Semiconductor coating equipment and coating method

Abstract

The invention relates to the technical field of semiconductor manufacturing, and particularly discloses semiconductor coating equipment and a coating method.The semiconductor coating equipment comprises a fixed platform, the top of the fixed platform is fixedly connected with a mounting ring, and the inner wall of the mounting ring is in threaded connection with a storage tank; through the arrangement of the storage tank, the stirring rod, the air pump and the storage pipe, during use, the telescopic motor drives the sleeving frame, the mounting pipe below the sleeving frame and the stirring rod to move up and down through the connecting rod, the stirring rod plays a role in uniformly stirring a coating material in the coating process, the coating quality is ensured, the air pump in the sleeving frame is connected with the air storage tank, and the coating efficiency is improved. Inert gas is stored in the gas storage tank, the inert gas is conveyed to the assembling pipe through the connecting gas pipe and then enters the storage pipe through the inserting pipe, and the Haar powder is stored in the storage pipe, so that the inert gas blows the Haar powder in the storage pipe into the storage tank, and the Haar powder is mixed with coating liquid in the storage tank; therefore, the coating uniformity and efficiency are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a semiconductor coating device and a coating method. Background Art

[0002] With the rapid development of semiconductor technology, the manufacturing process of semiconductor devices is becoming increasingly sophisticated, and the requirements for coating processes are becoming increasingly stringent. As a key link in semiconductor manufacturing, the quality and efficiency of coating technology directly affect the performance and stability of semiconductor devices. Traditional semiconductor coating equipment and methods have gradually revealed their limitations when dealing with high-precision and high-uniformity coating requirements.

[0003] At present, most semiconductor coating equipment on the market adopts simple spraying or dipping methods. The uniformity and stability of the coating liquid are difficult to guarantee. The spraying method often causes the coating liquid to be unevenly distributed on the semiconductor surface, resulting in thickness differences, affecting the performance of the device. Although the spin coating method improves the uniformity of coating to a certain extent, the adaptability and flexibility of the spin coating equipment are limited for semiconductor devices of large size or complex shape. In addition, the traditional coating equipment lacks an effective stirring and mixing mechanism during the coating process, which makes the components in the coating liquid easy to stratify or precipitate, further affecting the coating quality, so staff need to improve it. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor coating device and a coating method to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A semiconductor coating device, comprising:

[0007] Fixed platform;

[0008] The top of the fixed platform is fixedly connected with a mounting ring, the inner wall of the mounting ring is threadedly connected with a storage tank, the top of the storage tank is threadedly connected with a sealing cover, and both sides of the top of the sealing cover are provided with air holes;

[0009] The top of the sealing cover is fixedly connected to a protection box, the inner wall of the protection box is fixedly connected to a telescopic motor, the output end of the telescopic motor is installed with a connecting rod, the bottom end of the connecting rod is fixedly connected to a sleeve frame, the bottom end of the sleeve frame is threadedly connected to a mounting tube, and the bottom end of the mounting tube is fixedly connected to a stirring rod;

[0010] An air pump is fixedly connected to the inner wall of the sleeve frame, an air tank is fixedly connected to the top of the air pump, a connecting air pipe is installed at the output end of the air pump, and the surface of the connecting air pipe is plugged into the inner wall of the mounting pipe, a plurality of assembly pipes are fixedly connected to the surface of the connecting air pipe, a plug-in pipe is fixedly connected to the inner wall of the assembly pipe, a storage pipe is sleeved on the surface of the plug-in pipe, a one-way valve is provided on the inner wall of the storage pipe, a rubber ring is fixedly connected to the surface of the storage pipe, a plurality of connecting pipes are fixedly connected to the surface of the mounting pipe, and the surface of the rubber ring is plugged into the inner wall of the connecting pipe.

[0011] Preferably, a conical discharge pipe is fixedly connected to the bottom of the mounting ring, and the surface of the conical discharge pipe is plugged into the inner wall of the fixed platform, the bottom end of the conical discharge pipe is fixedly connected to a control pipe, the surface of the control pipe is fixedly connected to an installation frame, the inner wall of the installation frame is fixedly connected to a flow meter, and the surface of the flow meter is plugged into the inner wall of the control pipe, and one side of the flow meter is fixedly connected to a controller.

[0012] Preferably, an electric telescopic rod is fixedly connected to the inner wall of the mounting frame, a sealing plate is fixedly connected to the output end of the electric telescopic rod, and the surface of the sealing plate is plugged into the inner wall of the control tube, one end of the electric telescopic rod is electrically connected to a wire, and the top of the wire is electrically connected to one side of the controller.

[0013] Preferably, a connection box is fixedly connected to the surface of the control tube, a fan is fixedly connected to the inner wall of the connection box, an exhaust pipe is installed at the output end of the fan, and the surface of the exhaust pipe is plugged into the inner wall of the control tube, and a discharge pipe is fixedly connected to the bottom end of the control tube.

[0014] Preferably, the bottom of the fixed platform is fixedly connected to a mounting platform, the inner wall of the mounting platform is fixedly connected to a battery box, the inner wall of the battery box is fixedly connected to a battery, and the surface of the mounting platform is fixedly connected to a control panel.

[0015] Preferably, a driving motor is fixedly connected to the inner wall of the mounting platform, a driving rod is installed at the output end of the driving motor, and a positioning plate is fixedly connected to the top end of the driving rod.

[0016] Preferably, four mounting holes are provided on the top of the positioning plate, a sliding block is slidably connected to the inner wall of the mounting hole, both sides of the back side of the sliding block are connected to extrusion springs, and the surface of the extrusion spring is inserted into the inner wall of the mounting hole, a baffle is fixedly connected to the top of the sliding block, and an elastic pad is fixedly connected to the surface of the baffle.

[0017] A coating method for a semiconductor coating device comprises the following steps:

[0018] S1. The operator starts the equipment through the control panel and connects the battery in the battery box to provide power support for the entire coating equipment. Then, the drive motor is powered on and the positioning plate is driven to rotate through the drive rod. The positioning plate is used to fix the semiconductor material to be coated to ensure its stability during the coating process. The sliding block on the positioning plate slides flexibly in the mounting hole and tightly and firmly clamps semiconductor materials of different sizes through the elastic force of the extrusion spring. At the same time, the baffle and the elastic pad enhance the stability of the coating process and the protection of the semiconductor material;

[0019] S2. After the semiconductor material is stably fixed, the telescopic motor is turned on to drive the sleeve frame and the mounting tube and stirring rod below it to move up and down through the connecting rod. The stirring rod evenly stirs the coating liquid in the storage tank during the movement. At the same time, the air pump inside the sleeve frame is turned on to transport the inert gas in the gas tank to the assembly tube through the connecting air pipe, and then enter the storage tube through the plug-in tube. The Halberd powder stored in the storage tube is evenly blown into the storage tank under the blowing of the inert gas and mixed with the coating liquid;

[0020] S3. After the coating liquid and the halal powder are evenly mixed, the mixture is guided to flow to the control tube through the conical discharge pipe. The flow meter integrated inside the mounting frame accurately measures the amount of coating material flowing through the control tube, and feeds back the data to the controller. The controller intelligently controls the electric telescopic rod according to the feedback of the flow meter, so that it drives the sealing plate to move flexibly in the control tube after receiving the signal through the wire;

[0021] S4. The fan in the connection box blows air into the control tube through the exhaust pipe, effectively preventing material blockage and ensuring smooth discharge. Finally, the coating material is evenly coated on the surface of the semiconductor equipment through the discharge pipe.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] (1) Through the arrangement of a storage tank, a telescopic motor, a mounting tube, a stirring rod, an air pump, a connecting air pipe, a storage tube and a one-way valve, when in use, the telescopic motor drives the sleeve frame and the mounting tube and the stirring rod below it to move up and down through the connecting rod. The stirring rod plays a role in uniformly stirring the coating material during the coating process to ensure the coating quality. The air pump inside the sleeve frame is connected to the air tank. Inert gas is stored in the air tank. The inert gas is transported to the assembly tube through the connecting air pipe and then enters the storage tube through the plug-in tube. Hal powder is stored in the storage tube, so that the inert gas blows the Hal powder in the storage tube into the storage tank, so that the Hal powder is mixed with the coating liquid in the storage tank. The one-way valve in the storage tube ensures the one-way flow of gas to avoid backflow. The close fit between the rubber ring and the connecting tube further enhances the stability and sealing of the structure, so that the coating material can be evenly blown by the gas while being stirred, which is convenient for evenly mixing the Hal powder with the coating liquid, thereby improving the coating uniformity and efficiency.

[0024] (2) Through the setting of the conical discharge pipe, flow meter, controller, electric telescopic rod, sealing plate, fan, exhaust pipe and discharge pipe, when in use, the conical discharge pipe guides the material to flow to the control pipe, and the flow meter integrated in the mounting frame accurately measures the amount of coating material flowing through the control pipe, providing data support for precise coating, and the controller intelligently adjusts the electric telescopic rod according to the feedback of the flow meter. After the electric telescopic rod receives the signal through the wire, it drives the sealing plate to move flexibly in the control pipe, accurately controls the flow of materials, and realizes on-demand coating. At the same time, the fan in the connection box blows air into the control pipe through the exhaust pipe, effectively preventing material blockage and ensuring smooth discharge. Finally, the coating material is evenly coated on the target surface through the discharge pipe, which not only realizes the precise measurement and control of the coating material, but also ensures the smoothness and efficiency of the coating process, greatly improving the coating quality and the overall operating efficiency of the equipment.

[0025] (3) Through the arrangement of the driving rod, the positioning plate, the mounting hole, the sliding block, the extrusion spring, the baffle and the elastic pad, when in use, the driving motor drives the positioning plate to rotate through the driving rod, and the positioning plate is used to fix the semiconductor material to be coated to ensure its stability during the coating process. The sliding block on the positioning plate can slide in the mounting hole and tightly clamp semiconductor materials of different sizes through the elastic force of the extrusion spring, thereby improving the versatility and adaptability of the equipment. The baffle is connected to the positioning plate through the sliding block, and the elastic pad on its surface can prevent the coating material from overflowing during the coating process, thereby ensuring the neatness and accuracy of the coating, which not only improves the stability and accuracy of the coating equipment, but also enhances its ability to adapt to semiconductor materials of different sizes, thereby achieving efficient and accurate coating operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A perspective view of the present invention;

[0027] Figure 2 is a three-dimensional diagram of a storage tank of the present invention;

[0028] Figure 3 is a three-dimensional diagram of the stirring rod of the present invention;

[0029] Figure 4 is a three-dimensional diagram of the air pump of the present invention;

[0030] Figure 5 is a three-dimensional diagram of the flow meter of the present invention;

[0031] Figure 6 is a three-dimensional diagram of the fan of the present invention;

[0032] Figure 7 A three-dimensional diagram of the positioning plate of the present invention;

[0033] Figure 8 A three-dimensional diagram of a battery box of the present invention;

[0034] In the figure: 1. fixed platform; 2. mounting ring; 3. storage tank; 4. sealing cover; 5. protective box; 6. telescopic motor; 7. connecting rod; 8. sleeve frame; 9. mounting pipe; 10. stirring rod; 11. air pump; 12. connecting air pipe; 13. assembly pipe; 14. plug-in pipe; 15. storage pipe; 16. one-way valve; 17. rubber ring; 18. connecting pipe; 19. conical discharge pipe; 20. control pipe; 21. mounting frame ; 22. Flow meter; 23. Controller; 24. Electric telescopic rod; 25. Sealing plate; 26. Wire; 27. Connection box; 28. Fan; 29. ​​Exhaust duct; 30. Control tube; 31. Battery box; 32. Installation platform; 33. Control panel; 34. Drive motor; 35. Drive rod; 36. Positioning plate; 37. Installation hole; 38. Sliding block; 39. Extrusion spring; 40. Baffle; 41. Elastic pad. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Embodiment 1:

[0037] See also Figures 1 to 8 As shown, a semiconductor coating device and a coating method, comprising:

[0038] Fixed platform 1;

[0039] The top of the fixed platform 1 is fixedly connected with a mounting ring 2, the inner wall of the mounting ring 2 is threadedly connected with a storage tank 3, the top of the storage tank 3 is threadedly connected with a sealing cover 4, and both sides of the top of the sealing cover 4 are provided with air holes;

[0040] The top of the sealing cover 4 is fixedly connected with a protection box 5, the inner wall of the protection box 5 is fixedly connected with a telescopic motor 6, the output end of the telescopic motor 6 is installed with a connecting rod 7, the bottom end of the connecting rod 7 is fixedly connected with a sleeve frame 8, the bottom end of the sleeve frame 8 is threadedly connected with a mounting tube 9, and the bottom end of the mounting tube 9 is fixedly connected with a stirring rod 10;

[0041] An air pump 11 is fixedly connected to the inner wall of the sleeve frame 8, and an air tank is fixedly connected to the top of the air pump 11. A connecting air pipe 12 is installed at the output end of the air pump 11, and the surface of the connecting air pipe 12 is plugged into the inner wall of the mounting tube 9. A plurality of assembly tubes 13 are fixedly connected to the surface of the connecting air pipe 12, and a plug-in tube 14 is fixedly connected to the inner wall of the assembly tube 13. A storage tube 15 is sleeved on the surface of the plug-in tube 14. A one-way valve 16 is provided on the inner wall of the storage tube 15, and a rubber ring 17 is fixedly connected to the surface of the storage tube 15. A plurality of connecting tubes 18 are fixedly connected to the surface of the mounting tube 9, and the surface of the rubber ring 17 is plugged into the inner wall of the connecting tube 18.

[0042] When in use, the mounting ring 2 fixed on the fixed platform 1 is used to firmly mount the storage tank 3, and is convenient for disassembling and assembling the storage tank 3 and quickly cleaning the interior. The storage tank 3 is tightly matched with the sealing cover 4 through a threaded connection to ensure the sealed storage of the coating material. At the same time, the air vent design on the sealing cover 4 ensures the balance of the internal air pressure. The protective box 5 prevents the telescopic motor 6 from being disturbed by the outside world and provides a stable working environment. The telescopic motor 6 is powered on, and the telescopic motor 6 drives the sleeve frame 8 and the mounting tube 9 and the stirring rod 10 below it to move up and down through the connecting rod 7. The stirring rod 10 plays a role in evenly stirring the coating material during the coating process to ensure the coating quality. The air pump 11 is connected to the gas storage tank, and inert gas is stored in the gas storage tank. The inert gas is transported to the assembly pipe 13 through the connecting air pipe 12, and then enters the storage pipe 15 through the plug-in pipe 14. The storage pipe 15 stores Hal powder, so that the inert gas blows the Hal powder in the storage pipe 15 into the storage tank 3, so that the Hal powder is mixed with the coating liquid in the storage tank 3. The one-way valve 16 in the storage pipe 15 ensures the one-way flow of the gas to avoid backflow. The close fit between the rubber ring 17 and the connecting pipe 18 further enhances the stability and sealing of the structure, so that the coating material can be evenly blown by the gas while being stirred, which is convenient for evenly mixing the Hal powder with the coating liquid.

[0043] Embodiment 2:

[0044] See also Figures 1 to 8As shown, the bottom of the mounting ring 2 is fixedly connected with a conical discharge pipe 19, and the surface of the conical discharge pipe 19 is plugged into the inner wall of the fixed platform 1, the bottom end of the conical discharge pipe 19 is fixedly connected with a control pipe 20, the surface of the control pipe 20 is fixedly connected with a mounting frame 21, the inner wall of the mounting frame 21 is fixedly connected with a flow meter 22, and the surface of the flow meter 22 is plugged into the inner wall of the control pipe 20, one side of the flow meter 22 is fixedly connected with a controller 23, the inner wall of the mounting frame 21 is fixedly connected with an electric telescopic rod 24, and the electric telescopic rod 2 The output end of the control tube 20 is fixedly connected with a sealing plate 25, and the surface of the sealing plate 25 is plugged into the inner wall of the control tube 20, one end of the electric telescopic rod 24 is electrically connected with a wire 26, and the top of the wire 26 is electrically connected to one side of the controller 23, the surface of the control tube 20 is fixedly connected with a connection box 27, the inner wall of the connection box 27 is fixedly connected with a fan 28, the output end of the fan 28 is installed with an exhaust pipe 29, and the surface of the exhaust pipe 29 is plugged into the inner wall of the control tube 20, and the bottom end of the control tube 20 is fixedly connected with a discharge pipe 30.

[0045] When in use, a conical discharge pipe 19 is provided at the bottom of the mounting ring 2. The conical discharge pipe 19 guides the material flow to the control pipe 20. Its shape helps to reduce material residue and improve discharge efficiency. The flow meter 22 integrated in the mounting frame 21 accurately measures the amount of coating material flowing through the control pipe 20, providing data support for precise coating, and the controller 23 intelligently adjusts the electric telescopic rod 24 according to the feedback of the flow meter 22. After receiving the signal through the wire 26, the electric telescopic rod 24 drives the sealing plate 25 to move flexibly in the control pipe 20, accurately controls the flow of the material, and realizes on-demand coating. At the same time, the fan 28 in the connecting box 27 blows air into the control pipe 20 through the exhaust pipe 29, effectively preventing material blockage and ensuring smooth discharge. Finally, the coating material is evenly coated on the target surface through the discharge pipe 30, which not only realizes the precise measurement and control of the coating material, but also ensures the smoothness and efficiency of the coating process.

[0046] Embodiment three:

[0047] See also Figures 1 to 8As shown, the bottom of the fixed platform 1 is fixedly connected to a mounting platform 32, the inner wall of the mounting platform 32 is fixedly connected to a battery box 31, the inner wall of the battery box 31 is fixedly connected to a battery, the surface of the mounting platform 32 is fixedly connected to a control panel 33, the surface of the mounting platform 32 is fixedly connected to the control panel 33, the inner wall of the mounting platform 32 is fixedly connected to a driving motor 34, a driving rod 35 is installed at the output end of the driving motor 34, the top of the driving rod 35 is fixedly connected to a positioning plate 36, the top of the positioning plate 36 is provided with four mounting holes 37, the inner wall of the mounting hole 37 is slidably connected to a sliding block 38, both sides of the back of the sliding block 38 are connected to extrusion springs 39, and the surface of the extrusion spring 39 is inserted into the inner wall of the mounting hole 37, the top of the sliding block 38 is fixedly connected to a baffle 40, and the surface of the baffle 40 is fixedly connected to an elastic pad 41.

[0048] When in use, the battery built into the battery box 31 provides power support for the entire device to ensure stable operation of the device. The mounting platform 32 firmly supports the entire coating device. The control panel 33 serves as a human-computer interaction interface, allowing the operator to easily control various functions of the device. The drive motor 34 inside the mounting platform 32 is connected to the power supply, and the drive motor 34 drives the positioning plate 36 to rotate through the drive rod 35. The positioning plate 36 is used to fix the semiconductor material to be coated to ensure its stability during the coating process. The sliding block 38 on the positioning plate 36 can slide in the mounting hole 37 and tightly clamp semiconductor materials of different sizes through the elastic force of the extrusion spring 39, thereby improving the versatility and adaptability of the equipment. The baffle 40 is connected to the positioning plate 36 through the sliding block 38. The elastic pad 41 on its surface can prevent the coating material from overflowing during the coating process, thereby ensuring the neatness and accuracy of the coating, which not only improves the stability and accuracy of the coating equipment, but also enhances its ability to adapt to semiconductor materials of different sizes.

[0049] Embodiment 4:

[0050] See also Figures 1 to 8 As shown, a coating method of a semiconductor coating device comprises the following steps:

[0051] S1. The operator starts the equipment through the control panel 33, connects the battery in the battery box 31 to provide power support for the entire coating equipment, and then the drive motor 34 is powered on, and the positioning plate 36 is driven to rotate through the drive rod 35. The positioning plate 36 is used to fix the semiconductor material to be coated to ensure its stability during the coating process. The sliding block 38 on the positioning plate 36 slides flexibly in the mounting hole 37 and tightly and firmly clamps semiconductor materials of different sizes through the elastic force of the squeezing spring 39. At the same time, the baffle 40 and the elastic pad 41 enhance the stability of the coating process and the protection of the semiconductor material;

[0052] S2. After the semiconductor material is stably fixed, the telescopic motor 6 is turned on to drive the sleeve frame 8 and the mounting pipe 9 and the stirring rod 10 below it to move up and down through the connecting rod 7. The stirring rod 10 evenly stirs the coating liquid in the storage tank 3 during the movement. At the same time, the air pump 11 inside the sleeve frame 8 is turned on to transport the inert gas in the gas tank to the assembly pipe 13 through the connecting air pipe 12, and then enter the storage pipe 15 through the plug-in pipe 14. The Hala powder stored in the storage pipe 15 is evenly blown into the storage tank 3 under the blowing of the inert gas and mixed with the coating liquid;

[0053] S3, after the coating liquid and the halal powder are evenly mixed, the mixture is guided to flow to the control tube 20 through the conical discharge pipe 19, and the flow meter 22 integrated in the mounting frame 21 accurately measures the amount of coating material flowing through the control tube 20, and feeds back the data to the controller 23, and the controller 23 intelligently controls the electric telescopic rod 24 according to the feedback of the flow meter 22, so that the electric telescopic rod 24 receives the signal through the wire 26 and drives the sealing plate 25 to move flexibly in the control tube 20;

[0054] S4. The fan 28 in the connection box 27 blows air into the control tube 20 through the exhaust pipe 29, effectively preventing material blockage and ensuring smooth discharge. Finally, the coating material is evenly coated on the surface of the semiconductor device through the discharge pipe 30.

[0055] Embodiment five:

[0056] See also Figures 1 to 8 As shown, with the continuous development of semiconductor technology, the performance requirements of semiconductor devices are getting higher and higher, and the requirements for coating processes are becoming increasingly stringent. Traditional coating methods often have problems such as uneven coating, large material waste, and low production efficiency, which cannot meet the needs of modern semiconductor manufacturing. This coating equipment has a wide range of applications in the actual semiconductor manufacturing process. For example, on the production line of semiconductor chips, the coating equipment can be used to evenly coat a specific coating liquid on the surface of a semiconductor wafer, which is a key step in semiconductor manufacturing and is essential for improving the performance and stability of semiconductor devices.

[0057] The operator first starts the equipment through the control panel, and the batteries in the battery box provide power support for the entire coating equipment. Then, the semiconductor material to be coated is fixed on the positioning plate, and the sliding block on the positioning plate slides flexibly in the mounting hole and tightly and firmly clamps semiconductor materials of different sizes through the elastic force of the extrusion spring. At the same time, the setting of the baffle and elastic pad enhances the stability during the coating process and the protection of the semiconductor material.

[0058] Next, turn on the telescopic motor to drive the sleeve frame and the mounting tube and stirring rod below it to move up and down through the connecting rod. The stirring rod stirs the coating liquid in the storage tank during the movement to ensure the uniformity of the coating liquid. At this time, the air pump starts to work, blowing the Hala powder in the storage tube into the storage tank through wind, mixing with the coating liquid to form a coating liquid containing Hala powder.

[0059] Finally, the fan on the surface of the control tube blows air into the control tube through the exhaust pipe, effectively preventing material blockage and ensuring smooth discharge. The coating material is evenly coated on the surface of the semiconductor device through the discharge pipe, completing the coating process.

[0060] Working principle: First, the operator starts the equipment through the control panel 33, and the battery in the battery box 31 provides power support for the entire coating equipment. Then the drive motor 34 is connected to the power supply, and the drive rod 35 installed at its output end starts to rotate, thereby driving the positioning plate 36 to rotate. The positioning plate 36 is used to fix the semiconductor material to be coated to ensure stability during the coating process. The positioning plate 36 is provided with a mounting hole 37. The sliding block 38 can slide flexibly in the mounting hole 37, and through the elastic force of the extrusion spring 39, it can tightly and firmly clamp semiconductor materials of different sizes. At the same time, the setting of the baffle 40 and the elastic pad 41 further enhances the stability during the coating process and the protection of the semiconductor material.

[0061] After the semiconductor material is stably fixed, the telescopic motor 6 is turned on, and the output end of the telescopic motor 6 drives the sleeve frame 8 to move up and down through the connecting rod 7. The bottom end of the sleeve frame 8 is threadedly connected to the mounting tube 9, and the bottom end of the mounting tube 9 is fixedly connected to the stirring rod 10. Therefore, the movement of the sleeve frame 8 will drive the stirring rod 10 to stir up and down, and the stirring action of the stirring rod 10 helps to evenly mix the coating liquid in the storage tank 3.

[0062] In addition, Hal powder is stored in the storage tube 15. Under the action of the air pump 11, wind is blown into the assembly tube 13 through the connecting air pipe 12, and then the Hal powder in the storage tube 15 is blown into the storage tank 3 to be mixed with the coating liquid. The addition of Hal powder helps to improve the performance of the coating liquid and enhance the coating effect.

[0063] During the coating process, the fan 28 blows air into the control tube 20 through the exhaust pipe 29, effectively preventing material blockage and ensuring smooth discharge. Finally, the mixed coating material is evenly coated on the surface of the semiconductor device through the discharge pipe 30.

[0064] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor coating device, characterized in that: include: Fixed platform (1); The top of the fixed platform (1) is fixedly connected to a mounting ring (2), the inner wall of the mounting ring (2) is threadedly connected to a storage tank (3), the top of the storage tank (3) is threadedly connected to a sealing cover (4), and both sides of the top of the sealing cover (4) are provided with air holes; The top end of the sealing cover (4) is fixedly connected to a protection box (5), the inner wall of the protection box (5) is fixedly connected to a telescopic motor (6), the output end of the telescopic motor (6) is installed with a connecting rod (7), the bottom end of the connecting rod (7) is fixedly connected to a sleeve frame (8), the bottom end of the sleeve frame (8) is threadedly connected to a mounting tube (9), and the bottom end of the mounting tube (9) is fixedly connected to a stirring rod (10); An air pump (11) is fixedly connected to the inner wall of the sleeve frame (8), and an air storage tank is fixedly connected to the top of the air pump (11). A connecting air pipe (12) is installed at the output end of the air pump (11), and the surface of the connecting air pipe (12) is plugged into the inner wall of the mounting pipe (9). A plurality of assembly pipes (13) are fixedly connected to the surface of the connecting air pipe (12), and a plug-in pipe (14) is fixedly connected to the inner wall of the assembly pipe (13). A storage pipe (15) is sleeved on the surface of the plug-in pipe (14), and a one-way valve (16) is provided on the inner wall of the storage pipe (15). A rubber ring (17) is fixedly connected to the surface of the storage pipe (15), and a plurality of connecting pipes (18) are fixedly connected to the surface of the mounting pipe (9), and the surface of the rubber ring (17) is plugged into the inner wall of the connecting pipe (18).

2. A semiconductor coating device according to claim 1, characterized in that: The bottom of the mounting ring (2) is fixedly connected to a conical discharge pipe (19), and the surface of the conical discharge pipe (19) is plugged into the inner wall of the fixed platform (1); the bottom end of the conical discharge pipe (19) is fixedly connected to a control pipe (20), the surface of the control pipe (20) is fixedly connected to an installation frame (21), the inner wall of the installation frame (21) is fixedly connected to a flow meter (22), and the surface of the flow meter (22) is plugged into the inner wall of the control pipe (20); one side of the flow meter (22) is fixedly connected to a controller (23).

3. A semiconductor coating device according to claim 2, characterized in that: An electric telescopic rod (24) is fixedly connected to the inner wall of the mounting frame (21); a sealing plate (25) is fixedly connected to the output end of the electric telescopic rod (24); and a surface of the sealing plate (25) is plugged into the inner wall of the control tube (20); one end of the electric telescopic rod (24) is electrically connected to a wire (26); and a top end of the wire (26) is electrically connected to one side of the controller (23).

4. A semiconductor coating device according to claim 2, characterized in that: A connection box (27) is fixedly connected to the surface of the control tube (20), a fan (28) is fixedly connected to the inner wall of the connection box (27), an exhaust pipe (29) is installed at the output end of the fan (28), and the surface of the exhaust pipe (29) is plugged into the inner wall of the control tube (20), and a discharge pipe (30) is fixedly connected to the bottom end of the control tube (20).

5. A semiconductor coating device according to claim 1, characterized in that: The bottom of the fixed platform (1) is fixedly connected to a mounting platform (32), the inner wall of the mounting platform (32) is fixedly connected to a battery box (31), the inner wall of the battery box (31) is fixedly connected to a battery, and the surface of the mounting platform (32) is fixedly connected to a control panel (33).

6. A semiconductor coating device according to claim 5, characterized in that: A driving motor (34) is fixedly connected to the inner wall of the mounting platform (32), a driving rod (35) is installed at the output end of the driving motor (34), and a positioning plate (36) is fixedly connected to the top end of the driving rod (35).

7. A semiconductor coating device according to claim 6, characterized in that: The top of the positioning plate (36) is provided with four mounting holes (37), the inner walls of the mounting holes (37) are slidably connected to sliding blocks (38), both sides of the back of the sliding blocks (38) are connected to extrusion springs (39), and the surfaces of the extrusion springs (39) are plugged into the inner walls of the mounting holes (37), the top of the sliding blocks (38) is fixedly connected to a baffle (40), and the surface of the baffle (40) is fixedly connected to an elastic pad (41).

8. A coating method for a semiconductor coating device, applicable to a semiconductor coating device according to claims 1 to 7, characterized in that: The following steps are involved: S1. The operator starts the equipment through the control panel (33) and connects the battery in the battery box (31) to provide power support for the entire coating equipment. Subsequently, the driving motor (34) is connected to the power supply, and the positioning plate (36) is driven to start rotating through the driving rod (35). The positioning plate (36) is used to fix the semiconductor material to be coated to ensure its stability during the coating process. The sliding block (38) on the positioning plate (36) slides flexibly in the mounting hole (37) and tightly and firmly clamps semiconductor materials of different sizes through the elastic force of the extrusion spring (39). At the same time, the baffle (40) and the elastic pad (41) enhance the stability during the coating process and the protection of the semiconductor material; S2. After the semiconductor material is stably fixed, the telescopic motor (6) is turned on to drive the sleeve frame (8) and the mounting tube (9) and the stirring rod (10) below it to move up and down through the connecting rod (7). The stirring rod (10) evenly stirs the coating liquid in the storage tank (3) during the movement. At the same time, the air pump (11) inside the sleeve frame (8) is turned on to allow the inert gas in the gas storage tank to be transported to the assembly tube (13) through the connecting air pipe (12), and then enter the storage tube (15) through the plug-in tube (14). The Halberd powder stored in the storage tube (15) is evenly blown into the storage tank (3) under the blowing of the inert gas and mixed with the coating liquid; S3, after the coating liquid and the Halberd powder are evenly mixed, the mixture is guided to flow to the control tube (20) through the conical discharge pipe (19), and the flow meter (22) integrated inside the mounting frame (21) accurately measures the amount of coating material flowing through the control tube (20), and feeds back the data to the controller (23). The controller (23) intelligently controls the electric telescopic rod (24) according to the feedback of the flow meter (22), so that the electric telescopic rod (24) receives the signal through the wire (26) and drives the sealing plate (25) to move flexibly in the control tube (20); S4. The fan (28) in the connection box (27) blows air into the control tube (20) through the exhaust pipe (29), effectively preventing material blockage and ensuring smooth discharge. Finally, the coating material is evenly coated on the surface of the semiconductor device through the discharge pipe (30).

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