Pad array structure, flexible circuit board, test system and test process method

Abstract

The present application relates to the field of display technology, and specifically discloses a pad array structure, a flexible circuit board, a test system and a test process method. The pad array structure includes at least two pad groups arranged at intervals along a first direction, and each of the pad groups includes a plurality of pads arranged at intervals along a second direction. In the same pad group, the spacing distance between two adjacent pads is greater than or equal to the width of a single pad. That is, in the pad array structure, each pad can be arranged in at least two rows, which increases the spacing distance between two adjacent pads compared to the traditional one-row arrangement. When the pad array structure is applied to display screens and flexible circuit boards, it is not easy for two adjacent pads to short-circuit, which effectively reduces the risk of burning the wiring and improves the product yield.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a pad array structure, a flexible circuit board, a testing system and a testing process method. Background Art

[0002] In the case of poor display on the display screen, the main method of troubleshooting is to detect the point screen. During the troubleshooting process, microscopic analysis often finds that the metal traces under the pads of the display screen are burned. After investigation, it is found that the burns of the metal traces under the pads are usually caused by abnormal pad alignment and crimping, but there is currently no effective solution to this problem. Summary of the invention

[0003] Based on this, it is necessary to provide a pad array structure, a flexible circuit board, a testing system and a testing process method to address the above problems.

[0004] According to a first aspect of an embodiment of the present application, a pad array structure is provided, comprising at least two pad groups arranged at intervals along a first direction, each of the pad groups comprising a plurality of pads arranged at intervals along a second direction, and in the same pad group, the spacing distance between two adjacent pads is greater than or equal to the width of a single pad.

[0005] In one embodiment, in the same pad group, in the second direction, the spacing distance between two adjacent pads is between 100 micrometers and 150 micrometers.

[0006] In one embodiment, the spacing distance between two adjacent pad groups in the first direction is between 50 micrometers and 150 micrometers.

[0007] In one embodiment, it includes a first pad group and a second pad group arranged at intervals along a first direction, the first pad group includes a plurality of first pads arranged at intervals along a second direction, and the second pad group includes a plurality of second pads arranged at intervals along the second direction.

[0008] In one embodiment, each of the first solder pads and each of the second solder pads are staggered in the first direction.

[0009] In one of the embodiments, in the first direction, a single first pad is located in the middle of two second pads adjacent to the first pad.

[0010] In one embodiment, each of the first soldering pads and each of the second soldering pads are aligned in the first direction.

[0011] In one embodiment, the first direction is the Y-axis direction, and the second direction is the X-axis direction.

[0012] According to a second aspect of an embodiment of the present application, a flexible circuit board is provided, comprising the above-mentioned pad array structure.

[0013] According to a third aspect of an embodiment of the present application, a testing system is provided, including a display screen and the above-mentioned flexible circuit board, wherein the above-mentioned pad array structure is arranged in the display screen, and the pad array structure in the display screen is correspondingly connected to the pad array structure in the flexible circuit board.

[0014] According to a fourth aspect of an embodiment of the present application, a testing process method is provided, including:

[0015] Forming the pad array structure as described above on the display screen and the flexible circuit board respectively;

[0016] The pad array structure on the display screen is connected correspondingly to the pad array structure on the flexible circuit board to perform a point screen test.

[0017] The pad array structure provided in the embodiment of the present application includes at least two pad groups, each pad group is arranged at intervals along a first direction, each pad group includes a plurality of pads, each pad is arranged at intervals along a second direction, and in the same pad group, the spacing distance between two adjacent pads is greater than or equal to the width of a single pad. That is, in the pad array structure, each pad can be arranged in at least two rows, and compared with the traditional row arrangement, the spacing distance between two adjacent pads is increased so that it is not less than the width of a single pad. When the pad array structure is applied to display screens and flexible circuit boards, it is not easy for two adjacent pads to short-circuit, which effectively reduces the risk of burning the wiring and improves the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a pad array structure on a display screen in conventional technology;

[0019] Figure 2 It is a structural schematic diagram of a pad array structure on a flexible circuit board in conventional technology;

[0020] Figure 3 A schematic diagram of a structure in which a pad on a display screen and a pad on a flexible circuit board are correctly connected in a conventional technology;

[0021] Figure 4 A schematic diagram of a structure in which a pad on a display screen and a pad on a flexible circuit board are misaligned and connected in a conventional technology;

[0022] Figure 5 A schematic structural diagram of a pad array structure provided in one embodiment of the present application;

[0023] Figure 6 A schematic diagram of the structure of the pad array structure provided in one embodiment of the present application when it is connected;

[0024] Figure 7 A schematic diagram of the structure of the pad array structure provided in one embodiment of the present application when it is connected;

[0025] Figure 8 A schematic structural diagram of a pad array structure provided in another embodiment of the present application;

[0026] Fig. 9 A flowchart of a testing process method provided in another embodiment of the present application.

[0027] Description of reference numerals:

[0028] 100, solder pad group; 110, solder pad; 120, first solder pad group; 121, first solder pad; 130, second solder pad group; 131, second solder pad; 200, display screen; 300, flexible circuit board. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to understand the disclosure of the present application more thoroughly and comprehensively.

[0030] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0033] In the case of poor display on the display screen, the main method of troubleshooting is to detect the point screen. During the troubleshooting process, microscopic analysis often reveals that the metal traces under the pads of the display screen are burned. After investigation, it is found that the burns of the metal traces under the pads are usually caused by abnormal pad alignment and crimping.

[0034] Specifically, see Figure 1-Figure 4 Currently, the pads 110 on the display screen 200 are all of equal size and spacing, and are arranged in the same row. Since the horizontal space on the display screen 200 is limited, the spacing between the pads 110 is small. When the flexible circuit board 300 is connected to the display screen 200, the pads 110 on the flexible circuit board 300 need to be aligned and connected with the pads 110 on the display screen 200. Figure 3 FIG. 1 shows a state where the pads 110 on the flexible circuit board 300 and the pads 110 on the display screen 200 are correctly aligned and connected. Figure 4 Since the spacing between the pads 110 is small, the pads 110 on the flexible circuit board 300 and the pads 110 on the display screen 200 will be misaligned, which will cause a short circuit between adjacent pads 110. For example, one pad 110 on the flexible circuit board 300 is connected to two pads 110 on the display screen 200. Since the voltage difference between the two traces on the screen body after aging is large, which can reach 30V, when the pads 110 are short-circuited, the trace temperature will be too high and burn, thereby affecting the yield.

[0035] In order to solve the above problems, the embodiments of the present application provide a pad array structure, a display screen, a flexible circuit board and a display system.

[0036] Reference Figure 5 In one embodiment, a pad array structure is provided, including at least two pad groups 100 arranged at intervals along a first direction, each of the pad groups 100 includes a plurality of pads 110 arranged at intervals along a second direction, and in the same pad group 100, the spacing distance between two adjacent pads 110 is greater than or equal to the width of a single pad 110.

[0037] In this embodiment, there are at least two groups of pads 110 arranged at intervals along the first direction, which may specifically include two groups, three groups, or four groups of pads 110, etc., and each pad 110 in each group of pads 110 is arranged at intervals along the second direction. In the case where the number of pads 110 remains unchanged, compared with only one group of pads 110, that is, all pads 110 are arranged in the same group, and all pads 110 are arranged at intervals along the second direction, in this embodiment, all pads 110 are divided into at least two groups, and each group of pads 110 is arranged along the first direction, thereby reducing the number of pads in each pad group 100, and in each pad group 100, the interval between pads 110 arranged along the second direction can be increased. Specifically, in the same pad group 100, the interval between two adjacent pads 110 is greater than or equal to the width of a single pad 110.

[0038] When the pad array structure is applied to the display screen 200 and the flexible circuit board 300, since the intervals between adjacent pads 110 in the pad array structure are relatively large, when the pad array structure on the display screen 200 is connected to the pad array structure on the flexible circuit board 300, even if misalignment occurs, it is not easy to cause a short circuit between two adjacent pads 110, thereby effectively reducing the risk of burning the wiring and improving the product yield.

[0039] refer to Figure 6 and Figure 7 , the pad array structure includes two pad groups 100 arranged at intervals along the first direction, and each pad group 100 includes a plurality of pads 110 arranged at intervals along the second direction. When the pad array structure is applied to the display screen 200 and the flexible circuit board 300, when the pad array structure in the display screen 200 is connected to the pad array structure in the flexible circuit board 300, if misalignment occurs, there are usually the following two situations: ① Referring to Figure 6 , the pad 110 in the display screen 200 and the pad 110 in the flexible circuit board 300 do not completely overlap, but only partially overlap; ② Referring to Figure 7 , the pads 110 in the display screen 200 and the pads 110 in the flexible circuit board 300 are completely staggered, and there is no overlapping area. For situation ①, the display screen 200 may have a normal display or an abnormal display, and for situation ②, the display screen 200 may have no display. Regardless of abnormal display or no display, it is only necessary to re-touch the screen, and there will be no burning of the wiring, that is, no damage to the screen body.

[0040] Among them, the first direction may be perpendicular to the second direction, the first direction may be the Y-axis direction, i.e., the column direction, and the second direction may be the X-axis direction, i.e., the row direction. That is to say, in the conventional technology, all the pads 110 are arranged in the same row. Since the space in the row direction of the display screen 200 is limited, the intervals between adjacent pads 110 are often small. In this embodiment, the pads 110 are arranged into an array structure of at least two rows while the total number of pads 110 remains unchanged, i.e., the number of pads 110 in the same row is reduced, thereby increasing the intervals between adjacent pads 110 in the same row, and preventing short circuits between two adjacent pads 110 from occurring.

[0041] In one embodiment, in the same pad group 100, in the second direction, the spacing distance between two adjacent pads 110 is between 100 microns and 150 microns. Specifically, the spacing distance between two adjacent pads 110 is 100 microns, 110 microns, 120 microns, 130 microns, or 150 microns, etc., and the spacing distance between two adjacent pads 110 can be set according to the size of the space in the second direction of the display screen 200.

[0042] In this embodiment, in the same pad group 100 , the intervals between two adjacent pads 110 can be the same or different, as long as each pad 110 in the display screen 200 can correspond one-to-one with each pad 110 in the flexible circuit board 300 .

[0043] In one embodiment, the spacing distance between two adjacent pad groups 100 in the first direction is between 50 microns and 150 microns, and can be 50 microns, 60 microns, 70 microns, 100 microns, 150 microns, etc. The spacing distance between two adjacent pad groups 100 can be set according to the size of the space in the first direction on the display screen 200.

[0044] In one embodiment, referring to Figure 5 The pad array structure provided in this embodiment includes a first pad group 120 and a second pad group 130 arranged at intervals along a first direction, the first pad group 120 includes a plurality of first pads 121 arranged at intervals along a second direction, and the second pad group 130 includes a plurality of second pads 131 arranged at intervals along the second direction.

[0045] That is, two pad groups 100 are arranged along the first direction, which can meet the quantity requirement of the pads 110 on the one hand, and will not occupy too much space of the display screen 200 in the first direction on the other hand.

[0046] In one embodiment, referring to Figure 5, each of the first pads 121 and each of the second pads 131 are staggered in the first direction. The first pads 121 and the second pads 131 are staggered to improve the alignment efficiency. More preferably, in the first direction, a single first pad 121 is located in the middle of two second pads 131 adjacent to the first pad 121.

[0047] In another embodiment, referring to Figure 8 , each of the first solder pads 121 and each of the second solder pads 131 are aligned in the first direction.

[0048] In this embodiment, the first solder pad 121 and the second solder pad 131 may be staggered or aligned in the first direction, and the specific arrangement may be made according to actual needs.

[0049] In this embodiment, the sizes of the pads 110 may be kept consistent. For example, the height of the pad 110 may be 800 micrometers, and the width of the pad 110 may be 125 micrometers.

[0050] In one embodiment, a flexible circuit board 300 is provided, comprising the above-mentioned pad array structure.

[0051] In one embodiment, a test system is provided, including a display screen 200 and the above-mentioned flexible circuit board 300, wherein the above-mentioned pad array structure is provided in the display screen 200, and the pad array structure in the display screen 200 is connected correspondingly to the pad array structure in the flexible circuit board 300. That is, the pad array structure in the display screen 200 is the same as the pad array structure in the flexible circuit board 300, and when connecting the display screen 200 and the flexible circuit board 300, each pad 110 in the pad array structure of the two can be connected correspondingly.

[0052] Since the intervals between adjacent pads 110 in the pad array structure are relatively large, when the pad array structure on the display screen 200 is connected to the pad array structure on the flexible circuit board 300, even if misalignment occurs, it is not easy to cause a short circuit between two adjacent pads 110, thereby effectively reducing the risk of burning the wiring and improving the product yield.

[0053] Reference Fig. 9 In one embodiment, a testing process method is provided, comprising the following steps:

[0054] Step S100: forming the pad array structure as described above on the display screen and the flexible circuit board respectively.

[0055] The pad array structure on the display screen is the same as the pad array structure on the flexible circuit board.

[0056] Step S300: Connect the pad array structure on the display screen to the pad array structure on the flexible circuit board to perform a dot screen test.

[0057] After the corresponding pad array structure is formed on the display screen and the flexible circuit board, the pad array structure on the display screen can be connected correspondingly with the pad array structure on the flexible circuit board. Specifically, each pad in the pad array structure on the display screen can be connected correspondingly with each pad in the pad array structure on the flexible circuit board, thereby performing the subsequent point screen testing process.

[0058] Step S500: after the dot screen test is completed, the pad array structure on the display screen is removed.

[0059] When the dot screen test process is completed, the pad array structure can be removed from the display screen so as to enter the subsequent module process of the display screen. Specifically, the pad array structure on the display screen can be removed by laser cutting.

[0060] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent. It should be noted that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A pad array structure, characterized in that: It comprises at least two pad groups spaced apart along a first direction, each pad group comprises a plurality of pads spaced apart along a second direction, and in the same pad group, the spacing distance between two adjacent pads is greater than or equal to the width of a single pad.

2. The pad array structure according to claim 1, characterized in that: In the same pad group, in the second direction, the spacing distance between two adjacent pads is between 100 micrometers and 150 micrometers.

3. The pad array structure according to claim 1, characterized in that: The spacing distance between two adjacent pad groups in the first direction is between 50 micrometers and 150 micrometers.

4. The pad array structure according to claim 1, characterized in that: It includes a first pad group and a second pad group arranged at intervals along a first direction, the first pad group includes a plurality of first pads arranged at intervals along a second direction, and the second pad group includes a plurality of second pads arranged at intervals along the second direction.

5. The pad array structure according to claim 4, characterized in that: Each of the first solder pads and each of the second solder pads are staggered in the first direction. Preferably, in the first direction, a single first pad is located in the middle of two second pads adjacent to the first pad.

6. The pad array structure according to claim 4, characterized in that: Each of the first pads and each of the second pads are aligned in the first direction.

7. The pad array structure according to claim 1, characterized in that: The first direction is the Y-axis direction, and the second direction is the X-axis direction.

8. A flexible circuit board, characterized in that: The invention comprises the pad array structure as described in any one of claims 1 to 7.

9. A testing system, characterized in that: It comprises a display screen and a flexible circuit board as claimed in claim 8, wherein the display screen is provided with a pad array structure as claimed in any one of claims 1 to 7, and the pad array structure in the display screen is connected correspondingly to the pad array structure in the flexible circuit board.

10. A testing process method, characterized in that: include: Forming a pad array structure as claimed in any one of claims 1 to 7 on a display screen and a flexible circuit board respectively; The pad array structure on the display screen is connected correspondingly to the pad array structure on the flexible circuit board to perform a point screen test.

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