Wafer spraying equipment

Abstract

The present application relates to the field of wafer preparation technology, and in particular to a wafer spraying device, comprising: an adsorption component, a heating component, and a negative pressure joint; wherein, along a first preset direction, the heating component is arranged below the adsorption component; the adsorption component is formed with negative pressure holes and negative pressure channels arranged in sequence and connected along the first preset direction, and the two respectively penetrate the two sides of the adsorption component along the first preset direction; the heating component is provided with a connecting hole, and the negative pressure joint is arranged on the heating component, and is connected to the negative pressure channel through the connecting hole. In the wafer spraying device provided in the present application, structures such as an adsorption component, a heating component, and a negative pressure joint are provided. The negative pressure joint can be connected to an external negative pressure device, and the negative pressure joint is connected with the connecting hole on the heating component, the negative pressure channel on the adsorption component, and the negative pressure hole, so as to realize vacuum adsorption and fixation of the wafer, thereby avoiding deformation of the wafer, reducing the difficulty of spraying, and improving the spraying effect.

Description

Technical Field

[0001] The present application relates to the technical field of wafer preparation, and in particular to a wafer spraying device. Background Art

[0002] The surface of the wafer needs to be coated with glue during the wafer process, but some wafers are thin and have curvatures, which causes the periphery of the wafer to warp and is easily deformed during the heating process. It is difficult to coat such wafers with glue, and the coating effect is poor. Summary of the invention

[0003] The purpose of the present application is to provide a wafer spraying device, which to a certain extent solves the technical problems existing in the prior art that some wafers are thin and have curvatures, causing the periphery of the wafer to warp and be easily deformed during heating, making it difficult to apply glue to such wafers and the gluing effect is poor.

[0004] The present application provides a wafer spraying device, comprising: an adsorption component, a heating component, and a negative pressure joint; wherein, along a first preset direction, the heating component is arranged below the adsorption component; the adsorption component is formed with negative pressure holes and a negative pressure channel which are arranged in sequence and connected along the first preset direction, and both of them respectively pass through the two sides of the adsorption component along the first preset direction; the heating component is provided with a connecting hole, and the negative pressure joint is connected with the negative pressure channel through the connecting hole.

[0005] In the above technical solution, further, the wafer spraying device also includes a sealing ring, and one of the sides of the adsorption component and the heating component that are close to each other is provided with a sealing groove, the sealing ring is installed in the sealing groove, and the sealing ring is compressed between the adsorption component and the heating component; the sealing ring surrounds the outer circumference of the negative pressure channel.

[0006] In any of the above technical solutions, further, the number of the negative pressure holes is five, and the line connecting four of the negative pressure holes is arranged in a square, and the fifth negative pressure hole is located at the center of the square line.

[0007] In any of the above technical solutions, further, the negative pressure channel is X-shaped, wherein the four negative pressure holes are respectively arranged corresponding to the four vertex positions of the X-shaped negative pressure channel, and the fifth negative pressure hole is arranged corresponding to the center position of the X-shaped negative pressure channel.

[0008] In any of the above technical solutions, further, the wafer spraying device also includes an exhaust component, and the exhaust component is formed with a receiving groove, and the adsorption component and the heating component are both arranged in the receiving groove;

[0009] The side walls and bottom wall of the accommodating groove are both hollow structures, and the inner side wall of the accommodating groove is provided with a suction port connected to the internal hollow part thereof, and the bottom of the bottom wall of the accommodating groove is provided with a glue discharge port connected to the internal hollow part thereof.

[0010] In any of the above technical solutions, further, the suction port is a strip-shaped port arranged along the height direction of the accommodating groove, and the number of the suction ports is multiple and they are arranged in sequence and at intervals along the length direction of the side wall of the accommodating groove.

[0011] In any of the above technical solutions, further, the wafer spraying device also includes a glue spraying mechanism, a driving device and a processing platform; wherein, the driving device is arranged on the processing platform, and the glue spraying mechanism is connected to the driving device, and the driving device is used to drive the glue spraying mechanism to move; the adsorption component and the heating component are arranged in sequence on the processing platform along the first preset direction, and are located below the glue spraying mechanism.

[0012] In any of the above technical solutions, further, the driving device includes a first linear module, a second linear module and a third linear module; wherein the glue spraying mechanism is arranged on the third linear module; the third linear module is connected to the second linear module, the second linear module is connected to the first linear module, and the first linear module is used to drive the second linear module, the third linear module and the glue spraying mechanism to move along the second preset direction;

[0013] The second linear module is used to drive the third linear module and the glue spraying mechanism to move along the third preset direction, and the third linear module is used to drive the glue spraying mechanism to move along the first preset direction; the first linear module and the second linear module are arranged on the outer side of the adsorption component.

[0014] In any of the above technical solutions, further, in an initial state, an initial groove is provided on the processing platform below the glue spraying mechanism, and the initial groove is provided with a guide pipe connected to the inside and the outside.

[0015] In any of the above technical solutions, further, the glue spraying mechanism includes a supporting member, an adjusting member, a first glue spraying head and a second glue spraying head; wherein, the first glue spraying head is arranged on the supporting member, and the second glue spraying head is arranged on the adjusting member; the supporting member is formed with a slide groove extending along a third preset direction, the adjusting member is formed with an adjusting protrusion, and the adjusting protrusion is movably arranged in the slide groove.

[0016] In any of the above technical solutions, further, one of the support member and the first glue spray head is provided with a first waist-shaped hole, and the other is provided with a first circular hole; the wafer spraying device further includes a first bolt, and the first bolt is installed in the first waist-shaped hole and the first circular hole, for locking the first glue spray head and the support member;

[0017] One of the support member and the first glue spray head is provided with a first arc-shaped hole, and the other of them is provided with a second circular hole, and the first circular hole is located at the center of the first arc-shaped hole; the wafer spraying device also includes a second bolt, and the second bolt is installed in the first arc-shaped hole and the second circular hole, for locking the first glue spray head and the support member.

[0018] In any of the above technical solutions, further, one of the adjusting member and the second glue spray head is provided with a second waist-shaped hole, and the other of them is provided with a third circular hole; the wafer spraying device further includes a third bolt, and the third bolt is installed in the second waist-shaped hole and the third circular hole, for locking the second glue spray head and the supporting member;

[0019] One of the adjusting member and the second glue spray head is provided with a second arc-shaped hole, and the other of them is provided with a fourth circular hole, and the third circular hole is located at the center of the second arc-shaped hole; the wafer spraying device also includes a fourth bolt, and the fourth bolt is installed in the second arc-shaped hole and the fourth circular hole, for locking the first glue spray head and the supporting member.

[0020] In any of the above technical solutions, further, a scale is provided on the supporting member and / or the adjusting member.

[0021] In any of the above technical solutions, further, the adsorption component is formed with a plurality of spraying stations, and each of the spraying stations is provided with the negative pressure hole and the negative pressure channel.

[0022] In any of the above technical solutions, further, the wafer spraying device also includes a temperature detection component, and the temperature detection component is penetrated by the heating component, and the detection end of the temperature detection component is in contact with the adsorption component.

[0023] In any of the above technical solutions, further, the wafer spraying device also includes an over-temperature protection component, and the over-temperature protection component is connected to the heating component.

[0024] In any of the above technical solutions, further, the heating component includes a heat conducting plate and a heating wire, the heating wire is arranged on a side of the heat conducting plate away from the adsorption component, and the heating wire is coiled around the entire heat conducting plate.

[0025] In any of the above technical solutions, further, the wafer spraying device also includes a heat insulation plate arranged on the heating component, and the heat insulation plate is arranged on the entire periphery of the heating component and / or the bottom of the heating component along the first preset direction.

[0026] In any of the above technical solutions, further, a heat-conducting layer is provided between the heating component and the adsorption component.

[0027] In any of the above technical solutions, further, the negative pressure joint is arranged on the heating component.

[0028] Compared with the prior art, the beneficial effects of this application are:

[0029] The wafer spraying device provided in the present application is provided with structures such as an adsorption component, a heating component and a negative pressure joint. The negative pressure joint can be connected to an external negative pressure device, and the negative pressure joint is connected to the connecting hole on the heating component, the negative pressure channel and the negative pressure hole on the adsorption component to achieve vacuum adsorption and fixation of the wafer, thereby avoiding deformation of the wafer, reducing the difficulty of spraying, and improving the spraying effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 A schematic diagram of the structure of a wafer spraying device provided in an embodiment of the present application;

[0032] Figure 2 Another schematic diagram of the structure of the wafer spraying device provided in the embodiment of the present application;

[0033] Figure 3 for Figure 2 Cross-sectional view along section AA;

[0034] Figure 4 An assembly diagram of an adsorption component and a heating component provided in an embodiment of the present application;

[0035] Figure 5 A schematic diagram of the structure of the adsorption component provided in the embodiment of the present application;

[0036] Figure 6 Another schematic diagram of the structure of the adsorption component provided in the embodiment of the present application;

[0037] Figure 7 Another assembly diagram of the adsorption component and the heating component provided in the embodiment of the present application;

[0038] Figure 8 A schematic diagram of the structure of the exhaust component provided in the embodiment of the present application;

[0039] Fig. 9 A schematic diagram of the structure of a heating component provided in an embodiment of the present application;

[0040] Fig.10 Another assembly diagram of the adsorption component and the heating component provided in the embodiment of the present application;

[0041] Fig.11 Another assembly diagram of the adsorption component and the heating component provided in the embodiment of the present application;

[0042] Fig.12 Another structural schematic diagram of the wafer spraying device provided in the embodiment of the present application;

[0043] Fig.13 for Fig.12 A schematic diagram of the local enlarged structure at B;

[0044] Fig.14 for Fig.13 Schematic diagram of the local enlarged structure at point C.

[0045] Reference numerals:

[0046] 1-adsorption component, 101-spraying station, 102-negative pressure hole, 103-negative pressure channel, 2-heating component, 21-heat conducting plate, 22-heating wire, 23-connecting hole, 24-sealing groove, 3-negative pressure joint, 4-exhaust component, 41-accommodating groove, 42-glue suction channel, 43-suction port, 44-glue discharge port, 5-glue spraying mechanism, 51-support component, 52-adjusting component, 53-first glue spraying head, 54 -Second glue spray head, 55-slide groove, 56-adjusting protrusion, 57-first circular hole, 58-first arc hole, 59-second circular hole, 510-scaler, 6-driving device, 61-first linear module, 62-second linear module, 63-third linear module, 7-processing platform, 71-initial groove, 8-heat insulation board, 9-temperature detection component, 10-over-temperature protection component, 11-drag chain, 12-wire clamp. DETAILED DESCRIPTION

[0047] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0048] The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed, but merely represents the selected embodiments of the present application.

[0049] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0050] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0051] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0052] Refer to the following Figures 1 to 14 A wafer spray coating device according to some embodiments of the present application is described.

[0053] See also Figures 1 to 7 As shown, an embodiment of the present application provides a wafer spraying device, comprising: an adsorption component 1, a heating component 2, and a negative pressure connector 3; wherein, along a first preset direction a, the heating component 2 is arranged below the adsorption component 1; the adsorption component 1 is formed with negative pressure holes 102 and a negative pressure channel 103 which are arranged in sequence and connected along the first preset direction a, and both of them pass through the two sides of the adsorption component 1 along the first preset direction a respectively; the heating component 2 is provided with a connecting hole 23, the negative pressure connector 3 is arranged on the heating component 2, and is connected with the negative pressure channel 103 through the connecting hole 23.

[0054] In this embodiment, the wafer spraying device provided in the present application is provided with structures such as an adsorption component 1, a heating component 2 and a negative pressure joint 3. The negative pressure joint 3 can be connected to an external negative pressure device, and the negative pressure joint 3 is connected to the connecting hole 23 on the heating component 2, the negative pressure channel 103 on the adsorption component 1 and the negative pressure hole 102 to achieve vacuum adsorption and fixation of the wafer, thereby avoiding deformation of the wafer, reducing the difficulty of spraying, and improving the spraying effect.

[0055] Further, preferably, Figure 4 and Figure 5 As shown, the adsorption component 1 is formed with a plurality of spraying stations 101, and each spraying station 101 is provided with a negative pressure hole 102, a negative pressure channel 103 and a negative pressure connector 3, so that a plurality of wafers can be sprayed without affecting each other.

[0056] Further, preferably, Fig.10 As shown, the heating component 2 includes a heat conducting plate 21 and a heating wire 22. The heating wire 22 is arranged on the side of the heat conducting plate 21 away from the adsorption component 1, and the heating wire 22 is coiled around the entire heat conducting plate 21. The heating wire 22 is energized to convert electrical energy into thermal energy and transfer it to the heat conducting plate 21, thereby heating the wafer during the gluing process to meet the gluing requirements. This will be used as an example to illustrate this later. Of course, the structure of the heating component 2 is not limited to the above, and can also be designed according to actual needs.

[0057] Further preferably, a connecting hole 23 connected to the negative pressure channel 103 is opened on the heat conducting plate 21 for conveying negative pressure, and the connecting hole 23 corresponds to the spraying station 101 one by one.

[0058] Further, preferably, the negative pressure joint 3 is provided on the heating component 2 , and preferably, the negative pressure joint 3 can be embedded in the heating plate of the sub-heating component 2 .

[0059] In one embodiment of the present application, preferably, Fig. 9 As shown, the wafer spraying device also includes a sealing ring. A sealing groove 24 is provided on one side of the heating component 2 close to the adsorption component 1. The sealing ring is installed in the sealing groove 24, and the sealing ring is compressed between the adsorption component 1 and the heating component 2; the sealing ring surrounds the outer periphery of the negative pressure channel 103.

[0060] In this embodiment, a sealing groove 24 is provided on the side of the heating component 2 facing the adsorption component 1, and a sealing ring is embedded in the sealing groove 24. The sealing ring is clamped between the heating component 2 and the bottom of the adsorption component 1, and the negative pressure channel 103 is surrounded by the sealing ring. In this way, the suction force of the negative pressure vacuum is ensured to achieve effective fixation of the wafer. Especially when there are multiple spraying stations 101, multiple sealing grooves 24 are arranged one by one corresponding to multiple spraying stations 101 to achieve independent sealing.

[0061] Of course, the present invention is not limited thereto, and a sealing groove 24 may be provided on one side of the adsorption component 1 close to the heating component 2 , depending on actual needs.

[0062] In this embodiment, further, preferably, Figure 4 and Figure 5 As shown, the number of the negative pressure holes 102 is five, and the line connecting four of the negative pressure holes 102 is arranged in a square, wherein the fifth negative pressure hole 102 is located at the center of the square line.

[0063] In this embodiment, five negative pressure holes 102 are provided on each spraying station 101, so that vacuum adsorption is achieved in the middle and around the wafer, thereby facilitating the adsorption of the arc-shaped wafer into a plane (the wafer is very thin and a certain degree of complete deformation is allowed without damaging the wafer). Correspondingly, a negative pressure channel 103 is provided at the bottom of the adsorption component 1. The negative pressure channel 103 can be arranged corresponding to the distribution of the negative pressure holes 102. For example, when there are five negative pressure holes 102, the negative pressure channel 103 can be an X-shaped structure, wherein four negative pressure holes 102 are arranged corresponding to the four top corners of the X-shaped negative pressure channel 103, and the fifth negative pressure hole 102 is arranged corresponding to the center position of the X-shaped negative pressure channel 103.

[0064] It should be noted that the number of the negative pressure holes 102 is not limited to five, but may be less than five, such as two, three or four, and the number of the negative pressure holes 102 may be greater than five, such as six, seven or ten, and so on.

[0065] In addition, the distribution of the negative pressure holes 102 is not limited to the above, and correspondingly, the shape of the negative pressure channel 103 is not limited to the above X-shape. For example, multiple negative pressure holes 102 can be arranged in a circular array or a square array, and the negative pressure channel 103 can also include multiple annular channels and straight air channels. The multiple annular channels are arranged in a circular array or a square array, and the straight air channels are connected together.

[0066] In one embodiment of the present application, preferably, Figure 3 and Figure 8 As shown, the wafer spraying device further includes an exhaust member 4, and the exhaust member 4 is formed with a receiving groove 41, and the adsorption member 1 and the heating member 2 are both arranged in the receiving groove 41, so that the adsorption member 1 and the heating member 2 are more stable and not easy to shift, and preferably, the adsorption member 1 and the heating member 2 can also be detachably connected to the bottom wall of the receiving groove 41 by the same bolts, which plays a role of further reinforcement;

[0067] The side walls and bottom wall of the accommodating groove 41 are both hollow structures, and the hollow part serves as a glue suction channel 42. The inner side wall of the accommodating groove 41 is provided with a suction port 43 connected to the hollow part thereof, and the bottom of the bottom wall of the accommodating groove 41 is provided with a glue discharge port 44 connected to the hollow part thereof.

[0068] In this embodiment, a suction port 43 is provided on the side wall of the accommodating groove 41, the interior of the exhaust component 4 is hollow to form a glue suction channel 42, and a glue discharge port 44 is provided at the bottom of the exhaust component 4, and the glue discharge port 44 is connected to the negative pressure exhaust device, so that the wind flow at the spraying station 101 flows into the glue suction channel 42 through the suction port 43 and then is discharged from the glue discharge port 44, so that the excess glue liquid is discharged from the glue discharge port 44 along the wind flow during the glue spraying process of the nozzle, so as to solve the problem of difficult glue cleaning on the processing platform 7. It should be noted that a through hole is also provided at the bottom of the accommodating groove 41 for wiring or connecting negative pressure vacuum equipment, etc.

[0069] In one embodiment of the present application, preferably, Figure 8 As shown, the suction port 43 is a strip-shaped port arranged along the height direction of the accommodating groove 41 , and there are multiple suction ports 43 , which are arranged in sequence and at intervals along the length direction of the side wall of the accommodating groove 41 .

[0070] In this embodiment, the strip-shaped opening arranged along the height direction of the accommodating groove 41 occupies little space, so that more suction openings 43 can be arranged in a limited area, thereby improving the effect of cleaning the glue liquid. Of course, it is not limited to this. The suction opening 43 can also be circular or other shapes, etc., which can be selected according to actual needs.

[0071] Furthermore, preferably, the accommodating groove 41 is a rectangular groove, and preferably, the four side walls thereof are all provided with the aforementioned suction port 43, so that the glue can be removed in all directions around the adsorption component 1. Of course, it is not limited to this, and the suction port 43 can be provided only on one side wall, two side walls or three side walls of the accommodating groove 41. In addition, it should be noted that: the shape of the accommodating groove 41 is not limited to the above, and can also be designed according to actual needs.

[0072] In one embodiment of the present application, preferably, Figure 1 and Figure 2 As shown, the wafer spraying device also includes a glue spraying mechanism 5, a driving device 6 and a processing platform 7; wherein the driving device 6 is arranged on the processing platform 7, and the glue spraying mechanism 5 is connected to the driving device 6, and the driving device 6 is used to drive the glue spraying mechanism 5 to move; the adsorption component 1 and the heating component 2 are sequentially arranged on the processing platform 7 along the first preset direction a, and are located below the glue spraying mechanism 5.

[0073] In this embodiment, the processing platform 7 is used to place the aforementioned exhaust component 4, adsorption component 1 and heating component 2, and the driving device 6 is used to drive the glue spraying mechanism 5 to move, thereby spraying glue on the wafer placed on the glue spraying station of the adsorption component 1.

[0074] In one embodiment of the present application, preferably, Figure 1 and Figure 2 As shown, the driving device 6 includes a first linear module 61, a second linear module 62 and a third linear module 63; wherein the glue spraying mechanism 5 is arranged on the third linear module 63; the third linear module 63 is connected to the second linear module 62, the second linear module 62 is connected to the first linear module 61, and the first linear module 61 is used to drive the second linear module 62, the third linear module 63 and the glue spraying mechanism 5 to move along the second preset direction b;

[0075] The second linear module 62 is used to drive the third linear module 63 and the glue spraying mechanism 5 to move along the third preset direction c, and the third linear module 63 is used to drive the glue spraying mechanism 5 to move along the first preset direction a; the first linear module 61 and the second linear module 62 are arranged on the outer side of the adsorption component 1.

[0076] Further, preferably, the first preset direction a is a vertical direction, the second preset direction b is an X direction in a horizontal plane, and the third preset direction c is a Y direction in a horizontal plane. This will be used as an example to illustrate below. Of course, it is not limited to the above and can also be selected according to actual needs.

[0077] It should be noted that the structure of the driving device 6 is not limited to the above, and may also be a linear module structure with two adjustable directions, or a linear module structure with one adjustable direction, etc.

[0078] In this embodiment, three linear modules are provided, so that the position of the glue spraying mechanism 5 can be adjusted in three directions to meet the glue coating requirements of wafers at different glue coating stations.

[0079] In one embodiment of the present application, preferably, Figure 1 As shown, in the initial state, an initial groove 71 is provided on the processing platform 7 below the glue spraying mechanism 5 .

[0080] In this embodiment, an initial groove 71 is further provided on the processing platform 7. Before the glue coating begins, the two glue spray heads described below are located above the initial groove 71. Before the glue spray heads move above the nozzle station, the glue spray heads can be allowed to spray out the front glue mist first to avoid clogging of the glue spray heads or deposition of residual glue in the glue spray heads, which does not meet the glue spraying requirements of the wafer. The initial groove 71 is formed into a groove structure, and preferably, at least part of the groove wall is inclined to facilitate the glue to flow downward, and a guide pipe is provided at the bottom of the initial groove 71 to discharge the glue in the initial groove 71.

[0081] In one embodiment of the present application, preferably, Figure 12 to Figure 14 As shown, the glue spraying mechanism 5 includes a supporting member 51, an adjusting member 52, a first glue spraying head 53 and a second glue spraying head 54; wherein, the first glue spraying head 53 is arranged on the supporting member 51, and the second glue spraying head 54 is arranged on the adjusting member 52; the supporting member 51 is arranged along a third preset direction c, and the supporting member 51 is formed with a slide groove 55 extending along the third preset direction c, and the adjusting member 52 is formed with an adjusting protrusion 56, and the adjusting protrusion 56 is movably arranged in the slide groove 55.

[0082] In this embodiment, the distance between the first nozzle and the second nozzle is adjusted by adjusting the protrusion to slide in the slide groove 55, and preferably, a ruler 510 is also provided on the support member 51 to improve the accuracy of the adjustment distance. Of course, the present invention is not limited to this, and the ruler 510 may also be provided on the adjustment member 52, or the ruler 510 may be provided on both the support member 51 and the adjustment member 52.

[0083] In one embodiment of the present application, preferably, Fig.14 As shown, the support member 51 is provided with a first waist-shaped hole extending along a first preset direction a, and the first glue spray head 53 has a first circular hole 57; the wafer spraying device also includes a first bolt, and the first bolt is installed in the first waist-shaped hole and the first circular hole 57, and cooperates with the first nut to lock the first glue spray head 53 and the support member 51.

[0084] It can be seen that the position of the first bolt can be adjusted through the first waist hole, thereby adjusting the height of the first glue spray head 53. Of course, not limited to the above, the first glue spray head 53 can also be provided with a first waist hole, the support member 51 can be provided with a first circular hole 57, etc.

[0085] Further, preferably, the first glue spray head 53 is provided with a first arc-shaped hole 58, the supporting member 51 is provided with a second circular hole 59, and the first circular hole 57 is located at the center of the first arc-shaped hole 58; the wafer spraying device also includes a second bolt, and the second bolt is installed in the first arc-shaped hole 58 and the second circular hole 59, and cooperates with the second nut to lock the first glue spray head 53 and the supporting member 51.

[0086] In this embodiment, the position of the second bolt can be adjusted through the first arc hole 58, thereby adjusting the angle of the first glue spray head 53. Of course, not limited to the above, the support member 51 can also be provided with the first arc hole 58, the first glue spray head 53 can be provided with the second circular hole 59, etc.

[0087] In one embodiment of the present application, preferably, the adjusting member 52 is provided with a second waist-shaped hole, and the second glue spray head 54 is provided with a third circular hole; the wafer spraying device also includes a third bolt, and the third bolt is installed in the second waist-shaped hole and the third circular hole, and cooperates with the third nut to lock the second glue spray head 54 and the supporting member 51, referring to the aforementioned assembly structure of the first glue spray head 53 and the supporting member 51.

[0088] It can be seen that the position of the third bolt can be adjusted through the second waist-shaped hole, thereby adjusting the height of the second glue spraying head 54. Of course, not limited to the above, the second glue spraying head 54 can also be provided with a second waist-shaped hole, and the adjusting member 52 can be provided with a third circular hole.

[0089] Further, preferably, the second glue spray head 54 is provided with a second arc-shaped hole, the adjusting member 52 is provided with a fourth circular hole, and the third circular hole is located at the center of the second arc-shaped hole; the wafer spraying device also includes a fourth bolt, and the fourth bolt is installed in the second arc-shaped hole and the fourth circular hole, and cooperates with the third nut, and the nut is used to lock the first glue spray head 53 and the supporting member 51, referring to the aforementioned assembly structure of the first glue spray head 53 and the supporting member 51.

[0090] It can be seen that the position of the fourth bolt can be adjusted through the second arc hole, thereby adjusting the angle of the second glue spraying head 54. Of course, not limited to the above, the adjusting member 52 can also be provided with a second arc hole, the second glue spraying head 54 can be provided with a fourth circular hole, etc.

[0091] In one embodiment of the present application, preferably, Figure 7 and Fig.11 As shown, the wafer spraying device further includes a temperature detection component 9 , and the temperature detection component 9 is disposed through the heating component 2 , and a detection end of the temperature detection component 9 is in contact with the adsorption component 1 .

[0092] In this embodiment, the temperature detection element is preferably a temperature sensor. The wafer spraying device provided in this embodiment is also equipped with a controller, and the temperature detection element, the over-temperature protection element described below, and the heating wire 22 are communicatively connected with the controller to realize real-time monitoring, control and protection of the temperature.

[0093] In one embodiment of the present application, preferably, Figure 7 and Fig.11As shown, the wafer spraying device further includes an over-temperature protection component 10, and the over-temperature protection component 10 is connected to the heating component 2 to play a role of overheating protection.

[0094] In one embodiment of the present application, preferably, Figure 4 As shown, the wafer spray coating device further includes a heat insulation plate 8 disposed on the heating component 2 , and the number of the heat insulation plates 8 is plural and they are sequentially disposed along the entire periphery of the heating component 2 .

[0095] In this embodiment, heat insulation plates 8 are provided around the heating component 2 to prevent the heat generated by the heating component 2 from being lost through conduction, and the heat insulation plates 8 are preferably made of a material with low thermal conductivity.

[0096] In one embodiment of the present application, preferably, Fig.11 As shown, a heat insulation board 8 is provided at the bottom of the heating component 2 along the first preset direction a to prevent the heat generated by the heating wire 22 from being lost by conduction, and the heat insulation board 8 is preferably made of a material with low thermal conductivity.

[0097] In one embodiment of the present application, preferably, a heat-conducting layer is provided between the heating component 2 and the adsorption component 1 to perform heat conduction and enhance the heating effect, and preferably, the heat-conducting layer is made of thermal grease, but of course, it is not limited thereto.

[0098] In one embodiment of the present application, preferably, Figure 2 As shown, the wafer spraying device also includes a drag chain 11, which plays a role in protecting cables and the like.

[0099] In one embodiment of the present application, preferably, Fig.12 As shown, the circular spraying device also includes a wire clamp 12. The wire clamp 12 is arranged on the supporting member 51, and is used to clamp the above-mentioned rubber hose and air pipe to avoid the wire entanglement during the movement of the nozzle. Similarly, the wire clamp 12 can also be installed on the adjusting member 52, so that the two nozzle wire clamps 12 can fix the rubber hose and air pipe on the first nozzle and the second nozzle respectively.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer spraying device, characterized in that: include: An adsorption component, a heating component, and a negative pressure connector; wherein, along a first preset direction, the heating component is arranged below the adsorption component; the adsorption component is formed with negative pressure holes and a negative pressure channel which are arranged in sequence and connected along the first preset direction, and both of them respectively pass through the two sides of the adsorption component along the first preset direction; the heating component is provided with a connecting hole, and the negative pressure connector is connected with the negative pressure channel through the connecting hole.

2. The wafer spraying device according to claim 1, characterized in that: The wafer spraying device also includes a sealing ring, and a sealing groove is provided on one of the sides of the adsorption component and the heating component that are close to each other. The sealing ring is installed in the sealing groove, and the sealing ring is compressed between the adsorption component and the heating component; the sealing ring surrounds the outer circumference of the negative pressure channel.

3. The wafer spraying device according to claim 1, characterized in that: The number of the negative pressure holes is five, and the line connecting four of the negative pressure holes is arranged in a square, wherein the fifth negative pressure hole is located at the center of the square line.

4. The wafer spraying device according to claim 3, characterized in that: The negative pressure channel is X-shaped, wherein the four negative pressure holes are respectively arranged corresponding to the four vertex positions of the X-shaped negative pressure channel, and the fifth negative pressure hole is arranged corresponding to the center position of the X-shaped negative pressure channel.

5. The wafer spraying device according to claim 1, characterized in that: The wafer spraying device further includes an exhaust component, and the exhaust component is formed with a receiving groove, and the adsorption component and the heating component are both arranged in the receiving groove; The side walls and bottom wall of the accommodating groove are both hollow structures, and the inner side wall of the accommodating groove is provided with a suction port connected to the internal hollow part thereof, and the bottom of the bottom wall of the accommodating groove is provided with a glue discharge port connected to the internal hollow part thereof.

6. The wafer spraying device according to claim 5, characterized in that: The suction port is a strip-shaped port arranged along the height direction of the accommodating groove, and the number of the suction ports is multiple and they are arranged in sequence and at intervals along the length direction of the side wall of the accommodating groove.

7. The wafer spraying device according to claim 1, characterized in that: The wafer spraying device also includes a glue spraying mechanism, a driving device and a processing platform; wherein the driving device is arranged on the processing platform, and the glue spraying mechanism is connected to the driving device, and the driving device is used to drive the glue spraying mechanism to move; the adsorption component and the heating component are sequentially arranged on the processing platform along the first preset direction, and are located below the glue spraying mechanism.

8. The wafer spraying device according to claim 7, characterized in that: The driving device includes a first linear module, a second linear module and a third linear module; wherein the glue spraying mechanism is arranged on the third linear module; the third linear module is connected to the second linear module, the second linear module is connected to the first linear module, and the first linear module is used to drive the second linear module, the third linear module and the glue spraying mechanism to move along a second preset direction; The second linear module is used to drive the third linear module and the glue spraying mechanism to move along a third preset direction, and the third linear module is used to drive the glue spraying mechanism to move along a first preset direction; the first linear module and the second linear module are arranged on the outer side of the adsorption component; and / or In the initial state, an initial groove is arranged on the processing platform below the glue spraying mechanism, and the initial groove is equipped with a guide pipe connected with the inside and the outside.

9. The wafer spraying device according to claim 7, characterized in that: The glue spraying mechanism includes a supporting member, an adjusting member, a first glue spraying head and a second glue spraying head; wherein, the first glue spraying head is arranged on the supporting member, and the second glue spraying head is arranged on the adjusting member; the supporting member is formed with a slide groove extending along a third preset direction, and the adjusting member is formed with an adjusting protrusion, and the adjusting protrusion is movably arranged in the slide groove.

10. The wafer spraying device according to claim 9, characterized in that: One of the support member and the first glue spray head is provided with a first waist-shaped hole, and the other of the first glue spray head is provided with a first circular hole; the wafer spraying device further comprises a first bolt, and the first bolt is installed in the first waist-shaped hole and the first circular hole, for locking the first glue spray head and the support member; One of the support member and the first glue spray head is provided with a first arc-shaped hole, and the other of the two is provided with a second circular hole, and the first circular hole is located at the center of the first arc-shaped hole; the wafer spraying device further includes a second bolt, and the second bolt is installed in the first arc-shaped hole and the second circular hole, and is used to lock the first glue spray head and the support member; and / or One of the adjusting member and the second glue spray head is provided with a second waist-shaped hole, and the other of the adjusting member and the second glue spray head is provided with a third circular hole; the wafer spraying device further comprises a third bolt, and the third bolt is installed in the second waist-shaped hole and the third circular hole, and is used to lock the second glue spray head and the supporting member; One of the adjusting member and the second glue spray head is provided with a second arc-shaped hole, and the other of them is provided with a fourth circular hole, and the third circular hole is located at the center of the second arc-shaped hole; the wafer spraying device also includes a fourth bolt, and the fourth bolt is installed in the second arc-shaped hole and the fourth circular hole, and is used to lock the first glue spray head and the supporting member; and / or The supporting member and / or the adjusting member is provided with a scale.

11. The wafer spraying device according to any one of claims 1 to 10, characterized in that: The adsorption component is formed with a plurality of spraying stations, and each of the spraying stations is provided with the negative pressure hole and the negative pressure channel; and / or The wafer spraying device further comprises a temperature detection component, and the temperature detection component is disposed through the heating component, and a detection end of the temperature detection component is in contact with the adsorption component; and / or The wafer spraying device further includes an over-temperature protection component, and the over-temperature protection component is connected to the heating component; and / or The heating component comprises a heat conducting plate and a heating wire, wherein the heating wire is arranged on a side of the heat conducting plate away from the adsorption component, and the heating wire is coiled around the entire heat conducting plate; and / or The wafer spraying device further comprises a heat insulating plate arranged on the heating component, and the heat insulating plate is arranged on the entire periphery of the heating component and / or the bottom of the heating component along the first preset direction; and / or A heat-conducting layer is provided between the heating component and the adsorption component; and / or The negative pressure joint is arranged on the heating component.

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