Non-contact in-situ manufacturing method of curved surface conformal resistor

Abstract

The invention discloses a non-contact in-situ manufacturing method of a curved surface conformal resistor. The method comprises the following steps: firstly, carrying out resistance test verification according to manufacturing conditions such as a target resistance value demand and a pin gap, and selecting a resistor paste; path planning is carried out on the piezoelectric spraying device, so that resistance paste spraying liquid drops are accurately deposited to the designated position of the curved surface substrate; carrying out in-situ infrared drying curing and laser sintering functionalization on the printed curved surface conformal resistor; the manufacturing precision of the curved surface conformal resistor is improved through a laser resistance trimming method; and packaging the piezoelectric jet resistor protection layer on the surface of the curved surface conformal resistor. Based on the characteristics of jet printing, complicated path planning and nozzle interference risks of contact printing of the curved surface conformal resistor can be avoided, and meanwhile, the problem of material limitation in the manufacturing process of a high-temperature-resistant resistor material can be solved through laser sintering, so that the problem of stable manufacturing of the curved surface conformal resistor on any curved surface is solved.

Description

Technical Field

[0001] The invention relates to the technical field of resistor element processing and manufacturing, and in particular to a non-contact in-situ manufacturing method for a curved surface conformal resistor. Background Art

[0002] Traditional planar integrated circuits use resistor elements mainly by depositing resistor materials onto insulating substrates through methods such as magnetron sputtering and screen printing resistor paste, and then encapsulating the resistor protective layer to form a planar chip resistor device, which is fixed to the electronic circuit board by mounting or welding. However, in curved electronic circuits, even if the chip-type planar resistors are mounted and fixed using professional equipment, there will be assembly stress at the corners of the chip, resulting in poor reliability of resistor assembly. Fixing resistor elements by welding may affect the electromagnetic properties of curved electronic components. In summary, traditional manufacturing methods cannot meet the requirements for reliable manufacturing of curved conformal resistor elements.

[0003] 3D printing technology provides a new solution for the manufacture of resistor elements. It can directly manufacture resistor elements and flexibly adjust the resistor structure. For example, the patent application named "A method for preparing and adjusting the resistance value of 3D printed resistors" (publication number: CN113628821A) is used. However, for the manufacture of curved conformal resistors, the use of contact printing methods such as extrusion printing is limited by the limitations of the technology itself. On large-scale curved surfaces or complex curved surfaces, the substrate is prone to nozzle interference due to the small receiving distance. The use of non-contact printing methods such as inkjet printing and aerosol jetting is limited by the printing materials and can only print low-viscosity slurries (Ramon E, Sowade E, Martinez-Domingo C, et al. Large-scale fabrication of all-inkjet-printed resistors and WORM memories on flexible polymer films with high yield and stability [J]. Flexible and Printed Electronics, 2021, 6 (1): 015003.).

[0004] High temperature resistant resistor materials require a high temperature tunnel furnace treatment of more than 800°C due to the functional post-processing of resistor materials. For example, in the patent application entitled "A thin film resistor and its preparation method" (publication number: CN118053640A), high temperature resistant resistor materials have been manufactured on high temperature resistant substrates such as ceramics. However, the tunnel furnace sintering method is not suitable for most electronic substrates, and the tunnel furnace sintering method is completely unsuitable for surfaces with existing electronic components. There is currently no mature method for in-situ sintering functionalization of resistor elements. Summary of the invention

[0005] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a non-contact in-situ manufacturing method for curved conformal resistors. The piezoelectric injection method can achieve stable printing of curved conformal resistor elements. At the same time, laser sintering can solve the problem of material limitation in the manufacturing process of high-temperature resistant resistor materials, thereby achieving stable manufacturing of curved conformal resistors on any curved surface.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] A non-contact in-situ manufacturing method for a curved surface conformal resistor comprises the following steps:

[0008] Step S1: According to the information including the resistor pin gap, manufacturing range and target resistance value and the calculated material plane square resistance parameters, the material is selected to match the piezoelectric jet droplet deposition area and thickness for resistance test verification to determine the resistor slurry;

[0009] Step S2: Based on step S1, a three-dimensional model of the curved device is obtained by using computer-aided design software or three-dimensional scanning technology, and the obtained model is subjected to piezoelectric injection path planning, and the piezoelectric deposition droplets on the complex curved surface and the conformal resistance of the curved surface are regulated;

[0010] Step S3: fix the curved substrate on the printing platform, use the piezoelectric jet device to eject the resistor material from the nozzle according to the path set in step S2, and the formed jet droplets are non-contactly deposited on the specified position of the curved substrate to complete the curved conformal resistor printing;

[0011] Step S4: functionalizing the curved conformal resistor in step S3 by in-situ infrared drying and curing and in-situ laser sintering;

[0012] Step S5: testing the resistance of the functionalized curved surface conformal resistor in step S4, and modifying the curved surface conformal resistor using a laser resistance trimming method;

[0013] Step S6: Piezoelectrically jet print the curved surface resistor protection layer on the surface of the functionalized curved surface conformal resistor modified in step S5 to complete the preparation.

[0014] In step S1, the resistor slurry is a high temperature resistant ruthenium slurry with a viscosity of 100-300 Pa.s, and the square resistance is selected from resistors of different orders of magnitude such as 10Ω / □ / mil, 100Ω / □ / mil, 1kΩ / □ / mil, and 10kΩ / □ / mil.

[0015] In step S2, piezoelectric deposition of droplets on complex curved surfaces is performed by adjusting the number of piezoelectric jet dispensing times and the fusion state between consecutive dots.

[0016] In step S2, the control of the resistance value of the conformal resistor on the complex curved surface is achieved by changing the shape and thickness of the piezoelectric jet printed resistor.

[0017] In step S2, the resistance value of the conformal resistor on the complex curved surface is regulated so that the thickness of the piezoelectric jet droplets deposited on the curved surface is 0.03-0.1 mm.

[0018] In step S3, the distance between the nozzle of the piezoelectric injection valve and the surface of the curved substrate is 2 to 6 mm.

[0019] In step S3, the piezoelectric injection valve usage parameters include nozzle diameter, piezoelectric injection valve rise time, piezoelectric injection valve descending time, piezoelectric injection valve opening time, piezoelectric injection valve descending force, and piezoelectric injection valve delay time; adjusting the above parameters can realize dispensing control of the piezoelectric injection device, and then realize control of the manufacturing of curved surface conformal resistor structures and patterns.

[0020] The in-situ infrared drying method in step S4 specifically refers to: using a thermal energy infrared lamp to heat the curved conformal resistor that has been dried and cured at room temperature to 100-150° C. in situ and irradiate for 10-15 minutes to dry it.

[0021] The in-situ laser sintering method in step S4 specifically refers to using continuous laser to directly irradiate the ruthenium resistor material to sinter and solidify the curved conformal resistor, wherein the continuous laser power density is: 0.5*104~10*104W / cm 2 , the laser scanning speed is 1~10mm / s.

[0022] The in-situ laser sintering process in step S4 not only needs to consider the curved surface conformal resistor absorbing light and receiving energy, but also needs to consider the heating of the curved surface substrate during the sintering process.

[0023] Step S5 specifically refers to: clamping the curved conformal resistor on the laser resistance trimming device, using laser to ablate the resistor on the resistor body according to the initial resistance value of the resistor to change the width of the resistor body, and adjusting the resistance value of the curved conformal resistor to its designed value.

[0024] In step S6, the material of the protective layer is polyimide (PI), glass glaze, polyetheretherketone (PEEK), etc. The protective layer is dried and cured by hot air circulation in a curing furnace, thermal radiation curing, and thermal energy infrared lamp irradiation curing.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The present invention provides a non-contact in-situ manufacturing method for a curved conformal resistor. A piezoelectric jet non-contact printing method is used to control the droplet fusion state and the resistor shape to achieve printing and flexible regulation of the curved conformal resistor. Through the research of piezoelectric jet technology and process, stable printing of high-viscosity high-temperature resistant resistors can be achieved. An in-situ infrared drying method is used in combination with a pre-sintering process to achieve solidification and conformal retention of the curved conformal resistor, thereby improving the stability and uniformity of the manufacturing of the curved conformal resistor. An in-situ laser sintering method is used to functionalize the in-situ sintering of the high-temperature resistant resistor, thereby solving the problem of substrate limitation during the manufacturing of the high-temperature resistant resistor material and achieving stable manufacturing of the curved conformal resistor element on any curved surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Schematic diagram of the non-contact in-situ manufacturing process of a curved conformal resistor according to an embodiment of the present invention.

[0028] Figure 2 Schematic diagram of a spherical substrate used in an embodiment of the present invention.

[0029] Figure 3 Schematic diagram of printing a curved surface conformal resistor by a piezoelectric injection device according to an embodiment of the present invention.

[0030] Figure 4 It is a schematic diagram of piezoelectric jet dispensing droplet fusion in an embodiment of the present invention.

[0031] Figure 5 These are photos of piezoelectric jet dispensing droplet fusion in an embodiment of the present invention; the fusion is 5%, 15%, 25%, 50%, 75%, and 90% in sequence.

[0032] Figure 6 This is a fitting curve of the droplet fusion state and the corresponding resistance value according to an embodiment of the present invention.

[0033] Figure 7 Schematic diagram of the combination of droplet fusion state and resistor shape design according to an embodiment of the present invention.

[0034] In the figure: 1-curved substrate; 2-curved conformal resistor; 3-curved circuit; 4-piezoelectric injection valve; 5-piezoelectric injection droplet. DETAILED DESCRIPTION

[0035] In order to explain the purpose and technical scheme of the present invention more clearly, the present invention will be further described below in conjunction with embodiments and drawings. It should be understood that the embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] Example 1: Reference Figure 1, a non-contact in-situ manufacturing method for a curved conformal resistor, comprising the following steps:

[0037] Step S1: According to the information including the resistor pin gap, manufacturing range and target resistance value and the calculated material plane square resistance parameters, the material is selected to match the piezoelectric jet droplet deposition area and thickness for resistance test verification to determine the resistor slurry;

[0038] Step S2: Based on step S1, a three-dimensional model of the curved device is obtained by using computer-aided design software or three-dimensional scanning technology, and the obtained model is subjected to piezoelectric injection path planning, and the piezoelectric deposition droplets on the complex curved surface and the conformal resistance of the curved surface are regulated;

[0039] Step S3: fix the curved substrate on the printing platform, use the piezoelectric jet device to eject the resistor material from the nozzle according to the path set in step S2, and the formed jet droplets are non-contactly deposited on the specified position of the curved substrate 1 to complete the curved conformal resistor printing;

[0040] Step S4: functionalizing the curved conformal resistor in step S3 by in-situ infrared drying and curing and in-situ laser sintering;

[0041] Step S5: testing the resistance of the functionalized curved surface conformal resistor in step S4, and modifying the curved surface conformal resistor using a laser resistance trimming method;

[0042] Step S6: Piezoelectrically jet print the curved surface resistor protection layer on the surface of the functionalized curved surface conformal resistor modified in step S5 to complete the preparation.

[0043] like Figure 2 As shown, the curved substrate 1 of this embodiment is a spherical surface, and a curved conformal resistor 2 and a curved circuit 3 are manufactured on the curved substrate 1; the target resistance at different curvatures of the curved substrate 1 is designed to be 200Ω±10%, and the electrode spacing is 0.5mm; the thickness is based on the actual printing thickness, 20-50μm; the printed resistor slurry is a high-temperature resistant ruthenium resistor slurry, with a square resistance of 150±10Ω / □ / mil and a viscosity of 150±30Pa.s. The traditional sintering method is tunnel furnace atmospheric atmosphere sintering, with a peak temperature of 850±5°C and a peak time of 9-11min; the equipment is a piezoelectric jet valve composite six-degree-of-freedom robotic arm.

[0044] By editing the motion trajectory of the robot arm, the posture is adjusted according to different curvatures so that the piezoelectric injection valve 4 deposits the piezoelectric injection droplet 5 at a specified position on the curved substrate 1 in a non-contact manner along the normal direction of the curved substrate 1 when working, such as Figure 3As shown in the figure; after the piezoelectric jet resistor printing is completed, it is dried and leveled at room temperature for 2 minutes and heated by infrared thermal lamp for curved surface conformal. The infrared heating power is 100W~200W, and the power is slowly increased to increase the temperature. The temperature is raised to 100-120℃ for 12-15 minutes; after the pre-sintering and curing steps are completed, the functionalized resistor paste is sintered by continuous laser irradiation through the defocused surface sintering process. Because the printed resistor layer is thick, multiple laser scans are required, and the laser power is reduced by 0.5*104W / cm 2 , where the continuous laser power density is: 1.0*104~2*104W / cm 2 ; The scanning speed increases by 0.5mm / s, and the laser scanning speed is 3-10mm / s.

[0045] The thickness of the curved surface conformal resistor functionalized by laser sintering is 40μm±5μm, and the bonding strength with the curved surface substrate is ≥1N / mm; first, the functionalized curved surface conformal resistor is compared with the target value, and laser resistance adjustment is performed if the resistance value is too large. If the resistance value is too small or other resistance values ​​differ too much, the resistance value is adjusted by re-optimizing the process parameters and the curved surface conformal resistor structure shape.

[0046] The curved substrate 1 is reliably fixed on the laser resistance trimming machine using a clamp, the curved conformal resistor 2 is in good contact with the curved circuit 3 and the resistance value is tested to be stable, the resistance value of the functionalized curved conformal resistor 2 is measured and compared with the target resistance, and the resistance value of the laser resistance trimming pattern cutting resistor is designed to adjust the resistance value to the design value of the curved conformal resistor, with a resistance accuracy within ±3%; the resistance value of the manufactured curved conformal resistor is compared with the target value, and if it meets the requirements, the surface protection layer of the curved conformal resistor that has been trimmed is packaged, the packaging technology is piezoelectric injection, and the packaging material is polyimide (PI) material. After printing is completed, a thermal infrared lamp is used to heat and polymerize the PI material, and the power of the infrared thermal lamp is 500W.

[0047]

[0048] Embodiment 2: The difference from embodiment 1 is: refer to Figure 4 , by controlling the droplet fusion state of different droplet jetting intervals, such as designing the fusion ratio of 5%, 25%, 50%, 75%, and 95%; the electrode spacing is 6mm, and the thickness is based on the actual printing thickness, which is 80μm to 100μm; the printed resistor paste is a high-temperature resistant ruthenium resistor paste with a square resistance of 220±10Ω / □ / mil. The traditional sintering method is tunnel furnace atmospheric sintering, with a peak temperature of 850±5℃ and a peak time of 9 to 11min; the equipment is a piezoelectric jet valve composite three-axis 3D printing platform.

[0049] The computer program with different spraying distances is designed according to the size of the spray droplets through computer-aided software. The three-axis 3D printing platform is input to make the droplets deposited at the specified position of the substrate. After the piezoelectric jet resistor printing is completed, it is dried and leveled at room temperature for 2 minutes and heated by infrared thermal lamp for conformal. The infrared heating power is 200W~500W, and the power is slowly increased to increase the temperature to 120-150℃ for 10-12 minutes. After completing the pre-sintering and curing steps, continuous laser irradiation is used to sinter the functionalized resistor paste through the defocused surface sintering process. Because the thickness of the printed resistor layer is relatively thick, multiple laser scans are required, and the laser power is reduced by 1.0*104W / cm 2 , the scanning speed increases by 0.5mm / s, and the continuous laser power density is: 5.0*104~10*104W / cm 2 , the laser scanning speed is 1~3mm / s, such as Figure 5 From left to right, the fusion ratios are 5%, 15%, 25%, 50%, 75%, and 95%. It can be seen that the shapes obtained by different droplet fusion ratios are different. It is foreseeable that different numbers of droplets at the same length fuse in different ratios to change the thickness and morphology of the formed resistor structure, and ultimately change the resistance value of the manufactured resistor structure, thereby achieving resistance value regulation.

[0050] The resistance value of the laser functionalized resistors was tested, and the resistance values ​​obtained by the test and the resistances manufactured with different fusion ratios were curve fitted, such as Figure 6 As shown, the relationship between the droplet fusion ratio and the corresponding resistor value can be obtained. It can be seen that as the droplet fusion ratio increases, the resistance value of the manufactured resistor structure decreases according to a certain rule. Figure 7 As shown, the resistance value is adjusted by designing the resistance structure by combining different droplet fusion states with different resistor shapes such as straight line type, broken line type, "M" type, etc.

[0051] It should be noted that the above embodiments are only examples and cannot limit the scope of the present invention. Any changes and improvements made by ordinary technicians in this field within the scope of the present invention should be within the scope of patent protection of the present invention.

Claims

1. A non-contact in-situ manufacturing method for a curved surface conformal resistor, characterized in that: The following steps are involved: Step S1: According to the information including the resistor pin gap, manufacturing range and target resistance value and the calculated material plane square resistance parameters, the material is selected to match the piezoelectric jet droplet deposition area and thickness for resistance test verification to determine the resistor slurry; Step S2: Based on step S1, a three-dimensional model of the curved device is obtained by using computer-aided design software or three-dimensional scanning technology, and the obtained model is subjected to piezoelectric injection path planning, and the piezoelectric deposition droplets on the complex curved surface and the conformal resistance of the curved surface are regulated; Step S3: fix the curved substrate on the printing platform, use the piezoelectric jet device to eject the resistor material from the nozzle according to the path set in step S2, and the formed jet droplets are non-contactly deposited on the specified position of the curved substrate to complete the curved conformal resistor printing; Step S4: functionalizing the curved conformal resistor in step S3 by in-situ infrared drying and curing and in-situ laser sintering; Step S5: testing the resistance of the functionalized curved surface conformal resistor in step S4, and modifying the curved surface conformal resistor using a laser resistance trimming method; Step S6: Piezoelectrically jet print the curved surface resistor protection layer on the surface of the functionalized curved surface conformal resistor modified in step S5 to complete the preparation.

2. The method according to claim 1, characterized in that: In step S1, the resistor slurry is a high temperature resistant ruthenium slurry with a viscosity of 100 to 300 Pa.s.

3. The method according to claim 1, characterized in that: In step S2, piezoelectric deposition of droplets on complex curved surfaces is performed by adjusting the number of piezoelectric jet dispensing times and the fusion state between consecutive dots.

4. The method according to claim 1, characterized in that: In step S2, the control of the resistance value of the conformal resistor on the complex curved surface is achieved by changing the shape and thickness of the piezoelectric jet printed resistor.

5. The method according to claim 1, characterized in that: In step S3, the distance between the nozzle of the piezoelectric injection valve and the surface of the curved substrate is 2 to 6 mm.

6. The method according to claim 1, characterized in that: In step S3, the piezoelectric injection valve usage parameters include nozzle diameter, piezoelectric injection valve rise time, piezoelectric injection valve descending time, piezoelectric injection valve opening time, piezoelectric injection valve descending force, and piezoelectric injection valve delay time; adjusting the above parameters can realize dispensing control of the piezoelectric injection device, and then realize control of the manufacturing of curved surface conformal resistor structures and patterns.

7. The method according to claim 1, characterized in that: The in-situ infrared drying method in step S4 specifically refers to: using a thermal energy infrared lamp to heat the curved conformal resistor that has been dried and cured at room temperature to 100-150° C. in situ and irradiate for 10-15 minutes to dry it.

8. The method according to claim 1, characterized in that: The in-situ laser sintering method in step S4 specifically refers to using continuous laser to directly irradiate the ruthenium resistor material to sinter and solidify the curved conformal resistor, wherein the continuous laser power density is: 0.5*104~10*104W / cm 2 , the laser scanning speed is 1~10mm / s.

9. The method according to claim 1, characterized in that: Step S5 specifically refers to: clamping the curved conformal resistor on the laser resistance trimming device, using laser to ablate the resistor on the resistor body according to the initial resistance value of the resistor to change the width of the resistor body, and adjusting the resistance value of the curved conformal resistor to its designed value.

10. The method according to claim 1, characterized in that: In step S6, the material of the protective layer is polyimide (PI), glass glaze or polyetheretherketone (PEEK), and the protective layer is dried and cured by hot air circulation in a curing furnace, thermal radiation curing, or thermal energy infrared lamp irradiation curing.

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