Pressing head, pressing device, semiconductor manufacturing device, and electronic component manufacturing device

Abstract

The pressing head includes a head body and a sheet portion. The head body has a pressing surface. The sheet portion is fixed so as to face the pressing surface and have a gap with respect to the pressing surface. In addition, the sheet portion has a flexible layer facing the pressing surface, and a release layer formed so as to come into contact with the flexible layer.

Description

Technical Field

[0001] The present invention relates to a pressing head used when heating and pressing semiconductor components, electronic components, etc. in a die bonding process, and a pressing device including the pressing head. Background Art

[0002] Patent Document 1 describes a method for bonding a semiconductor element to a substrate via a bonding material. The semiconductor element, bonding material, and substrate are temporarily placed, and in this temporarily placed state, a suction chuck (pressing head) is used to heat and pressurize them. Thus, the semiconductor element, bonding material, and substrate are bonded.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-106677 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] When heating and pressing are performed by the suction chuck (pressing head) described in Patent Document 1, the following problems may occur.

[0008] When the semiconductor element is tilted in the temporarily placed state, the contact area between the suction chuck and the semiconductor element becomes smaller. In other words, the heat during heating and pressing is difficult to transfer to the semiconductor element and the bonding material. Therefore, bonding failure may occur.

[0009] Therefore, an object of the present invention is to provide a pressing head and a pressing device that suppress poor bonding during heating and pressing.

[0010] Technical solutions to solve problems

[0011] The pressing head of the present invention comprises a head body and a sheet portion. The head body has a pressing surface. The sheet portion is fixed to face the pressing surface and has a gap relative to the pressing surface. In addition, the sheet portion has a flexible layer facing the pressing surface and a release layer formed to abut against the flexible layer.

[0012] In this structure, since the sheet portion formed to have a gap with the head body has a flexible layer, the sheet portion is deformed. Therefore, the contact area between the sheet portion and the element to be heated and pressurized can be increased. That is, the concentration of pressure during heating and pressurization is alleviated, and the heating temperature is easily transmitted to the element. Therefore, poor bonding between the element and the bonding material can be suppressed.

[0013] Effects of the Invention

[0014] According to the present invention, it is possible to provide a pressing head and a pressing device that can suppress bonding failure during heating and pressing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is an external view of the pressing head according to the first embodiment.

[0016] Figure 2 It is an external view of the pressing head according to the first embodiment.

[0017] Figure 3 It is a side cross-sectional view of the sheet portion according to the first embodiment.

[0018] Figure 4 This is a side cross-sectional view schematically showing the heating and pressurizing of the electronic component using the pressing device according to the first embodiment.

[0019] Figure 5 (A)~ Figure 5 (F) is a side cross-sectional view schematically showing the shape of the sheet portion when the electronic component according to the first embodiment is heated and pressurized.

[0020] Figure 6 This is a flowchart showing a process procedure when heating and pressurizing the electronic component according to the first embodiment. DETAILED DESCRIPTION

[0021] [First embodiment]

[0022] The structures of a pressing head and a pressing device according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1 , Figure 2 It is an external view of the pressing head according to the first embodiment. Figure 3 This is a side cross-sectional view schematically showing the heating and pressing of electronic components using a plurality of pressing heads according to the first embodiment. Figure 4 It is a side cross-sectional view of the sheet portion according to the first embodiment. Figure 5 (A)~ Figure 5 (F) is a side cross-sectional view schematically showing the shape of the sheet portion when the electronic component according to the first embodiment is heated and pressurized. Figure 6 This is a flowchart showing a process procedure when heating and pressurizing the electronic component according to the first embodiment.

[0023] (Structure of the pressing head)

[0024] use Figure 1 , Figure 2, the outline of the pressing head 10 is described. The pressing head 10 includes a head body 110 and a sheet portion 120. In addition, a heating portion 130 and a sensor portion 135 are provided inside the head body 110. The pressing head 10 is heated by the heating portion 130 (heating mechanism). The temperature of the heating portion 130 is detected by the sensor portion 135.

[0025] The head body 110 is, for example, in the shape of a polygonal column. The head body 110 includes a pressing surface PS, a first side surface SD1 connected to the pressing surface PS, and a second side surface SD2. The corners of the portion where the pressing surface PS and the first side surface SD1 are connected, and the portion where the pressing surface PS and the second side surface SD2 are connected (boundary portion) are rounded, and have an R-chamfered shape in which the pressing surface PS and the first side surface SD1, and the pressing surface PS and the second side surface SD2 are smoothly connected.

[0026] The sheet portion 120 is disposed at a position facing the pressing surface PS of the head body 110. More specifically, the sheet portion 120 is fixed to the first side surface SD1 and the second side surface SD2 of the head body 110 by, for example, adhesive tape, and is fixed to face the pressing surface PS. The sheet portion 120 is detachable.

[0027] like Figure 2 As shown, the sheet portion 120 is arranged to cover the pressing surface PS along the first side surface SD1 and the second side surface SD2. That is, the sheet portion 120 has a substantially rectangular shape that can cover the pressing surface PS and may have a shape corresponding to the size of the pressing surface PS.

[0028] like Figure 1 As shown, the sheet 120 is fixed with a gap GP between the pressing surface PS and the sheet 120. The gap GP may be shaped enough to allow the sheet 120 to bend when the pressing head 10 contacts the electronic component during heating and pressing. The specific structure will be described later.

[0029] (Structure of the sheet portion)

[0030] Next, the detailed structure of the sheet portion 120 will be described. Figure 3 2 is a cross-sectional view of the sheet portion 120 and the head main body 110. This cross-sectional view is a cross-sectional view based on a plane perpendicular to the direction in which the head main body 110 extends. Figure 3 The structure of the sheet part 120 and the head main body 110 is schematically shown. The sheet part 120 includes a release layer 121 and a flexible layer 122. The release layer 121 is formed so as to abut against the flexible layer 122.

[0031] As described above, the sheet portion 120 is formed to be opposite to the head body 110. More specifically, the flexible layer 122 of the sheet portion 120 is formed to be opposite to the head body 110. In other words, the flexible layer 122 is formed to be opposite to the pressing surface PS. The release layer 121 is formed to abut against the flexible layer 122. In addition, it is preferred that substantially the entire surface of the surface on the opposite side of the surface of the sheet portion 120 that is opposite to the head body 110 is the release layer 121.

[0032] The mold release layer 121 is a fluororesin (eg, PTFE). In addition, the mold release layer 121 is not limited to PTFE, and may also be a thermoplastic resin or FEP. In other words, any material with low wettability may be used.

[0033] The flexible layer 122 is formed of, for example, glass fibers. The glass fibers may be any of glass wool (short fibers) and glass yarns (long fibers). In addition, the flexible layer 122 may be formed by weaving the glass fibers into a mesh shape.

[0034] In addition, if Figure 3 , an example is shown in which the release layer 121 and the flexible layer 122 are formed in two layers. However, the release layer 121 and the flexible layer 122 may be formed integrally. In other words, the shape in which substantially the entire surface of the flexible layer 122 is covered by the release layer 121 may also be adopted.

[0035] (Pressing structure during heating and pressurization)

[0036] use Figure 4 , the structure of the pressing device 1 is described. The pressing device 1 includes a plurality of pressing heads 10 (for convenience, referred to as a pressing head 10U1 and a pressing head 10U2). More specifically, Figure 4 The pressing surface PS1 of the pressing head 10U1 and the pressing surface PS2 of the pressing head 10U2 are arranged at opposing positions. The pressing head 10U1 and the pressing head 10U2 have the same structure as the pressing head 10 described above.

[0037] The electronic component 200 (for example, a solid electrolytic capacitor having a lead frame) is disposed between the pressing surface PS1 and the pressing surface PS2 . In other words, the electronic component 200 is disposed between the sheet portion 120A formed in the pressing head 10U1 and the sheet portion 120B formed in the pressing head 10U2 .

[0038] Next, use Figure 5 (A)~ Figure 5 (F) Figure 6 The operation of the sheet portion 120A of the pressing head 10U1 when the electronic component 200 is heated and pressed using the pressing device 1 will be described. The sheet portion 120B of the pressing head 10U2 performs substantially the same operation as the pressing head 10U1, and thus will be omitted.

[0039] First, the electronic component 200 is arranged. The electronic component 200 is, for example, a solid electrolytic capacitor. The solid electrolytic capacitor has a plurality of capacitor elements, and the capacitor elements are bonded to a lead frame. The portions of the plurality of capacitor elements that function as capacitors are thicker than the region bonded to the lead frame. Therefore, the portions having different thicknesses have an inclination when viewed from the side. At this time, a bonding material (for example, silver paste) is used to bond the plurality of capacitor elements to the lead frame. Figure 6 : Step S11).

[0040] like Figure 5 As shown in (A), the pressing head 10U1 is arranged to abut against the electronic component 200 ( Figure 6 : Step S12). The sheet portion 120A is not deformed. This is set to the initial state of the sheet portion 120A.

[0041] Then, if Figure 5 As shown in (B), the pressing head 10U1 is pressed toward the electronic component 200. The sheet portion 120A begins to deform into a shape that conforms to the outer shape of the electronic component 200.

[0042] As described above, the sheet portion 120A has the flexible layer 122 and has a gap GP between the sheet portion 120A and the pressing surface PS, so it is easy to deform. That is, the flexible layer 122 of the sheet portion 120A serves as a buffer, which can prevent the electronic component 200 from being damaged by the pressing head 10U1. In other words, the deformation of the flexible layer 122 plays a buffering role, which can prevent damage to the electronic component 200.

[0043] Furthermore, the head main body 110 has a shape with rounded corners, so that damage to the sheet portion 120A is suppressed.

[0044] Then, if Figure 5 As shown in (C), the pressing head 10U1 is further pressed against the electronic component 200 to perform heating and pressing ( Figure 6 : Step S13). The flexible layer 122 of the sheet portion 120A is deformed to follow the outer shape of the electronic component 200. Figure 5 In (C), the shape of the electronic component 200 (a laminate of a plurality of capacitor elements) is exaggerated, and the pressing head 10U1 and the electronic component 200 are greatly separated, but in reality, the separation is close to the thickness of the sheet portion 120A.

[0045] As a result, the electronic component 200 is basically in contact with the sheet portion 120A without a gap, and the contact area between the sheet portion 120A and the electronic component 200 can be expanded. That is, it is possible to suppress the pressure and heating temperature during the heating and pressing of the pressing head 10U1 from being concentrated locally (for example, in the case of a solid electrolytic capacitor, a specific part in the capacitor stack). In addition, pressure and heating temperature can be uniformly applied to the electronic component 200. Therefore, poor bonding when the electronic component 200 is bonded can be suppressed. For example, the part where multiple capacitor elements are bonded to the lead frame is made thinner than the part where the capacitor functional parts of the multiple capacitor elements are stacked. Even with such a structure, poor bonding can be suppressed.

[0046] Next, use Figure 5 (D) illustrates the action of the sheet portion 120A when the pressing head 10U1 is pulled away from the electronic component 200 after heating and pressing. At this time, the head body 110 first separates from the electronic component 200, and the sheet portion 120A gradually separates from the end of the electronic component 200. At this time, the center of the sheet portion 120A contacts the electronic component 200.

[0047] And, if Figure 5 As shown in (E), the pressing head 10U1 is further pulled away from the electronic component 200 ( Figure 6 : Step S14). The sheet portion 120A gradually moves away from the center of the electronic component 200. Specifically, the sheet portion 120A is deformed to extend toward the electronic component 200 and gradually moves away from the outer periphery of the electronic component 200 toward the center.

[0048] Here, the structure of the present invention is compared with the conventional structure. In the conventional structure, the electronic component is difficult to peel off from the pressing head. Specifically, in the process of separating the pressing head from the electronic component after heating and pressurizing, the electronic component is pulled by the pressing head ( Figure 5 That is, the electronic component is pulled away by the pressing head before the inside of the electronic component is cured, so peeling occurs inside the electronic component.

[0049] On the other hand, in the present invention, the release layer 121 of the sheet portion 120A is in contact with the electronic component 200. Due to the wettability of the release layer 121, the sheet portion 120A is easily peeled off from the electronic component 200. That is, the head body 110 that is not in direct contact with the electronic component 200 is peeled off first. After that, the sheet portion 120A gradually leaves the electronic component 200. Therefore, the sheet portion 120A is pulled away from the pressing head 10U1 after the inside of the electronic component 200 is fully cured. Therefore, peeling inside the electronic component 200 can be suppressed.

[0050] Then, if Figure 5 As shown in (F), the sheet portion 120A is restored to Figure 5 The initial state shown in (A).

[0051] In this manner, when heating and pressing are performed using the pressing head 10U1 , bonding defects of the electronic component 200 can be suppressed.

[0052] By using the pressing head 10 (pressing head 10U1 , pressing head 10U2 ), the following effects can be further obtained.

[0053] (1) When the electronic component 200 is heated and pressed using the pressing head 10, the bonding material disposed in the electronic component 200 melts due to the heating temperature of the pressing head 10. The melted bonding material may be exposed from the outer surface of the electronic component 200. That is, the melted bonding material adheres to the release layer 121 of the sheet portion 120.

[0054] In the conventional structure, the bonding material adheres to the pressing surface, resulting in unevenness. Therefore, when heating and pressing are then performed, poor bonding may occur due to the unevenness. However, in the present invention, the release layer 121 of the sheet portion 120A is provided at the position abutting against the electronic component 200. That is, even if the bonding material adheres to the release layer 121, it is easy to remove (clean) the bonding material from the release layer 121 of the sheet portion 120A.

[0055] (2) The sheet portion 120 is detachable from the head main body 110. The sheet portion 120 is worn due to repeated heating and pressurization. However, when the sheet portion 120 is worn, it can be replaced.

[0056] In the above structure, an example in which the electronic component 200 is a solid electrolytic capacitor is shown. However, in the case where a bonding material is applied to a support and a semiconductor element is fixed to the bonding material, the pressing head 10 or the pressing device 1 of the present invention can be applied. In addition, the electronic component 200 is not limited to semiconductor elements, and can also be applied to other electronic components.

[0057] Furthermore, the structures shown in the above-mentioned embodiments and various derivative examples can be combined as appropriate, and can produce effects corresponding to each combination.

[0058] The correspondence between the structure according to the present invention and the above-mentioned structure is described below.

[0059] [Note]

[0060] <1> A pressing head, comprising:

[0061] a head body having a pressed surface; and

[0062] The sheet portion is fixed to face the pressing surface and to have a gap with respect to the pressing surface,

[0063] The sheet portion includes a flexible layer facing the pressing surface and a release layer formed to abut against the flexible layer.

[0064] <2> exist <1> Among the compression heads described,

[0065] The head body has a first side surface and a second side surface connected to the pressing surface,

[0066] The sheet portion is fixed to the first side surface and the second side surface.

[0067] <3> exist <2> Among the compression heads described,

[0068] A boundary between the first side surface of the sheet portion and the pressed surface, and a boundary between the second side surface of the sheet portion and the pressed surface have rounded shapes.

[0069] <4> exist <1> to <3> In any one of the pressing heads described in

[0070] The sheet portion is attachable to and detachable from the head main body.

[0071] <5> exist <1> to <4> In any one of the pressing heads described in

[0072] The flexible layer and the release layer of the sheet portion are integrally formed.

[0073] <6> exist <1> to <5> In any one of the pressing heads described in

[0074] A heating mechanism is provided inside the head body.

[0075] <7> A pressing device having multiple <1> to <6> Any of the pressing heads described in

[0076] The pressing surfaces of the pressing heads are arranged at opposing positions, respectively.

[0077] <8> A semiconductor manufacturing device having <1> to <6> Any of the following described compression head or <7> The described pressing device.

[0078] <9> An electronic component manufacturing device having <1> to <6> Any of the following described compression head or <7> The described pressing device.

[0079] Description of Reference Numerals

[0080] GP…Gap

[0081] PS, PS1, PS2… pressed surface

[0082] SD1…Side 1

[0083] SD2…Side 2

[0084] 1…Pressing device

[0085] 10, 10U1, 10U2…Pressure head

[0086] 110…Head body

[0087] 120, 120A, 120B…sheet part

[0088] 121…Mold release layer

[0089] 122…Flexible layer

[0090] 130…Heating unit

[0091] 135…Sensor

[0092] 200…Electronic components.

Claims

1. A pressing head, comprising: a head body having a pressed surface; and The sheet portion is fixed to face the pressing surface and to have a gap with respect to the pressing surface, The sheet portion includes a flexible layer facing the pressing surface and a release layer formed to abut against the flexible layer.

2. The pressing head according to claim 1, wherein: The head body has a first side surface and a second side surface connected to the pressing surface, The sheet portion is fixed to the first side surface and the second side surface.

3. The pressing head according to claim 2, wherein: A boundary between the first side surface of the sheet portion and the pressed surface, and a boundary between the second side surface of the sheet portion and the pressed surface have rounded shapes.

4. The pressing head according to any one of claims 1 to 3, wherein: The sheet portion is attachable to and detachable from the head main body.

5. The pressing head according to any one of claims 1 to 4, wherein: The flexible layer and the release layer of the sheet portion are integrally formed.

6. The pressing head according to any one of claims 1 to 5, wherein: A heating mechanism is provided inside the head body.

7. A pressing device comprising a plurality of pressing heads according to any one of claims 1 to 6, The pressing surfaces of the pressing heads are arranged at opposing positions, respectively. 8 . A semiconductor manufacturing device comprising the pressing head according to claim 1 or the pressing device according to claim 7 . 9 . An electronic component manufacturing device comprising the pressing head according to claim 1 or the pressing device according to claim 7 .

Images