Chip pick-and-place mechanism and its control method, device, and medium

Abstract

This invention proposes a chip pick-and-place mechanism and its control method, device, and medium. The mechanism includes: a support frame with a top plate on its upper side; a rotary motor and a turntable, the rotary motor being fixed to the top plate and the turntable connected to the rotary motor; multiple equally spaced chip pick-up heads with trigger devices on their outer edges; a loading assembly, a fourth lifting mechanism, an electrical performance testing assembly, a fifth lifting mechanism, and a unloading assembly arranged sequentially; the loading assembly includes a first lifting mechanism and a first CCD device, and the unloading assembly includes a second lifting mechanism; the electrical performance testing assembly includes a detector card and a third lifting mechanism for driving the detector card; and a controller communicatively connected to the rotary motor, trigger device, loading assembly, unloading assembly, electrical performance testing assembly, fourth lifting mechanism, and fifth lifting mechanism. According to the technical solution of this invention, the chip pick-and-place mechanism can complete the chip picking, transfer, and testing steps.

Description

Technical Field

[0001] This invention relates to the field of chip transfer technology, and in particular to a chip pick-and-place mechanism and its control method, device, and medium. Background Technology

[0002] The chip manufacturing process involves chip material handling and transportation, as well as chip testing.

[0003] In existing technology, the chip is located below the first chip pick-and-place mechanism, which loads the chip and transfers it to the testing equipment for unloading. After the testing equipment completes the chip testing, a second chip pick-and-place mechanism loads the tested chip and transfers it to a designated location for unloading. However, this method requires multiple devices to complete the chip picking, transfer, and testing steps, resulting in long chip transfer times between devices, low efficiency, increased equipment costs for chip production, and a large equipment footprint. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a chip pick-and-place mechanism and its control method, device, and medium, which can complete the chip picking, transfer, and inspection steps through a single chip pick-and-place mechanism, thereby reducing the chip transfer time between devices, improving chip production efficiency, reducing the equipment cost required for chip production, and saving installation space.

[0005] In a first aspect, embodiments of the present invention provide a chip pick-and-place mechanism, comprising:

[0006] A support frame, wherein a top plate is provided on the upper side of the support frame;

[0007] A rotary motor and a turntable are provided. The rotary motor is fixed to the top plate, and the turntable is connected to the rotary motor. The rotary motor is used to drive the turntable to rotate. Multiple chip picking heads with equal spacing are provided on the outer edge of the turntable. A triggering device is provided above the chip picking head and is electrically connected to the chip picking head.

[0008] The feeding assembly and the unloading assembly are fixed to the support frame and located above the chip pick-up head. The feeding assembly includes a first lifting mechanism and a first CCD device. The shooting direction of the first CCD device is aligned with the lower part of the first lifting mechanism. The unloading assembly includes a second lifting mechanism. The first lifting mechanism and the second lifting mechanism can descend and abut against the trigger device.

[0009] An electrical performance testing component is fixed to the top plate and located between the feeding component and the unloading component. The electrical performance testing component includes a third lifting mechanism and a detection card. The detection card is located at the lower end of the third lifting mechanism and moves vertically under the drive of the third lifting mechanism.

[0010] The fourth lifting mechanism and the fifth lifting mechanism are both fixed to the top plate. The fourth lifting mechanism is located between the feeding component and the electrical performance testing component, and the fifth lifting mechanism is located between the electrical performance testing component and the unloading component.

[0011] The controller is communicatively connected to the rotary motor, the triggering device, the feeding assembly, the unloading assembly, the electrical performance testing assembly, the fourth lifting mechanism, and the fifth lifting mechanism.

[0012] According to some embodiments of the present invention, the device further includes a plurality of solenoid valves and a plurality of flow meters. The plurality of chip pick-up heads are all connected to a vacuum pump. Each of the triggering devices is electrically connected to one of the solenoid valves and one of the flow meters. The solenoid valve is located between one of the chip pick-up heads and the vacuum pump. The flow meter is located inside the chip pick-up head and is used to detect the gas flow rate of the chip pick-up head. The plurality of flow meters are all communicatively connected to the controller.

[0013] According to some embodiments of the present invention, the unloading assembly includes a second CCD device, the imaging direction of which is aligned with the lower part of the second lifting mechanism.

[0014] In a second aspect, embodiments of the present invention provide a control method for a chip pick-and-place mechanism, applied to the chip pick-and-place mechanism described in the first aspect, wherein the plurality of chip pick-up heads include at least a first chip pick-up head, and the method includes:

[0015] The controller sends a rotation signal to the rotary motor, which drives the turntable to rotate so that the first chip pick-up head rotates to a position below the feeding assembly, and the first chip is placed below the first chip pick-up head.

[0016] The controller controls the feeding component to perform CCD detection on the first chip to obtain a first CCD detection result, and sends the first CCD detection result to the controller. After the controller controls the first chip pick-up head to pick up the first chip, it sends the rotation signal to the rotary motor again.

[0017] When the first chip pick-up head rotates to below the fourth lifting mechanism, and the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the triggering device of the first chip pick-up head, so that the first chip pick-up head puts down the first chip; or, when the first CCD detection result indicates that the CCD detection passes, the controller controls the first chip pick-up head to rotate to below the electrical performance detection component, controls the electrical performance detection component to perform electrical performance detection on the first chip to obtain the first electrical performance detection result, and sends the first electrical performance detection result to the controller.

[0018] When the controller rotates the first chip pick-up head below the fifth lifting mechanism, and the first electrical performance test result indicates that the electrical performance test fails, the controller controls the fifth lifting mechanism to trigger the triggering device of the first chip pick-up head so that the first chip pick-up head puts down the first chip. Alternatively, when the first electrical performance test result indicates that the electrical performance test passes, the controller controls the first chip pick-up head to rotate below the unloading assembly, and the unloading assembly completes the unloading of the first chip.

[0019] According to some embodiments of the present invention, the plurality of chip pick-up heads further includes a second chip pick-up head, the second chip pick-up head being located after the first chip pick-up head, and after sending the rotation signal to the rotary motor again, the method further includes:

[0020] When the second chip suction head rotates to a position below the feeding assembly, the second chip is placed below the second chip suction head;

[0021] The controller controls the feeding component to perform CCD detection on the second chip to obtain the second CCD detection result;

[0022] When the second CCD detection result indicates that the CCD detection has passed and the second chip pick-up head rotates to the underside of the electrical performance detection component, the second electrical performance detection result of the second chip is determined based on the electrical performance detection component;

[0023] The second chip is cut to size based on the second electrical performance test results.

[0024] According to some embodiments of the present invention, after the first chip pick-up head rotates to below the fourth lifting mechanism, the method further includes:

[0025] The controller acquires a first queue, wherein the first queue stores at least the first CCD detection result and the second CCD detection result;

[0026] The controller obtains the first CCD detection result from the first queue, and controls the fourth lifting mechanism based on the first CCD detection result to remove the first CCD detection result from the first queue;

[0027] When the second chip pick-up head rotates to the position below the fourth lifting mechanism, the controller obtains the second CCD detection result from the first queue, and controls the fourth lifting mechanism based on the second CCD detection result to remove the second CCD detection result from the first queue.

[0028] According to some embodiments of the present invention, after the controller's first chip pick-up head rotates to below the fifth lifting mechanism, the method further includes:

[0029] The controller acquires a second queue, wherein the second queue stores at least the first electrical performance test result and the second electrical performance test result;

[0030] The controller obtains the first electrical performance test result from the second queue, and controls the fifth lifting mechanism based on the first electrical performance test result to remove the first electrical performance test result from the second queue;

[0031] When the second chip pick-up head rotates to the position below the fifth lifting mechanism, it obtains the second electrical performance test result from the second queue, and controls the fifth lifting mechanism based on the second electrical performance test result to remove the second electrical performance test result from the second queue.

[0032] According to some embodiments of the present invention, the device further includes a plurality of solenoid valves and a plurality of flow meters. The plurality of chip pick-up heads are all connected to a vacuum pump. Each of the triggering devices is electrically connected to one of the solenoid valves and one of the flow meters. The solenoid valve is located between one of the chip pick-up heads and the vacuum pump. The flow meter is located inside the chip pick-up head. The plurality of flow meters are all communicatively connected to the controller. The unloading assembly includes a second CCD device. The imaging direction of the second CCD device is aligned with the lower part of the second lifting mechanism.

[0033] Controlling the first chip pick-up head to rotate below the unloading assembly, the unloading assembly completing the unloading of the first chip includes:

[0034] The controller controls the first chip to rotate to the underside of the feeding assembly, and places the first chip fixture under the first chip;

[0035] The second CCD device is controlled to perform CCD detection on the first chip fixture to obtain a first CCD positioning result, and the first CCD positioning result is sent to the controller.

[0036] When the first CCD positioning result indicates that the positioning detection of the first chip fixture has passed, the controller controls the second lifting mechanism to move downward, so that the second lifting mechanism triggers the triggering device, and the triggering device controls the solenoid valve and the flow meter to close, and the first chip suction head puts down the first chip.

[0037] Thirdly, embodiments of the present invention provide a control device for a chip pick-and-place mechanism, including at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, the instructions being executed by the at least one control processor to enable the at least one control processor to perform the control method for the chip pick-and-place mechanism as described in the second aspect above.

[0038] Fourthly, embodiments of the present invention provide a computer-readable storage medium storing computer-executable instructions for performing the control method of the chip pick-and-place mechanism as described in the second aspect above.

[0039] The chip picking and placing mechanism according to embodiments of the present invention has at least the following beneficial effects: a support frame, wherein a top plate is provided on the upper side of the support frame; a rotary motor and a turntable, wherein the rotary motor is fixed to the top plate, the turntable is connected to the rotary motor, the rotary motor is used to drive the turntable to rotate, a plurality of equally spaced chip picking heads are provided on the outer edge of the turntable, a triggering device is provided above the chip picking head, the triggering device is electrically connected to the chip picking head; a loading assembly and a unloading assembly, wherein the loading assembly and the unloading assembly are fixed to the support frame and located above the chip picking head, the loading assembly includes a first lifting mechanism and a first CCD device, the imaging direction of the first CCD device is aligned with the lower part of the first lifting mechanism, the unloading assembly includes a second lifting mechanism, and the first lifting mechanism and the second lifting mechanism are capable of descending and... The device is abutting against the triggering device; an electrical performance testing component, fixed to the top plate and located between the loading component and the unloading component, the electrical performance testing component including a third lifting mechanism and a probe card, the probe card being located at the lower end of the third lifting mechanism, the probe card moving vertically under the drive of the third lifting mechanism; a fourth lifting mechanism and a fifth lifting mechanism, the top ends of the fourth lifting mechanism and the fifth lifting mechanism being fixed to the top plate, the fourth lifting mechanism being located between the loading component and the electrical performance testing component, and the fifth lifting mechanism being located between the electrical performance testing component and the unloading component; a controller, the controller being communicatively connected to the rotary motor, the triggering device, the loading component, the unloading component, the electrical performance testing component, the fourth lifting mechanism, and the fifth lifting mechanism. According to the technical solution of the present invention, the chip picking, transfer, and testing steps can be completed through a single chip picking and placing mechanism, reducing the chip transfer time between devices, improving chip production efficiency, reducing the equipment cost required for chip production, and saving installation space. Attached Figure Description

[0040] Figure 1 This is a structural diagram of the internal structure of the support frame provided in one embodiment of the present invention;

[0041] Figure 2 This is a structural diagram of a chip pick-and-place mechanism provided in another embodiment of the present invention;

[0042] Figure 3 This is a structural diagram of a chip pick-and-place head provided in another embodiment of the present invention;

[0043] Figure 4 This is a flowchart of a control method for a chip pick-and-place mechanism provided in another embodiment of the present invention;

[0044] Figure 5This is a structural diagram of the control device for the chip pick-and-place mechanism provided in another embodiment of the present invention. Detailed Implementation

[0045] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0046] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0047] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0048] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0049] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0050] The chip picking and placing mechanism according to embodiments of the present invention has at least the following beneficial effects: a support frame, wherein a top plate is provided on the upper side of the support frame; a rotary motor and a turntable, wherein the rotary motor is fixed to the top plate, the turntable is connected to the rotary motor, the rotary motor is used to drive the turntable to rotate, a plurality of equally spaced chip picking heads are provided on the outer edge of the turntable, a triggering device is provided above the chip picking head, the triggering device is electrically connected to the chip picking head; a loading assembly and a unloading assembly, wherein the loading assembly and the unloading assembly are fixed to the support frame and located above the chip picking head, the loading assembly includes a first lifting mechanism and a first CCD device, the imaging direction of the first CCD device is aligned with the lower part of the first lifting mechanism, the unloading assembly includes a second lifting mechanism, and the first lifting mechanism and the second lifting mechanism are capable of descending and... The device is abutting against the triggering device; an electrical performance testing component, fixed to the top plate and located between the loading component and the unloading component, the electrical performance testing component including a third lifting mechanism and a probe card, the probe card being located at the lower end of the third lifting mechanism, the probe card moving vertically under the drive of the third lifting mechanism; a fourth lifting mechanism and a fifth lifting mechanism, the top ends of the fourth lifting mechanism and the fifth lifting mechanism being fixed to the top plate, the fourth lifting mechanism being located between the loading component and the electrical performance testing component, and the fifth lifting mechanism being located between the electrical performance testing component and the unloading component; a controller, the controller being communicatively connected to the rotary motor, the triggering device, the loading component, the unloading component, the electrical performance testing component, the fourth lifting mechanism, and the fifth lifting mechanism. According to the technical solution of the present invention, the chip picking, transfer, and testing steps can be completed through a single chip picking and placing mechanism, reducing the chip transfer time between devices, improving chip production efficiency, reducing the equipment cost required for chip production, and saving installation space.

[0051] First, refer to Figures 1 to 3 The chip pick-and-place mechanism provided in this application embodiment includes:

[0052] A support frame 10 is provided with a top plate 20 on its upper side;

[0053] A rotary motor 30 and a turntable 40 are provided. The rotary motor 30 is fixed to the top plate 20, and the turntable 40 is connected to the rotary motor 30. The rotary motor 30 is used to drive the turntable 40 to rotate. Multiple chip picking heads 41 with equal spacing are provided on the outer edge of the turntable 40. A trigger device 42 is provided above the chip picking head 41 and is electrically connected to the chip picking head 41.

[0054] The loading assembly 50 and the unloading assembly 60 are fixed to the support frame 10 and located above the chip pick-up head 41. The loading assembly 50 includes a first lifting mechanism and a first CCD device. The shooting direction of the first CCD device is aligned with the lower part of the first lifting mechanism. The unloading assembly 60 includes a second lifting mechanism 61. The first lifting mechanism and the second lifting mechanism 61 can descend and abut against the trigger device 42.

[0055] The electrical performance testing component is fixed to the top plate 20 and located between the feeding component 50 and the unloading component 60. The electrical performance testing component includes a third lifting mechanism 70 and a detector card. The detector card is located at the lower end of the third lifting mechanism 70. Under the drive of the third lifting mechanism 70, the detector card moves vertically.

[0056] The top ends of the fourth lifting mechanism 80 and the fifth lifting mechanism 90 are fixed to the top plate 20. The fourth lifting mechanism 80 is located between the feeding component 50 and the electrical performance testing component, and the fifth lifting mechanism 90 is located between the electrical performance testing component and the unloading component 60.

[0057] The controller is communicatively connected to the rotary motor 30, the triggering device 42, the feeding assembly 50, the unloading assembly 60, the electrical performance detection assembly, the fourth lifting mechanism 80, and the fifth lifting mechanism 90.

[0058] It should be noted that the turntable 40 is equipped with equally spaced chip pick-up heads 41. The rotary motor 30 drives the turntable 40 to rotate by a preset angle, and each station passes through the testing equipment and the lowering mechanism in sequence. After receiving the rotation signal, the rotary motor 30 rotates by a preset angle, which is related to the spacing between the stations. The rotation of the rotary motor 30 drives the turntable 40 to rotate by the preset angle, so that two adjacent chip pick-up heads 41 pass through the loading assembly 50, the fourth lifting mechanism 80, the electrical performance testing equipment, the fifth lifting mechanism 90, and the unloading assembly 60 in sequence in the rotation direction of the turntable 40.

[0059] It should be noted that the method of picking up chips via the chip pick-up head 41 is existing technology. The chip is placed below the chip pick-up head 41, and the first lifting mechanism can move vertically. The first lifting mechanism descends to abut against the trigger device 42, which generates an electrical signal and sends it to the chip pick-up head 41, thus picking up the chip and completing the loading. To achieve automated chip picking, transfer, and inspection, a conveyor belt located below the loading assembly 50 can be used to transport chips to the area below the chip pick-up head 41, which is located below the loading assembly 50.

[0060] It should be noted that the first CCD device is used to take pictures of the chip's upper surface to acquire images, and to perform defect detection on the chip's upper surface based on the images. How to detect defects on the chip's upper surface using images is existing technology, and this application does not make any improvements to defect detection based on chip surface images, so it will not be elaborated here.

[0061] It should be noted that the first CCD device obtains the offset angle of the unloaded chip based on the image acquired from the chip, and sends the chip angle to the external device. The external device corrects the chip based on the chip angle to achieve neat placement during unloading, which facilitates subsequent chip transfer.

[0062] It should be noted that the surface of the probe card includes multiple contacts. Driven by the third lifting mechanism 70, the probe card moves downward, and the contacts of the probe card make electrical contact with the contacts of the chip. If they are interconnected, the test is passed; if they are not interconnected, the test is failed. This achieves the electrical performance testing of the chip. How to achieve the electrical performance testing of the chip based on the probe card is existing technology. This application does not make any improvements to the electrical performance testing of the chip, and will not be elaborated here.

[0063] It should be noted that the fourth lifting mechanism 80 is used to unload chips that fail the visual inspection of the upper surface, meaning that chips that fail the upper surface inspection do not need to undergo electrical performance testing; the fifth lifting mechanism 90 is used to unload chips that fail the electrical performance test. That is, the fourth lifting mechanism 80, the fifth lifting mechanism 90, and the second lifting mechanism 61 are used to classify chips based on the chip inspection results. Chips unloaded by the fourth lifting mechanism 80 are chips with defects on the upper surface, chips unloaded by the fifth lifting mechanism 90 are chips that pass the visual test but fail the electrical performance test, and chips unloaded by the second lifting mechanism 61 are chips that pass both the visual test and the electrical performance test.

[0064] It should be noted that an additional lifting mechanism can be provided between the unloading component 60 and the loading component 50. The lifting mechanism located between the unloading component 60 and the loading component 50 is used to unload the chip suction head 41 that has passed through the unloading component 60 again, so as to ensure that the chip suction head 41 entering the loading component 50 does not pick up any chips.

[0065] It should be noted that the unloading component 60 unloads chips that have passed visual and electrical performance tests, and has two unloading logics. The first unloading logic is that the second lifting mechanism 61 performs an unloading operation on the chip pick-up head 41 located below the unloading component 60 every time the turntable 40 rotates. The second unloading logic is that the second lifting mechanism 61 only unloads the chip pick-up head 41 located below the unloading component 60 that has picked up a chip, and does not operate on the chip pick-up head 41 that has not picked up a chip.

[0066] It should be noted that the controller sends signals to control the rotary motor 30, trigger device 42, feeding assembly 50, unloading assembly 60, electrical performance detection assembly, fourth lifting mechanism 80 and fifth lifting mechanism 90 to perform operations.

[0067] In this embodiment, the chip pick-and-place mechanism is activated. The rotary motor 30 drives the first chip pick-up head 41 to rotate below the loading assembly 50 via the turntable 40. The first chip is positioned below the first chip pick-up head 41. The first CCD device takes a picture of the upper surface of the first chip and acquires an image. Based on the image, visual inspection is performed. A chip with no defects on its upper surface passes the visual inspection; a chip with defects fails the visual inspection. The rotary motor 30 drives the first chip to rotate below the fourth lifting mechanism 80. The fourth lifting mechanism 80 operates on the first chip based on the visual inspection results. If the first chip passes the visual inspection, the fourth lifting mechanism 80 does not operate on the first chip; if the first chip fails the visual inspection, the fourth lifting mechanism 80 performs a unloading operation on the first chip. The rotary motor 30 drives the first chip that has passed the visual inspection to rotate below the electrical performance testing assembly. The electrical performance testing assembly performs electrical performance testing on the first chip via a probe card. If the first chip and the probe card are electrically connected, the electrical performance test is passed; otherwise, the electrical performance test is failed. A rotary motor 30 drives the first chip to rotate below the fifth lifting mechanism 90. The fifth lifting mechanism 90 operates on the first chip based on the electrical performance test results. If the first chip passes the electrical performance test, the fifth lifting mechanism 90 does not operate on the first chip; if the first chip fails the electrical performance test, the fifth lifting mechanism 90 performs a unloading operation on the first chip. The rotary motor 30 drives the first chip, which has passed visual inspection and electrical performance testing, to rotate below the second lifting mechanism 61, and the second lifting mechanism 61 unloads the first chip. Through the rotary motor 30, turntable 40, first CCD device, and electrical performance testing components of this application, multi-station chip inspection is realized. After a chip is picked up by a chip pick-up head 41, the chip picking and testing steps can be completed without a lowering operation. The chips are classified based on the test results, reducing the transfer time between chip equipment, improving chip production efficiency, reducing the equipment cost required for chip production, and saving installation space.

[0068] Additionally, in one embodiment, reference is made to Figure 3 It also includes multiple solenoid valves 43 and multiple flow meters 44. Multiple chip suction heads 41 are all connected to the air pump. Each trigger device 42 is electrically connected to a solenoid valve 43 and a flow meter 44. The solenoid valve 43 is located between a chip suction head 41 and the air pump. The flow meter 44 is located inside the chip suction head 41. The flow meter 44 is used to detect the gas flow rate of the chip suction head 41. Multiple flow meters 44 are all communicatively connected to the controller.

[0069] It should be noted that one end of the chip suction head 41 is used to pick up the chip, and the other end is connected to the air pump through an air tube. The air pump works continuously, and the solenoid valve 43 is used to open and close the air tube channel between the air pump and the chip suction head 41.

[0070] It should be noted that when the chip pick-up head 41 is not picking up a chip, the lifting mechanism abuts against the trigger device 42. The trigger device 42 generates an electrical signal and sends it to the solenoid valve 43 and the flow meter 44. The solenoid valve 43 and the flow meter 44 open, and the air pump draws air through the open solenoid valve 43. The flow meter 44 detects the gas flow rate passing through the chip pick-up head 41. When the gas flow rate is lower than a preset threshold, the chip is picked up by the chip pick-up head 41 and forms a sealed space, meaning that the chip pick-up head 41 has finished loading the chip. When the chip pick-up head 41 has picked up a chip, the trigger device 42 generates an electrical signal and sends it to the solenoid valve 43 and the flow meter 44. The solenoid valve 43 and the flow meter 44 close, and the chip pick-up head 41 lowers the chip, thus completing the chip unloading.

[0071] It should be noted that during the opening of the solenoid valve 43, the flow meter 44 continuously monitors the gas flow. When the gas flow suddenly increases, i.e. the chip falls off the chip pick-up head 41, the chip pick-up and drop mechanism issues an alarm, and the operator inspects the chip pick-up and drop device and the chip.

[0072] Additionally, in one embodiment, reference is made to Figure 1 The unloading assembly 60 includes a second CCD device, the shooting direction of which is aligned with the lower part of the second lifting mechanism 61.

[0073] It should be noted that the chip placement device places the chip onto the chip fixture, facilitating subsequent material handling and transfer. The second CCD device is used for positioning detection of the chip fixture. If the chip fixture is in the designated position, the second lifting mechanism 61 unloads the chip onto the chip fixture. If the chip fixture fails the positioning detection, the offset angle of the chip fixture is determined based on the image acquired by the second CCD device and sent to an external device for correction of the chip fixture angle.

[0074] It should be noted that those skilled in the art know how to obtain the angle of the chip fixture based on a vision device and how to correct the chip fixture based on the obtained angle. How to obtain the angle of the chip fixture based on a vision device and how to correct the chip fixture are existing technologies. This application has not made any improvements and will not elaborate further here.

[0075] In addition, embodiments of the present invention provide a control method for a chip pick-and-place mechanism, applicable to... Figures 1 to 3 The chip pick-and-place mechanism of the embodiment shown is referred to Figure 4 The method includes, but is not limited to, the following steps:

[0076] S10, the controller sends a rotation signal to the rotary motor, the rotary motor drives the turntable to rotate, so that the first chip pick-up head rotates to the bottom of the feeding assembly, and the first chip is placed under the first chip pick-up head;

[0077] S20, the controller controls the feeding component to perform CCD detection on the first chip to obtain the first CCD detection result, and sends the first CCD detection result to the controller. The controller controls the first chip pick-up head to pick up the first chip and then sends a rotation signal to the rotary motor again.

[0078] S30, when the first chip pick-up head rotates to below the fourth lifting mechanism, and the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the triggering device of the first chip pick-up head so that the first chip pick-up head puts down the first chip; or, when the first CCD detection result indicates that the CCD detection passes, the controller controls the first chip pick-up head to rotate to below the electrical performance detection component, controls the electrical performance detection component to perform electrical performance detection on the first chip to obtain the first electrical performance detection result, and sends the first electrical performance detection result to the controller;

[0079] S40, the controller rotates the first chip pick-up head to below the fifth lifting mechanism. When the first electrical performance test result indicates that the electrical performance test fails, the controller controls the fifth lifting mechanism to trigger the triggering device of the first chip pick-up head so that the first chip pick-up head puts down the first chip. Alternatively, when the first electrical performance test result indicates that the electrical performance test passes, the controller controls the first chip pick-up head to rotate to below the unloading assembly, and the unloading assembly completes the unloading of the first chip.

[0080] It should be noted that the technical principle of the chip picking and placing mechanism, which is based on a rotary motor driving a turntable and a chip pick-up head to perform chip picking, transfer, and inspection operations, can be found in [reference needed]. Figures 1 to 3 The description of the illustrated embodiments will not be repeated here.

[0081] It should be noted that after receiving the rotation signal, the rotary motor rotates by a preset angle so that the chip pick-up head, which has completed chip loading, moves toward the fourth lifting mechanism, causing the first chip pick-up head to rotate to below the loading assembly.

[0082] It should be noted that when the first chip pick-up head rotates to a position below the feeding assembly, and the first chip is located below the first chip pick-up head, the controller sends a signal to the first CCD device, which takes a picture of the first chip and acquires an image. After the first CCD device acquires the image of the upper surface of the first chip, the controller sends a signal to the first triggering device, which sends an electrical signal to the first chip pick-up head, and the first chip pick-up head feeds the first chip.

[0083] It should be noted that, because the workstations are evenly spaced, after the controller sends n rotation signals to the rotary motor (where n is an integer greater than or equal to 1 and less than the number of chip pick-up and place heads), the rotary motor drives the turntable to rotate n times at a preset angle. The first chip pick-up head rotates from below the loading assembly to below the fourth lifting mechanism. The fourth lifting mechanism operates the first chip pick-up and place head based on the first CCD detection result. After the controller sends m rotation signals to the rotary motor (where m is an integer greater than or equal to 1 and less than the number of chip pick-up and place heads), the first chip pick-up and place head rotates from the fourth lifting mechanism to below the electrical performance testing assembly. The electrical performance testing assembly performs electrical performance testing on the first chip that has passed the CCD detection based on the first CCD detection result.

[0084] It should be noted that after the controller sends p rotation signals to the rotary motor, the first chip pick-and-place head rotates from below the electrical performance testing component to below the fifth lifting mechanism. The fifth lifting mechanism operates the first chip pick-and-place head based on the first electrical performance test result. After the controller sends q rotation signals to the rotary motor (q being an integer greater than or equal to 1 and less than the number of chip pick-and-place heads), the first chip pick-and-place head rotates from the fifth lifting mechanism to below the second lifting mechanism. The second lifting mechanism then unloads the chips that have passed CCD detection and electrical performance testing.

[0085] In another embodiment, the plurality of chip pick-up heads also includes a second chip pick-up head, which is located after the first chip pick-up head. After sending a rotation signal to the rotary motor again, step S20 further includes, but is not limited to, the following steps:

[0086] S210, when the second chip suction head rotates to the bottom of the feeding assembly, the second chip is placed below the second chip suction head;

[0087] S220, the controller controls the feeding component to perform CCD detection on the second chip to obtain the second CCD detection result;

[0088] S230, when the second CCD detection result indicates that the CCD detection has passed and the second chip pick-up head rotates to the underside of the electrical performance detection component, the second electrical performance detection result of the second chip is determined based on the electrical performance detection component;

[0089] S240 completes the cutting of the second chip based on the second electrical performance test results.

[0090] It should be noted that the turntable is equipped with multiple chip pick-up heads, and each chip pick-up head is connected to... Figure 4 The first chip pick-up head in the illustrated embodiment performs the same operation.

[0091] It should be noted that the first chip pick-up head and the second chip pick-up head pass through the feeding component, the fourth lifting mechanism, the electrical performance testing component, the fifth lifting mechanism, and the unloading component in sequence. After the first chip pick-up head is located in a component and completes the relevant operations, the second chip pick-up head enters below the component, and the component performs the same operations on the second chip pick-up head as on the first chip pick-up head.

[0092] In another embodiment, after the first chip pick-up head rotates to below the fourth lifting mechanism, step S30 further includes, but is not limited to, the following steps:

[0093] S310, the controller acquires the first queue, wherein the first queue stores at least the first CCD detection result and the second CCD detection result;

[0094] S320, the controller obtains the first CCD detection result from the first queue, and controls the fourth lifting mechanism based on the first CCD detection result to remove the first CCD detection result from the first queue;

[0095] S330, when the second chip pick-up head rotates to the bottom of the fourth lifting mechanism, the controller obtains the second CCD detection result from the first queue, and controls the fourth lifting mechanism based on the second CCD detection result to remove the second CCD detection result from the first queue.

[0096] It should be noted that the feeding component sends the CCD detection results to the controller in the order of detection, i.e., the arrangement order of the chips. The controller stores the CCD detection results in the first queue. The chips rotate to the bottom of the fourth lifting mechanism according to the arrangement order. That is, the controller obtains the CCD detection results in the order of chip arrangement, and controls the fourth lifting mechanism based on the CCD detection results to remove the CCD detection results.

[0097] In another embodiment, after the controller's first chip-picking head rotates to below the fifth lifting mechanism, step S30 further includes, but is not limited to, the following steps:

[0098] S410, the controller acquires the second queue, wherein the second queue stores at least the first electrical performance test result and the second electrical performance test result;

[0099] S420, the controller obtains the first electrical performance test result from the second queue, and controls the fifth lifting mechanism based on the first electrical performance test result to remove the first electrical performance test result from the second queue;

[0100] S430: When the second chip pick-up head rotates to the bottom of the fifth lifting mechanism, it obtains the second electrical performance test result from the second queue, and controls the fifth lifting mechanism based on the second electrical performance test result to remove the second electrical performance test result from the second queue.

[0101] It should be noted that the electrical performance testing component sends the electrical performance test results to the controller in the order of testing, i.e., the arrangement order of the chips. The controller stores the electrical performance test results in the second queue. The chips rotate to the bottom of the fifth lifting mechanism according to the arrangement order. That is, the controller obtains the electrical performance test results in the order of chip arrangement, and controls the fifth lifting mechanism based on the electrical performance test results to remove the electrical performance test results.

[0102] In another embodiment, it also includes multiple solenoid valves and multiple flow meters. Multiple chip suction heads are all connected to the air pump. Each triggering device is electrically connected to a solenoid valve and a flow meter. The solenoid valve is located between a chip suction head and the air pump. The flow meter is located inside the chip suction head. Multiple flow meters are all communicatively connected to the controller. The unloading assembly includes a second CCD device. The imaging direction of the second CCD device is aligned with the lower part of the second lifting mechanism.

[0103] Step S40 specifically includes, but is not limited to, the following steps: controlling the first chip pick-up head to rotate below the unloading component, and the unloading component completing the unloading of the first chip, including:

[0104] S510, the controller controls the first chip to rotate to the bottom of the unloading component, and the first chip fixture is placed below the first chip;

[0105] S520: Control the second CCD device to perform CCD detection on the first chip fixture to obtain the first CCD positioning result, and send the first CCD positioning result to the controller;

[0106] S530, when the first CCD positioning result indicates that the positioning detection of the first chip fixture has passed, the controller controls the second lifting mechanism to move downward, so that the second lifting mechanism triggers the triggering device, the triggering device controls the solenoid valve and flow meter to close, and the first chip suction head puts down the first chip.

[0107] It should be noted that this embodiment provides a feeding step including a solenoid valve and a flow meter. Those skilled in the art should be able to understand a loading step including a solenoid valve and a flow meter. The technical principle of chip pick-up head loading and unloading based on a solenoid valve and a flow meter can be referred to the above. Figure 3 The description of the illustrated embodiments will not be repeated here.

[0108] It should be noted that the chip loading and unloading operations are performed by a flow meter, a solenoid valve, and a chip pick-up head. To facilitate subsequent transfer operations of the chip, the chip pick-up and placement mechanism of this application places the chip on a chip fixture at a fixed angle.

[0109] In addition, to better illustrate the technical solution of this embodiment, the following specific example is provided: a control method for a chip pick-and-place mechanism, including but not limited to the following steps:

[0110] S610, start the chip picking and placing mechanism. The controller sends a rotation signal to the rotary motor. The rotary motor rotates at a preset angle so that the first chip picking head rotates to the bottom of the feeding assembly and the first chip is placed under the first chip picking head.

[0111] S620, the controller controls the feeding assembly to perform CCD detection on the first chip to obtain the first CCD detection result, and sends the first CCD detection result to the controller. The controller stores the first CCD detection result in the first queue. The controller sends a signal to the first lifting mechanism. The first lifting mechanism abuts against the trigger device located above the first chip pick-up head, so that the trigger device sends an electrical signal to activate the solenoid valve and flow meter, so that the first chip pick-up head picks up the first chip. The controller sends a rotation signal to the rotary motor again, so that the second chip pick-up head rotates to the bottom of the feeding assembly. The second chip is placed under the second chip pick-up head. The second chip pick-up head feeds the second chip. The feeding assembly performs the same operation on the second chip as on the first chip.

[0112] S630, when the first chip pick-up head rotates to below the fourth lifting mechanism, the controller obtains the first CCD detection result from the first queue. If the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the triggering device of the first chip pick-up head so that the first chip pick-up head puts down the first chip. Alternatively, if the first CCD detection result indicates that the CCD detection passes, the controller controls the first chip pick-up head to rotate to below the electrical performance detection component, controls the electrical performance detection component to perform electrical performance detection on the first chip to obtain the first electrical performance detection result, and sends the first electrical performance detection result to the controller. The controller stores the first electrical performance detection result in the second queue and sends a rotation signal to the rotary motor again so that the second chip pick-up head rotates to below the electrical performance detection component.

[0113] S640, the controller rotates the first chip pick-up head to below the fifth lifting mechanism. When the first electrical performance test result indicates that the electrical performance test fails, the controller controls the fifth lifting mechanism to trigger the triggering device of the first chip pick-up head, so that the first chip pick-up head puts down the first chip. Alternatively, when the first electrical performance test result indicates that the electrical performance test passes, the controller controls the first chip pick-up head to rotate to below the unloading assembly. The unloading assembly completes the unloading of the first chip. After the unloading is completed, the controller sends a rotation signal to the rotary motor, so that the second chip pick-up head rotates to below the unloading assembly.

[0114] like Figure 5 As shown, Figure 5This is a structural diagram of a control device for a chip pick-and-place mechanism according to an embodiment of the present invention. The present invention also provides a control device for a chip pick-and-place mechanism, comprising:

[0115] The processor 701 can be implemented using a general-purpose central processing unit (CPU), microprocessor, application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0116] The memory 702 can be implemented as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 702 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 702, and the processor 701 calls and executes the control method of the chip pick-and-place mechanism of the embodiments of this application.

[0117] The input / output interface 703 is used to implement information input and output;

[0118] The communication interface 704 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0119] Bus 705 transmits information between various components of the device (e.g., processor 701, memory 702, input / output interface 703, and communication interface 704);

[0120] The processor 701, memory 702, input / output interface 703, and communication interface 704 are connected to each other within the device via bus 705.

[0121] This application embodiment also provides a storage medium, which is a computer-readable storage medium, storing a computer program. When the computer program is executed by a processor, it implements the control method of the chip pick-and-place mechanism described above.

[0122] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0123] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0124] The above provides a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of the present invention.

Claims

1. A chip pick-and-place mechanism, characterized in that, include: A support frame, wherein a top plate is provided on the upper side of the support frame; A rotary motor and a turntable are provided. The rotary motor is fixed to the top plate, and the turntable is connected to the rotary motor. The rotary motor is used to drive the turntable to rotate. The outer edge of the turntable is provided with a plurality of equally spaced chip picking heads. A triggering device is provided above the chip picking head and is electrically connected to the chip picking head. The feeding assembly and the unloading assembly are fixed to the support frame and located above the chip pick-up head. The feeding assembly includes a first lifting mechanism and a first CCD device. The shooting direction of the first CCD device is aligned with the lower part of the first lifting mechanism. The unloading assembly includes a second lifting mechanism. The first lifting mechanism and the second lifting mechanism can descend and abut against the trigger device. An electrical performance testing component is fixed to the top plate and located between the feeding component and the unloading component. The electrical performance testing component includes a third lifting mechanism and a detection card. The detection card is located at the lower end of the third lifting mechanism and moves vertically under the drive of the third lifting mechanism. The fourth lifting mechanism and the fifth lifting mechanism are both fixed to the top plate. The fourth lifting mechanism is located between the feeding component and the electrical performance testing component, and the fifth lifting mechanism is located between the electrical performance testing component and the unloading component. The controller is communicatively connected to the rotary motor, the triggering device, the feeding assembly, the unloading assembly, the electrical performance testing assembly, the fourth lifting mechanism, and the fifth lifting mechanism. Multiple solenoid valves and multiple flow meters are provided. Multiple chip suction heads are connected to a vacuum pump. Each triggering device is electrically connected to one solenoid valve and one flow meter. The solenoid valve is located between one chip suction head and the vacuum pump. The flow meter is located inside the chip suction head and is used to detect the gas flow rate of the chip suction head. Multiple flow meters are communicatively connected to the controller.

2. The chip pick-and-place mechanism according to claim 1, characterized in that, The unloading assembly includes a second CCD device, the imaging direction of which is aligned with the lower part of the second lifting mechanism.

3. A control method for a chip pick-and-place mechanism, characterized in that, Applied to the chip pick-and-place mechanism according to any one of claims 1 to 2, wherein the plurality of chip pick-up heads includes at least a first chip pick-up head, the method includes: The controller sends a rotation signal to the rotary motor, which drives the turntable to rotate so that the first chip pick-up head rotates to a position below the feeding assembly, and the first chip is placed below the first chip pick-up head. The controller controls the feeding component to perform CCD detection on the first chip to obtain a first CCD detection result, and sends the first CCD detection result to the controller. After the controller controls the first chip pick-up head to pick up the first chip, it sends the rotation signal to the rotary motor again. When the first chip pick-up head rotates to below the fourth lifting mechanism, and the first CCD detection result indicates that the CCD detection fails, the controller controls the fourth lifting mechanism to trigger the triggering device of the first chip pick-up head, so that the first chip pick-up head puts down the first chip; or, when the first CCD detection result indicates that the CCD detection passes, the controller controls the first chip pick-up head to rotate to below the electrical performance detection component, controls the electrical performance detection component to perform electrical performance detection on the first chip to obtain the first electrical performance detection result, and sends the first electrical performance detection result to the controller. When the controller rotates the first chip pick-up head below the fifth lifting mechanism, and the first electrical performance test result indicates that the electrical performance test fails, the controller controls the fifth lifting mechanism to trigger the triggering device of the first chip pick-up head so that the first chip pick-up head puts down the first chip. Alternatively, when the first electrical performance test result indicates that the electrical performance test passes, the controller controls the first chip pick-up head to rotate below the unloading assembly, and the unloading assembly completes the unloading of the first chip.

4. The control method for the chip pick-and-place mechanism according to claim 3, characterized in that, The plurality of chip pick-up heads further includes a second chip pick-up head, which is located after the first chip pick-up head. After sending the rotation signal to the rotary motor again, the method further includes: When the second chip suction head rotates to a position below the feeding assembly, the second chip is placed below the second chip suction head; The controller controls the feeding component to perform CCD detection on the second chip to obtain the second CCD detection result; When the second CCD detection result indicates that the CCD detection has passed and the second chip pick-up head rotates to the underside of the electrical performance detection component, the second electrical performance detection result of the second chip is determined based on the electrical performance detection component; The second chip is cut to size based on the second electrical performance test results.

5. The control method for the chip pick-and-place mechanism according to claim 4, characterized in that, After the first chip pick-up head rotates to below the fourth lifting mechanism, the method further includes: The controller acquires a first queue, wherein the first queue stores at least the first CCD detection result and the second CCD detection result; The controller obtains the first CCD detection result from the first queue, and controls the fourth lifting mechanism based on the first CCD detection result to remove the first CCD detection result from the first queue; When the second chip pick-up head rotates to the position below the fourth lifting mechanism, the controller obtains the second CCD detection result from the first queue, and controls the fourth lifting mechanism based on the second CCD detection result to remove the second CCD detection result from the first queue.

6. The control method for the chip pick-and-place mechanism according to claim 5, characterized in that, After the controller's first chip-picking head rotates to below the fifth lifting mechanism, the method further includes: The controller acquires a second queue, wherein the second queue stores at least the first electrical performance test result and the second electrical performance test result; The controller obtains the first electrical performance test result from the second queue, and controls the fifth lifting mechanism based on the first electrical performance test result to remove the first electrical performance test result from the second queue; When the second chip pick-up head rotates to the position below the fifth lifting mechanism, it obtains the second electrical performance test result from the second queue, and controls the fifth lifting mechanism based on the second electrical performance test result to remove the second electrical performance test result from the second queue.

7. The control method for the chip pick-and-place mechanism according to claim 3, characterized in that, It also includes multiple solenoid valves and multiple flow meters. Multiple chip suction heads are connected to a vacuum pump. Each triggering device is electrically connected to one solenoid valve and one flow meter. The solenoid valve is located between one chip suction head and the vacuum pump. The flow meter is located inside the chip suction head. Multiple flow meters are communicatively connected to the controller. The unloading assembly includes a second CCD device. The imaging direction of the second CCD device is aligned with the lower part of the second lifting mechanism. Controlling the first chip pick-up head to rotate below the unloading assembly, the unloading assembly completing the unloading of the first chip includes: The controller controls the first chip to rotate to the underside of the feeding assembly, and places the first chip fixture under the first chip; The second CCD device is controlled to perform CCD detection on the first chip fixture to obtain a first CCD positioning result, and the first CCD positioning result is sent to the controller. When the first CCD positioning result indicates that the positioning detection of the first chip fixture has passed, the controller controls the second lifting mechanism to move downward, so that the second lifting mechanism triggers the triggering device, and the triggering device controls the solenoid valve and the flow meter to close, and the first chip suction head puts down the first chip.

8. A control device for a chip pick-and-place mechanism, characterized in that, It includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enable the at least one control processor to perform the control method of the chip pick-and-place mechanism as described in any one of claims 3 to 7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the control method of the chip pick-and-place mechanism as described in any one of claims 3 to 7.

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