Thermal field supporting structure and crystal pulling furnace

Abstract

The invention provides a thermal field supporting structure and a crystal pulling furnace, the thermal field supporting structure comprises a bottom plate, a supporting ring and a supporting cylinder, the supporting ring is arranged on the periphery of the bottom plate in a surrounding manner, and the supporting cylinder is arranged on the supporting ring. Therefore, the supporting cylinder is supported by the additionally arranged supporting ring, the bearing pressure of the bottom plate can be reduced, the bottom plate cannot be damaged when an upper thermal field component is cleaned and replaced, the stability of the thermal field and the stability of the upper thermal field component are improved, and the quality of a crystal bar is improved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer manufacturing, and in particular to a thermal field support structure and a crystal pulling furnace. Background Art

[0002] A crystal pulling furnace is a device used to produce crystal rods. The thermal field of the crystal pulling furnace is the main area where the behavior occurs. Any component in the thermal field will be subjected to strong thermal shock, and problems such as component aging, wear, and cracking are likely to occur.

[0003] Among them, the BIC plate (Bottom insulation cover plate) is one of the core thermal field components in the crystal pulling furnace, which is used to support the upper thermal field components and protect the bottom curing felt. When cleaning and replacing the upper thermal field components, the BIC plate is easily worn or even broken, which seriously affects the stability of the thermal field and the stability of the upper thermal field components, resulting in short service life of the thermal field components, thermal field tilt and other problems. Summary of the invention

[0004] In view of this, the present application provides a thermal field support structure, which can solve the problems of short life of thermal field components and thermal field inclination.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A thermal field support structure comprises a base plate, a support ring and a support tube. The support ring is arranged around the outer periphery of the base plate, and the support tube is arranged on the support ring.

[0007] Optionally, the inner diameter of the support ring is consistent with the outer diameter of the base plate.

[0008] Optionally, the edge height of the bottom plate is greater than the height of the support ring, and the inner diameter of the support ring is consistent with the inner diameter of the support tube.

[0009] Optionally, a side of the support ring close to the support tube is configured as a plane.

[0010] Optionally, the support ring is provided as at least two sections arranged along the circumference of the base plate.

[0011] Optionally, the support ring is made of a carbon-carbon composite material.

[0012] Optionally, the inner circumferential surface of the support ring is provided with a first avoidance groove for allowing the heating electrode to pass through.

[0013] Optionally, a second avoidance groove for the heating electrode to pass through is provided on the outer peripheral surface of the bottom plate, and the first avoidance groove and the second avoidance groove form a circular hole.

[0014] Optionally, a main heater and a bottom heater are provided on the bottom plate, and the bottom heater is located on the inner side of the main heater.

[0015] Optionally, a heat-insulating cylinder is arranged around the outer periphery of the support cylinder, and the bottom plate, the support ring and the heat-insulating cylinder are all arranged on the curing felt.

[0016] A crystal pulling furnace comprises a thermal field supporting structure as described in any one of the above items.

[0017] The thermal field support structure and crystal pulling furnace provided by the present application can reduce the load-bearing pressure of the bottom plate by supporting the support tube with an additional support ring, and will not damage the bottom plate when cleaning and replacing the upper thermal field components, which is beneficial to improving the stability of the thermal field and the stability of the upper thermal field components, and is beneficial to improving the quality of the crystal rod. Moreover, during use, if the support ring is damaged, the support ring can be directly replaced while retaining the bottom plate, which greatly reduces the cost of thermal field consumables and labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0019] Figure 1 A schematic diagram of a thermal field support structure shown in some embodiments;

[0020] Figure 2 A front view of a base plate and a support ring shown for some embodiments;

[0021] Figure 3 A top view of a base plate and support ring is shown for some embodiments.

[0022] In the figure: 1. curing felt; 2. bottom plate; 3. bottom heater; 4. main heater; 5. support tube; 6. insulation tube; 7. support ring; 8. heating electrode; 9. circular hole. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0024] like Figure 1-Figure 3 As shown, an embodiment of the present application provides a thermal field support structure, including a base plate 2, a support ring 7 and a support tube 5. When the thermal field is installed, the base plate 2 and the support ring 7 are both arranged on the curing felt 1, and then the base plate 2 and the support ring 7 are used to support the upper thermal field components and protect the lower curing felt 1.

[0025] The support ring 7 is arranged around the outer periphery of the bottom plate 2 so that the bottom plate 2 and the support ring 7 are both arranged on the upper surface of the curing felt 1, and have good structural flatness. Among them, the support tube 5 is arranged on the support ring 7, that is, the upper surface of the support ring 7 abuts against the lower part of the support tube 5, and the lower surface of the support ring 7 abuts against the curing felt 1. In this way, the load-bearing pressure of the bottom plate 2 can be reduced by supporting the support tube 5 only by the additional support ring 7. When cleaning and replacing the upper thermal field components, the bottom plate 2 will not be damaged, which is beneficial to improving the stability of the thermal field and the stability of the upper thermal field components, and is beneficial to improving the quality of the crystal rod. Moreover, during use, if the support ring 7 is damaged, the support ring 7 can be directly replaced while retaining the bottom plate 2, which greatly reduces the cost of thermal field consumables and labor costs.

[0026] It should be noted that the above-mentioned bottom plate 2 and support ring 7 together constitute the BIC plate in the prior art, and the bottom plate 2 can be consistent with the main structure of the existing BIC plate, and by optimizing the size of the bottom plate 2 (reducing the outer diameter of the bottom plate 2), the additional support ring 7 can be arranged around the outer periphery of the bottom plate 2. That is, the BIC plate in the prior art is set as a split structure, and the function of supporting the support tube 5 in the BIC plate in the prior art is transferred to the additional support ring 7, thereby reducing the load-bearing pressure of the bottom plate 2.

[0027] The hardness of the support ring 7 should be greater than the hardness of the bottom plate 2. When selecting the material of the support ring 7, the material hardness of the support ring 7 needs to be greater than the material hardness of the BIC plate in the prior art. For example, the support ring 7 is set to be a carbon-carbon composite material. In this way, the support tube 5 is supported by the additional support ring 7 with a larger material hardness. When the upper thermal field components are cleaned and replaced, the support ring 7 is not prone to wear and tear, and has a good structural strength, which is conducive to improving the service life of the thermal field components and production efficiency.

[0028] In this solution, a main heater 4 and a bottom heater 3 are provided on the bottom plate 2. The main heater 4 is close to the inner wall of the support tube 5 and is used to heat the crucible in the circumferential direction. The bottom heater 3 is located inside the main heater 4 and close to the upper surface of the bottom plate 2 and is used to heat the crucible at the bottom to form a heat field inside the support tube 5 and above the bottom plate 2.

[0029] The outer periphery of the support tube 5 is surrounded by a heat-insulating tube 6, and the bottom plate 2, the support ring 7 and the heat-insulating tube 6 are all arranged on the curing felt 1, that is, the bottom plate 2 is arranged on the inner side of the support ring 7, and the heat-insulating tube 6 is arranged on the outer side of the support ring 7. The heat-insulating tube 6 can not only insulate the thermal field, but also limit the bottom plate 2 and the support ring 7. Moreover, the curing felt 1 can not only insulate the thermal field, but also support the heat-insulating tube 6, the support ring 7 and the bottom plate 2, making the structure more stable.

[0030] Among them, the support ring 7 and the base plate 2 can have a clearance fit or a tight fit. Here, it is preferred that the inner diameter of the support ring 7 is consistent with the inner diameter of the base plate 2, so that the outer circumference of the support ring 7 contacts the inner circumference of the base plate 2. The support ring 7 can be limited by the base plate 2 to avoid radial shaking of the support ring 7, which is beneficial to improving the stability of the structure and can prevent the thermal field from damaging the curing felt 1 through the gap between the base plate 2 and the support ring 7.

[0031] In some embodiments, the side of the support ring 7 close to the support tube 5 is set to be a plane. When the support tube 5 is installed on the support ring 7, the contact surface between the support tube 5 and the support ring 7 is a plane, which can prevent the support tube 5 from being tilted relative to the support ring 7, thereby preventing the thermal field from tilting and improving the force balance at various locations on the support ring 7.

[0032] The height of the edge of the bottom plate 2 can be greater than the height of the support ring 7, and a step is formed at the edge of the support ring 7 and the bottom plate 2, and the inner diameter of the support ring 7 is consistent with the inner diameter of the support tube 5, so that the support tube 5 is just sleeved on the outer periphery of the bottom plate 2. In this way, the support ring 7 is arranged on the support ring 7, and the support tube 5 can be limited by the above-mentioned step, thereby improving the stability of the structural installation.

[0033] In order to facilitate the disassembly and assembly of the support ring 7, the support ring 7 can be set to a split structure, and the support ring 7 is set to at least two sections arranged along the circumference of the base plate 2. For example, the support ring 7 is set to two semicircular sections, or the support ring 7 is set to three sections, each section is one-third of a circular arc.

[0034] In some preferred schemes, a first avoidance groove is provided on the inner circumferential surface of the support ring 7, and the first avoidance groove is used for the heating electrode 8 to pass through. When the hot field is installed, the heating electrode 8 can pass through the support ring 7 through the first avoidance groove, and then heat the main heater 4 above the base plate 2 through the heating electrode 8.

[0035] Moreover, the outer peripheral surface of the bottom plate 2 is provided with a second avoidance groove, and the second avoidance groove is used for the heating electrode 8 to pass through. When the thermal field is installed, the heating electrode 8 can pass through the support ring 7 through the first avoidance groove, and then heat the main heater 4 above the bottom plate 2 through the heating electrode 8. Among them, the shapes of the first avoidance groove and the second avoidance groove are both arc-shaped, so that the first avoidance groove and the second avoidance groove form a circular hole 9, and the inner diameter of the circular hole 9 matches the outer diameter of the heating electrode 8, so that the circular hole 9 is just for the heating electrode 8 to pass through, thereby improving the tightness of the structure and avoiding heat loss in the thermal field.

[0036] Specifically, four first avoidance grooves are evenly distributed on the inner circumference of the support ring 7, and four second avoidance grooves are evenly distributed on the outer circumference of the base plate 2, so that four circular holes 9 are formed between the support ring 7 and the base plate 2, and the four heating electrodes 8 are respectively located in the four circular holes 9.

[0037] The embodiment of the present application provides a crystal pulling furnace, including the thermal field support structure in the above embodiment. In this way, the support tube 5 is supported by the additional support ring 7, which can reduce the load-bearing pressure of the bottom plate 2. When cleaning and replacing the upper thermal field components, the bottom plate 2 will not be damaged, which is beneficial to improving the stability of the thermal field and the stability of the upper thermal field components, and is beneficial to improving the quality of the crystal rod. Moreover, during use, if the support ring 7 is damaged, the support ring 7 can be directly replaced while retaining the bottom plate 2, which greatly reduces the cost of thermal field consumables and labor costs.

[0038] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0039] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0040] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0041] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0042] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0043] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A thermal field support structure, characterized in that: The invention comprises a bottom plate, a support ring and a support tube. The support ring is arranged around the outer periphery of the bottom plate, and the support tube is arranged on the support ring.

2. The thermal field support structure according to claim 1, characterized in that: The inner diameter of the support ring is consistent with the outer diameter of the base plate.

3. The thermal field support structure according to claim 2, characterized in that: The edge height of the bottom plate is greater than the height of the support ring, and the inner diameter of the support ring is consistent with the inner diameter of the support tube.

4. The thermal field support structure according to claim 1, characterized in that: A side of the support ring close to the support tube is configured as a plane.

5. The thermal field support structure according to claim 1, characterized in that: The support ring is configured to have at least two sections arranged along the circumference of the base plate.

6. The thermal field support structure according to claim 1, characterized in that: The support ring is configured to be made of a carbon-carbon composite material.

7. The thermal field support structure according to claim 1, characterized in that: The inner circumferential surface of the support ring is provided with a first avoidance groove for the heating electrode to pass through.

8. The thermal field support structure according to claim 7, characterized in that: The outer peripheral surface of the bottom plate is provided with a second avoidance groove for the heating electrode to pass through, and the first avoidance groove and the second avoidance groove form a circular hole.

9. The thermal field support structure according to claim 1, characterized in that: A main heater and a bottom heater are arranged on the bottom plate, and the bottom heater is located at the inner side of the main heater.

10. The thermal field support structure according to claim 1, characterized in that: A heat-insulating tube is arranged around the outer periphery of the support tube, and the bottom plate, the support ring and the heat-insulating tube are all arranged on the curing felt.

11. A crystal pulling furnace, characterized in that: The invention comprises the thermal field supporting structure according to any one of claims 1 to 10.

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