Packaging equipment for gallium antimonide wafer production

By designing an automated gallium antimonide wafer packaging equipment, using the carrier mechanism, drive mechanism and detection equipment, the fragility and pollution problems of gallium antimonide wafers in the packaging process are solved, efficient and automated packaging and detection are achieved, and packaging efficiency and quality are improved.

CN119764193AInactive Publication Date: 2025-04-04WUXI JINGMINGGUANGDIAN TECH CO
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Patent Information

Application Number
CN202411973192.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2025-04-04
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

GaN wafers are very fragile and susceptible to contamination during manufacturing and processing, resulting in existing packaging equipment requiring curing and quality inspection after packaging is completed, affecting packaging efficiency and quality.

Method used

A packaging device including a load bearing mechanism, a drive mechanism, a switching mechanism, a glue coating head, a drying lamp and a camera is designed to ensure packaging quality and improve efficiency through an automated glue coating packaging, curing and detection process.

Benefits of technology

Automatic packaging and detection of gallium antimonide wafers is realized, packaging efficiency is improved, repeated turnover of the wafer is reduced, packaging quality is ensured, and the continuous stability of the equipment is ensured through the heat dissipation mechanism.

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Abstract

The invention discloses packaging equipment for gallium antimonide wafer production, and belongs to the technical field of wafer production, and the packaging equipment comprises a machine shell, a bearing mechanism is arranged at the bottom of the inner side of the machine shell, a driving mechanism is arranged at the top of the inner side of the machine shell, and the bottom end of the driving mechanism is connected with a switching mechanism. And the switching mechanism comprises a mounting plate, a rotating cylinder, a guide ring and three sliding plates, a rotating column is fixedly mounted at the top of the rotating cylinder, and the rotating column is rotationally mounted in the mounting plate. Through the bearing mechanism, the driving mechanism, the switching mechanism, the gluing head, the drying lamp and the camera, automatic gluing packaging, curing and detection of the gallium antimonide wafer are conveniently achieved, the packaging quality is guaranteed, repeated turnover is not needed in the packaging process, and therefore the packaging efficiency can be improved, and the production cost is reduced. And through arrangement of a compression cylinder and a counterweight ball, heat dissipation work of a gluing head, a drying lamp and a camera can be achieved through energy generated by variable-speed motion of equipment, and continuous and stable work is guaranteed.
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Description

Technical Field

[0001] The present invention relates to the technical field of wafer production, and in particular to packaging equipment for producing gallium antimonide wafers. Background Art

[0002] Due to its excellent electronic properties and important applications in the field of infrared optoelectronics, GaSb wafers are widely used in the manufacturing process of high-performance infrared detectors, lasers and other devices. However, GaSb wafers are very fragile and susceptible to contamination during the manufacturing and handling process, which places high demands on the precision, stability and safety of packaging equipment.

[0003] At present, conventional packaging equipment for GaSb wafer production needs to solidify and inspect the lens quality after packaging. During this process, the wafer needs to be circulated, which not only reduces the packaging efficiency but also affects the packaging quality. Therefore, we propose a packaging equipment for GaSb wafer production to solve this problem. Summary of the invention

[0004] The object of the present invention is to provide a packaging device for producing gallium antimonide wafers to solve the problems raised in the above background technology.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A packaging device for gallium antimonide wafer production, comprising: a housing, a bearing mechanism is arranged at the inner bottom of the housing, a driving mechanism is arranged at the inner top of the housing, a switching mechanism is connected to the bottom end of the driving mechanism, the switching mechanism comprises: a mounting plate, a rotating drum, a guide ring and three slides, a rotating column is fixedly installed on the top of the rotating drum, the rotating column is rotatably installed in the mounting plate, the guide ring is fixedly installed at the bottom of the mounting plate, a guide groove is arranged inside the guide ring, the guide groove comprises: a horizontal section and a concave section connected end to end, and a rotating drum is arranged on the outer side. Three slide grooves, the skateboard is slidably installed in the corresponding slide grooves, a horizontal plate is fixedly installed on the outer side of the skateboard, a connecting column is fixedly installed on the outer side of the horizontal plate, the connecting column is movably inserted in the guide groove, and one of the connecting columns is located in the concave section, the bottom of the three horizontal plates are respectively fixedly installed with a glue coating head, a drying lamp and a camera, a heat sink is fixedly inserted at the bottom of the rotating drum, a cooling channel is opened on the top of the heat sink, and three heat-conducting rings are integrally formed on the outer side of the heat sink, a compression cylinder is fixedly installed on the inner bottom of the rotating drum, and a piston plate is slidably installed in the compression cylinder.

[0007] Preferably, a disc is fixedly mounted on the top of the piston plate, a conical groove is formed on the top of the disc, a fixed shaft is fixedly mounted in the compression cylinder, a rotating frame is rotatably mounted on the outer side of the fixed shaft, a connecting arm is rotatably mounted inside the rotating frame, a counterweight ball is fixedly mounted on the bottom end of the connecting arm, and the counterweight ball movably abuts against the inner wall of the conical groove;

[0008] A guide column is fixedly installed on the top of the piston plate, a guide plate is fixedly installed on the side wall of the compression cylinder, the guide column is slidably installed in the guide plate, a baffle is fixedly installed on the top of the guide column, a return spring is fixedly installed on the bottom of the baffle, and the bottom end of the return spring is fixedly connected to the guide plate.

[0009] Preferably, a vertical hole and a curved hole are respectively provided on both sides of the top of the compression cylinder, a first one-way valve is arranged in the curved hole, a first flow channel and a second flow channel are provided inside the rotating cylinder, a second one-way valve is arranged in the first flow channel, the top end of the first flow channel is connected to the bottom of the compression cylinder, the bottom end of the first flow channel is connected to one end of the cooling flow channel, the other end of the cooling flow channel is connected to the bottom end of the second flow channel, and the top end of the second flow channel is connected to the vertical hole.

[0010] Preferably, a limit rod and a touch button are fixedly installed in the slide groove, the slide plate is slidably sleeved on the outer side of the limit rod, a bracket and two drive plates are fixedly installed on the top of the mounting plate, a drive motor is fixedly installed on one side of the bracket, and the output end of the drive motor is fixedly installed on the top of the rotating column, a first hard tube and a second hard tube are fixedly installed in one of the drive plates, one end of the first hard tube and the second hard tube are respectively connected to a first hose and a second hose, the other ends of the first hose and the second hose both penetrate the rotating column and extend to the inside of the rotating drum, and the glue coating head, drying lamp and camera are connected with corresponding touch button signals.

[0011] Preferably, a water supply pipe and a water extraction pipe are fixedly installed on the side wall of the casing, the water supply pipe is adapted to the first hard pipe, the water extraction pipe is adapted to the second hard pipe, a water pump is fixedly installed on the outside of the casing, the water inlet of the water pump is connected to one end of the water extraction pipe, and one end of the water supply pipe is connected to a control valve.

[0012] Preferably, the bearing mechanism comprises: a bearing platform, a lifting plate and a side plate, the side plate is fixedly mounted on the side wall of the casing, an electric push rod is fixedly mounted on the top of the side plate, the output end of the electric push rod is fixedly mounted on the bottom of the lifting plate, a rotating motor and a square frame are fixedly mounted on the top of the lifting plate, a sliding seat is slidably mounted in the square frame, a connecting plate is fixedly mounted on the top of the sliding seat, the connecting plate is fixedly mounted on the bottom of the bearing platform, a lead screw is fixedly mounted on the output shaft of the rotating motor, and the sliding seat is threadedly sleeved on the outside of the lead screw;

[0013] A vertical rail is fixedly mounted on the side wall of the housing, and the lifting plate is slidably sleeved on the outer side of the vertical rail.

[0014] Preferably, the driving mechanism comprises: a fixed frame and two movable frames, both sides of the fixed frame are fixedly mounted with fixed seats, the two fixed seats are respectively fixedly mounted on the inner walls of the two sides of the casing, two first screw rods are rotatably mounted between the two fixed seats, a translation plate is slidably sleeved on the outer side of the fixed frame, the translation plate is threadedly sleeved on the outer sides of the two screw rods, a driven gear is fixedly mounted on the first screw rod, a first servo motor is fixedly mounted on the side wall of the fixed frame, a driving gear is fixedly mounted on the output end of the first servo motor, and the driving gear is meshed with the two driven gears;

[0015] The moving frame is fixedly installed on the bottom of the translation plate, a second servo motor is fixedly installed on the front side of the moving frame, a second screw rod is fixedly installed on the output shaft of the second servo motor, the driving plate is slidably installed in the corresponding moving frame, and the driving plate is threadedly sleeved on the outer side of the corresponding second screw rod.

[0016] Preferably, a T-shaped rod is fixedly installed in the fixing frame, the translation plate is slidably sleeved on the outer side of the T-shaped rod, and a through hole is opened on the front side of the housing.

[0017] The beneficial effects of the present invention are:

[0018] 1. In the present invention, the packaging equipment for gallium antimonide wafer production described above drives the lead screw to rotate by starting the rotary motor, and the lead screw drives the carrier to move forward by cooperating with the thread of the moving seat, so that the carrier moves out of the through hole to facilitate placing the packaging substrate on the carrier, and then the wafer is placed on the packaging substrate, and then the rotary motor is started to drive the carrier to reset, and then the electric push rod is started to drive the lifting plate to move up and down, so as to adjust the height of the carrier, so as to move the wafer to a suitable height for convenient packaging;

[0019] 2. In the present invention, the packaging equipment for gallium antimonide wafer production described above drives the driving gear and the second screw to rotate by starting the first servo motor and the second servo motor, the driving gear drives the first screw to rotate by meshing with the driven gear, the first screw drives the translation plate to move left and right by cooperating with the thread of the translation plate, the second screw drives the mounting plate to move forward and backward by cooperating with the thread of the driving plate, thereby driving the mounting plate to move horizontally in multiple directions, the mounting plate drives the glue coating head to move synchronously, and the epoxy resin required for packaging is evenly coated on the surface of the wafer by starting the glue coating head to achieve packaging;

[0020] 3. In the present invention, the packaging equipment for gallium antimonide wafer production described above drives the rotating ring to rotate by starting the driving motor, and the rotating ring drives the slide plate to perform circular motion. The slide plate drives the connecting column to perform synchronous motion through the horizontal plate. When the connecting column above the camera moves to the concave section, the camera moves downward, thereby approaching the wafer, and the image of the wafer is acquired by the camera, so as to judge the quality of epoxy resin coating. After the detection is completed, the driving motor is continued to be started to drive the connecting column on the drying lamp to move to the concave section, thereby driving the drying lamp to move downward, and the drying lamp emits ultraviolet rays to accelerate the curing of the epoxy resin, and then the driving motor is started again to drive the camera to rotate and move downward, and the fixing of the epoxy resin is detected by the camera, so as to judge the packaging quality. After the packaging is completed, the first servo motor and the second servo motor are started to insert the first hard tube into the water supply pipe and the second hard tube into the water extraction pipe, and then the water pump is started, and the cooling water in the drum can be pumped out through the water extraction pipe, the second hard tube and the second hose, and the control valve is opened to introduce new cooling water into the drum through the water supply pipe, the first hard tube and the first hose, so as to avoid the subsequent heat dissipation work affected by the temperature rise of the cooling water;

[0021] 4. In the present invention, the packaging equipment for gallium antimonide wafer production drives the mounting plate to move horizontally through the first servo motor and the second servo motor. When the gluing head, the drying lamp or the camera is located directly above the wafer, the power of the first servo motor and the second servo motor is reduced, thereby slowing down the moving speed of the mounting plate, thereby ensuring the effect of gluing, testing and drying. When the gluing head, the drying lamp or the camera is located in the interval of the wafer, the power of the first servo motor and the second servo motor is increased, thereby accelerating the moving speed of the mounting plate to shorten the time consumption. While the mounting plate is accelerating and decelerating, the counterweight ball shakes under the action of inertia, and at the same time, the counterweight ball abuts against the conical groove in the disc to push the piston plate. When the piston plate moves downward, it compresses the return spring, and then the piston plate moves downward and returns to its original position under the action of the return spring. When the piston plate moves upward, negative pressure is generated at the bottom of the inner side of the compression cylinder, so that the cooling water pre-stored in the rotating cylinder is sucked into the compression cylinder through the curved hole. When the piston plate moves downward, the water in the compression cylinder is introduced into the cooling channel through the first channel, and is reintroduced into the outer side of the compression cylinder through the vertical hole. The first one-way valve and the second one-way valve are used to prevent the backflow of water. When the cooling water flows through the cooling channel, the heat inside the heat sink can be taken away. When the glue coating head, camera and drying lamp are working, their outer parts are in contact with the heat-conducting ring, so that the heat generated by their work can be transferred to the heat sink and taken away by the cooling water, so as to achieve the heat dissipation effect.

[0022] 5. In the present invention, the packaging equipment for gallium antimonide wafer production can realize the automatic gluing packaging, curing and detection of gallium antimonide wafers conveniently through the supporting mechanism, driving mechanism, switching mechanism, gluing head, drying lamp and camera, thereby ensuring the packaging quality. In addition, there is no need for repeated turnover during the packaging process, thereby improving the packaging efficiency. The energy generated by the variable speed movement of the equipment can be used by the compression cylinder and counterweight ball to achieve heat dissipation of the gluing head, drying lamp and camera, thereby ensuring continuous and stable operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the three-dimensional structure of a packaging device for producing gallium antimonide wafers proposed by the present invention;

[0024] Figure 2 This is a schematic cross-sectional view of a packaging device for producing gallium antimonide wafers proposed by the present invention;

[0025] Figure 3 for Figure 2 A partial enlarged view of the

[0026] Figure 4 for Figure 2 A partial enlarged view of part A;

[0027] Figure 5 for Figure 2 A partial enlarged view of part B;

[0028] Figure 6 It is a three-dimensional structural schematic diagram of the carrying mechanism proposed by the present invention;

[0029] Figure 7 It is a three-dimensional structural schematic diagram of the driving mechanism proposed by the present invention;

[0030] Figure 8 This is a schematic diagram of the three-dimensional structure of the guide ring and the cross plate proposed by the present invention;

[0031] Fig. 9 This is a schematic diagram of the three-dimensional structure inside the compression cylinder proposed by the present invention;

[0032] Fig.10 A schematic diagram of the three-dimensional structure of the switching mechanism proposed by the present invention;

[0033] Fig.11 A schematic diagram of the three-dimensional structure of the switching mechanism proposed by the present invention from another viewing angle;

[0034] Fig.12 It is a cross-sectional structural schematic diagram of the switching mechanism proposed by the present invention;

[0035] Fig.13 for Fig.12 A partial enlarged view of part C in the middle;

[0036] Fig.14 for Fig.13 A partial enlarged view of part D.

[0037] In the figure: 1, housing; 101, through hole; 2, bearing mechanism; 201, bearing platform; 202, side plate; 203, electric push rod; 204, lifting plate; 205, frame; 206, vertical rail; 207, moving seat; 208, lead screw; 209, rotating motor; 210, connecting plate; 3, driving mechanism; 301, fixed seat; 302, fixed frame; 303, first lead screw; 304, translation plate; 305, T-bar; 306, driven gear; 307, driving gear; 308, first servo motor; 309, moving frame; 310, second servo motor; 311, second lead screw; 4, mounting plate; 401, driving plate; 5, guide ring; 501, guide groove; 6, rotating drum; 601, rotating column; 602, driving motor; 603, second flow channel; 6 04. First hose; 605. First hard tube; 606. Second hose; 607. Second hard tube; 608. First flow channel; 609. Second one-way valve; 7. Horizontal plate; 701. Connecting column; 702. Slide plate; 703. Touch button; 704. Limit rod; 8. Heat sink; 801. Cooling flow channel; 9. Compression cylinder; 901. Piston plate; 902. Disc; 903. Bend hole; 904. First one-way valve; 905. Fixed shaft; 906. Rotating frame; 907. Connecting arm; 908. Counterweight ball; 909. Vertical hole; 910. Guide column; 911. Guide plate; 912. Return spring; 913. Baffle; 10. Water pump; 1001. Water pipe; 11. Gluing head; 12. Drying lamp; 13. Camera; 14. Water pipe; 15. Control valve. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0039] Reference Figure 1-Figure 14A packaging device for producing gallium antimonide wafers, comprising: a housing 1, a bearing mechanism 2 is arranged at the inner bottom of the housing 1, a driving mechanism 3 is arranged at the inner top of the housing 1, a switching mechanism is connected to the bottom of the driving mechanism 3, the switching mechanism comprises: a mounting plate 4, a rotating drum 6, a guide ring 5 and three slide plates 702, a rotating column 601 is fixedly installed on the top of the rotating drum 6, the rotating column 601 is rotatably installed in the mounting plate 4, the guide ring 5 is fixedly installed at the bottom of the mounting plate 4, a guide groove 501 is opened inside the guide ring 5, and the guide groove 501 comprises: a horizontal section and a concave section connected end to end, three slide grooves are opened on the outer side of the rotating drum 6, and the slide The plate 702 is slidably installed in the corresponding slide groove, and a horizontal plate 7 is fixedly installed on the outer side of the slide plate 702. A connecting column 701 is fixedly installed on the outer side of the horizontal plate 7. The connecting column 701 is movably inserted in the guide groove 501, and one of the connecting columns 701 is located in the concave section. The bottoms of the three horizontal plates 7 are respectively fixedly installed with a glue coating head 11, a drying lamp 12 and a camera 13. The bottom of the rotating drum 6 is fixedly plugged with a heat sink 8, and a cooling channel 801 is opened on the top of the heat sink 8. Three heat-conducting rings are integrally formed on the outer side of the heat sink 8. A compression cylinder 9 is fixedly installed on the inner bottom of the rotating drum 6, and a piston plate 901 is slidably installed in the compression cylinder 9.

[0040] In this embodiment, a disc 902 is fixedly installed on the top of the piston plate 901, and a conical groove is opened on the top of the disc 902. A fixed shaft 905 is fixedly installed in the compression cylinder 9, and a rotating frame 906 is rotatably installed on the outer side of the fixed shaft 905. A connecting arm 907 is rotatably installed inside the rotating frame 906. A counterweight ball 908 is fixedly installed on the bottom end of the connecting arm 907, and the counterweight ball 908 is movably abutted against the inner wall of the conical groove;

[0041] A guide column 910 is fixedly installed on the top of the piston plate 901, a guide plate 911 is fixedly installed on the side wall of the compression cylinder 9, the guide column 910 is slidably installed in the guide plate 911, a baffle plate 913 is fixedly installed on the top of the guide column 910, a return spring 912 is fixedly installed on the bottom of the baffle plate 913, and the bottom end of the return spring 912 is fixedly connected to the guide plate 911.

[0042] In this embodiment, a vertical hole 909 and a curved hole 903 are respectively provided on both sides of the top of the compression cylinder 9, a first one-way valve 904 is arranged in the curved hole 903, a first flow channel 608 and a second flow channel 603 are provided inside the rotating cylinder 6, a second one-way valve 609 is arranged in the first flow channel 608, the top end of the first flow channel 608 is connected to the bottom of the compression cylinder 9, the bottom end of the first flow channel 608 is connected to one end of the cooling flow channel 801, the other end of the cooling flow channel 801 is connected to the bottom end of the second flow channel 603, and the top end of the second flow channel 603 is connected to the vertical hole 909.

[0043] In this embodiment, a limit rod 704 and a touch button 703 are fixedly installed in the slide groove, and the slide plate 702 is slidably sleeved on the outer side of the limit rod 704. A bracket and two driving plates 401 are fixedly installed on the top of the mounting plate 4. A driving motor 602 is fixedly installed on one side of the bracket. The output end of the driving motor 602 is fixedly installed on the top of the rotating column 601. A first hard tube 605 and a second hard tube 607 are fixedly installed in one of the driving plates 401. One end of the first hard tube 605 and the second hard tube 607 are respectively connected to the first hose 604 and the second hose 606, the other ends of the first hose 604 and the second hose 606 both pass through the rotating column 601 and extend to the inside of the rotating drum 6, the glue coating head 11, the drying lamp 12 and the camera 13 are connected with the corresponding touch button 703 signals, the connecting column 701 enters the concave section of the guide groove 501 and moves downward, and drives the horizontal plate 7 to move downward and contact the corresponding touch button 703, and after the touch button 703 is pressed, the glue coating head 11, the drying lamp 12 and the camera 13 are controlled to start, thereby achieving the effect of automatic start.

[0044] In this embodiment, a water supply pipe 14 and a water extraction pipe 1001 are fixedly installed on the side wall of the casing 1, the water supply pipe 14 is adapted to the first hard pipe 605, and the water extraction pipe 1001 is adapted to the second hard pipe 607. A water pump 10 is fixedly installed on the outer side of the casing 1, and the water inlet of the water pump 10 is connected to one end of the water extraction pipe 1001, and one end of the water supply pipe 14 is connected to a control valve 15, thereby facilitating the replacement of cooling water in the drum 6.

[0045] In this embodiment, the bearing mechanism 2 includes: a bearing platform 201, a lifting plate 204 and a side plate 202, the side plate 202 is fixedly mounted on the side wall of the housing 1, an electric push rod 203 is fixedly mounted on the top of the side plate 202, the output end of the electric push rod 203 is fixedly mounted on the bottom of the lifting plate 204, a rotating motor 209 and a square frame 205 are fixedly mounted on the top of the lifting plate 204, a sliding seat is slidably mounted in the square frame 205, a connecting plate 210 is fixedly mounted on the top of the sliding seat, and the connecting plate 210 is fixedly mounted on the bottom of the bearing platform 201, a lead screw 208 is fixedly mounted on the output shaft of the rotating motor 209, and the sliding seat is threadedly sleeved on the outside of the lead screw 208;

[0046] A vertical rail 206 is fixedly mounted on the side wall of the housing 1 , and the lifting plate 204 is slidably sleeved on the outer side of the vertical rail 206 , thereby guiding the lifting movement of the lifting plate 204 .

[0047] In this embodiment, the driving mechanism 3 includes: a fixed frame 302 and two movable frames 309, both sides of the fixed frame 302 are fixedly installed with fixed seats 301, the two fixed seats 301 are respectively fixedly installed on the inner walls of the two sides of the housing 1, two first screw rods 303 are rotatably installed between the two fixed seats 301, the outer side of the fixed frame 302 is slidably sleeved with a translation plate 304, the translation plate 304 is threadedly sleeved on the outer sides of the two screw rods, a driven gear 306 is fixedly installed on the first screw rod 303, a first servo motor 308 is fixedly installed on the side wall of the fixed frame 302, and a driving gear 307 is fixedly installed on the output end of the first servo motor 308, and the driving gear 307 is meshed with the two driven gears 306;

[0048] The moving frame 309 is fixedly installed at the bottom of the translation plate 304, and a second servo motor 310 is fixedly installed on the front side of the moving frame 309. A second screw rod 311 is fixedly installed on the output shaft of the second servo motor 310. The driving plate 401 is slidably installed in the corresponding moving frame 309 to guide the driving plate 401, and the driving plate 401 is threadedly sleeved on the outer side of the corresponding second screw rod 311, thereby facilitating the movement of the driving plate 401.

[0049] In this embodiment, a T-shaped rod 305 is fixedly installed in the fixing frame 302, and the translation plate 304 is slidably sleeved on the outside of the T-shaped rod 305. A through hole 101 is opened on the front side of the housing 1 to facilitate the moving in and out of the carrying platform 201.

[0050] In this embodiment, when in use, the rotating motor 209 is started to drive the lead screw 208 to rotate, and the lead screw 208 drives the carrier 201 to move forward by cooperating with the thread of the moving seat 207, so that the carrier 201 is moved out of the through hole 101, so as to facilitate the placement of the packaging substrate on the carrier 201, and then the wafer is placed on the packaging substrate, and then the rotating motor 209 is started to drive the carrier 201 to reset, and then the electric push rod 203 is started to drive the lifting plate 204 to move up and down, so as to adjust the height of the carrier 201, so as to move the wafer to a suitable height for packaging, and by starting the first servo The motor 308 and the second servo motor 310 drive the driving gear 307 and the second screw rod 311 to rotate. The driving gear 307 drives the first screw rod 303 to rotate by meshing with the driven gear 306. The first screw rod 303 drives the translation plate 304 to move left and right by cooperating with the thread of the translation plate 304. The second screw rod 311 drives the mounting plate 4 to move forward and backward by cooperating with the thread of the driving plate 401, thereby driving the mounting plate 4 to move horizontally in multiple directions. The mounting plate 4 drives the glue coating head 11 to move synchronously, and the epoxy resin required for packaging is evenly coated on the surface of the wafer by starting the glue coating head 11 to achieve packaging.

[0051] The driving motor 602 is started to drive the rotating ring to rotate, and the rotating ring drives the slide plate 702 to perform circular motion. The slide plate 702 drives the connecting column 701 to perform synchronous motion through the horizontal plate 7. When the connecting column 701 above the camera 13 moves to the concave section, the camera 13 moves downward to approach the wafer, and the image of the wafer is acquired through the camera 13 to judge the quality of the epoxy resin coating. After the inspection is completed, the driving motor 602 is continued to be started to drive the connecting column 701 on the drying lamp 12 to move to the concave section, thereby driving the drying lamp 12 to move downward, and the drying lamp 12 emits ultraviolet rays to accelerate the curing of the epoxy resin, and then the driving motor 602 is started again to drive the camera 13 to rotate and move downward. The camera 13 detects The fixing condition of epoxy resin is measured to judge the packaging quality. After the packaging is completed, the first hard tube 605 is inserted into the water supply pipe 14 and the second hard tube 607 is inserted into the water extraction pipe 1001 by starting the first servo motor 308 and the second servo motor 310, and then the water pump 10 is started. The cooling water in the drum 6 can be pumped out through the water extraction pipe 1001, the second hard tube 607 and the second hose 606, and the control valve 15 is opened to introduce new cooling water into the drum 6 through the water supply pipe 14, the first hard tube 605 and the first hose 604 to avoid the cooling water temperature rising and affecting the subsequent heat dissipation work. When the mounting plate 4 is driven to move horizontally by the first servo motor 308 and the second servo motor 310, when the glue coating head 11, the drying lamp 12 or the camera When the gluing head 11, the drying lamp 12 or the camera 13 is located directly above the wafer, the power of the first servo motor 308 and the second servo motor 310 is reduced, thereby slowing down the moving speed of the mounting plate 4, so as to ensure the effect of gluing, testing and drying. When the gluing head 11, the drying lamp 12 or the camera 13 is located in the interval of the wafer, the power of the first servo motor 308 and the second servo motor 310 is increased, thereby accelerating the moving speed of the mounting plate 4 to shorten the time consumption. While the mounting plate 4 is accelerating and decelerating, the counterweight ball 908 shakes under the action of inertia. At the same time, the counterweight ball 908 abuts against the conical groove in the disc 902 to push the piston plate 901 downward and compress the return spring 912. Then, the piston plate 901 moves forward under the action of the return spring 912. When the piston plate 901 moves downward to reset, negative pressure is generated at the bottom inner side of the compression cylinder 9 when the piston plate 901 moves upward, so that the cooling water pre-stored inside the rotating cylinder 6 is sucked into the compression cylinder 9 through the curved hole 903. When the piston plate 901 moves downward, the water in the compression cylinder 9 is introduced into the cooling channel 801 through the first channel 608, and is reintroduced into the outside of the compression cylinder 9 through the vertical hole 909. The first one-way valve 904 and the second one-way valve 609 are used to prevent the backflow of water. When the cooling water flows through the cooling channel 801, the heat inside the heat sink 8 can be taken away. When the glue coating head 11, the camera 13 and the drying lamp 12 are working, their exteriors are in contact with the heat-conducting ring, so that the heat generated by their work can be transferred to the heat sink 8 and taken away by the cooling water to achieve a heat dissipation effect.

[0052] The above is a detailed introduction to a packaging device for gallium antimonide wafer production provided by the present invention. Specific embodiments are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A packaging device for producing gallium antimonide wafers, characterized in that: include: A housing (1), wherein a bearing mechanism (2) is arranged at the bottom of the inner side of the housing (1), a driving mechanism (3) is arranged at the top of the inner side of the housing (1), a switching mechanism is connected to the bottom end of the driving mechanism (3), and the switching mechanism comprises: a mounting plate (4), a rotating drum (6), a guide ring (5) and three slide plates (702), a rotating column (601) is fixedly mounted on the top of the rotating drum (6), the rotating column (601) is rotatably mounted in the mounting plate (4), the guide ring (5) is fixedly mounted on the bottom of the mounting plate (4), a guide groove (501) is provided inside the guide ring (5), and the guide groove (501) comprises: a horizontal section and a concave section connected end to end, three slide grooves are provided on the outer side of the rotating drum (6), and the slide plate (702) slides The sliding plate (702) is movably installed in the corresponding slide groove, and a horizontal plate (7) is fixedly installed on the outer side of the sliding plate (7). A connecting column (701) is fixedly installed on the outer side of the horizontal plate (7). The connecting column (701) is movably plugged into the guide groove (501), and one of the connecting columns (701) is located in the concave section. The bottoms of the three horizontal plates (7) are respectively fixedly installed with a glue coating head (11), a drying lamp (12) and a camera (13). The bottom of the rotating cylinder (6) is fixedly plugged with a heat sink (8), and a cooling channel (801) is opened on the top of the heat sink (8). Three heat-conducting rings are integrally formed on the outer side of the heat sink (8). A compression cylinder (9) is fixedly installed on the inner bottom of the rotating cylinder (6), and a piston plate (901) is slidably installed in the compression cylinder (9).

2. The packaging equipment for gallium antimonide wafer production according to claim 1, characterized in that: A disc (902) is fixedly mounted on the top of the piston plate (901), a conical groove is formed on the top of the disc (902), a fixed shaft (905) is fixedly mounted inside the compression cylinder (9), a rotating frame (906) is rotatably mounted on the outer side of the fixed shaft (905), a connecting arm (907) is rotatably mounted inside the rotating frame (906), a counterweight ball (908) is fixedly mounted on the bottom end of the connecting arm (907), and the counterweight ball (908) is movably abutted against the inner wall of the conical groove; A guide column (910) is fixedly mounted on the top of the piston plate (901), a guide plate (911) is fixedly mounted on the side wall of the compression cylinder (9), the guide column (910) is slidably mounted in the guide plate (911), a baffle plate (913) is fixedly mounted on the top of the guide column (910), a return spring (912) is fixedly mounted on the bottom of the baffle plate (913), and the bottom end of the return spring (912) is fixedly connected to the guide plate (911).

3. The packaging equipment for gallium antimonide wafer production according to claim 1, characterized in that: A vertical hole (909) and a curved hole (903) are respectively provided on both sides of the top of the compression cylinder (9), and a first one-way valve (904) is arranged in the curved hole (903). A first flow channel (608) and a second flow channel (603) are provided inside the rotating cylinder (6), and a second one-way valve (609) is arranged in the first flow channel (608). The top end of the first flow channel (608) is connected to the bottom of the compression cylinder (9), and the bottom end of the first flow channel (608) is connected to one end of the cooling flow channel (801), and the other end of the cooling flow channel (801) is connected to the bottom end of the second flow channel (603), and the top end of the second flow channel (603) is connected to the vertical hole (909).

4. The packaging equipment for producing gallium antimonide wafers according to claim 1, characterized in that: A limit rod (704) and a touch button (703) are fixedly installed in the slide groove, and the slide plate (702) is slidably sleeved on the outer side of the limit rod (704). A bracket and two drive plates (401) are fixedly installed on the top of the mounting plate (4). A drive motor (602) is fixedly installed on one side of the bracket, and the output end of the drive motor (602) is fixedly installed on the top of the rotating column (601). A first hard tube (605) and a second hard tube (607) are fixedly installed in one of the drive plates (401), and one end of the first hard tube (605) and the second hard tube (607) are respectively connected to a first hose (604) and a second hose (606), and the other ends of the first hose (604) and the second hose (606) both penetrate the rotating column (601) and extend to the inside of the rotating drum (6). The glue coating head (11), the drying lamp (12) and the camera (13) are connected to the corresponding touch button (703) signals.

5. The packaging equipment for gallium antimonide wafer production according to claim 1, characterized in that: A water supply pipe (14) and a water extraction pipe (1001) are fixedly mounted on the side wall of the casing (1); the water supply pipe (14) is matched with the first hard pipe (605); the water extraction pipe (1001) is matched with the second hard pipe (607); a water pump (10) is fixedly mounted on the outside of the casing (1); a water inlet of the water pump (10) is connected to one end of the water extraction pipe (1001); and one end of the water supply pipe (14) is connected to a control valve (15).

6. The packaging equipment for gallium antimonide wafer production according to claim 1, characterized in that: The bearing mechanism (2) comprises: a bearing platform (201), a lifting plate (204) and a side plate (202); the side plate (202) is fixedly mounted on the side wall of the housing (1); an electric push rod (203) is fixedly mounted on the top of the side plate (202); the output end of the electric push rod (203) is fixedly mounted on the bottom of the lifting plate (204); a rotating motor (209) and a square frame (205) are fixedly mounted on the top of the lifting plate (204); a sliding seat is slidably mounted in the square frame (205); a connecting plate (210) is fixedly mounted on the top of the sliding seat; the connecting plate (210) is fixedly mounted on the bottom of the bearing platform (201); a lead screw (208) is fixedly mounted on the output shaft of the rotating motor (209); and the sliding seat is threadedly sleeved on the outside of the lead screw (208); A vertical rail (206) is fixedly mounted on the side wall of the housing (1), and the lifting plate (204) is slidably sleeved on the outer side of the vertical rail (206).

7. The packaging equipment for producing gallium antimonide wafers according to claim 4, characterized in that: The driving mechanism (3) comprises: a fixed frame (302) and two movable frames (309); fixed seats (301) are fixedly mounted on both sides of the fixed frame (302); the two fixed seats (301) are respectively fixedly mounted on the inner walls of both sides of the housing (1); two first screw rods (303) are rotatably mounted between the two fixed seats (301); a translation plate (304) is slidably sleeved on the outer side of the fixed frame (302); the translation plate (304) is threadedly sleeved on the outer sides of the two screw rods; a driven gear (306) is fixedly mounted on the first screw rod (303); a first servo motor (308) is fixedly mounted on the side wall of the fixed frame (302); a driving gear (307) is fixedly mounted on the output end of the first servo motor (308); the driving gear (307) is meshed with the two driven gears (306); The moving frame (309) is fixedly mounted on the bottom of the translation plate (304); a second servo motor (310) is fixedly mounted on the front side of the moving frame (309); a second screw rod (311) is fixedly mounted on the output shaft of the second servo motor (310); the driving plate (401) is slidably mounted in the corresponding moving frame (309), and the driving plate (401) is threadedly sleeved on the outer side of the corresponding second screw rod (311).

8. The packaging equipment for producing gallium antimonide wafers according to claim 7, characterized in that: A T-shaped rod (305) is fixedly installed in the fixed frame (302), the translation plate (304) is slidably sleeved on the outside of the T-shaped rod (305), and a through hole (101) is opened on the front side of the housing (1).

Citation Information

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