Circuit board assemblies and electronic devices

Abstract

The present application provides a circuit board assembly and an electronic device, belonging to the technical field of electronic devices. The circuit board assembly includes: a circuit board, the circuit board includes a board body and a solder pad, the solder pad is arranged on the board body, and the board body has a through hole; an annular reinforcement member is arranged in the through hole through the solder pad; a sealing member is arranged on the annular reinforcement member; and a first structural member is arranged on the sealing member.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and in particular relates to a circuit board assembly and an electronic equipment. Background Art

[0002] In the related art, the speakers in electronic devices are usually semi-sealed, and the sealing of the rear cavity of the speaker needs to be ensured. The sealing of the rear cavity directly affects the low-frequency performance of the speaker. It is usually designed to hollow out part of the circuit board, and the rear cavity cover is matched with foam and pressed on the circuit board to form a closed rear cavity.

[0003] Furthermore, since there are many components on the circuit board, there is usually a camera hollow next to the speaker hollow, which results in a narrow edge between the speaker hollow and the camera hollow, or a narrow edge between the speaker hollow and the edge of the circuit board. In order to improve the strength of the narrow edge, it is necessary to set a reinforcing steel sheet on the narrow edge. However, after the reinforcing steel sheet is set, there is a height difference on the surface of the circuit board, which affects the sealing effect of the foam. Therefore, the foam and the reinforcing steel sheet need to be set side by side, which results in the width of the narrow edge cannot be maximized, affecting the layout area of ​​the circuit board. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a circuit board assembly and an electronic device that can effectively solve the technical problem that the circuit board has narrow edges due to hollowing out, and reinforcement and sealing need to be arranged side by side on the narrow edges, thereby affecting the layout area of ​​the circuit board.

[0005] In a first aspect, an embodiment of the present application provides a circuit board assembly, including:

[0006] A circuit board, the circuit board comprises a board body and a pad, the pad is arranged on the board body, and the board body has a through hole;

[0007] An annular reinforcement piece, the annular reinforcement piece is arranged around the through hole through a welding pad;

[0008] A sealing member, arranged on the annular reinforcement member;

[0009] The first structural member is arranged on the sealing member.

[0010] In a second aspect, an embodiment of the present application provides an electronic device, including:

[0011] A circuit board assembly as provided in the first aspect embodiment.

[0012] In an embodiment of the present application, a circuit board assembly includes a circuit board, an annular reinforcement, a seal and a first structural member. The circuit board includes a board body and a solder pad, and the board body is provided with a through hole, the solder pad is arranged around the through hole, the annular reinforcement is arranged on the circuit board, and welding is achieved through the solder pad, the surface flatness of the annular reinforcement can be guaranteed, and further, arranging the seal on the annular reinforcement can avoid the problem of sealing failure due to height difference, and arranging the first structural member on the seal, so that the circuit board, the annular reinforcement, the seal and the first structural member can achieve good sealing performance, thereby ensuring the airtightness of the cavity enclosed by the circuit board, the annular reinforcement, the seal and the first structural member. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0014] Figure 1 A cross-sectional view of a circuit board assembly provided by one embodiment of the present application is shown;

[0015] Figure 2 A schematic diagram of a circuit board and an annular reinforcement member in a circuit board assembly provided by an embodiment of the present application is shown;

[0016] Figure 3 A schematic diagram of an annular reinforcement member, a first sub-pad, a second sub-pad and adhesive in a circuit board assembly provided by an embodiment of the present application is shown;

[0017] Figure 4 A schematic diagram of an annular reinforcement member, a first sub-pad, a second sub-pad, a third sub-pad and adhesive in a circuit board assembly provided in one embodiment of the present application is shown.

[0018] Figures 1 to 4 Reference numerals:

[0019] 100 circuit board assembly, 110 circuit board, 112 board body, 114 solder pad, 1142 first layer solder pad, 1144 first sub-pad, 1146 second layer solder pad, 1148 second sub-pad, 1150 third layer solder pad, 1152 third sub-pad, 116 through hole, 118 camera hole, 120 annular reinforcement, 122 folded edge, 130 sealing member, 140 first structural member, 150 adhesive, 160 speaker, 170 second structural member. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0021] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0022] In the description of the present application, it should be understood that the terms "upper", "inner", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0023] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] Combine the following Figures 1 to 4 A circuit board assembly 100 and an electronic device according to an embodiment of the present application are described.

[0025] First, as Figure 1 As shown, an embodiment of the present application provides a circuit board assembly 100, including: a circuit board 110, the circuit board 110 includes a board body 112 and a solder pad 114, the solder pad 114 is arranged on the board body 112, and the board body 112 has a through hole 116; an annular reinforcement 120, the annular reinforcement 120 is arranged around the through hole 116 through the solder pad 114; a sealing member 130, which is arranged on the annular reinforcement 120; and a first structural member 140, which is arranged on the sealing member 130.

[0026] In the embodiment of the present application, the circuit board assembly 100 includes a circuit board 110, an annular reinforcement 120, a seal 130 and a first structural member 140. The circuit board 110 includes a board body 112 and a solder pad 114. The board body 112 is provided with a through hole 116. The solder pad 114 is arranged around the through hole 116. The annular reinforcement 120 is arranged on the circuit board 110 and welded through the solder pad 114. The surface flatness of the annular reinforcement 120 can be guaranteed. Further, arranging the seal 130 on the annular reinforcement 120 can avoid the problem of sealing failure due to height difference. The first structural member 140 is arranged on the seal 130, so that the circuit board 110, the annular reinforcement 120, the seal 130 and the first structural member 140 can achieve good sealing performance, thereby ensuring the airtightness of the cavity surrounded by the circuit board 110, the annular reinforcement 120, the seal 130 and the first structural member 140.

[0027] The cavity enclosed by the circuit board 110, the annular reinforcement 120, the seal 130 and the first structural member 140 can be the rear cavity of the speaker 160 or other cavities that need to be sealed. The first structural member 140 can be a rear cavity housing, a frame, a circuit board cover or a circuit board shielding cover.

[0028] As above, as Figure 1 and Figure 2 As shown, by using the annular reinforcement 120, the seal 130 is completely set on the reinforcement, and there is no height difference problem among the seal 130, the annular reinforcement 120 and the circuit board 110. The annular reinforcement 120 can provide a good flat line for the seal 130, and there is no need to worry about the height difference affecting the sealing, thereby ensuring the sealing effect. The narrow side of the stroke between the through hole 116 and the edge of the circuit board 110 or the camera hole 118 can be set narrower, thereby solving the size bottleneck in the X direction or Y direction encountered during the stacking of internal components of the electronic device, and the seal 130 is directly pasted on the annular reinforcement 120 to ensure the sealing of the back cavity of the speaker 160.

[0029] Specifically, the annular reinforcement member 120 may be made of metal, resin, or plastic. For example, the annular reinforcement member 120 may be made of steel sheet or glass fiber cloth (Flame Retardant 4, FR-4).

[0030] During assembly, the seal 130 is pressed onto the annular reinforcement 120 . Compared with the design in which the seal 130 is directly attached to the circuit board 110 , this can ensure that the narrow strip of the circuit board 110 has sufficient strength and can also ensure the sealing of the rear cavity of the speaker 160 .

[0031] like Figure 1As shown, as a possible implementation, the pad 114 includes: a first layer pad 1142, which is arranged around the through hole 116; and a second layer pad 1146, which is arranged around the first layer pad 1142; wherein the first layer pad 1142 and the second layer pad 1146 are arranged at intervals, and the annular reinforcement 120 is arranged on the first layer pad 1142 and the second layer pad 1146.

[0032] Specifically, the pads 114 include a first layer of pads 1142 and a second layer of pads 1146. The first layer of pads 1142 is arranged on the inner side of the second layer of pads 1146. The first layer of pads 1142 is arranged around the through hole 116. The second layer of pads 1146 is arranged around the first layer of pads 1142. The first layer of pads 1142 and the second layer of pads 1146 are arranged at intervals. The annular reinforcement 120 is welded on the first layer of pads 1142 and the second layer of pads 1146. The sealing between the annular reinforcement 120 and the circuit board 110 is ensured by the two layers of pads 114.

[0033] Among them, the minimum width of green oil is retained between the first layer pad 1142 and the second layer pad 1146, so that the distance between the first layer pad 1142 and the second layer pad 1146 can be made as small as possible. During the welding process, a steel mesh of appropriate thickness is used to ensure partial solder connection between the parallel pads 114, thereby improving the welding sealing.

[0034] The first layer pad 1142 and the second pad 114 are arranged substantially in parallel.

[0035] like Figure 1 and Figure 3 As shown, as a possible implementation, the first layer pad 1142 includes at least two spaced first sub-pads 1144, and the at least two first sub-pads 1144 are arranged in sequence around the through hole 116; the second layer pad 1146 includes at least two spaced second sub-pads 1148, and the at least two second sub-pads 1148 are arranged in sequence around the first layer pad 1142.

[0036] Specifically, the first layer of pads 1142 includes at least two first sub-pads 1144, and the first sub-pads 1144 are arranged at intervals, and the entire first layer of pads 1142 is similar to a ring structure formed by a "dotted line", and each section is a first sub-pad 1144. The second layer of pads 1146 includes at least two second sub-pads 1148, and the second sub-pads 1148 are arranged at intervals, and the entire second layer of pads 1146 is similar to a ring structure formed by a "dotted line", and each section is a second sub-pad 1148. The second sub-pads 1148 are located on the outside of the first sub-pad 1144. Compared with the one-piece pad, such a split design can ensure the amount of tin on each pad and ensure the connection strength between the annular reinforcement 120 and the circuit board 110.

[0037] like Figure 1 and Figure 3 As shown, as a possible implementation, the first sub-pad 1144 and the second sub-pad 1148 are arranged alternately.

[0038] Specifically, the first sub-pads 1144 and the second sub-pads 1148 are staggered, that is, the gaps between adjacent first sub-pads 1144 are opposite to the second sub-pads 1148, and the gaps between adjacent second sub-pads 1148 are opposite to the first sub-pads 1144, thereby improving the sealing between the circuit board 110 and the annular reinforcement 120.

[0039] Compared with the integrated full-circle solder pad 114 , the solder pad 114 formed by the staggered manner can increase the tin amount per unit area and reduce the risk of false soldering.

[0040] As described above, by combining the above-mentioned staggered solder pads 114 and the annular reinforcement 120, the welding sealing of the annular reinforcement 120 and the strength of the narrow strip on the circuit board 110 are guaranteed. The seal 130 and the annular reinforcement 120 are stacked in the Z direction to solve the problem that the seal 130 and the annular reinforcement 120 cannot overlap. There is no need to consider the height difference between the seal 130, the annular reinforcement 120 and the circuit board 110, and the width of the narrow strip on the circuit board 110 can be further narrowed. After the annular reinforcement 120 is welded, the seal 130 is pressed against the surface of the annular reinforcement 120 to form a closed rear cavity of the speaker 160.

[0041] like Figure 2 , Figure 3 and Figure 4 As shown, as a possible implementation, the through hole 116 is polygonal, and each side of the through hole 116 corresponds to a first sub-pad 1144 and a second sub-pad 1148 .

[0042] Specifically, the through hole 116 is polygonal, and the first sub-pad 1144 and the second sub-pad 1148 are arranged corresponding to each side of the through hole 116, thereby ensuring that each side of the through hole 116 can be well sealed to ensure the sealing effect.

[0043] The first sub-pad 1144 and the second sub-pad 1148 are both strip-shaped, and the first sub-pad 1144 on the same side of the through hole 116 extend in the same direction, and the second sub-pad 1148 on the same side of the through hole 116 extend in the same direction.

[0044] like Figure 1 , Figure 3 and Figure 4As shown, as a possible implementation, it also includes: adhesive 150, which is arranged between adjacent second sub-pads 1148 and opposite to the first sub-pad 1144; or arranged between adjacent first sub-pads 1144 and opposite to the second sub-pad 1148; wherein the adhesive 150 is filled between adjacent first sub-pads 1144; or the adhesive 150 is filled between adjacent second sub-pads 1148; or the adhesive 150 is filled between adjacent first sub-pads 1144 and second sub-pads 1148.

[0045] Specifically, the circuit board assembly 100 also includes an adhesive 150, which is disposed on the circuit board 110, filled between adjacent first sub-pads 1144, and opposite to the inner second sub-pads 1148, so that after the circuit board 110 and the annular reinforcement 120 are welded, the adhesive 150 will increase the connection strength and sealing between the circuit board assembly 100 and the annular reinforcement 120.

[0046] Alternatively, the adhesive 150 is disposed on the circuit board 110, filling between adjacent second sub-pads 1148 and facing the inner first sub-pad 1144, so that after the circuit board 110 and the annular reinforcement 120 are welded, the adhesive 150 will increase the connection strength and sealing between the circuit board assembly 100 and the annular reinforcement 120.

[0047] Alternatively, the adhesive 150 is disposed on the circuit board 110 and filled between the adjacent first sub-pads 1144 and second sub-pads 1148 , and then after the circuit board 110 and the annular reinforcement 120 are welded, the adhesive 150 increases the connection strength and sealing between the circuit board assembly 100 and the annular reinforcement 120 .

[0048] Of course, in other embodiments of the present application, the adhesive 150 can also be set at at least two of the above positions.

[0049] Among them, the adhesive 150 can be red glue, yellow glue or hot melt glue, etc., and red glue is used as an example for explanation. Red glue is a polymer compound that solidifies after being heated, with a solidification point of 150°C, and is irreversible after solidification. It has viscosity fluidity, temperature characteristics and wetting characteristics, and can well bond the annular reinforcement 120 to the circuit board 110. Through the staggered pads 114, while ensuring good welding between the circuit board 110 and the annular reinforcement 120, the red glue is used in combination, so as to utilize the characteristics of the red glue to fill at least one of the gaps between adjacent first sub-pads 1144, the gaps between adjacent second sub-pads 1148, and the gaps between adjacent first sub-pads 1144 and second sub-pads 1148, and the parallel layout between the double-layer pads 114 is connected to tin. After reflow soldering, the solder paste and the red glue can form a full circle of sealing as a whole, ensuring the sealing between the annular reinforcement 120 and the circuit board 110.

[0050] Compared with ordinary sealants, red glue can be dispensed onto the circuit board 110 at the same time as solder paste, which can save a separate dispensing process. The staggered soldering pads 114 are arranged to increase the amount of tin per unit area. The inner and outer layers of segmented soldering pads 114 are staggered with each other to form narrower inner and outer channels between the soldering pads 114. The gaps between the soldering pads 114 are filled with red glue to ensure welding sealing.

[0051] During production, both the solder paste and the adhesive 150 can be arranged on the circuit board 110, and then the annular reinforcement member 120 can be welded on the circuit board 110. Among them, at least part of the solder paste is located on the pad 114, and the adhesive 150 is located between adjacent first sub-pads 1144, between adjacent second sub-pads 1148, or between adjacent first sub-pads 1144 and second sub-pads 1148. Then, after the welding process, the solder paste connects the annular reinforcement member 120 and the pad 114, and the adhesive 150 connects the annular reinforcement member 120 and the circuit board 110, so that two connection processes are completed at one time, reducing the production cost and the production process.

[0052] like Figure 1 and Figure 4 As shown, as a possible implementation, the annular reinforcement 120 includes a folded edge 122, at least a portion of which is located in the through hole 116, and the pad 114 also includes: a third layer pad 1150, the third layer pad 1150 is arranged on the side wall of the through hole 116, and the folded edge 122 is welded to the third layer pad 1150.

[0053] Specifically, the annular reinforcement 120 includes a folded edge 122, at least part of which is embedded in the through hole 116, and the pad 114 also includes a third-layer pad 1150, which is arranged on the side wall of the through hole 116, that is, the side of the circuit board 110, and the folded edge 122 is welded to the third-layer pad 1150, thereby achieving fixation of the circuit board 110 and the annular reinforcement 120 in two directions, reducing the possibility of local warping or tilting of the annular reinforcement 120, ensuring the flatness of the annular reinforcement 120, and the sealing effect between the circuit board 110 and the annular reinforcement 120.

[0054] That is, the surface where the adhesive 150 is located is defined to correspond to the horizontal direction. The annular reinforcement 120 may have a problem of not being able to ensure the flatness in the horizontal direction due to its large size. The side plating process is adopted on the side wall of the through hole 116 of the circuit board 110, and a third-layer solder pad 1150 is set. The tinning of the side solder pad 114 is completed with a three-dimensional steel mesh. The cross-section of the annular reinforcement 120 is "L"-shaped, forming an annular folded edge 122. The folded edge 122 extends into the through hole 116, completely covering the third-layer solder pad 1150 on the side wall of the through hole 116. The folded edge 122 and the third-layer solder pad 1150 are welded and connected. By adding the third-layer solder pad 1150, the poor welding seal of the annular reinforcement 120 in the horizontal direction due to the flatness problem is compensated.

[0055] When the larger annular reinforcement 120 produces horizontal local warping, the folded edge 122 of the annular reinforcement 120 will fit more closely to the third-layer pad 1150 on the side wall of the through hole 116, which is more conducive to ensuring the sealing between the third-layer pad 1150 and the folded edge 122. The influence of the flatness problem caused by the production and welding process on the welding sealing can be avoided by means of the horizontal first-layer pad 1142 and the second-layer pad 1146, the third-layer pad 1150, the adhesive 150 and the annular reinforcement 120 with the folded edge 122.

[0056] By providing a folded edge 122 on the annular reinforcement 120 and a third-layer solder pad 1150 on the side wall of the through hole 116, the welding sealing between the circuit board 110 and the annular reinforcement 120 is further improved, and the flatness problem caused by the excessive reinforcement size of the annular reinforcement 120 and the problem of plane warping during large plane welding can be effectively solved. On the basis of ensuring that the narrow strip of the circuit board 110 is narrowed, the sealing of the rear cavity of the speaker 160 is guaranteed.

[0057] like Figure 1 and Figure 4 As shown, as a possible implementation, the third layer pad 1150 includes at least two spaced third sub-pads 1152 , and the at least two third sub-pads 1152 are sequentially arranged along the sidewall of the through hole 116 .

[0058] Specifically, the third layer pad 1150 includes at least two spaced third sub-pads 1152, and the at least two third sub-pads 1152 are arranged in sequence along the side wall of the through hole 116, so that the tinning amount per unit area is increased through the at least two third sub-pads 1152, reducing the risk of false soldering.

[0059] like Figure 1 As shown, as a possible implementation, it further includes: a speaker 160 , at least partially located in the through hole 116 ; and a second structural member 170 , disposed on a side of the circuit board 110 away from the first structural member 140 .

[0060] Specifically, the circuit board assembly 100 also includes a speaker 160 and a second structural member 170. At least a portion of the speaker 160 is located in the through hole 116. The second structural member 170 is arranged on the side of the circuit board 110 away from the first structural member 140, thereby forming a front cavity of the speaker 160 to ensure the effect of the speaker 160.

[0061] The second structural member 170 may enclose a front cavity of the speaker 160. The second structural member 170 may be a front cavity housing, a frame, a circuit board cover, or a circuit board shielding cover.

[0062] In a second aspect, an embodiment of the present application provides an electronic device, including: a circuit board assembly 100 as provided in the embodiment of the first aspect.

[0063] The electronic device provided in the present application includes the circuit board assembly 100 provided in the first aspect embodiment, and therefore has all the beneficial effects of the circuit board assembly 100 provided in the first aspect embodiment, which will not be described one by one here.

[0064] The electronic device may be a terminal, or may be other devices other than the electronic device. For example, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a music player, a private network communication terminal device (such as a walkie-talkie), a mobile Internet device (Mobile Internet Device, MID), an augmented reality / virtual reality / mixed reality device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited.

[0065] In the description of this specification, the description with reference to the terms "one embodiment" or "specific embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0066] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board, the circuit board comprising a board body and a pad, the pad being arranged on the board body, and the board body having a through hole; An annular reinforcement piece, the annular reinforcement piece is disposed around the through hole through the pad; A sealing member, arranged on the annular reinforcing member; The first structural member is arranged on the sealing member.

2. The circuit board assembly according to claim 1, characterized in that: The pad comprises: A first layer of pads, the first layer of pads being arranged around the through hole; A second layer of pads, wherein the second layer of pads is arranged around the first layer of pads; The first layer pads and the second layer pads are arranged to be spaced apart from each other, and the annular reinforcement piece is arranged on the first layer pads and the second layer pads.

3. The circuit board assembly according to claim 2, characterized in that: The first layer of pads includes at least two first sub-pads spaced apart from each other, and the at least two first sub-pads are sequentially arranged around the through hole; The second layer of pads includes at least two second sub-pads spaced apart from each other, and the at least two second sub-pads are sequentially arranged around the first layer of pads.

4. The circuit board assembly according to claim 3, characterized in that: The first sub-pads and the second sub-pads are arranged alternately.

5. The circuit board assembly according to claim 3, characterized in that: The through hole is polygonal, and each side of the through hole corresponds to the first sub-pad and the second sub-pad.

6. The circuit board assembly according to claim 3, characterized in that: Also includes: Adhesive is disposed between adjacent second sub-pads and opposite to the first sub-pad; or is disposed between adjacent first sub-pads and opposite to the second sub-pad; The adhesive is filled between adjacent first sub-pads; or the adhesive is filled between adjacent second sub-pads; or the adhesive is filled between adjacent first sub-pads and second sub-pads.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The annular reinforcement member includes a folded edge, at least a portion of which is located in the through hole, and the pad further includes: The third layer pad is arranged on the side wall of the through hole, and the folded edge is welded on the third layer pad.

8. The circuit board assembly according to claim 7, characterized in that: The third layer pad includes at least two spaced third sub-pads, and the at least two third sub-pads are sequentially arranged along the side wall of the through hole.

9. The circuit board assembly according to any one of claims 1 to 6, characterized in that: Also includes: a speaker, at least partially located in the through hole; The second structural member is arranged on a side of the circuit board away from the first structural member.

10. An electronic device, characterized in that: include: A circuit board assembly as claimed in any one of claims 1 to 9.

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