Flexible sensing acquisition processing system and manufacturing method thereof

Abstract

The invention provides a flexible sensing acquisition processing system and a manufacturing method thereof, which not only can measure and monitor various physical and chemical parameters, but also can reduce the hardware embedding process and reduce the design difficulty and the installation difficulty under the condition of being applied to large equipment and equipment. The flexible sensing acquisition processing system comprises a flexible circuit board, a flexible chip, a passive device and a plastic package device, and the flexible chip, the passive device and the plastic package device are arranged on the surface of the flexible circuit board and are electrically connected through a circuit on the flexible circuit board.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a flexible sensor acquisition and processing system and a manufacturing method thereof. Background Art

[0002] The sensing system is a system that integrates sensors and related data processing technologies. It can measure and monitor various physical and chemical parameters and is widely used in medical, wearable devices, robots, smart homes and other fields. Although the existing sensing system can measure various parameters, it is a rigid structure. When used in large-scale equipment, hardware embedding design must be carried out in advance, which increases the difficulty of design and installation. Summary of the invention

[0003] One advantage of the present application is that it provides a flexible sensing acquisition and processing system and a method for manufacturing the same, which can not only measure and monitor various physical and chemical parameters, but also reduce the hardware embedding process and reduce the design and installation difficulty when applied to large-scale equipment.

[0004] Another advantage of the present application is to provide a flexible sensing acquisition processing system and a method for making the same, wherein in order to achieve the above advantages, no expensive materials or complex structures are required in the present application. Therefore, the solution provided by the present application can successfully and effectively solve the above problems, and not only provides a simple flexible sensing acquisition processing system and a method for making the same, but also increases the practicality and reliability of the flexible sensing acquisition processing system and a method for making the same.

[0005] Based on this, in order to achieve at least one of the above-mentioned advantages or other advantages and purposes of the present application, the present application provides a flexible sensing acquisition and processing system, including: a flexible circuit board, a flexible chip, passive components and plastic-encapsulated components, wherein the flexible chip, the passive components and the plastic-encapsulated components are arranged on the surface of the flexible circuit board and are electrically connected through the circuit on the flexible circuit board.

[0006] With such a configuration, this solution demonstrates significant technical advantages by integrating flexible circuit boards, flexible chips, passive devices, and plastic-encapsulated devices in the design of a flexible sensing acquisition and processing system. Flexible chips, passive devices, and plastic-encapsulated devices are directly mounted on the surface of the flexible circuit board and are efficiently electrically connected through a finely designed circuit, ensuring high integration and flexibility of the system. This design not only improves the adaptability and plasticity of the flexible sensing acquisition and processing system, but also optimizes the efficiency and processing rate of signal transmission.

[0007] According to one embodiment of the present application, the thickness of the flexible chip is less than or equal to 50 microns.

[0008] With such configuration, the thickness of the flexible chip in the flexible sensing acquisition and processing system is less than or equal to 50 microns. Compared with a solution in which the thickness of the flexible chip in the flexible sensing acquisition and processing system is greater than 50 microns, this solution has a smaller thickness of the flexible chip. When the flexible sensing acquisition and processing system is twisted or folded by external force, the occurrence of damage to the flexible sensing acquisition and processing system due to external forces is reduced, thereby improving the service life and quality of the flexible sensing acquisition and processing system.

[0009] According to an embodiment of the present application, the flexible sensing acquisition and processing system further includes an encapsulation layer, which is used to encapsulate the flexible circuit board, the flexible chip, the passive components and the plastic-encapsulated components.

[0010] With such a configuration, the encapsulation layer plays a key role in protecting and optimizing the performance of the flexible sensing acquisition and processing system. The encapsulation layer is used to encapsulate the flexible circuit board, flexible chip, passive components and plastic-encapsulated components, providing the system with a buffer structure for protecting the flexible circuit board, flexible chip, passive components and plastic-encapsulated components and isolating the external environment. The advantage of this design is that the encapsulation layer can effectively isolate the damage to the flexible circuit board, flexible chip, passive components and plastic-encapsulated components caused by external physical impact, chemical corrosion and environmental changes, ensuring the stable operation of the internal components.

[0011] According to an embodiment of the present application, the flexible sensing acquisition and processing system further includes a shell, which is used to cover the flexible circuit board, the flexible chip, the passive components, the encapsulation layer and the plastic-encapsulated components.

[0012] In this way, on the basis of the encapsulation layer, this solution is provided with a shell for wrapping and protecting the flexible sensing acquisition and processing system. Compared with the encapsulation layer that only encapsulates the position where the flexible chip, passive components and plastic-encapsulated components are provided on the flexible circuit board, the shell wraps all components in the flexible sensing acquisition and processing system except itself. This further enhances the waterproof, dustproof and moisture-proof capabilities of the system, improves durability and service life, that is, protects the flexible circuit board, flexible chip, passive components, encapsulation layer and plastic-encapsulated components from the influence of the external environment. In addition, the shell provides additional mechanical support, reduces the risk of damage to various internal components due to external stress, thereby improving the reliability and safety of the entire system, making it more suitable for use in high-risk and extreme environments.

[0013] According to another aspect of the present application, the present application further provides a method for manufacturing a flexible sensing acquisition and processing system, comprising the following steps:

[0014] Providing a flexible substrate;

[0015] Making a circuit on the surface of the flexible substrate to obtain a flexible circuit board;

[0016] Passive components and plastic-encapsulated components are arranged on the surface of the flexible circuit board, and the passive components and plastic-encapsulated components are electrically connected to the circuit;

[0017] A flexible chip is arranged on the surface of the flexible circuit board, and the flexible chip is electrically connected to the circuit to obtain a flexible sensing acquisition and processing system.

[0018] With such a configuration, the above-mentioned flexible sensing acquisition and processing system can be prepared through the steps described, thereby avoiding the problem that the prior art, when applied to large-scale equipment and facilities, requires advance hardware embedding design, which increases the difficulty of design and installation.

[0019] According to an embodiment of the present application, before arranging a flexible chip on the surface of the flexible circuit board and electrically connecting the flexible chip to the circuit, it also includes: pre-processing the flexible chip.

[0020] With such a configuration, pre-processing the flexible chip before electrically connecting the flexible chip to the circuit can improve the electrical and physical properties of the flexible chip, thereby improving the overall performance of the flexible sensing acquisition and processing system.

[0021] According to one embodiment of the present application, the process of preprocessing the flexible chip includes:

[0022] Thinning the flexible chip to a thickness greater than or equal to 50 microns;

[0023] Performing back-gold processing on the chip that needs to be grounded in the flexible chip;

[0024] A chip bonding film is attached to the back of the chip that does not need to be grounded in the flexible chip.

[0025] Such a configuration can make the thickness of the flexible chip less than or equal to 50 microns. Compared with the solution in which the thickness of the flexible chip in the flexible sensing acquisition and processing system is greater than 50 microns, this solution has a smaller thickness of the flexible chip. When the flexible sensing acquisition and processing system is twisted or folded by external force, it will reduce the occurrence of damage to the flexible sensing acquisition and processing system due to external forces, thereby improving the service life and quality of the flexible sensing acquisition and processing system. In addition, a layer of metal is plated on the chip that needs to be grounded through back gold treatment, thereby improving the conductivity of the flexible chip. The chip bonding film is a flexible material film, usually composed of organic or inorganic adhesives, filling materials and reinforcing materials, used to bond the chip to the substrate. The chip bonding film is attached to the back of the flexible chip that does not need to be grounded, which not only improves the reliability and stability of the system, but also simplifies the chip bonding process by using the bonding film, thereby improving production efficiency.

[0026] According to one embodiment of the present application, the process of arranging a flexible chip on the surface of the flexible circuit board includes:

[0027] The flexible chip is mounted on a preset position on the surface of the flexible circuit board by using one or more of a chip bonding film, anisotropic conductive adhesive and flexible conductive adhesive;

[0028] The flexible chip is electrically connected to the circuit through one or more of a wire bonding process, a flip chip process, and a multi-chip stacking bonding process.

[0029] With such a configuration, the flexible chip can be mounted on a preset position on the surface of the flexible circuit board by means of one or more of a chip adhesive film, anisotropic conductive adhesive and flexible conductive adhesive, and the flexible chip can be electrically connected to the circuit by means of a wire bonding process, a flip chip process and a multi-chip stacking bonding process. One or more of the wire bonding process, flip chip process and multi-chip stacking bonding process can be freely selected to electrically connect the flexible chip to the circuit according to the characteristics of the flexible sensing acquisition and processing system to be prepared, so that different flexible sensing acquisition and processing systems can be prepared according to different environments, which not only saves costs but also improves the adaptability of the flexible sensing acquisition and processing system to different use environments.

[0030] According to an embodiment of the present application, the manufacturing method further includes the following steps: encapsulating the flexible chip, the passive device and the plastic-encapsulated device with flexible silicone to form an encapsulation layer.

[0031] Such an arrangement can form an encapsulation layer to protect the flexible chip, the passive components and the plastic-encapsulated components, providing the system with a buffer structure for protecting the flexible circuit board, the flexible chip, the passive components and the plastic-encapsulated components and isolating the external environment.

[0032] According to an embodiment of the present application, after the flexible chip, the passive device and the plastic package device are encapsulated with flexible silicone, the following steps are also included:

[0033] The flexible circuit board, the flexible chip, the passive components, the encapsulation layer and the plastic-encapsulated components are injection-molded and encapsulated by using silica gel to form a shell.

[0034] In this way, on the basis of setting the encapsulation layer, the flexible circuit board, flexible chip, passive components, encapsulation layer and plastic-sealed components are injection-molded with silicone to form an outer shell, thereby enhancing the waterproof, dustproof and moisture-proof capabilities of the system, and improving durability and service life, that is, protecting the flexible circuit board, flexible chip, passive components, encapsulation layer and plastic-sealed components from the influence of the external environment.

[0035] Beneficial effects: This solution demonstrates significant technical advantages by integrating flexible circuit boards, flexible chips, passive devices, and plastic-encapsulated devices in the design of a flexible sensing acquisition and processing system. Flexible chips, passive devices, and plastic-encapsulated devices are directly mounted on the surface of the flexible circuit board, and are efficiently electrically connected through finely designed circuits, ensuring the high integration and flexibility of the system. This design not only improves the adaptability and plasticity of the flexible sensing acquisition and processing system, but also makes it more adaptable to various complex shapes and environments compared to existing rigid sensing systems, and also optimizes the efficiency of signal transmission and the processing rate. At the same time, due to the use of flexible materials, the system reduces the impact of mechanical and thermal stresses while maintaining high performance, prolongs its service life, and enhances reliability and stability. Such an architecture can be applied to application areas that require high sensitivity and adaptability to complex environments, such as wearable devices, medical monitoring systems, and intelligent robots. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 A circuit diagram of a flexible sensing acquisition and processing system provided for one embodiment of the present application;

[0038] Figure 2 A schematic flow chart of a method for manufacturing a flexible sensing acquisition and processing system provided in other embodiments of the present application;

[0039] Figure 3 A schematic flow chart of a method for manufacturing a flexible sensing acquisition and processing system provided in another embodiment of the present application.

[0040] Figure numerals: 1. Flexible sensing acquisition and processing system; 10. Flexible circuit board; 20. Flexible chip; 30. Passive components; 40. Plastic package components; 50. Encapsulation layer; 60. Housing. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0042] Considering that the existing sensor system is a hard structure, when it is applied to large-scale equipment and devices, hardware embedding design needs to be carried out in advance, which increases the difficulty of design and installation. In order to solve this problem, the present application provides a flexible sensor acquisition and processing system 1 and a manufacturing method thereof, which can not only measure and monitor various physical and chemical parameters, but also reduce the process of hardware embedding when applied to large-scale equipment and devices, thereby reducing the difficulty of design and installation.

[0043] For details, please refer to the attached Figure 1 An embodiment of the present application provides a flexible sensing acquisition and processing system 1, which may include: a flexible circuit board 10, a flexible chip 20, a passive device 30 and a plastic package device 40.

[0044] More specifically, the flexible chip 20 , the passive device 30 and the plastic package device 40 are arranged on the surface of the flexible circuit board 10 and are electrically connected through the circuit on the flexible circuit board 10 .

[0045] It should be noted that by integrating the flexible circuit board 10, the flexible chip 20, the passive device 30 and the plastic package device 40 in the design of the flexible sensing acquisition and processing system 1, significant technical advantages are shown. The flexible chip 20, the passive device 30 and the plastic package device 40 are directly mounted on the surface of the flexible circuit board 10, and are efficiently electrically connected through a finely designed circuit, ensuring the high integration and flexibility of the system. This design not only improves the adaptability and plasticity of the flexible sensing acquisition and processing system 1, but also makes the flexible sensing acquisition and processing system 1 more adaptable to various complex shapes and environments compared to the existing rigid sensing system, and also optimizes the efficiency of signal transmission and the processing rate. At the same time, due to the use of flexible materials, the system reduces the impact of mechanical stress and thermal stress while maintaining high performance, prolongs the service life, and enhances reliability and stability. Such an architecture can be applied to application fields that require high sensitivity and adaptability to complex environments, such as wearable devices, medical monitoring systems, and intelligent robots.

[0046] It is worth noting that the thickness of the flexible chip 20 is less than or equal to 50 microns.

[0047] Particularly, the thickness of the flexible circuit board 10 is 50 micrometers to 500 micrometers.

[0048] In particular, the flexible chip 20 includes but is not limited to one or more of an AD chip, an FPGA chip, a Bluetooth chip, a CPU chip, a wifi chip, a flash chip, an op amp chip, a DSP chip, an LDO chip, and a multiplexer chip; the passive device 30 includes but is not limited to one or more of a resistor, a capacitor, an inductor, a transformer, a relay, a connector, a filter, and a resonator; the plastic-encapsulated device 40 includes but is not limited to a small-sized packaged diode, a small-sized packaged transistor, and a small-sized packaged integrated circuit (IC). The flexible chip 20, the passive device 30, and the plastic-encapsulated device 40, when connected to the circuit on the flexible circuit board 10, cooperate to sample and process various external physical and chemical parameters, and send the processed data to an external terminal.

[0049] It should be noted that the material of the flexible circuit board 10 includes but is not limited to polyimide (PI), polyester (PE), polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), liquid crystal polymer (LCP), polyvinyl alcohol (PVA) and polyethylene naphthalate (PEN).

[0050] It should be noted that compared with the solution in which the thickness of the flexible chip 20 in the flexible sensing acquisition and processing system 1 is greater than 50 microns, in this solution, since the thickness of the flexible chip 20 is smaller, when the flexible sensing acquisition and processing system 1 is twisted or folded by external force, the occurrence of damage to the flexible sensing acquisition and processing system 1 due to external forces will be reduced, thereby improving the service life and quality of the flexible sensing acquisition and processing system 1.

[0051] It is worth noting that the flexible sensing acquisition and processing system 1 further includes an encapsulation layer 50 , and the encapsulation layer 50 is used to encapsulate the flexible circuit board 10 , the flexible chip 20 , the passive device 30 and the plastic package device 40 .

[0052] It should be noted that the encapsulation layer 50 plays a key role in protecting and optimizing the performance of the flexible sensing acquisition and processing system 1. The encapsulation layer 50 is used to encapsulate the flexible circuit board 10, the flexible chip 20, the passive device 30 and the plastic encapsulation device 40, and provides the system with a buffer structure for protecting the flexible circuit board 10, the flexible chip 20, the passive device 30 and the plastic encapsulation device 40 and isolating the external environment. The advantage of this design is that the encapsulation layer 50 can effectively isolate the damage to the flexible circuit board 10, the flexible chip 20, the passive device 30 and the plastic encapsulation device 40 caused by external physical impact, chemical corrosion and environmental changes, and ensure the stable operation of the internal components.

[0053] In particular, the encapsulation layer 50 includes a plurality of sub-encapsulation parts, and the plurality of sub-encapsulation parts are formed by silicone rubber with different fluidity through dam encapsulation, dispensing encapsulation or other encapsulation methods. In addition, the number of sub-encapsulation parts for encapsulating the flexible chip 20 is one or more, and when the number of the sub-encapsulation parts is multiple, the multiple encapsulation parts are overlapped with each other. This embodiment takes two sub-encapsulation parts as an example, and the silicone rubber of the sub-encapsulation part (first sub-encapsulation part) close to the flexible chip 20 has the worst fluidity, and the silicone rubber of the sub-encapsulation part (second sub-encapsulation part) far from the flexible chip 20 has better fluidity, so the hardness of the first sub-encapsulation part is harder than that of the second sub-encapsulation part.

[0054] It is worth noting that the flexible sensing acquisition and processing system 1 further includes a housing 60 , and the housing 60 is used to cover the flexible circuit board 10 , the flexible chip 20 , the passive device 30 , the encapsulation layer 50 and the plastic package device 40 .

[0055] It should be noted that, on the basis of the encapsulation layer 50, the present solution is provided with a shell 60 for wrapping and protecting the flexible sensing acquisition and processing system 1. Compared with the encapsulation layer 50 which only encapsulates the position where the flexible chip 20, the passive device 30 and the plastic-encapsulated device 40 are provided on the flexible circuit board 10, the shell 60 wraps all the devices in the flexible sensing acquisition and processing system 1 except itself. This further enhances the waterproof, dustproof and moisture-proof capabilities of the system, improves durability and service life, that is, protects the flexible circuit board 10, the flexible chip 20, the passive device 30, the encapsulation layer 50 and the plastic-encapsulated device 40 from the influence of the external environment. In addition, the shell 60 provides additional mechanical support, reduces the risk of damage to each internal device due to external stress, thereby improving the reliability and safety of the entire system, making it more suitable for use in high-risk and extreme environments.

[0056] like Figure 2 As shown, in other embodiments of the present application, a method for manufacturing a flexible sensing acquisition and processing system 1 is provided, comprising the following steps:

[0057] Providing a flexible substrate;

[0058] Making a circuit on the surface of the flexible substrate to obtain a flexible circuit board 10;

[0059] Passive components 30 and plastic-encapsulated components 40 are arranged on the surface of the flexible circuit board 10, and the passive components 30 and plastic-encapsulated components 40 are electrically connected to the circuit;

[0060] It should be noted that, in the present embodiment, in the step of arranging the passive components 30 and the plastic package components 40 on the surface of the flexible circuit board 10 , the passive components 30 , the plastic package components 40 are electrically connected to the circuit by reflow soldering.

[0061] Optionally, after the step of arranging the passive components 30 and the plastic-encapsulated components 40 on the surface of the flexible circuit board 10 , the method further includes the following step: cleaning the flexible circuit board 10 .

[0062] It should be noted that cleaning the flexible circuit board 10 can remove impurities (such as welding slag, flux residue, oxides, etc.) remaining after welding. Cleaning impurities remaining after welding, such as welding slag, flux residue and oxides, is a key step to ensure the performance and reliability of electronic equipment. These impurities will not only reduce the resistance of the circuit, affect the efficiency and quality of signal transmission, but also may cause short circuits between wires or components on the circuit board, thereby affecting the stable operation of the entire circuit. In addition, impurities on the surface of the welding point will form stress concentration points, weaken the mechanical strength and durability of the welding point, and then cause corrosion problems and shorten the service life of the equipment. Cleaning these impurities can significantly improve the electrical performance of electronic equipment, reduce resistance, prevent short circuits, enhance mechanical strength, and extend the service life of the equipment. Although this process seems simple, it is an indispensable part of ensuring the efficient, stable and durable operation of electronic equipment.

[0063] A flexible chip 20 is arranged on the surface of the flexible circuit board 10 , and the flexible chip 20 is electrically connected to the circuit to obtain a flexible sensing acquisition and processing system 1 .

[0064] It is worth noting that the above-mentioned flexible sensing acquisition and processing system 1 can be prepared through the steps described, thereby avoiding the problem that the prior art needs to carry out hardware embedding design in advance when applied to large-scale equipment and facilities, which increases the difficulty of design and installation.

[0065] It is worth noting that Figure 3 As shown, before a flexible chip 20 is arranged on the surface of the flexible circuit board 10 and the flexible chip 20 is electrically connected to the circuit, the flexible chip 20 is also pre-processed to improve the overall performance of the flexible sensing acquisition and processing system 1. The process of pre-processing the flexible chip 20 includes: thinning the flexible chip 20 to a thickness greater than or equal to 50 microns; performing back gold processing on the chip that needs to be grounded in the flexible chip 20; and attaching a chip bonding film to the back of the chip that does not need to be grounded in the flexible chip 20.

[0066] It should be noted that the thickness of the flexible chip 20 can be less than or equal to 50 microns. Compared with the solution in which the thickness of the flexible chip 20 in the flexible sensing acquisition processing system 1 is greater than 50 microns, the thickness of the flexible chip 20 in this solution is smaller. When the flexible sensing acquisition processing system 1 is twisted or folded by external force, the occurrence of damage to the flexible sensing acquisition processing system 1 due to external forces will be reduced, thereby improving the service life and quality of the flexible sensing acquisition processing system 1. In addition, a layer of metal is plated on the chip that needs to be grounded through back gold processing, thereby improving the conductivity of the flexible chip 20. The metal With extremely low resistivity, back-metal treatment can significantly improve the electrical conductivity of the flexible chip 20, which is particularly important for high-frequency and high-speed electronic devices, and enhance the thermal conductivity of the flexible chip 20: metal is a thermal conductor with good thermal conductivity, which can help the flexible chip 20 dissipate heat more effectively and prevent overheating from affecting device performance and life. In addition, metal has high stability in a variety of chemical environments, which can prevent the flexible chip 20 from corrosion and oxidation, thereby protecting the internal circuit of the flexible chip 20. In addition, the metal layer can also act as a barrier to protect the flexible chip 20 from physical damage, such as scratches or cracks. Chip bonding film is a flexible material film, usually composed of organic or inorganic adhesives, fillers and reinforcing materials. It is pre-cut into specific shapes and sizes and is used to bond the chip to the substrate. The chip bonding film is attached to the back of the flexible chip 20 that does not need to be grounded. This not only improves the reliability and stability of the system: the strong bonding ensures that the device can operate stably in harsh environments such as high temperature, high humidity and vibration, but also simplifies the process: the use of bonding film simplifies the chip bonding process and improves production efficiency. In addition, through customized design, bonding films of different materials and different thicknesses can be designed, so that the flexible sensing acquisition and processing system 1 can meet the needs of various specific applications.

[0067] It is worth noting that Figure 3 As shown, the process of arranging the flexible chip 20 on the surface of the flexible circuit board 10 includes:

[0068] The flexible chip 20 is mounted on a preset position on the surface of the flexible circuit board 10 by using one or more of a chip bonding film, anisotropic conductive adhesive and flexible conductive adhesive;

[0069] The flexible chip is electrically connected to the circuit through one or more of a wire bonding process, a flip chip process, and a multi-chip stacking bonding process.

[0070] It should be noted that the flexible chip 20 can be mounted on a preset position on the surface of the flexible circuit board 10 by means of one or more of a chip adhesive film, anisotropic conductive adhesive and flexible conductive adhesive, and the flexible chip can be electrically connected to the circuit by means of a wire bonding process, a flip chip process, or a multi-chip stacking bonding process. The wire bonding process is a chip connection technology that is widely used in the packaging of various semiconductors. It connects the pads on the chip with the pads on the substrate using metal wires (usually gold, copper or aluminum). It can be applied to various packaging forms, such as DIP, QFP, BGA, etc., and has high flexibility. The lead length and shape can be adjusted to meet different packaging requirements, but it is easily affected by mechanical stress and vibration, and its reliability is relatively low. The flip chip process is a direct connection technology. By placing the chip upside down on the substrate, the pads on the chip are directly facing the pads on the substrate, and the connection is made through welding balls or conductive columns to connect the chip and the substrate, so that the transmission path of the signal is shorter, thereby reducing signal delay and electromagnetic interference, and improving device performance. In addition, the flip chip process can also make the system compact and suitable for high-density packaging. However, the flip chip process is relatively complex and costly, and the flip chip process is prone to stress during the thermal cycle, requiring the system to have good thermal management and design. The multi-chip stacking bonding process is an advanced packaging technology that achieves high-density integration and multi-functional integration by vertically stacking multiple chips in a package. The system can achieve higher integration density through vertical stacking, thereby saving space, and can improve the overall system performance by optimizing the connection and signal path between chips. However, the multi-chip stacking technology requires high-precision manufacturing processes and high costs, and vertically stacking chips will increase the difficulty of heat dissipation, requiring effective thermal management design. According to the characteristics of the flexible sensing acquisition and processing system 1 to be prepared, one or more of the wire bonding process, flip chip process, and multi-chip stacking bonding process can be freely selected to electrically connect the flexible chip 20 to the circuit, so that different flexible sensing acquisition and processing systems 1 can be prepared according to different environments, which not only saves costs but also improves the adaptability of the flexible sensing acquisition and processing system 1 to different usage environments.

[0071] It is worth noting that Figure 3 As shown, the manufacturing method further includes the following steps: using flexible silicone to encapsulate the flexible chip 20, the passive device 30 and the plastic encapsulation device 40. In this way, an encapsulation layer 50 can be formed to protect the flexible chip 20, the passive device 30 and the plastic encapsulation device 40, and provide a buffer structure for protecting the flexible circuit board 10, the flexible chip 20, the passive device 30 and the plastic encapsulation device 40 and isolating the external environment.

[0072] In particular, the flexible chip 20, the passive device 30 and the plastic package device 40 are encapsulated by using flexible silicone, specifically:

[0073] Encapsulating the area including the flexible chip 20 and the connection circuits between the flexible chips 20 by damming;

[0074] Performing glue dispensing and encapsulation on the area including the flexible chip 20 and the connection circuits between the flexible chips 20;

[0075] Perform pin encapsulation on the passive device 30 and the plastic package device 40;

[0076] The entire circuit on the flexible circuit board 10 is enclosed by a dam.

[0077] It should be noted that the connection circuits between the flexible chips 20 include but are not limited to leads connecting the flexible chips 20, solder balls or conductive columns connecting the flexible chips 20, and necessary plastic packaging devices 40 and / or passive devices 30 between chips.

[0078] In particular, after the flexible chip 20, the passive device 30 and the plastic package device 40 are encapsulated with the flexible silicone, the following steps are also included: silicone leveling. When silicone is applied to various surfaces, it can fill the depressions and unevenness of the surface of the object to be covered through its own fluidity. This leveling property not only enables the silicone to quickly and evenly cover the entire surface, but also ensures that the final coating is as smooth as a mirror, reducing the generation of bubbles and defects. In the encapsulation of electronic components, the leveling effect of silicone can ensure that the material can completely cover and protect every tiny corner, prevent the intrusion of moisture, dust and mechanical shock, and improve the reliability and service life of the equipment.

[0079] It is worth noting that Figure 3 As shown, after the flexible chip 20, the passive device 30 and the plastic package device 40 are encapsulated by using flexible silicone, the following steps are also included:

[0080] The flexible circuit board 10 , the flexible chip 20 , the passive device 30 , the encapsulation layer 50 and the plastic encapsulation device 40 are injection-molded by using silica gel to form a housing 60 .

[0081] It should be noted that, on the basis of setting the encapsulation layer 50, the flexible circuit board 10, the flexible chip 20, the passive device 30, the encapsulation layer 50 and the plastic-encapsulated device 40 are injection-molded with silicone to form a shell 60, thereby enhancing the waterproof, dustproof and moisture-proof capabilities of the system, and improving durability and service life, that is, protecting the flexible circuit board 10, the flexible chip 20, the passive device 30, the encapsulation layer 50 and the plastic-encapsulated device 40 from the influence of the external environment.

[0082] It is worth noting that other embodiments of the present application further provide a data acquisition and processing device, which includes: the above-mentioned flexible sensing acquisition and processing system 1 and an external terminal.

[0083] Working process: The flexible sensing acquisition and processing system 1 is arranged on the external object where the data is to be sampled, and is used to measure and monitor various physical and chemical parameters, and to perform noise reduction and filtering processing on the collected parameter signals, and then the processed parameter signals are sent to an external terminal, and the terminal stores or uses the parameter signals after noise reduction and filtering processing.

[0084] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0085] In addition, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or equipment.

[0086] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0087] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0088] The technical features of the above embodiments can be combined without changing the basic principles of the present application. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A flexible sensing acquisition and processing system, characterized in that: include: A flexible circuit board, a flexible chip, a passive component and a plastic-encapsulated component, wherein the flexible chip, the passive component and the plastic-encapsulated component are arranged on the surface of the flexible circuit board and are electrically connected through the circuit on the flexible circuit board.

2. The flexible sensing acquisition and processing system according to claim 1 is characterized in that: The thickness of the flexible chip is less than or equal to 50 microns.

3. The flexible sensing acquisition and processing system according to claim 1 is characterized in that: The flexible sensing collection and processing system also includes an encapsulation layer, which is used to encapsulate the flexible circuit board, the flexible chip, the passive components and the plastic-encapsulated components.

4. The flexible sensing acquisition and processing system according to claim 3 is characterized in that: The flexible sensing collection and processing system also includes a shell, which is used to cover the flexible circuit board, the flexible chip, the passive components, the encapsulation layer and the plastic-encapsulated components.

5. A manufacturing method for preparing the flexible sensing acquisition and processing system as claimed in any one of claims 1 to 4, characterized in that: The following steps are involved: Providing a flexible substrate; Making a circuit on the surface of the flexible substrate to obtain a flexible circuit board; Passive components and plastic-encapsulated components are arranged on the surface of the flexible circuit board, and the passive components and plastic-encapsulated components are electrically connected to the circuit; A flexible chip is arranged on the surface of the flexible circuit board, and the flexible chip is electrically connected to the circuit to obtain a flexible sensing acquisition and processing system.

6. The method according to claim 5, characterized in that: Before arranging a flexible chip on the surface of the flexible circuit board and electrically connecting the flexible chip to the circuit, the method further includes: pre-processing the flexible chip.

7. The manufacturing method according to claim 6, characterized in that: The process of pre-processing the flexible chip includes: Thinning the flexible chip to a thickness greater than or equal to 50 microns; Performing back-gold processing on the chip that needs to be grounded in the flexible chip; A chip bonding film is attached to the back of the chip that does not need to be grounded in the flexible chip.

8. The manufacturing method according to claim 5, characterized in that: The process of arranging a flexible chip on the surface of the flexible circuit board includes: The flexible chip is mounted on a preset position on the surface of the flexible circuit board by using one or more of a chip bonding film, anisotropic conductive adhesive and flexible conductive adhesive; The flexible chip is electrically connected to the circuit through one or more of a wire bonding process, a flip chip process, and a multi-chip stacking bonding process.

9. The manufacturing method according to claim 5, characterized in that: The manufacturing method further comprises the following steps: encapsulating the flexible chip, the passive device and the plastic-encapsulated device with flexible silicone to form an encapsulation layer.

10. The manufacturing method according to claim 9, characterized in that: After the flexible chip, the passive device and the plastic package device are encapsulated by the flexible silicone, the following steps are also included: The flexible circuit board, the flexible chip, the passive device, the encapsulation layer and the plastic-encapsulated device are injection-molded and encapsulated by using silica gel to form a shell.

Images