Sensor monocrystalline silicon etching device

Abstract

The invention belongs to the technical field of monocrystalline silicon etching, and particularly relates to a sensor monocrystalline silicon etching device which comprises a machine body, a fixing table is arranged in the machine body, a fixing frame is fixedly connected to the upper surface of the fixing table, a connecting groove is formed in the fixing frame, a drying groove is formed in one side of the connecting groove, and the drying groove is communicated with the drying groove. An etching assembly is arranged in the fixed frame, the etching assembly comprises two motors, the output end of each motor is fixedly connected with a reciprocating screw rod, the circumferential surface of each reciprocating screw rod is slidably connected with a sliding block, and a fixed pipe is rotatably connected between the two sliding blocks; a plurality of spray heads are fixedly connected to the circumferential surface of the fixed pipe and used for spraying etching liquid, and by arranging the switching assembly, the cleaning assembly and other structures, the problems that cleaning cannot be effectively and timely conducted, and monocrystalline silicon is damaged due to excessive etching are solved.

Description

Technical Field

[0001] The invention belongs to the technical field of single crystal silicon etching, in particular to a sensor single crystal silicon etching device. Background Art

[0002] During the processing of single crystal silicon for sensors, it is necessary to etch it. This step is an indispensable part of single crystal silicon manufacturing and is crucial to achieving high precision and high performance of sensors.

[0003] In the existing etching process, a plurality of single crystal silicon are usually stacked on a wafer rack, and then the pre-treated sample is placed in an etching tank, and the etching liquid is sprayed onto the surface of the single crystal silicon by movement, and then etching is started, and the etching rate and selectivity are controlled by adjusting the movement speed, etc. After the etching is completed, post-processing is performed to remove the residue and restore the surface flatness of the sample. The whole process needs to be precisely controlled to ensure the etching quality and accuracy, so that the single crystal silicon surface can be effectively etched; However, there is a significant problem with the existing etching technology. After the etching is completed, the wafer rack containing the single crystal silicon needs to be taken out by a robotic arm, and then transferred to a cleaning tank and cleaned by spraying deionized water. Since the wet etching process uses a chemical liquid with an acidity higher than that of a strong acid for etching, the residual etching liquid will continue to etch the single crystal silicon during the transportation process, causing excessive etching. It cannot be effectively and timely cleaned, resulting in excessive etching and damage to the single crystal silicon.

[0004] To this end, the present invention provides a sensor single crystal silicon etching device. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows: a sensor single crystal silicon etching device according to the present invention comprises a body, a fixing platform is arranged inside the body, a fixing frame is fixedly connected to the upper surface of the fixing platform, a connecting groove is arranged inside the fixing frame, a drying groove is arranged on one side of the connecting groove, An etching assembly is arranged inside the fixed frame, and the etching assembly includes two motors, the output end of each motor is fixedly connected to a reciprocating screw, the circumferential surface of each reciprocating screw is slidably connected to a sliding block, a fixed tube is rotatably connected between the two sliding blocks, and a plurality of nozzles are fixedly connected to the circumferential surface of the fixed tube, and the plurality of nozzles are used to spray etching liquid; A switching component is provided inside each of the sliding blocks, and the switching component is used to clean the nozzle and can clean the single crystal silicon arranged on the wafer rack at the same time; The inner wall of the fixing frame is also provided with a cleaning component, and the cleaning component can pass between every two single crystal silicon wafers to assist the cleaning liquid in cleaning the single crystal silicon wafers.

[0007] Preferably, the etching component also includes limiting grooves on both sides of the fixed frame, and a connecting block is fixedly connected to one side of the sliding block. The connecting block can slide along the limiting groove, thereby improving the stability of the sliding block during movement. An auxiliary tube is fixedly connected to one side of the connecting block, and the auxiliary tube is used to pass the etching liquid. A positioning tube is fixedly connected to the diagonal position of the auxiliary tube, and the positioning tube is used to pass the cleaning liquid.

[0008] Preferably, the switching assembly also includes an auxiliary port opened on one side of the sliding block corresponding to the auxiliary tube, a positioning port is opened on one side of the sliding block corresponding to the position of the positioning tube, a rotating ring is fixedly connected to the circumferential surface of the fixed tube, a positioning block is fixedly connected to one side of the rotating ring, the end of the fixed tube is rotatably connected to the positioning ring, an auxiliary groove is opened on the inner wall of the positioning ring, the positioning block can rotate within a certain range along the auxiliary groove, a half disk is fixedly connected to one side of the positioning ring, the half disk can close the auxiliary port during the switching process, and the half disk can also close the positioning port during the switching process, and two push plates are fixedly connected to the inner wall of the fixed frame.

[0009] Preferably, the motor drives the reciprocating screw to rotate, driving the sliding block to first slide along the reciprocating screw toward the push plate on one side, and during the sliding process, the etching liquid is introduced into the fixed tube through the auxiliary tube, and spray etching is performed through the nozzle.

[0010] Preferably, after the nozzle has completed the reciprocating etching, when cleaning is required, it is only necessary to move the sliding block a certain distance along the reciprocating screw to make the nozzle abut against the push plate. At this time, the rotating ring drives the positioning block to rotate along the auxiliary groove. When it abuts against one end of the auxiliary groove, it can push the positioning ring to rotate on one side of the sliding block. The rotating positioning ring will drive the half disk to seal the auxiliary port, and the nozzle on the circumferential surface of the fixed tube will face the other side, so that the single crystal silicon can be cleaned by spraying cleaning liquid during the return process. The same movement process can be used to stop the introduction of cleaning liquid after cleaning, and the nozzle can touch the push plate on the other side to change the spraying direction of the fixed tube.

[0011] Preferably, the cleaning component includes fixed grooves opened on both sides of the inner wall of the fixed frame, and two fixed plates are slidably connected in the two fixed grooves, and the lower surface of one of the fixed plates is rotatably connected to a plurality of rotating columns, which are cleaning brush columns. The cleaning brush columns are used to clean the corresponding surfaces of every two single crystal silicon.

[0012] Preferably, the lower surface of the other fixed plate is also rotatably connected to a plurality of rotating columns, which are sponge columns and are used to wipe the residual cleaning liquid between every two silicon monocrystallines to facilitate subsequent rapid drying.

[0013] Preferably, a sliding groove is provided on the lower surface of the fixed plate, a sliding plate is slidably connected in the sliding groove, two auxiliary blocks are fixedly connected to the lower surface of the sliding plate, a fixed shaft is rotatably connected between the two auxiliary blocks, both ends of the fixed shaft are fixedly connected to torsion springs, a rotating rod is rotatably connected to the circumferential surface of the fixed shaft, and a plurality of rotating columns are fixedly connected to the lower surface of the rotating rod.

[0014] Preferably, when the fixed plate slides along the fixed groove and drives the rotating rod to move toward the connecting groove, it will pass over the side wall of the fixed frame. The squeezing of the fixed frame will first cause several rotating columns to drive the rotating rod to rotate. When the rotating rod moves to a point where the rotating column can be accommodated in the fixed frame, the rotating column enters the fixed frame under the action of the torsion spring to clean the corresponding surfaces between every two single crystal silicon.

[0015] Preferably, a positioning platform is fixedly connected to one side of the fixed platform, a first hydraulic cylinder is fixedly connected to the upper surface of the positioning platform, a top plate is fixedly connected to the output end of the first hydraulic cylinder, two clamping plates are slidably connected to the upper surface of the top plate, and the two clamping plates are used to clamp another group of rotating columns made of sponge material, so as to control the humidity of the sponge block and improve the wiping effect.

[0016] The beneficial effects of the present invention are as follows: 1. The sensor single crystal silicon etching device described in the present invention is started by switching the component to switch the cleaning mode. The nozzle sprays the cleaning liquid to clean the single crystal silicon wafer and the nozzle itself, effectively removing the residual etching liquid. At the same time, the cleaning component on the inner wall of the fixed frame is started, which flexibly shuttles between the single crystal silicon wafers to assist the cleaning liquid to deeply clean the hard-to-reach single crystal silicon gaps, ensuring that the surface of the single crystal silicon wafer is clean and free of impurities. The device integrates etching and cleaning functions in one, with a high degree of automation, which significantly improves the processing efficiency and precision of the single crystal silicon wafer. The design of the switching component realizes the rapid switching between etching and cleaning, avoiding the tedious process of disassembling and replacing parts in the traditional process. The addition of the cleaning component greatly improves the surface cleanliness of the single crystal silicon wafer and ensures the stability of product quality.

[0017] 2. A sensor single crystal silicon etching device described in the present invention realizes accurate supply of etching liquid and cleaning liquid by corresponding the auxiliary port and the positioning port to the auxiliary tube and the positioning tube respectively during the movement of the sliding block. When it is necessary to switch from the etching mode to the cleaning mode, the nozzle abuts against the push plate on one side, and the push plate pushes the fixed tube to rotate, so that the rotating ring can drive the positioning block to rotate in the auxiliary groove, driving the positioning ring and the half disk fixed thereto to rotate synchronously. During the rotation of the half disk, the auxiliary port is first closed to block the supply of etching liquid, and then the positioning port is opened to allow the cleaning liquid to flow in, completing the mode switching. At the same time, when the sliding block moves to a specific position, the push plate in the fixed frame can assist the half disk to complete the closing action. Through the rotation switching of the half disk, fast and accurate switching of etching liquid and cleaning liquid is realized, avoiding the tedious manual replacement of components in the traditional method. The setting of the push plate further enhances the stability and reliability of the switching process, ensuring the high efficiency and continuity of the single crystal silicon wafer processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Figure 1 is a three-dimensional diagram of the first embodiment of the present invention; Figure 2 It is a schematic diagram of the internal structure of the body of the present invention; Figure 3 It is a schematic diagram of the internal structure of the fixing frame of the present invention; Figure 4 It is a schematic structural diagram of the reciprocating screw of the present invention; Figure 5 It is a schematic diagram of the split structure of the positioning ring of the present invention; Figure 6 It is a structural schematic diagram of the fixing groove of the present invention; Figure 7 It is a structural schematic diagram of the top plate of the present invention; Figure 8 It is a structural schematic diagram of the fixing plate of the present invention; In the figure: 1. body; 2. Fixed table; 21. Fixed frame; 22. Connecting groove; 23. Motor; 24. Reciprocating screw; 25. Sliding block; 26. Connecting block; 27. Positioning ring; 28. Rotating ring; 29. ​​Fixed pipe; 210. Spray head; 211. Auxiliary pipe; 212. Positioning pipe; 213. Positioning port; 214. Auxiliary port; 215. Half plate; 216. Auxiliary groove; 217. Positioning block; 218. Limiting groove; 219. Push plate; 3. Drying trough; 4. Fixed groove; 41. Fixed plate; 42. Sliding groove; 43. Sliding plate; 44. Auxiliary block; 45. Fixed shaft; 46. Torsion spring; 47. Rotating rod; 48. Rotating column; 49. Positioning table; 410. Hydraulic cylinder; 411. Top plate; 412. Clamp. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0021] Embodiment 1: Figures 1 to 8 As shown, a sensor single crystal silicon etching device according to an embodiment of the present invention comprises a body 1, a fixed platform 2 is arranged inside the body 1, a fixed frame 21 is fixedly connected to the upper surface of the fixed platform 2, a connecting groove 22 is provided inside the fixed frame 21, a drying groove 3 is provided on one side of the connecting groove 22, an etching component is arranged inside the fixed frame 21, and the etching component comprises two motors 23, a reciprocating screw 24 is fixedly connected to the output end of each motor 23, a sliding block 25 is slidably connected to the circumferential surface of each reciprocating screw 24, a fixed tube 29 is rotatably connected between the two sliding blocks 25, a plurality of nozzles 210 are fixedly connected to the circumferential surface of the fixed tube 29, and the plurality of nozzles 210 are used to spray etching liquid; a switching component is arranged inside each sliding block 25, and the switching component is used to clean the nozzle 210, and can clean the single crystal silicon arranged on the wafer rack; a cleaning component is also arranged on the inner wall of the fixed frame 21, and the cleaning component can pass between every two single crystal silicon wafers to assist the cleaning liquid in cleaning the single crystal silicon wafers.

[0022] Specifically, the existing etching technology has a significant problem. After etching is completed, the wafer rack containing the single crystal silicon needs to be taken out by a robotic arm, and then transferred to a cleaning tank and cleaned by spraying deionized water. Since the wet etching process uses a chemical liquid with an acidity higher than that of a strong acid for etching, the residual etching liquid will continue to etch the single crystal silicon during the transportation of the single crystal silicon, causing the problem of excessive etching, and it is impossible to clean it effectively and timely, resulting in the problem of excessive etching damaging the single crystal silicon. Therefore, the present invention solves this problem by setting a certain structure. First, when the device is started, the motor 23 drives the reciprocating screw 24 to rotate, driving the sliding block 25 to move back and forth on the reciprocating screw 24, and then drives the fixed tube 29 and the nozzle 210 thereon to make linear motion in the fixed frame 21, and evenly sprays the etching liquid onto the single crystal silicon wafer placed on the wafer rack in the fixed frame 21 to achieve the etching operation. After the etching is completed, the switching component is started, the cleaning mode is switched, and the nozzle 210 sprays the cleaning liquid to clean the single crystal silicon wafer and the nozzle 210 itself, effectively removing the residual etching liquid. Liquid, at the same time, the cleaning component on the inner wall of the fixed frame 21 is started, which flexibly shuttles between the single crystal silicon wafers, assisting the cleaning liquid to deeply clean the hard-to-reach single crystal silicon gaps, ensuring that the surface of the single crystal silicon wafer is clean and free of impurities. The device integrates etching and cleaning functions in one, with a high degree of automation, which significantly improves the processing efficiency and accuracy of the single crystal silicon wafer. The design of the switching component realizes the rapid switching between etching and cleaning, avoiding the cumbersome process of disassembling and replacing parts in the traditional process. The addition of the cleaning component is a great improvement in the cleanliness of the surface of the single crystal silicon wafer, ensuring the stability of product quality; The problem of ineffective and timely cleaning, resulting in excessive etching and damage to single crystal silicon, is solved.

[0023] like Figure 3 As shown, the etching assembly of this embodiment also includes limiting grooves 218 opened on both sides of the fixed frame 21, and a connecting block 26 is fixedly connected to one side of the sliding block 25. The connecting block 26 can slide along the limiting groove 218, thereby improving the stability of the sliding block 25 during movement. An auxiliary tube 211 is fixedly connected to one side of the connecting block 26, and the auxiliary tube 211 is used to pass the etching liquid. A positioning tube 212 is fixedly connected to the diagonal position of the auxiliary tube 211, and the positioning tube 212 is used to pass the cleaning liquid.

[0024] Specifically, the etching component improves the stability of the sliding block 25 during movement through the design of the limit groove 218 and the connecting block 26. During operation, the connecting block 26 slides tightly in the limit groove 218 to ensure that the sliding block 25 moves smoothly along a predetermined trajectory, thereby ensuring the accuracy of the nozzle 210 spraying the etching liquid or the cleaning liquid. The setting of the auxiliary tube 211 and the positioning tube 212 realizes the separate supply of the etching liquid and the cleaning liquid, ensuring the orderly progress of the etching and cleaning operations, improving the operating efficiency, and further ensuring the processing quality of the single crystal silicon wafer.

[0025] like Figure 5As shown, the switching component of this embodiment also includes an auxiliary port 214 opened on one side of the sliding block 25 corresponding to the auxiliary tube 211, a positioning port 213 is opened on one side of the sliding block 25 corresponding to the position of the positioning tube 212, a rotating ring 28 is fixedly connected to the circumferential surface of the fixed tube 29, a positioning block 217 is fixedly connected to one side of the rotating ring 28, the end of the fixed tube 29 is rotatably connected to the positioning ring 27, an auxiliary groove 216 is opened on the inner wall of the positioning ring 27, the positioning block 217 can rotate within a certain range along the auxiliary groove 216, a half disk 215 is fixedly connected to one side of the positioning ring 27, the half disk 215 can close the auxiliary port 214 during the switching process, and the half disk 215 can also close the positioning port 213 during the switching process, and two push plates 219 are fixedly connected to the inner wall of the fixed frame 21.

[0026] Specifically, during the movement of the sliding block 25, the auxiliary port 214 and the positioning port 213 correspond to the auxiliary tube 211 and the positioning tube 212 respectively, so as to realize the accurate supply of the etching liquid and the cleaning liquid. When it is necessary to switch from the etching mode to the cleaning mode, the nozzle 210 abuts against the push plate 219 on one side, and the push plate 219 pushes the fixed tube 29 to rotate, so that the rotating ring 28 can drive the positioning block 217 to rotate in the auxiliary groove 216, and drive the positioning ring 27 and the half disk 215 fixed thereto to rotate synchronously. During the rotation process, the half disk 215 first closes the auxiliary port 214, blocks the supply of etching liquid, then opens the positioning port 213 to allow the cleaning liquid to flow in, completing the mode switching. At the same time, the push plate 219 in the fixed frame 21 can assist the half disk 215 to complete the closing action when the sliding block 25 moves to a specific position. Through the rotation switching of the half disk 215, the etching liquid and the cleaning liquid are quickly and accurately switched, avoiding the tedious manual replacement of parts in the traditional method. The setting of the push plate 219 further enhances the stability and reliability of the switching process, ensuring the efficiency and continuity of the single crystal silicon wafer processing process.

[0027] like Figure 3 As shown, the motor 23 of this embodiment drives the reciprocating screw 24 to rotate, driving the sliding block 25 to slide along the reciprocating screw 24 toward the push plate 219 on one side. During the sliding process, the etching liquid is introduced into the fixed tube 29 through the auxiliary tube 211, and spray etching is performed through the nozzle 210.

[0028] Specifically, the motor 23 drives the reciprocating screw 24 to rotate, pushing the sliding block 25 to slide along the screw toward the side push plate 219. During the sliding process, the etching liquid is sent into the fixed tube 29 through the auxiliary tube 211, and is accurately sprayed on the target area by the nozzle 210 for etching, thereby improving the processing efficiency. At the same time, since the movement of the sliding block 25 and the spraying of the etching liquid are driven by the same power source (motor 23), the synchronization and coordination of the two actions are guaranteed, thereby ensuring the accuracy and stability of the etching operation.

[0029] like Figure 5 As shown, after the nozzle 210 of this embodiment has completed the reciprocating etching, when cleaning is required, it is only necessary to move the sliding block 25 a certain distance along the reciprocating screw 24 so that the nozzle 210 abuts against the push plate 219. At this time, the rotating ring 28 drives the positioning block 217 to rotate along the auxiliary groove 216. When it abuts against one end of the auxiliary groove 216, it can push the positioning ring 27 to rotate on one side of the sliding block 25. The rotating positioning ring 27 will drive the half disk 215 to block the auxiliary port 214, and the nozzle 210 on the circumferential surface of the fixed tube 29 faces the other side, so that the single crystal silicon can be cleaned by spraying cleaning liquid during the return process. The same movement process can be used to stop the introduction of cleaning liquid after cleaning, and the nozzle 210 can touch the push plate 219 on the other side to change the spraying direction of the fixed tube 29.

[0030] Specifically, after the etching operation is completed, for cleaning, the sliding block 25 continues to move a distance along the reciprocating screw 24 under the drive of the motor 23 until the nozzle 210 contacts the push plate 219. At this time, the rotating ring 28 drives the positioning block 217 to rotate along the auxiliary groove 216 until it abuts against the end of the auxiliary groove 216, pushing the positioning ring 27 and the fixed half disk 215 to rotate on one side of the sliding block 25. During the rotation of the half disk 215, the auxiliary port 214 is blocked. At the same time, the nozzle 210 on the fixed tube 29 changes its direction and is aimed at the other side. When the sliding block 25 returns, the cleaning liquid is introduced through the positioning tube 212. The nozzle 210 sprays the cleaning liquid onto the surface of the single crystal silicon wafer. After the cleaning is completed, the cleaning liquid is stopped and the nozzle 210 is allowed to touch the other side push plate 219 again to change the spraying direction of the fixed tube 29 to prepare for the next etching operation. The continuity and automation of the etching and cleaning operations are achieved without replacing parts or interrupting the operation process, which significantly improves the processing efficiency. At the same time, by changing the direction of the nozzle 210, it is ensured that the cleaning liquid can be evenly sprayed onto the surface of the single crystal silicon wafer, thereby improving the cleaning effect and processing quality. The device demonstrates high efficiency, flexibility and practicality in the field of single crystal silicon wafer processing.

[0031] Embodiment 2: Figures 1 to 8 As shown, compared with Example 1, another embodiment of the present invention is: the cleaning component includes fixed grooves 4 opened on both sides of the inner wall of the fixed frame 21, and two fixed plates 41 are slidably connected in the two fixed grooves 4, and the lower surface of one of the fixed plates 41 is rotatably connected to a plurality of rotating columns 48, and the rotating columns 48 are cleaning brush columns, which are used to clean the corresponding surfaces of every two single crystal silicon.

[0032] Specifically, the cleaning component is slidably connected by two fixed plates 41 in the fixed groove 4. A cleaning brush column rotatably connected to the lower surface of one of the fixed plates 41 can move with the sliding of the fixed plate 41 to clean every two corresponding surfaces of the single crystal silicon, thereby realizing automatic cleaning of the corresponding surfaces of the single crystal silicon wafers and improving the cleaning efficiency. The rotatable connection of the cleaning brush column controls the rotation of the rotating column 48 for cleaning through the built-in motor 23, thereby ensuring the uniformity and thoroughness of the cleaning process and avoiding omissions or dead corners that may exist in traditional cleaning methods.

[0033] like Figure 6 As shown, the lower surface of another fixed plate 41 of this embodiment is also rotatably connected to a plurality of rotating columns 48, and the rotating columns 48 are sponge columns, which are used to wipe the residual cleaning liquid between every two silicon monocrystallines to facilitate subsequent rapid drying.

[0034] Specifically, in the cleaning assembly, a sponge column is rotatably connected to the lower surface of another fixed plate 41. As the fixed plate 41 slides, it can wipe the cleaning liquid remaining between every two silicon monocrystals, preparing for subsequent rapid drying. The wiping effect of the sponge column effectively removes the cleaning liquid remaining between the silicon monocrystals, avoids secondary contamination of the silicon monocrystal surface by the cleaning liquid, and reduces energy consumption and time during the drying process.

[0035] like Figure 8 As shown, a sliding groove 42 is provided on the lower surface of the fixed plate 41 of the present embodiment, a sliding groove 42 is slidably connected with a sliding plate 43, two auxiliary blocks 44 are fixedly connected to the lower surface of the sliding plate 43, a fixed shaft 45 is rotatably connected between the two auxiliary blocks 44, both ends of the fixed shaft 45 are fixedly connected with torsion springs 46, a rotating rod 47 is rotatably connected to the circumferential surface of the fixed shaft 45, and a plurality of rotating columns 48 are fixedly connected to the lower surface of the rotating rod 47.

[0036] Specifically, on the lower surface of the fixed plate 41, the sliding groove 42 allows the sliding plate 43 to slide and adjust, so that the two sides of the two single crystal silicon at the end of the wafer rack can also be within the cleaning range, ensuring that both sides of each single crystal silicon can be effectively cleaned, and two auxiliary blocks 44 are fixedly connected to the lower surface of the sliding plate 43, which are connected by a fixed shaft 45 and are equipped with a torsion spring 46. A rotating rod 47 is rotatably connected to the circumferential surface of the fixed shaft 45, and a plurality of rotating columns 48 (which can be cleaning brush columns or sponge columns, etc.) are fixedly connected to the lower surface of the rotating rod 47. When the sliding plate 43 slides in the sliding groove 42, the rotating rod 47 can move within a certain range through the cooperation of the auxiliary blocks 44, the fixed shaft 45 and the torsion spring 46, and at the same time drive the rotating columns 48 on its lower surface to clean or wipe the single crystal silicon wafers.

[0037] like Figure 8As shown, in this embodiment, when the fixed plate 41 slides along the fixed groove 4 and drives the rotating rod 47 to move toward the connecting groove 22, it will pass over the side wall of the fixed frame 21. The squeezing of the fixed frame 21 will first cause a number of rotating columns 48 to drive the rotating rod 47 to rotate. When the rotating rod 47 moves to a point where the rotating column 48 can be accommodated to enter the fixed frame 21, the rotating column 48 enters the fixed frame 21 under the action of the torsion spring 46 to clean the corresponding surface between every two single crystal silicon.

[0038] Specifically, when the fixed plate 41 slides along the fixed groove 4, driving the rotating rod 47 to move into the connecting groove 22 and pass over the side wall of the fixed frame 21, the squeezing effect of the fixed frame 21 will cause several rotating columns 48 (such as cleaning brush columns) on the rotating rod 47 to rotate first to adapt to the contour of the fixed frame 21. Once the rotating rod 47 moves to a position that can accommodate the rotating column 48 to enter the fixed frame 21, the elastic force of the torsion spring 46 will cause the rotating column 48 to return to its original position and enter the fixed frame 21, thereby cleaning the corresponding surface between every two single crystal silicon.

[0039] like Figure 6 As shown, in this embodiment, a positioning platform 49 is fixedly connected to one side of the fixed platform 2, a first hydraulic cylinder 410 is fixedly connected to the upper surface of the positioning platform 49, an output end of the first hydraulic cylinder 410 is fixedly connected to a top plate 411, and two clamping plates 412 are slidably connected to the upper surface of the top plate 411, and the two clamping plates 412 are used to clamp another group of rotating columns 48 made of sponge material, so as to control the humidity of the sponge block and improve the wiping effect.

[0040] Specifically, on one side of the fixed table 2, the positioning table 49 firmly supports the first hydraulic cylinder 410, and its output end is connected to the top plate 411. Two clamping plates 412 are designed on the upper surface of the top plate 411. The two clamping plates 412 can slide to adjust the position and are used to clamp another set of rotating columns 48 - this time they are made of sponge material, which are used to wipe the residual cleaning liquid between the single crystal silicon. Through the telescopic movement of the first hydraulic cylinder 410, the clamping plates 412 on the top plate 411 can be controlled to be located on both sides of the sponge block, and then the rotating columns 48 of the sponge material are clamped, thereby realizing precise control of the humidity of the sponge block and improving the wiping effect.

[0041] Working principle: first, when the device is started, the motor 23 drives the reciprocating screw 24 to rotate, driving the sliding block 25 to move back and forth on the reciprocating screw 24, thereby driving the fixed tube 29 and the nozzle 210 thereon to make linear motion in the fixed frame 21, and evenly spraying the etching liquid onto the single crystal silicon wafer placed on the wafer rack in the fixed frame 21 to achieve the etching operation. After the etching is completed, the switching component is started, the cleaning mode is switched, and the nozzle 210 sprays the cleaning liquid to clean the single crystal silicon wafer and the nozzle 210 itself, effectively removing the residual etching liquid. At the same time, the fixed frame 21 The cleaning component on the inner wall is started, which flexibly shuttles between the single crystal silicon wafers, assisting the cleaning liquid to deeply clean the hard-to-reach single crystal silicon gaps, ensuring that the surface of the single crystal silicon wafer is clean and free of impurities. The device integrates etching and cleaning functions in one, with a high degree of automation, which significantly improves the processing efficiency and accuracy of single crystal silicon wafers. The design of the switching component realizes the rapid switching between etching and cleaning, avoiding the tedious process of disassembling and replacing parts in the traditional process. The addition of the cleaning component is a great improvement in the cleanliness of the surface of the single crystal silicon wafer, ensuring the stability of product quality; In addition, during the movement of the sliding block 25, the auxiliary port 214 and the positioning port 213 correspond to the auxiliary tube 211 and the positioning tube 212 respectively, so as to realize the accurate supply of the etching liquid and the cleaning liquid. When it is necessary to switch from the etching mode to the cleaning mode, the nozzle 210 abuts against the push plate 219 on one side, and the push plate 219 pushes the fixed tube 29 to rotate, so that the rotating ring 28 can drive the positioning block 217 to rotate in the auxiliary groove 216, and drive the positioning ring 27 and the half disk 215 fixed thereto to rotate synchronously. During the rotation process, the half disk 215 first closes the auxiliary port 214 and the positioning block 217 is rotated in the auxiliary groove 216. 14, blocking the supply of etching liquid, then opening the positioning port 213 to allow the cleaning liquid to flow in, completing the mode switching. At the same time, when the sliding block 25 moves to a specific position, the push plate 219 in the fixed frame 21 can assist the half disk 215 to complete the closing action. Through the rotation switching of the half disk 215, the etching liquid and the cleaning liquid are quickly and accurately switched, avoiding the tedious manual replacement of parts in the traditional method. The setting of the push plate 219 further enhances the stability and reliability of the switching process, ensuring the efficiency and continuity of the single crystal silicon wafer processing process; After the etching operation is completed, for cleaning, the sliding block 25 continues to move a distance along the reciprocating screw 24 under the drive of the motor 23 until the nozzle 210 contacts the push plate 219. At this time, the rotating ring 28 drives the positioning block 217 to rotate along the auxiliary groove 216 until it abuts against the end of the auxiliary groove 216, pushing the positioning ring 27 and the fixed half disk 215 to rotate on one side of the sliding block 25. During the rotation of the half disk 215, the auxiliary port 214 is blocked. At the same time, the nozzle 210 on the fixed tube 29 changes its direction and is aimed at the other side. When the sliding block 25 returns, the cleaning liquid is introduced through the positioning tube 212, and the nozzle 210 is sprayed. The nozzle 210 sprays the cleaning liquid onto the surface of the single crystal silicon wafer for cleaning. After the cleaning is completed, the cleaning liquid is stopped and the nozzle 210 touches the push plate 219 on the other side again to change the spraying direction of the fixed tube 29 to prepare for the next etching operation. The continuity and automation of the etching and cleaning operations are achieved without replacing parts or interrupting the operation process, which significantly improves the processing efficiency. At the same time, by changing the direction of the nozzle 210, it is ensured that the cleaning liquid can be evenly sprayed onto the surface of the single crystal silicon wafer, which improves the cleaning effect and processing quality. The device demonstrates high efficiency, flexibility and practicality in the field of single crystal silicon wafer processing. In the cleaning assembly, the sponge column connected to the lower surface of another fixed plate 41 is rotatably connected. As the fixed plate 41 slides, the cleaning liquid remaining between each two silicon monocrystals can be wiped to prepare for subsequent rapid drying. The wiping effect of the sponge column effectively removes the cleaning liquid remaining between the silicon monocrystals, avoiding secondary contamination of the surface of the silicon monocrystals by the cleaning liquid, while reducing energy consumption and time during the drying process. At the same time, on the lower surface of the fixed plate 41, the sliding groove 42 allows the sliding plate 43 to slide and adjust, so that the two sides of the two single crystal silicon at the end of the sheet rack can also be within the cleaning range, ensuring that both sides of each single crystal silicon can be effectively cleaned, and two auxiliary blocks 44 are fixedly connected to the lower surface of the sliding plate 43, which are connected by a fixed shaft 45 and are equipped with a torsion spring 46. A rotating rod 47 is rotatably connected to the circumferential surface of the fixed shaft 45, and a plurality of rotating columns 48 (which can be cleaning brush columns or sponge columns, etc.) are fixedly connected to the lower surface of the rotating rod 47. When the sliding plate 43 slides in the sliding groove 42, the rotating rod 47 can move within a certain range through the cooperation of the auxiliary block 44, the fixed shaft 45 and the torsion spring 46, and at the same time drive the rotating column 48 on its lower surface to clean or wipe the single crystal silicon wafer; Finally, on one side of the fixed platform 2, the positioning platform 49 firmly supports the first hydraulic cylinder 410, and its output end is connected to the top plate 411. Two clamping plates 412 are designed on the upper surface of the top plate 411. These two clamping plates 412 can slide to adjust their positions and are used to clamp another set of rotating columns 48 - this time they are made of sponge material, which are used to wipe the residual cleaning liquid between the single crystal silicon. Through the telescopic movement of the first hydraulic cylinder 410, the clamping plates 412 on the top plate 411 can be controlled to be located on both sides of the sponge block, and then the rotating columns 48 of the sponge material are clamped, thereby realizing precise control of the humidity of the sponge block and improving the wiping effect.

[0042] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A sensor single crystal silicon etching device, comprising a body (1), a fixing platform (2) being arranged inside the body (1), a fixing frame (21) being fixedly connected to the upper surface of the fixing platform (2), a connecting groove (22) being provided inside the fixing frame (21), a drying groove (3) being provided on one side of the connecting groove (22), characterized in that: An etching assembly is arranged inside the fixed frame (21), and the etching assembly comprises two motors (23), the output end of each motor (23) is fixedly connected to a reciprocating screw (24), the circumferential surface of each reciprocating screw (24) is slidably connected to a sliding block (25), a fixed tube (29) is rotatably connected between the two sliding blocks (25), a plurality of nozzles (210) are fixedly connected to the circumferential surface of the fixed tube (29), and the plurality of nozzles (210) are used to spray etching liquid; A switching component is provided inside each of the sliding blocks (25), and the switching component is used to clean the nozzle (210) and can also clean the single crystal silicon arranged on the wafer rack; The inner wall of the fixing frame (21) is also provided with a cleaning component, and the cleaning component can pass between every two single crystal silicon wafers to assist the cleaning liquid in cleaning the single crystal silicon wafers.

2. A sensor single crystal silicon etching device according to claim 1, characterized in that: The etching assembly further comprises limiting grooves (218) provided on both sides of the fixed frame (21); a connecting block (26) is fixedly connected to one side of the sliding block (25); the connecting block (26) can slide along the limiting groove (218), thereby improving the stability of the sliding block (25) during movement; an auxiliary tube (211) is fixedly connected to one side of the connecting block (26); the auxiliary tube (211) is used for introducing etching liquid; a positioning tube (212) is fixedly connected to a diagonal position of the auxiliary tube (211); the positioning tube (212) is used for introducing cleaning liquid.

3. A sensor single crystal silicon etching device according to claim 1, characterized in that: The switching assembly further comprises an auxiliary port (214) provided on one side of the sliding block (25) corresponding to the auxiliary tube (211); a positioning port (213) is provided on one side of the sliding block (25) at a position corresponding to the positioning tube (212); a rotating ring (28) is fixedly connected to the circumferential surface of the fixed tube (29); a positioning block (217) is fixedly connected to one side of the rotating ring (28); an end of the fixed tube (29) is rotatably connected to the positioning ring (27); an auxiliary groove (216) is provided on the inner wall of the positioning ring (27); the positioning block (217) can rotate within a certain range along the auxiliary groove (216); a half disk (215) is fixedly connected to one side of the positioning ring (27); the half disk (215) can close the auxiliary port (214) during the switching process; the half disk (215) can also close the positioning port (213) during the switching process; and two push plates (219) are fixedly connected to the inner wall of the fixed frame (21).

4. A sensor single crystal silicon etching device according to claim 3, characterized in that: The motor (23) drives the reciprocating screw (24) to rotate, and drives the sliding block (25) to slide along the reciprocating screw (24) toward the push plate (219) on one side. During the sliding process, the etching liquid is introduced into the fixed tube (29) through the auxiliary tube (211), and the etching is sprayed through the nozzle (210) for etching.

5. A sensor single crystal silicon etching device according to claim 4, characterized in that: After the nozzle (210) has completed the reciprocating etching, when cleaning is required, the sliding block (25) only needs to be moved a certain distance along the reciprocating screw (24) so ​​that the nozzle (210) abuts against the push plate (219). At this time, the rotating ring (28) drives the positioning block (217) to rotate along the auxiliary groove (216). When it abuts against the end of the auxiliary groove (216), it can push the positioning ring (27) to rotate on one side of the sliding block (25). The rotating positioning ring (27) will drive the half disk (215) to block the auxiliary port (214), and the nozzle (210) on the circumferential surface of the fixed tube (29) faces the other side, so that the single crystal silicon can be cleaned by spraying cleaning liquid during the return process. The same movement process is carried out. After cleaning, the introduction of cleaning liquid can be stopped, and the nozzle (210) can touch the push plate (219) on the other side to change the spraying direction of the fixed tube (29).

6. The sensor single crystal silicon etching device according to claim 1, characterized in that: The cleaning component comprises fixed grooves (4) formed on both sides of the inner wall of the fixed frame (21), two fixed plates (41) being slidably connected in the two fixed grooves (4), a plurality of rotating columns (48) being rotatably connected to the lower surface of one of the fixed plates (41), the rotating columns (48) being cleaning brush columns used for cleaning the corresponding surfaces of each two single crystal silicon.

7. A sensor single crystal silicon etching device according to claim 6, characterized in that: The lower surface of the other fixed plate (41) is also rotatably connected to a plurality of rotating columns (48), the rotating columns (48) being sponge columns, which are used to wipe the residual cleaning liquid between each two silicon monocrystals to facilitate subsequent rapid drying.

8. The sensor single crystal silicon etching device according to claim 6, characterized in that: A sliding groove (42) is provided on the lower surface of the fixed plate (41), a sliding plate (43) is slidably connected in the sliding groove (42), two auxiliary blocks (44) are fixedly connected to the lower surface of the sliding plate (43), a fixed shaft (45) is rotatably connected between the two auxiliary blocks (44), both ends of the fixed shaft (45) are fixedly connected to torsion springs (46), a rotating rod (47) is rotatably connected to the circumferential surface of the fixed shaft (45), and a plurality of rotating columns (48) are fixedly connected to the lower surface of the rotating rod (47).

9. A sensor single crystal silicon etching device according to claim 8, characterized in that: When the fixed plate (41) slides along the fixed groove (4) and drives the rotating rod (47) to move into the connecting groove (22), it will pass over the side wall of the fixed frame (21). The plurality of rotating columns (48) will first drive the rotating rod (47) to rotate due to the squeezing of the fixed frame (21). When the rotating rod (47) moves to a position where the rotating column (48) can be accommodated to enter the fixed frame (21), the rotating column (48) enters the fixed frame (21) under the action of the torsion spring (46) to clean the corresponding surface between every two single crystal silicon.

10. The sensor single crystal silicon etching device according to claim 1, characterized in that: A positioning platform (49) is fixedly connected to one side of the fixed platform (2); a first hydraulic cylinder (410) is fixedly connected to the upper surface of the positioning platform (49); an output end of the first hydraulic cylinder (410) is fixedly connected to a top plate (411); two clamping plates (412) are slidably connected to the upper surface of the top plate (411); the two clamping plates (412) are used to clamp another group of rotating columns (48) made of sponge material, thereby controlling the humidity of the sponge block and improving the wiping effect.

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