Antenna device and method for manufacturing antenna device

Abstract

A method for manufacturing an antenna device (100) includes a melting step and a removal step. An antenna device (100) is provided with: an antenna unit (20) formed by winding a coil wire (40) in which a coil core (47) is covered with an insulating film (46); and a base (30) having a pad portion (331) brazed to a portion of the coil wire (40) by a solder (50). In the melting step, the solder (50) supplied to the pad portion (331) is irradiated with laser light, and the solder (50) is melted. In the removal step, the coil wire (40) is immersed in the molten solder (50), a portion of the insulating film (46) is removed from the coil wire (40), and the coil wire (40) and the pad portion (331) are joined by the solder (50).

Description

Technical Field

[0001] The present invention relates to an antenna device and a method for manufacturing the antenna device. Background Art

[0002] Some antenna devices include an antenna formed by winding a coil wire, and the coil wire is electrically connected to a circuit unit by soldering or the like.

[0003] Regarding this technology, the following patent document 1 discloses a method for manufacturing an RFID transponder, wherein the RFID transponder has an antenna (4) made of a winding wire (2), and the winding wire (2) is soldered to a solderable contact area (12). Specifically, as described in patent document 1, Figure 1 As shown in the figure, a solderable contact area (12) is provided on the upper surface of the semiconductor wafer (6). The contact area (12) is a metal plating layer made of a nickel-based alloy or the like. The end of the winding wire (2) is soldered to the contact area (12). Specifically, a laser is irradiated to the soldering area, and the solder is melted by the laser to join the winding wire (2) to the contact area (12).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application No. 2014-505309 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] Generally speaking, the coil wire wound into an antenna is covered with an insulating film. In order to solder the winding wire (2) to the contact area (12) as in Patent Document 1, it is necessary to peel off the insulating film of at least the portion of the winding wire (2) to be soldered in advance. In Patent Document 1, the following process is performed: using the same laser device as the laser device for soldering the winding wire (2) to the contact area (12), the insulating film is peeled off before the soldering process. That is, the process of peeling off the insulating film needs to be performed before the soldering process. Therefore, in the manufacturing process of the antenna device, there is a problem of increased manufacturing man-hours.

[0009] Such a problem is not limited to solder, but is a problem that occurs in all brazing processes using other metal solders.

[0010] The present invention has been made in view of the above-mentioned problems, and provides an antenna device with a small number of manufacturing steps and a method for manufacturing the antenna device.

[0011] Solutions for solving problems

[0012] The manufacturing method of the antenna device of the present invention is the following manufacturing method of the antenna device, the antenna device comprises: an antenna part, which is a coil core formed by winding a coil wire covered with an insulating coating; and a base, which has a pad part that is partially soldered to the coil wire using solder. The manufacturing method of the antenna device is characterized in that it includes: a melting step, irradiating the solder supplied to the pad part with a laser to melt the solder; and a removal step, immersing the coil wire in the molten solder to partially remove the insulating coating from the coil wire, and the coil wire and the pad part are joined using the solder.

[0013] The antenna device of the present invention comprises: an antenna portion, which is formed by winding a coil wire having a coil core and an insulating coating covering the coil core; and a base, which has a pad portion, wherein the antenna device is characterized in that the coil wire has an exposed portion where the coil core is exposed from the insulating coating, the coil wire and the pad portion are joined by solder, a portion of the coil wire is buried in the solder, a first boundary line and a second boundary line are similar to each other, the first boundary line is a boundary between an internal area buried in the solder and an external area exposed outside the solder in the circumference of the coil wire, and the second boundary line is a boundary between the exposed portion and a covered portion of the coil wire covered by the insulating coating.

[0014] Effects of the Invention

[0015] According to the manufacturing method of the present invention, the heat of the molten solder is used to remove the insulating coating immersed in the solder from the coil wire. Thus, the soldering process and the process of stripping the insulating coating of the coil wire can be performed simultaneously, and the manufacturing man-hours of the antenna device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above-mentioned object and other objects, features and advantages will become more apparent from the preferred embodiments described below and the following drawings attached to the preferred embodiments.

[0017] Figure 1 It is a perspective view showing an example of the antenna device according to the first embodiment of the present invention.

[0018] Figure 2 It is a plan view of the circuit unit of the antenna device according to the first embodiment.

[0019] Figure 3 The antenna device of the first embodiment is viewed in the direction of arrow line III-III. Figure 2 A longitudinal sectional view of a cross section indicated by a single-dot chain line in FIG.

[0020] Figure 4 The antenna device of the first embodiment Figure 2 Magnified view of the X shown in .

[0021] Figure 5 The antenna device of the first embodiment is viewed in the direction of arrow line VV. Figure 4 A longitudinal sectional view of a cross section indicated by a single-dot chain line in FIG.

[0022] Figure 6 This is a perspective view of the antenna device for illustrating an example of the method for manufacturing the antenna device according to the first embodiment.

[0023] Figure 7 This is a plan view of the antenna device for illustrating an example of the method for manufacturing the antenna device according to the first embodiment.

[0024] Figure 8 The antenna device of the first embodiment is viewed in the direction of arrow line VIII-VIII. Figure 7 A longitudinal sectional view of a cross section indicated by a single-dot chain line in FIG.

[0025] Fig. 9 The antenna device of the first embodiment is viewed in the direction of arrow line IX-IX. Figure 7 A longitudinal sectional view of a cross section indicated by a single-dot chain line in FIG.

[0026] Fig.10 This is a perspective view showing an example of a pressurizing jig used in the method for manufacturing the antenna device according to the first embodiment.

[0027] Fig.11 This is a perspective view showing an example of the installation of a press jig in the method for manufacturing the antenna device according to the first embodiment. DETAILED DESCRIPTION

[0028] The various components of the antenna device of the present invention do not need to exist separately and independently, and it is allowed that multiple components are formed into one member, one component is formed by multiple members, a certain component is a part of another component, a part of a certain component overlaps with a part of another component, etc.

[0029] In addition, there are cases where the manufacturing method of the antenna device of the present invention is described using a plurality of steps described in sequence, but the order in which the steps are described does not limit the order or timing of executing the plurality of steps. Therefore, when implementing the manufacturing method of the antenna device of the present invention, the order of the plurality of steps can be changed within a range that does not hinder the content, and part or all of the execution timing of the plurality of steps can also overlap with each other.

[0030] Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, in each of the drawings, common reference numerals are attached to corresponding components, and duplicate descriptions are appropriately omitted.

[0031] In addition, in the present embodiment, the directions of front, back, left, right, up and down are defined as shown in the figure for description. In addition, for the base 30, the antenna portion 20 or the coil wire 40, the end of the front side is sometimes referred to as the front end, and the end of the rear side is sometimes referred to as the rear end. In addition, the left and right directions are sometimes referred to as the width directions, and the up and down directions are sometimes referred to as the height directions. The direction from the center line of the base toward the left or right in the left and right directions is called the outer side or outward, and the direction from the left or right toward the center line of the base is called the inner side or inward. Moreover, the directions orthogonal to the up and down directions, that is, the left and right directions and the front and back directions are sometimes collectively referred to as lateral directions. However, these are stipulated for the sake of convenience in order to simply explain the relative relationship of the constituent elements, and do not limit the directions during the manufacture and use of the product implementing the present invention.

[0032] In the present invention, the plane refers to a shape that is physically formed with the plane as the goal, and need not necessarily be a geometrically perfect plane.

[0033] <First embodiment>

[0034] (Overview of Antenna Device)

[0035] Figure 1 It is a perspective view showing an example of the antenna device 100 according to the first embodiment of the present invention.

[0036] First, the outline of the antenna device 100 according to the present embodiment will be described.

[0037] The antenna device 100 includes an antenna unit 20 and a base (circuit unit 33) having a pad unit 331. The antenna unit 20 is formed by winding a coil wire 40 having a coil core 47 and an insulating film 46 covering the coil core 47. The coil wire 40 and the pad unit 331 are bonded by solder 50.

[0038] Next, use Figure 1 to Figure 5 Next, the antenna device 100 according to the present embodiment will be described in detail.

[0039] The antenna device 100 is used in a small mobile communication system such as a transceiver used in a keyless entry system, and can also be used as an RFID transponder for identifying goods and other items. For example, the antenna unit 20 functions as an antenna for transmitting and receiving radio waves in the antenna device 100. In this embodiment, the antenna unit 20 has a winding core 21, and a coil wire 40 is wound around the winding core 21. Figure 1As shown, both ends of the coil wire 40 are arranged on the base 30 side (rear end side) of the winding core 21. The coil wire 40 (coil portion 49) is wound in the middle of the axial direction of the winding core 21. That is, the coil wire 40 is not wound around the front end of the winding core 21.

[0040] In addition, Figure 1 In the illustrated coil portion 49, illustration of each of the coil wires 40 wound around the winding core 21 is omitted. Figure 3 , Figure 6 , Figure 7 , Fig. 9 as well as Fig.11 The same is true in Chinese.

[0041] The antenna part 20 is not limited to the shape of the present embodiment, and includes various shapes that function as an antenna. For example, it may be an air-core coil in which the winding core 21 is not used and the inner side of the coil part 49 is hollow. In addition, the coil wire 40 may be wound in a manner arranged in a ring shape on a plane. Both ends of the coil wire 40 are led out to the base 30 side.

[0042] The coil wire 40 is a conductive wire. The coil wire 40 in this embodiment is a coil core 47 formed of a conductive metal such as copper (see Figure 4 ) is insulated by the insulating film 46 (refer to Figure 4 The material of the insulating film 46 may be exemplified by resins such as polyurethane and polyimide.

[0043] In this embodiment, the winding core 21 is inserted into a winding core insertion hole 316 (see FIG. 1 ) provided on the front end side of the base 30 to be described later. Figure 3 ), and fixed to the base 30. In addition, Figure 3 As shown, in order to facilitate the insertion of the core 21 into the core insertion hole 316, a chamfered portion 316a is provided at the opening of the core insertion hole 316. The end surface (surface opposite to the rear end side) of the core 21 contacts the bottom surface (surface opposite to the rear end side) of the core insertion hole 316.

[0044] The base 30 (circuit section 33) is a member for arranging a circuit main body 333 connected to the coil wires 40a and 40b drawn out from the coil section 49. In addition to the circuit section 33, the base 30 may also include a wire arrangement section 31 used in the manufacturing method of the antenna device 100 discussed later. Hereinafter, the circuit section 33 may be referred to as the base 30, and the circuit section 33 and the wire arrangement section 31 may be referred to as the base 30 together.

[0045] In this embodiment, if Figure 1As shown in the figure, the circuit unit 33 has a cylindrical shape with a bottom surface that is roughly semicircular. The circuit unit 33 is configured in such a manner that the semicircular surface corresponding to the bottom surface of the cylinder faces the front-back direction, the flat portion (upper surface 33a) of the side surface of the cylinder faces upward, and the curved circumferential surface of the side surface of the cylinder faces downward. The shape of the circuit unit 33 is not limited to a cylindrical shape with a semicircular bottom surface, and may also be a flat plate, a prism, a cylinder, etc.

[0046] In this embodiment, a downwardly recessed installation hole 334 is provided on the upper surface 33a of the circuit portion 33 (see Figure 3 and Figure 8 In this embodiment, the hole 334 is set as Figure 3 As shown in the figure, the hole 334 is open at the upper side and the rear end side. The setting hole 334 may be a shape in which only the upper side is open.

[0047] The bottom surface of the hole 334 has a sufficient size and shape for arranging the circuit body 333 discussed later. Specifically, in this embodiment, in order to accommodate the rectangular circuit body 333 that is long in the front-to-back direction, the hole 334 also has a rectangular shape that is long in the front-to-back direction. In addition, the length of the width direction and the front-to-back direction of the hole 334 is equal to or greater than the length of the width direction or the front-to-back direction of the circuit body 333.

[0048] In this embodiment, the width direction and the length of the front-to-back direction of the hole 334 are respectively greater than the width direction or the length of the front-to-back direction of the circuit body 333. Figure 2 As shown in the figure, there are gaps between the circuit portion 33 and the circuit main body 333 on the front end side, left side, and right side of the circuit main body 333 .

[0049] The circuit body 333 is accommodated in the setting hole 334. Accommodation means that part or all of the circuit body 333 is arranged in the setting hole 334. In this embodiment, as will be discussed later, the upper surface 333a of the circuit body 333 is lower than the upper surface 33a of the circuit part 33. Figure 3 As shown in the figure, the circuit body 333 is entirely accommodated in the setting hole 334, but the present invention is not limited thereto. The upper portion of the circuit body 333 may also be located above the upper surface 33a of the circuit portion 33. In addition, the circuit portion 33 may not be provided with the setting hole 334, and the circuit body 333 may be arranged on the upper surface 33a of the circuit portion 33.

[0050] The circuit body 333 has a pad portion 331 (see Figure 2 and Figure 3) and the member connected to the coil wire 40 is a circuit substrate equipped with semiconductor components and the like. The circuit substrate may also be coated with resin or the like, and may be housed inside a member of a cavity, for example. In the present embodiment, the circuit body 333 and the circuit portion 33 in which the circuit body 333 is provided are provided as different members, but the present invention is not limited thereto. The circuit body 333 and the circuit portion 33 may also be formed as one member.

[0051] A pad portion 331 is disposed on the upper surface 333a of the circuit body 333. The pad portion 331 is a portion to which the solder 50 for soldering the coil wire 40 is supplied. Specifically, the pad portion 331 is a portion plated with a conductive metal such as copper or nickel in a thin film. The pad portion 331 is connected to a component constituting a circuit such as a semiconductor substrate, and the coil wire 40 and the component constituting the circuit are electrically connected via the pad portion 331.

[0052] The thickness (length in the height direction) of the pad portion 331 is preferably smaller than a pedestal height h2 (the height to the upper surface 33a of the circuit portion 33 with respect to the upper surface 333a of the circuit body 333) described later.

[0053] like Figure 2 and Figure 4 As shown in the figure, in this embodiment, two pads 331 are provided at two locations on the upper surface 333a of the circuit main body 333. This is to join the two ends of the coil wire 40 to each pad 331. More specifically, the pad 331 of this embodiment is arranged at one location each in the left and right regions on the rear end side of the upper surface 333a of the circuit main body 333. The left and right pads 331 are respectively arranged at positions that are axially symmetrical with respect to the center line of the left-right direction of the circuit main body 333, and have an axially symmetrical shape.

[0054] In this embodiment, both ends of the coil wire 40 are respectively joined to a pair of pads 331 provided on the base 30 by solder 50. The pair of pads 331 are respectively formed into a substantially rectangular shape that is long in the front-back direction. In addition, the rectangular shape is formed by chamfering one of the inner corners of the pair of pads 331 to form a bevel 331a (see Figure 4 ) shape. Specifically, it is a shape formed by chamfering the corner arranged on the inner side of the rectangle and on the front end side. That is, the pad portion 331 has a pentagonal shape. In addition, the hypotenuse 331a is along the extension direction of the coil wire 40. Among them, the extension direction of the coil wire 40 refers to the axial direction of the coil wire 40. The hypotenuse 331a is along the extension direction of the coil wire 40, which means that the extension direction of the coil wire 40 and the hypotenuse 331a are preferably roughly parallel, and means that the acute angle of the angle formed by the extension direction of the coil wire 40 and the hypotenuse 331a is at least 45 degrees or less.

[0055] The coil wire 40 led out from the antenna unit 20 is arranged on the base 30 and bonded to the land portion 331 .

[0056] like Figure 1 As shown in the figure, the corner portion of the boundary between the side surface on the front end side of the base 30 and the upper surface 33a is C-chamfered to provide an inclined surface 33c. In addition, a pair of guide portions 335 protruding relative to the upper surface 33a of the circuit portion 33 are provided on the front end side of the base 30 in a manner separated in the left-right direction. Figure 2 As shown in the figure, the guide portion 335 is respectively arranged at a position on the outer side of the pair of pad portions 331. The guide portion 335 is in a substantially rectangular shape that is long in the front-to-back direction, and the corners of the side surface that is the boundary between the side surface on the rear end side and the side surface on the outer side are R-chamfered. That is, the outer side surface 335a (refer to Figure 2 ) becomes a locally curved circumferential surface.

[0057] like Figure 1 and Figure 2 As shown in the figure, the coil wire 40 led out to the side of the base 30 is arranged along the inclined surface 33c and the outer side surface 335a of the guide portion 335. The coil wire 40 is further arranged along the upper surface 33a of the circuit portion 33 and the outer side surface 335a of the guide portion 335. That is, the coil wire 40 is bent along the curved peripheral surface which is a part of the outer side surface 335a. One end of the coil wire 40 is soldered to the pad portion 331 arranged on the inner side of the guide portion 335. In addition, as shown in Figure 2 and Figure 4 As shown in the figure, in the present embodiment, a part of one end of the coil wire 40 protrudes from the solder 50 toward the rear end side.

[0058] As the solder 50 for soldering the coil wire 40 and the pad portion 331, metal solders such as soft solder and gold solder can be exemplified. The solder 50 melts in a melting step to be discussed later, and the melted solder 50 contacts the coil core 47 and the pad portion 331 of the coil wire 40 to form an alloy layer between the solder 50 and the coil core 47 or the pad portion 331.

[0059] Hereinafter, the brazing material 50 will be described as being a soft solder material 50 .

[0060] The coil wire 40 is partially buried in the solder 50 (soft solder 50). However, the partial burial of the coil wire 40 in the soft solder 50 is not limited to the following. Figure 4 and Figure 5 The solder 50a in the coil wire 40 is such that the solder 50 covers the entire radial area of ​​the coil wire 40, and the coil wire 40 is entirely wrapped by the solder 50 in the local length area of ​​the coil wire 40. For example, it may be as follows Figure 4 and Figure 5The solder 50b shown in the figure is such that there is no portion where the entire radial area of ​​the coil wire 40 is covered by the solder 50, but rather a radial part of the coil wire 40 is covered by the solder 50 while other radial parts are not covered by the solder 50. In other words, only the radial part may be an external area discussed later, and the other radial part may be an internal area discussed later. Preferably, at a certain point of the coil wire 40, more than half of the circumference of the coil wire 40, and more preferably more than three quarters of the circumference, is covered by the solder 50. The radial direction refers to a direction orthogonal to the axis of the coil wire 40 starting from the axis, that is, a direction radially directed from the axis of the coil wire 40 toward the circumference.

[0061] (Method of manufacturing antenna device)

[0062] Next, a method for manufacturing the antenna device 100 according to the present embodiment (hereinafter, sometimes referred to as the present method) will be described.

[0063] First, the outline of this method is described.

[0064] The antenna device 100 manufactured by this method has, as described above, an antenna portion 20 formed by winding a coil wire 40 covered with an insulating coating 46 around a coil core 47 , and a base 30 having a pad portion 331 partially soldered to the coil wire 40 using solder 50 .

[0065] The present method includes a melting step and a removal step. In the melting step, the solder 50 supplied to the pad portion 331 is irradiated with laser light to melt the solder 50. In the removal step, the coil wire 40 is immersed in the molten solder 50 to remove a portion of the insulating coating 46 from the coil wire 40, and the coil wire 40 and the pad portion 331 are joined by the solder 50. In addition, in the present method of the present embodiment, as will be discussed later, the wire configuration step is performed before the melting step and the removal step, and the cutting step is performed after the melting step and the removal step.

[0066] Here, first, the base 30 in this method will be described.

[0067] In this method, if Figure 6 As shown in the figure, the base 30 includes a circuit portion 33 and a wire configuration portion 31. The wire configuration portion 31 is a portion of the base 30 for fixing the end of the coil wire 40. In the present embodiment, the wire configuration portion 31 is a plate-like member that is longer in the front-to-back direction. That is, the wire configuration portion 31 extends in the front-to-back direction. The main surface of the plate-like portion (flat plate portion 315) of the wire configuration portion 31 faces the up-down direction. The shape of the wire configuration portion 31 is not limited to a flat plate, and may also be a columnar shape or the like.

[0068] In addition, the wire arrangement portion 31 is arranged in the circuit portion 33 at a position opposite to the antenna portion 20, that is, at the rear end side of the circuit portion 33. In the present embodiment, the wire arrangement portion 31 and the circuit portion 33 are formed integrally. Fig. 9 As shown in the figure, the upper surface 315 a of the flat plate portion 315 is arranged below the upper surface 33 a of the circuit portion 33 .

[0069] The base 30 (wire configuration portion 31) has a wire fixing portion 312 for fixing the coil wire 40. The wire fixing portion 312 is a portion where the end of the coil wire 40 is fixed. In the present embodiment, the wire fixing portion 312 is a quadrangular prism protruding upward from the upper surface 315a of the flat plate portion 315 on the rear end side. The coil wire 40 can be fixed by wrapping the coil wire 40 around the protruding quadrangular prism as discussed later. The coil wire 40 is not limited to a shape protruding upward, and may have a shape or function for fixing one end of the coil wire 40, such as a left-right direction, a protrusion toward the rear end or downward, a hook shape, etc.

[0070] In addition, a rectangular hollow hole 314 is provided between the support portion 311 of the flat plate portion 315 and the wire fixing portion 312 (see FIG. Figure 7 ).

[0071] Next, use Figure 6 to Figure 11 This method is described in detail step by step.

[0072] In this embodiment, the solder 50 is preliminarily piled up on the surface of the pad portion 331 before the wire arrangement step to be discussed later. Figure 8 As shown in the figure, the solder 50 is formed into a mountain shape having an inclined surface 51 that slopes downward from the center of the pad portion 331 toward the periphery of the pad portion 331. The solder 50 is in contact with substantially the entire area of ​​the surface of the pad portion 331. In addition, the inclined surface 51 of the solder 50 is in an arch shape that bulges upward, and the solder 50 has a dome shape as a whole. The solder 50 is cooled and solidified.

[0073] At this time, the distance from the surface of the pad portion 331 to the highest position (apex 52) of the solder 50 (the thickness of the solder 50) is greater than the pedestal height h2 (see Fig. 9 ) is large, and preferably is larger than the wire diameter of the coil wire 40.

[0074] Next, a wire placement step is performed to place the end of the coil wire 40 on the base 30 .

[0075] In the wire placement step, one end portion (fixing portion 43 ) of the coil wire 40 is fixed to the wire fixing portion 312 , and part of the coil wire 40 (the portion 42 placed on the land portion) is placed on the solder 50 provided on the surface of the land portion 331 .

[0076] Specifically, if Figure 6 and Figure 7 As shown in the figure, one end of the coil wire 40 led out from the antenna portion 20 on which the coil wire 40 is wound is led out to the circuit portion 33 side. The led-out coil wire 40 is arranged along the inclined surface 33c, the upper surface 33a of the circuit portion 33, and the outer side surface 335a of the guide portion 335 as described above. The lead-out direction of the coil wire 40 is turned inward by the coil wire 40 along the R surface of the outer side surface 335a of the guide portion 335. Thus, the coil wire 40 is led out toward the pad portion 331.

[0077] like Figure 7 As shown in the figure, the local length region of the coil wire 40 (the portion 42 disposed on the pad portion) is disposed on the pad portion 331. The local length region of the coil wire 40 disposed on the pad portion 331 means that when viewed from the height direction, a part of the coil wire 40 overlaps a part of the pad portion 331. The part of the portion 42 disposed on the pad portion is preferably disposed at the top 52 (see Figure 8 ) is located on the outer side.

[0078] In this embodiment, if Figure 8 As shown in the figure, part of the land portion upper arrangement portion 42 is arranged above the land portion 331 and does not contact the surface of the land portion 331. The solder 50 and the land portion upper arrangement portion 42 may or may not contact each other.

[0079] like Figure 6 As shown in the figure, when the pad portion arrangement portion 42 is arranged on the pad portion 331, the end of the coil wire 40 is wound and fixed to the wire fixing portion 312. At this time, sufficient tension is applied to the coil wire 40 so that the coil wire 40 arranged above the base 30 does not loosen.

[0080] In this embodiment, the base 30 has a support portion 311 for the coil wire 40 to be pressed against so as to turn the lead-out direction of the coil wire 40. Figure 7 As shown in the figure, the bend portion 45 between the local portion (the portion 42 disposed on the pad portion) and one end portion (the fixed portion 43) of the coil wire 40 is pressed against the support portion 311 of the base 30 and bent. The bend portion 45 is a local length region between the portion 42 disposed on the pad portion and the fixed portion 43 of the coil wire 40. More specifically, the bend portion 45 refers to a length region of the coil wire 40 that is bent by contact with the support portion 311 and a length region in the vicinity thereof.

[0081] The support portion 311 is a member for holding the coil wire 40 in order to maintain the lead-out direction of the coil wire 40. Figure 6As shown in the figure, the support portion 311 can be exemplified as a cylindrical protrusion protruding upward from the upper surface 315a of the flat plate portion 315. By pressing the coil wire 40 inwardly to contact the support portion 311 as discussed later, the lead-out direction of the coil wire 40 led out from the guide portion 335 is maintained at a predetermined angle. The support portion 311 can also be a protrusion in the shape of a prism or a cylinder with a semicircular bottom surface. In addition, the support portion 311 can also be a wall portion having a peripheral surface or a plane for contacting the coil wire 40 and protruding from the base 30. The support portion 311 is not limited to the above-mentioned shape as long as it is a structure for maintaining the lead-out direction of the coil wire 40.

[0082] In the present embodiment, the support portion 311 is arranged between the pad portion 331 and the wire fixing portion 312. In other words, when viewed in the height direction, the support portion 311 is arranged between the upper configuration portion 42 of the pad portion and the fixing portion 43. With such an arrangement, the bending portion 45 between the upper configuration portion 42 of the pad portion and the fixing portion 43 is pressed against the side surface of the support portion 311 and bent. Specifically, a part of the bending portion 45 is bent along the circumferential surface of the support portion 311. In addition, at this time, the coil wire 40 is pressed against the side surface of the support portion 311. More specifically, the coil wire 40 is pressed against the side surface of the support portion 311 on the opposite side to the side from which it is led out from the coil portion 49 in the left-right direction. For example, as Figure 7 As shown in the figure, the coil wire 40b (see Figure 1 ) is pressed against the peripheral surface on the left side of the support portion 311.

[0083] One end portion (fixed portion 43 ) of the coil wire 40 bent at the bent portion 45 is wound around the wire fixing portion 312 of the base 30 as described above.

[0084] In the present embodiment, both ends of the coil wire 40 are arranged on the base 30 as described above. In addition, both ends of the coil wire 40 cross above the base 30 when viewed from the height direction. Specifically, the pressurizing parts 44, 44 cross when viewed from the height direction above the pressurizing jig setting hole 313. The pressurizing parts 44 may or may not contact each other. That is, the pressurizing parts 44 may be in a mutually twisted relationship. By making the parts of the coil wire 40 intersect at one point when viewed from the height direction, it is easy to arrange the wire cross-over part 220 on the both ends of the coil wire 40 when the pressurizing jig 200 is arranged as discussed later.

[0085] In addition, the pressurizing portions 44 of the two coil wires 40a and 40b overlap in the height direction at the intersection. At the intersection, the coil wire 40a may be located above or below the coil wire 40b. Figure 8 and Fig. 9 In the figure, the overlapping of the pressurizing portion 44 of the coil wire 40a and the pressurizing portion 44 of the coil wire 40b is omitted from the illustration.

[0086] By pressing a part of the coil wire 40 against the support portion 311 in this way, the coil wire 40 led out from the antenna portion 20 can be led out in any direction and arranged on the pad portion 331. Specifically, by changing the position of the support portion 311 in the front-to-back direction, or changing the width (length in the left-right direction) of the support portion 311, it is possible to adjust the coil wire 40 to pass through any position. For example, by arranging the support portion 311 at a more front end side, or making the width of the support portion 311 larger, the coil wire 40 is led out at a larger angle relative to the front-to-back direction, and the coil wire 40 is arranged more on the inner side above the circuit body 333.

[0087] In this embodiment, the distance between the pad portion 331 and the support portion 311 is less than half the distance between the pad portion 331 and the wire fixing portion 312. In addition, the width of the support portion 311 (the diameter of the bottom surface when the support portion 311 is cylindrical) is larger than the width of the wire fixing portion 312.

[0088] In the wire configuration process, if the coil wire 40 is configured on the base 30, the pressurizing portion 44 is pressurized toward the base 30 so that the coil wire 40 is pressed and contacted with the solder 50 (soft solder 50). The pressurizing portion 44 refers to a local length region between one end (fixing portion 43) and a part (the configuration portion 42 on the pad portion) of the coil wire 40. More specifically, the pressurizing portion 44 refers to a local length region between a length region (a part or all of the bent portion 45) of the coil wire 40 that contacts the support portion 311 and the configuration portion 42 on the pad portion, and is a local length region configured above the pressurizing jig setting hole 313 discussed later.

[0089] The direction of the pressurizing portion 44 toward the base 30 refers to the direction toward the pressurizing jig installation hole 313 when the base 30 is provided with a cavity portion such as the pressurizing jig installation hole 313. In the present embodiment, the pressurizing portion 44 is pressed downward. As a result, the coil wire 40 contacts the solder 50 while applying resistance to the solder 50. As will be discussed later, the coil wire 40 applies resistance downward, inward, and toward the front end to the inclined surface 51 of the solder 50.

[0090] In order to pressurize the pressurizing portion 44 , a pressurizing jig 200 is used in the present embodiment.

[0091] like Fig.10As shown in the figure, the pressurizing jig 200 has an inverted U-shape as a whole. The pressurizing jig 200 has a rod portion 230. Arms 210 extend from both ends of the rod portion 230, and a weight portion 211 is provided at the lower end of the arm 210. The rod portion 230 and the arm 210 in the present embodiment are in the shape of a flat plate, and the weight portion 211 is in the shape of a roughly cubic cube. A wire span portion 220 is provided in the center of the extension direction of the rod portion 230. The wire span portion 220 is a portion that directly applies pressure to a part (pressurizing portion 44) of the coil wire 40, and has a pair of claws 221 separated in the extension direction of the rod portion 230. The claws 221 protrude to the side opposite to the rod portion 230 (the lower side).

[0092] The shape of the pressurizing jig 200 is not limited to the above-described shape, and may be any shape capable of pressurizing the coil wire 40 .

[0093] like Fig.11 As shown in the figure, the pressurizing jig 200 is configured in a manner of straddling the wire configuration portion 31. A pressurizing portion 44 is configured between a pair of claws 221, and the wire straddling portion 220 straddles the pressurizing portion 44 and contacts the pressurizing portion 44. Specifically, the wire straddling portion 220 straddles a portion of the pressurizing portion 44 where both ends of the coil wire 40 are close to each other or intersecting when viewed from the height direction. The pressurizing jig 200 configured on the pressurizing portion 44 sinks downward due to its own weight. At this time, the sunken wire straddling portion 220 may also be configured in the pressurizing jig setting hole 313, and the lower surface of the rod portion 230 may be in contact with or not in contact with the upper surface of the flat plate portion 315.

[0094] The weight of the pressurizing jig 200 is transferred to the pressurizing portion 44 in contact with the wire span portion 220 , so that the pressurizing portion 44 is pressed downward. At this time, the pressurizing jig 200 is stably arranged on the coil wire 40 because the pressurizing portion 44 is held between the pair of claws 221 , 221 .

[0095] In addition, a pair of inner end surfaces 212 (see Fig.10 ) is greater than the width of the flat plate portion 315. Preferably, the distance between the inner end faces 212 of the press jig 200 is equal to the width of the flat plate portion 315, and when the press jig 200 is straddled to the coil wire 40, the outer end face 315b of the flat plate portion 315 contacts the inner end face 212 of the press jig 200. Thus, the press jig 200 is easily positioned when straddling the wire arrangement portion 31, and the press jig 200 straddling the wire arrangement portion 31 can be well prevented from deviating.

[0096] By applying pressure to the pressurizing portion 44 toward the base 30, the coil wire 40 bends toward the base 30, that is, downward. As a result, the upper arrangement portion 42 of the pad portion approaches the pad portion 331, and contacts the solder material 50 that is previously piled on the pad portion 331 while pressing against it. More specifically, as Figure 8 As shown in the figure, the coil wire 40 is pressed against the inclined surface 51 of the solder 50 (soft solder 50). Specifically, the coil wire 40 is pressed against the inclined surface 51 on the outer side of the vertex 52 of the soft solder 50 piled up in a mountain shape. Figure 7 Thus, when viewed from above, the coil wire 40 including the upper arrangement portion 42 of the pad portion is pushed outward and slightly bent at the portion pressed against the solder 50. In addition, the coil wire 40 including the upper arrangement portion 42 of the pad portion is partially bent as shown in FIG. Figure 7 Thus, the coil wire 40 including the upper arrangement portion 42 of the pad portion is also pushed toward the rear end side at the portion pressed against the solder 50. Figure 7 In this way, when viewed from above, the land portion upper arrangement portion 42 is bent outwardly and toward the rear end along the inclined surface of the solder 50 .

[0097] To summarize the above, the coil wire 40 not only applies downward resistance to the solder 50, but also applies resistance inward and toward the front end. In other words, the coil wire 40 applies resistance (resistance T (refer to Figure 8 )), while pressing toward the center of the pad portion 331 for contact.

[0098] By pressing the coil wire 40 against the inclined surface 51 of the solder 50, the direction of the pressurization of the coil wire 40 against the solder 50 can be controlled to be constant. In addition, the coil wire 40 does not contact the vertex 52 of the solder 50, but contacts the inclined surface 51 of the solder 50, thereby preventing the coil wire 40 from deviating unpredictably in the left-right front-back direction on the solder 50.

[0099] like Fig. 9 As shown in the figure, the upper surface 333a of the circuit body 333 is arranged below the upper surface 33a of the circuit portion 33. In other words, the upper surface 333a of the circuit body 333 is arranged below the upper surface 33a of the circuit portion 33 arranged at the rear end side of the circuit body 333.

[0100] As described above, the height (base height h2) from the upper surface 33a of the circuit portion 33 based on the upper surface 333a of the circuit body 333 is greater than the thickness of the pad portion 331. Since the upper surface 333a of the circuit body 333 is arranged at a position lower than the upper surface 33a of the circuit portion 33, when the coil wire 40 is pressed downward, the coil wire 40 contacts the upper surface 33a of the rear end side of the circuit portion 33, and does not contact the surface of the pad portion 331 and the circuit portion 33. Thus, it is possible to prevent the surface of the pad portion 331 and the circuit portion 33 from being damaged by the coil wire 40.

[0101] In addition, the base height h2 is smaller than the height to the highest point of the solder 50 based on the upper surface 333a of the circuit body 333 (solder height h1). Preferably, the base height h2 is less than one-half of the solder height h1. Thus, the height of the upper configuration portion 42 of the pad portion relative to the solder 50 can be adjusted to an arbitrary position. That is, by pressing the coil wire 40 to contact the middle portion of the inclined surface 51 of the solder 50, the coil wire 40 can be fully immersed in the solder 50 when the solder 50 is melted, as discussed later.

[0102] After the wire arrangement step is performed, the melting step is performed.

[0103] In the melting process, the solder 50 supplied to the pad portion 331 from above is irradiated with laser light (not shown) as described above. In the present embodiment, the solder 50 is irradiated with carbon dioxide laser light. The pad portion 331 includes the surface of the pad portion 331 and the space above the pad portion 331. That is, irradiating the solder 50 supplied to the pad portion 331 with laser light is not limited to irradiating the solder 50 formed and solidified on the surface of the pad portion 331 with laser light. As discussed later, it also includes irradiating the solder 50 such as the linear solder arranged above the pad portion 331 with laser light. The solder 50 melts due to the heat applied from the laser light.

[0104] The solder 50 may be irradiated with the laser beam, and the coil wire 40 may or may not be irradiated with the laser beam.

[0105] In the present embodiment, in the melting process, the solder 50 is supplied to the surface of the pad portion 331 with a thickness greater than the wire diameter of the coil wire 40. In the present embodiment, the solder 50 is pre-formed to have a thickness greater than the wire diameter of the coil wire 40, but even if melted by the laser, the thickness of the solder 50 is maintained greater than the wire diameter of the coil wire 40.

[0106] When the solder 50 is supplied by a solder wire or the like in the melting step as described later, the thickness of the solder 50 melted and applied to the surface of the land portion 331 is equal to or greater than the wire diameter of the coil wire 40 .

[0107] By applying the solder 50 to a sufficient thickness on the surface of the land portion 331 in this manner, the coil wire 40 is sufficiently immersed in the solder 50 in the removal step described later.

[0108] In this embodiment, in the melting process, the temperature of at least one of the coil wire 40 or the solder 50 (soft solder 50) is measured, and the irradiation amount of the laser is controlled so that the temperature is within a predetermined range higher than the melting point of the solder 50. Alternatively, the irradiation amount of the laser is controlled so that the temperature is within a predetermined range higher than the decomposition temperature of the insulating coating 46.

[0109] The temperature of only the coil wire 40, only the solder 50, or both the coil wire 40 and the solder 50 can be measured. More specifically, the temperature of the solder 50 irradiated with the laser or the temperature of the length region of the coil wire 40 immersed in the solder 50 and its vicinity is measured. The temperature of the solder 50 is preferably measured in a non-contact manner, and an infrared radiation thermometer can be exemplified as a measuring instrument used for the temperature measurement.

[0110] The lower limit of the predetermined range is the melting point of the solder 50, which is preferably higher than the melting point of the insulating film 46, and more preferably higher than the decomposition temperature of the insulating film 46. In addition, the upper limit of the predetermined range can be set to the lower limit of the temperature at which the insulating film 46 of the portion of the coil wire 40 not immersed in the solder 50 (the outer region discussed later) is charred or decomposed and modified.

[0111] When the temperature of the measurement site deviates from the predetermined range, the laser irradiation amount is immediately changed. The laser irradiation amount control includes increasing the laser irradiation amount when the temperature of the measurement site is lower than the predetermined range, and reducing the laser irradiation amount or interrupting the laser irradiation when the temperature of the measurement site is higher than the predetermined range.

[0112] By controlling the laser irradiation in this way, the solder 50 is sufficiently melted and the temperature is set to a high enough level to remove the insulating film 46 in the removal step described later. In addition, the insulating film 46 covering the outer region of the coil wire 40 described later can be prevented from being modified.

[0113] Once the melting step has been performed, the removal step is performed.

[0114] When the solder 50 is melted and becomes liquid, the part of the coil wire 40 that is in press contact with the solder 50 is immersed in the melted solder 50 .

[0115] As described above, the coil wire 40 pressed toward the center of the pad portion 331 enters the inside of the solder 50 toward the center of the pad portion 331. Figure 8 As shown in the figure, when viewed from the front-back direction, the coil wire 40 (especially the upper arrangement portion 42 of the land portion) pressed against the inclined surface 51 of the solder 50 moves inward and downward (the coil wire 40a faces the lower right, and the coil wire 40b faces the lower left) while entering the inside of the solder 50. Figure 7 Thus, when viewed from above, the coil wire 40 moves inward and toward the front end (the coil wire 40a faces the lower right of the paper, and the coil wire 40b faces the lower left of the paper) while entering the inside of the solder 50 .

[0116] That is, the molten solder 50 wraps around the coil wire 40 from the center of the land portion 331. Figure 8 In the embodiment, the solder 50a is wrapped around the coil wire 40 from the lower right of the coil wire 40a, and the solder 50b is wrapped around the coil wire 40 from the lower left of the coil wire 40b. As a result, as will be discussed later, the side circumferential surface 40e (see Figure 5 ) (the upper right portion of the paper) is arranged outside the solder 50b. Alternatively, a part of the coil wire 40 such as the coil wire 40a is completely immersed in the inside of the solder 50.

[0117] When the coil wire 40 is immersed in the molten solder 50, the liquid solder 50 piled up on the surface of the pad portion 331 will expand horizontally (left-right direction and front-back direction). In this embodiment, the solder 50 only expands to the surface of the pad portion 331 with good wettability, and does not expand outward relative to the pad portion 331.

[0118] As described above, when viewed from above, the coil wire 40 moves inwardly and toward the front end while entering the inside of the solder 50. As a result, the solder 50 is particularly pushed inwardly and toward the front end.

[0119] On the other hand, as described above, the pad portion 331 is rectangular in shape with the corners missing on the inner side and the front end side when viewed from above. Thus, when the coil wire 40 is dipped into the solder 50, the solder 50 that is intended to expand inward and toward the front end is prevented from expanding flatter than necessary. In addition, the solder 50 that is prevented from expanding is prevented from bulging upward and covering the coil wire 40, so that the upper surface 40c of the coil wire 40 (see Figure 5 ) is covered with the solder 50. As a result, the coil wire 40 can be fully immersed in the solder 50.

[0120] In addition, as described above, the solder 50 is difficult to wet the upper surface 333a of the circuit body 333 that is not metal-plated, and therefore bulges upward on the pad portion 331. Alternatively, the bulged solder 50 may have a roundness due to surface tension. Figure 4As shown in the figure, when viewed from above, the solder material 50 appears to be arranged at a position further outside than the land portion 331 .

[0121] When the coil wire 40 is immersed in the solder 50 heated by laser irradiation, the insulating film 46 on the surface of the coil wire 40 immersed in the solder 50 is heated by the heat of the melted solder 50. The insulating film 46 in contact with the solder 50 is removed by the heating.

[0122] Specifically, for example, the insulating coating 46 is decomposed and removed from the coil wire 40. If the temperature of the insulating coating 46 reaches the decomposition temperature of the insulating coating 46, the insulating coating 46 decomposes. The affinity between the coil core 47 made of metal or the like and the solder 50 is greater than the affinity between the decomposition product of the insulating coating 46 formed of resin or the like and the coil core 47. As a result, the solder 50 wets the surface of the coil core 47, and the decomposition product of the insulating coating 46 is removed from the surface of the coil core 47 to the outside of the solder 50. The decomposition product of the insulating coating 46 precipitates on the surface of the solder 50. Alternatively, the decomposition product of the insulating coating 46 sublimates due to the heat of the molten solder 50. In this way, the insulating coating 46 is decomposed and removed from the surface of the coil wire 40, and the coil core 47 is exposed.

[0123] Alternatively, instead of decomposing the insulating film 46, the insulating film 46 may be melted and removed from the coil wire 40. When the temperature of the insulating film 46 reaches the melting point of the resin forming the insulating film 46, the insulating film 46 melts and the fluidity of the insulating film 46 increases, and the insulating film 46 becomes liquid. Therefore, the insulating film 46 in liquid form is squeezed out from the surface of the coil core 47 by the solder 50 wetted on the surface of the coil core 47 and removed. The insulating film 46 in liquid form floats on the surface of the solder 50.

[0124] Alternatively, the insulating coating 46 may be partially melted and the other portions may be decomposed and removed from the coil wire 40 .

[0125] In order to fully remove the insulating film 46, a coil wire 40 with low heat resistance may be used, in which the insulating film 46 has a low heat resistance temperature. An insulating material with a heat resistance of 120 degrees or less, such as polyurethane, is exemplified. In addition, it is preferable to use a coil wire 40 in which the insulating film 46 is thin enough to be easily removed.

[0126] In addition, the color of the insulating film 46 is transparent or white, preferably uncolored. This can suppress the absorption rate of the laser in the insulating film 46 to be low, and can prevent the insulating film 46 from being directly peeled off due to laser irradiation or the insulating film 46 not covered by the solder 50 from being modified due to laser irradiation.

[0127] In this manner, substantially all of the insulating coating 46 covered with the solder 50 is removed from the coil wire 40 , but the present invention is not limited thereto.

[0128] A small amount of the insulating film 46 may remain on a portion of the coil wire 40 dipped in the solder 50. Figure 4 As shown in the figure, a part of the inner region (the region inside the first boundary line 48) to be described later covered by the solder 50b also has a covering portion 473 to be described later where the insulating coating 46 remains. This is because the heat of the solder 50b is not sufficiently transferred to the peripheral portion of the inner region (the portion close to the first boundary line 48). In addition, as described later, the insulating coating 46 may not be completely decomposed or may not be completely melted in the central portion of the inner region and may remain slightly.

[0129] In addition, the outer part of the solder 50 in the coil wire 40 may not be covered by the insulating film 46. For example, Figure 4 The insulating film 46 of the coil wire 40a shown in the figure in the outer region to be discussed later and close to the solder 50a is removed to form an exposed portion 471 to be discussed later. This is because the heat of the molten solder 50 is also transferred to the insulating film 46 located outside the solder 50 and close to the solder 50.

[0130] When the insulating film 46 is removed from the coil wire 40, the coil core 47 comes into contact with the solder 50. The coil wire 40 and the land portion 331 are bonded to each other because the metal constituting the coil core 47 and the metal constituting the solder 50 form an alloy.

[0131] The melted solder 50 is cooled and solidified.

[0132] In the present embodiment, a part of the melting process and a part of the removal process are performed at overlapping times. Performing at overlapping times means that all the processes can be performed at the same time as each other, or some of them can be performed simultaneously with each other. Specifically, in the melting process, when the solder 50 starts to melt, the removal process is started and the coil wire 40 starts to be immersed in the solder 50. That is, while the solder 50 is melted by the laser, the coil wire 40 is immersed in the solder 50. In addition, the melting process ends before the removal process ends.

[0133] In this embodiment, the coil wire 40 is continuously pressed toward the base before and during laser irradiation. That is, the pressurization in the wire arrangement process and a part of the melting process are performed at overlapping times. Thus, the coil wire 40 is immersed while the solder 50 is melted.

[0134] In the present embodiment, in the melting process, an inert gas (not shown) is supplied to the solder 50 (soft solder 50) along the direction in which the coil wire 40 is pressurized. In addition, it is preferred that the inert gas is also supplied in the removal process following the melting process. The direction in which the inert gas is supplied is preferably substantially parallel to the direction in which the coil wire 40 is pressurized. That is, in the melting process, the inert gas is supplied to the soft solder 50 from above. As the inert gas, a gas with low reactivity with the soft solder 50 is used, and rare gases such as nitrogen and argon can be exemplified.

[0135] By supplying the inert gas to the solder 50, the air including oxygen around the solder 50 can be removed. Thus, the solder 50 can be prevented from being oxidized, and the wettability of the solder 50 on the peripheral surface of the coil wire 40 and the surface of the land portion 331 can be improved.

[0136] In addition, by supplying the inert gas in the direction of pressurizing the coil wire 40, oxygen around the solder 50 can be removed widely and sufficiently. That is, the solder 50 is piled up in a mountain shape in an upward protruding manner, and therefore, by supplying the inert gas from above, the inert gas is supplied to the entire area of ​​the inclined surface 51 of the solder 50.

[0137] Instead of supplying the inert gas in the direction in which the coil wire 40 is pressurized, the inert gas may be supplied in the directions of the resistance exerted by the coil wire 40 on the solder 50. That is, the inert gas may be supplied from two directions, from the upper right toward the solder 50 and from the upper left toward the solder 50. Thus, the inert gas is fully supplied to the periphery of the coil wire 40 buried in the solder 50. The wettability of the solder 50 on the peripheral surface of the coil wire 40 is well maintained, and the coil wire 40 is fully immersed in the solder 50.

[0138] This method includes a cutting step performed after the pad portion 331 and the coil wire 40 are joined by the solder 50 (soft solder 50) in the removing step. In the cutting step, the coil wire 40 and the base 30 are cut off, and a portion of the coil wire 40 including one end portion (fixing portion 43) and a portion of the base 30 including the wire fixing portion 312 are removed.

[0139] In this embodiment, the coil wire 40 and the base 30 are cut at a plane substantially perpendicular to the front-rear direction. It is preferable that the coil wire 40 and the base 30 are cut at the same plane.

[0140] Specifically, in Fig. 9The coil wire 40 and the base 30 are cut at the cut surface indicated by the single-dot chain line Y in FIG. That is, in the present embodiment, the cut surface that cuts the coil wire 40 and the base 30 is a surface that is arranged closer to the rear end side than the side end surface 333b on the rear end side of the circuit body 333 and is parallel to the side end surface 333b. More specifically, the cut surface includes the setting hole 334.

[0141] Alternatively, the cut surface may be the same plane as the side end surface 333b of the circuit body 333. In addition, in the removal process, the circuit portion 33 may not be cut, but the flat plate portion 315 and the coil wire 40 of the wire arrangement portion 31 may be cut. In this case, the cut surface may be the same surface as the rear end side surface 33d arranged on the rear end side of the circuit portion 33 (the boundary surface between the wire arrangement portion 31 and the circuit portion 33).

[0142] The two ends of the coil wire 40 disposed at the front end side of the cut surface are removed. Specifically, the ends of the coil wire 40 including the pressurizing portion 44, the bending portion 45, and the fixing portion 43 are removed. In addition, a portion of the base 30 disposed at the front end side of the cut surface is also removed. Specifically, the end of the base 30 including the wire disposing portion 31 is removed.

[0143] The antenna device 100 is manufactured through the above steps.

[0144] When manufacturing antenna device 100, a melting step of melting solder 50 by laser irradiation and a step of partially removing insulating coating 46 from coil wire 40 by immersing coil wire 40 in molten solder 50 are essential steps. Inclusion of other steps or other components is optional.

[0145] According to this method, when the coil wire 40 is immersed in the solder 50 for soldering, the insulating film 46 is removed from the coil wire 40. That is, in this method, the insulating film 46 can be peeled off during the soldering process, and there is no need to perform a process of peeling off the insulating film 46 of the coil wire 40 before the soldering process. As a result, the manufacturing man-hours of the antenna device 100 can be reduced.

[0146] (Details of antenna device)

[0147] Next, the features of the antenna device 100 manufactured in this embodiment will be described in detail.

[0148] The coil wire 40 has an exposed portion 471 where the coil core 47 is exposed from the insulating coating 46. A first boundary line 48, which is a boundary between an inner region buried in the solder 50 and an outer region exposed to the outside of the solder 50 in the peripheral surface of the coil wire 40, and a second boundary line 472, which is a boundary between the exposed portion 471 and a covered portion 473 of the coil wire 40 covered by the insulating coating 46, are similar to each other.

[0149] The fact that part of the peripheral surface of the coil wire 40 is buried in the solder 50 means that part of the peripheral surface of the coil wire 40 is covered with the solder 50 .

[0150] The inner region refers to a local region of the circumferential surface of the coil wire 40 that is buried in the solder 50 and is larger than the first boundary line 48 (see Figure 4 The outer region refers to a local area of ​​the circumferential surface of the coil wire 40 that is not covered by the solder 50 and is an area outside the first boundary line 48.

[0151] like Figure 4 As shown in the figure, two first boundary lines 48 are arranged on the circumferential surface of the coil wire 40a in a manner separated in the front-to-back direction. Each first boundary line 48 on the coil wire 40a is circumferentially wound around the coil wire 40a. Among them, the internal area (the area closer to the inside than the first boundary line 48) refers to a local area on the circumferential surface of the coil wire 40a that is sandwiched by a pair of first boundary lines 48. That is, the internal area in the coil wire 40a covers the entire radial area of ​​the coil wire 40a.

[0152] On the other hand, Figure 4 The illustrated coil wire 40b is provided with a first, roughly elliptical boundary line 48 on its circumferential surface. The inner region in the coil wire 40b is a roughly elliptical region inside the first boundary line 48. More specifically, the inner region in the coil wire 40b covers a portion of the circumferential surface on the lower side of the coil wire 40b (the lower circumferential surface 40d discussed later), and only covers a portion of the radial direction of the coil wire 40b.

[0153] The exposed portion 471 refers to a local area of ​​the circumferential surface of the coil wire 40, and is an area where the coil core 47 is exposed without being covered by the insulating film 46. As described above, sometimes the insulating film 46 is not fully removed in the removal process, and a little insulating film 46 remains in the central part of the internal area. That is, sometimes the insulating film 46 is arranged in an extremely small part of the central part of the exposed portion 471. In this case, the area on the inner side of the internal area except the peripheral edge where the insulating film 46 is arranged is also set as the exposed portion 471. It is preferred that the insulating film 46 is completely peeled off in the entire area of ​​the exposed portion 471.

[0154] On the other hand, a partial area of ​​the circumferential surface of the coil wire 40 excluding the exposed portion 471 is covered with the insulating film 46 . The area of ​​the circumferential surface of the coil wire 40 covered with the insulating film 46 is referred to as a covered portion 473 .

[0155] In the coil wire 40a, the exposed portion 471 extends over the entire circumference of the coil wire 40a. The exposed portion 471a is an area sandwiched by a pair of second boundary lines 472a, 472a separated in the front-to-back direction. The second boundary lines 472a are respectively circumferentially wound around the circumference of the coil wire 40a. In addition, in the coil wire 40b, the exposed portion 471b is roughly elliptical, including a portion of the lower circumferential surface 40d discussed later, and only extends over a radial portion of the coil wire 40b. That is, the exposed portion 471b is an area on the inner side of the roughly elliptical second boundary line 472.

[0156] like Figure 4 As shown in the figure, the exposed portion 471 is roughly consistent with the internal area, but it is not necessary to completely coincide with each other. For example, the exposed portion 471 may include the external area, and the internal area may include the covering portion 473. In the coil wire 40a, most of the exposed portion 471 is covered by the solder 50 and is consistent with the internal area, but part of the exposed portion 471 is located outside the solder 50 and is the external area. In the coil wire 40b, most of the internal area is the exposed portion 471 where the coil core 47 is exposed, and the remaining part of the internal area is the covering portion 473 covered by the insulating coating 46.

[0157] The first boundary line 48 and the second boundary line 472 are similar to each other, which means that the convex parts of the first boundary line 48 and the concave parts of the second boundary line 472 correspond to each other. That is, the shape of the first boundary line 48 and the shape of the second boundary line 472 are substantially the same. Preferably, the acute angle of the angle formed by the tangent of a part of the first boundary line 48 and the tangent of a part of the second boundary line 472 close to the part of the first boundary line 48 is smaller than the acute angle of the angle formed by the plane orthogonal to the extension direction of the coil wire 40 and the first boundary line 48.

[0158] In addition, it is desirable that the first boundary line 48 is sufficiently close to the second boundary line 472. Specifically, the distance between a part of the first boundary line 48 and a part of the second boundary line 472 close to the part is preferably less than the wire diameter of the coil. It is further preferred that the distance between a part of the first boundary line 48 and a part of the second boundary line 472 close to the part is zero, and the first boundary line 48 and the second boundary line 472 are substantially consistent.

[0159] In addition, the first boundary line 48 can be arranged inside or outside the exposed portion 471. For example, the first boundary line 48a in the solder 50a exists on the exposed portion 471a, that is, it is arranged at a position closer to the inside than the second boundary line 472a in the exposed portion 471a. On the other hand, the local length area (first boundary line 48b) of the first boundary line 48 in the solder 50b is arranged outside the exposed portion 471b, that is, it is arranged at a position closer to the outside of the exposed portion 471b than the second boundary line 472b. In addition, the other local length area (first boundary line 48c) of the first boundary line 48 in the solder 50b is roughly consistent with the local part of the second boundary line 472 (second boundary line 472c).

[0160] Furthermore, the second boundary line 472 may intersect the first boundary line 48. That is, a partial length region of the first boundary line 48 may be arranged outside the exposed portion 471, and another partial length region of the first boundary line 48 may be arranged inside the exposed portion 471, and the second boundary line 472 may intersect the first boundary line 48.

[0161] The antenna device 100 can be manufactured by the above-described manufacturing method by forming the solder 50 into a shape that wraps the coil wire 40 so that the first boundary line 48 and the second boundary line 472 coincide with each other. That is, the antenna device 100 of this embodiment has a structure that can be manufactured with a small number of manufacturing steps.

[0162] In addition, by making the first boundary line 48 and the second boundary line 472 similar to each other, the substantially entire area of ​​the exposed portion 471 is covered by the solder 50, and the area (the area where the coil core is exposed) in the exposed portion 471 that is not covered by the solder 50 can be minimized. Thus, the coil core 47 can be prevented from being exposed more than necessary, thereby increasing the insulation of the coil wire 40. In addition, since the coil core 47 is less exposed, the deterioration of the coil core 47 due to wear and oxidation can be prevented.

[0163] In addition, the antenna device 100 in which the coil wire 40 is enclosed in the solder 50 in such a manner that the first boundary line 48 and the second boundary line 472 are similar can be manufactured independently of the above-mentioned manufacturing method. For example, an example can be given in which the insulating coating is removed while the portion of the circumference of the coil wire 40 except for the predetermined area covered by the solder 50 is covered in advance.

[0164] In the present embodiment, the thickness (length in the height direction) of the solder 50 (solder 50) is larger than the wire diameter of the coil wire 40. The thickness of the solder 50 refers to the maximum height of the solder 50 based on the surface of the pad portion 331 at a location where the coil wire 40 in the area where the solder 50 is arranged does not overlap with the solder 50 when viewed in the height direction. That is, the thickness of the solder 50 does not include the thickness of the coil wire 40, but means only the thickness of the solder 50. For example, Figure 5 As shown in FIG. 1 , the solder 50 is formed into a substantially mountain-shaped shape with the top of the coil wire 40 as the vertex. In this case, the highest position of the solder 50 exists above the coil wire 40, but the thickness of the solder 50 is smaller than the height of the solder 50 (the distance from the surface of the land portion 331 to the highest position of the solder 50). In this case, the thickness of the solder 50 is the height of the solder 50 at a point close to the side of the coil wire 40.

[0165] By forming the solder 50 with a sufficient thickness equal to or greater than the wire diameter of the coil wire 40 , the coil wire 40 can be sufficiently immersed in the solder 50 in the method of manufacturing the antenna device 100 described later.

[0166] Furthermore, by stacking the solder 50 to a thickness greater than the wire diameter of the coil wire 40, the coil wire 40 can be almost entirely buried in the solder 50 in the radial direction. Thus, the solder 50 and the coil wire 40 are physically firmly joined, and the electrical connection between the solder 50 and the coil wire 40 is improved.

[0167] In the present embodiment, in the local length region of the coil wire 40b (the local length region having the exposed portion 471 when viewed from the radial direction of the coil wire 40, i.e., the buried portion 42a), the radial part becomes the exposed portion 471, and the other radial parts become the covered portion 473. The radial part becomes the exposed portion 471 and the other parts become the covered portion 473 means that, in the cross section at a certain point of the buried portion 42a, the circumference (arc) of the part of the circle of the cross section is not covered by the insulating coating 46, the coil core 47 is exposed, and the circumference of the other parts is covered by the insulating coating 46.

[0168] In this embodiment, if Figure 4 and Figure 5 In the illustrated coil wire 40 b , in the entire region of the buried portion 42 a , a portion in the radial direction is the exposed portion 471 , and the other portion is the covered portion 473 . That is, the insulating coating 46 is not broken by the exposed portion 471 .

[0169] That is, the first insulating coating 46a and the second insulating coating 46b are connected by a bridge portion 461 having a width smaller than the wire diameter of the coil wire 40 and extending along the extension direction of the coil wire 40, and the first insulating coating 46a and the second insulating coating 46b cover the entire radial area of ​​the first length region and the second length region of the coil wire 40 separated by the buried portion 42a (the local length region buried in the solder 50).

[0170] The first length region and the second length region are located outside the solder 50 and are local length regions of the coil wire 40 that are located closer to the front end or the rear end than the pad portion 331 when viewed in the height direction. Figure 4 As shown in the figure, the first insulating film 46a covers the entire circumference of the coil wire 40 (first length region) arranged at the front end side of the buried portion 42a. In addition, the second insulating film 46b covers the entire circumference of the coil wire 40 (second length region) arranged at the rear end side of the buried portion 42a.

[0171] The bridge portion 461 connecting the first insulating coating 46a and the second insulating coating 46b is arranged on the circumferential surface of the buried portion 42a. The bridge portion 461 is a part of the insulating coating 46, and is narrow and long in the direction along the axial direction of the coil wire 40. The length direction of the bridge portion 461 is similar to the extension direction of the coil wire 40. Among them, the width of the bridge portion 461 refers to the smallest length of the circumferential length of the bridge portion 461. In addition, the length direction of the bridge portion 461 is similar to the extension direction of the coil wire 40, which means that the acute angle of the angle formed when the imaginary center line connecting the center of the width direction of the bridge portion 461 is projected onto the axis of the coil wire 40 is at least 30 degrees or less. Preferably, the center line of the bridge portion 461 is substantially parallel to the axis of the coil wire 40.

[0172] In addition, in the present embodiment, in the partial length region (buried portion 42a) of the coil wire 40, the upper portion (upper peripheral surface 40c) on the side opposite to the side where the pad portion 331 is arranged and the lower portion (lower peripheral surface 40d) on the side opposite to the pad portion 331 are exposed portions 471 formed by removing the insulating coating 46, and are in contact with the solder 50. In addition, the lateral portion in the partial length region is a covered portion 473 covered by the insulating coating 46, and is not in contact with the solder 50.

[0173] Among them, last week's 40c Figure 5As shown, this refers to an area of ​​a predetermined width including the upper end of the coil wire 40 in the circumferential surface of the buried portion 42a. That is, the upper circumferential surface 40c can be a substantially linear area including only the upper end of the coil wire 40, or a slender area including the upper end of the coil wire 40 and its vicinity. In addition, the lower circumferential surface 40d refers to an area of ​​a predetermined width including the lower end of the coil wire 40 in the circumferential surface of the buried portion 42a. Similar to the upper circumferential surface 40c, the lower circumferential surface 40d can be a substantially linear area including only the lower end, or a slender shape having a width. The width of the upper circumferential surface 40c or the lower circumferential surface 40d can be less than half of the wire diameter of the coil wire 40, or more than half of the wire diameter of the coil wire 40.

[0174] Here, the part of the side of the coil wire 40 being the covering portion 473 means that at least part of the side peripheral surface is the covering portion 473. The side peripheral surface 40e is a region of the peripheral surface of the coil wire 40 excluding the upper peripheral surface 40c and the lower peripheral surface 40d.

[0175] In addition, in the present embodiment, the upper part of the side of the partial length region (buried portion 42a) of the coil wire 40 is a covering portion 473 covered by the insulating film 46, which does not contact the solder 50, and the entire lower part of the side of the partial length region (buried portion 42a) is an exposed portion 471 formed by removing the insulating film 46, which contacts the solder 50. That is, the outer and upper area of ​​the side circumferential surface 40e is the covering portion 473, and the lower area of ​​the side circumferential surface 40e is the exposed portion 471. The upper side of the side circumferential surface 40e refers to the area of ​​the side circumferential surface 40e located above the center of the cross section of the coil wire 40, and the lower side of the side circumferential surface 40e refers to the area located below the center of the cross section and opposite to the pad portion 331.

[0176] The upper circumferential surface 40c and the lower circumferential surface 40d are not limited to the exposed portion 471 in the entire length region of the buried portion 42a. Alternatively, the upper circumferential surface 40c or the lower circumferential surface 40d may be the exposed portion 471 in a partial length region of the buried portion 42a, and the upper circumferential surface 40c or the lower circumferential surface 40d may be the covered portion 473 in the remaining length region.

[0177] Since only a radial portion of the coil wire 40 is buried in the solder 50 and the other portion is disposed outside the solder 50 , the coil wire 40 and the land portion 331 can be joined using a small amount of solder 50 .

[0178] In addition, the radial portion not covered by the solder 50 is covered by the insulating coating 46, so that the coil core 47 of the buried portion 42a is covered by the insulating coating 46 or the solder 50 over the entire circumference. Thus, the coil core 47 is not exposed to the outside, and the coil core 47 can be prevented from being degraded and disconnected due to oxidation, wear, etc.

[0179] Furthermore, since the radial part of the buried portion 42a is not covered by the solder 50 over the entire length of the buried portion 42a, the heat fatigue resistance of the joint between the land portion 331 and the coil wire 40 is improved. For example, when the coil wire 40 is immersed in the molten solder 50, air attached to the coil wire 40 sometimes enters the inside of the solder 50. In contrast, according to the present embodiment, since the radial part of the coil wire 40 is not covered by the solder 50 over the entire length of the buried portion 42a, air entering any position in the solder 50 is also easy to move upward along the surface of the coil wire 40 and be discharged from the solder 50. As a result, the generation of voids in the solder 50 can be suppressed, and the aging of the joint due to the contraction and expansion of the air in the solder 50 accompanying the temperature change around the joint can be prevented.

[0180] Furthermore, since the upper peripheral surface 40 c of the peripheral surface of the coil wire 40 is covered with the solder 50 , the upper peripheral surface 40 c that is easily worn due to interference with other members can be protected by the solder 50 .

[0181] In addition, if Figure 4 As shown in the figure, the buried portion 42a of the coil wire 40a buried in the solder 50a has an exposed portion 471 formed by removing the insulating coating 46 over the entire radial direction over the substantially entire length. In the present embodiment, both ends of the buried portion 42a protrude from the solder 50a at an angle relative to the circumferential direction of the coil wire 40a. The first insulating coating 46a covering the first length region on the front end side of the buried portion 42a in the coil wire 40a and the second insulating coating 46b covering the second length region on the rear end side of the buried portion 42a are disconnected and separated from each other by the exposed portion 471.

[0182] In addition, among the parts at both ends of the buried portion 42 a , only the parts in the radial direction are inner regions covered with the solder 50 , and the other parts in the radial direction are outer regions not covered with the solder 50 .

[0183] In the present embodiment, at both ends of the buried portion 42a, the area in the outer area of ​​the circumference of the coil wire 40a, close to the solder 50a, becomes an exposed portion 471a formed by stripping the insulating coating 46. Alternatively, the area in the outer area of ​​the circumference of the coil wire 40a, close to the solder 50a, may be covered by the insulating coating 46 to become a covering portion 473. That is, the second boundary line 472 may be substantially consistent with the first boundary line 48, or the second boundary line 472 may be arranged on the inner side of the exposed portion 471. In this case, at both ends of the buried portion 42a, a radial part is covered by the solder 50, and the other radial parts are covered by the insulating coating 46. Thus, at both ends of the buried portion 42a, the coil core 47 can be prevented from being broken due to deterioration caused by oxidation, wear, etc. as described above.

[0184] In this embodiment, the following configuration is shown: only in one of the left and right coil wires 40a and 40b, a radial portion of the entire length region of the buried portion 42a is the exposed portion 471, and the other portion is the covered portion 473, but the present invention is not limited thereto. Alternatively, in both the left and right coil wires 40a and 40b, a radial portion of the entire length region of the buried portion 42a is the exposed portion 471, and the other portion is the covered portion 473. Alternatively, in both the left and right coil wires 40a and 40b, the entire radial region in the partial length region is the exposed portion 471.

[0185] In addition, in this embodiment, if Figure 2 and Figure 3 As shown in the figure, the end faces 41 at both ends of the coil wire 40 and the side end face 33b of the base 30 (circuit portion 33) are arranged on the same plane. The end face 41 of the coil wire 40 refers to the cross section produced by cutting the coil wire 40 in the cutting process discussed later. In the present embodiment, the coil wire 40 is arranged obliquely with respect to the cut surface, so the end face 41 of the coil wire 40 is elliptical. In addition, the side end face 33b of the circuit portion 33 refers to the surface of the circuit portion 33 facing the rear end side, which is the cross section produced by cutting the base 30 in the above-mentioned cutting process. In other words, the side end face 33b of the circuit portion 33 and the side end face 33b of the circuit portion 33 are in the same plane as the side end face 33b of the circuit portion 33. Fig. 9 The surfaces represented by the single-dotted line Y are the same plane.

[0186] Alternatively, in the cutting process, the coil wire 40 and the circuit portion 33 may be cut along the side end surface 333b of the circuit body 333. In this case, the end surface 41 of the coil wire 40, the side end surface 33b of the circuit portion 33, and the side end surface 333b of the circuit body 333 are all arranged on the same plane. Alternatively, in the cutting process, the coil wire 40 and the circuit portion 33 may be cut along the side end surface 333b of the circuit body 333. Fig. 9 The base 30 is cut off at the same side as the rear end side 33d in the middle.

[0187] Thus, the coil wire 40 and the circuit body 333 do not protrude toward the rear end side relative to the side end surface 33 b of the circuit portion 33 , thereby preventing the coil wire 40 and the circuit body 333 from being deteriorated due to wear.

[0188] <Modification>

[0189] In addition, the present invention is not limited to the above-mentioned embodiment, and includes various modifications, improvements, and other aspects as long as the object of the present invention is achieved.

[0190] The following modifications can be combined as appropriate.

[0191] For example, in the present embodiment, the solder 50 is formed in a mountain shape on the surface of the pad portion 331 in advance and solidified, but the present invention is not limited thereto. The solder 50 may not be formed in advance on the surface of the pad portion 331. For example, as described above, in the melting process, the solder 50 supplied to the upper part of the pad portion 331 may be melted by laser, and the melted solder 50 may fall on the surface of the pad portion 331. In the case where the solder 50 is not formed on the surface of the pad portion 331 in advance and the melted solder 50 is applied to the surface of the pad portion 331 in the melting process, the wire arrangement process may be performed after the melting process. That is, after the liquid solder 50 is supplied to the surface of the pad portion 331, the coil wire 40 may be arranged above the pad portion 331, and the coil wire 40 may be pressed downward to immerse the coil wire 40 in the solder 50. In other words, the melting process and the removal process may be performed at different times.

[0192] In this embodiment, on the surface of the pad, the inclined surface 51 of the solder 50 is pre-formed into an arched mountain shape, but it is not limited to this. For example, the inclined surface 51 of the solder 50 can be a straight line or can be concave downward. In addition, it is not limited to the case where the vertex 52 of the solder 50 is a point. The highest point in the solder 50 can also be connected in a line, and it can also be a surface. For example, when viewed from the front and back directions, the solder 50 can also be formed into a trapezoidal shape.

[0193] In order to press the coil wire 40 into contact with the solder 50, in the present embodiment, one end of the coil wire 40 is fixed to the rear end side of the base 30, and the pressurizing jig 200 is placed on the coil wire 40 to pressurize the coil wire 40 downward, but it is not limited to this. For example, it is also possible that, without using a pressurizing jig, a mechanism for pulling or pressing the coil wire 40 downward is used to bring the coil wire 40 close to the solder 50 and press it into contact therewith. In addition, it is also possible that, in the wire configuration process, when the coil wire 40 is configured above the pad portion 331 and then led out to the rear end side, the coil wire 40 is led out downward and fixed so that the coil wire 40 is pressed into contact with the solder 50.

[0194] As described above, in the present embodiment, by setting the depth (length in the height direction) of the hole 334 to be larger than the thickness (length in the height direction) of the circuit body 333, the upper surface 33a of the circuit portion 33 is disposed as a whole at a position higher than the upper surface 333a of the circuit body 333. Alternatively, in place of the present embodiment, only the upper surface 33a of the circuit portion 33 disposed on the rear end side of the circuit body 333 may be disposed at a position higher than the upper surface 333a of the circuit body 333. For example, a protrusion protruding upward from the upper surface 33a of the circuit portion 33 may be provided at a position closer to the rear end side than the circuit body 333, and the upper surface of the protrusion may be higher than the upper surface 333a of the circuit body 333. Thus, the coil wire 40 that is pressed and approaches the pad portion 331 can be prevented from contacting the pad portion 331 and damaging the pad portion 331. In this case, substantially the entire region of the upper surface 33 a of the circuit portion 33 excluding the protruding portion may be arranged at a position lower than the upper surface 333 a of the circuit body 333 .

[0195] In this embodiment, the pressurizing jig setting hole 313 is arranged between the circuit part 33 and the support part 311, but it is not limited to this. The pressurizing jig setting hole 313 can also be provided between the support part 311 and the wire fixing part 312. In this case, the pressurizing part 44 is a local length area between the bending part 45 and the fixing part 43.

[0196] The above-mentioned embodiments include the following technical concepts.

[0197] (1) A method for manufacturing an antenna device, the antenna device comprising: an antenna portion having a coil core formed by winding a coil wire covered with an insulating film; and a base having a pad portion soldered to a part of the coil wire by solder, wherein:

[0198] include:

[0199] a melting step of irradiating the solder supplied onto the pad portion with a laser to melt the solder; and

[0200] In the removing step, the coil wire is immersed in the molten solder to partially remove the insulating coating from the coil wire, and the coil wire and the land portion are bonded together by the solder.

[0201] (2) The method for manufacturing an antenna device according to (1), wherein a portion of the melting step and a portion of the removing step are performed at overlapping timings.

[0202] (3) The method for manufacturing an antenna device according to (1) or (2), wherein in the melting step, the solder is supplied to the surface of the land portion with a thickness equal to or greater than a wire diameter of the coil wire.

[0203] (4) The method for manufacturing an antenna device according to any one of (1) to (3), wherein in the removing step, the insulating coating is decomposed and removed from the coil wire.

[0204] (5) A method for manufacturing an antenna device according to any one of (1) to (4), wherein the temperature of at least one of the coil wire and the solder is measured in the melting process, and the irradiation amount of the laser is controlled so that the temperature is within a predetermined range higher than the melting point of the solder.

[0205] (6) The method for manufacturing an antenna device according to (5), wherein an irradiation amount of the laser light is controlled so that the temperature is within a predetermined range higher than a decomposition temperature of the insulating coating.

[0206] (7) The method for manufacturing an antenna device according to any one of (1) to (6), wherein:

[0207] It also includes a wire configuration step performed before the melting step,

[0208] The base has a wire fixing portion for fixing the coil wire.

[0209] In the wire arrangement step, one end of the coil wire is fixed to the wire fixing portion, and a portion of the coil wire is arranged on the solder provided on the surface of the pad portion.

[0210] In the wire arrangement step, a local length region between the one end portion and the portion of the coil wire, ie, a pressurized portion, is pressed toward the base, so that the coil wire is pressed into contact with the solder.

[0211] (8) A method for manufacturing an antenna device according to (7), wherein, in the wire configuration step, on the surface of the pad portion, the solder is formed into a mountain shape having an inclined surface that slopes downward from the center of the pad portion toward the periphery, and the coil wire is pressed into contact with the inclined surface of the solder.

[0212] (9) The method for manufacturing an antenna device according to (8), wherein the coil wire is pressed into contact with the inclined surface toward a center of the land portion.

[0213] (10) A method for manufacturing an antenna device according to any one of (7) to (9), wherein the method for manufacturing an antenna device includes a cutting step: after the pad portion and the coil wire are joined using the solder, the coil wire and the base are cut off, and a portion of the coil wire including the one end portion and a portion of the base including the wire fixing portion are removed.

[0214] (11) The method for manufacturing an antenna device according to any one of (7) to (10), wherein:

[0215] The base has a support portion against which the coil wire is pressed to turn the lead-out direction of the coil wire.

[0216] In the wire arrangement step, a bent portion of the coil wire located between the portion and the one end portion is pressed against the support portion of the base to be bent.

[0217] The one end portion of the coil wire bent at the bent portion is wound around the wire fixing portion of the base.

[0218] (12) The method for manufacturing an antenna device according to any one of (7) to (11), wherein in the melting step, an inert gas is supplied to the solder in a direction in which the coil wire is pressurized.

[0219] (13) An antenna device comprising: an antenna portion formed by winding a coil wire having a coil core and an insulating coating covering the coil core; and a base having a pad portion, wherein:

[0220] The coil wire has an exposed portion where the coil core is exposed from the insulating coating.

[0221] The coil wire is joined to the pad portion by soldering,

[0222] The coil wire is partially buried in the solder,

[0223] The first boundary line and the second boundary line are similar to each other. The first boundary line is the boundary between the internal area buried in the solder and the external area exposed outside the solder in the circumference of the coil wire, and the second boundary line is the boundary between the exposed part and the covered part of the coil wire covered by the insulating coating.

[0224] (14) The antenna device according to (13), wherein:

[0225] The thickness of the solder is larger than the wire diameter of the coil wire.

[0226] (15) The antenna device according to (13) or (14), wherein, in the partial length region of the coil wire, a portion in a radial direction serves as the exposed portion, and the other portion in a radial direction serves as the covered portion.

[0227] (16) An antenna device according to (15), wherein, in the local length area of ​​the coil wire, a part on the side opposite to the side where the pad portion is configured, i.e., a part on the upper side, and a part on the side opposite to the pad portion, i.e., a part on the lower side, are the exposed portion and are in contact with the solder, and a part on the side in the local length area is the covered portion and is not in contact with the solder.

[0228] (17) The antenna device according to (16), wherein a portion of the upper side of the side of the partial length region is the covering portion and is not in contact with the solder, and the entire region of the lower side of the side of the partial length region is the exposed portion and is in contact with the solder.

[0229] (18) An antenna device according to any one of (15) to (17), wherein a first insulating coating and a second insulating coating are connected by a bridge portion having a width smaller than a wire diameter of the coil wire and extending along the coil wire, and the first insulating coating and the second insulating coating cover the entire radial area of ​​each of the first length region and the second length region of the coil wire separated by the local length region buried in the solder.

[0230] (19) The antenna device according to any one of (13) to (18), wherein end surfaces at both ends of the coil wire and side end surfaces of the base are arranged on the same plane.

[0231] (20) The antenna device according to any one of (13) to (19), wherein both ends of the coil wire are respectively bonded to a pair of the land portions provided on the base using the solder,

[0232] The pair of pads are respectively formed in a rectangular shape,

[0233] The rectangular shapes are each a shape in which one of the inner corners of the pair of land portions is chamfered to form a hypotenuse.

[0234] The oblique side is along an extending direction of the coil wire.

[0235] (21) An antenna device, wherein the insulating coating is transparent or white.

[0236] Description of Reference Numerals

[0237] 100, antenna device; 20, antenna part; 21, winding core; 30, base; 31, wire configuration part; 311, support part; 312, wire fixing part; 313, pressurizing fixture setting hole; 314, hollow hole; 315, flat plate part; 315a, upper surface; 315b, outer end surface; 316, winding core insertion hole; 316a, chamfered part; 33, circuit part; 33a, upper surface; 33b, side end surface; 33c, inclined surface; 33d, rear end side surface; 331, pad part; 331a, bevel; 333, circuit body; 333a, upper surface; 333b, side end surface; 334, setting hole; 335, guide part; 335a, outer side surface; 40, 40a, 40b, coil wire; 40c, upper surface; 40d, lower surface; 40e , side surface; 41, end surface; 42, pad portion upper configuration portion; 42a, buried portion; 43, fixing portion; 44, pressurizing portion; 45, bending portion; 46, insulating film; 46a, first insulating film; 46b, second insulating film; 461, bridge portion; 47, coil core; 471, 471a, 471b, exposed portion; 472, 472a, 472b, 472 c, second boundary line; 473, covering portion; 48, 48a, 48b, 48c, first boundary line; 49, coil portion; 50, solder; 50, 50a, 50b, soft solder; 51, inclined surface; 52, vertex; 200, pressurizing fixture; 210, arm; 211, counterweight portion; 212, inner end surface; 220, line span portion; 221, claw; 230, rod portion.

Claims

1. A method for manufacturing an antenna device, the antenna device comprising: an antenna portion, wherein a coil core is formed by winding a coil wire covered with an insulating film; and a base having a pad portion soldered to a part of the coil wire by solder, wherein in the method for manufacturing the antenna device, include: a melting step of irradiating the solder supplied onto the pad portion with a laser to melt the solder; and In the removing step, the coil wire is immersed in the molten solder to partially remove the insulating coating from the coil wire, and the coil wire and the land portion are bonded together by the solder.

2. The method for manufacturing an antenna device according to claim 1, wherein: A part of the melting step and a part of the removing step are performed at overlapping timings.

3. The method for manufacturing an antenna device according to claim 1 or 2, wherein: In the melting step, the solder is supplied to the surface of the land portion with a thickness equal to or greater than a wire diameter of the coil wire.

4. The method for manufacturing an antenna device according to any one of claims 1 to 3, wherein: In the removing step, the insulating coating is decomposed and removed from the coil wire.

5. The method for manufacturing an antenna device according to any one of claims 1 to 4, wherein: In the melting step, the temperature of at least one of the coil wire and the solder is measured, and the irradiation amount of the laser light is controlled so that the temperature is within a predetermined range higher than the melting point of the solder.

6. The method for manufacturing an antenna device according to claim 5, wherein: The irradiation amount of the laser light is controlled so that the temperature is within a predetermined range higher than a decomposition temperature of the insulating film.

7. The method for manufacturing an antenna device according to any one of claims 1 to 6, wherein: It also includes a wire configuration step performed before the melting step, The base has a wire fixing portion for fixing the coil wire. In the wire arrangement step, one end of the coil wire is fixed to the wire fixing portion, and a portion of the coil wire is arranged on the solder provided on the surface of the pad portion. In the wire arrangement step, a local length region between the one end portion and the portion of the coil wire, ie, a pressurized portion, is pressed toward the base, so that the coil wire is pressed into contact with the solder.

8. The method for manufacturing an antenna device according to claim 7, wherein: In the wire arrangement step, the solder is formed in a mountain shape having an inclined surface that slopes downward from the center toward the periphery of the pad portion on the surface of the pad portion, and the coil wire is pressed into contact with the inclined surface of the solder.

9. The method for manufacturing an antenna device according to claim 8, wherein: The coil wire is pressed into contact with the inclined surface toward the center of the land portion.

10. The method for manufacturing an antenna device according to any one of claims 7 to 9, wherein: The manufacturing method of the antenna device includes a cutting step of cutting the coil wire and the base after the land portion and the coil wire are joined by the solder to remove a portion of the coil wire including the one end portion and a portion of the base including the wire fixing portion.

11. The method for manufacturing an antenna device according to any one of claims 7 to 10, wherein: The base has a support portion against which the coil wire is pressed to turn the lead-out direction of the coil wire. In the wire arrangement step, a bent portion of the coil wire located between the portion and the one end portion is pressed against the support portion of the base to be bent. The one end portion of the coil wire bent at the bent portion is wound around the wire fixing portion of the base.

12. The method for manufacturing an antenna device according to any one of claims 7 to 11, wherein: In the melting step, an inert gas is supplied to the solder in a direction in which the coil wire is pressurized.

13. An antenna device comprising: an antenna portion formed by winding a coil wire having a coil core and an insulating film covering the coil core; and a base having a pad portion, wherein: The coil wire has an exposed portion where the coil core is exposed from the insulating coating. The coil wire is joined to the pad portion by soldering, The coil wire is partially buried in the solder, The first boundary line and the second boundary line are similar to each other. The first boundary line is the boundary between the internal area buried in the solder and the external area exposed outside the solder in the circumference of the coil wire, and the second boundary line is the boundary between the exposed part and the covered part of the coil wire covered by the insulating coating.

14. The antenna device according to claim 13, wherein: The thickness of the solder is larger than the wire diameter of the coil wire.

15. The antenna device according to claim 13 or 14, wherein: In the partial length region of the coil wire, a portion in the radial direction becomes the exposed portion, and the other portion in the radial direction becomes the covered portion.

16. The antenna device according to claim 15, wherein: In the local length area of ​​the coil wire, the part on the side opposite to the side where the pad portion is configured, i.e., the upper side, and the part on the side opposite to the pad portion, i.e., the lower side, are the exposed portion, which are in contact with the solder, and the part on the side in the local length area is the covered portion, which is not in contact with the solder.

17. The antenna device according to claim 16, wherein: A portion of the upper side of the side of the partial length region is the covering portion and is not in contact with the solder, and the entire lower side of the side of the partial length region is the exposed portion and is in contact with the solder.

18. The antenna device according to any one of claims 15 to 17, wherein: The first insulating coating and the second insulating coating are connected by a bridge portion having a width smaller than the wire diameter of the coil wire and extending along the extension direction of the coil wire. The first insulating coating and the second insulating coating cover the entire radial area of ​​the first length area and the second length area of ​​the coil wire separated by the local length area buried in the solder.

19. The antenna device according to any one of claims 13 to 18, wherein: The end surfaces of both ends of the coil wire and the side end surface of the base are arranged on the same plane.

20. The antenna device according to any one of claims 13 to 19, wherein: The two ends of the coil wire are respectively joined to a pair of the pads provided on the base by the solder. The pair of pads are respectively formed in a rectangular shape, The rectangular shapes are each a shape in which one of the inner corners of the pair of land portions is chamfered to form a hypotenuse. The oblique side is along an extending direction of the coil wire.

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