A thermal analysis sensor

Abstract

The present invention relates to a thermal analysis sensor, comprising: a first insulating plate, formed with N thermocouple monomers of a first material; the N thermocouple monomers of the first material are arranged in a ring shape and spaced apart; a second insulating plate, formed with N thermocouple monomers of a second material; the N thermocouple monomers of the second material are arranged in a ring shape and spaced apart; the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomers of the first material on the first insulating plate and the thermocouple monomers of the second material on the second insulating plate are connected in series in sequence. The thermal analysis sensor provided by the present application can improve the thermal coupling effect, increase the measurement area, and improve the signal sensitivity due to its thermocouple structure combined with the internal and external distribution and the upper and lower staggered distribution.

Description

Technical Field

[0001] The invention belongs to the technical field of thermal analysis and relates to a thermal analysis sensor. Background Art

[0002] Differential Scanning Calorimetry (DSC) is an analytical instrument used to study the thermal properties of materials. It outputs the physical transformation (such as melting, crystallization, glass transition) and chemical reaction (such as decomposition, curing, etc.) characteristics of materials by monitoring the heat flow difference between the sample and the reference under programmed temperature control conditions. Differential scanning calorimeters are widely used in polymer, medicine, metal, ceramic and other fields. They can accurately measure the melting point, phase change temperature, thermal effect (enthalpy change) and thermal stability of materials, providing key data support for material research and process optimization.

[0003] Thermocouple structure is the core component of differential scanning calorimeter, which is used to detect the temperature difference between the sample and the reference and convert it into a heat flow signal. Its internal structure and layout directly determine the sensitivity and measurement accuracy of the differential scanning calorimeter.

[0004] However, research has found that the existing thermocouple structure uses multiple thermocouples of different materials in the same layer to detect the internal and external temperature difference, and the detection sensitivity is not high. Summary of the invention

[0005] In order to solve the above-mentioned problems in the prior art, the present invention provides a thermal analysis sensor.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] In a first aspect, an embodiment of the present application provides a thermal analysis sensor, comprising: a first insulating plate, on which N thermocouple monomers of a first material are formed; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; a second insulating plate, on which N thermocouple monomers of a second material are formed; the N thermocouple monomers of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the second material includes a first end and a second end; the first material and the second material are different; wherein the first end of each thermocouple monomer of the first material is connected to a second material through a metal column The first end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the first insulating plate and the thermocouple monomer of the second material on the second insulating plate are connected in series in sequence; the first ends of the N thermocouple monomers of the first material and the first ends of the N thermocouple monomers of the second material form an inner circle thermoelectric junction; the second ends of the N thermocouple monomers of the first material and the second ends of the N thermocouple monomers of the second material form an outer circle thermoelectric junction; the adjacent thermocouple monomers of the first material and the thermocouple monomers of the second material constitute a pair of thermocouples; the N pairs of thermocouples form a thermopile.

[0008] Optionally, an inner circle opening is set in the first insulating plate corresponding to the first end of each thermocouple monomer of the first material; the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column in the corresponding inner circle opening; an outer circle opening is set in the second insulating plate corresponding to the second end of each thermocouple monomer of the second material; the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column in the corresponding outer circle opening.

[0009] Optionally, the thickness of the first insulating plate and the second insulating plate are both m millimeters; m>0; the first insulating plate and the second insulating plate are adjacent to each other, or the first insulating plate and the second insulating plate are spaced apart, and the thickness of the spaced apart is at least m millimeters.

[0010] Optionally, m is 0.1 mm.

[0011] Optionally, the N thermocouple monomers of the first material are located in the sample measurement area of ​​the first insulating plate; the N thermocouple monomers of the second material are located in the sample measurement area of ​​the second insulating plate; the first insulating plate and the second insulating plate also include a reference area; wherein the structure of the thermopile in the sample measurement area is the same as that of the thermopile in the reference area, and the end of the thermopile in the sample measurement area is connected to the end of the thermopile in the reference area.

[0012] Optionally, the number of the sample measurement areas is at least two, and the structure of the thermopile in each of the sample measurement areas is the same.

[0013] Optionally, the spacing distance between the first ends of the N thermocouple monomers of the first material is 0.1 mm to 0.5 mm; the spacing distance between the first ends of the N thermocouple monomers of the first material is equal to the spacing distance between the first ends of the N thermocouple monomers of the second material.

[0014] Optionally, the first material is gold, platinum or palladium; the second material is gold, and the material of the metal column is gold.

[0015] Optionally, the thermal analysis sensor further includes: a carrying plate, a third insulating plate and a base; the thermal analysis sensor is provided with the carrying plate, the first insulating plate, the second insulating plate, the third insulating plate and the base in sequence from top to bottom; the carrying plate is used to support a container for holding a sample to be tested; and the carrying plate is provided with a sample measurement area.

[0016] Optionally, the first insulating plate and the second insulating plate are both ceramic sheets.

[0017] The beneficial effects of the embodiments of the present application include:

[0018] First, the thermocouple structure (i.e., thermopile) of the thermal analysis sensor adopts an inner and outer circle distribution structure, which can better fit the circular distribution of the container (usually a crucible), determine the thermocouple arrangement to be more in line with the actual shape, and improve the thermal coupling effect. In addition, the use of an inner circle distribution structure can make the inner circle hot spot junction more concentrated and denser, so that the intensity of the detected heat flow signal is enhanced, thereby effectively measuring the temperature difference in the inner and outer directions.

[0019] Second, the thermocouple structure (i.e., thermopile) of the thermal analysis sensor also adopts an upper and lower staggered distribution. Thermocouple monomers of the same material are only located on the same insulating plate, and thermocouples of different materials are connected up and down through metal columns. The thermocouple structure that is staggered up and down makes it possible to effectively measure the temperature difference in the vertical direction. For example, for any one of the thermocouple monomers of the first material, the thermocouple structure can measure the temperature difference between the first end of the thermocouple monomer of the first material and the second end of the thermocouple monomer of the second material connected to the second end of the thermocouple monomer of the first material. In this way, the vertical heat flow is sensed, and the measurement area is further improved, thereby making the thermoelectric signal more obvious and the response more sensitive.

[0020] In summary, the thermal analysis sensor provided in the embodiment of the present application can improve the thermal coupling effect, increase the measurement area, and improve the signal sensitivity due to its thermocouple structure combining the inside-outside distribution and the upper-lower staggered distribution. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a thermal analysis sensor provided by an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of a thermocouple structure provided for the implementation of the present invention;

[0023] Figure 3 A schematic diagram of the structure of another thermal analysis sensor provided by an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of another thermocouple structure provided for the implementation of the present invention;

[0025] Figure 5 A cross-sectional view of another thermal analysis sensor provided by an embodiment of the present invention;

[0026] Figure 6 This is an overall diagram of another thermal analysis sensor provided by an embodiment of the present invention.

[0027] Reference numerals:

[0028] 100-thermal analysis sensor; 10-first insulating plate; 11-thermocouple monomer of the first material; 20-second insulating plate; 21-thermocouple monomer of the second material; 30-metal column; 40-sample measurement area; 50-reference area; 60-carrying plate; 70-third insulating plate; 80-base. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Research has found that the existing thermocouple structure uses multiple thermocouples of different materials in the same layer to detect the temperature difference between the inside and outside, and the detection sensitivity is not high.

[0031] In view of the above problems, the present application provides the following embodiments to solve them:

[0032] See also Figure 1 The embodiment of the present application provides a thermal analysis sensor 100 , including: a first insulating plate 10 and a second insulating plate 20 .

[0033] The thermocouple structure of the thermal analysis sensor 100 is provided by the first insulating plate 10 and the second insulating plate 20 .

[0034] For easier understanding, please combine Figure 2 The schematic diagram shown is a diagram of a thermocouple structure of a thermal analysis sensor 100 being separated separately.

[0035] Specifically, N thermocouple monomers 11 of the first material are formed on the first insulating plate 10. The N thermocouple monomers 11 of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer 11 of the first material includes a first end and a second end; and N is a positive integer.

[0036] The above-mentioned N can be 17, 20, 21, etc. The first end and the second end of the thermocouple monomer 11 made of the first material are opposite ends.

[0037] It should be noted that the thermocouple monomer 11 of the first material is a long strip structure, having a first end and a second end, that is, the first end and the second end are two ends of the long strip structure. Since the N thermocouple monomers 11 of the first material are arranged in a ring shape and are spaced apart, the first ends of the N thermocouple monomers 11 of the first material form an inner circle, and the second ends of the N thermocouple monomers 11 of the first material form an outer circle, that is, the first end is located inside relative to the second end, and the second end is located outside relative to the first end.

[0038] N thermocouple monomers 21 of the second material are formed on the second insulating plate 20. The N thermocouple monomers 21 of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer 21 of the second material includes a first end and a second end. Similarly, N is a positive integer.

[0039] Here, the number of the thermocouple cells 11 made of the first material of the first insulating plate 10 is the same as the number of the thermocouple cells 21 made of the second material of the second insulating plate 20. The first material and the second material are different materials.

[0040] The above-mentioned N can be 17, 20, 21, etc., and the first end and the second end of the thermocouple monomer 21 made of the second material are opposite ends.

[0041] It should be noted that the structures of the thermocouple monomers of the two materials are also the same, that is, the thermocouple monomer 21 of the second material is a long strip structure, having a first end and a second end, that is, the first end and the second end are the two ends of the long strip structure. Since the N thermocouple monomers 21 of the second material are arranged in a ring shape and are spaced apart, the first ends of the N thermocouple monomers 21 of the second material form an inner circle, and the second ends of the N thermocouple monomers 21 of the second material form an outer circle, that is, the first end is located inside relative to the second end, and the second end is located outside relative to the first end.

[0042] In this embodiment, the first end of each thermocouple monomer 11 of the first material is connected to the first end of a thermocouple monomer 21 of the second material through a metal column 30, and the second end of each thermocouple monomer 11 of the first material is connected to the second end of another thermocouple monomer 21 of the second material through a metal column 30, so that the thermocouple monomers 11 of the first material on the first insulating plate 10 and the thermocouple monomers 21 of the second material on the second insulating plate 20 are connected in series in sequence.

[0043] The first ends of the N first material thermocouple monomers 11 and the first ends of the N second material thermocouple monomers 21 form an inner thermoelectric junction. The second ends of the N first material thermocouple monomers 11 and the second ends of the N second material thermocouple monomers 21 form an outer thermoelectric junction.

[0044] The adjacent thermocouple monomers 11 made of the first material and the adjacent thermocouple monomers 21 made of the second material form a pair of thermocouples (in a V-shape); N pairs of thermocouples form a thermopile.

[0045] Take any one of the first material thermocouple monomers 11 as an example for explanation: the first end of the first material thermocouple monomer 11 is connected to the first end of a second material thermocouple monomer 21 located directly below the first end of the first material thermocouple monomer 11 through a metal column 30. It can be understood that the two materials of thermocouple monomers constitute a pair of thermocouples (in a V shape), and then the second end of the first material thermocouple monomer 11 is connected to the second end of another second material thermocouple monomer 21 located directly below the second end of the first material thermocouple monomer 11 through a metal column 30. It can be understood that this is a series connection of two different thermocouple pairs. In this way, N pairs of thermocouples form a thermopile, and the thermopile is realized by N thermocouples arranged in an up and down staggered manner in series, and the whole is also arranged in a ring. From the overall presentation, each thermocouple is connected to the adjacent thermocouple, so that a thermocouple monomer 21 of the second material is connected between two adjacent thermocouple monomers 11 of the first material, or a thermocouple monomer 11 of the first material is connected between two adjacent thermocouple monomers 21 of the second material.

[0046] In addition, in this embodiment, when the thermal analysis sensor 100 is actually measuring, the first insulating plate 10 is closer to the container containing the sample to be tested than the second insulating plate 20. If the sample to be tested is contained in a crucible, the first insulating plate 10 is closer to the crucible than the second insulating plate 20, so that the inner ring thermoelectric junction can be close to the bottom of the crucible.

[0047] In summary, the thermal analysis sensor 100 provided in the embodiment of the present application has the following beneficial effects:

[0048] First, the thermocouple structure (i.e., thermopile) of the thermal analysis sensor 100 adopts an inner and outer circle distribution structure, which can better fit the circular distribution of the container (usually a crucible), that is, the thermocouple arrangement is more in line with the actual shape of the container, which can improve the thermal coupling effect. And the use of an inner circle distribution structure can make the inner circle hot spot junction more concentrated and denser, so that the intensity of the detected heat flow signal is enhanced, thereby effectively measuring the temperature difference in the inner and outer directions.

[0049] Second, the thermocouple structure (i.e., thermopile) of the thermal analysis sensor 100 also adopts an upper and lower staggered distribution. Thermocouple monomers of the same material are only located on the same insulating plate, and thermocouples of different materials are connected up and down through metal columns. Through the thermocouple structure that is staggered up and down, the thermocouple can effectively measure the temperature difference in the vertical direction. For example, for any one of the thermocouple monomers of the first material, the thermocouple structure can measure the temperature difference between the first end of the thermocouple monomer 11 of the first material and the second end of the thermocouple monomer 21 of the second material connected to the second end of the thermocouple monomer 11 of the first material. In this way, the vertical heat flow is sensed, and the measurement area is further improved, thereby making the thermoelectric signal more obvious and the response more sensitive.

[0050] In summary, the thermal analysis sensor 100 provided in the embodiment of the present application can improve the thermal coupling effect, increase the measurement area, and improve the signal sensitivity due to its thermocouple structure combining the inside-outside distribution and the top-bottom staggered distribution.

[0051] Optionally, in the embodiment of the present application, the first insulating plate 10 and the second insulating plate 20 are both ceramic sheets.

[0052] Optionally, an inner circle opening is set in the first insulating plate 10 corresponding to the first end of each thermocouple monomer 11 of the first material; the first end of each thermocouple monomer 11 of the first material is connected to the first end of a thermocouple monomer 21 of the second material through the metal column 30 in the corresponding inner circle opening; an outer circle opening is set in the second insulating plate 20 corresponding to the second end of each thermocouple monomer 21 of the second material; the second end of each thermocouple monomer 11 of the first material is connected to the second end of another thermocouple monomer 21 of the second material through the metal column 30 in the corresponding outer circle opening.

[0053] Optionally, the first material is gold, platinum or palladium; the second material is gold, and the material of the metal column is gold.

[0054] The processing process is described below.

[0055] For example, the first insulating plate 10 may be coated with metal paste of gold, platinum and palladium, and the gold, platinum and palladium thermocouple monomers may be arranged in a ring shape and spaced apart. The second insulating plate 20 may be coated with metal paste of gold, and the gold thermocouple monomers may be arranged in a ring shape and spaced apart.

[0056] Then, a hole is opened at the end point of the metal inner circle of the first insulating plate 10, and metal paste gold is poured to connect the metal gold platinum palladium with the metal gold on the lower side to form an inner circle thermoelectric junction. And a hole is opened at the end point of the metal outer circle of the second insulating plate 20, and metal paste gold is poured to connect the metal gold platinum palladium on the upper side with the metal gold on the lower side to form an outer circle thermoelectric junction.

[0057] The inner thermoelectric junction is on the first insulating plate 10, close to the bottom of the sample measuring crucible. The outer thermoelectric junction is on the second insulating plate 20, close to the constant temperature field heat sink.

[0058] The design effect of this method is: the inner circle thermoelectric junction is on the upper layer, close to the bottom of the sample measurement crucible. This allows the upper layer to capture the heat released by the sample reaction in the crucible more quickly, and the measurement results are more accurate. At the same time, the inner circle thermoelectric junction is on the upper layer, and the outer circle thermoelectric junction is on the lower layer, so that the thermal reaction can reach equilibrium faster and improve the rapid response performance.

[0059] Optionally, the thickness of the first insulating plate 10 and the second insulating plate 20 are both m millimeters; m>0.

[0060] In one embodiment, the thickness of the first insulating plate 10 and the second insulating plate 20 is 0.1 mm.

[0061] Of course, the thickness in this embodiment is not intended to limit the present application. In other embodiments, the thickness of the first insulating plate 10 and the second insulating plate 20 may also be set to 0.2 mm, etc.

[0062] Optionally, the first insulating plate 10 and the second insulating plate 20 are adjacent to each other, or the first insulating plate 10 and the second insulating plate 20 are spaced apart, and the thickness of the space is at least m millimeters.

[0063] In other words, the first insulating plate 10 and the second insulating plate 20 may be directly in contact with each other, or a plurality of insulating plates may be arranged between the first insulating plate 10 and the second insulating plate 20 to increase the spacing thickness.

[0064] When the first insulating plate 10 and the second insulating plate 20 are arranged in contact with each other up and down, the size of the metal pillar 30 is also m millimeters.

[0065] When the first insulating plate 10 and the second insulating plate 20 are arranged with a spacing of 2m mm, for example, an insulating plate with a thickness of m is further arranged between the first insulating plate 10 and the second insulating plate 20 .

[0066] It can be seen that in the embodiment of the present application, the size of the metal pillar 30 is at least m millimeters.

[0067] For ease of understanding, the size of the metal pillar 30 and the spacing thickness of the insulating plate may be set in the aforementioned manner.

[0068] Among them, when the size of the metal column 30 is m millimeters, the first insulating plate 10 and the second insulating plate 20 are in contact with each other up and down; when the size of the metal column 30 is greater than m millimeters, at least M / m-1 insulating plates with a thickness of m millimeters are included between the first insulating plate 10 and the second insulating plate 20; wherein M represents the size of the metal column 30, M>m.

[0069] For example, when m is equal to 0.1 mm, if the size M of the metal column 30 is also 0.1 mm, the first insulating plate 10 and the second insulating plate 20 are in contact with each other. That is, there is no other layer between the first insulating plate 10 and the second insulating plate 20, and the thermocouple monomer 11 of the first material on the first insulating plate 10 is connected to the thermocouple monomer 21 of the second material on the second insulating plate 20 through the metal column 30.

[0070] This method can achieve rapid transmission of temperature changes (i.e., timely response to changes in the temperature difference between the upper and lower layers of the thermocouples), which helps to timely reflect changes in sample temperature.

[0071] When m is equal to 0.1 mm, if the size M of the metal pillar 30 is 0.3 mm, there are at least M / m-1 insulating plates with a thickness of m mm between the first insulating plate 10 and the second insulating plate 20. Substituting into the calculation, it can be obtained that there are at least 2 insulating plates with a thickness of 0.1 mm between the two.

[0072] That is, by setting at least one layer between the first insulating plate 10 and the second insulating plate 20, this method can increase the interval between the upper and lower layers of thermocouples of different materials, thereby making the temperature difference sensed by the thermocouple more significant and the temperature gradient larger, which can expand the temperature measurement range to a certain extent, that is, cover a larger temperature measurement range in the gradient or depth direction.

[0073] See also Figure 3 Optionally, N thermocouple monomers 11 made of the first material are located in the sample measurement region 40 of the first insulating plate 10 , and N thermocouple monomers 21 made of the second material are located in the sample measurement region 40 of the second insulating plate 20 .

[0074] In addition, the first insulating plate 10 and the second insulating plate 20 further include a reference region 50. The thermopile of the sample measurement region 40 has the same structure as the thermopile of the reference region 50, and the end of the thermopile of the sample measurement region 40 is connected to the end of the thermopile of the reference region 50.

[0075] For easier understanding, please combine Figure 4 The schematic diagram shown is a separation of the thermocouple structure in the thermal analysis sensor 100. The thermocouple structure includes a thermopile in the sample measurement region 40 and a thermopile in the reference region 50.

[0076] Since the structure of the thermopile in the sample measurement area 40 is the same as that of the thermopile in the reference area 50, the structure of the thermopile in the reference area 50 can be described with reference to the above-mentioned embodiment and the corresponding Figure 2 The explanation is not repeated here.

[0077] It should be noted that the thermopiles in the sample measurement area 40 and the thermopiles in the reference area 50 are symmetrically distributed. In the actual measurement process, the sample is placed in a crucible, and then the crucible is placed in the sample measurement area 40, while an empty crucible is placed in the reference area 50 for measurement.

[0078] Optionally, the number of the sample measurement areas is at least two, and the structure of the thermopile in each sample measurement area is the same.

[0079] It should be noted that the thermopile in each sample measurement area needs to be connected to the thermopile in the reference area.

[0080] Exemplarily, the number of sample measurement areas may be three, and the thermocouple structure of each sample measurement area is the same as the thermocouple structure provided in the aforementioned embodiment.

[0081] This method can be used to measure the thermal effects of multiple samples at the same time. Compared with traditional single sample measurement, it can greatly improve the measurement efficiency and reduce the number of measurement experiments. At the same time, samples of the same batch can be measured under exactly the same thermal field and heating rate conditions, eliminating the error interference caused by experimental conditions.

[0082] Optionally, the spacing distance between the first ends of the N thermocouple monomers 11 of the first material is 0.1 mm to 0.5 mm; the spacing distance between the first ends of the N thermocouple monomers 11 of the first material is equal to the spacing distance between the first ends of the N thermocouple monomers 21 of the second material.

[0083] Exemplarily, the spacing distance between the first ends of the N thermocouple monomers 11 made of the first material is 0.2 mm, and the spacing distance between the first ends of the N thermocouple monomers 21 made of the second material is 0.2 mm.

[0084] It should be noted that in the embodiment of the present application, by limiting the spacing distance between the first ends of the thermocouple monomers in the same layer, the inner circle of the thermocouple monomers in the same layer is more contracted, and the thermoelectric junction density of the inner circle layer is larger, which is more conducive to quickly capturing the heat released by the sample reaction in the crucible, thereby improving the measurement accuracy.

[0085] The complete structure of the thermal analysis sensor 100 in one embodiment is described below.

[0086] See also Figure 5 and Figure 6 Optionally, the thermal analysis sensor 100 further includes: a carrier plate 60 , a third insulating plate 70 and a base 80 .

[0087] The thermal analysis sensor 100 includes a carrier plate 60 , a first insulating plate 10 , a second insulating plate 20 , a third insulating plate 70 and a base 80 in order from top to bottom.

[0088] The carrying plate 60 is used to support the container containing the sample to be tested; the carrying plate is provided with a sample measurement area 40 and a reference area 50 .

[0089] In the actual measurement process, the sample is placed in a crucible, and then the crucible is placed in the sample measurement area 40, while an empty crucible is placed in the reference area 50 for measurement.

[0090] The third insulating plate 70 may be used as a measuring plate for other functions, such as temperature measurement, which is not limited.

[0091] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0092] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0093] In the description of the embodiments of the present invention, it needs to be understood that terms such as “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “center”, “top”, “bottom”, “top”, “bottom”, “inside”, “outside”, “inside”, and “outside” indicate orientation or positional relationships.

[0094] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "assemble" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0095] In the description of the embodiments of the present invention, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0096] In the description of the embodiments of the present invention, it should be understood that "-" and "~" represent a range between two values, and the range includes the endpoints. For example: "AB" represents a range greater than or equal to A, and less than or equal to B. "A~B" represents a range greater than or equal to A, and less than or equal to B.

[0097] In the description of the embodiments of the present invention, the term "and / or" herein is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " herein generally indicates that the associated objects before and after are in an "or" relationship.

[0098] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A thermal analysis sensor, characterized in that: include: A first insulating plate, on which N thermocouple monomers of a first material are formed; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; A second insulating plate, on which N thermocouple monomers of a second material are formed; the N thermocouple monomers of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the second material includes a first end and a second end; the first material and the second material are different; The first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the first insulating plate and the thermocouple monomer of the second material on the second insulating plate are connected in series in sequence; The first ends of the N thermocouple monomers of the first material and the first ends of the N thermocouple monomers of the second material form an inner circle thermoelectric junction; the second ends of the N thermocouple monomers of the first material and the second ends of the N thermocouple monomers of the second material form an outer circle thermoelectric junction; adjacent thermocouple monomers of the first material and thermocouple monomers of the second material constitute a pair of thermocouples; and the N pairs of thermocouples form a thermopile.

2. The thermal analysis sensor according to claim 1, characterized in that: The first insulating plate is provided with an inner circle opening corresponding to the first end of each thermocouple monomer of the first material; The first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column in the corresponding inner ring opening; The second insulating plate is provided with an outer ring opening corresponding to the second end of each thermocouple monomer of the second material; The second end of each thermocouple monomer made of the first material is connected to the second end of another thermocouple monomer made of the second material through a metal column in the corresponding outer ring opening.

3. The thermal analysis sensor according to claim 1, characterized in that: The thickness of the first insulating plate and the second insulating plate are both m millimeters; m>0; The first insulating plate and the second insulating plate are adjacent to each other, or the first insulating plate and the second insulating plate are spaced apart, and the thickness of the space is at least m millimeters.

4. The thermal analysis sensor according to claim 3, characterized in that: m is 0.1 mm.

5. The thermal analysis sensor according to claim 1, characterized in that: The N thermocouple monomers made of the first material are located in the sample measurement area of ​​the first insulating plate; the N thermocouple monomers made of the second material are located in the sample measurement area of ​​the second insulating plate; The first insulating plate and the second insulating plate further include a reference region; The structure of the thermopile in the sample measurement area is the same as that of the thermopile in the reference area, and the end of the thermopile in the sample measurement area is connected to the end of the thermopile in the reference area.

6. The thermal analysis sensor according to claim 5, characterized in that: The number of the sample measurement areas is at least two, and the structure of the thermopile in each of the sample measurement areas is the same.

7. The thermal analysis sensor according to claim 1, characterized in that: The spacing distance between the first ends of the N thermocouple monomers of the first material is 0.1 mm to 0.5 mm; The spacing distance between the first ends of the N thermocouple monomers of the first material is equal to the spacing distance between the first ends of the N thermocouple monomers of the second material.

8. The thermal analysis sensor according to claim 1, characterized in that: The first material is gold, platinum and palladium; the second material is gold, and the material of the metal column is gold.

9. The thermal analysis sensor according to claim 1, characterized in that: The thermal analysis sensor further comprises: a carrying plate, a third insulating plate and a base; The thermal analysis sensor is provided with the supporting plate, the first insulating plate, the second insulating plate, the third insulating plate and the base in order from top to bottom; The carrying plate is used to support a container containing a sample to be tested; the carrying plate is provided with a sample measuring area.

10. The thermal analysis sensor according to claim 1, characterized in that: The first insulating plate and the second insulating plate are both ceramic sheets.

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