A new type of high-speed semiconductor ceramic device nondestructive scanning detection equipment

Abstract

The application relates to the technical field of semiconductors, and discloses a novel high-speed semiconductor ceramic device nondestructive scanning detection equipment, which comprises a Y-direction motion mechanism, a Z-direction motion mechanism and an X-direction motion mechanism, the X-direction motion mechanism is installed on the front face of the Z-direction motion mechanism, the Y-direction motion mechanism is installed on the bottom of the Z-direction motion mechanism and is used for Z-direction motion of the Z-direction motion mechanism; the X-direction motion mechanism comprises an X-direction fixed plate, two X-direction linear guides are installed on the upper side and the lower side of the front face of the X-direction fixed plate. The novel high-speed semiconductor ceramic device nondestructive scanning detection equipment is driven by high-speed and high-precision linear motors in X-direction and Y-direction motion of detection scanning, the motion time of detection scanning is greatly reduced, the motion speed is improved, high-precision and high-efficiency nondestructive scanning detection of semiconductor ceramic devices is realized, the inspection time of products is finally reduced, and the demand of efficient inspection of a large number of products is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a new type of high-speed semiconductor ceramic device nondestructive scanning detection equipment. BACKGROUND

[0002] In the semiconductor manufacturing industry, ceramic devices are widely used in various electronic devices due to their excellent performance, such as high hardness, high wear resistance, high corrosion resistance, and good insulation performance. However, with the continuous development of semiconductor technology, the complexity and integration of ceramic devices are also increasing, which puts higher requirements on the quality detection of ceramic devices.

[0003] The existing detection equipment uses a lead screw transmission system for scanning in the vertical three directions, and the vertical Z direction movement is combined with the scanning direction, so that the movement structure cannot meet the high-speed movement requirement, the scanning speed is low, and the time for one plane scanning and multi-layer scanning is too long, which cannot adapt to the inspection requirements of a large number of products, therefore, a new type of high-speed semiconductor ceramic device nondestructive scanning detection equipment is urgently needed. SUMMARY

[0004] The purpose of the present application is to provide a new type of high-speed semiconductor ceramic device nondestructive scanning detection equipment to solve the problems raised in the background.

[0005] In order to solve the above technical problems, the present application provides the following technical scheme: a new type of high-speed semiconductor ceramic device nondestructive scanning detection equipment, comprising a Y direction movement mechanism, a Z direction movement mechanism and an X direction movement mechanism,

[0006] The X direction movement mechanism is installed on the front of the Z direction movement mechanism, and the Y direction movement mechanism is installed on the bottom of the Z direction movement mechanism for Z direction movement of the Z direction movement mechanism.

[0007] The X direction movement mechanism comprises an X direction fixed plate, the upper and lower sides of the front of the X direction fixed plate are each provided with two X direction linear guides, the upper sides of the two X direction linear guides are each provided with an X direction sliding block, the two X direction sliding blocks are each fixed with the same X direction moving plate, the rear side of the middle of the X direction moving plate is fixed with a mover of a linear motor, the front of the X direction moving plate is fixed with a probe mounting plate, the front of the probe mounting plate is fixedly connected with an amplifier mounting seat, the amplifier mounting seat is fixedly connected with a pulse transmitter-receiver, the front of the probe mounting plate is provided with a detection probe, and the middle of the X direction fixed plate is provided with a stator of a linear motor.

[0008] Preferably, the detection probe controls the current of the mover coil of the linear motor through the motion controller to realize high-speed and high-precision movement of the detection probe in the X direction to detect the product below.

[0009] The X-direction movement mechanism is driven by a linear motor, the mover of the linear motor is fixed on the X-direction moving plate, and the stator is installed on the X-direction fixed plate. When the motion controller controls the current of the mover coil of the linear motor, the mover will generate a corresponding electromagnetic force to make linear motion in the magnetic field generated by the stator. Since the mover is fixedly connected with the X-direction moving plate, the linear motion of the mover will drive the X-direction moving plate and all components (including the probe mounting plate, the amplifier mounting seat, the pulse transmitter and receiver, the detection probe, etc.) thereon to move.

[0010] Preferably, the Z-direction movement mechanism comprises a Z-direction mounting plate, the front surface of the Z-direction mounting plate is provided with two Z-direction linear guides, two Z-direction sliders are respectively arranged on each Z-direction linear guide in sliding mode, two upper and lower screw rod seats are installed on the front surface of the Z-direction mounting plate, a ball screw is installed between the two screw rod seats, a screw nut is arranged on the outer side of the ball screw, a screw nut connecting block is installed at the bottom of the screw nut, a first synchronous wheel is fixedly connected to the top of the ball screw, a Z-direction servo motor is installed on the back surface of the Z-direction mounting plate, and a second synchronous wheel is fixedly connected to the output end of the Z-direction servo motor.

[0011] Preferably, the first synchronous wheel is connected with the second synchronous wheel on the Z-direction servo motor through a synchronous belt, so as to realize the rotation driving of the ball screw by the Z-direction servo motor and drive the screw nut to move up and down in the Z-direction.

[0012] Preferably, the front surfaces of the Z-direction sliders on the two Z-direction linear guides are fixedly connected with the X-direction fixed plate respectively.

[0013] The Z-direction movement mechanism is driven by the Z-direction servo motor, the second synchronous wheel at the output end of the Z-direction servo motor is connected with the first synchronous wheel of the ball screw through a synchronous belt, when the Z-direction servo motor rotates, it will drive the synchronous belt and the first synchronous wheel to rotate, and in turn drive the ball screw to rotate. When the ball screw rotates, the screw nut thereon will move linearly in the spiral groove of the ball screw. The screw nut is fixedly connected with the X-direction fixed plate through the screw nut connecting block, so that the linear motion of the screw nut will drive the X-direction fixed plate and all components (including the X-direction movement mechanism and the detection probe) thereon to move up and down in the Z-direction (i.e. the vertical direction).

[0014] Preferably, the Y-direction movement mechanism comprises a table top, two mounting seats are fixedly connected to the top of the table top, a Y-direction linear guide is installed on each mounting seat, a Y-direction slider is installed on each Y-direction linear guide, the top of each Y-direction slider is fixedly connected with the same slider mounting plate, and two auxiliary support plates are bolted to the top of the slider mounting plate.

[0015] The Y-axis motion mechanism is achieved through a Y-axis linear guide and a Y-axis slider. The Y-axis linear guide is mounted on a mounting base on the platform, and the Y-axis slider slides on it. When Y-axis motion is required, the Y-axis slider can be driven by a corresponding linear motor to slide on the Y-axis linear guide. Since the slider mounting plate is fixedly connected to the Y-axis slider, the sliding of the Y-axis slider will drive the slider mounting plate and all its components, including the Z-axis motion mechanism and the X-axis motion mechanism, to move in the Y-axis direction, which is horizontal and perpendicular to the X-axis.

[0016] Preferably, the ends of the two auxiliary support plates that are close to each other are fixedly connected to the Z-axis mounting plate.

[0017] Preferably, the device is driven by a linear motor at each position in the X and Y directions, thereby achieving high-speed and high-precision movement of the detection probe and improving the inspection efficiency of the device.

[0018] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0019] First, this invention uses high-speed, high-precision linear motors to drive the X and Y direction movements of the detection scan, which greatly reduces the motion time of the detection scan, reduces the impact of structural load on the scanning motion, and increases the motion speed. This enables high-precision, high-efficiency non-destructive scanning detection of semiconductor ceramic devices, ultimately reducing the inspection time of products and meeting the need for efficient inspection of a large number of products. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention from the rear side view;

[0022] Figure 3 This is a schematic diagram of the X-axis motion mechanism of the present invention;

[0023] Figure 4 This is a schematic diagram of the Z-axis motion mechanism of the present invention.

[0024] The components are as follows: 11. X-axis fixed plate; 12. X-axis linear guide rail; 13. X-axis slider; 14. X-axis moving plate; 15. Mover; 16. Probe mounting plate; 17. Amplifier mounting base; 18. Pulse transmitter and receiver; 19. Detection probe; 20. Stator; 21. Z-axis mounting plate; 22. Z-axis linear guide rail; 23. Z-axis slider; 24. Lead screw seat; 25. Ball screw; 26. Lead screw nut; 27. Lead screw nut connecting block; 28. First synchronous pulley; 29. ​​Z-axis servo motor; 30. Second synchronous pulley; 31. Synchronous belt; 32. Table; 33. Mounting base; 34. Y-axis linear guide rail; 35. Y-axis slider; 36. Slider mounting plate; 37. Auxiliary support plate. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] This invention provides the following technical solutions:

[0027] Example 1

[0028] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 A novel high-speed non-destructive scanning and testing device for semiconductor ceramic devices includes a Y-axis motion mechanism, a Z-axis motion mechanism, and an X-axis motion mechanism.

[0029] The X-axis motion mechanism is installed on the front of the Z-axis motion mechanism, and the Y-axis motion mechanism is installed at the bottom of the Z-axis motion mechanism for the Z-axis motion of the Z-axis motion mechanism.

[0030] The X-axis motion mechanism includes an X-axis fixed plate 11. Two X-axis linear guides 12 are mounted on the upper and lower sides of the front of the X-axis fixed plate 11. X-axis sliders 13 are slidably mounted on the upper sides of the two X-axis linear guides 12. The same X-axis moving plate 14 is fixed on the two X-axis sliders 13. The mover 15 of the linear motor is fixed on the rear side of the middle of the X-axis moving plate 14. A probe mounting plate 16 is fixed on the front of the X-axis moving plate 14. An amplifier mounting base 17 is fixedly connected to the front of the probe mounting plate 16. A pulse transmitter and receiver 18 is fixedly connected to the amplifier mounting base 17. A detection probe 19 is mounted on the front of the probe mounting plate 16. The stator 20 of the linear motor is mounted in the middle of the X-axis fixed plate 11.

[0031] The detection probe 19 controls the current of the moving coil of the linear motor through the motion controller, so as to realize the high-speed and high-precision movement of the detection probe 19 in the X direction to detect the product below.

[0032] Through the above technical solution, the X-axis motion mechanism is driven by a linear motor. The mover 15 of the linear motor is fixed on the X-axis moving plate 14, while the stator 20 is mounted on the X-axis fixed plate 11. When the motion controller controls the current of the mover coil of the linear motor, the mover 15 generates a corresponding electromagnetic force, thereby moving linearly in the magnetic field generated by the stator 20. Since the mover 15 is fixedly connected to the X-axis moving plate 14, the linear motion of the mover 15 will drive the X-axis moving plate 14 and all its components, including the probe mounting plate 16, amplifier mounting base 17, pulse transmitter and receiver 18, and detection probe 19, to move together. This motion is high-speed and high-precision, which can ensure that the detection probe 19 accurately scans and detects the product below in the X-axis, i.e., the horizontal direction. Since the equipment is driven by a linear motor, there is power drive at each position in the X-axis, realizing high-speed and high-precision movement of the detection probe and improving the inspection efficiency of the equipment.

[0033] Example 2

[0034] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 A novel high-speed non-destructive scanning and inspection device for semiconductor ceramic devices includes a Z-axis motion mechanism comprising a Z-axis mounting plate 21, two Z-axis sliders 23 slidably mounted on each Z-axis linear guide rail 22, two upper and lower lead screw seats 24 mounted on the front of the Z-axis mounting plate 21, a ball screw 25 mounted between the two lead screw seats 24, a lead screw nut 26 mounted on the outer side of the ball screw 25, a lead screw nut connecting block 27 mounted at the bottom of the lead screw nut 26, a first synchronous pulley 28 fixedly connected to the top of the ball screw 25, a Z-axis servo motor 29 mounted on the back of the Z-axis mounting plate 21, and a second synchronous pulley 30 fixedly connected to the output end of the Z-axis servo motor 29.

[0035] The first synchronous pulley 28 is connected to the second synchronous pulley 30 on the Z-axis servo motor 29 via the synchronous belt 31, so that the Z-axis servo motor 29 rotates to drive the ball screw 25, which in turn drives the screw nut 26 to move up and down in the Z direction.

[0036] The front sides of the Z-axis sliders 23 on the two Z-axis linear guides 22 are fixedly connected to the X-axis fixing plates 11 respectively.

[0037] Through the above technical solution, the Z-axis motion mechanism is driven by the Z-axis servo motor 29. The second synchronous pulley 30 at the output end of the Z-axis servo motor 29 is connected to the first synchronous pulley 28 of the ball screw 25 through the synchronous belt 31. When the Z-axis servo motor 29 rotates, it will drive the synchronous belt 31 and the first synchronous pulley 28 to rotate together, thereby driving the ball screw 25 to rotate. When the ball screw 25 rotates, the screw nut 26 on it will make linear motion in the spiral groove of the ball screw 25. The screw nut 26 is fixedly connected to the X-axis fixed plate 11 through the screw nut connecting block 27. Therefore, the linear motion of the screw nut 26 will drive the X-axis fixed plate 11 and all its components, including the X-axis motion mechanism and the detection probe 19, to make up-down motion in the Z-axis, i.e., vertical direction.

[0038] Example 3

[0039] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 A novel high-speed non-destructive scanning and inspection device for semiconductor ceramic devices includes a Y-axis motion mechanism comprising a table 32, with two mounting seats 33 fixedly connected to the top of the table 32. Each mounting seat 33 is equipped with a Y-axis linear guide rail 34, and each Y-axis linear guide rail 34 is equipped with a Y-axis slider 35. The top of each Y-axis slider 35 is fixedly connected to the same slider mounting plate 36, and the top of the slider mounting plate 36 is bolted with two auxiliary support plates 37.

[0040] The ends of the two auxiliary support plates 37 that are close to each other are fixedly connected to the Z-direction mounting plate 21.

[0041] The equipment is driven by a linear motor at each position in the X and Y directions, thereby achieving high-speed and high-precision movement of the detection probe 19 and improving the inspection efficiency of the equipment.

[0042] Through the above technical solution, the Y-axis motion mechanism is realized through the Y-axis linear guide 34 and the Y-axis slider 35. The Y-axis linear guide 34 is installed on the mounting base 33 of the table 32, and the Y-axis slider 35 slides on it. When Y-axis motion is required, the Y-axis slider 35 can be driven by a corresponding linear motor to slide on the Y-axis linear guide 34. Since the slider mounting plate 36 is fixedly connected to the Y-axis slider 35, the sliding of the Y-axis slider 35 will drive the slider mounting plate 36 and all its components, including the Z-axis motion mechanism and the X-axis motion mechanism, to move together in the Y-axis, that is, horizontal and perpendicular to the X-axis. The equipment is driven by linear motors at each position in the Y-axis, realizing high-speed and high-precision movement of the detection probe and improving the inspection efficiency of the equipment.

[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel high-speed non-destructive scanning and testing device for semiconductor ceramic devices, comprising a Y-axis motion mechanism, a Z-axis motion mechanism, and an X-axis motion mechanism, characterized in that: The X-axis motion mechanism is installed on the front of the Z-axis motion mechanism, and the Y-axis motion mechanism is installed at the bottom of the Z-axis motion mechanism for Z-axis motion of the Z-axis motion mechanism. The X-axis motion mechanism includes an X-axis fixed plate (11). Two X-axis linear guides (12) are installed on the upper and lower sides of the front of the X-axis fixed plate (11). X-axis sliders (13) are slidably arranged on the two X-axis linear guides (12). The same X-axis moving plate (14) is fixed on the two X-axis sliders (13). The mover (15) of the linear motor is fixed on the rear side of the middle of the X-axis moving plate (14). A probe mounting plate (16) is fixed on the front of the X-axis moving plate (14). An amplifier mounting base (17) is fixedly connected to the front of the probe mounting plate (16). A pulse transmitter receiver (18) is fixedly connected to the amplifier mounting base (17). A detection probe (19) is installed on the front of the probe mounting plate (16). The stator (20) of the linear motor is installed in the middle of the X-axis fixed plate (11). The Z-axis motion mechanism includes a Z-axis mounting plate (21). Two Z-axis linear guides (22) are mounted on the front of the Z-axis mounting plate (21). Two Z-axis sliders (23) are slidably arranged on each Z-axis linear guide (22). Two upper and lower lead screw seats (24) are mounted on the front of the Z-axis mounting plate (21). A ball screw (25) is installed between the two lead screw seats (24). A lead screw nut (26) is provided on the outer side of the ball screw (25). A lead screw nut connecting block (27) is installed at the bottom of the lead screw nut (26). A first synchronous pulley (28) is fixedly connected to the top of the ball screw (25). A Z-axis servo motor (29) is mounted on the back of the Z-axis mounting plate (21). A second synchronous pulley (30) is fixedly connected to the output end of the Z-axis servo motor (29). The first synchronous pulley (28) is connected to the second synchronous pulley (30) on the Z-axis servo motor (29) via the synchronous belt (31), so that the Z-axis servo motor (29) rotates to drive the ball screw (25), which in turn drives the screw nut (26) to move up and down in the Z direction. The Y-axis motion mechanism includes a platform (32), and two mounting seats (33) are fixedly connected to the top of the platform (32). Each mounting seat (33) is equipped with a Y-axis linear guide rail (34), and each Y-axis linear guide rail (34) is equipped with a Y-axis slider (35). The top of each Y-axis slider (35) is fixedly connected to the same slider mounting plate (36), and the top of the slider mounting plate (36) is bolted with two auxiliary support plates (37).

2. The novel high-speed non-destructive scanning and testing equipment for semiconductor ceramic devices according to claim 1, characterized in that: The detection probe (19) controls the current of the moving coil of the linear motor through the motion controller, so as to realize the high-speed and high-precision movement of the detection probe (19) in the X direction to detect the product below.

3. The novel high-speed non-destructive scanning and testing equipment for semiconductor ceramic devices according to claim 1, characterized in that: The front sides of the Z-axis sliders (23) on the two Z-axis linear guides (22) are fixedly connected to the X-axis fixing plates (11).

4. The novel high-speed non-destructive scanning and testing equipment for semiconductor ceramic devices according to claim 1, characterized in that: The two auxiliary support plates (37) are fixedly connected to the Z-axis mounting plate (21) at their closest points.

5. The novel high-speed non-destructive scanning and testing equipment for semiconductor ceramic devices according to claim 1, characterized in that: The device is driven by a linear motor at each position in the X and Y directions, thereby achieving high-speed and high-precision movement of the detection probe (19) and improving the inspection efficiency of the device.

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