A sample position correction method, device, electronic equipment and storage medium

Abstract

The present disclosure provides a sample position correction method, device, electronic device and storage medium, wherein the method comprises: placing a sample to be tested on a sample slot of a motion platform, wherein the sample to be tested comprises a plurality of grids arranged in an array along a first direction and a second direction, wherein the first direction is perpendicular to the second direction; determining a user coordinate system corresponding to the sample to be tested, wherein an X-axis of the user coordinate system is parallel to the first direction, a Y-axis is parallel to the second direction, and an origin coincides with the center of the sample slot; acquiring an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position of the sample to be tested along the Y-axis direction; determining a coordinate value of a correction point corresponding to the center position of the sample to be tested according to the electron beam image; determining a deviation value of a mechanical parameter corresponding to the motion platform according to the coordinate value of the correction point; and correcting the position of the sample to be tested according to the deviation value of the mechanical parameter.

Description

Technical Field

[0001] The present disclosure relates to the technical field of scanning electron microscopes, and in particular to a sample position correction method, device, electronic equipment and storage medium. Background Art

[0002] Microscopes are the eyes of human beings to study the objective world. Among them, scanning transmission electron microscopy (STEM) is a widely used microscope with nano-level characterization capabilities, which is often used in the fields of biology, semiconductors, and materials science. However, when taking and delivering samples, the millimeter-level gap problem between the sample and the sample slot has become a major problem affecting the accuracy of micron-level observations. Specifically, after each sample taking and delivery operation, the position of the sample in the sample slot often has a micron-level deviation from the previous position. This deviation directly leads to the inconsistency between the point mark on the sample schematic and the actual irradiation point of the electron beam, which in turn has an adverse effect on the observer's accurate judgment. The existing method of manually correcting the sample position requires the operator to repeatedly move the sample position and visually compare whether the feature information in the electron beam image is consistent with the specific point feature in the sample schematic. This process is not only cumbersome and inefficient, but also highly dependent on the operator's professional skills and rich experience, which limits the efficiency of subsequent sample observation and analysis. Summary of the invention

[0003] The present disclosure provides a sample position correction method, device, electronic device and storage medium to at least solve the above technical problems existing in the prior art.

[0004] According to a first aspect of the present disclosure, a sample position correction method is provided, wherein the method comprises:

[0005] Placing a sample to be tested on a sample slot of a moving platform, wherein the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, wherein the first direction is perpendicular to the second direction;

[0006] Determine a user coordinate system corresponding to the sample to be tested, wherein an X-axis of the user coordinate system is parallel to the first direction, a Y-axis is parallel to the second direction, and an origin coincides with a center of the sample slot;

[0007] Acquire an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction;

[0008] Determining the coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam image;

[0009] Determining the deviation value of the mechanical parameter corresponding to the motion platform according to the coordinate value of the calibration point;

[0010] The position of the sample to be tested is corrected according to the deviation value of the mechanical parameter.

[0011] In one possible implementation, determining the deviation value of the mechanical parameter corresponding to the motion platform according to the coordinate value of the calibration point includes:

[0012] According to affine transformation, the user coordinate system is converted into a motion coordinate system, and the coordinate value of the conversion point corresponding to the coordinate value of the correction point in the motion coordinate system is obtained; wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image;

[0013] Acquire a mapping table between the motion coordinate system and the mechanical parameters;

[0014] Determine, according to the mapping table, the mechanical parameters corresponding to the origin of the motion coordinate system and the mechanical parameters corresponding to the conversion point;

[0015] The deviation value of the mechanical parameter is determined according to the mechanical parameter corresponding to the origin of the motion coordinate system and the mechanical parameter corresponding to the conversion point.

[0016] In one possible implementation, the mechanical parameter includes a motor pulse value.

[0017] In one possible implementation, obtaining an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction; and determining the coordinate value of a correction point corresponding to the center position of the sample to be tested according to the electron beam image, including:

[0018] The Y-axis coordinate of the electron beam irradiation imaging point is fixed to 0, and the motion platform is moved along the X-axis direction of the user coordinate system to obtain electron beam images of two relative edge positions of the sample to be tested in the X-axis direction;

[0019] Determine the X-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the X-axis direction;

[0020] The X-axis coordinate of the irradiation imaging point of the electron beam is fixed as the X-axis coordinate value of the calibration point, and the motion platform is moved along the Y-axis direction of the user coordinate system to obtain electron beam images of two relative edge positions of the sample to be tested in the Y-axis direction;

[0021] According to the electron beam images of two opposite edge positions of the sample to be tested in the Y-axis direction, the Y-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested is determined.

[0022] In one possible implementation, determining the X-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the X-axis direction includes:

[0023] Determine the X-axis coordinates of the edge positions of the sample to be tested in the negative direction of the X-axis and the positive direction of the X-axis respectively according to the electron beam images of the two relative edge positions of the sample to be tested in the X-axis direction;

[0024] Taking the average of the X-axis coordinates of the edge position of the sample to be tested in the negative direction of the X-axis and the positive direction of the X-axis to obtain the X-axis coordinate value of the calibration point;

[0025] Determining the Y-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the Y-axis direction includes:

[0026] Determine the Y-axis coordinates of the edge positions of the sample to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis respectively according to the electron beam images of the two relative edge positions of the sample to be tested in the Y-axis direction;

[0027] The Y-axis coordinate value of the calibration point is obtained by taking the average value of the Y-axis coordinates of the edge positions of the sample to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis.

[0028] In one possible implementation manner, the step of correcting the position of the sample to be tested according to the deviation value of the mechanical parameter includes:

[0029] Acquire a first coordinate value of a first point of the sample to be tested in a user coordinate system, wherein the first point is any point on the sample to be tested;

[0030] Converting the first coordinate value into a first converted coordinate value in the motion coordinate system;

[0031] Determining a first mechanical parameter corresponding to the first converted coordinate value according to the mapping table;

[0032] Subtracting the deviation value from the first mechanical parameter to determine a first corrected mechanical parameter;

[0033] According to the first calibration mechanical parameter, the motion platform is controlled to move so as to calibrate the position of the first point of the sample to be tested.

[0034] In one possible implementation manner, converting the user coordinate system into a motion coordinate system according to an affine transformation includes:

[0035] The user coordinate system is converted into the motion coordinate system using the following formula:

[0036]

[0037] Where x and y are the coordinates of the point in the user coordinate system, x′ and y′ are the coordinates of the point in the motion coordinate system, θ is the angular deviation between the coordinate systems, and T x and T y is the translation deviation between the coordinate systems.

[0038] According to a second aspect of the present disclosure, a sample position correction device is provided, wherein the device comprises:

[0039] A clamping unit, used to place a sample to be tested on a sample slot of the moving platform, wherein the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, wherein the first direction is perpendicular to the second direction;

[0040] A first determining unit, configured to determine a user coordinate system corresponding to the sample to be tested, wherein an X-axis of the user coordinate system is parallel to the first direction, a Y-axis is parallel to the second direction, and an origin coincides with a center of the sample slot;

[0041] An acquisition unit, used for acquiring an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction;

[0042] A second determination unit, used to determine the coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam image;

[0043] A third determining unit, configured to determine a deviation value of a mechanical parameter corresponding to the motion platform according to a coordinate value of the calibration point;

[0044] A correction unit is used to correct the position of the sample to be tested according to the deviation value of the mechanical parameter.

[0045] According to a third aspect of the present disclosure, there is provided an electronic device, including:

[0046] at least one processor; and

[0047] a memory communicatively connected to the at least one processor; wherein,

[0048] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present disclosure.

[0049] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute the method described in the present disclosure.

[0050] The sample position correction method, device, electronic device and storage medium disclosed in the present invention obtain the electron beam image of the edge position of the sample to be tested, calculate the coordinate value of the correction point corresponding to the center point of the sample to be tested in the user coordinate system, and then obtain the deviation value of the mechanical parameter corresponding to the motion platform according to the coordinate value of the correction point. Subsequently, the position of the motion platform is adjusted according to the relevant parameters to ensure that the position of the corrected sample to be tested corresponds to the sample slot, thereby eliminating the observation error caused by the position deviation. The present invention abandons the traditional method of manual center point positioning that is highly dependent on the operator's experience, simplifies the operation complexity through automation, and greatly improves the accuracy of the correction and the data accuracy of the overall observation system.

[0051] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0053] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0054] Figure 1 A flow chart of a sample position correction method provided in an embodiment of the present disclosure;

[0055] Figure 2 Schematic diagram of the electron beam image of the sample to be tested;

[0056] Figure 3 A physical picture of the sample to be tested;

[0057] Figure 4 A schematic diagram of the structure of a sample position correction device provided in an embodiment of the present disclosure;

[0058] Figure 5 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0059] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0060] The present disclosure provides a method for correcting the position of a sample. Figure 1 A flow chart of a sample position correction method provided in an embodiment of the present disclosure, such as Figure 1 As shown, the sample position correction method includes:

[0061] Step 101 , placing a sample to be tested on a sample slot of a moving platform, wherein the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, wherein the first direction is perpendicular to the second direction.

[0062] Figure 2 Figure 1 is a schematic diagram of the electron beam image of the sample to be tested. Figure 2 As shown, when the sample 10 to be tested is placed on the sample slot 201 of the moving platform 20, due to errors in manual placement and other reasons, the sample 10 to be tested is not correctly placed in the sample slot 201, and there is a certain gap between the sample 10 to be tested and the sample slot 201. Therefore, the position of the sample 10 to be tested needs to be adjusted subsequently to be correctly placed in the sample slot 201.

[0063] Figure 3 is a physical picture of the sample to be tested. Figure 3 As shown, the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, and the first direction is perpendicular to the second direction.

[0064] Step 102, determining a user coordinate system corresponding to the sample to be tested, wherein the X axis of the user coordinate system is parallel to the first direction, the Y axis is parallel to the second direction, and the origin coincides with the center of the sample slot.

[0065] See also Figure 2 , the X-axis of the user coordinate system is the axis X1 in the figure, and the Y-axis is the axis Y1 in the figure.

[0066] It can be understood that the origin of the user coordinate system is the position of the ideal center point of the sample to be measured.

[0067] Step 103, obtaining an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction;

[0068] Step 104: Determine the coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam image.

[0069] In one embodiment, an electron beam image of an edge position of the sample 10 to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction are obtained; and a coordinate value of a calibration point corresponding to the center position of the sample 10 to be tested is determined according to the electron beam image, including:

[0070] The Y-axis coordinate of the electron beam irradiation imaging point is fixed to 0, and the motion platform 20 is moved along the X-axis direction of the user coordinate system to obtain electron beam images of two opposite edge positions of the sample 10 to be tested in the X-axis direction;

[0071] Determine the X-axis coordinate value of the calibration point corresponding to the center position of the sample 10 to be tested according to the electron beam images of two opposite edge positions of the sample 10 to be tested in the X-axis direction;

[0072] The X-axis coordinate of the electron beam irradiation imaging point is fixed as the X-axis coordinate value of the calibration point, and the motion platform 20 is moved along the Y-axis direction of the user coordinate system to obtain electron beam images of two relative edge positions of the sample 10 to be tested in the Y-axis direction;

[0073] According to the electron beam images of two opposite edge positions of the sample 10 to be tested in the Y-axis direction, the Y-axis coordinate value of the calibration point corresponding to the center position of the sample 10 to be tested is determined.

[0074] In one embodiment, determining the X-axis coordinate value of the calibration point corresponding to the center position of the sample 10 to be tested according to the electron beam images of two relative edge positions of the sample 10 to be tested in the X-axis direction includes:

[0075] Determine the X-axis coordinates of the edge positions of the sample 10 to be tested in the negative direction of the X-axis and the positive direction of the X-axis, respectively, according to the electron beam images of the two opposite edge positions of the sample 10 to be tested in the X-axis direction;

[0076] The X-axis coordinates of the edge positions of the sample 10 to be tested in the negative direction of the X-axis and the positive direction of the X-axis are averaged to obtain the X-axis coordinate value of the calibration point;

[0077] Determining the Y-axis coordinate value of the calibration point corresponding to the center position of the sample 10 to be tested according to the electron beam images of two relative edge positions of the sample 10 to be tested in the Y-axis direction includes:

[0078] Determine the Y-axis coordinates of the edge positions of the sample 10 to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis, respectively, according to the electron beam images of the two relative edge positions of the sample 10 to be tested in the Y-axis direction;

[0079] The Y-axis coordinate value of the calibration point is obtained by taking the average value of the Y-axis coordinates of the edge positions of the sample 10 to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis.

[0080] Specifically, see Figure 2 In the user coordinate system, the Y-axis coordinate of the electron beam irradiation imaging point is fixed to 0, and the motion platform 20 is moved so that the image moves in the X-axis direction. The real-time collected electron beam image is analyzed to determine whether it reaches the edge position of the sample 10 to be tested. When the electron beam irradiates the sample 10 to be tested, the blocked part is displayed as a black area on the image because the electron beam cannot penetrate, and the unblocked area is white, such as Figure 3 As shown in the figure, the area shown by the dotted box is the unblocked area, and the grid of the sample to be tested is also the unblocked area, while the edge of the sample to be tested is solid, so it is the blocked area. Therefore, the sample to be tested 10 will appear half black and half white at the edge, and the dividing line is an arc. Based on this, the image can be analyzed to determine whether it has reached the edge position.

[0081] After obtaining the electron beam images of two relative edge positions of the sample 10 to be tested in the X-axis direction, the X-axis coordinates of the edge positions of the sample 10 to be tested in the negative direction of the X-axis and the positive direction of the X-axis are determined, such as Figure 2 As shown, the coordinate point of the edge position of the sample 10 to be tested in the negative direction of the X-axis is A1, and the coordinate point of the edge position in the positive direction of the X-axis is A2. By taking the average of A1 and A2, the X-axis coordinate value of the correction point C corresponding to the center position of the sample 10 to be tested can be obtained. For example, if A1 is -6 and A2 is 4, then the X-axis coordinate value of the correction point C is -1.

[0082] Next, the X-axis coordinate of the electron beam irradiation imaging point is fixed to the X-axis coordinate value of the correction point C, and the motion platform 20 is moved so that the image moves in the Y-axis direction. The real-time collected image is analyzed to determine whether it reaches the edge position of the sample 10 to be tested.

[0083] After obtaining the electron beam images of two relative edge positions of the sample 10 to be tested in the Y-axis direction, the Y-axis coordinates of the edge positions of the sample 10 to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis are determined, such as Figure 2 As shown, the coordinate point of the edge position of the sample 10 to be tested in the negative direction of the Y axis is B1, and the coordinate point of the edge position in the positive direction of the Y axis is B2. The average value of B1 and B2 can be used to obtain the Y-axis coordinate value of the calibration point C corresponding to the center position of the sample 10 to be tested. For example, if B1 is -6 and B2 is 4, the Y-axis coordinate value of the calibration point C is -1, so the coordinate of the calibration point C can be obtained as (-1, -1). It can be understood that the calibration point C is the actual center point of the sample 10 to be tested.

[0084] Step 105: Determine the deviation value of the mechanical parameter corresponding to the motion platform according to the coordinate value of the calibration point.

[0085] In one embodiment, the deviation value of the mechanical parameter corresponding to the motion platform 20 is determined according to the coordinate value of the calibration point C, including:

[0086] According to the affine transformation, the user coordinate system is converted into the motion coordinate system, and the coordinate value of the conversion point corresponding to the coordinate value of the correction point C in the motion coordinate system is obtained; wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to the two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image;

[0087] Obtain a mapping table between the motion coordinate system and mechanical parameters;

[0088] According to the mapping table, determine the mechanical parameters corresponding to the origin of the motion coordinate system and the mechanical parameters corresponding to the conversion point;

[0089] The deviation value of the mechanical parameter is determined according to the mechanical parameter corresponding to the origin of the motion coordinate system and the mechanical parameter corresponding to the conversion point.

[0090] Specifically, Figure 2 As shown, the X-axis of the motion coordinate system is the axis X2 in the figure, and the Y-axis is the axis Y2 in the figure.

[0091] First, the user coordinate system is converted into the motion coordinate system using affine transformation. Specifically, the user coordinate system can be converted into the motion coordinate system using the following formula:

[0092]

[0093] Where x and y are the coordinates of the point in the user coordinate system, x′ and y′ are the coordinates of the point in the motion coordinate system, θ is the angular deviation between the coordinate systems, and T x and T y is the translation deviation between the coordinate systems.

[0094] After the user coordinate system is converted into the motion coordinate system according to the above formula, the correction point C is converted into the motion coordinate system to obtain the coordinate value of the corresponding conversion point (not shown in the figure).

[0095] Then, a mapping table between the motion coordinate system and the mechanical parameters is obtained; the mechanical parameters here can be the motor pulse value of the motor that controls the motion of the motion platform, or can be the mechanical parameters of other devices that control the movement of the motion platform, such as the pressure value of the pneumatic compressor, the piezoelectric coefficient of the piezoelectric ceramic, etc. In the embodiment of the present disclosure, the electrode pulse value is taken as an example for introduction.

[0096] Since the stepper motor outputs discrete pulse values, it cannot be mapped one-to-one with continuous coordinate values, and the motor movement direction is not completely vertical, and there are slight angular deviations in some areas. At this time, a mapping table is needed to complete the mapping between the motion coordinate system and the motor coordinate system (motor pulse value). The mapping table is obtained in advance by moving the motion platform and taking images of it at different positions and then analyzing and processing them uniformly.

[0097] After obtaining the mapping table, the mechanical parameters corresponding to the origin of the motion coordinate system and the mechanical parameters corresponding to the conversion point are determined; then the mechanical parameters corresponding to the origin of the motion coordinate system are subtracted from the mechanical parameters corresponding to the conversion point to obtain the deviation value of the mechanical parameters.

[0098] Step 106: Correct the position of the sample to be tested according to the deviation value of the mechanical parameter.

[0099] In one embodiment, the position of the sample 10 to be tested is corrected according to the deviation value of the mechanical parameter, including:

[0100] Obtaining a first coordinate value of a first point of the sample to be tested 10 in a user coordinate system, wherein the first point is any point on the sample to be tested 10;

[0101] Convert the first coordinate value into a first converted coordinate value in a motion coordinate system;

[0102] Determine, according to the mapping table, a first mechanical parameter corresponding to the first conversion coordinate value;

[0103] Subtract the deviation value from the first mechanical parameter to determine a first corrected mechanical parameter;

[0104] According to the first calibration mechanical parameter, the motion platform is controlled to move so as to calibrate the position of the first point of the sample to be measured.

[0105] The calculated deviation value represents the deviation between the ideal point and the actual point of the sample to be tested, such as the deviation between the ideal center point and the actual center point, and is mapped to the motor pulse value of the motion platform for storage. When the user subsequently moves the electron beam irradiation point, the software algorithm will subtract the deviation value from the final calculation result when calculating the corresponding motor pulse value to eliminate the deviation between the ideal point and the actual point of the sample to be tested, thereby correcting the position of the sample to be tested.

[0106] The present invention does not require complicated calculations, but uses the inherent characteristics of the sample itself (when the electron beam irradiates the sample, the blocked part is displayed as a black area on the image because the electron beam cannot penetrate, and the unblocked area is white) as a reference to automatically identify and locate its center point, and convert the coordinate value of the correction point into the motor pulse value of the motion platform, which simplifies the application steps of the coordinate value of the correction point, facilitates the implementation of subsequent correction operations, and improves the overall response speed and execution efficiency of the system.

[0107] The present disclosure also provides a sample position correction device. Figure 4 A schematic diagram of the structure of the sample position correction device provided in the embodiment of the present disclosure, as shown in FIG. Figure 4 As shown, the device comprises:

[0108] The clamping unit 401 is used to place the sample to be tested on the sample slot of the moving platform, wherein the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, wherein the first direction is perpendicular to the second direction;

[0109] A first determining unit 402 is used to determine a user coordinate system corresponding to the sample to be tested, wherein the X axis of the user coordinate system is parallel to the first direction, the Y axis is parallel to the second direction, and the origin coincides with the center of the sample slot;

[0110] An acquisition unit 403 is used to acquire an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction;

[0111] A second determining unit 404 is used to determine the coordinate value of the calibration point corresponding to the center position of the sample to be measured according to the electron beam image;

[0112] The third determining unit 405 is used to determine the deviation value of the mechanical parameter corresponding to the motion platform according to the coordinate value of the calibration point;

[0113] The correction unit 406 is used to correct the position of the sample to be tested according to the deviation value of the mechanical parameter.

[0114] In one embodiment, the third determining unit 405 includes:

[0115] A conversion unit, used for converting the user coordinate system into a motion coordinate system according to an affine transformation, and obtaining the coordinate value of the conversion point corresponding to the coordinate value of the correction point in the motion coordinate system; wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image;

[0116] A first sub-acquisition unit, used to acquire a mapping table between a motion coordinate system and mechanical parameters;

[0117] A first sub-determining unit, configured to determine the mechanical parameters corresponding to the origin of the motion coordinate system and the mechanical parameters corresponding to the conversion point according to the mapping table;

[0118] The second sub-determining unit is used to determine the deviation value of the mechanical parameter according to the mechanical parameter corresponding to the origin of the motion coordinate system and the mechanical parameter corresponding to the conversion point.

[0119] In one embodiment, the obtaining unit 403 and the second determining unit 404 are specifically configured to:

[0120] The Y-axis coordinate of the electron beam irradiation imaging point is fixed to 0, and the motion platform is moved along the X-axis direction of the user coordinate system to obtain electron beam images of two relative edge positions of the sample to be tested in the X-axis direction;

[0121] Determine the X-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the X-axis direction;

[0122] The X-axis coordinate of the irradiation imaging point of the electron beam is fixed as the X-axis coordinate value of the calibration point, and the motion platform is moved along the Y-axis direction of the user coordinate system to obtain electron beam images of two relative edge positions of the sample to be tested in the Y-axis direction;

[0123] According to the electron beam images of two opposite edge positions of the sample to be tested in the Y-axis direction, the Y-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested is determined.

[0124] In one embodiment, determining the X-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the X-axis direction includes:

[0125] Determine the X-axis coordinates of the edge positions of the sample to be tested in the negative direction of the X-axis and the positive direction of the X-axis respectively according to the electron beam images of the two relative edge positions of the sample to be tested in the X-axis direction;

[0126] The X-axis coordinates of the edge positions of the sample to be tested in the negative direction of the X-axis and the positive direction of the X-axis are averaged to obtain the X-axis coordinate value of the calibration point;

[0127] Determining the Y-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the Y-axis direction includes:

[0128] Determine the Y-axis coordinates of the edge positions of the sample to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis respectively according to the electron beam images of the two relative edge positions of the sample to be tested in the Y-axis direction;

[0129] The Y-axis coordinate value of the calibration point is obtained by taking the average value of the Y-axis coordinates of the edge positions of the sample to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis.

[0130] In one embodiment, the correction unit 406 includes:

[0131] A second sub-acquisition unit is used to acquire a first coordinate value of a first point of the sample to be tested in a user coordinate system, wherein the first point is any point on the sample to be tested;

[0132] A first sub-conversion unit, used for converting the first coordinate value into a first conversion coordinate value in a motion coordinate system;

[0133] A third sub-determining unit, configured to determine a first mechanical parameter corresponding to the first converted coordinate value according to the mapping table;

[0134] a fourth sub-determining unit, configured to subtract the deviation value from the first mechanical parameter to determine a first corrected mechanical parameter;

[0135] The first sub-calibration unit is used to control the motion platform to move according to the first calibration mechanical parameter, so as to calibrate the position of the first point of the sample to be measured.

[0136] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.

[0137] Figure 5 A schematic block diagram of an example electronic device 500 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0138] like Figure 5 As shown, the device 500 includes a computing unit 501, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 508 into a random access memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the device 500 can also be stored. The computing unit 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0139] A number of components in the device 500 are connected to the I / O interface 505, including: an input unit 506, such as a keyboard, a mouse, etc.; an output unit 507, such as various types of displays, speakers, etc.; a storage unit 508, such as a disk, an optical disk, etc.; and a communication unit 509, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 509 allows the device 500 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0140] The computing unit 501 can be various general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 501 performs the various methods and processes described above, such as the sample position correction method. For example, in some embodiments, the sample position correction method can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 508. In some embodiments, part or all of the computer program can be loaded and / or installed on the device 500 via ROM 502 and / or communication unit 509. When the computer program is loaded into RAM 503 and executed by the computing unit 501, one or more steps of the sample position correction method described above can be performed. Alternatively, in other embodiments, the computing unit 501 can be configured to perform the sample position correction method by any other appropriate means (e.g., by means of firmware).

[0141] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0142] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0143] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0144] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0145] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0146] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0147] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0148] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0149] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A sample position correction method, characterized in that: The method comprises: Placing a sample to be tested on a sample slot of a moving platform, wherein the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, wherein the first direction is perpendicular to the second direction; Determine a user coordinate system corresponding to the sample to be tested, wherein an X-axis of the user coordinate system is parallel to the first direction, a Y-axis is parallel to the second direction, and an origin coincides with a center of the sample slot; Acquire an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction; Determining the coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam image; Determining the deviation value of the mechanical parameter corresponding to the motion platform according to the coordinate value of the calibration point; The position of the sample to be tested is corrected according to the deviation value of the mechanical parameter.

2. The method according to claim 1, characterized in that The step of determining the deviation value of the mechanical parameter corresponding to the motion platform according to the coordinate value of the calibration point comprises: According to affine transformation, the user coordinate system is converted into a motion coordinate system, and the coordinate value of the conversion point corresponding to the coordinate value of the correction point in the motion coordinate system is obtained; wherein the X axis and the Y axis of the motion coordinate system are respectively parallel to two adjacent rectangular sides of the electron beam image, and the origin coincides with the center of the electron beam image; Acquire a mapping table between the motion coordinate system and the mechanical parameters; Determine, according to the mapping table, the mechanical parameters corresponding to the origin of the motion coordinate system and the mechanical parameters corresponding to the conversion point; The deviation value of the mechanical parameter is determined according to the mechanical parameter corresponding to the origin of the motion coordinate system and the mechanical parameter corresponding to the conversion point.

3. The method according to claim 1, characterized in that The mechanical parameters include motor pulse values.

4. The method according to claim 1, characterized in that: Acquire an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction; Determining the coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam image includes: The Y-axis coordinate of the electron beam irradiation imaging point is fixed to 0, and the motion platform is moved along the X-axis direction of the user coordinate system to obtain electron beam images of two relative edge positions of the sample to be tested in the X-axis direction; Determine the X-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the X-axis direction; The X-axis coordinate of the irradiation imaging point of the electron beam is fixed as the X-axis coordinate value of the calibration point, and the motion platform is moved along the Y-axis direction of the user coordinate system to obtain electron beam images of two relative edge positions of the sample to be tested in the Y-axis direction; According to the electron beam images of two relative edge positions of the sample to be tested in the Y-axis direction, the Y-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested is determined.

5. The method according to claim 4, characterized in that Determining the X-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the X-axis direction includes: Determine the X-axis coordinates of the edge positions of the sample to be tested in the negative direction of the X-axis and the positive direction of the X-axis respectively according to the electron beam images of the two relative edge positions of the sample to be tested in the X-axis direction; Taking the average of the X-axis coordinates of the edge position of the sample to be tested in the negative direction of the X-axis and the positive direction of the X-axis to obtain the X-axis coordinate value of the calibration point; Determining the Y-axis coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam images of two relative edge positions of the sample to be tested in the Y-axis direction includes: Determine the Y-axis coordinates of the edge positions of the sample to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis respectively according to the electron beam images of the two relative edge positions of the sample to be tested in the Y-axis direction; The Y-axis coordinate value of the calibration point is obtained by taking the average value of the Y-axis coordinates of the edge positions of the sample to be tested in the negative direction of the Y-axis and the positive direction of the Y-axis.

6. The method according to claim 2, characterized in that The step of correcting the position of the sample to be tested according to the deviation value of the mechanical parameter comprises: Acquire a first coordinate value of a first point of the sample to be tested in a user coordinate system, wherein the first point is any point on the sample to be tested; Converting the first coordinate value into a first converted coordinate value in the motion coordinate system; Determining a first mechanical parameter corresponding to the first converted coordinate value according to the mapping table; Subtracting the deviation value from the first mechanical parameter to determine a first corrected mechanical parameter; According to the first calibration mechanical parameter, the motion platform is controlled to move so as to calibrate the position of the first point of the sample to be tested.

7. The method according to claim 2, characterized in that The converting the user coordinate system into a motion coordinate system according to the affine transformation comprises: The user coordinate system is converted into the motion coordinate system using the following formula: Where x and y are the coordinates of the point in the user coordinate system, x′ and y′ are the coordinates of the point in the motion coordinate system, θ is the angular deviation between the coordinate systems, and T x and T y is the translation deviation between the coordinate systems.

8. A sample position correction device, characterized in that: The device comprises: A clamping unit, used to place a sample to be tested on a sample slot of the moving platform, wherein the sample to be tested includes a plurality of grids arranged in an array along a first direction and a second direction, wherein the first direction is perpendicular to the second direction; A first determining unit, configured to determine a user coordinate system corresponding to the sample to be tested, wherein an X-axis of the user coordinate system is parallel to the first direction, a Y-axis is parallel to the second direction, and an origin coincides with a center of the sample slot; An acquisition unit, used for acquiring an electron beam image of an edge position of the sample to be tested along the X-axis direction and an electron beam image of an edge position along the Y-axis direction; A second determination unit, used to determine the coordinate value of the calibration point corresponding to the center position of the sample to be tested according to the electron beam image; A third determining unit, configured to determine a deviation value of a mechanical parameter corresponding to the motion platform according to a coordinate value of the calibration point; A correction unit is used to correct the position of the sample to be tested according to the deviation value of the mechanical parameter.

9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 1-7.

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