A demolding device and a wafer-level product demolding method

Abstract

This invention discloses a demolding device and a method for demolding wafer-level products, belonging to the field of wafer-level product processing technology. The device includes a first suction cup and a second suction cup, both having a hinged end and an opening / closing end, with their hinged ends hinged together. The first suction cup has a first vacuum hole layout area extending from the opening / closing end to the hinged end, and the second suction cup has a second vacuum hole layout area located near the opening / closing end. The method includes: S1, the first suction cup is placed horizontally; S2, the wafer glass is adsorbed onto the first suction cup; S3, the second suction cup adsorbs the printing template; S4, the second suction cup is rotated with its back to the first suction cup until the printing template detaches from the wafer glass. During demolding, the second object and the first object first separate from the end near the opening / closing end, and then gradually spread to the end near the hinged end. This method can reduce the risk of deformation or breakage of the first object and avoid local stress concentration.

Description

Technical Field

[0001] This invention relates to the field of wafer-level product processing technology, and in particular to a demolding device and a method for demolding wafer-level products. Background Technology

[0002] With the increasing market demand for small-sized products, wafer-level products have become the mainstream. The typical wafer-level product manufacturing process involves first creating a metal or glass mold, then using a metal stamp (template), applying a suitable amount of adhesive to the surface of the wafer glass, pressing the adhesive flat with the stamp, and then curing the adhesive to transfer the shape of the surface structure from the stamp to the adhesive. Finally, the stamp and adhesive are separated, forming the wafer-level product. One of the biggest problems known to the inventors in wafer-level product manufacturing is the difficulty in demolding the product. The thickness of the wafer glass is typically around 0.08~1mm. When separating the stamp and the wafer glass, the wafer glass is easily broken, leading to a sharp increase in product processing costs. Summary of the Invention

[0003] The purpose of this invention is to solve the above-mentioned technical problems and provide a demolding device and a wafer-level product demolding method. The first and second suction cups can rotate along their hinge ends, allowing their opening and closing ends to be opened and closed. Because the second vacuum hole area is close to the opening and closing end of the second suction cup, it adsorbs the end of the second object closest to the opening and closing end of the second suction cup. When the first and second suction cups open, the second and first objects first separate from the end closest to the opening and closing end, and then gradually spread to the end closest to the hinge end. This reduces the risk of deformation or breakage of the first object due to the large adhesive adhesion area and strong adhesion force caused by direct overall peeling. Simultaneously, because the first vacuum hole area extends from the opening and closing end of the first suction cup to the hinge end, the first object is effectively adsorbed along the direction from the opening and closing end to the hinge end, which aligns with the separation direction, ensuring that the first object is adsorbed as a whole in this direction, avoiding the problem of localized stress concentration and breakage.

[0004] To achieve the above objectives, the present invention provides the following solution: The present invention discloses a demolding device for separating a first object and a second object bonded by adhesive, comprising a first suction cup and a second suction cup with their adsorption surfaces facing each other. The first suction cup and the second suction cup each have a hinged end and an opening end located on opposite sides. The hinged ends of the first suction cup and the second suction cup are hinged to each other. The adsorption surface of the first suction cup is provided with a first vacuum hole layout area for adsorbing the first object. The first vacuum hole layout area extends from the opening end of the first suction cup to the hinged end. The adsorption surface of the second suction cup is provided with a second vacuum hole layout area for adsorbing the second object. The second vacuum hole layout area is close to the opening end of the second suction cup.

[0005] Preferably, it further includes a base for horizontal placement, the base having a hollow area that can accommodate the first suction cup and the second suction cup, the hollow area having a support base plate for supporting the back side of the first suction cup, the first suction cup being mounted on the support base plate, and the base having a hinge seat for the second suction cup to hinge onto.

[0006] Preferably, the first suction cup is provided with a first vacuum chamber, and the back side of the first suction cup is provided with a first suction hole for connection with a suction device. The first vacuum hole layout area is provided with a plurality of annular grooves arranged sequentially from the inside to the outside. The center of the annular grooves coincides with the center of the first vacuum hole layout area. The plurality of annular grooves are connected to each other through cross grooves. The cross grooves are provided with a first vacuum hole. Both the first suction hole and the first vacuum hole are connected to the first vacuum chamber.

[0007] Preferably, the second suction cup is provided with a second vacuum chamber, and the side wall of the second suction cup is provided with a second suction hole for connecting with a suction device. The second vacuum hole is provided in the second vacuum hole layout area, and the second suction hole and the second vacuum hole are both connected to the second vacuum chamber.

[0008] Preferably, the second suction cup is provided with an observation port that allows the first suction cup to be viewed.

[0009] Preferably, the second suction cup has a hinge shaft on its side wall, and the hinge seat has a hinge groove for hinge shaft to be hinged.

[0010] Preferably, the system further includes a drive mechanism for driving the second suction cup to rotate. The base is provided with a mounting groove. The drive mechanism includes a hinge block, a drive motor, and two lead screw nuts. The screw of the lead screw nut is rotatably connected in the mounting groove. The screw is driven by the drive motor. The nut of the lead screw nut is provided with hinged double ears. Connecting rods are hinged to the hinged double ears. The connecting rods on the two lead screw nuts are respectively hinged to both ends of the hinge block. A connecting block for hinged to the hinge block is fixed on the opening and closing end of the second suction cup. The axis of the screw is parallel to the hinge axis of the hinge end of the first suction cup. The hinge axis of the connecting block is parallel to the axis of the screw. The hinge axis of the connecting rod is perpendicular to the axis of the screw and the hinge axis of the opening and closing end of the second suction cup.

[0011] Preferably, it further includes a suction device and a control device, wherein the control device is electrically connected to the suction device and the drive motor.

[0012] Preferably, the control device includes a computer host, a display, and a motor controller, wherein the computer host is electrically connected to the display and the motor controller respectively.

[0013] A wafer product processing demolding method is also disclosed, which uses the above-mentioned demolding device and includes the following steps:

[0014] S1. The first suction cup is placed horizontally, and the second suction cup is located above the first suction cup;

[0015] S2. Place and adsorb the wafer glass and the printing template, which are bonded together by adhesive, onto the first vacuum hole layout area of ​​the first suction cup. When placing, the wafer glass faces the first vacuum hole layout area. A release agent is applied between the printing template and the adhesive in advance, and an adhesion promoter is applied between the wafer glass and the adhesive in advance.

[0016] S3. Rotate the second suction cup toward the first suction cup so that the second vacuum hole layout area adsorbs the printing template;

[0017] S4. Rotate the second suction cup away from the first suction cup until the printing template is detached from the wafer glass.

[0018] The present invention achieves the following technical effects compared to the prior art:

[0019] The demolding device of this invention mainly includes a first suction cup and a second suction cup hinged together, allowing the first and second suction cups to rotate along the hinge end, enabling their opening and closing. The first object to be separated is adsorbed onto the first vacuum hole area, and the second object is adsorbed onto the second vacuum hole area. Because the second vacuum hole area is close to the opening and closing end of the second suction cup, the adsorbed end is the end of the second object closest to the opening and closing end of the second suction cup. When the first and second suction cups open, the second and first objects first separate from the end closest to the opening and closing end, and then gradually spread to the end closest to the hinge end. This reduces the risk of deformation or breakage of the first object due to the large adhesive adhesion area and strong adhesion force caused by direct overall peeling. Simultaneously, because the first vacuum hole area extends from the opening and closing end of the first suction cup to the hinge end, the first object is effectively adsorbed along the direction from the opening and closing end to the hinge end, aligning with the separation direction and ensuring that the first object is adsorbed as a whole in this direction, avoiding the problem of localized stress concentration and breakage. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1This is a three-dimensional structural diagram of the two suction cups closing in the demolding device in the embodiment;

[0022] Figure 2 This is a three-dimensional structural diagram of the two suction cups opening in the demolding device in the embodiment;

[0023] Figure 3 This is a three-dimensional structural diagram of the drive mechanism in the demolding device in the embodiment;

[0024] Figure 4 This is a top view of the demolding device in the embodiment;

[0025] Figure 5 This is a bottom view of the demolding device in the embodiment;

[0026] Figure 6 This is a top view of the structure of the first suction cup in the embodiment;

[0027] Figure 7 This is a side view of the first suction cup in the embodiment.

[0028] Figure 8 This is a bottom view of the structure of the first suction cup in the embodiment;

[0029] Figure 9 This is a top view of the second suction cup in the embodiment;

[0030] Figure 10 for Figure 9 A magnified view of a portion of the image;

[0031] Figure 11 This is a cross-sectional view of the second suction cup in the embodiment;

[0032] Figure 12 This is a bottom view of the structure of the second suction cup in the embodiment;

[0033] Figure 13 This is a schematic diagram of the drive mechanism when the two suction cups are closed in the embodiment;

[0034] Figure 14 This is a schematic diagram of the drive mechanism when the two suction cups open in the embodiment;

[0035] Figure 15 This is a side view of the demolding device when the two suction cups are closed, as shown in the embodiment.

[0036] Figure 16 This is a side view of the demolding device when the two suction cups open, as shown in the embodiment.

[0037] Figure 17 This is a schematic diagram showing the hinge position relationship between the hinge seat and the hinge shaft when the two suction cups are closed in the embodiment.

[0038] Figure 18 This is a three-dimensional structural diagram of the base in the embodiment;

[0039] Figure 19 This is a top view of the base structure in the embodiment;

[0040] Figure 20 This is a bottom view of the base structure in the embodiment;

[0041] Figure 21 This is a side view of the hinged seat in the embodiment.

[0042] Figure 22 This is a three-dimensional structural diagram of the supporting base plate in the embodiment;

[0043] Figure 23 This is a cross-sectional view of the supporting base plate in the embodiment;

[0044] Figure 24 This is a schematic diagram of the overall structure of the demolding device in the embodiment;

[0045] Figure 25 This is a schematic diagram of the structure of the wafer glass and the printing template before demolding in the embodiment;

[0046] Figure 26 This is a schematic diagram of the structure of the wafer glass and the printing template after demolding in the embodiment.

[0047] Explanation of reference numerals in the attached figures:

[0048] 1. Base; 2. First suction cup; 3. Second suction cup; 4. Drive mechanism; 5. Wafer glass; 6. Copy template; 7. Glue; 8. Computer host; 9. Suction device; 10. Motor controller;

[0049] 101. Hollowed-out area; 102. Support base plate; 103. Hinge seat; 104. Hinge groove; 105. Mounting groove; 106. First screw hole; 107. Second screw hole; 108. Third screw hole; 109. Fourth screw hole; 110. Fifth screw hole; 111. Sixth screw hole; 112. Motor mounting hole; 1041. Semi-circular groove; 1042. End wall; 1043. Inner bend section;

[0050] 201. Annular groove; 202. Cross groove; 203. First vacuum hole; 204. First suction hole; 205. Seventh screw hole;

[0051] 301. Second suction port; 302. Second vacuum port; 303. Observation port; 304. Hinge shaft;

[0052] 401. Hinge block; 402. Screw; 403. Nut; 404. Hinge lugs; 405. Connecting rod; 406. Connecting block; 407. Drive motor. Detailed Implementation

[0053] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0054] This embodiment provides a demolding device for separating a first object (such as a wafer glass 5) and a second object (stamp, i.e., a printing template 6) bonded together by adhesive. Figures 1 to 26 As shown, the device includes a first suction cup 2 and a second suction cup 3. The first suction cup 2 has a hinged end and an opening / closing end located on opposite sides, and the second suction cup 3 also has a hinged end and an opening / closing end located on opposite sides. The hinged ends of the first suction cup 2 and the second suction cup 3 are hinged together. After hinged connection, the adsorption surfaces of the first suction cup 2 and the second suction cup 3 will face each other, so that when the first suction cup 2 and the second suction cup 3 rotate relative to each other, their adsorption surfaces will move closer or further apart. A first vacuum hole arrangement area is provided on the adsorption surface of the first suction cup 2. The first vacuum hole arrangement area is used to adsorb a first object onto the adsorption surface of the first suction cup 2, and the first vacuum hole arrangement area extends from the opening / closing end of the first suction cup 2 towards the hinged end. The second suction cup 3 has a second vacuum hole area on its adsorption surface. This second vacuum hole area is used to adsorb a second object. The second vacuum hole area is located near the opening / closing end of the second suction cup 3. When the first suction cup 2 and the second suction cup 3 are closed, the second suction cup 3 adsorbs the second object onto the end of the second suction cup 3 closest to its opening / closing end. This allows the first object and the second object to separate first from the end closest to the opening / closing end of the second suction cup 3 when the first suction cup 2 and the second suction cup 3 are opened, and then gradually separate towards the hinge end of the second suction cup 3. Preferably, the second vacuum hole area extends in a direction perpendicular to the opening / closing end of the second suction cup 3 towards the hinge end.

[0055] Work process:

[0056] First, rotate the first suction cup 2 and the second suction cup 3 in a direction away from each other, causing them to open. Then, attach the first object (consisting of the first item, glue 7, and the second item) to the first vacuum hole area of ​​the first suction cup 2. Next, rotate the first suction cup 2 and the second suction cup 3 in a direction closer to each other until the second vacuum hole area of ​​the second suction cup 3 attaches the second item to the end near the open / closed end of the second suction cup 3. Finally, rotate the first suction cup 2 and the second suction cup 3 in a direction away from each other. The first and second objects are first separated at the end near the opening end of the second suction cup 3, and then gradually separated along the direction towards the hinge end of the second suction cup 3. This avoids excessive adhesive force between the first and second objects, which could cause the first object to break or deform. At the same time, since the first vacuum hole layout area extends from the opening end of the first suction cup 2 to the hinge end, the first object is adsorbed along the length direction from the opening end of the first suction cup 2 to the hinge end, so that the first object is completely attached to the first suction cup 2 in this direction, avoiding stress concentration and cracking of the first object.

[0057] In one implementation, such as Figures 1 to 26 As shown, the system also includes a base 1 for horizontal placement. The base 1 has a hollow area 101 that can accommodate the first suction cup 2 and the second suction cup 3. A supporting base plate 102 is provided at the hollow area 101 to support the back side (i.e., the side facing away from the suction surface) of the first suction cup 2. The supporting base plate 102 is mounted on the first suction cup 2 and is located within the hollow area 101. A hinge seat 103 is provided on the base 1 for hinged connection to the second suction cup 3. By placing the base 1 horizontally on an operating table or the ground, the first suction cup 2 can be placed horizontally. Preferably, the hinge seat 103 can be located within the hollow area 101.

[0058] In one implementation, such as Figures 1 to 26As shown, a first suction cup 2 has a first vacuum chamber inside, and a first suction hole 204 is provided on the back side of the first suction cup 2. The first suction hole 204 is used to connect to a suction device. The first vacuum hole layout area has multiple annular grooves 201 arranged sequentially from the inside out. The multiple annular grooves 201 are spaced apart, either evenly or with variable spacing. The center of each annular groove 201 coincides with the center of the first vacuum hole layout area. The multiple annular grooves 201 are connected by a cross groove 202. A first vacuum hole 203 is provided in the cross groove 202, which is composed of two strip grooves, at least one of which contains a first vacuum hole 203. Both the first suction hole 204 and the first vacuum hole 203 are connected to the first vacuum chamber. After connecting the first suction hole 204 to the suction device, place the first object on the first vacuum hole layout area, that is, cover the annular groove 201 and the cross groove 202. Turn on the suction device, and the first suction hole 204 will suction the first vacuum chamber. Then the first vacuum hole 203 will suction the annular groove 201 and the cross groove 202, so that a negative pressure is generated between the annular groove 201 and the cross groove 202 and the first object, thereby adsorbing the first object on the first vacuum hole layout area. The arrangement of multiple annular grooves 201 and cross grooves 202 can ensure that the first object and the first suction cup 2 are adsorbed as a whole, so that when the first object and the second object are separated, the problem of deformation or breakage due to local stress concentration of the first object is reduced. Preferably, one of the strip grooves of the cross groove 202 extends parallel to the opening and closing end of the first suction cup 2 towards the hinge end, and the other strip groove extends perpendicular to the opening and closing end of the first suction cup 2 towards the hinge end. At least the strip groove that extends parallel to the opening and closing end of the first suction cup 2 towards the hinge end is provided with a first vacuum hole 203, and the first vacuum hole 203 is arranged at a uniform interval along the strip groove.

[0059] In one implementation, such as Figures 1 to 26 As shown, the second suction cup 3 has a second vacuum chamber, and a second suction hole 301 is provided on the side wall of the second suction cup 3 for connecting to a suction device. A second vacuum hole 302 is provided in the second vacuum hole 302 layout area, and both the second suction hole 301 and the second vacuum hole 302 communicate with the second vacuum chamber. Preferably, the second vacuum holes 302 are arranged at intervals along a direction perpendicular to the opening end of the second suction cup 3 towards the hinge end. The second vacuum holes 302 can be circular holes, strip holes, or other shapes. Preferably, the second vacuum holes 302 are strip holes, and the length direction of the strip hole is perpendicular to the direction extending from the opening end of the second suction cup 3 towards the hinge end.

[0060] In one implementation, such as Figures 1 to 26 As shown, the second suction cup 3 is provided with an observation port 303, through which the first suction cup 2 can be exposed, so that after the first object is attached to the first suction cup 2, it can be observed whether the position of the second object is appropriate.

[0061] In one implementation, such as Figures 1 to 26 As shown, a hinge shaft 304 is provided on the side wall of the second suction cup 3, and a hinge groove 104 is provided on the hinge seat 103 for the hinge shaft 304 to be hinged.

[0062] Furthermore, in one embodiment, such as Figures 1 to 26 As shown, the hinge groove 104 can be a sloping groove, with a recessed semi-circular groove 1041 at the bottom of the slope. The semi-circular groove 1041 is used for hinge shaft 304 to hinge. The bottom of the hinge groove 104 has a certain depth to provide a certain amount of movement space for the hinge shaft 304, that is, the hinge shaft 304 can disengage from the semi-circular groove and move along the end wall 1042 of the bottom of the hinge groove 104 towards the opening of the hinge groove 104. The purpose of this arrangement is that when the thickness of the first object and the second object is relatively large, during the closing process of the first suction cup 2 and the second suction cup 3, affected by the thickness of the first object and the second object, the hinge shaft 304 of the second suction cup 3 will move away from the second suction cup 3, and then disengage from the semi-circular groove, moving along the end wall 1042 towards the opening of the hinge groove 104, so that there is a certain gap between the second suction cup 3 and the first suction cup 2, which adapts to the thickness of the first object and the second object. Figure 17 As shown. Preferably, the end wall 1042 at the bottom of the slope of the hinge groove 104 has an inwardly curved section 1043 near the groove opening, which serves as a limit to prevent the hinge shaft 304 from easily disengaging from the hinge groove 104.

[0063] In one implementation, such as Figures 1 to 26As shown, it also includes a drive mechanism 4. The drive mechanism 4 is used to drive the second suction cup 3 to rotate. The base 1 is provided with a mounting groove 105. The drive mechanism 4 includes a hinge block 401, a drive motor 407, and two lead screw nuts. The screw 402 of the lead screw nut is rotatably connected in the mounting groove 105. The screw 402 is driven by the drive motor 407. The nut of the lead screw nut is provided with hinged double ears 404. A connecting rod 405 is hinged to the hinged double ears 404. The connecting rod 405 is located between the two double ears of the hinged double ears 404. The connecting rod 405 on the two lead screw nuts is respectively hinged to both ends of the hinge block 401. A connecting block 406 is fixed on the opening and closing end of the second suction cup 3. The connecting block 406 is hinged to the hinge block 401. The axis of the screw 402 is parallel to the hinge axis of the hinge end of the first suction cup 2, the hinge axis of the connecting block 406 is parallel to the axis of the screw 402, and the hinge axis of the connecting rod 405 is perpendicular to the axis of the screw 402 and the hinge axis of the opening and closing end of the second suction cup 3. Preferably, there can be two mounting slots 105 for mounting two screws 402 respectively. The base 1 part between the two mounting slots 105 can be used to support the hinge block 401 and limit its movement. When the hinge block 401 contacts the base 1, the first suction cup 2 and the second suction cup 3 are perfectly aligned. Of course, the drive mechanism 4 is mainly set to achieve automatic demolding. If the drive mechanism 4 is not set, the second suction cup 3 can be manually rotated to achieve manual demolding. It should be noted that during use, the base 1 needs to be kept stable. The base 1 can be pressed onto the operating platform manually, or it can be fixed to the operating platform by other components. Then, only the second suction cup 3 is rotated, while the first suction cup 2 and the base 1 remain stationary.

[0064] Work process:

[0065] When the drive motor 407 is started, the screw 402 rotates, causing the nut 403 to move along the axis of the screw 402. When the nuts 403 of the two screws 402 move towards each other, the connecting rod 405 raises the hinge block 401, which in turn raises the connecting block 406, thereby raising the opening and closing end of the second suction cup 3, opening the second suction cup 3 and the first suction cup 2. When the nuts 403 of the two screws 402 move away from each other, the connecting rod 405 pulls down the hinge block 401, which in turn pulls down the connecting block 406, thereby pulling down the opening and closing end of the second suction cup 3, closing the second suction cup 3 and the first suction cup 2.

[0066] In one implementation, such as Figures 1 to 26As shown, it also includes a suction device and a control device, with the control device electrically connected to the suction device and the drive motor 407. The suction device is used to connect to the first suction hole 204 and the second suction hole 301. The suction device can simultaneously suction the first suction hole 204 and the second suction hole 301, or it can suction the first suction hole 204 and the second suction hole 301 independently. The control device can start the suction device and the drive motor 407.

[0067] Furthermore, in one embodiment, such as Figures 1 to 26 As shown, the suction device can use two vacuum pumps, which are respectively connected to the first suction port 204 and the second suction port 301.

[0068] Furthermore, in one embodiment, such as Figures 1 to 26 As shown, the control equipment includes a computer host, a monitor, and a motor controller. The computer host is electrically connected to both the monitor and the motor controller, and the motor controller is electrically connected to the drive motor 407. Parameters such as suction force and motor speed are input to the suction equipment and motor controller via the computer host and monitor. The motor controller then controls the speed of the drive motor 407. Automatic demolding can be achieved.

[0069] In one implementation, such as Figures 1 to 26 As shown, the opening angle between the first suction cup 2 and the second suction cup 3 can be preset to 0~90 degrees, and can be increased or decreased as needed.

[0070] In one implementation, such as Figures 1 to 26 As shown, the base 1 and the hinge seat 103 are fixed with screws. The base 1 and the support base plate 102 are fixed with screws. The support base plate 102 and the first suction cup 2 are fixed with screws. For example, the side wall of the hollow area 101 of the base 1 is provided with a first screw hole 106, and the hinge seat 103 is provided with a third screw hole 108. Screws are screwed into the first screw hole 106 and the third screw hole 108 to connect the base 1 and the hinge seat 103. The back side of the base 1 is provided with a second screw hole 107, the support base plate 102 is provided with a fourth screw hole 109 and a fifth screw hole 110, and the back side of the first suction cup 2 is provided with a seventh screw hole 205. The second screw hole 107 and the fourth screw hole 109 cooperate to connect the base 1 and the support base plate 102 with screws, and the fifth screw hole 110 and the seventh screw hole 205 cooperate to connect the support base plate 102 and the first suction cup 2 with screws. The mounting groove 105 of the base 1 is provided with a sixth screw hole 111 and a motor mounting hole 112. The sixth screw hole 111 is for screw connection of the drive motor 407, and the motor mounting hole 112 is for the output shaft of the drive motor 407 to extend into and connect with the screw 407. Example

[0071] This embodiment provides a method for demolding wafer products during processing, such as... Figures 1 to 26 As shown, the demolding device described in Example 1 is used, including the following steps:

[0072] S1. The first suction cup 2 is placed horizontally, and the second suction cup 3 is located above the first suction cup 2;

[0073] S2. Place the wafer glass 5 and the printing template 6, which are bonded together by the glue 7, on the first vacuum hole layout area of ​​the first suction cup 2. When placing, the wafer glass 5 faces the first vacuum hole layout area. A release agent is applied between the printing template 6 and the glue 7 in advance, and an adhesion promoter is applied between the wafer glass 5 and the glue 7 in advance.

[0074] S3. Rotate the second suction cup 3 toward the first suction cup 2 so that the second vacuum hole layout area is adsorbed onto the printing template 6.

[0075] S4. Rotate the second suction cup 3 away from the first suction cup 2 until the printing template 6 is detached from the wafer glass 5.

[0076] When the first suction cup 2 and the second suction cup 3 are rotated relative to each other in a direction that is relatively far apart, the opening and closing ends of the two open first. Therefore, the wafer glass 5 and the printing template 6 will first open a gap at the end near the opening and closing top. Then the wafer glass 5 and the printing template 6 will gradually separate. Compared with directly pulling the printing template 6 out of the wafer glass 5, this method can avoid the glue 7 between the wafer glass 5 and the printing template 6 being too strong, which would cause the wafer glass 5 to break. At the same time, since the first vacuum hole layout area extends from the opening and closing end of the first suction cup 2 to the hinge end, the wafer glass 5 is adsorbed along the length direction from the opening and closing end of the first suction cup 2 to the hinge end. This makes the wafer glass 5 adhere to the first suction cup 2 in this direction as a whole, avoiding the problem of local stress concentration on the wafer glass 5 and cracking.

[0077] In one implementation, such Figures 1 to 26As shown, when the first suction cup 2 and the second suction cup 3 in the demolding device are closed, the initial included angle between the first suction cup 2 and the second suction cup 3 is A0 = 0°, and the output shaft of the drive motor 407 has an initial angle B0. In order to have a certain force in the initial transmission, the initial angle B0 is required to be greater than 0°, preferably B0 = 10°. The length of the screw 402 is L1, that is, the maximum effective stroke of the nut 403 is L1, the length of the connecting rod 405 is L2, and the distance from the center of the second suction cup 3 to the hinge block 401 is N1. In the initial state, L1 = L2 * SIN(B0). As the drive motor 407 rotates, the stroke of the nut 403 gradually decreases. Since the length L2 of the transmission workpiece remains unchanged, B0 increases to B1. The range of B1 is 10°~60°, and A0 changes from 0° to A1>0°. The preferred angle range of A1 is 0~30°, which creates a certain stress between the stamp (replica template 6) and the wafer glass 5. As L1 continues to increase, when the angle of A1 reaches a certain level, the stamp (replica template 6) and the wafer glass 5 completely separate. For different types of products, the distance L2 that the nut 403 moves and the change of the angle A1 between the first suction cup 2 and the second suction cup 3 can be obtained by the formula A1=arctan((L1²-L2²)^0.5 / N1), thus solving the problem of wafer-level product demolding.

[0078] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A demolding device for separating a first object and a second object bonded together by adhesive, characterized in that, The device includes a first suction cup and a second suction cup with their adsorption surfaces facing each other. Both the first suction cup and the second suction cup have a hinge end and an opening end located on opposite sides. The hinge end of the first suction cup and the hinge end of the second suction cup are hinged to each other. The adsorption surface of the first suction cup is provided with a first vacuum hole layout area for adsorbing a first object. The first vacuum hole layout area extends from the opening end of the first suction cup to the hinge end. The adsorption surface of the second suction cup is provided with a second vacuum hole layout area for adsorbing a second object. The second vacuum hole layout area is close to the opening end of the second suction cup. It also includes a base for horizontal placement, the base having a hollow area that can accommodate the first suction cup and the second suction cup, the hollow area having a support base plate for supporting the back side of the first suction cup, the first suction cup being mounted on the support base plate, and the base having a hinge seat for the second suction cup to hinge onto. The first suction cup is provided with a first vacuum chamber. The back side of the first suction cup is provided with a first suction hole for connecting to a suction device. The first vacuum hole layout area is provided with a plurality of annular grooves arranged sequentially from the inside to the outside. The center of the annular grooves coincides with the center of the first vacuum hole layout area. The plurality of annular grooves are connected to each other through a cross groove. The cross groove is provided with a first vacuum hole. Both the first suction hole and the first vacuum hole are connected to the first vacuum chamber. The second suction cup is provided with a second vacuum chamber, and the side wall of the second suction cup is provided with a second suction hole for connecting with a suction device. The second vacuum hole is provided in the second vacuum hole layout area, and the second suction hole and the second vacuum hole are both connected to the second vacuum chamber.

2. The demolding device according to claim 1, characterized in that, The second suction cup is provided with an observation port that exposes the first suction cup.

3. The demolding device according to claim 1, characterized in that, The second suction cup has a hinge shaft on its side wall, and the hinge seat has a hinge groove for the hinge shaft to be hinged.

4. The demolding device according to claim 1, characterized in that, It also includes a drive mechanism for driving the second suction cup to rotate. The base is provided with a mounting groove. The drive mechanism includes a hinge block, a drive motor, and two lead screw nuts. The screw of the lead screw nut is rotatably connected in the mounting groove. The screw is driven by the drive motor. The nut of the lead screw nut is provided with hinged double ears. Connecting rods are hinged to the hinged double ears. The connecting rods on the two lead screw nuts are respectively hinged to both ends of the hinge block. A connecting block for hinged to the hinge block is fixed on the opening and closing end of the second suction cup. The axis of the screw is parallel to the hinge axis of the hinge end of the first suction cup. The hinge axis of the connecting block is parallel to the axis of the screw. The hinge axis of the connecting rod is perpendicular to the axis of the screw and the hinge axis of the opening and closing end of the second suction cup.

5. The demolding device according to claim 4, characterized in that, It also includes a suction device and a control device, wherein the control device is electrically connected to the suction device and the drive motor.

6. The demolding device according to claim 5, characterized in that, The control device includes a computer host, a monitor, and a motor controller, with the computer host electrically connected to the monitor and the motor controller respectively.

7. A method for demolding wafer products, characterized in that, The demolding device as described in any one of claims 1 to 6 includes the following steps: S1. The first suction cup is placed horizontally, and the second suction cup is located above the first suction cup; S2. Place and adsorb the wafer glass and the printing template, which are bonded together by adhesive, onto the first vacuum hole layout area of ​​the first suction cup. When placing, the wafer glass faces the first vacuum hole layout area. A release agent is applied between the printing template and the adhesive in advance, and an adhesion promoter is applied between the wafer glass and the adhesive in advance. S3. Rotate the second suction cup toward the first suction cup so that the second vacuum hole layout area adsorbs the printing template; S4. Rotate the second suction cup away from the first suction cup until the printing template is detached from the wafer glass.

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