesive layer; 121. Jointing part; 122. Adhesive part; 13. Driving electrode; 131. Electrode material; 14. Substrate; 15. Flowable shading layer; 151. Flowable shading material; 16. Encapsulation layer; 21. Base; 22. Adhesive layer; 23. Fixed shading layer; 3. Magnetron device; X, horizontal direction; Y, vertical direction. DETAILED DESCRIPTION

[0058] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete and will fully convey the concept of the example embodiments to those skilled in the art.

[0059] In addition, the described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the present disclosure.

[0060] The present disclosure is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be understood as limiting the present disclosure.

[0061] like Figures 1 to 3 As shown, in some current embodiments, a hot melt adhesive layer 12 is usually provided on the driving substrate when the light emitting chip 11 is transferred in bulk, and the hot melt adhesive layer 12 is located between the light emitting chip 11 and the driving electrode 13 to achieve buffering between the light emitting chip 11 and the driving electrode 13. Due to technical limitations, there is a precision deviation in the laser that separates the light emitting chip 11 from the base 21 in the transfer substrate, resulting in part of the laser irradiating the hot melt adhesive layer 12 outside the position of the light emitting chip 11. Since the hot melt adhesive layer 12 has a certain wettability, the hot melt adhesive layer 12 will be heated during laser irradiation, and the solvent in the hot melt adhesive layer 12 will evaporate, resulting in slight flow of the surrounding hot melt adhesive layer 12, which in turn causes the position of the light emitting chip 11 to be offset when it is transferred to the driving substrate, thereby affecting the display effect and reliability of the display panel.

[0062] To solve the above problems, Figure 4 As shown, the present disclosure provides a driving substrate, including: a substrate 14 and a plurality of electrode units.

[0063] A plurality of electrode unit arrays are arranged on a substrate 14, wherein the electrode unit includes a driving electrode 13 and a light shielding structure arranged around the driving electrode 13, wherein the driving electrode 13 is configured to be connected to the connecting electrode 111 of the light emitting chip 11, and the light shielding structure includes at least a flowable light shielding layer 15 in an initial state. After the target driving force is applied to the driving substrate, the flowable light shielding layer 15 flows toward the corresponding driving electrode 13 under the action of the target driving force to switch from the initial state to the working state. When the light emitting chip 11 is separated from the base 21 in the transfer substrate by laser, if the laser is irradiated to an area other than the position of the light emitting chip 11, the present disclosure can adjust the flowable light shielding layer 15 to a working state according to the laser offset range, and use the flowable light shielding layer 15 to shield the laser that is offset to an area other than the position of the light emitting chip 11, so as to avoid the laser irradiating the hot melt adhesive layer 12 and causing the hot melt adhesive layer 12 to melt, thereby avoiding the problem of position offset of the light emitting chip 11 during the transfer process, and then improving the transfer yield of the light emitting chip 11.

[0064] It should be noted that the flowable shading layer 15 in the initial state can cover the entire area of ​​the upper surface of the substrate 14 except the position of the driving electrode 13 (the upper surface of the substrate 14 refers to the side of the substrate 14 close to the driving electrode 13), but is not limited to this. The flowable shading layer 15 in the initial state may also only cover a partial area of ​​the upper surface of the substrate 14 except the position of the driving electrode 13.

[0065] The target driving force mentioned above refers to the force that can drive the flowable light shielding layer 15 to switch between the initial state and the working state. After the target driving force is applied to the driving substrate, the flowable light shielding layer 15 gathers to the corresponding driving electrode 13 and switches to the working state. At this time, the top surface of the flowable light shielding layer 15 is higher than the top surface of the flowable light shielding layer 15 in the initial state.

[0066] In the embodiment of the present disclosure, the top surface of the flowable light shielding layer 15 is higher than the driving electrode 13 when in the working state, and the top surface of the flowable light shielding layer 15 does not exceed the top surface of the driving electrode 13 when in the initial state, thereby saving the manufacturing cost of the flowable light shielding layer 15. However, it is not limited to this. In the present disclosure, the top of the flowable light shielding layer 15 in the initial state may also exceed the top surface of the driving electrode 13, and the top of the flowable light shielding layer 15 in the initial state is lower than the top of the flowable light shielding layer 15 in the working state.

[0067] It should be noted that the hot melt adhesive layer 12 may at least include a joint portion 121 covering the top surface of the driving electrode 13. When in the working state, the top surface of the flowable shading layer 15 is higher than the driving electrode 13 and is arranged around the joint portion 121. Even if part of the laser is reflected or diffracted, resulting in partial melting of the joint portion 121 in the hot melt adhesive layer 12, the flowable shading layer 15 in the working state can limit the flow of the hot melt adhesive material in the joint portion 121 to a certain extent, thereby reducing or avoiding the problem of position displacement of the light-emitting chip 11.

[0068] Further, such as Figure 5 As shown, the driving substrate in the embodiment of the present disclosure may further include an encapsulation layer 16 corresponding to the flowable light shielding layer 15, the encapsulation layer 16 is arranged around the driving electrode 13, and the flowable light shielding layer 15 is encapsulated on the substrate 14. By providing the encapsulation layer 16, it is possible to achieve the sealing of the flowable light shielding layer 15, and the flowable light shielding layer 15 can move arbitrarily inside the encapsulation layer 16 under the action of the driving force, thereby preventing the flowable light shielding layer 15 from flowing onto the light emitting chip 11 and causing the formed display panel to have a poor display problem.

[0069] The top surface of the flowable light shielding layer 15 has a gap with the bottom surface of the top wall of the encapsulation layer 16 when in the initial state, and the top surface of the flowable light shielding layer 15 is connected with the bottom surface of the top wall of the encapsulation layer 16 when in the working state. The top wall of the encapsulation layer 16 refers to the part of the encapsulation layer 16 away from the substrate 14, and the top wall of the encapsulation layer 16 and the side wall of the encapsulation layer 16 together realize the encapsulation of the flowable light shielding layer 15.

[0070] It should be noted that the material for making the encapsulation layer 16 may be silicon dioxide. The encapsulation layer 16 may be light-transmissive.

[0071] In some embodiments of the present disclosure, the driving substrate may be a driving substrate in the transfer process of the light emitting chip 11, and the encapsulation layer 16 may be a light-transmitting structure. At this time, the present disclosure may adjust the flowable light shielding layer 15 to a working state according to the laser offset range to shield the laser that is offset to the area outside the position of the light emitting chip 11, thereby avoiding the situation where the laser is irradiated on the hot melt adhesive layer 12 and causes the hot melt adhesive layer 12 to melt, thereby avoiding the problem of positional offset of the light emitting chip 11 during the transfer process.

[0072] In other embodiments of the present disclosure, the driving substrate may be a driving substrate in a display panel. The driving electrode 13 in the display panel generates a large amount of heat when working. The present disclosure sets a flowable shading layer 15 on the driving substrate. A driving force can be applied to the flowable shading layer 15 to drive it to flow inside the encapsulation layer 16, thereby promoting the heat dissipation of the driving electrode 13, so as to reduce or avoid damage to the driving electrode 13 caused by excessive temperature, thereby extending the service life of the driving electrode 13 and improving the display reliability of the display panel. At the same time, the flowable shading layer 15 is located between two adjacent light-emitting chips 11, thereby at least blocking part of the light irradiated from one light-emitting chip 11 to another adjacent light-emitting chip 11, so as to reduce or avoid light mixing between two adjacent light-emitting chips 11, thereby improving the display effect of the display panel.

[0073] In addition, since the flowable shading layer 15 is fluid, when the display panel moves or tilts during use, the flowable shading layer 15 in the encapsulation layer 16 can be concentrated to a position close to the driving electrode 13 under the action of gravity and absorb the heat generated therein. Subsequently, when the display panel tilts in other directions, the flowable shading layer 15 also flows in the same direction, thereby promoting the heat dissipation of the driving electrode 13 while reducing the heat dissipation energy consumption of the driving electrode 13.

[0074] like Figure 6 As shown, in some embodiments of the present disclosure, the side walls of two adjacent encapsulation layers 16 can be attached to each other, and at this time, the movable range of the flowable light-shielding layer 15 in the horizontal direction X is relatively large. When the driving substrate is used in the display panel, the movable range of the flowable light-shielding layer 15 in the encapsulation layer 16 is larger, thereby further improving the heat dissipation effect on the driving electrode 13. When the driving substrate is used in the transfer process of the light-emitting chip 11, the light-shielding range of the flowable light-shielding layer 15 in the horizontal direction X is relatively large. Even if the offset range of the laser used to peel the light-emitting chip 11 from the transfer substrate is relatively large, the flowable light-shielding layer 15 can also achieve complete shielding of the laser that is offset to a position outside the light-emitting chip 11 under the action of the target driving force, thereby avoiding the situation where the hot melt adhesive layer 12 melts and causes the light-emitting chip 11 to shift in position.

[0075] But not limited to this, such as Figure 5 As shown, in other embodiments of the present disclosure, the side walls of two adjacent encapsulation layers 16 may also be spaced apart from each other to reduce the material used to make the encapsulation layer 16 and reduce the manufacturing cost of the encapsulation layer 16. At this time, the length of each encapsulation layer 16 in the horizontal direction X should not be less than the offset distance of the laser in the horizontal direction X to ensure that the flowable light shielding layer 15 can completely shield the offset laser under the action of the target driving force.

[0076] In the embodiment of the present disclosure, the top surface of the flowable light shielding layer 15 in the working state can be made not lower than the top surface of the hot melt adhesive layer 12. Figure 4 As shown, the top surface of the flowable light shielding layer 15 in the working state can be made flush with the top surface of the hot melt adhesive layer 12, so that the flowable light shielding layer 15 can completely avoid the situation where the laser is irradiated on the joint 121, and further avoid the problem of position displacement of the light emitting chip 11 during the transfer process caused by the melting of the hot melt adhesive material on the joint 121. However, it is not limited to this, and the top surface of the flowable light shielding layer 15 in the present disclosure in the working state can also be lower than the top surface of the hot melt adhesive layer 12, which can be determined according to actual conditions.

[0077] like Figure 5 As shown, when the driving substrate in the present disclosure includes an encapsulation layer 16, the top surface of the top wall of the encapsulation layer 16 can be flush with the top surface of the hot melt adhesive layer 12. The flowable light shielding layer 15 can at least block part of the laser irradiated to the joint 121 in the working state to reduce the positional displacement of the light-emitting chip 11 during the transfer process. Among them, even if part of the laser is still irradiated to the joint 121 and causes the hot melt adhesive material to melt, since the encapsulation layer 16 is arranged around the driving electrode 13, and the top surface of the top wall of the encapsulation layer 16 is flush with the top surface of the hot melt adhesive layer 12, the encapsulation layer 16 can limit the flow of the joint 121, thereby preventing the light-emitting chip 11 from being displaced.

[0078] It should be noted that before removing the hot melt adhesive layer 12, the height difference between the top surface of the flowable shading layer 15 and the top surface of the driving electrode 13 is less than or equal to the sum of the heights of the connecting electrode 111 of the light-emitting chip 11 and the hot melt adhesive layer 12. Therefore, when the light-emitting chip 11 is transferred from the transfer substrate to the substrate 14, it can be avoided that the light-emitting chip 11 is unable to contact the corresponding joint 121 on the substrate 14 due to the flowable shading layer 15 being too high, thereby causing the light-emitting chip 11 to be unable to connect with the corresponding driving electrode 13.

[0079] After removing the hot melt adhesive layer 12, the height difference between the top surface of the flowable shading layer 15 and the top surface of the driving electrode 13 is less than or equal to the height of the connecting electrode 111 of the light-emitting chip 11, thereby ensuring that the light-emitting chip 11 is connected to the driving electrode 13 and realizing normal light emission of the light-emitting chip 11.

[0080] For example, Figure 7As shown, before removing the hot melt adhesive layer 12, the height difference between the top surface of the flowable light shielding layer 15 and the top surface of the driving electrode 13 in the present disclosure can be equal to the sum of the heights of the connecting electrode 111 of the light emitting chip 11 and the hot melt adhesive layer 12. At this time, the flowable light shielding layer 15 can prevent the laser from irradiating the joint 121, thereby reducing the problem of positional displacement of the light emitting chip 11 during the transfer process. At the same time, the flowable light shielding layer 15 can also prevent the laser from irradiating the corresponding driving electrode 13 and the connecting electrode 111, so as to avoid the damage of the driving electrode 13 and the connecting electrode 111 due to laser irradiation, thereby improving the transfer yield of the light emitting chip 11 and improving the display effect of the display panel.

[0081] It should be noted that before removing the hot melt adhesive layer 12, when the height difference between the top surface of the flowable light-shielding layer 15 and the top surface of the driving electrode 13 is greater than the height of the connecting electrode 111 of the light-emitting chip 11, if the hot melt adhesive layer 12 needs to be removed from the substrate 14 when the connecting electrode 111 is subsequently bound to the driving electrode 13, a target driving force can be applied to the flowable light-shielding layer 15 to make the flowable light-shielding layer 15 flow in a direction away from its corresponding driving electrode 13, so that the height difference between the top surface of the flowable light-shielding layer 15 and the top surface of the driving electrode 13 is less than or equal to the height of the connecting electrode 111 of the light-emitting chip 11, so as to avoid the problem that the connecting electrode 111 cannot be connected to the driving electrode 13 due to the flowable light-shielding layer 15 being too high.

[0082] When the driving substrate includes a packaging layer 16, the height difference between the top surface of the top wall of the packaging layer 16 and the top surface of the driving electrode 13 should be less than or equal to the height of the connecting electrode 111 of the light-emitting chip 11, thereby avoiding the situation where the light-emitting chip 11 cannot contact the corresponding joint 121 on the substrate 14 due to the packaging layer 16 being too high, and then the light-emitting chip 11 cannot connect with the corresponding driving electrode 13.

[0083] like Figure 4 As shown, in the embodiment of the present disclosure, the hot melt adhesive layer 12 may only include the joint portion 121 covering the top surface of the driving electrode 13. However, it is not limited thereto. Figure 8 As shown, when there is a gap between two adjacent flowable light-shielding layers 15 , the hot-melt adhesive layer 12 may also include an adhesive portion 122 arranged around the flowable light-shielding layers 15 .

[0084] Specifically, Fig. 9 As shown, when the driving substrate includes a packaging layer 16 and there is a gap between the side walls of two adjacent packaging layers 16 , the bonding portion 122 can be disposed between the two adjacent packaging layers 16 , and the bonding portion 122 is bonded to the packaging layer 16 and the substrate 14 .

[0085] It should be noted that in the present disclosure, the top surface of the adhesive portion 122 is flush with the top surface of the top wall of the packaging layer 16, so that the packaging layer 16 can separate the adhesive portion 122 from the joining portion 121, thereby preventing the hot melt adhesive material in the bonding portion 121 from flowing when the hot melt adhesive material in the adhesive portion 122 melts, thereby reducing the risk of positional displacement of the light-emitting chip 11 and improving the transfer yield of the light-emitting chip 11.

[0086] The embodiment of the present disclosure can enhance the stability of the connection between the encapsulation layer 16 and the substrate 14 by providing the adhesive portion 122, thereby preventing part of the material of the flowable light-shielding layer 15 from flowing out of the encapsulation layer 16 due to poor sealing, resulting in the remaining flowable light-shielding material 151 in the encapsulation layer 16 being insufficient to completely block the laser irradiating the joint portion 121, thereby causing the light-emitting chip 11 to be displaced.

[0087] In addition, when the driving substrate is used in a display panel, by strengthening the connection stability between the encapsulation layer 16 and the substrate 14, the flowable light shielding material 151 flowing out of the flowable light shielding layer 15 can be prevented from flowing onto the light emitting chip 11, thereby preventing the display panel from having a poor display. At the same time, by preventing the flowable light shielding material 151 in the encapsulation layer 16 from being reduced, the heat dissipation effect of the flowable light shielding layer 15 on the driving electrode 13 can also be ensured, thereby extending the service life of the driving electrode 13.

[0088] In the embodiment of the present disclosure, the bonding portion 122 and the joining portion 121 can be provided in the same layer, thereby simplifying the manufacturing process of the hot melt adhesive layer 12. It should be noted that the same layer provision here means that the bonding portion 122 and the joining portion 121 are processed by the same process.

[0089] The target driving force in the present disclosure may be a magnetic attraction, and the flowable light-shielding material 151 for making the flowable light-shielding layer 15 may include a magnetic material.

[0090] For example, the flowable shading material 151 in the present disclosure may include: black iron oxide (Fe3O4), brown iron oxide (Fe2O3), alkyd resin, polyurethane, epoxy resin, acrylamide, polyvinyl acetate, vinyl chloride acetate copolymer, polyvinyl butyral, polyethylene ethyl ether, nitrocellulose, polyurethane resin, silane, and at least one of ferric acid esters.

[0091] Among them, black iron oxide and brown iron oxide are magnetic pigments, and their particles are needle-shaped crystals with a size less than 1 um, and the pigments can be evenly arranged in a magnetic field. For example, the proportion of the pigments in the material for making the flowable light shielding layer 15 can be 60% to 80%.

[0092] Alkyd resin, polyurethane, epoxy resin, acrylamide, polyvinyl acetate, vinyl chloride-acetic acid copolymer, polyvinyl butyral, polyethylene ethyl ether, nitrocellulose, polyurethane resin are synthetic resin-based binders to ensure the fluidity and adhesion of the flowable light-shielding layer 15. For example, the binder may account for 15% to 35% of the material used to make the flowable light-shielding layer 15.

[0093] Silane and ferrite are additives to ensure that the flowable light shielding layer 15 is evenly dispersed in the connecting material. For example, the additive may account for 5% of the material used to make the flowable light shielding layer 15.

[0094] However, it is not limited thereto, and other forces other than the magnetic attraction force that can drive the flowable light-shielding layer 15 to switch from the initial state to the working state can be included in the embodiments of the present disclosure.

[0095] like Fig.10 As shown, the present disclosure provides a chip transfer method, and the steps of the transfer method include:

[0096] S1. Provide a transfer substrate, wherein the transfer substrate comprises a base 21 and a plurality of light emitting chips 11 arranged in an array and at intervals.

[0097] S2. Provide a driving substrate, the driving substrate includes a substrate 14 and a plurality of electrode units arranged in an array on the substrate 14, the electrode unit includes a driving electrode 13 and a shading structure arranged around the driving electrode 13, the shading structure includes at least a flowable shading layer 15 in an initial state, and the top surface of the flowable shading layer 15 does not exceed the top surface of the driving electrode 13 when in the initial state.

[0098] S3 . Coating a hot melt adhesive layer 12 on the driving substrate. The hot melt adhesive layer 12 at least includes a bonding portion 121 covering the top surface of the driving electrode 13 .

[0099] S4 , placing the transfer substrate and the driving substrate opposite to each other, so that the light emitting chip 11 is connected to the driving electrode 13 through the joint portion 121 .

[0100] S5 , irradiating the transfer substrate with laser to peel off the base 21 and transfer each light emitting chip 11 to the drive substrate.

[0101] S6. After the transfer substrate is placed opposite to the driving substrate, a target driving force is applied to the driving substrate, and the flowable shading layer 15 flows toward the corresponding driving electrode 13 under the action of the target driving force to switch from an initial state to a working state. When the flowable shading layer 15 is in the working state, its top surface is higher than the driving electrode 13 and is arranged around the joint 121.

[0102] like Fig.11 As shown, in the embodiment of the present disclosure, the transfer substrate may further include an adhesive layer 22 , and the adhesive layer 22 is located between the base 21 and the light emitting chip 11 .

[0103] Specifically, an adhesive layer 22 may be first formed on the substrate 21, and the adhesive layer 22 may cover a side of the substrate 21 close to the light-emitting chip 11. After the adhesive layer 22 is formed, a plurality of light-emitting chips 11 arranged in an array and spaced apart are arranged on the adhesive layer 22, and the light-emitting chip 11 includes a connecting electrode 111 and a main body 112, and the main body 112 is located on a side of the connecting electrode 111 close to the substrate 21, and the main body 112 of the light-emitting chip 11 is connected to the adhesive layer 22. The main body 112 of the light-emitting chip 11 may be partially embedded in the adhesive layer 22 to achieve a stable connection between the light-emitting chip 11 and the collector.

[0104] It should be noted that, in addition to providing a flowable light shielding layer 15 on the driving substrate, Figure 12 to Figure 13 As shown, the present disclosure can also form a flowable light-shielding layer 15 surrounding the light-emitting chip 11 on the transfer substrate, and the flowable light-shielding layer 15 on the transfer substrate corresponds to the light-emitting chip 11 one by one.

[0105] The flowable light shielding layer 15 on the transfer substrate also has an initial state and a working state, and after the target driving force is applied to the transfer substrate, the flowable light shielding layer 15 flows toward the corresponding light emitting chip 11 under the action of the target driving force to switch from the initial state to the working state. In the process of flowing, the side of the flowable light shielding layer 15 on the transfer substrate away from the base 21 is always not higher than the side of the main body 112 of the corresponding light emitting chip 11 close to the connecting electrode 111, so as to avoid the problem of signal interference to the connecting electrode 111 when the flowable light shielding layer 15 directly contacts the connecting electrode 111.

[0106] In addition, if Figure 14 to Figure 15 As shown, the present disclosure may also provide a fixed light shielding layer 23 on the transfer substrate, and the fixed light shielding layer 23 is provided around the light emitting chip 11 .

[0107] For example, the fixed shading layer 23 can cover the area of ​​the substrate 21 except the position of the light-emitting chip 11, so as to shield the offset laser that is offset to the area other than the position of the light-emitting chip 11, thereby preventing the laser from causing the hot melt adhesive layer 12 to melt and avoiding the problem of position displacement of the light-emitting chip 11.

[0108] In the present disclosure, the side of the fixed light shielding layer 23 away from the substrate 21 is not higher than the side of the main body 112 away from the substrate 21 to avoid signal interference to the connection electrode 111 when the fixed light shielding layer 23 directly contacts the connection electrode 111 .

[0109] In some embodiments of the present disclosure, the material used to make the fixed light shielding layer 23 may include one or more of carbon black, resin, solvent and additives.

[0110] In addition, in other embodiments of the present disclosure, the material used to make the fixed light shielding layer 23 may include a photochromic material. Fig.14 As shown, before the laser irradiates the fixed light shielding layer 23, the fixed light shielding layer 23 is transparent; Fig.15 As shown, when the laser irradiates the fixed shading layer 23, the fixed shading layer 23 changes from transparent to dark, and the fixed shading layer 23 consumes the power of the laser during the color change process. After the fixed shading layer 23 changes color, it blocks the laser from propagating to the hot melt adhesive layer 12 on the driving substrate, thereby avoiding the deviation of the light-emitting chip 11 during the transfer due to the flow of the hot melt adhesive layer 12.

[0111] For example, the photochromic material may include: one or more of a colorless dye, a photoacid generator, a free radical polymerizable compound, a photoradical polymerization initiator, and a tertiary amine compound. The colorless dye may change color when in contact with an acidic substance, the colorless dye is 3-dibutylamino-6-methyl-7-anilinofluoran, the photoacid generator may generate an acidic compound under light irradiation, the photoacid generator is an aryl sulfonium salt substance, the free radical polymerizable compound is a compound containing an acryloyl group, the photoradical polymerization initiator is an acetophenone-based or acylphosphine oxide-based initiator, and the tertiary amine compound is used to delay the color change of the colorless dye, and the tertiary amine compound is N-phenyldiethanolamine.

[0112] Of course, the present disclosure may also set a fixed shading layer 23 surrounding the driving electrode 13 on the driving substrate to block the laser irradiated onto the hot melt adhesive layer 12 through the fixed shading layer 23, thereby avoiding the problem of position displacement of the light-emitting chip 11 caused by the flow of the hot melt adhesive layer 12.

[0113] In the embodiment of the present disclosure, the light shielding structure may further include a plurality of encapsulation layers 16. Fig.16 As shown, the encapsulation layer 16 is disposed around the driving electrode 13, and encapsulates the flowable light shielding layer 15 on the substrate 14. The encapsulation layer 16 in the present disclosure is light-transmissive.

[0114] Among them, the top surface of the flowable light-shielding layer 15 has a gap with the top wall and bottom surface of the packaging layer 16 when it is in the initial state, and the top surface of the flowable light-shielding layer 15 is connected with the top wall and bottom surface of the packaging layer 16 when it is in the working state, that is, the space formed by the packaging layer 16 and the substrate 14 is larger than the volume of the flowable light-shielding layer 15, so that the flowable light-shielding layer 15 can flow in the packaging layer 16 to promote the heat dissipation of the driving electrode 13.

[0115] In the embodiment of the present disclosure, a plurality of flowable light shielding layers 15 arranged in an array and spaced apart from each other may be formed on the substrate 14 , and then the driving electrode 13 may be formed.

[0116] For example, the step of forming a driving substrate in the present disclosure may include: forming a plurality of flowable light-shielding layers 15 arranged in an array on a substrate 14. Specifically, a flowable light-shielding material 151 may be coated on the substrate 14 first, and a target driving force may be applied to the flowable light-shielding material 151 to form a plurality of flowable light-shielding layers 15 arranged in an array, and the flowable light-shielding layer 15 is in an initial state at this time. Then, a plurality of light-transmitting encapsulation layers 16 are formed on the substrate 14, and the encapsulation layers 16 correspond one-to-one to the flowable light-shielding layers 15. Next, a driving electrode 13 is formed on the substrate 14, and the driving electrode 13 corresponds one-to-one to the encapsulation layer 16, and the encapsulation layer 16 is arranged around the driving electrode 13. Specifically, the step of forming the driving electrode 13 may include: coating an electrode material 131 on the substrate 14, the electrode material 131 covers the substrate 14, and the electrode material 131 is exposed and developed to form a plurality of drive electrodes 13 arranged in an array.

[0117] However, the present disclosure is not limited thereto. After forming the driving electrode 13 on the substrate 14 , the flowable light shielding layer 15 surrounding the driving electrode 13 may be formed, and then the hot melt adhesive layer 12 may be coated on the driving substrate.

[0118] For example, Fig.17 As shown, the present disclosure can form a plurality of array-spaced drive electrodes 13 on a substrate 14, and then coat a flowable light-shielding material 151 on the upper surface of the substrate 14 except for the location of the drive electrodes 13 to form a flowable light-shielding layer 15 in an initial state. The flowable light-shielding layer 15 in the initial state can be flush with the top surface of the drive electrodes 13. Before forming the hot melt adhesive layer 12, a target driving force can be applied to the flowable light-shielding layer 15 to adjust the position of the flowable light-shielding layer 15 on the substrate 14.

[0119] During the transfer process of the light-emitting chip 11 , the step of applying the target driving force to the driving substrate may occur after the laser irradiates the transfer substrate and before the laser irradiates the driving substrate.

[0120] Specifically, the present disclosure may provide a laser detection device between the driving substrate and the transfer substrate. The laser detection device may include a signal transmitter and a signal detector. The signal detector may be used to receive the signal generated by the signal transmitter.

[0121] The signal emitter and the signal detector are respectively placed on opposite sides of the transfer substrate in the horizontal direction X. Fig.18 As shown, the signal emitter and the signal detector may be placed at opposite ends in the AA' direction and opposite ends in the BB' direction, respectively, to detect the position of the laser transmitted through the substrate 21, thereby obtaining the offset position of the laser.

[0122] After obtaining the offset position of the laser, a corresponding target driving force can be applied to the flowable shading layer 15 according to the offset position information. Under the action of the target driving force, the flowable shading layer 15 switches from an initial state to a working state to block the laser irradiated onto the hot melt adhesive layer 12, thereby reducing or avoiding the problem of position offset of the light-emitting chip 11 caused by the flow of the hot melt adhesive layer 12.

[0123] At the same time, since the top surface of the flowable shading layer 15 in the working state is higher than the driving electrode 13 and is arranged around the joint 121, even if part of the hot melt adhesive layer 12 is still melted under the irradiation of the laser, the flowable shading layer 15 in the working state can also limit the flow of the hot melt adhesive material in the joint 121 to a certain extent, thereby reducing or avoiding the problem of position displacement of the light-emitting chip 11 and improving the transfer yield of the light-emitting chip 11.

[0124] The present disclosure sets a flowable shading layer 15 on the driving substrate, so that when the laser irradiated on the transfer substrate is offset to an area outside the position of the light-emitting chip 11, the flowable shading layer 15 can be made to flow and switch to a working state by applying a target driving force, so as to block the laser irradiated on the hot melt adhesive layer 12. The present disclosure sets a laser detection device between the driving substrate and the transfer substrate, and then the laser offset position detected by the laser detection device can be used to accurately adjust the shading position of the flowable shading layer 15, so that the flowable shading layer 15 can completely block the offset laser while reducing the setting of the flowable shading material 151, thereby saving the manufacturing cost of the driving substrate. In addition, the present disclosure can also adjust the position of the flowable shading layer 15 so that a gap flows out between two adjacent flowable shading layers 15, so as to facilitate the use of a CCD (Charge Coupled Device) image sensor to obtain multiple specific coordinate information on the driving substrate and the transfer substrate, respectively, so as to achieve precise alignment of the driving substrate and the transfer substrate.

[0125] In addition, due to technical limitations, manufacturing deviation may occur when manufacturing the light emitting chip 11 and the driving electrode 13 .

[0126] For example, Fig.19As shown, when the actual manufacturing size of the light-emitting chip 11 exceeds the actual required size of the light-emitting chip 11, the distance between the position of the laser offset and the corresponding driving electrode 13 increases. At this time, after the driving substrate and the transfer substrate are placed opposite to each other and before the laser irradiates the driving substrate, the target driving force can be applied to the flowable light-shielding layer 15 to adjust the flowable light-shielding layer 15 to a working state, so as to avoid the situation where part of the laser is irradiated onto the hot-melt adhesive layer 12 when the laser irradiates the transfer substrate, thereby reducing the possibility of position offset of the light-emitting chip 11 during the transfer process due to the flow of the hot-melt adhesive layer 12.

[0127] In addition, when the light-emitting chip 11 and the driving electrode 13 are offset in manufacturing, the present invention can also adjust the position of the flowable light-shielding layer 15 after the driving substrate and the transfer substrate are placed opposite each other and before the laser irradiates the driving substrate; and then after the laser irradiates the transfer substrate and before the laser irradiates the driving substrate, the position of the flowable light-shielding layer 15 is adjusted again according to the actual offset range of the laser, so as to improve the accuracy of the light-shielding of the flowable light-shielding layer 15 and reduce the situation where the laser irradiates the hot melt adhesive layer 12 and causes the position of the light-emitting chip 11 to be offset.

[0128] However, it is not limited to this. During the entire transfer process of the light emitting chip 11, when the light emitting chip 11 and the driving electrode 13 are offset in production, the present invention can also adjust the shading range of the flowable shading layer 15 according to the actual offset range of the laser after the laser irradiates the transfer substrate and before the laser irradiates the driving substrate, so as to reduce the frequency of adjusting the flowable shading layer 15, thereby simplifying the process of transferring the light emitting chip 11 and reducing the cost of transferring the light emitting chip 11.

[0129] like Fig. 20 As shown, in the embodiment of the present disclosure, the target driving force may be a magnetic attraction force. At this time, the step of applying the target driving force to the driving substrate may include: providing a magnetic control device 3, the magnetic control device 3 having a plurality of electrode groups, and the electrode groups correspond to the light shielding structures one by one. Applying a voltage to the electrode groups, the electrode groups form a target driving force on the driving substrate to drive the corresponding flowable light shielding layer 15 to switch between the initial state and the working state.

[0130] Specifically, the electrode group may include a first magnetic electrode and a second magnetic electrode that are relatively arranged. The first magnetic electrode may include a plurality of first electrode blocks that are spaced apart, and the second magnetic electrode may include a plurality of second electrode blocks that are spaced apart, and the first electrode blocks and the second electrode blocks are both arranged around the driving electrode 13. The voltage on each first electrode block and the second electrode block is controlled to form a target driving force that drives the flowable shading layer 15 to switch between an initial state and a working state. Among them, the moving direction of each flowable shading layer 15 and its moving distance in the vertical direction Y and the horizontal direction X can be controlled by controlling the size and electrical properties of the voltage applied to each first electrode block and the second electrode block.

[0131] After the light emitting chip 11 is transferred to the driving substrate, the hot melt adhesive layer 12 can be heated to remove the hot melt adhesive layer 12 from the substrate 14. If the hot melt adhesive layer 12 needs to be retained on the final product (such as a display panel), the step of removing the hot melt adhesive layer 12 can be omitted.

[0132] It should be noted that any of the above-mentioned driving substrates can utilize the chip transfer method in the present disclosure to obtain the light-emitting chip 11 from the transfer substrate, and then realize the transfer of the light-emitting chip 11 .

[0133] The embodiment of the present disclosure further discloses a display panel, including a light emitting chip 11 and any one of the driving substrates as described above, wherein the light emitting chip 11 is correspondingly connected to the driving electrodes 13 in the driving substrate to realize the display function of the display panel.

[0134] It should be noted that the driving substrate in the display panel may include a hot melt adhesive layer 12 , but is not limited thereto. The driving substrate in the display panel may also not include the hot melt adhesive layer 12 , which may be specifically set according to actual conditions.

[0135] For example, when the display panel does not include the hot melt adhesive layer 12, the hot melt adhesive layer 12 in the driving substrate can be removed first, and then the opposing substrate and the driving substrate are assembled to obtain a display panel with a display function.

[0136] Furthermore, the display panel in the present disclosure may also include a magnetic control device 3, which is used to form a target driving force on the driving substrate to control the flowable light shielding layer to switch from an initial state to a working state.

[0137] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0138] It should be noted that "upper", "lower" and the like are only used to distinguish for the convenience of description, and do not impose any directional restrictions on the embodiments of the present invention. For example, the "upper" may actually be the "lower" and other directions. In the present disclosure, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral whole; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0139] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0140] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and cannot be construed as limitations on the present disclosure. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and specification of the present disclosure shall fall within the scope covered by the patent of the present disclosure.

Claims

1. A driving substrate, characterized in that: include: substrate; A plurality of electrode units are arranged in an array on the substrate, the electrode units include a driving electrode and a light shielding structure arranged around the driving electrode, the driving electrode is configured to be connected to the connection electrode of the light-emitting chip; the light shielding structure includes at least a flowable light shielding layer in an initial state, and the top surface of the flowable light shielding layer does not exceed the top surface of the driving electrode in the initial state; The flowable shading layer is configured to flow toward the corresponding driving electrode under the action of the target driving force so as to switch from the initial state to the working state. The top surface of the flowable shading layer is higher than the driving electrode when in the working state.

2. The driving substrate according to claim 1, characterized in that: The light shielding structure further includes an encapsulation layer, which is disposed around the driving electrode and encapsulates the flowable light shielding layer on the substrate; Wherein, the top surface of the flowable light-shielding layer has a gap with the top wall bottom surface of the encapsulation layer when in the initial state, and the top surface of the flowable light-shielding layer is connected with the top wall bottom surface of the encapsulation layer when in the working state.

3. The driving substrate according to claim 2, characterized in that: The side walls of two adjacent packaging layers are in contact with each other; and / or A height difference between a top surface of a top wall of the encapsulation layer and a top surface of the driving electrode is less than or equal to a height of a connecting electrode of the light-emitting chip.

4. The driving substrate according to claim 2, characterized in that: The side walls of two adjacent packaging layers are spaced apart, and an adhesive portion is formed between the side walls of two adjacent packaging layers, and the adhesive portion is bonded to the packaging layer and the substrate.

5. The driving substrate according to claim 4, characterized in that: The top surface of the bonding portion is flush with the top surface of the top wall of the packaging layer.

6. The driving substrate according to any one of claims 1 to 5, characterized in that: The target driving force is a magnetic attraction force, and the material of the flowable light-shielding layer includes a magnetic material.

7. A chip transfer method, characterized in that: The method comprises: Providing a transfer substrate, the transfer substrate comprising a base and a plurality of light-emitting chips arranged in an array and at intervals; A driving substrate is provided, the driving substrate comprising a substrate and a plurality of electrode units arranged in an array on the substrate, the electrode unit comprising a driving electrode and a light shielding structure arranged around the driving electrode, the light shielding structure at least comprising a flowable light shielding layer in an initial state, and a top surface of the flowable light shielding layer does not exceed a top surface of the driving electrode in the initial state; Coating a hot melt adhesive layer on the driving substrate, wherein the hot melt adhesive layer at least includes a bonding portion covering the top surface of the driving electrode; Placing the transfer substrate and the drive substrate opposite to each other so that the light emitting chip is connected to the drive electrode through the joint portion; irradiating the transfer substrate with laser to peel off the base and transfer each of the light-emitting chips to the drive substrate; Among them, after the transfer substrate and the driving substrate are placed opposite to each other, a target driving force is applied to the driving substrate, and the flowable shading layer flows toward the corresponding driving electrode under the action of the target driving force to switch from the initial state to the working state. When the flowable shading layer is in the working state, its top surface is higher than the driving electrode and is arranged around the joint.

8. The chip transfer method according to claim 7, characterized in that: The light shielding structure comprises a plurality of encapsulation layers, the encapsulation layers are arranged around the driving electrodes, and the flowable light shielding layers are encapsulated on the substrate; the encapsulation layers are light-transmissive; Wherein, the top surface of the flowable light-shielding layer has a gap with the top wall bottom surface of the encapsulation layer when in the initial state, and the top surface of the flowable light-shielding layer is connected with the top wall bottom surface of the encapsulation layer when in the working state.

9. The chip transfer method according to claim 7, characterized in that: After the light emitting chip is transferred onto the driving substrate, the hot melt adhesive layer is heated to remove the hot melt adhesive layer from the substrate; and / or The target driving force is a magnetic attraction force, and the step of applying the target driving force to the driving substrate includes: A magnetron device is provided, wherein the magnetron device has a plurality of electrode groups, and the electrode groups correspond to the light shielding structures one by one; A voltage is applied to the electrode group, and the electrode group forms a target driving force on the driving substrate to drive the corresponding flowable light-shielding layer to switch between the initial state and the working state.

10. A display panel, characterized in that: The display panel comprises a light emitting chip and a driving substrate as claimed in any one of claims 1 to 6, wherein the light emitting chip is connected to driving electrodes in the driving substrate correspondingly to realize a display function of the display panel; or The display panel includes a light-emitting chip, a magnetic control device and a driving substrate as described in any one of claims 1 to 6, the light-emitting chip is correspondingly connected to the driving electrodes in the driving substrate to realize the display function of the display panel, and the magnetic control device is used to form a target driving force on the driving substrate to control the flowable shading layer to switch from an initial state to a working state.

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