Ion pump testing system and method based on electron microscope imaging and storage medium

Abstract

The invention discloses an ion pump testing system and method based on electron microscope imaging and a storage medium, and the system comprises a sample chamber; an electron gun; the mechanical pump set comprises a mechanical pump and a molecular pump; a molecular sieve getter pump; each ion pump set comprises at least one standard ion pump and at least one ion pump to be detected; a vacuum degree monitoring device and a beam monitoring device. Therefore, the access mode of the molecular sieve getter pump and the plurality of ion pump sets is changed, and the sample chamber and the electron gun vacuum chamber are vacuumized to an ultrahigh vacuum environment through the molecular sieve getter pump, so that the calibration of the vacuum degree detection device is realized, and the consistency of various parameters in the test process is ensured, and the accuracy of the monitoring result of the beam monitoring device is improved. Therefore, the vacuum stability of the ion pump is represented based on the beam parameters of the beam emitted by the electron gun, the test result is more objective and accurate, and the comparison test of the vacuum stability of a plurality of ion pump groups is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of ion pump testing, and in particular to an ion pump testing system based on electron microscope imaging, an ion pump testing method based on electron microscope imaging, and a computer-readable storage medium. Background Art

[0002] At present, the vacuum stability of each ion pump is usually tested based on the Chinese machinery industry standard JB / T 2765-92 sputtering ion pump performance test method. However, this test method has the following shortcomings: 1. Limited measurement accuracy: This standard method relies on traditional vacuum gauges (such as thermocouple gauges, ionization gauges, etc.) for measurement. These devices have limited measurement accuracy and stability in the extremely high vacuum range; 2. Insufficient dynamic response: This standard method cannot fully reflect the dynamic response characteristics of the sputtering ion pump under different working conditions, especially under rapidly changing gas loads; 3. Long-term stability is difficult to evaluate: This standard method is difficult to fully evaluate the performance changes and stability of the sputtering ion pump after long-term operation. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art to at least a certain extent. To this end, the first purpose of the present invention is to propose an ion pump test system based on electron microscope imaging, which can characterize the vacuum stability of the ion pump based on the beam parameters of the electron gun emitted beam, and the test results are more objective and accurate, so as to realize the vacuum stability comparison test of multiple ion pump groups.

[0004] The second object of the present invention is to provide an ion pump testing method based on electron microscope imaging.

[0005] The third object of the present invention is to provide another ion pump testing method based on electron microscope imaging.

[0006] The fourth object of the present invention is to provide another ion pump testing method based on electron microscope imaging.

[0007] A fifth object of the present invention is to provide a computer-readable storage medium.

[0008] To achieve the above-mentioned purpose, the first aspect of the present invention proposes an ion pump testing system based on electron microscope imaging, comprising: a sample chamber suitable for placing an electron microscope imaging sample; an electron gun suitable for acting on the electron microscope imaging sample through a charged particle beam; a mechanical pump group, the mechanical pump group including a mechanical pump and a molecular pump, suitable for evacuating the sample chamber and the electron gun vacuum chamber to a prepared vacuum environment; a molecular sieve getter pump, suitable for evacuating the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment, wherein the vacuum degree of the ultra-high vacuum environment is greater than the vacuum degree of the prepared vacuum environment; a plurality of ion pump groups, each ion pump group including at least one standard ion pump and at least one ion pump to be tested, suitable for performing a vacuum stability comparison test of the ion pump; a vacuum degree monitoring device, suitable for monitoring and displaying the vacuum degree of the sample chamber and the electron gun vacuum chamber; a beam current monitoring device, suitable for monitoring the emission beam current of the electron gun to obtain beam current parameters, the beam current parameters are used to characterize the vacuum stability of each ion pump group, so as to realize a vacuum stability test of at least one ion pump.

[0009] According to the ion pump testing system based on electron microscope imaging according to the embodiment of the present invention, it is possible to change the access mode of the molecular sieve aspirator pump and multiple ion pump groups, and evacuate the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment through the molecular sieve aspirator pump to realize the calibration of the vacuum degree detection device, and ensure the consistency of various parameters during the test, so as to improve the accuracy of the monitoring results of the beam monitoring device, thereby characterizing the vacuum stability of the ion pump based on the beam parameters of the electron gun emitted beam, and the test results are more objective and accurate, thereby realizing the vacuum stability comparison test of multiple ion pump groups.

[0010] In addition, the ion pump testing system based on electron microscope imaging according to the above embodiment of the present invention may also have the following additional technical features:

[0011] According to one embodiment of the present invention, the beam monitoring device includes: a charged particle beam emission source, which is connected to a high-voltage cathode and is suitable for generating charged particles; an extraction electrode, which includes a first anode and a second anode, the first anode is connected to the high-voltage anode and is suitable for extracting the charged particles to form the emission beam, the upper end of the second anode is arranged corresponding to the lower end of the first anode, and the second anode is suitable for focusing the emission beam; a first ammeter, which is connected to the first anode and is suitable for monitoring the extraction current of the first anode; a power control module, which is suitable for adjusting the voltage of the first anode and collecting a monitoring signal corresponding to the extraction current of the first ammeter; and a signal analysis module, which is suitable for generating the beam parameters according to the monitoring signal corresponding to the extraction current of the first ammeter.

[0012] According to one embodiment of the present invention, the lower end of the first anode is a trumpet-shaped opening, and the upper end of the second anode is a trumpet-shaped opening.

[0013] According to one embodiment of the present invention, the beam monitoring device also includes: a second ammeter, which is connected to the charged particle beam emission source and is suitable for monitoring the emission current of the charged particle beam emission source; the power supply control module is also suitable for adjusting the voltage of the second anode and collecting the monitoring signal corresponding to the emission current of the second ammeter; the signal analysis module is also suitable for generating the beam parameters based on the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter.

[0014] According to one embodiment of the present invention, the signal analysis module is also suitable for performing frequency domain analysis on the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter to find a first frequency band with similar frequency domain signals; optimizing the stability of the first frequency band part of the monitoring signal corresponding to the extraction current of the first ammeter by adjusting the voltage of the first anode and the second anode; collecting the monitoring signals of the first ammeter and the second ammeter so that the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the extraction current of the second ammeter are inversely superimposed to generate the beam parameters.

[0015] According to one embodiment of the present invention, the at least one standard ion pump and the at least one ion pump to be tested are connected to the sample chamber or the electron gun vacuum chamber through a Y-shaped three-way pipe.

[0016] According to one embodiment of the present invention, the electron microscope is a transmission electron microscope or a scanning electron microscope.

[0017] To achieve the above-mentioned purpose, the second aspect of the present invention proposes an ion pump testing method based on electron microscope imaging, which is applied to the ion pump testing system based on electron microscope imaging as described in the above-mentioned embodiment of the present invention, and the method includes: controlling the mechanical pump group to operate at a preset speed, so that the sample chamber and the electron gun vacuum chamber are evacuated to a preliminary vacuum environment; connecting the molecular sieve getter pump to the electron gun vacuum chamber, so that the sample chamber and the electron gun vacuum chamber are evacuated to an ultra-high vacuum environment, and recording the current reading of the vacuum monitoring device; connecting at least two standard ion pumps of the multiple ion pump groups to the electron gun vacuum chamber and the sample chamber, and disconnecting the molecular sieve getter pump to realize vacuum stability testing of the at least two standard ion pumps; monitoring the emission beam of the electron gun to obtain beam parameters corresponding to the standard ion pump, and the beam parameters corresponding to the standard ion pump are used to characterize the at least two standard ion pumps. The vacuum stability of the pump is tested; at least two standard ion pumps in the multiple ion pump groups are disconnected to restore the sample chamber and the electron gun vacuum chamber to the prepared vacuum environment; the molecular sieve aspirator pump is connected to the electron gun vacuum chamber again to evacuate the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment, and the current reading of the vacuum degree monitoring device is corrected; at least two ion pumps to be tested in the multiple ion pump groups are connected to the electron gun vacuum chamber and the sample chamber, and the molecular sieve aspirator pump is disconnected to implement a vacuum stability test of the at least two ion pumps to be tested; the emission beam of the electron gun is monitored to obtain the beam parameters corresponding to the ion pump to be tested, and the beam parameters corresponding to the ion pump to be tested are used to characterize the vacuum stability of the at least two ion pumps to be tested; according to the beam parameters corresponding to the standard ion pump and the beam parameters corresponding to the ion pump to be tested, the vacuum stability test of at least one ion pump is implemented.

[0018] The electron microscope imaging-based ion pump testing method according to the embodiment of the present invention can characterize the vacuum stability of the ion pump based on the beam parameters of the electron gun emitted beam, and the test results are more objective and accurate, thereby realizing the vacuum stability comparison test of multiple ion pump groups.

[0019] To achieve the above-mentioned purpose, the third aspect of the present invention proposes an ion pump testing method based on electron microscope imaging, which is applied to the ion pump testing system based on electron microscope imaging as described in the above-mentioned embodiment of the present invention, and the method comprises: placing a standard sample into the sample chamber, and connecting at least two standard ion pumps in the multiple ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the electron gun vacuum chamber are evacuated to a first vacuum environment; selecting a first image target site under electron microscope imaging, and controlling the emission beam to remain unchanged; obtaining the image drift value of the first image target site within a preset time period, and forming an image of the corresponding standard ion pump. The invention relates to a method for producing an image drift curve of the ion pump to be tested; connecting at least two ion pumps to be tested among the multiple ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the electron gun vacuum chamber are evacuated to the first vacuum environment; selecting a second image target site under electron microscope imaging, and controlling the emission beam to remain unchanged; obtaining an image drift value of the second image target site within a preset time period, and forming an image drift curve of the corresponding ion pump to be tested; characterizing the vacuum stability of each ion pump group according to the image drift curve of the corresponding standard ion pump and the image drift curve of the corresponding ion pump to be tested, so as to realize a comparative test of the vacuum stability of the multiple ion pump groups.

[0020] The ion pump testing method based on electron microscope imaging according to the embodiment of the present invention can characterize the vacuum stability of the ion pump based on the image drift curve, and the test result is more objective and accurate, thereby realizing the vacuum stability comparison test of multiple ion pump groups.

[0021] To achieve the above-mentioned purpose, the fourth aspect of the present invention proposes an ion pump testing method based on electron microscope imaging, which is applied to the ion pump testing system based on electron microscope imaging as described in the above-mentioned embodiment of the present invention, and the method includes: placing a standard sample into the sample chamber, and connecting at least two standard ion pumps of the multiple ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the vacuum chamber of the electron gun are evacuated to a second vacuum environment; obtaining a first image burr parameter corresponding to the standard ion pump under electron microscope imaging; connecting at least two ion pumps to be tested of the multiple ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the vacuum chamber of the electron gun are evacuated to the second vacuum environment; obtaining a second image burr parameter corresponding to the ion pump to be tested under electron microscope imaging; characterizing the leakage magnetic condition of each ion pump group according to the first image burr parameter corresponding to the standard ion pump and the second image burr parameter corresponding to the ion pump to be tested, so as to realize the leakage magnetic comparison test of the multiple ion pump groups.

[0022] The ion pump testing method based on electron microscope imaging according to the embodiment of the present invention can characterize the magnetic flux leakage of the ion pump based on image burr parameters, and the test result is more objective and accurate, thereby realizing the magnetic flux leakage test of multiple ion pump groups.

[0023] To achieve the above-mentioned purpose, a computer storage medium is proposed in an embodiment of the fifth aspect of the present invention, on which an ion pump testing program based on electron microscopy imaging is stored. When the ion pump testing program based on electron microscopy imaging is executed by a processor, an ion pump testing method based on electron microscopy imaging according to any one of the aforementioned second aspect embodiments, third aspect embodiments and fourth aspect embodiments is implemented.

[0024] According to the computer-readable storage medium of an embodiment of the present invention, by executing an ion pump test program based on electron microscope imaging, it is possible to characterize the vacuum stability of the ion pump based on the beam parameters of the electron gun emitted beam, and the test results are more objective and accurate, thereby realizing a comparative test of the vacuum stability of multiple ion pump groups; or, characterize the vacuum stability of the ion pump based on the image drift curve, and the test results are more objective and accurate, thereby realizing a comparative test of the vacuum stability of multiple ion pump groups; or, characterize the magnetic leakage condition of the ion pump based on the image burr parameters, and the test results are more objective and accurate, thereby realizing a magnetic leakage condition test of multiple ion pump groups.

[0025] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a block diagram of an ion pump testing system based on electron microscope imaging according to an embodiment of the present invention;

[0027] Figure 2 is a structural schematic diagram of an ion pump testing system based on electron microscope imaging according to a specific embodiment of the present invention;

[0028] Figure 3 is a structural schematic diagram of a beam monitoring device according to a specific embodiment of the present invention;

[0029] Figure 4 is a schematic structural diagram of an electron gun according to a specific embodiment of the present invention;

[0030] Figure 5 is a schematic structural diagram of an electron gun according to another specific embodiment of the present invention;

[0031] Figure 6 is a schematic flow chart of an ion pump testing system based on electron microscope imaging according to an embodiment of the present invention;

[0032] Figure 7is a schematic diagram comparing a vacuum gauge reading and a beam current variation curve according to an embodiment of the present invention;

[0033] Figure 8 is a flow chart of an ion pump testing system based on electron microscope imaging according to another embodiment of the present invention;

[0034] Fig. 9 is a schematic diagram of electron microscope imaging for selecting an image target site according to an embodiment of the present invention;

[0035] Fig.10 is a schematic diagram comparing a vacuum gauge reading and an image drift curve according to an embodiment of the present invention;

[0036] Fig.11 is a flow chart of an ion pump testing system based on electron microscope imaging according to another embodiment of the present invention;

[0037] Fig.12 is a schematic diagram of electron microscope imaging for measuring image burr parameters according to an embodiment of the present invention;

[0038] Fig.13 is a schematic diagram of electron microscope imaging of standard electron pump image burr parameters according to one embodiment of the present invention;

[0039] Fig.14 It is a schematic diagram of electron microscope imaging of burr parameters of an electronic pump image to be tested according to an embodiment of the present invention. DETAILED DESCRIPTION

[0040] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0041] The following describes an ion pump testing system based on electron microscope imaging, an ion pump testing method based on electron microscope imaging, and a computer-readable storage medium according to embodiments of the present invention with reference to the accompanying drawings.

[0042] Figure 1 4 is a block diagram of an ion pump testing system based on electron microscope imaging according to an embodiment of the present invention.

[0043] Specifically, in some embodiments of the present invention, Figure 1 As shown, the ion pump testing system 1000 based on electron microscope imaging includes: a sample chamber 10, an electron gun 20, a mechanical pump group 30, a molecular sieve getter pump 40, a plurality of ion pump groups 50, a vacuum monitoring device 60 and a beam monitoring device 70.

[0044] Among them, the sample chamber 10 is suitable for placing electron microscope imaging samples; the electron gun 20 is suitable for acting on the electron microscope imaging samples through a charged particle beam; the mechanical pump group 30 includes a mechanical pump and a molecular pump, which is suitable for evacuating the vacuum chamber of the sample chamber 10 and the electron gun 20 to a prepared vacuum environment; the molecular sieve suction pump 40 is suitable for evacuating the vacuum chamber of the sample chamber 10 and the electron gun 20 to an ultra-high vacuum environment, wherein the vacuum degree of the ultra-high vacuum environment is greater than the vacuum degree of the prepared vacuum environment; each of the multiple ion pump groups 50 includes at least one standard ion pump and at least one ion pump to be tested, which is suitable for performing a vacuum stability comparison test of the ion pump; a vacuum degree monitoring device 60 is suitable for monitoring and displaying the vacuum degree of the sample chamber 10 and the vacuum chamber of the electron gun 20; a beam current monitoring device 70 is suitable for monitoring the emission beam current of the electron gun 20 to obtain beam current parameters, and the beam current parameters are used to characterize the vacuum stability of each ion pump group to achieve a vacuum stability test of at least one ion pump.

[0045] For example, in some embodiments of the present invention, taking two ion pump groups as an example, Figure 2 As shown, at least one standard ion pump (i.e., ion pump A) and at least one ion pump to be tested (i.e., ion pump B) in one ion pump group are connected to the sample chamber 10, and at least one standard ion pump (i.e., ion pump C) and at least one ion pump to be tested (i.e., ion pump D) in another ion pump group are connected to the vacuum chamber of the electron gun 20. The pumping speed of the electron gun part is required to be 25L / s, and the pumping speed of the sample chamber is required to be 200L / s. Then, the vacuum environment of the whole machine (i.e., the vacuum chamber of the sample chamber 10 and the electron gun 20) is first evacuated to a preliminary vacuum environment (for example, the vacuum degree is maintained at 10 -4 Pa level), and then the molecular sieve suction pump 40 evacuates the vacuum environment of the whole machine to an ultra-high vacuum environment, wherein the vacuum degree of the ultra-high vacuum environment is greater than the vacuum degree of the preliminary vacuum environment, so as to unify the initial environment of the mechanical vacuum by unifying the initial environmental variables, and finally, based on the ion pump test requirements, the corresponding standard ion pump and / or the ion pump to be tested are connected to the vacuum environment of the whole machine for evacuation to make the electron gun beam produce different beam parameters, thereby, the test results (vacuum degree and beam parameters) of the standard ion pump and the ion pump to be tested are compared by the vacuum degree monitoring device 60 and the beam current monitoring device 70, so as to realize the vacuum stability test of at least one ion pump.

[0046] In addition, in this embodiment of the present invention, if Figure 2 As shown, the vacuum monitoring device 60 includes a vacuum gauge a, which is used to monitor and display the vacuum degree of the sample chamber 10 and the vacuum chamber of the electron gun 20.

[0047] Optionally, in some other embodiments of the present invention, Figure 2As shown, the vacuum monitoring device 60 also includes a vacuum gauge b and a vacuum gauge c. The vacuum gauges ac can be selected from various vacuum gauges such as hot cathode ionization gauges, cold cathode ionization gauges, Pirani resistance gauges, and thermocouple gauges. The measurement lower limit of the vacuum gauge a should be less than or equal to 10 -8 Pa level, the measurement lower limit of vacuum gauge b should be less than or equal to 0.1Pa level, and the measurement lower limit of vacuum gauge c should be less than or equal to 10 -4 Pa level to meet different vacuum monitoring needs.

[0048] It should be noted that molecular sieve suction pumps have high pumping speeds and low ultimate pressures: molecular sieve suction pumps can provide very high pumping speeds within a specific pressure range, especially in the ultra-high vacuum region, which enables them to quickly reduce the pressure of the system and reach extremely low ultimate pressures, as well as molecular sieve suction pumps with chemical adsorption capabilities and long-term stability of ultimate vacuum: molecular sieve suction pumps not only remove gas molecules by physical adsorption, but also fix certain active gases (such as hydrogen, oxygen, water vapor, etc.) on their surfaces through chemical reactions. This chemical adsorption capability can more thoroughly remove residual gases, improve the stability of the vacuum, and maintain extremely low vacuum for a long time because the adsorbed gas molecules are not easily released again.

[0049] Therefore, in the above-mentioned embodiment of the present invention, a molecular sieve aspiration pump is used to calibrate the ultra-high vacuum gauge, thereby improving the comparability of the test results. In subsequent steps, the vacuum gauge can also be calibrated based on the above-mentioned calibration method to ensure the consistency of various parameters during the experiment, so that the test results of the standard ion pump and the ion pump under test are comparable, making the test results more objective.

[0050] It should be understood that beam parameters are not only affected by the vacuum degree, but also by various other factors such as power supply stability, electrode characteristics, system composition, beam state, etc. Therefore, in order to reduce the interference of other factors when measuring the beam current and make the measured beam current change have a direct correlation with the vacuum degree and an accurate characterization effect, in some embodiments of the present invention, the beam current monitoring device 70 and the beam current monitoring method thereof are also improved. The specific methods are as follows:

[0051] Further, in some embodiments of the present invention, Figure 3 As shown, the beam monitoring device 70 includes: a charged particle beam emission source, an extraction electrode, a first ammeter, a power supply control module and a signal analysis module.

[0052] Among them, the charged particle beam emission source includes a charged particle beam emission source, which is connected to a high-voltage cathode and is suitable for generating charged particles; the extraction electrode includes a first anode and a second anode, the first anode is connected to the high-voltage anode and is suitable for extracting charged particles to form an emission beam, the upper end of the second anode is arranged corresponding to the lower end of the first anode, and the second anode is suitable for focusing the emission beam; a first ammeter, the first ammeter is connected to the first anode and is suitable for monitoring the extraction current of the first anode; a power control module is suitable for adjusting the voltage of the first anode and collecting a monitoring signal corresponding to the extraction current of the first ammeter; a signal analysis module is suitable for generating beam parameters according to the monitoring signal corresponding to the extraction current of the first ammeter.

[0053] It can be understood that in this embodiment of the present invention, Figure 3 As shown, the charged particle beam emission source is connected to the high-voltage cathode to generate charged particles, the first anode in the extraction electrode is connected to the high-voltage anode to extract the charged particles to form an emission beam, and the upper end of the second anode is arranged corresponding to the lower end of the first anode to focus the emission beam. At this time, under the joint action of the first anode and the second anode, the distribution ratio of the emission beam passing through the first anode and impacting the first anode is stabilized, thereby reducing the influence of the beam state on the beam stability.

[0054] In addition, in this embodiment of the present invention, if Figure 3 As shown, the extraction current of the first anode is monitored by the first ammeter, and then, the voltage of the first anode is adjusted by the power control module and the monitoring signal corresponding to the extraction current of the first ammeter is collected, and the beam parameters are generated according to the extraction current of the first anode by the signal analysis module. The beam parameters can characterize the beam stability of the emission beam, thereby reducing the influence of the system structure on the beam stability.

[0055] Optionally, in the above-mentioned embodiments of the present invention, the charged particle beam emission source may be a field emission tip.

[0056] Furthermore, in some embodiments of the present invention, the lower end of the first anode is a trumpet-shaped opening, and the upper end of the second anode is a trumpet-shaped opening.

[0057] It can be understood that in this embodiment of the present invention, Figure 3 As shown, the lower end of the first anode is preferably a trumpet-shaped opening, and the upper end of the second anode is preferably a trumpet-shaped opening, so as to reduce the beam fluctuation caused by the emission beam hitting the side walls of the first anode and the second anode channel, thereby reducing the influence of the electrode characteristics on the beam stability. Thus, the accuracy of beam monitoring is improved.

[0058] Further, in some embodiments of the present invention, Figure 3As shown, the beam monitoring device 70 also includes: a second ammeter, which is connected to the charged particle beam emission source and is suitable for monitoring the emission current of the charged particle beam emission source; a power control module, which is also suitable for adjusting the voltage of the second anode and collecting the monitoring signal corresponding to the emission current of the second ammeter; the signal analysis module is also suitable for generating beam parameters according to the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter.

[0059] It can be understood that in this embodiment of the present invention, the extraction current of the first anode and the emission current of the charged particle beam emission source can be monitored respectively by the first ammeter and the second ammeter, so as to collect the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter respectively through the power supply control module, and then, generate the beam parameters according to the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter through the signal analysis module.

[0060] Furthermore, in some embodiments of the present invention, the signal analysis module is also suitable for performing frequency domain analysis on the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter to find a first frequency band with similar frequency domain signals; optimizing the stability of the first frequency band part of the monitoring signal corresponding to the extraction current of the first ammeter by adjusting the voltage of the first anode and the second anode; collecting the monitoring signals of the first ammeter and the second ammeter so that the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the extraction current of the second ammeter are inversely superimposed to generate beam parameters.

[0061] Specifically, in this embodiment of the present invention, a signal analysis module is used to perform frequency domain analysis on the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter to find out a first frequency band with similar frequency domain signals and a second frequency band with large frequency domain signal difference. Then, by adjusting the voltages of the first anode and the second anode, the stability of the first frequency band part of the monitoring signal corresponding to the extraction current of the first ammeter is optimized. Then, by collecting the monitoring signals of the first ammeter and the second ammeter, the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter are reversely superimposed (that is, the monitoring signal corresponding to the extraction current of the first ammeter is subtracted from the monitoring signal corresponding to the extraction current of the second ammeter) to generate beam parameters, thereby reducing the influence of power supply stability on beam stability.

[0062] It should be understood that, in the above-mentioned embodiments of the present invention, the frequency domain signals being similar means that the changing rules of the two signals in the frequency domain are relatively synchronized.

[0063] Furthermore, in some embodiments of the present invention, at least one standard ion pump and at least one ion pump to be tested are connected to the sample chamber or the electron gun vacuum chamber through a Y-shaped three-way pipe.

[0064] It can be understood that in this embodiment of the present invention, Figure 2 As shown, the standard ion pump a and the ion pump b to be tested can be connected to the sample chamber through a Y-type three-way pipe, and the standard ion pump b and the ion pump d to be tested can be connected to the electron gun vacuum chamber through a Y-type three-way pipe. Therefore, the ion pumps to be compared are connected at the same time through the Y-type three-way pipe to meet different ion pump test requirements, and effectively avoid the change of environmental variables caused by the disassembly and installation process of the ion pump, so that all tests use the same test system to ensure more objective test results.

[0065] Furthermore, in some embodiments of the present invention, the electron microscope is a transmission electron microscope or a scanning electron microscope.

[0066] It is understood that in this embodiment of the present invention, the electron microscope may be Figure 4 The transmission electron microscope shown in the figure specifically includes an electron source, an extraction electrode, a condenser, an objective lens, an intermediate lens, a projection lens and a fluorescent screen. The electron microscope can also be as follows Figure 5 The scanning electron microscope shown in the figure specifically includes: an electron source, an extraction electrode, an objective lens, and a deflection electrode. Among them, the transmission electron microscope or the scanning electron microscope acts on the sample through a charged particle beam, and collects various types of particles generated to form an image or a diffraction pattern. At the same time, in order to ensure that the high-energy charged particle beam can reach the sample and form a clear image, the transmission electron microscope or the scanning electron microscope needs to maintain an extremely high vacuum environment to prevent air molecules from interfering with the path of the charged particle beam.

[0067] In summary, the ion pump testing system based on electron microscope imaging according to the embodiment of the present invention can change the access mode of the molecular sieve aspirator pump and multiple ion pump groups, and evacuate the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment through the molecular sieve aspirator pump to realize the calibration of the vacuum degree detection device, and ensure the consistency of various parameters during the test process, so as to improve the accuracy of the monitoring results of the beam monitoring device, thereby characterizing the vacuum stability of the ion pump based on the beam parameters of the electron gun emitted beam, and the test results are more objective and accurate, thereby realizing the vacuum stability comparison test of multiple ion pump groups.

[0068] Specifically, the embodiment of the present invention further proposes an ion pump testing method based on electron microscope imaging applied to the ion pump testing system 1000 based on electron microscope imaging of the aforementioned embodiment of the present invention, such as Figure 6 As shown, the method includes:

[0069] S101, controlling the mechanical pump group to operate at a preset speed to evacuate the sample chamber and the electron gun vacuum chamber to a preliminary vacuum environment.

[0070] It can be understood that in this embodiment of the present invention, the mechanical pump group (i.e., the mechanical pump and the molecular pump) is controlled to work according to the preset speed until the current reading Pv1 of the vacuum monitoring device (vacuum gauge a) reaches 10 -4 Pa level, so that the sample chamber and the electron gun vacuum chamber are evacuated to the pre-vacuum environment.

[0071] S102, connecting the molecular sieve suction pump to the electron gun vacuum chamber, evacuating the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment, and recording the current reading of the vacuum degree monitoring device.

[0072] It can be understood that in this embodiment of the present invention, the molecular sieve suction pump is connected until the reading of the vacuum monitoring device (vacuum gauge a) no longer decreases, the sample chamber and the electron gun vacuum chamber are evacuated to an ultra-high vacuum environment, and the current reading Pv2 of the vacuum monitoring device (i.e., vacuum gauge a) is recorded.

[0073] S103, connecting at least two standard ion pumps in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, and disconnecting the molecular sieve getter pump, so as to implement a vacuum stability test on the at least two standard ion pumps.

[0074] It can be understood that in this embodiment of the present invention, the electron gun vacuum chamber and the sample chamber are both connected to a standard ion pump, and then the molecular sieve aspiration pump is disconnected until the reading of the vacuum monitoring device (vacuum gauge a) stabilizes at Pv3 (the change amplitude within the preset time is less than the preset value).

[0075] Optionally, in this embodiment of the present invention, the reading Pv3 of the vacuum monitoring device (vacuum gauge a) can also be used to characterize the relative ultimate vacuum degree of a standard ion pump connected to the electron gun vacuum chamber and the sample chamber.

[0076] S104, monitoring the emission beam of the electron gun to obtain beam parameters corresponding to the standard ion pump, where the beam parameters corresponding to the standard ion pump are used to characterize the vacuum stability of at least two standard ion pumps.

[0077] It can be understood that in this embodiment of the present invention, the emission beam of the electron gun is monitored to obtain the beam parameters corresponding to the standard ion pump (for example, the variation curve of the beam within a set time length, or the beam sampled at a fixed frequency, and the variance of the beam stability is statistically analyzed), thereby characterizing the vacuum stability of at least two standard ion pumps through the beam parameters corresponding to the standard ion pump.

[0078] S105, disconnecting at least two standard ion pumps in the plurality of ion pump groups, so that the sample chamber and the electron gun vacuum chamber are restored to a preliminary vacuum environment.

[0079] It is understood that in this embodiment of the present invention, by disconnecting at least two standard ion pumps in the plurality of ion pump groups until the current reading Pv1 of the vacuum monitoring device (vacuum gauge a) reaches 10 -4 Pa level, so that the sample chamber and the electron gun vacuum chamber are restored to the preliminary vacuum environment.

[0080] S106, connecting the molecular sieve suction pump to the electron gun vacuum chamber again, evacuating the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment, and correcting the current reading of the vacuum degree monitoring device.

[0081] It can be understood that in this embodiment of the present invention, the molecular sieve suction pump is connected again until the reading of the vacuum monitoring device (vacuum gauge a) no longer decreases, the sample chamber and the electron gun vacuum chamber are evacuated to an ultra-high vacuum environment, and the current reading of the vacuum monitoring device is corrected to Pv2, thereby unifying the initial environmental variables and calibrating the starting reading of the vacuum monitoring device.

[0082] S107, connecting at least two ion pumps to be tested in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, and disconnecting the molecular sieve getter pump, so as to implement a vacuum stability test on the at least two ion pumps to be tested.

[0083] It can be understood that in this embodiment of the present invention, the electron gun vacuum chamber and the sample chamber are both connected to the ion pump to be tested, and then the connection of the molecular sieve aspiration pump is disconnected until the reading of the vacuum monitoring device (vacuum gauge a) stabilizes at Pv4 (the change amplitude within the preset time is less than the preset value).

[0084] Optionally, in this embodiment of the present invention, the reading Pv4 of the vacuum monitoring device (vacuum gauge a) can also be used to characterize the relative ultimate vacuum degree of the ion pump to be tested connected to the electron gun vacuum chamber and the sample chamber.

[0085] S108, monitoring the emission beam of the electron gun to obtain beam parameters corresponding to the ion pump to be tested, where the beam parameters corresponding to the ion pump to be tested are used to characterize the vacuum stability of at least two ion pumps to be tested.

[0086] It can be understood that in this embodiment of the present invention, the emission beam of the electron gun is monitored to obtain the beam parameters corresponding to the standard ion pump (for example, the beam change curve within a set time length, or the beam sampled at a fixed frequency, and the variance of the beam stability is statistically analyzed), so that the vacuum stability of at least two ion pumps to be tested is characterized by the beam parameters corresponding to the ion pumps to be tested.

[0087] S109, performing a vacuum stability test on at least one ion pump to be tested according to beam parameters corresponding to the standard ion pump and beam parameters corresponding to the ion pump to be tested.

[0088] It is understandable that in this embodiment of the present invention, by comparing the beam change curves or beam stability variances obtained in step S104 and step S108, the vacuum stabilities of different ion pumps can be compared, thereby achieving a vacuum stability test of at least one ion pump to be tested.

[0089] Combine the following Figure 7 With reference to the specific embodiments of the present invention, the test effect of the ion pump test method based on electron microscope imaging in the embodiments of the present invention is described accordingly.

[0090] Specifically, the vacuum monitoring device (vacuum gauge a) readings and beam current change curves of the standard ion pump working continuously for 10 hours in an electron microscope are as follows: Figure 7 As shown in the figure, combined with the figure, it can be seen that the reading of the vacuum monitoring device (vacuum gauge a) jumped between 300min and 400min. If the actual vacuum degree jumps, it will inevitably affect the beam current (because when the vacuum degree decreases, the gas molecules remaining in the electron gun increase, and these gas molecules collide with the electron beam, which may cause the scattering of the electron beam and the generation of secondary electrons, increasing the beam intensity). However, the beam current did not change significantly during this period, that is, the reading of the vacuum monitoring device (vacuum gauge a) did not match the actual vacuum degree change. In other words, the jump in the reading of the vacuum monitoring device (vacuum gauge a) may be caused by the aggregation of gas molecules in the local area (where the vacuum gauge is installed), or it may be caused by changes in the electrical properties of the vacuum gauge's own devices (cathode, grid, collector) after long-term operation.

[0091] In addition, if Figure 7 As shown in the figure, the overall values ​​of the vacuum gauge readings from 450min to 600min are similar, which means that the vacuum degree of the electron gun has no significant change during this period. However, from the beam current situation, the beam intensity has increased significantly around 520min, which means that the vacuum degree of the electron gun has actually decreased significantly. It can be seen that the vacuum stability of the ion pump can be intuitively characterized based on the electron gun emission beam, and the characterization effect is better than that of a high-precision vacuum gauge.

[0092] In summary, the ion pump testing method based on electron microscope imaging according to the embodiment of the present invention can characterize the vacuum stability of the ion pump based on the beam parameters of the electron gun emitted beam, and the test results are more objective and accurate, thereby realizing the vacuum stability comparison test of multiple ion pump groups.

[0093] Specifically, the embodiment of the present invention further proposes an ion pump testing method based on electron microscope imaging applied to the ion pump testing system 1000 based on electron microscope imaging of the aforementioned embodiment of the present invention, such as Figure 8 As shown, including:

[0094] S201, placing a standard sample into a sample chamber, and connecting at least two standard ion pumps in a plurality of ion pump groups to a vacuum chamber, so that the sample chamber and the electron gun vacuum chamber are evacuated to a first vacuum environment.

[0095] It can be understood that in this embodiment of the present invention, a standard sample is placed in the sample chamber, and both the electron gun vacuum chamber and the sample chamber are connected to a standard ion pump until the reading of the vacuum monitoring device (vacuum gauge a) is stable, so that the sample chamber and the electron gun vacuum chamber are evacuated to the first vacuum environment.

[0096] S202, selecting the first image target site under electron microscope imaging, and controlling the emission beam to remain unchanged.

[0097] It is understandable that in this embodiment of the present invention, a identifiable feature site with a clear boundary is selected in the image under electron microscope imaging as the first image target site (such as Fig. 9 As shown, the contact point between the large particle and the small particle at the intersection of the horizontal line and the vertical line is taken as the first image target site), and the emission beam is controlled to remain unchanged, for example, the emission beam parameters (beam current, voltage of each electrode lens, etc.) are controlled to remain at preset values.

[0098] S203, obtaining an image drift value of the target site in the first image within a preset time period, and forming an image drift curve corresponding to a standard ion pump.

[0099] It can be understood that in this embodiment of the present invention, by recording the initial pixel position coordinates (at the intersection of the horizontal line and the vertical line) of the first image target site at the beginning of the preset time within the preset time, and then recording the pixel position offset coordinates of the first image target site at the end of the preset time, the distance between the initial pixel position coordinates and the pixel position offset coordinates is calculated as the image drift value of the first image target site within the preset time period, or, by recording the coordinate trajectory of the first image target site within the preset time period, the farthest distance between the coordinate trajectory and the initial pixel position coordinates within the preset time period is obtained as the image drift value of the first image target site within the preset time period, and then, based on the aforementioned pixel offset value, an image drift curve of the corresponding standard ion pump changing with time is formed.

[0100] S204, connecting at least two ion pumps to be tested in the plurality of ion pump groups to the vacuum chamber, and evacuating the sample chamber and the electron gun vacuum chamber to a first vacuum environment.

[0101] It can be understood that in this embodiment of the present invention, the electron gun vacuum chamber and the sample chamber are both connected to the ion pump to be tested until the reading of the vacuum monitoring device (vacuum gauge a) is stable, so that the sample chamber and the electron gun vacuum chamber are evacuated to the first vacuum environment.

[0102] S205, selecting a second image target site under electron microscope imaging, and controlling the emission beam current to remain unchanged.

[0103] It can be understood that in this embodiment of the present invention, a identifiable characteristic site with a clear boundary is selected in the image under electron microscope imaging as the second image target site, and the emission beam is controlled to remain unchanged, for example, the emission beam parameters (beam current, voltage of each electrode lens, etc.) are controlled to remain at preset values.

[0104] S206, obtaining an image drift value of the target site in the second image within a preset time period, and forming an image drift curve corresponding to the ion pump to be tested.

[0105] It can be understood that in this embodiment of the present invention, by recording the initial pixel position coordinates (at the intersection of the horizontal line and the vertical line) of the second image target site at the beginning of the preset time within the preset time, and then recording the pixel position offset coordinates of the second image target site at the end of the preset time, the distance between the initial pixel position coordinates and the pixel position offset coordinates is calculated as the image drift value of the second image target site within the preset time period, or, by recording the coordinate trajectory of the second image target site within the preset time period, the farthest distance between the coordinate trajectory and the initial pixel position coordinates within the preset time period is obtained as the image drift value of the second image target site within the preset time period, and then, based on the aforementioned pixel offset value, an image drift curve of the corresponding standard ion pump changing with time is formed.

[0106] S207 , characterizing the vacuum stability of each ion pump group according to the image drift curve corresponding to the standard ion pump and the image drift curve corresponding to the ion pump to be tested, so as to implement a vacuum stability comparison test of multiple ion pump groups.

[0107] It can be understood that, in this embodiment of the present invention, by comparing the image drift curves obtained in step S203 and step S206, the vacuum stabilities of different ion pumps can be compared, thereby achieving a vacuum stability test of at least one ion pump to be tested.

[0108] Combine the following Fig.10 With reference to the specific embodiments of the present invention, the test effect of the ion pump test method based on electron microscope imaging in the embodiments of the present invention is described accordingly.

[0109] Specifically, the vacuum monitoring device (vacuum gauge a) readings and image drift curves of the standard ion pump working continuously for 10 hours in an electron microscope are as follows: Fig.10 As shown, the unit of the vacuum monitoring device (vacuum gauge a) reading is 10 -8Pa, corresponds to the ordinate on the left, and the image drift value is the farthest distance between the target site coordinate trajectory and the initial coordinate within a 10-minute period, in nm, corresponding to the ordinate on the right.

[0110] Combination Fig.10 It can be seen that during the 10-hour continuous operation of the scanning electron microscope, the vacuum gauge reading jumped between 300min and 400min. If the actual vacuum degree jumps, it will inevitably affect the image offset value (when the vacuum degree decreases, the residual gas molecules in the electron gun increase, and these gas molecules collide with the electron beam, which may cause the electron beam to be unstable and increase the image offset value). However, the image offset value did not change significantly during this period, that is, the reading of the vacuum monitoring device (vacuum gauge a) did not match the change of the actual vacuum degree. The possible reasons for the jump in the reading of the vacuum monitoring device (vacuum gauge a) have been explained in the previous article and will not be repeated here;

[0111] In addition, if Fig.10 As shown in the figure, the overall readings of the vacuum monitoring device (vacuum gauge a) after the jump are similar, which means that the vacuum degree of the electron gun has no significant change during this period of time. However, from the perspective of the image offset value, the image offset value gradually increases, which means that the vacuum degree of the electron gun has actually decreased significantly, which is consistent with the response to the beam change. It can be seen that the vacuum stability of the ion pump can also be intuitively characterized based on image drift, and the characterization effect is better than that of a high-precision vacuum gauge.

[0112] In summary, the ion pump testing method based on electron microscope imaging according to the embodiment of the present invention can characterize the vacuum stability of the ion pump based on the image drift curve, and the test result is more objective and accurate, thereby realizing the vacuum stability comparison test of multiple ion pump groups.

[0113] Specifically, the embodiment of the present invention further proposes an ion pump testing method based on electron microscope imaging applied to the ion pump testing system 1000 based on electron microscope imaging of the aforementioned embodiment of the present invention, such as Fig.11 As shown, the method includes:

[0114] S301, placing a standard sample into a sample chamber, and connecting at least two standard ion pumps in a plurality of ion pump groups to a vacuum chamber, so that the sample chamber and the vacuum chamber of the electron gun are evacuated to a second vacuum environment.

[0115] It can be understood that in this embodiment of the present invention, a standard sample is placed in the sample chamber, and both the electron gun vacuum chamber and the sample chamber are connected to a standard ion pump until the reading of the vacuum monitoring device (vacuum gauge a) is stable, so that the sample chamber and the electron gun vacuum chamber are evacuated to the second vacuum environment.

[0116] S302, obtaining first image burr parameters corresponding to a standard ion pump under electron microscope imaging.

[0117] It can be understood that by measuring the electron microscope image formed based on the standard ion pump, the measurement Fig.12 The image burr length is shown in Figure 1, and the image burr length is obtained at a fixed magnification as shown in Figure 1. Fig.13 and Fig.14 The image shown can clearly display the image burr frequency (density) to obtain the first image burr parameter corresponding to the standard ion pump under electron microscope imaging.

[0118] S303, connecting at least two ion pumps to be tested in the plurality of ion pump groups to the vacuum chamber, and evacuating the sample chamber and the electron gun vacuum chamber to a second vacuum environment.

[0119] It can be understood that in this embodiment of the present invention, the electron gun vacuum chamber and the sample chamber are both connected to the ion pump to be tested until the reading of the vacuum monitoring device (vacuum gauge a) is stable, so that the sample chamber and the electron gun vacuum chamber are evacuated to the second vacuum environment.

[0120] S304, obtaining a second image burr parameter corresponding to the ion pump to be tested under electron microscope imaging.

[0121] It can be understood that by measuring the image burr length under the electron microscope image formed based on the ion pump to be tested, and obtaining an image that can clearly show the image burr frequency (density) at a fixed magnification, the second image burr parameter corresponding to the ion pump to be tested under the electron microscope imaging is obtained.

[0122] S305 , characterizing the magnetic flux leakage of each ion pump group according to the first image burr parameter corresponding to the standard ion pump and the second image burr parameter corresponding to the ion pump to be tested, so as to implement a magnetic flux leakage comparison test on multiple ion pump groups.

[0123] It is understandable that, in this embodiment of the present invention, by comparing the image burr parameters obtained in step S302 and step S304, the magnetic flux leakage conditions of different ion pumps can be compared, thereby achieving a magnetic flux leakage comparison test on at least one ion pump to be tested.

[0124] Combine the following Fig.13 and Fig.14 In accordance with the specific embodiment of the present invention, the test effect of the ion pump test method based on electron microscope imaging according to the embodiment of the present invention is described accordingly.

[0125] Specifically, combined Fig.13 and Fig.14It can be seen that the burr length and frequency of the ion pump to be tested are significantly better than those of the standard ion pump, that is, the magnetic leakage of the ion pump to be tested is better than that of the standard ion pump. It can be seen that the magnetic leakage of the ion pump can be intuitively characterized based on the image burrs, and has good identification and distinction.

[0126] In summary, the ion pump testing method based on electron microscope imaging according to the embodiment of the present invention can characterize the magnetic flux leakage of the ion pump based on image burr parameters, and the test result is more objective and accurate, thereby realizing the magnetic flux leakage test of multiple ion pump groups.

[0127] Based on the aforementioned electron microscope imaging-based ion pump testing method of the embodiment of the present invention, the present invention further proposes a computer storage medium on which an electron microscope imaging-based ion pump testing program is stored. When the electron microscope imaging-based ion pump testing program is executed by a processor, the aforementioned electron microscope imaging-based ion pump testing method of the embodiment of the present invention is implemented.

[0128] It should be understood that.

[0129] In summary, according to the computer-readable storage medium of an embodiment of the present invention, by executing an ion pump test program based on electron microscope imaging, it is possible to characterize the vacuum stability of the ion pump based on the beam parameters of the electron gun emitted beam, and the test results are more objective and accurate, thereby realizing a comparative test of the vacuum stability of multiple ion pump groups; or, characterize the vacuum stability of the ion pump based on the image drift curve, and the test results are more objective and accurate, thereby realizing a comparative test of the vacuum stability of multiple ion pump groups; or, characterize the magnetic leakage condition of the ion pump based on the image burr parameters, and the test results are more objective and accurate, thereby realizing a magnetic leakage condition test of multiple ion pump groups.

[0130] It should be noted that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in combination with these instruction execution systems, devices or apparatuses. For the purposes of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in combination with these instruction execution systems, devices or apparatuses. More specific examples of computer-readable media (a non-exhaustive list) include the following: an electrical connection portion with one or more wirings (electronic device), a portable computer disk box (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or processing in other suitable ways if necessary, and then stored in a computer memory.

[0131] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, a plurality of steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0132] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0133] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0134] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0135] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0136] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0137] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An ion pump testing system based on electron microscope imaging, characterized in that: The system comprises: A sample chamber, suitable for placing electron microscope imaging samples; An electron gun, adapted to act on the electron microscope imaging sample through a charged particle beam; A mechanical pump group, comprising a mechanical pump and a molecular pump, adapted to evacuate the sample chamber and the electron gun vacuum chamber to a pre-vacuum environment; A molecular sieve getter pump, adapted to evacuate the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment, wherein the vacuum degree of the ultra-high vacuum environment is greater than the vacuum degree of the preliminary vacuum environment; A plurality of ion pump groups, each ion pump group includes at least one standard ion pump and at least one ion pump to be tested, suitable for performing a vacuum stability comparison test of the ion pumps; A vacuum degree monitoring device, adapted to monitor and display the vacuum degrees of the sample chamber and the electron gun vacuum chamber; The beam monitoring device is suitable for monitoring the emission beam of the electron gun to obtain beam parameters, wherein the beam parameters are used to characterize the vacuum stability of each ion pump group to implement a vacuum stability test for at least one ion pump.

2. The ion pump testing system based on electron microscope imaging according to claim 1, characterized in that: The beam monitoring device comprises: a charged particle beam emission source, the charged particle beam emission source being connected to a high voltage cathode and being suitable for generating charged particles; An extraction electrode, the extraction electrode comprising a first anode and a second anode, the first anode being connected to the high voltage anode and being suitable for extracting the charged particles to form the emission beam, the upper end of the second anode being arranged corresponding to the lower end of the first anode, and the second anode being suitable for focusing the emission beam; a first ammeter connected to the first anode and adapted to monitor a current drawn from the first anode; A power control module, adapted to adjust the voltage of the first anode and collect a monitoring signal corresponding to the extraction current of the first ammeter; The signal analysis module is adapted to generate the beam parameters according to a monitoring signal corresponding to the extraction current of the first ammeter.

3. The ion pump testing system based on electron microscope imaging according to claim 2, characterized in that: The lower end of the first anode is a trumpet-shaped opening, and the upper end of the second anode is a trumpet-shaped opening.

4. The ion pump testing system based on electron microscope imaging according to claim 2, characterized in that: The beam monitoring device also includes: a second ammeter connected to the charged particle beam emission source and adapted to monitor an emission current of the charged particle beam emission source; The power control module is further adapted to adjust the voltage of the second anode and collect a monitoring signal corresponding to the emission current of the second ammeter; The signal analysis module is further adapted to generate the beam parameters according to a monitoring signal corresponding to an extraction current of the first ammeter and a monitoring signal corresponding to an emission current of the second ammeter.

5. The ion pump testing system based on electron microscope imaging according to claim 4, characterized in that: The signal analysis module is also adapted to: Performing frequency domain analysis on the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the emission current of the second ammeter to find a first frequency band with similar frequency domain signals; By adjusting the voltages of the first anode and the second anode, the stability of the first frequency band portion of the monitoring signal corresponding to the extraction current of the first ammeter is optimized; The monitoring signals of the first ammeter and the second ammeter are collected, and the monitoring signal corresponding to the extraction current of the first ammeter and the monitoring signal corresponding to the extraction current of the second ammeter are reversely superimposed to generate the beam current parameter.

6. The ion pump testing system based on electron microscope imaging according to claim 1, characterized in that: The at least one standard ion pump and the at least one ion pump to be tested are connected to the sample chamber or the electron gun vacuum chamber through a Y-shaped three-way pipe.

7. The ion pump testing system based on electron microscope imaging according to claim 1, characterized in that: The electron microscope is a transmission electron microscope or a scanning electron microscope.

8. An ion pump testing method based on electron microscope imaging, characterized in that: Applied to the ion pump testing system based on electron microscope imaging as described in any one of claims 1 to 5, the method comprising: Controlling the mechanical pump group to operate at a preset speed to evacuate the sample chamber and the electron gun vacuum chamber to a preliminary vacuum environment; Connecting the molecular sieve suction pump to the electron gun vacuum chamber to evacuate the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment, and recording the current reading of the vacuum degree monitoring device; Connecting at least two standard ion pumps in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, and disconnecting the molecular sieve getter pump, so as to implement a vacuum stability test on the at least two standard ion pumps; Monitoring the emission beam of the electron gun to obtain beam parameters corresponding to a standard ion pump, wherein the beam parameters corresponding to the standard ion pump are used to characterize the vacuum stability of the at least two standard ion pumps; Disconnecting at least two standard ion pumps in the plurality of ion pump groups to restore the sample chamber and the electron gun vacuum chamber to the preliminary vacuum environment; Connecting the molecular sieve suction pump to the electron gun vacuum chamber again, evacuating the sample chamber and the electron gun vacuum chamber to an ultra-high vacuum environment, and correcting the current reading of the vacuum degree monitoring device; Connecting at least two ion pumps to be tested in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, and disconnecting the molecular sieve getter pump, so as to implement a vacuum stability test on the at least two ion pumps to be tested; Monitoring the emission beam of the electron gun to obtain beam parameters corresponding to the ion pump to be tested, wherein the beam parameters corresponding to the ion pump to be tested are used to characterize the vacuum stability of the at least two ion pumps to be tested; A vacuum stability test of at least one ion pump is performed according to the beam parameters corresponding to the standard ion pump and the beam parameters corresponding to the ion pump to be tested.

9. An ion pump testing method based on electron microscope imaging, characterized in that: Applied to the ion pump testing system based on electron microscope imaging as described in any one of claims 1 to 5, the method comprising: Placing a standard sample into the sample chamber, and connecting at least two standard ion pumps in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the electron gun vacuum chamber are evacuated to a first vacuum environment; Selecting a first image target site under electron microscope imaging, and controlling the emission beam to remain unchanged; Acquiring an image drift value of the target site of the first image within a preset time period, and forming an image drift curve corresponding to a standard ion pump; Connecting at least two ion pumps to be tested in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the electron gun vacuum chamber are evacuated to the first vacuum environment; Selecting a second image target site under electron microscope imaging, and controlling the emission beam to remain unchanged; Acquiring an image drift value of the target site of the second image within a preset time period, and forming an image drift curve corresponding to the ion pump to be tested; The vacuum stability of each ion pump group is characterized according to the image drift curve corresponding to the standard ion pump and the image drift curve corresponding to the ion pump to be tested, so as to achieve a comparative test on the vacuum stability of the multiple ion pump groups.

10. An ion pump testing method based on electron microscope imaging, characterized in that: Applied to the ion pump testing system based on electron microscope imaging as described in any one of claims 1 to 5, the method comprising: Placing a standard sample into the sample chamber, and connecting at least two standard ion pumps in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the vacuum chamber of the electron gun are evacuated to a second vacuum environment; Obtain the first image burr parameters corresponding to the standard ion pump under electron microscope imaging; Connecting at least two ion pumps to be tested in the plurality of ion pump groups to the electron gun vacuum chamber and the sample chamber, so that the sample chamber and the electron gun vacuum chamber are evacuated to the second vacuum environment; Obtaining burr parameters of a second image corresponding to the ion pump to be tested under electron microscope imaging; The magnetic flux leakage condition of each ion pump group is characterized according to the first image burr parameter corresponding to the standard ion pump and the second image burr parameter corresponding to the ion pump to be tested, so as to implement a magnetic flux leakage comparison test on the multiple ion pump groups.

11. A computer storage medium, characterized in that: An ion pump testing program based on electron microscope imaging is stored thereon, and when the ion pump testing program based on electron microscope imaging is executed by a processor, an ion pump testing method based on electron microscope imaging according to any one of claims 8 to 10 is implemented.

Images