Printed circuit board inner layer depth measurement system and operation method thereof

Abstract

A printed circuit board inner layer depth measurement system is used for measuring the depth in a circuit board test hole and comprises a light source emitter, a semi-permeable mirror module, a depth measurer, a CCD lens module and a processor. The light source emitter emits incident light, the semitransparent mirror module receives and reflects the incident light, the depth measuring device moves towards the semitransparent mirror module, and the tail end of the depth measuring device is a cone covered by a reflecting film layer, so that the incident light is incident to a surface copper annular part, exposed in a circuit board test hole, of the surface copper of the printed circuit board. And the cone of the depth measurer moves towards the middle of the circuit board test hole, so that the incident light is incident to an inner-layer copper annular part, exposed in the circuit board test hole, of the inner-layer copper of the printed circuit board, and the processor calculates the depth according to the interval time of the two reflected light received by the CCD lens module.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board inner layer depth measurement, and in particular to a printed circuit board inner layer depth measurement system and an operation method thereof. Background Art

[0002] Generally speaking, in order to electrically connect at least two circuit layers of a multi-layer circuit board, a conductive via is first formed on the board. However, the conductor tail remaining in the conductive via is not conducive to the transmission of electrical signals and is prone to noise, so back drilling technology is used to remove the conductor tail in the conductive via. Under such conditions, it is extremely important to control the drilling depth of the drill bit.

[0003] In the prior art, the drilling system drills the same batch of circuit boards at the same preset drilling depth. However, the thickness of each circuit board in the same batch of circuit boards may be different, so if all circuit boards are drilled at the same preset drilling depth, some circuit boards may be defective. Summary of the invention

[0004] One of the technical aspects disclosed herein is a printed circuit board inner layer depth measurement system, in which the annular reflected light received by the CCD lens module is reflected from the cone covered by the reflective film layer of the depth meter through the surface copper annular portion and the inner copper annular portion, so that the entire surface copper annular portion and the inner copper annular portion can be completely detected, and a better detection effect can be achieved.

[0005] The embodiment disclosed herein provides a printed circuit board inner layer depth measurement system, which is used to measure the drilling depth in the circuit board test hole, and includes a light source transmitter, a semi-lens module, a depth meter, a CCD lens module and a processor. The light source transmitter is used to emit incident light. The semi-lens module is arranged on one side of the light source transmitter and is used to receive and reflect the incident light. The depth meter is arranged on one side of the semi-lens module. The depth meter and the semi-lens module are arranged on opposite sides of the circuit board test hole, and the depth meter is used to enter the circuit board test hole to move toward the semi-lens module. The end of the depth meter is a cone, which is covered by a reflective film layer to receive the incident light reflected by the semi-lens module and to project the incident light into the surface copper ring portion of the printed circuit board surface copper exposed in the circuit board test hole. The surface copper ring portion reflects the incident light to generate a first ring-shaped reflected light. The CCD lens module is arranged on the side of the semi-lens module facing away from the depth meter and is attached to the semi-lens module. The CCD lens module is used to receive the first annular reflected light, and the cone of the depth measuring device then moves toward the middle of the circuit board test hole, so that the incident light is incident on the inner copper annular portion of the printed circuit board inner copper exposed in the circuit board test hole, and the inner copper annular portion reflects the incident light to generate a second annular reflected light. The processor is electrically connected to the CCD lens module and is used to calculate the drilling depth of the depth measuring device displacement according to the moving distance between the cone of the depth measuring device reflecting the first annular reflected light and the second annular reflected light.

[0006] According to an embodiment of the present disclosure, the top tip of the cone of the depth measuring device has a tip angle, and the tip angle is between 60 degrees and 120 degrees, and the reflective film layer covering the cone is a coated metal layer.

[0007] According to an embodiment of the present disclosure, the top tip of the cone of the depth measuring device is used to align with the center of the test hole of the circuit board so that the cone of the depth measuring device does not touch the surface copper of the printed circuit board and the inner copper of the printed circuit board.

[0008] According to an embodiment of the present disclosure, the cone of the depth measuring device is a conical cylinder.

[0009] According to an embodiment of the present disclosure, the cone of the depth measuring device has a plurality of side portions, and the cone having the plurality of side portions is formed into a polygonal cone.

[0010] Another technical aspect disclosed herein is an operating method of a printed circuit board inner layer depth measurement system, wherein the annular reflected light received by the CCD lens module is reflected from the cone covered by the reflective film layer of the depth measuring device through the surface copper annular portion and the inner copper annular portion, so that the entire surface copper annular portion and the inner copper annular portion can be fully detected, and a better detection effect can be achieved.

[0011] The embodiment of the present disclosure provides an operation method of a printed circuit board inner layer depth measurement system, which is used to measure the drilling depth in a circuit board test hole, and includes: a light source emitter emits incident light; a semi-mirror module receives and reflects the incident light; a cone of a depth measuring device covered by a reflective film layer receives the incident light reflected by the semi-mirror module, and incidents the incident light to a surface copper annular portion of the printed circuit board surface copper exposed in the circuit board test hole, wherein the surface copper annular portion reflects the incident light to generate a first annular reflected light; a CCD lens module receives the first annular reflected light; the cone of the depth measuring device then moves toward the middle of the circuit board test hole, so that the incident light is incident to an inner copper annular portion of the printed circuit board inner layer copper exposed in the circuit board test hole, wherein the inner copper annular portion reflects the incident light to generate a second annular reflected light; and the CCD lens module receives the second annular reflected light, wherein the processor calculates the drilling depth of the displacement of the depth measuring device according to the movement distance between the cone of the depth measuring device and the reflection of the first annular reflected light and the second annular reflected light.

[0012] According to an embodiment of the present disclosure, the cone of the depth measuring device moves from the surface copper of the printed circuit board toward the inner copper of the printed circuit board at a fixed speed, and the CCD lens module captures images at a fixed time to receive the first annular reflected light and the second annular reflected light.

[0013] According to one embodiment of the present disclosure, the cone of the depth meter has a plurality of side portions, and the cone directs incident light onto the copper surface of the printed circuit board, further comprising the plurality of side portions of the cone directing incident light reflected by the semi-mirror module onto the copper surface of the printed circuit board.

[0014] According to an embodiment of the present disclosure, the cone allows the incident light to be incident on the inner copper layer of the printed circuit board, and the plurality of side portions of the cone allow the incident light reflected by the semi-mirror module to be incident on the inner copper layer of the printed circuit board.

[0015] According to an embodiment of the present disclosure, when the CCD lens module receives the first annular reflected light, the processor determines that it is in the initial measurement state, and when the CCD lens module receives the second annular reflected light, the processor determines that it is in the completed measurement state.

[0016] In summary, in the present disclosure, the end of the depth measuring device of the inner layer depth measuring system of the printed circuit board is a cone covered by a reflective film layer, which can be used to project incident light onto the surface copper ring portion of the printed circuit board surface copper exposed in the circuit board test hole, so that the surface copper ring portion reflects the incident light to generate a first ring-shaped reflected light, and can be used to project incident light onto the inner layer copper ring portion of the printed circuit board inner layer copper exposed in the circuit board test hole, so that the inner layer copper ring portion reflects the incident light to generate a second ring-shaped reflected light. Then, the processor can calculate the drilling depth of the depth measuring device displacement according to the moving distance between the cone of the depth measuring device in reflecting the first ring-shaped reflected light and the second ring-shaped reflected light, so as to understand the expected drilling depth of each printed circuit board, which can avoid the situation in which the conventional technology uses the same preset drilling depth to drill all circuit boards, resulting in partial circuit board defects, so as to improve the manufacturing yield of the printed circuit board. In addition, the annular reflected light received by the CCD lens module of the printed circuit board inner layer depth measurement system is reflected from the cone covered by the reflective film layer of the depth meter through the surface copper annular portion and the inner copper annular portion. Therefore, the entire surface copper annular portion and the inner copper annular portion can be completely detected, which can have a better detection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] One embodiment of the present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, in accordance with standard industry practice, the various features are not drawn to scale and are for illustration purposes only. In fact, the size of the various features may be arbitrarily increased or decreased for clarity of discussion.

[0018] Figure 1 FIG. 4 is a block diagram of a printed circuit board inner layer depth measurement system according to an embodiment of the present disclosure.

[0019] Figure 2 A side view of a depth measuring device according to one embodiment of the present disclosure is shown.

[0020] Figure 3 A three-dimensional view of a depth measuring device according to another embodiment of the present disclosure is shown.

[0021] Figure 4 A three-dimensional view of a depth measuring device according to another embodiment of the present disclosure is shown.

[0022] Figure 5 A three-dimensional cross-sectional view of a printed circuit board according to an embodiment of the present disclosure is shown.

[0023] Figures 6 to 9 Schematic diagrams showing a printed circuit board inner layer depth measurement system in operation at different stages according to some embodiments of the present disclosure.

[0024] Fig.10A schematic diagram illustrating a picture captured by a CCD lens module according to an embodiment of the present disclosure.

[0025] Fig.11 A flow chart is shown of an operation method of a printed circuit board inner layer depth measurement system according to an embodiment of the present disclosure.

[0026] In the picture: 100-Printed circuit board inner layer depth measurement system

[0027] 110: Light emitter

[0028] 120: Half-mirror module

[0029] 130, 130a, 130b: Depth measuring device

[0030] 131: Vertex Tip

[0031] 132, 132a, 132b: cone

[0032] 133a, 133b: Side part

[0033] 134: Reflective film layer

[0034] 140: CCD lens module

[0035] 150: Processor

[0036] 200: Copper on the surface of printed circuit board

[0037] 210: Surface copper ring

[0038] 300: Inner copper layer of printed circuit board

[0039] 310: Inner copper ring

[0040] C: Circuit board test hole

[0041] D: Drill depth

[0042] I: Incident light

[0043] L1: First ring reflected ray

[0044] L2: Second ring reflected light

[0045] S1~S6:Steps

[0046] θ: Tip angle DETAILED DESCRIPTION

[0047] The following disclosed embodiments provide many different embodiments, or examples, for implementing the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present invention. Of course, these examples are only examples and are not intended to be limiting. In addition, the present invention may repeat component symbols and / or letters in each example. This repetition is for the purpose of simplicity and clarity, and does not itself specify the relationship between the various embodiments and / or configurations discussed.

[0048] Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe the relationship of one element or feature to another element or feature as illustrated in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0049] Please refer to Figure 1 and Figure 2 , Figure 1 FIG. 1 is a block diagram of a printed circuit board inner layer depth measurement system 100 according to an embodiment of the present disclosure. Figure 2 FIG. 1 is a side view of a depth measuring device 130 according to an embodiment of the present disclosure. Figure 2 In order to clearly illustrate the outline of the cone 132, the reflective film layer 134 covering the cone 132 is omitted. Figure 6 Please note the detailed description). Figure 1 and Figure 2 In the embodiment, the inner layer depth measurement system 100 of the printed circuit board includes a light source emitter 110, a semi-mirror module 120, a depth meter 130, a CCD lens module 140 and a processor 150. The semi-mirror module 120 is arranged on one side of the light source emitter 110. The depth meter 130 is arranged on one side of the semi-mirror module 120. In detail, the depth meter 130 and the semi-mirror module 120 are arranged on opposite sides of the circuit board test hole C. It is worth noting that the end of the depth meter 130 is a cone 132, and the cone 132 is covered by a reflective film layer 134. In other words, the cone 132 of the depth meter 130 has been processed by a coating layer, and the reflective film layer 134 covering the cone 132 is a coated metal layer, such as gold, silver or copper.

[0050] In some embodiments, the vertex tip 131 of the cone 132 of the depth measuring device 130 has a tip angle θ, and the tip angle θ of the vertex tip 131 is between 60 degrees and 120 degrees. The cone 132 of the depth measuring device 130 is a conical cylinder. The CCD lens module 140 is disposed on the side of the semi-mirror module 120 facing away from the depth measuring device 130 and is attached to the semi-mirror module 120. CCD is a charge-coupled device (CCD). The processor 150 is electrically connected to the CCD lens module 140.

[0051] Please refer to Figure 3 and Figure 4 , Figure 3 A three-dimensional diagram of a depth measuring device 130a according to another embodiment of the present disclosure is shown. Figure 4 FIG. 1 is a perspective view of a depth measuring device 130b according to another embodiment of the present disclosure. Figure 3 middle, Figure 3 The depth measuring device 130a shown is Figure 2 The depth measuring device 130 shown is different in that the cone 132a of the depth measuring device 130a has a plurality of side portions 133a, and the cone 132a having the plurality of side portions 133a is formed into a polygonal pyramid. Figure 4 middle, Figure 4 The depth measuring device 130b is shown with Figure 3 The depth measuring device 130a shown is different in that the body of the depth measuring device 130b is a cylinder. Figure 2 Depth measuring device 130, Figure 3 The depth measuring device 130a and Figure 4 The depth measuring devices 130 b have in common that they are all cone-shaped columns covered by the reflective film layer 134 .

[0052] Please refer to Figure 5 , Figure 5 A three-dimensional cross-sectional view of a printed circuit board according to an embodiment of the present disclosure is shown. Figure 5 In the embodiment, the printed circuit board has a circuit board test hole C, and the printed circuit board also has a printed circuit board surface copper 200 and a printed circuit board inner layer copper 300. The surface copper ring portion 210 of the printed circuit board surface copper 200 and the inner layer copper ring portion 310 of the printed circuit board inner layer copper 300 are exposed in the circuit board test hole C.

[0053] Please refer to Figures 6 to 9 , Figures 6 to 9 Schematic diagrams showing the operation of the printed circuit board inner layer depth measurement system 100 according to some embodiments of the present disclosure at different stages. Fig. 9In the present invention, the inner layer depth measurement system 100 of a printed circuit board is used to measure the drilling depth D in a test hole C of a printed circuit board. The light source transmitter 110 is used to emit an incident light I. The semi-mirror module 120 is used to receive and reflect the incident light I. The depth measuring device 130 is used to enter the test hole C of the printed circuit board to move toward the semi-mirror module 120, and the cone 132 of the depth measuring device 130 covered by the reflective film layer 134 can receive the incident light I reflected by the semi-mirror module 120, and can make the incident light I incident on the surface copper annular portion 210 of the printed circuit board surface copper 200 exposed in the test hole C of the printed circuit board. The surface copper annular portion 210 can reflect the incident light I to generate a first annular reflected light L1, so that the CCD lens module 140 can receive the first annular reflected light L1.

[0054] In some embodiments, the cone 132 of the depth measuring device 130 then moves toward the middle of the circuit board test hole C, so that the incident light I is incident on the inner copper ring portion 310 of the inner copper 300 of the printed circuit board exposed in the circuit board test hole C, and the inner copper ring portion 310 can reflect the incident light I to generate a second ring-shaped reflected light L2, so that the CCD lens module 140 is used to receive the second ring-shaped reflected light L2. The processor 150 can calculate the drilling depth D of the displacement of the depth measuring device 130 according to the moving distance between the cone 132 of the depth measuring device 130 in reflecting the first ring-shaped reflected light L1 and the second ring-shaped reflected light L2. In addition, the vertex tip 131 of the cone 132 of the depth measuring device 130 is used to align with the center of the circuit board test hole C, so that the cone 132 of the depth measuring device 130 does not touch the surface copper 200 of the printed circuit board and the inner copper 300 of the printed circuit board in the circuit board test hole C.

[0055] Please refer to Fig.10 , Fig.10 A schematic diagram of a CCD lens module 140 capturing an image according to an embodiment of the present disclosure is shown. Figures 6 to 10 In the figure, the first annular reflected light L1 and the second annular reflected light L2 received by the CCD lens module 140 are reflected from the cone 132 covered by the reflective film layer 134 of the depth meter 130 through the surface copper annular portion 210 and the inner copper annular portion 310. Therefore, the entire surface copper annular portion 210 and the inner copper annular portion 310 can be completely detected, and a better detection effect can be achieved.

[0056] In the following description, the operation method of the printed circuit board inner layer depth measurement system will be described. The component connection relationship, materials and functions described above will not be repeated, and it is better to explain them first.

[0057] Please refer to Fig.11 , Fig.11 A flow chart of an operation method of a printed circuit board inner layer depth measurement system according to an embodiment of the present disclosure is shown. Fig.11 In the method for operating the inner layer depth measuring system of a printed circuit board, the method for operating the inner layer depth measuring system of a printed circuit board can be used to measure the drilling depth in a test hole of a circuit board. First, in step S1, a light source emitter emits incident light. Then, in step S2, a semi-mirror module receives and reflects the incident light. Then, in step S3, a cone of a depth meter covered by a reflective film layer receives the incident light reflected by the semi-mirror module, and directs the incident light to a surface copper annular portion of the surface copper of the printed circuit board exposed in the test hole of the circuit board, wherein the surface copper annular portion reflects the incident light to generate a first annular reflected light. Then, in step S4, a CCD lens module receives the first annular reflected light. Then, in step S5, the cone of the depth measuring device is then moved toward the middle of the circuit board test hole, so that the incident light is incident on the inner copper ring portion of the printed circuit board inner copper exposed in the circuit board test hole, wherein the inner copper ring portion reflects the incident light to generate a second ring-shaped reflected light. Then, in step S6, the CCD lens module receives the second ring-shaped reflected light, wherein the processor calculates the drilling depth of the depth measuring device displacement according to the moving distance between the cone of the depth measuring device and the reflection of the first ring-shaped reflected light and the second ring-shaped reflected light. In the following description, the above steps will be described in detail.

[0058] Back to Figures 1 to 4 as well as Figures 6 to 9 , the light source emitter 110 can emit an incident light I, and the semi-mirror module 120 can receive the incident light and reflect the incident light I to the depth measuring device 130. Then, the cone 132 of the depth measuring device 130 covered by the reflective film layer 134 can receive the incident light I reflected by the semi-mirror module 120, and can project the incident light I to the surface copper annular portion 210 of the printed circuit board surface copper 200 exposed in the circuit board test hole C, so that the surface copper annular portion 210 reflects the incident light I to generate a first annular reflected light L1, and the CCD lens module 140 can receive the first annular reflected light L1. In other embodiments, the plurality of side portions 133a of the cone 132a of the depth measuring device 130a or the plurality of side portions 133b of the cone 132b of the depth measuring device 130b can project the incident light I reflected by the semi-mirror module 120 to the surface copper 200 of the printed circuit board.

[0059] Next, the cone 132 of the depth measuring device 130 moves toward the middle of the circuit board test hole C, so that the incident light I is incident on the inner copper annular portion 310 of the inner copper 300 of the printed circuit board exposed in the circuit board test hole C, and the inner copper annular portion 310 can reflect the incident light I to generate a second annular reflected light L2, and the CCD lens module 140 can receive the second annular reflected light L2. Next, the processor 150 calculates the drilling depth D of the displacement of the depth measuring device 130 according to the moving distance between the cone 132 of the depth measuring device 130 in reflecting the first annular reflected light L1 and the second annular reflected light L2. It is worth noting that the cone 132 of the depth measuring device 130 moves from the surface copper 200 of the printed circuit board toward the inner copper 300 of the printed circuit board at a fixed speed, and the CCD lens module 140 captures the picture at a fixed time to receive the first annular reflected light L1 and the second annular reflected light L2. In other embodiments, the plurality of side portions 133a of the cone 132a of the depth measuring device 130a or the plurality of side portions 133b of the cone 132b of the depth measuring device 130b can cause the incident light I reflected by the semi-mirror module 120 to be incident on the inner copper layer 300 of the printed circuit board. In addition, when the CCD lens module 140 receives the first annular reflected light L1, the processor 150 determines that it is in the initial measurement state, and when the CCD lens module 140 receives the second annular reflected light L2, the processor 150 determines that it is in the completed measurement state.

[0060] In summary, the end of the depth measuring device 130 of the printed circuit board inner layer depth measuring system 100 is a cone 132 covered by a reflective film layer 134, which can be used to allow the incident light I to be incident on the surface copper annular portion 210 of the printed circuit board surface copper 200 exposed in the circuit board test hole C, so that the surface copper annular portion 210 reflects the incident light I to generate a first annular reflected light L1, and can be used to allow the incident light I to be incident on the inner copper annular portion 310 of the printed circuit board inner layer copper 300 exposed in the circuit board test hole C, so that the inner copper annular portion 310 reflects the incident light I to generate a second annular reflected light L2. Next, the processor 150 can calculate the drilling depth D of the depth measuring device 130 displacement according to the moving distance between the cone 132 of the depth measuring device 130 in reflecting the first annular reflected light L1 and the second annular reflected light L2, so as to understand the expected drilling depth of each printed circuit board, and avoid the situation where the conventional technology uses the same preset drilling depth to drill all circuit boards, resulting in partial circuit board defects, so as to improve the manufacturing yield of the printed circuit board. In addition, the annular reflected light received by the CCD lens module 140 of the printed circuit board inner layer depth measurement system 100 is reflected from the cone 132 of the depth measuring device 130 covered by the reflective film layer 134 through the surface copper annular portion 210 and the inner copper annular portion 310, so the entire surface copper annular portion 210 and the inner copper annular portion 310 can be completely detected, with a better detection effect.

[0061] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and modifications here without departing from the spirit and scope of the present disclosure.

Claims

1. A printed circuit board inner layer depth measurement system, characterized in that: Used to measure the drilling depth (D) in a circuit board test hole (C), and includes: A light source emitter (110) for emitting an incident light (I); A half lens module (120) is disposed on one side of the light source emitter (110) and is used to receive and reflect the incident light (I); A depth measuring device (130) is arranged on one side of the semi-mirror module (120), wherein the depth measuring device (130) and the semi-mirror module (120) are arranged on opposite sides of the circuit board test hole (C), and the depth measuring device (130) is used to enter the circuit board test hole (C) to move toward the semi-mirror module (120), and the end of the depth measuring device (130) is a cone (132), and the cone (132) is covered by a reflective film layer (134) to receive the incident light (I) reflected by the semi-mirror module (120), and the incident light (I) is incident on a surface copper annular portion (210) of a printed circuit board surface copper (200) exposed in the circuit board test hole (C), and the surface copper annular portion (210) reflects the incident light (I) to generate a first annular reflected light (L1); a CCD lens module (140) disposed on a side of the semi-mirror module (120) facing away from the depth measuring device (130) and attached to the semi-mirror module (120), wherein the CCD lens module (140) is used to receive the first annular reflected light (L1), and the cone (132) of the depth measuring device (130) then moves toward the middle of the circuit board test hole (C), so that the incident light (I) is incident on an inner copper annular portion (310) of an inner copper layer (300) of a printed circuit board exposed in the circuit board test hole (C), and the inner copper annular portion (310) reflects the incident light (I) to generate a second annular reflected light (L2); and A processor (150) is electrically connected to the CCD lens module (140) and is used to calculate the drilling depth (D) of the depth measuring device (130) according to the moving distance between the first annular reflection light (L1) and the second annular reflection light (L2) reflected by the cone (132) of the depth measuring device (130).

2. The printed circuit board inner layer depth measurement system according to claim 1, characterized in that: A vertex tip (131) of the cone (132) of the depth meter (130) has a tip angle (θ), and the tip angle (θ) is between 60 degrees and 120 degrees, and the reflective film layer (134) covering the cone (132) is a coated metal layer.

3. The printed circuit board inner layer depth measurement system according to claim 2, characterized in that: The top tip (131) of the cone (132) of the depth measuring device (130) is used to align with the center of the circuit board test hole (C), so that the cone (132) of the depth measuring device (130) does not touch the surface copper (200) of the printed circuit board and the inner layer copper (300) of the printed circuit board.

4. The printed circuit board inner layer depth measurement system according to claim 1, characterized in that: The cone (132) of the depth measuring device (130) is a conical cylinder.

5. The printed circuit board inner layer depth measurement system according to claim 1, characterized in that: The cone (132a) of the depth measuring device (130a) has a plurality of side portions (133a), and the cone (132a) having the plurality of side portions (133a) is formed as a polygonal pyramid.

6. An operating method of a printed circuit board inner layer depth measurement system, applied to the printed circuit board inner layer depth measurement system as claimed in any one of claims 1 to 5, for measuring a drilling depth (D) in a circuit board test hole (C), characterized in that: The following steps are involved: A light source emitter (110) emits an incident light (I); The half lens module (120) receives and reflects the incident light (I); A depth measuring device (130) having a cone (132) covered by a reflective film layer (134) receives the incident light (I) reflected by the semi-mirror module (120), and directs the incident light (I) to a surface copper annular portion (210) of a printed circuit board surface copper (200) exposed in a circuit board test hole (C), wherein the surface copper annular portion (210) reflects the incident light (I) to generate a first annular reflected light (L1); A CCD lens module (140) receives the first annular reflected light (L1); The cone (132) of the depth measuring device (130) then moves toward the middle of the circuit board test hole (C), so that the incident light (I) is incident on an inner copper annular portion (310) of an inner copper layer (300) of a printed circuit board exposed in the circuit board test hole (C), wherein the inner copper annular portion (310) reflects the incident light (I) to generate a second annular reflected light (L2); as well as The CCD lens module (140) receives the second annular reflected light (L2), wherein a processor (150) calculates the drilling depth (D) of the depth measuring device (130) according to the moving distance between the first annular reflected light (L1) and the second annular reflected light (L2) reflected by the cone (132) of the depth measuring device (130).

7. The operating method of the printed circuit board inner layer depth measurement system according to claim 6, characterized in that: The cone (132) of the depth measuring device (130) moves from the surface copper (200) of the printed circuit board toward the inner layer copper (300) of the printed circuit board at a fixed speed, and the CCD lens module (140) captures images at a fixed time to receive the first annular reflected light (L1) and the second annular reflected light (L2).

8. The operating method of the printed circuit board inner layer depth measurement system according to claim 6, characterized in that: The cone (132a) of the depth measuring device (130a) has a plurality of side portions (133a), and the cone (132a) directs the incident light (I) to the copper (200) on the surface of the printed circuit board and further comprises: The plurality of side portions (133a) of the cone (132a) cause the incident light (I) reflected by the semi-mirror module (120) to be incident on the copper (200) on the surface of the printed circuit board.

9. The operating method of the printed circuit board inner layer depth measurement system according to claim 8, characterized in that: The cone (132a) directs the incident light (I) to the inner copper layer (300) of the printed circuit board and further comprises: The plurality of side portions (133a) of the cone (132a) cause the incident light (I) reflected by the semi-mirror module (120) to be incident on the inner copper layer (300) of the printed circuit board.

10. The operating method of the printed circuit board inner layer depth measurement system according to claim 6, characterized in that: When the CCD lens module (140) receives the first annular reflected light (L1), the processor (150) determines that it is in an initial measurement state, and when the CCD lens module (140) receives the second annular reflected light (L2), the processor (150) determines that it is in a completed measurement state.

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