Chip packaging sealing performance detection method and device

Abstract

The invention relates to a method and equipment for detecting the sealing performance of chip packaging. The chip comprises a non-metal packaging shell and internal metal, and the non-metal packaging shell surrounds the internal metal; the method comprises the following steps: the chip is immersed in a detection liquid, and the detection liquid can chemically react with the internal metal; and taking out the chip from the detection liquid, and judging the sealing performance of the non-metal packaging shell according to the state of the internal metal. According to the method provided by the invention, the to-be-detected chip is immersed into the detection liquid, so that the packaging damage or crack of the chip can be quickly identified, meanwhile, the high-cost and high-magnification electron microscope photographing investment is not needed, the cost of chip packaging sealing performance detection is reduced, and meanwhile, the detection efficiency is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of chip manufacturing technology, and in particular to a chip packaging sealing detection method and equipment. Background Art

[0002] As the size of chip packages gets smaller and smaller, WLCSP (Wafer Level Chip Scale Packaging) is widely used. WLCSP technology is an advanced packaging form that completes the packaging and manufacturing before the silicon wafer is complete and the individual chips are cut. It is widely used in high-performance computing, mobile communications and other fields due to its high integration, low power consumption and miniaturization. However, because WLCSP lacks traditional sealed plastic or ceramic packaging, it is necessary to ensure the sealing of its packaging, thereby ensuring the reliability and performance stability of the device in various environments. Summary of the invention

[0003] In order to solve the above technical problems, the present disclosure provides a chip package sealing detection method and device.

[0004] The present disclosure provides a method for detecting the sealing of a chip package, wherein the chip comprises a non-metallic packaging shell and an internal metal, wherein the non-metallic packaging shell surrounds the internal metal; the method comprises: immersing the chip in a detection liquid, wherein the detection liquid can chemically react with the internal metal; taking the chip out of the detection liquid, and judging the sealing of the non-metallic packaging shell according to the state of the internal metal.

[0005] Optionally, the inner metal comprises aluminum.

[0006] Optionally, the detection liquid is an alkaline liquid.

[0007] Optionally, the detection liquid is a sodium hydroxide solution.

[0008] Optionally, the concentration of the sodium hydroxide solution is 5%±2%.

[0009] Optionally, the surface color of the internal metal after the chemical reaction with the detection liquid is different from the surface color after the chemical reaction; judging the sealing performance of the non-metallic packaging shell according to the state of the internal metal includes: if the surface color of the internal metal changes, judging that the sealing performance of the non-metallic packaging shell is poor; or, if the surface color of the internal metal does not change, judging that the sealing performance of the non-metallic packaging shell is good.

[0010] Optionally, the light transmittance of the non-metallic packaging shell is greater than 50%; and judging the sealing performance of the non-metallic packaging shell according to the state of the internal metal comprises: observing the surface color of the internal metal with an optical microscope; if the surface color of the internal metal changes, judging that the sealing performance of the non-metallic packaging shell is poor; or, if the surface color of the internal metal does not change, judging that the sealing performance of the non-metallic packaging shell is good.

[0011] Optionally, the chip includes a chip circuit, and the internal metal is a metal sealing ring, which is arranged around the chip circuit.

[0012] Optionally, the chip is a wafer-level packaged chip.

[0013] Based on the same inventive concept, the present disclosure also provides a chip package sealing detection device for executing any one of the methods described above.

[0014] The technical solution provided by the present invention has the following advantages over the prior art: the method provided by the present invention can quickly identify chip packaging damage or cracks by immersing the chip to be inspected into the detection liquid, and at the same time does not require high-cost high-magnification electron microscope photography, thereby reducing the cost of chip packaging sealing detection and improving detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 A schematic diagram of a planar structure of a chip provided in an embodiment of the present disclosure;

[0018] Figure 2 A schematic diagram of a cross-sectional structure of a chip provided in an embodiment of the present disclosure;

[0019] Figure 3 A schematic diagram of a flow chart of a chip package sealing detection method provided in an embodiment of the present disclosure;

[0020] Figure 4 A schematic diagram of the cross-sectional structure of another chip provided in an embodiment of the present disclosure;

[0021] Figure 5A schematic diagram of the cross-sectional structure of another chip provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present disclosure, the scheme of the embodiments of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features therein can be combined with each other without conflict.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure, but the embodiments of the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0024] In the related technology, due to the small size of WLCSP chips, if there are slight defects or cracks in the package, it is difficult to find them with the naked eye or optical microscope, and it is necessary to use FIB (Focused Ion Beam) or SEM (Scanning Electron Microscope) to take pictures and observe. These two devices take a long time to take pictures, are expensive, and have the disadvantages of high cost and low efficiency.

[0025] In view of this, the present disclosure provides a chip package sealing detection method, such as Figure 1 and Figure 2 As shown ( Figure 1 A schematic diagram of the planar structure of a chip. Figure 2 for Figure 1 The embodiment is a schematic diagram of a cross-sectional structure of a chip cut along L1 , wherein the chip includes a non-metallic packaging shell 20 and an internal metal 40 , and the non-metallic packaging shell 20 surrounds the internal metal 40 .

[0026] Specifically, Figure 1 and Figure 2 As shown, the chip includes a chip circuit 00 , and the internal metal 40 is a metal sealing ring, which surrounds the chip circuit 00 and is arranged in the same layer as the chip circuit 00 .

[0027] The metal sealing ring is designed to surround the chip circuit 00 in a circle, and its function is to prevent cracks caused by external force attack on the chip from extending into the chip circuit 00, causing damage to the internal circuit of the chip circuit 00, and ultimately causing the chip circuit 00 to fail.

[0028] The non-metallic packaging shell 20 is also called a passivation layer. Its main function is to prevent the metal sealing ring from direct contact with corrosive substances such as oxygen and moisture in the air, protecting the metal sealing ring from corrosion and becoming fragile, and losing the ability to protect the internal chip circuit 00. Therefore, it is particularly important to detect the sealing of the non-metallic packaging shell 20.

[0029] like Figure 3 As shown, the above method includes:

[0030] S1 . Immerse the chip in a detection liquid, wherein the detection liquid can chemically react with the internal metal 40 , and at the same time, the detection liquid does not chemically react with the non-metal packaging shell 20 .

[0031] In a specific implementation, the non-metallic packaging shell 20 can be made of materials such as plastic or ceramic that are not easy to react chemically with external chemical substances.

[0032] S2 . Take the chip out of the testing liquid and judge the sealing performance of the non-metallic packaging shell 20 according to the state of the internal metal 40 .

[0033] Specifically, Figure 4 As shown, if the non-metallic packaging shell 20 has defects such as cracks 70, the detection liquid can enter the interior of the chip through the cracks 70 and contact the internal metal 40, causing the internal metal 40 to chemically react with the detection liquid, thereby changing the properties of the internal metal 40, making the chip packaging defects intuitively manifest.

[0034] In another embodiment, if Figure 5 As shown, if the non-metallic packaging shell 20 is defective, the detection liquid 60 can directly contact the internal metal 40, thereby causing a more obvious change in the properties of the internal metal 40. According to the degree of change in the properties of the internal metal 40, the severity of the defect of the non-metallic packaging shell 20 can also be further determined.

[0035] The method provided in the embodiment of the present disclosure can quickly identify chip packaging damage or cracks by immersing the chip to be inspected into the inspection liquid. At the same time, it does not require high-cost high-magnification electron microscope photography, thereby reducing the cost of chip packaging sealing inspection and improving inspection efficiency.

[0036] In some embodiments, the method provided by the above embodiments of the present disclosure is used to perform packaging sealing detection on wafer-level packaged chips.

[0037] Specifically, in the above S1, all chips on a silicon wafer may be immersed in the testing liquid at the same time, and in S2, the packaging sealing performance of all chips on the silicon wafer may be tested at the same time.

[0038] In specific implementation, the method provided in the above embodiment of the present disclosure can be used before / after the packaging reliability test of the WLCSP package, and used to detect whether the metal sealing ring is damaged. The method provided in the above embodiment of the present disclosure can also be used in the failure analysis process of the WLCSP package product, and used to determine the damage of the metal sealing ring of the product.

[0039] In a specific embodiment, Figure 2 , Figure 4 as well as Figure 5 As shown, the chip further includes a chip substrate 10 and metal connection holes 30 . The chip substrate 10 is used to support other structures in the chip, and the metal connection holes 30 are used to provide structural support for internal metals 40 of different layers.

[0040] In some embodiments, the surface color of the internal metal 40 after chemical reaction with the detection liquid is different from the surface color after no chemical reaction.

[0041] The above S2 includes:

[0042] If the surface color of the inner metal 40 changes, it is determined that the sealing performance of the non-metallic packaging shell 20 is poor; or if the surface color of the inner metal 40 does not change, it is determined that the sealing performance of the non-metallic packaging shell 20 is good.

[0043] As an intuitive indicator, color change has significant advantages in detecting damaged parts, and this change is often visible to the naked eye without the need for complex instruments or equipment. By observing the depth, range or change trend of the color, a preliminary judgment can be made as to whether the non-metallic packaging housing 20 is damaged, as well as the degree and nature of the damage.

[0044] In some embodiments, the inner metal 40 includes aluminum.

[0045] In WLCSP packaging, aluminum is used for the metal sealing ring, mainly because of its advantages of light weight, good corrosion resistance, cost-effectiveness, easy processing and molding, high temperature resistance and good electrical conductivity. These characteristics enable aluminum to maintain stable performance in a variety of industrial applications, especially in situations where weight reduction, limited budget, and rapid response to design changes and customization requirements are required.

[0046] In the above embodiment where the inner metal 40 comprises aluminum material, the detection liquid is an alkaline liquid.

[0047] In an alkaline liquid environment, the surface of aluminum undergoes corrosion and dissolution, and forms a film composed of aluminum hydroxide or aluminate generated by a chemical reaction, which causes the surface color of the internal metal 40 to change, and can be used for sealing detection.

[0048] In some embodiments, the detection liquid is a sodium hydroxide solution, and the concentration of the sodium hydroxide solution can be selected to be 5%±2%.

[0049] In specific implementation, the above S1 includes:

[0050] Place the chip to be tested directly into the sodium hydroxide solution and soak it at room temperature for 10 minutes.

[0051] When the non-metallic packaging shell 20 is intact, the internal metal 40 of the chip is completely wrapped by the non-metallic packaging shell 20, and the aluminum metal is isolated from the outside. At the same time, the sodium hydroxide solution does not react with the passivation layer non-metallic packaging shell 20, and the sodium hydroxide solution is blocked from outside. If the non-metallic packaging shell 20 is damaged and cracked 70, and the crack 70 has extended to the internal metal 40 to form a passage (such as Figure 4 As shown in the figure, the sodium hydroxide solution will react chemically with the aluminum metal along the crack 70. The chemical equation for the reaction of metal aluminum with sodium hydroxide solution is: 2Al+2NaOH+2H2O=2NaAlO2+3H2↑. In this reaction, metal aluminum (Al) reacts with sodium hydroxide (NaOH) and water (H2O) to generate sodium aluminate (NaAlO2) and hydrogen (H2). After the chemical reaction, the color of the crack 70 is obviously different from that of the normal area due to the lack of aluminum metal in the internal metal 40, and the color is obviously dim. At this time, by observing the appearance of the chip through an optical microscope, it is possible to quickly identify whether the sealing of the non-metallic packaging shell 20 is good.

[0052] Aluminum is an active metal that can react chemically with a variety of solutions and cause changes in the color of its surface. In other embodiments, the above-mentioned detection liquid can also be other chemical reagents. For example, when aluminum reacts with dilute sulfuric acid or hydrochloric acid, gas is generated and released. The generation of these gases may cause bubbles or discoloration on the aluminum surface; when in contact with nitric acid, a dense oxide film will form on the aluminum surface, which may change the appearance of the aluminum; in addition, aluminum can also react with carbonates and phosphates to form precipitates, which may form a covering on the aluminum surface, thereby changing its color; sulfides can also react with aluminum to form aluminum hydroxide precipitates, which will also change the color of the aluminum surface.

[0053] In some embodiments, the light transmittance of the non-metal packaging shell 20 is greater than 50%, and the non-metal packaging shell 20 may be made of transparent plastic or transparent ceramic.

[0054] The above S2 includes:

[0055] The surface color of the internal metal 40 is observed using an optical microscope, thereby eliminating the need for high-cost high-magnification electron microscope photography, thereby reducing the cost of chip package sealing inspection and improving inspection efficiency.

[0056] Specifically, the material of the non-metallic packaging shell 20 can be a translucent material with a light transmittance greater than 50% but less than 80%, or a transparent material with a light transmittance greater than 80%. The higher the light transmittance of the non-metallic packaging shell 20, the more obvious the color change of the internal metal 40 that can be observed, but the corresponding production cost will also increase. Those skilled in the art can select the corresponding material to manufacture the non-metallic packaging shell 20 according to actual use requirements, all of which are within the protection scope of the present disclosure.

[0057] Specifically, the material of the above-mentioned non-metallic packaging shell 20 can be transparent plastic, such as: PMMA (polymethyl methacrylate), also known as plexiglass or acrylic, which has excellent transparency and a transmittance of more than 92%; PC (polycarbonate), which has high transparency, good heat resistance and impact resistance, and a transmittance of more than 90%; PET (polyethylene terephthalate), which is a widely used high-transparency plastic with a transmittance between 88% and 92%, high transparency, light weight, good toughness, and strong weather resistance.

[0058] Specifically, the material of the non-metallic packaging shell 20 can be transparent ceramics. Transparent ceramics are a type of material that has good light transmittance within a specific wavelength range and has good thermal and mechanical properties of structural ceramics. For example, transparent alumina ceramics (Al2O3), a 0.75 mm thick transparent alumina ceramic sheet has a total light transmittance of 90% in the visible spectrum; transparent magnesium oxide ceramics (MgO), which have better light transmittance than Al2O3 ceramics, but because MgO is easily evaporated or sublimated in a high temperature oxygen-deficient atmosphere, transparent MgO ceramics are often prepared by hot pressing sintering or hot isostatic pressing sintering, and the resulting The refractive index of transparent yttrium oxide ceramics (Y2O3) is as high as 1.89 at 1050nm, which makes it have a theoretical transmittance of more than 80%; the linear transmittance of transparent magnesium aluminum spinel ceramics (MgAl2O4) in the range of 0.5-6.5μm is greater than 10%, and the total transmittance in the visible light range is 67-78%; the transmittance of aluminum oxynitride transparent ceramics (AlON) at a wavelength of 2μm reaches 80.3%, and the transmittance at a wavelength of 632nm is as high as 84.7%.

[0059] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the above method.

[0060] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0061] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides a chip package sealing detection device, which is used to execute any of the above-mentioned embodiments and methods.

[0062] Specifically, the chip package sealing detection device includes a chip carrying device, which is used to carry the chip, immerse the chip into the detection liquid, and take the chip out of the detection liquid.

[0063] The chip package sealing detection device further includes an optical detection module, which is used to determine the sealing of the non-metallic package shell 20 according to the state of the internal metal 40. The optical detection module may specifically include an optical microscope and a camera device.

[0064] The device provided by the embodiment of the present disclosure can quickly identify chip packaging damage or cracks by immersing the chip to be inspected into the inspection liquid. At the same time, it does not require high-cost high-magnification electron microscope photography, thereby reducing the cost of chip packaging sealing inspection and improving inspection efficiency.

[0065] The device of the above embodiment is used to implement the corresponding chip package sealing detection method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0066] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the existence of other identical elements in the process, method, article or device including the above elements.

[0067] The above are only specific embodiments of the present disclosure, which enable those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described above, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip package sealing detection method, characterized in that: The chip comprises a non-metallic packaging shell and internal metal, wherein the non-metallic packaging shell surrounds the internal metal; The method comprises: Immersing the chip in a detection liquid, wherein the detection liquid can chemically react with the internal metal; The chip is taken out from the detection liquid, and the sealing performance of the non-metallic packaging shell is determined according to the state of the internal metal.

2. The method according to claim 1, characterized in that The inner metal includes aluminum.

3. The method according to claim 2, characterized in that The detection liquid is an alkaline liquid.

4. The method according to claim 3, characterized in that The detection liquid is a sodium hydroxide solution.

5. The method according to claim 4, characterized in that The concentration of the sodium hydroxide solution is 5%±2%.

6. The method according to claim 1, characterized in that The surface color of the internal metal after chemical reaction with the detection liquid is different from the surface color after no chemical reaction; The step of judging the sealing performance of the non-metallic packaging shell according to the state of the internal metal includes: If the surface color of the inner metal changes, it is judged that the sealing performance of the non-metallic packaging shell is poor; or if the surface color of the inner metal does not change, it is judged that the sealing performance of the non-metallic packaging shell is good.

7. The method according to claim 6, characterized in that The light transmittance of the non-metallic packaging shell is greater than 50%; The step of judging the sealing performance of the non-metallic packaging shell according to the state of the internal metal includes: Observing the surface color of the internal metal using an optical microscope; If the surface color of the inner metal changes, it is judged that the sealing performance of the non-metallic packaging shell is poor; or if the surface color of the inner metal does not change, it is judged that the sealing performance of the non-metallic packaging shell is good.

8. The method according to claim 1, characterized in that The chip includes a chip circuit, and the internal metal is a metal sealing ring, which is arranged around the chip circuit.

9. The method according to claim 1, characterized in that: The chip is a wafer-level packaged chip.

10. A chip packaging sealing detection device, characterized in that: Used to perform the method according to any one of claims 1 to 9.

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