Substrate operating system, method and device

Abstract

A substrate handling system includes a stationary deposition ring; a moving deposition ring disposed above the fixed deposition ring and configured to move vertically; and a plurality of circumferentially spaced conductive ground plates disposed vertically between the fixed deposition ring and the moving deposition ring, each ground plate extending from a radially inner end to a radially outer end, each ground plate configured for vertical movement relative to the fixed deposition ring, and each ground plate having an electrical contact at the radially inner end.

Description

Technical Field

[0001] Embodiments of the present disclosure relate generally to substrate transport, and more particularly to systems, methods, and apparatus for handling and grounding substrates. Background Art

[0002] Substrate processing equipment generally includes a processing chamber configured to perform certain processes on a substrate, such as chemical vapor deposition (CVD), atomic layer deposition (ALD), etching, etc. The substrate handling mechanism within the processing chamber uses an insulating ring to transfer the substrate. Such a substrate handling mechanism does not provide a method for grounding and releasing the substrate.

[0003] Accordingly, the inventors provide embodiments of improved substrate handling systems, methods and apparatus as disclosed herein. Summary of the invention

[0004] Systems, methods, and apparatus for operating a substrate are provided herein. In some embodiments, the substrate operating system includes a fixed deposition ring; a mobile deposition ring disposed above the fixed deposition ring and configured to move vertically; and a plurality of circumferentially spaced conductive ground plates disposed vertically between the fixed deposition ring and the mobile deposition ring, each ground plate extending from a radially inner end to a radially outer end, each ground plate configured to move vertically relative to the fixed deposition ring, and each ground plate having an electrical contact at the radially inner end.

[0005] In some embodiments, a grounding member for grounding a substrate includes a grounding plate, which includes: a base configured to be positioned on a lifting pin; an intermediate member extending horizontally from the base to a second end spaced apart from the base; and a contact extending vertically from the intermediate member to a position above the base, wherein the grounding plate is conductive.

[0006] Other and further embodiments of the disclosure are described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the present disclosure briefly summarized above and discussed in more detail below may be understood by reference to the illustrative embodiments of the present disclosure depicted in the accompanying drawings. However, the drawings illustrate only typical embodiments of the present disclosure and are therefore not to be considered limiting of scope, as the present disclosure may admit to other equally effective embodiments.

[0008] Figure 1 is an isometric view of a substrate handling system in accordance with at least one embodiment of the present disclosure.

[0009] Figure 2 yes Figure 1 The substrate operating system along Figure 1 Section view of section AA in.

[0010] Figure 3 is an isometric view of a ground plate of a substrate handling system in accordance with at least one embodiment of the present disclosure.

[0011] Figure 4 is an isometric view (viewed from the bottom) of a stationary deposition ring and a mobile deposition ring of a substrate handling system according to at least one embodiment of the present disclosure.

[0012] Figure 5 Yes Figure 4 An isometric view of the moving deposition ring is shown with the stationary ring removed for clarity of illustration.

[0013] Figure 6 yes Figure 2 An enlarged cross-sectional view of the portion marked “A” in FIG.

[0014] Figure 7 Yes Figure 6 Plan view of the portion shown.

[0015] Figure 8 Yes Figure 6 Front view of the portion shown.

[0016] Fig. 9 is a partial cross-sectional view of a substrate handling system configured in a processing position according to at least one embodiment of the present disclosure.

[0017] Fig.10 A substrate handling system is shown having a substrate support and lift pins in a first relative position in accordance with at least one embodiment of the present disclosure.

[0018] Fig.11 Shows Fig.10 A substrate handling system wherein the substrate support and the lift pins are in a second relative position.

[0019] Fig.12 Shows Fig.10 A substrate handling system wherein the substrate support and the lift pins are in a third relative position.

[0020] Fig.13 The following is an example of at least one embodiment according to the present disclosure. Figure 6 An alternative baseboard operating system to the baseboard operating system shown.

[0021] Fig.14A An isometric component view of a substrate handling system in accordance with at least one embodiment of the present disclosure is shown.

[0022] Fig. 14B Shown assembled and constructed in original position Fig.14A Baseboard operating system.

[0023] Fig.15 Shows the ground ring viewed from the side and top Fig.14A and Fig. 14B An isometric view of the grounding ring of the baseboard handling system is shown.

[0024] Fig.16 Shows the ground ring viewed from the side and bottom Fig.15 Isometric view of a grounding ring.

[0025] Fig.17 It shows that Fig.14A and Fig. 14B An isometric view of a moving deposition ring of a substrate handling system is shown.

[0026] Fig.18 Shown is located Fig.15 and Fig.16 The grounding ring Fig.17 Isometric view of the moving deposition ring.

[0027] Fig.19 yes Fig.18 An enlarged isometric view of the portion marked "B".

[0028] Fig. 20 yes Fig.18 An enlarged isometric view of the portion marked “C” in FIG.

[0029] Fig.21 yes Fig.18 Detailed view of the section marked “D” in FIG.

[0030] Fig. 22 is along Fig.21 Cross-sectional view of section CC.

[0031] Fig.23 Yes Fig. 14B A view of the substrate handling system along section DD is shown.

[0032] Fig.24 Yes Fig. 14B An enlarged elevational view of the portion of the substrate handling system marked "E" is shown.

[0033] For ease of understanding, the same reference numerals are used, where possible, to represent the same elements common to the drawings. These figures are not drawn to scale and may be simplified for clarity. The elements and features of one embodiment may be beneficially incorporated into other embodiments without further elaboration. DETAILED DESCRIPTION

[0034] Embodiments of substrate handling systems, apparatuses, and methods are provided herein to facilitate grounding of a substrate being conveyed along an outer edge of the substrate. The substrate handling system is configured to discharge charge remaining on the substrate as the substrate is transferred to or from a substrate support such as an electrostatic chuck.

[0035] Figure 1 is an isometric view of a substrate handling system 100 in accordance with at least one embodiment of the present disclosure. Figure 2 yes Figure 1 The substrate operating system 100 along Figure 1 In some embodiments, the substrate handling system 100 includes a substrate support 102 having a substrate supporting surface 104 ( Figure 6 ). In some embodiments, the substrate support surface 104 may be part of an electrostatic chuck. In some embodiments, the substrate support surface 104 may have an area slightly smaller than the area of ​​the substrate 106, such that the outer edge of the substrate 106 protrudes from the outer edge of the substrate support surface 104, for example Figure 6 shown.

[0036] In some embodiments, and as Figure 2 As shown, the substrate handling system 100 may include a stationary deposition ring 108 located on a substrate support 102. The stationary deposition ring 108 may be located on an annular surface 210 of the substrate support 102 adjacent to the substrate supporting surface 104. In some embodiments, the stationary deposition ring 108 may be non-conductive. For example, in some embodiments, the stationary deposition ring 108 may be made of ceramic.

[0037] In some embodiments, and as Figure 2 As shown, the substrate handling system 100 may include a mobile deposition ring 112, which is configured to be disposed on the fixed deposition ring 108 and can move vertically relative to the fixed deposition ring. In some embodiments, the mobile deposition ring 112 may be non-conductive. For example, in some embodiments, the mobile deposition ring 112 may be made of ceramic.

[0038] In some embodiments, and as Figure 1 As shown, the substrate handling system 100 may include one or more grounding elements 115. In some embodiments, the grounding elements 115 include a plurality of circumferentially spaced grounding plates 114, each grounding plate 114 having a portion disposed between the fixed deposition ring 108 and the movable deposition ring 112. As discussed in more detail below, in some embodiments, each grounding plate 114 may include a contact 320 ( Figure 3), the contact 320 is configured to extend adjacent to and contact the bottom surface of the substrate 106 supported on the substrate support surface 104. In some embodiments, the ground plate 114 can be conductive. For example, in some embodiments, the ground plate can be made of metal in whole or in part, such as aluminum.

[0039] In some embodiments, and as Figure 1 and Figure 2 As shown, the substrate handling system 100 may include a plurality of lift pins 116 that are circumferentially spaced apart from one another and surround the substrate support 102 and are located below the ground plate 114 to operably support the ground plate 114 in at least one configuration of the substrate handling system 100. In some embodiments, the lift pins 116 may be conductive so that a conductive path may be formed between the ground plate 114 and the lift pins 116. In some embodiments, the lift pins 116 may be made of metal in whole or in part, such as aluminum. Thus, in a configuration of the substrate handling system 100 in which the contacts 320 of the ground plate 114 engage the substrate 106 and the lift pins 116 engage the ground plate 114, the charge on the substrate 106 may be discharged via the ground plate 114 and the lift pins 116.

[0040] In some embodiments, the substrate handling system 100 can be configured to ground the substrate 106 while operating the substrate 106. For example, Figure 1 and Figure 2 As shown, the substrate handling system 100 can be configured in a first configuration, wherein the lift pins 116 and the substrate support 102 are relatively positioned in a first position, which can be referred to as a "home position", wherein the lift pins 116 are not in contact with the ground plate 114. In the first configuration, the ground plate 114, the mobile deposition ring 112, and the fixed deposition ring 108 can be supported only by the substrate support 102. As discussed in more detail below, the lift pins 116 can be lifted together by lifting a hoop or ring 118 connected to the lower end of the lift pins 116 so that the lift pins 116 can contact the ground plate 114 to reconfigure the substrate handling system 100 into a second configuration. Further lifting the lift pins 116 upward relative to the substrate support 102 can lift the ground plate 114, the mobile deposition ring 112, and the substrate 106 (if present on the substrate support surface 104) away from the fixed deposition ring 108.

[0041] In some embodiments, and as Figure 3As shown, each ground plate 114 may include a base 322 having a lower end 322a and an upper end 322b, an intermediate member 324 extending substantially horizontally from a first end 324a of the intermediate member 324 to a second end 324b thereof from the upper end 322b, and a contact 320 extending upward from the second end 324b of the intermediate member 324 above the upper end 322b of the base 322. In some embodiments, as Figure 3 As shown, the intermediate member 324 can be substantially planar and have a substantially constant thickness between the first end 324a and the second end 324b. Figure 3 As shown, the intermediate member 324 can have a width W between the side surfaces 324c, which tapers radially inward toward the second end 324b. Figure 3 As shown, the intermediate member 324 may include a protrusion 324d extending from the side 324c and configured to rest on the upper surface 808 of the fixed deposition ring 108, as shown in FIG. Figure 8 In some embodiments, and as Figure 6 and Figure 8 As shown, the lower end 322 a of the base 322 may be configured to rest on a corresponding lift pin 116 .

[0042] As described above, in some embodiments, the ground plate 114 is conductive and can be made of metal in whole or in part. More specifically, in some embodiments, the ground plate 114 is configured to conduct electricity from the contact 320 to the lower end 322a of the base 322, so that when the lower end 322a of the base 322 contacts the lift pin 116, the conductive path will extend from the contact 320 to the lift pin 116.

[0043] In some embodiments, and as Figure 3 and Figure 6 As shown, the contact 320 may have a contact surface 320a configured to engage the bottom surface 606 of the substrate 106. The contact surface 320a may take a variety of forms. For example, in some embodiments, and as shown in FIG. Figure 3 As shown, the contact surface 320a can be planar and can have an elliptical shape. In some embodiments, the contact surface 320a can have other shapes, such as a circle or a polygon. In addition, in some embodiments, the contact surface can be curved, such as a hemispherical shape.

[0044] In some embodiments, and as Figure 4 and Figure 5 As shown, the fixed deposition ring 108 and the mobile deposition ring 112 may have one or more alignment features, such as for vertical, axial and / or radial alignment between the fixed deposition ring 108, the mobile deposition ring 112 and the ground plate 114. For example, in some embodiments, and as shown in Figure 4 and Figure 5 As shown, the fixed deposition ring 108 may include arcuate ribs 428, and the mobile deposition ring 112 may include a plurality of arcuate ribs 530 configured to be positioned adjacent to the arcuate ribs 428 to facilitate axial and radial alignment of the mobile deposition ring 112 with the fixed deposition ring 108 along the central axis A. In addition, in some embodiments, and as shown Figure 4 As shown, the stationary deposition ring 108 can have an outer edge 432 that includes a plurality of radially extending notches 434 that are circumferentially spaced apart from one another. In some embodiments, each notch 434 is sized and configured to receive the base 322 of a corresponding one of the ground plates 114, as discussed in more detail below.

[0045] In some embodiments, and as Figure 5 As shown, the mobile deposition ring 112 can have a generally arcuate shape. Figure 5 As shown, the mobile deposition ring 112 may include a plurality of circumferentially spaced grooves 536 extending radially from an outer end 536a to an inner end 536b along the bottom surface 512 of the mobile deposition ring 112. Figure 5 As shown, each groove 536 can taper radially inward. In some embodiments, and as Figure 8 As shown, each groove 536 can be configured to receive at least the intermediate member 324 of the corresponding ground plate 114. In some embodiments, and as shown in FIG. Figure 5 As shown, the outer end 536a of the groove 536 can extend to the outer edge 514 of the moving deposition ring 112, and the inner end 536b of the groove 536 can be separated from the inner edge 516 of the moving deposition ring 112 by a notch 540 formed in the inner edge 516, and the notch 540 is configured to receive the contact 320 of one of the plurality of ground plates 114, as discussed in more detail below, and as shown in FIG. Figure 6 and Figure 7 In some embodiments, as shown in Figure 7 As shown, each notch 540 is radially aligned with a corresponding groove 536. In some embodiments, as shown in FIG. Figure 7 As shown, each groove 536 of the mobile deposition ring 112 can be configured to be radially aligned with a corresponding notch 434 of the fixed deposition ring 108. Figure 7 As shown, each groove 536 and / or notch 540 of the mobile deposition ring 112 may be configured to be radially aligned (along centerline BB) with a corresponding notch 434 of the stationary deposition ring 108 .

[0046] In some embodiments, and as Figure 6As shown, the stationary deposition ring 108 may be located on an annular surface 210 of the substrate support 102 that surrounds the substrate supporting surface 104. Figure 6 As shown, the intermediate member 324 of the ground plate 114 can be located on the fixed deposition ring 108, and the mobile deposition ring 112 can be located above the ground plate 114, and the intermediate member 324 of the ground plate 114 is received in the groove 536 of the mobile deposition ring 112. In some embodiments, and as Figure 6 and Figure 8 As shown, the mobile deposition ring 112 can be located on at least one of the plurality of ground plates 114 or the fixed deposition ring 108 along an area surrounding the side surface 324c of the ground plate 114. In addition, in some embodiments, and as shown in FIG. Figure 6 and Figure 7 As shown, when the ground plate 114 is received in the groove 536, the contact 320 can extend upward in the notch 540 formed in the moving deposition ring 112 in the space adjacent to the substrate support surface 104. In some embodiments, and as shown in FIG. Figure 6 As shown, the contact surface 320a can extend slightly (e.g., approximately 0.1 mm to 0.2 mm) above the substrate support surface 104 so that the contact surface 320a engages the bottom surface 606 of the substrate 106 (if present on the substrate support surface 104). In addition, in some embodiments, and as shown in FIG. Figure 6 As shown, the contact point 320 may be radially spaced from the substrate supporting surface 104 by the inner edge 516 of the mobile deposition ring 112 .

[0047] In some embodiments, and as Figure 6 As shown, each lift pin 116 may have a support surface 650 extending radially between an outer end 650a and an inner end 650b. Each ground plate 114 has a center of gravity 652 located above the support surface 650 of the lift pin 116. In some embodiments, and as shown in FIG. Figure 7 As shown, the center of gravity 652 of the ground plate 114 is located between the protrusions 324d along the centerline BB. Figure 8 As shown, the lower end 322 a of the base 322 may have a recess 854 to receive the support surface 650 of the lift pin 116 .

[0048] In some embodiments, and as Figure 8 As shown, the width of each groove 536 can be slightly larger than the width W of the intermediate member 324 of the ground plate 114. For example, the gap between the side 324c of the intermediate member 324 and the side of the groove 536 can be about 0.5 mm. Such a gap can be provided to allow for thermal expansion of the ground plate 114 in the groove 536.

[0049] In some embodiments, and as Figure 8 As shown, the recess 434 of the stationary deposition ring 108 may be vertically tapered (eg, having vertically tapered sidewalls) to facilitate alignment of the base 322 of the ground plate 114 within the recess 434. Additionally, in some embodiments, and as shown Figure 8 As shown, a gap can be provided between each notch 434 and the side of the base 322 of the ground plate 114. In some embodiments, the gap can be at least about 0.5 mm. In addition, in some embodiments, and as shown in FIG. Figure 8 As shown, the protrusion 324 d may be located on the upper surface 808 of the stationary deposition ring 108 on the opposite side of the recess 434 .

[0050] In some embodiments, and as Figure 3 and Fig. 9 As shown, the ground plate 114 may have an outwardly inclined surface 360, which is configured to be inclined when the substrate handling system 100 is in a position such as Fig. 9 In the illustrated processing position, the outwardly inclined surface 360 ​​extends substantially parallel to a surface 974 of a protrusion 972 of the cover plate 970. The parallel inclined surfaces 974 and 360 may be configured to facilitate radial alignment and centering of the cover plate 970 relative to the mobile deposition ring 112 and the stationary deposition ring 108.

[0051] In some embodiments, and as Figure 10-12 As shown, the substrate handling system 100 can be reconfigured by changing the relative position of at least one lift pin 116 or substrate support 102. In some embodiments, and as Fig.10 and Fig.12 As shown, the substrate handling system 100 can be in a first configuration in which the lift pins 116 are not in electrical contact with the ground plate 114 and in a Fig.11 In the second configuration, the substrate handling system 100 may be in the second configuration, wherein the lift pins 116 are in electrical contact with the ground plate 114. Fig.10 and Fig.12 In FIG. 1 , the ground plate 114, the fixed deposition ring 108, and the movable deposition ring 112 are all supported separately by the substrate support 102, while in FIG. Fig.11 In the embodiment, the ground plate 114 and the moving deposition ring 112 are supported by lift pins 116 . Fig.10 1 shows the original position of the substrate support 102 and lift pins 116, which are slightly spaced below the ground plate 114. Fig.10 The arrangement shown is as follows Fig.11 In the arrangement shown, the lift pins 116 may be raised and the substrate support 102 may be lowered, causing the lift pins 116 to contact and lift the ground plate 114, which in turn may lift the moving deposition ring 112 vertically away from the fixed deposition ring 108 to a transfer position. Fig.11In the transfer position shown, the substrate 106 can be loaded onto or removed from the moving deposition ring 112. Fig.11 The arrangement shown is as follows Fig.12 In the arrangement shown, the substrate support 102 may be raised and the lift pins 116 lowered to a processing position where the substrate support 102 supports the substrate 106 along with the stationary deposition ring 108, the mobile deposition ring 112, and the ground plate 114. Substrate processing may be performed in the processing position.

[0052] In some embodiments, and as Fig. 9 As shown, the contacts 320 of the ground plate can be configured to engage the bottom surface 606 of the substrate 106 in the processing position. However, for some processes that occur in a processing chamber, electrical contact with the substrate 106 during processing is undesirable. Therefore, in some embodiments, the substrate handling system 100 can be configured so that the contacts 320 of the ground plate 114 do not contact the substrate 106 in the processing position. For example, Fig.13 It shows that Figure 6 A modification of the portion of the substrate handling system 100 is shown in which the mobile deposition ring 112 is configured to be located on the fixed deposition ring 108 in a spaced relationship with the ground plate 114. Fig.12 In the illustrated embodiment, the mobile deposition ring 112 is located on the fixed deposition ring 108, rather than on the ground plate 114 in the processing position, such that a gap 1380 is created between the ground plate 114 and the mobile deposition ring 112. In some embodiments, the gap 1380 may be approximately 0.2 mm. As a result of the gap 1380, when the lift pins 116 engage the ground plate 114 and lift the ground plate 114 at least via the gap 1380, the contact 320 may be vertically spaced below the substrate support surface 104 to contact the substrate 106.

[0053] Fig.14A and Fig. 14B An isometric view of a substrate handling system 1400 according to at least one embodiment of the present disclosure is shown. In some embodiments, the substrate handling system 1400 includes lift pins 1416, a mobile deposition ring 1412, a fixed deposition ring 1408, and a grounding element 1415 (hereinafter referred to as a "grounding ring"), which includes a plurality of grounding plates 1414 connected together by at least one arc-shaped member 1413. The grounding plates 1414 play the same role as the grounding plates 114 described herein, namely, to create a conductive path between a substrate (e.g., substrate 106) on a substrate supporting surface (e.g., substrate supporting surface 104) and the lift pins 1416. In some embodiments, the grounding plates 1414 and the arc-shaped members 1413 are formed of a conductive material such as stainless steel.

[0054] In some embodiments, grounding ring 1415 and mobile deposition ring 1412 are configured to move relative to fixed deposition ring 1408. In addition, in at least one configuration, and as Fig. 14B As shown, the mobile deposition ring 1412 and the grounding ring 1415 are configured to be located on the fixed deposition ring 1408 to form an annular assembly around the central axis A to support a substrate, such as the substrate 106, around the outer edge of the substrate. In some embodiments, and as described in further detail below, the mobile deposition ring 1412 and the grounding ring 1415 are configured to be connected to limit relative movement between the mobile deposition ring 1412 and the grounding ring 1415.

[0055] In some embodiments, and as Fig.14A As shown, the stationary deposition ring may have a plurality of notches 1420 formed along an outer edge 1422 for allowing the lift pins 1416 to move axially beneath the ground plate 1414 .

[0056] In some embodiments, and as Fig.15 As shown, each grounding plate 1414 may have a base 1522 configured to contact a corresponding lift pin 1416. In addition, each grounding plate 1414 may have a contact 1520 configured to extend to and contact a bottom surface of a substrate (e.g., substrate 106) when the mobile deposition ring 1412 and the grounding ring 1415 are located on the fixed deposition ring 1408. Fig. 14B shown.

[0057] Each ground plate 1414 can have an intermediate member 1532 that separates the base 1522 from the contact 1520. In some embodiments, and as Fig.15 and Fig.16 As shown, the base 1522 and the intermediate member can have substantially flat upper and lower surfaces and can be coplanar. Fig.15 As shown, each ground plate 1414 can extend radially inward (relative to the central axis A) from the base 1522 to the contact 1520. In some embodiments, and as shown in FIG. Fig.15 As shown, each ground plate 1414 may have a width W that tapers radially from the base 1522 to the contact 1520 .

[0058] In some embodiments, and as Fig.15 As shown, the grounding ring 1415 may have a raised outer edge 1524. In addition, in some embodiments, and as shown Fig.15As shown, the raised outer edge 1524 may also extend radially inwardly along the ends 1526 of the grounding ring 1415 and wrap around the inner edge 1528 of the grounding ring 1415 to form a notch 1530 at each end 1526 .

[0059] In some embodiments, and as Fig.17 As shown, the mobile deposition ring 1412 can have a generally arcuate shape and can have an inner edge 1716 and an outer edge 1714. The inner edge 1716 can have a space 1718 configured to be aligned with the outer edge 1714. Fig. 14B The portion 1410 of the fixed deposition ring 1408 shown is aligned with and receives the portion 1410 thereof. Fig.17 As shown, the mobile deposition ring 1412 may include a plurality of circumferentially spaced notches 1740 along the inner edge 1716. The notches 1740 may be configured to receive corresponding contacts 1520 of the grounding plate 1414 when the mobile deposition ring 1412 is located on the grounding ring 1415, as shown in FIG. Figure 18-Figure 20 In some embodiments, the bottom surface of the mobile deposition ring 1412 may include a plurality of circumferentially spaced grooves, such as the grooves 536 described above, to receive corresponding ground plates 1414.

[0060] Furthermore, in some embodiments, and as Figure 18-Figure 20 , when the mobile deposition ring 1412 is positioned on the grounding ring 1415, the outer edge 1714 can extend along (e.g., be closely spaced or in contact with) the raised outer edge 1524 of the grounding ring 1415. In some embodiments, and as most clearly shown in FIGS. 19-20, the mobile deposition ring 1412 can have a protrusion 1910 formed at each end 1920 of the mobile deposition ring 1412. In some embodiments, and as shown in Fig.19 and Fig. 20 As shown, each protrusion 1910 can be received in a corresponding recess 1530 formed in the end 1526 of the grounding ring 1415. In some embodiments, the protrusions 1910 and recesses 1530 can be configured using, for example, a "tongue and groove" arrangement (e.g., Fig.19 and Fig. 20 The projections 1910 and the recesses 1530 are configured to limit relative rotation about the central axis A between the mobile deposition ring 1412 and the grounding ring 1415 .

[0061] In some embodiments, and as Fig.21 and Fig. 22As shown, the mobile deposition ring 1412 and the grounding ring 1415 can be coupled together by circumferentially spaced pins 2110 extending radially between the mobile deposition ring 1412 and the grounding ring 1415. The pins 2110 can limit the relative axial and rotational movement between the mobile deposition ring 1412 and the grounding ring 1415. In some embodiments, and as Fig. 22 As shown, the grounding ring 1415 may have a plurality of radially extending through holes 2210, and the moving deposition ring may have a plurality of holes 2220 aligned with the through holes 2210 for receiving the pins 2110. Spaces 2230 may be provided between the pins 2110 and the holes 2220 to allow for clearance due to thermal expansion of the pins 2110 and / or the grounding ring 1415 during substrate processing.

[0062] Fig.23 and Fig.24 14 shows the relative positions of the lift pin 1416 and the ground plate 1414 in the original position as described herein. Fig.23 and Fig.24 In the original position shown, the lift pins 1416 are spaced below the ground plate 1414 so that there is no electrical connection between the lift pins 1416 and the ground plate 1414. Therefore, in the original position, any substrate (e.g., substrate 106) in contact with the contact 1520 is not grounded by the lift pins 1416. Fig.23 and Fig.24 In the processing position shown, the lift pins 1416 can be raised and / or the ground plate 1414 can be lowered by lowering the ground ring 1415 until the lift pins 1416 contact the ground plate 1414 in the transfer position, thereby forming an electrical connection between the lift pins 1416 and the ground plate 1414. In the transfer position, the charge on the substrate (e.g., substrate 106) in contact with the contact 1520 can be discharged via the ground ring 1415 and the lift pins 1416.

[0063] Thus, systems, methods, and apparatus for handling substrates that allow the substrate to be grounded while being handled have been described.Such systems, methods, and apparatus can be used to handle thin substrates that are often transported along their edges.

[0064] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof.

Claims

1. A substrate operating system, comprising: Fixed deposition ring; a mobile deposition ring disposed above the fixed deposition ring and configured to move vertically; as well as A plurality of circumferentially spaced conductive ground plates are vertically disposed between the fixed deposition ring and the movable deposition ring, each ground plate extending from a radially inner end to a radially outer end, each ground plate being configured to move vertically relative to the fixed deposition ring, and each ground plate having an electrical contact at the radially inner end.

2. The substrate operating system according to claim 1, further comprising: a substrate support having a substrate supporting surface configured to support a substrate, wherein the stationary deposition ring is located on the substrate support around the substrate supporting surface; as well as a plurality of circumferentially spaced electrically conductive lift pins disposed about the substrate support and beneath the radially outer end of the ground plate, the lift pins being configured for vertical movement relative to the substrate support, wherein each lift pin has a support surface extending radially between a first end and a second end, and wherein each ground plate has a center of gravity located directly above the support surface, and The substrate operating system may be constructed between a first construction, wherein the lift pins are vertically spaced apart from the radially outer end of the ground plate, and a second construction, wherein the lift pins are in contact with the radially outer end of the ground plate, wherein in the second construction, a conductive path is formed through the ground plate and the lift pins.

3. The substrate handling system of claim 2, wherein in the second configuration, the ground plate is spaced apart from the stationary deposition ring.

4. The substrate handling system of claim 2, wherein in the first configuration, the mobile deposition ring is located on the ground plate, and the ground plate is located on the fixed deposition ring.

5. The substrate handling system of claim 2, wherein the moving deposition ring comprises a plurality of circumferentially spaced grooves formed on a lower surface of the moving deposition ring facing the ground plate, wherein each groove is configured to receive a first portion of a ground plate in the first configuration. 6 . The substrate operating system as claimed in claim 1 , wherein the grounding plates are connected together by arc-shaped components to form a grounding ring.

7. A substrate handling system as described in claim 1, wherein the fixed deposition ring includes a plurality of circumferentially spaced notches formed along an outer edge of the fixed deposition ring, wherein each notch is configured to be radially aligned with a corresponding ground plate, and wherein each notch is configured to receive a portion of a corresponding lift pin.

8. The substrate handling system of claim 7, wherein each notch of the stationary deposition ring is vertically tapered.

9. The substrate handling system of claim 1, wherein the moving deposition ring has an inner edge including a plurality of circumferentially spaced notches, wherein each notch is configured to receive a corresponding contact.

10. The substrate operating system according to claim 1, wherein The stationary deposition ring has a plurality of circumferentially spaced notches along an outer edge of the stationary deposition ring, the stationary deposition ring being non-conductive; the mobile deposition ring having an inner edge and a plurality of circumferentially spaced notches formed along the inner edge of the mobile deposition ring, the notches being configured to radially align with the notches of the stationary deposition ring, the mobile deposition ring being non-conductive; and Each ground plate has a base, an intermediate member, and a contact extending from the intermediate member and spaced apart from the base, each contact being configured to be received in a corresponding recess formed in the inner edge of the moving deposition ring.

11. The substrate handling system of claim 10, wherein the intermediate member of each ground plate tapers radially inwardly. 12 . The substrate handling system of claim 10 , wherein the recess of the stationary deposition ring tapers vertically between an upper surface of the stationary deposition ring and a lower surface of the stationary deposition ring.

13. The substrate handling system of any one of claims 10 to 12, further comprising at least one arc-shaped member connecting the plurality of ground plates into a ground ring.

14. The substrate handling system of claim 13, wherein the mobile deposition ring is connected to the grounding ring to limit relative movement between the mobile deposition ring and the grounding ring.

15. The substrate handling system of claim 14, further comprising at least one pin extending between the mobile deposition ring and the ground ring.

16. The substrate handling system of claim 14, wherein the mobile deposition ring and the grounding ring are configured to be interconnected.

17. A grounding member for grounding a substrate, comprising: Ground plate, comprising: a base configured to rest on the lift pins; An intermediate member extending horizontally from the base to a second end spaced apart from the base; and A contact extends vertically from the intermediate member to a position above the base, wherein the ground plate is conductive.

18. The ground engaging member of claim 17, wherein the width of the intermediate member is tapered.

19. The grounding member according to claim 17, wherein the contact point comprises a circular contact surface, a polygonal contact surface or an elliptical contact surface.

20. The grounding member according to any one of claims 17 to 19, comprising a plurality of said grounding plates and at least one arc-shaped member connecting said grounding plates into a grounding ring.

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