Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component may include a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the main body comprises a first surface and a second surface which are opposite to each other in the first direction; third and fourth surfaces connected to the first and second surfaces and opposed to each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposed to each other in a third direction; the side edge parts are respectively arranged on the fifth surface and the sixth surface; and external electrodes disposed on the third surface and the fourth surface, respectively, and at least one additional pattern spaced apart from the internal electrodes may be disposed in at least one of a region between the internal electrodes and the fifth surface and a region between the internal electrodes and the sixth surface.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2023-0131633 filed in the Korean Intellectual Property Office on October 4, 2023, Korean Patent Application No. 10-2023-0171332 filed in the Korean Intellectual Property Office on November 30, 2023, and Korean Patent Application No. 10-2024-0013673 filed in the Korean Intellectual Property Office on January 30, 2024, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCC, a type of multilayer electronic component) are chip capacitors that are mounted on printed circuit boards of various electronic products (such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones) for charging or discharging therefrom.

[0004] Multilayer ceramic capacitors are used as components in various electronic devices due to their small size, high capacitance, and ease of mounting, and with the miniaturization and high output power of various electronic devices such as computers and mobile devices, the demand for miniaturization and high capacitance of multilayer ceramic capacitors is also increasing.

[0005] In addition, with the recent increase in industry interest in automotive electrical components, multilayer ceramic capacitors also require high reliability and high strength characteristics for use in automotive or infotainment systems.

[0006] In the process of printing the conductive paste for the internal electrode on the molded sheet and stacking the molded sheets printed with the conductive paste for the internal electrode, a slight difference in height between the portion of the molded sheet not printed with the conductive paste and the portion of the molded sheet printed with the conductive paste accumulates, thereby generating a step portion. Specifically, in the case of a general cutting method (having an edge in the width direction) as a conventional technique, the step portion of the width direction edge portion, in which the portion of the molded sheet not printed with the conductive paste is continuously stacked, is much larger than the step portion of the length direction edge portion, in which the portion of the molded sheet printed with the conductive paste and the portion of the molded sheet not printed with the conductive paste are alternately stacked. The step portion may cause the end of each sheet to bend to generate stress, which may cause defects such as delamination where there is a gap between layers.

[0007] Therefore, a method of manufacturing a multilayer ceramic capacitor has been developed as follows: when manufacturing a multilayer ceramic capacitor, the inner electrode is exposed in the width direction of the sheet body, and in a pre-sintering stage after manufacturing such a sheet body, the side edge portions are individually attached to the exposed surface of the inner electrode in the width direction of the sheet body. The above-mentioned method of manufacturing a multilayer ceramic capacitor can remove the step portion by an edgeless design.

[0008] However, since moisture easily penetrates between the side edge portion and the main body, reliability may be reduced, and when the side edge portion is not properly connected to the main body to generate a gap between the side edge portion and the main body, there is a concern that reliability may be further deteriorated. Therefore, a method of improving reliability while suppressing a step portion caused by an internal electrode is required. Summary of the invention

[0009] An aspect of the present disclosure is to improve the reliability of multi-layer electronic components.

[0010] An aspect of the present disclosure is to suppress generation of a step portion due to an internal electrode.

[0011] An aspect of the present disclosure is to suppress the occurrence of delamination between dielectric layers.

[0012] One aspect of the present disclosure is to increase the capacitance per unit volume of a multilayer electronic component.

[0013] However, aspects of the present disclosure are not limited to the above and may be more easily understood in the course of describing specific embodiments of the present disclosure.

[0014] According to one aspect of the present disclosure, a multilayer electronic component may include: a main body, including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and the main body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; side edge portions, respectively arranged on the fifth surface and the sixth surface of the main body; and external electrodes, respectively arranged on the third surface and the fourth surface of the main body, and at least one additional pattern spaced apart from the internal electrodes may be arranged in at least one of a region between the internal electrode and the fifth surface of the main body and a region between the internal electrode and the sixth surface of the main body.

[0015] One of the various effects of the present disclosure is to improve the reliability of a multilayer electronic component.

[0016] One of various effects of the present disclosure is to suppress generation of a step portion due to an internal electrode.

[0017] One of the various effects of the present disclosure is to suppress the occurrence of delamination between dielectric layers.

[0018] One of the various effects of the present disclosure is to improve the capacitance per unit volume of a multilayer electronic component.

[0019] However, the advantages and effects of the present disclosure are not limited to the above and may be more easily understood in the course of describing specific embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an example embodiment of the present disclosure; Figure 2 It is shown Figure 1 A perspective view of a separated main body and side edge portion excluding an external electrode in a multilayer electronic component; Figure 3 is along Figure 1 A cross-sectional view taken along line II'; Figure 4 is along Figure 1 A cross-sectional view taken along line II-II'; Figure 5 is along Figure 1 A cross-sectional view taken along line III-III'; Figure 6 yes Figure 4 An enlarged view of area K1; Figure 7 is according to another exemplary embodiment corresponding to Figure 6 ; Figure 8 is according to another exemplary embodiment corresponding to Figure 6 ; Fig. 9 A ceramic green sheet printed with an internal electrode pattern for manufacturing a multilayer electronic component according to an example embodiment of the present disclosure is shown; Fig.10 is shown where the stack has Fig. 9 A cross-sectional view of a stack of ceramic green sheets in a first direction and a third direction; Fig.11 is a first modification example corresponding to Figure 4 ; Fig.12 is a second modification example corresponding to Figure 4 ; Fig.13is a third modification example corresponding to Figure 4 ; Fig.14 is a fourth modification example corresponding to Figure 4 ; Fig.15 is a fifth modification example corresponding to Figure 4 ; Fig.16 is a sixth modification example corresponding to Figure 4 ; Fig.17 is a seventh modification example corresponding to Figure 4 ; and Fig.18 is a signal signal corresponding to the eighth modification example Figure 4 . DETAILED DESCRIPTION

[0021] Hereinafter, example embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the embodiments of the present disclosure may be shown in many different forms and should not be construed as being limited to the specific embodiments set forth herein. The example embodiments disclosed herein are provided to better explain the present disclosure to those skilled in the art. Therefore, in the accompanying drawings, for the sake of clarity, the shapes and sizes of the elements may be exaggerated, and the same reference numerals will always be used to represent the same or similar elements.

[0022] In addition, in order to clearly describe the present disclosure in the drawings, contents irrelevant to the description are omitted, and although the size (e.g., thickness) of each component shown in the drawings is arbitrarily shown for the convenience of description, the present disclosure is not limited thereto. In addition, components having the same functions within the same conceptual scope are described using the same reference numerals. Throughout the specification, unless otherwise specified, when a part "includes" or "contains" a component, this indicates that other components are not excluded and other components may be further included.

[0023] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0024] Multilayer electronic components Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an example embodiment of the present disclosure.

[0025] Figure 2 It is shown Figure 1 A perspective view of a separated main body and side edge portions excluding external electrodes in a multilayer electronic component.

[0026] Figure 3is along Figure 1 A cross-sectional view taken along line II'.

[0027] Figure 4 is along Figure 1 A cross-sectional view taken along line II-II'.

[0028] Figure 5 is along Figure 1 A cross-sectional view taken along line III-III'.

[0029] Figure 6 yes Figure 4 Magnified view of area K1.

[0030] In the following, reference is made to Figures 1 to 6 , a multilayer electronic component according to an example embodiment of the present disclosure will be described in detail.

[0031] A multilayer electronic component 100 according to an example embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, and the body 110 includes a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 to the fourth surface 4 and opposite to each other in a third direction; side edge portions 114 and 115 respectively arranged on the fifth surface 5 and the sixth surface 6; and external electrodes 131 and 132 respectively arranged on the third surface 3 and the fourth surface 4, and additional patterns 141a, 141b, 142a and 142b spaced apart from the internal electrodes may be arranged in at least one of a region between the internal electrode and the fifth surface and a region between the internal electrode and the sixth surface.

[0032] In the process of printing the conductive paste for the internal electrode on the molded sheet and stacking the molded sheets printed with the conductive paste for the internal electrode, a slight difference in height between the portion of the molded sheet not printed with the conductive paste and the portion of the molded sheet printed with the conductive paste accumulates, thereby generating a step portion. Specifically, in the case of a general cutting method (having an edge in the width direction) as a conventional technique, the step portion of the width direction edge portion, in which the portion of the molded sheet not printed with the conductive paste is continuously stacked, is much larger than the step portion of the length direction edge portion, in which the portion of the molded sheet printed with the conductive paste and the portion of the molded sheet not printed with the conductive paste are alternately stacked. The step portion may cause the end of each sheet to bend to generate stress, which may cause defects such as delamination with gaps between layers.

[0033] Therefore, a method of manufacturing a multilayer ceramic capacitor has been developed as follows: when manufacturing a multilayer ceramic capacitor, the inner electrode is exposed in the width direction of the sheet body, and in a pre-sintering stage after manufacturing such a sheet body, the side edge portions are individually attached to the exposed surface of the inner electrode in the width direction of the sheet body. The above-mentioned method of manufacturing a multilayer ceramic capacitor can remove the step portion by an edgeless design.

[0034] However, reliability may be reduced because moisture easily penetrates between the side edge portion and the body, and when the side edge portion is not properly connected to the body to generate a gap between the side edge portion and the body, there is a concern that reliability may further deteriorate.

[0035] According to an example embodiment of the present disclosure, additional patterns 141a, 141b, 142a, and 142b spaced apart from the internal electrodes 121 and 122 may be disposed in at least one of a region between the internal electrodes 121 and 122 and the fifth surface and a region between the internal electrodes 121 and 122 and the sixth surface, so that stress caused by an external impact can be reduced while suppressing a step portion caused by the internal electrode, and even if moisture penetrates between the side edge portion and the body, it is difficult for moisture to reach the internal electrode, thereby improving moisture resistance reliability.

[0036] Hereinafter, each configuration included in the multilayer electronic component 100 according to the example embodiment of the present disclosure will be described.

[0037] The body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately stacked.

[0038] There is no particular limitation on the specific shape of the body 110, but Figure 1 and Figure 2 As shown, the body 110 may have a hexahedral shape or a shape similar to the hexahedral shape. Due to shrinkage of ceramic powder particles included in the body 110 during a sintering process, the body 110 may not have a hexahedral shape with completely straight lines but may have a substantially hexahedral shape.

[0039] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0040] In a state in which the plurality of dielectric layers 111 included in the body 110 are sintered, adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to identify boundaries between the adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0041] According to an exemplary embodiment of the present disclosure, the material included in the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used. The barium titanate-based material may include BaTiO3-based ceramic powder particles, and examples of the BaTiO3-based ceramic powder particles may include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) formed by partially solid-soluting calcium (Ca) and / or zirconium (Zr) in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0042] As the material included in the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. may be added to powder particles such as barium titanate (BaTiO3) according to the purpose of the present disclosure.

[0043] The inner electrodes 121 and 122 may be alternately arranged with the dielectric layer 111.

[0044] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged to face each other, and the dielectric layer 111 may be interposed between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be respectively exposed to the third surface 3 and the fourth surface 4 of the main body 110.

[0045] In an exemplary embodiment, the inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122 alternately arranged in a first direction, and the dielectric layer 111 may be interposed between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 may be exposed to the third surface, and the second inner electrode 122 may be exposed to the fourth surface.

[0046] Referring to Figures 2 to 4 , the first inner electrode 121 may be spaced apart from the fourth surface 4, the fifth surface 5, and the sixth surface 6 and may be exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3, the fifth surface 5, and the sixth surface 6 and may be exposed through the fourth surface 4.

[0047] In this case, the first and second internal electrodes 121 and 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0048] The internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), and titanium (Ti), and alloys thereof.

[0049] In example embodiments, the average thickness of both end portions of the internal electrodes 121 and 122 in the third direction may be smaller than the average thickness of the central portions of the internal electrodes 121 and 122 in the third direction. According to example embodiments of the present disclosure, even if the additional patterns 141a, 141b, 142a, and 142b are provided, a step portion may be formed in a region where the additional pattern and the internal electrode are spaced apart from each other, and thus, during the pressing process, the average thickness of both end portions of the internal electrodes 121 and 122 in the third direction may be smaller than the average thickness of the central portions of the internal electrodes 121 and 122 in the third direction. However, compared to a case where there is no additional pattern, the difference in average thickness between both end portions and the central portions of the internal electrodes 121 and 122 in the third direction may be smaller.

[0050] In this case, when the inner electrodes 121 and 122 are divided into 10 equal regions in the third direction, the two ends of the inner electrodes 121 and 122 in the third direction may refer to the first region and the last region, and the central portion of the inner electrodes 121 and 122 in the third direction may refer to the second region to the ninth region. As an example of a specific measurement method, a cross section in the first direction and the third direction cut from the center of the body 110 in the second direction may be scanned and measured using a scanning electron microscope (SEM). After selecting 10 inner electrodes from the scanned image, the thickness may be measured at five points spaced apart from each other at equal intervals in the third direction in the two ends of one inner electrode 121 or 122 in the third direction and at five points spaced apart from each other at equal intervals in the third direction in the central portion of one inner electrode 121 or 122 in the third direction, and the values ​​of a total of 50 points at each of the two ends and the central portion of the inner electrodes 121 and 122 in the third direction may be averaged and compared.

[0051] In example embodiments, both ends of the internal electrodes 121 and 122 in the third direction may have a shape bent toward the center of the body in the first direction. Even if the additional patterns 141a, 141b, 142a, and 142b are provided according to example embodiments of the present disclosure, a step portion may be formed in a region where the additional pattern and the internal electrode are spaced apart from each other, and thus, during the pressing process, both ends of the internal electrodes 121 and 122 in the third direction may have a shape bent toward the center of the body in the first direction. However, the degree of bending of both ends of the internal electrodes 121 and 122 in the third direction may be lower than in the case where there is no additional pattern.

[0052] The additional patterns 141 a , 141 b , 142 a , and 142 b may be spaced apart from the internal electrodes 121 and 122 in at least one of a region between the internal electrodes 121 and 122 and the fifth surface and a region between the internal electrodes 121 and 122 and the sixth surface.

[0053] The additional patterns 141a, 141b, 142a, and 142b may be used to relieve the step caused by the internal electrode, and may be used to reduce stress caused by external impact, etc. In addition, the additional patterns 141a, 141b, 142a, and 142b may also be used to absorb stress caused by cutting in the process of cutting the stacked body in units of sheets. In addition, the additional patterns 141a, 141b, 142a, and 142b may be spaced apart from the internal electrodes 121 and 122 and may be provided outside the body 110 to prevent moisture, etc. from reaching the internal electrodes, thereby serving to improve moisture resistance reliability.

[0054] In example embodiments, the additional patterns 141a, 141b, 142a, and 142b may be spaced apart from the third and fourth surfaces of the body 110. Therefore, since the additional patterns 141a, 141b, 142a, and 142b are not connected to the external electrodes 131 and 132, even if moisture or the like penetrates and reaches the additional patterns 141a, 141b, 142a, and 142b, moisture resistance reliability does not deteriorate. In addition, it is not necessary to form the additional patterns 141a, 141b, 142a, and 142b with a material such as an insulating material, and the additional patterns may be printed simultaneously with the printing of the internal electrode patterns using the same paste as that used to form the internal electrodes 121 and 122, thereby improving productivity.

[0055] In example embodiments, a spacing distance W between the additional patterns 141 a , 141 b , 142 a , and 142 b and the internal electrodes 121 and 122 is g1 and W g2 There is no particular limitation, but it may be, for example, 15 μm to 45 μm. g1 and W g2When the thickness is less than 15 μm, the effect of improving the moisture resistance reliability by the additional pattern may be insufficient because the internal electrode and the additional pattern may be electrically connected. g1 and W g2 When it is larger than 45 μm, the capacitance per unit volume of the multilayer electronic component may be deteriorated.

[0056] In example embodiments, among both end portions of the additional patterns 141a, 141b, 142a, and 142b in the third direction, an average thickness of the end portions close to the internal electrodes 121 and 122 may be smaller than an average thickness of the central portion of the additional patterns in the third direction. As described above, a step portion may be formed in a region where the additional patterns 141a, 141b, 142a, and 142b and the internal electrodes 121 and 122 are spaced apart from each other, and thus, in a pressing process, among both end portions of the additional pattern, an end portion close to the internal electrode may have a smaller thickness.

[0057] In example embodiments, among both end portions of the additional patterns 141a, 141b, 142a, and 142b in the third direction, an average thickness of an end portion close to the internal electrodes 121 and 122 may be smaller than an average thickness of the other end portion of the additional pattern contacting one of the side edge portions 114 and 115.

[0058] In addition, among both end portions of the additional patterns 141a, 141b, 142a, and 142b in the third direction, the end portions close to the internal electrodes 121 and 122 may have a shape bent toward the center of the body in the first direction. In this case, the other end portions of the additional patterns 141a, 141b, 142a, and 142b may not be bent toward the center of the body in the first direction.

[0059] The material included in the additional patterns 141a, 141b, 142a, and 142b is not particularly limited. The additional patterns 141a, 141b, 142a, and 142b may be formed by including an insulating material, and may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. In addition, the additional patterns 141a, 141b, 142a, and 142b may be formed using the same material as the internal electrodes 121 and 122, and therefore, may be printed together with the internal electrode patterns, thereby simplifying the process and improving productivity. In addition, in order to improve the stress relief effect, the additional patterns 141a, 141b, 142a, and 142b may include graphene, etc.

[0060] The third direction width W of the additional patterns 141a, 141b, 142a and 142b c1 and W c2 Not particularly limited. For example,c1 and W c2 Each of may be 15 μm to 30 μm.

[0061] Reference Figure 4 and Figure 5 In example embodiments, the additional patterns 141a, 141b, 142a, and 142b may include first additional patterns 141a and 142a disposed in a region between the internal electrodes 121 and 122 and the fifth surface and second additional patterns 141b and 142b disposed in a region between the internal electrodes and the sixth surface.

[0062] In this case, the first additional patterns 141a and 142a may be arranged to contact the fifth surface, and the second additional patterns 141b and 142b may be arranged to contact the sixth surface. In the present disclosure, "the first additional patterns 141a and 142a may be arranged to contact the fifth surface" may mean that the first additional patterns 141a and 142a may be arranged to be exposed to the fifth surface, and "the second additional patterns 141b and 142b may be arranged to contact the sixth surface" may mean that the second additional patterns 141b and 142b may be arranged to be exposed to the sixth surface. Therefore, the first additional patterns 141a and 142a may be arranged to contact the first side edge portion on the fifth surface, and the second additional patterns 141b and 142b may be arranged to contact the second side edge portion on the sixth surface. In addition, during the stacking process, the additional patterns 141a, 141b, 142a and 142b may absorb stress to minimize deformation of the body.

[0063] However, the present disclosure is not limited thereto, and the additional patterns 141a, 141b, 142a, and 142b may have various forms, such as the modified examples described below. For example, the first additional pattern may be spaced apart from the fifth surface, and the second additional pattern may be spaced apart from the sixth surface. For example, the first additional pattern may be spaced apart from the fifth surface, and the second additional pattern may be arranged to contact the sixth surface. For example, the first additional pattern may be arranged to contact the fifth surface, and the second additional pattern may be spaced apart from the sixth surface. In addition, the additional pattern may be arranged only in one of the region between the inner electrode and the fifth surface and the region between the inner electrode and the sixth surface.

[0064] The average thickness td of the dielectric layer 111 is not particularly limited, but may be, for example, 0.05 μm to 3.0 μm. The average thickness te of the internal electrodes 121 and 122 is not particularly limited, but may be, for example, 0.05 μm to 3.0 μm. In addition, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be arbitrarily set according to the desired characteristics or purpose. For example, in the case of a small information technology (IT) electronic component for achieving miniaturization and high capacitance, the average thickness td of the dielectric layer 111 may be 0.4 μm or less, and the average thickness te of the internal electrodes 121 and 122 may be 0.4 μm or less. The average thickness of the additional patterns 141a, 141b, 142a, and 142b is not particularly limited, and may have a thickness similar to that of the internal electrodes 121 and 122.

[0065] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 refer to the average size of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the first and second direction cross sections of the body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, in order to obtain the average thickness td of the dielectric layer 111, the average value can be obtained by measuring the thickness at a plurality of regions (for example, 30 regions spaced apart from each other at equal intervals in the second direction) of one dielectric layer 111. In addition, in order to obtain the average thickness te of the internal electrodes 121 and 122, the average value can be obtained by measuring the thickness at a plurality of regions (for example, 30 regions spaced apart from each other at equal intervals in the second direction) of one internal electrode 121 or 122. 30 regions with equal intervals can be specified in the effective portion Ac to be described later. Furthermore, when an average value is obtained by extending the average value measurement to 10 dielectric layers 111 and 10 internal electrodes 121 and 122 , the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be further generalized.

[0066] The body 110 may include: an effective portion Ac, which is disposed inside the body 110 and forms a capacitor by including a first internal electrode 121 and a second internal electrode 122 disposed to face each other with a dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122; and covering portions 112 and 113 formed above and below the effective portion Ac in a first direction.

[0067] In addition, the effective portion Ac is a portion contributing to the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0068] The upper cover 112 and the lower cover 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in a thickness direction on upper and lower surfaces of the active portion Ac, respectively, and may mainly serve to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0069] The upper cover 112 and the lower cover 113 do not include an internal electrode, and may include the same material as the dielectric layer 111 .

[0070] That is, the upper cover 112 and the lower cover 113 may include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0071] In addition, the thickness of the cover parts 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the cover parts 112 and 113 may be 80 μm or less.

[0072] The average thickness tc of the covering portions 112 and 113 may refer to a first direction average dimension and may be a value obtained by averaging the first direction dimensions of the covering portions 112 and 113 measured at five regions spaced apart from each other at equal intervals in the second direction on the upper or lower portion of the effective portion Ac.

[0073] The side edge parts 114 and 115 may be disposed on the fifth and sixth surfaces of the body 110 .

[0074] The side edge portions 114 and 115 may include a first side edge portion 114 disposed on the fifth surface 5 of the body 110 and a second side edge portion 115 disposed on the sixth surface 6 of the body 110. That is, the side edge portions 114 and 115 may be disposed on both side surfaces of the body 110 in the third direction.

[0075] The side edge parts 114 and 115 may be provided to cover both side surfaces of the cover parts 112 and 113 in the third direction.

[0076] The side margin parts 114 and 115 may mainly serve to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0077] The side margin parts 114 and 115 may be formed by stacking a single dielectric layer or two or more dielectric layers on both side surfaces in the third direction of the body 110. The side margin parts 114 and 115 may have a different composition from the dielectric layer 111, a different grain size from the dielectric layer 111, and a different porosity from the dielectric layer 111. However, the present disclosure is not limited thereto, and the side margin parts 114 and 115 may have the same composition as the dielectric layer 111.

[0078] Reference Figure 6 , an upper end of the side edge portion 114 in the first direction may be disposed on the same plane as the second surface, and a lower end of the side edge portion 114 in the first direction may be disposed on the same plane as the first surface.

[0079] However, the side edge portion does not necessarily have to have such a shape in consideration of manufacturing errors and the like of the side edge portion.

[0080] For example, according to another exemplary embodiment of the present disclosure, Figure 7 As shown, the upper end of the side edge portion 114' in the first direction may be arranged to be lower than the second surface in the first direction, and the lower end of the side edge portion 114' in the first direction may be arranged to be higher than the first surface in the first direction. In this case, the upper end of the side edge portion 114' in the first direction may contact the upper cover portion 112 on the fifth surface, and the lower end of the side edge portion 114' in the first direction may contact the lower cover portion 113 on the fifth surface.

[0081] In addition, according to another exemplary embodiment of the present disclosure, Figure 8 As shown, the upper end of the side edge portion 114'' in the first direction may be arranged to be higher than the second surface in the first direction, and the lower end of the side edge portion 114'' in the first direction may be arranged to be lower than the first surface in the first direction. In this case, at least a portion of the side edge portion 114'' may be arranged on the first surface and the second surface. Here, only reference is made to Figure 6 , Figure 7 and Figure 8 The first side edge portion provided on the fifth surface 5 is described, and since the second side edge portion provided on the sixth surface 6 may have a structure similar to that of the first side edge portion, the description of the second side edge portion is omitted here.

[0082] The average width W of the side edge portions 114 and 115 in the third direction is m1 and W m2 No particular limitation is required. For example, W m1 and W m2 Each of can be 50μm or less, and for miniaturization and high capacitance, W m1 and W m2 Each of may be 20 μm or less. Here, the third direction width of the side margin parts 114 and 115 may refer to a size of the side margin parts 114 and 115 in the third direction.

[0083] In addition, according to an example embodiment of the present disclosure, the internal electrodes 121 and 122 may not be exposed to the fifth and sixth surfaces of the body, and the additional patterns 141a, 141b, 142a, and 142b spaced apart from the internal electrodes 121 and 122 may be disposed in at least one of a region between the internal electrodes 121 and 122 and the fifth surface and a region between the internal electrodes 121 and 122 and the sixth surface, so that the third-direction width of the side margin portions 114 and 115 may be reduced, thereby improving the capacitance per unit volume and ensuring moisture resistance reliability. For example, the average width W of the side margin portions 114 and 115 in the third direction may be less than 100 mm. m1 and W m2 The thickness may be 5 μm or more and 15 μm or less, and may be 5 μm or more and 10 μm or less.

[0084] In addition, the width of each position of the side margins 114 and 115 in the first direction may be substantially the same, and the deviation of the width may be within 5%. This may be because the side margins 114 and 115 are formed by attaching a ceramic green sheet for the side margins to the side surface of the body 110.

[0085] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 .

[0086] The external electrodes 131 and 132 may include first and second external electrodes 131 and 132 that are respectively disposed on the third and fourth surfaces 3 and 4 of the body 110 and connected to the first and second internal electrodes 121 and 122 , respectively.

[0087] Reference Figure 1 , the external electrodes 131 and 132 may be disposed to cover both end surfaces of the side edge portions 114 and 115 in the second direction.

[0088] In this example embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the number or shape of the external electrodes 131 and 132 may be changed according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0089] In example embodiments, the external electrodes 131 and 132 may include a first external electrode 131 disposed on a third surface of the body 110 and a second external electrode 132 disposed on a fourth surface of the body 110, and the first external electrode 131 may cover one end of the side edge portions 114 and 115 in the second direction, and the second external electrode 132 may cover the other end of the side edge portions 114 and 115 in the second direction.

[0090] In addition, the external electrodes 131 and 132 may be formed using any material such as metal as long as the material has conductivity, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may have a multi-layered structure.

[0091] For example, the external electrodes 131 and 132 may include electrode layers 131 a and 132 a disposed on the body 110 and plating layers 131 b and 132 b formed on the electrode layers 131 a and 132 a .

[0092] For a more specific example of the electrode layers 131 a and 132 a , the electrode layers 131 a and 132 a may be fired electrodes including a conductive metal and glass, or may be resin-based electrodes including a conductive metal and resin.

[0093] In addition, the electrode layers 131a and 132a can be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal to the main body, or can be formed by transferring a sheet including a conductive metal to the fired electrode.

[0094] As the conductive metal included in the electrode layers 131a and 132a, a material having excellent conductivity may be used without particular limitation. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0095] The plating layers 131b and 132b may be used to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and the plating layers 131b and 132b may be plating layers including one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0096] For a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, or may be a form in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, or may be a form in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed on the electrode layers 131a and 132a. In addition, the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0097] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0098] However, in order to achieve both miniaturization and high capacitance, the thickness of the dielectric layer and the internal electrode must be thinned to increase the number of stacks, and therefore, the reliability improvement effect according to the present disclosure may be more significant in a multilayer electronic component 100 having a size of 1005 (length×width, 1.0 mm×0.5 mm) or less.

[0099] Considering manufacturing errors, external electrode sizes, etc., when the length of the multilayer electronic component 100 is 1.1 mm or less and the width of the multilayer electronic component 100 is 0.55 mm or less, the effect of improving reliability and capacitance per unit volume according to the present disclosure may be more significant. Here, the length of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0100] Fig. 9 A ceramic green sheet printed with an internal electrode pattern for manufacturing a multilayer electronic component according to an example embodiment of the present disclosure is illustrated. Fig.10 Shown by stacking Fig. 9 The first direction and the third direction cross-section of the stacked body obtained by the ceramic green sheets.

[0101] Reference Fig. 9 and Fig.10 , a method of manufacturing a multilayer electronic component according to an example embodiment of the present disclosure will be described.

[0102] First, in Fig. 9 After the internal electrode pattern 120 and the additional pattern 140 are printed on the ceramic green sheet 10 shown, a plurality of ceramic green sheets 10 are stacked and pressed to form a stacked body 10 ′.

[0103] Then, refer to Fig.10 , the stacked body 10' can be cut by selecting reference cutting lines C1 and C2 based on the additional pattern 140, thereby obtaining the main body of the unit sheet. Fig.10 When the stacked body 10 ′ is accurately cut along the reference cutting lines C1 and C2 , the additional pattern 140 may be exposed to the fifth and sixth surfaces of the body.

[0104] Then, when Figure 2 When one or more dielectric sheets for side edge portions are attached to the fifth and sixth surfaces of the body as shown, the first additional patterns 141a and 142a can be arranged to contact the first side edge portion on the fifth surface, and the second additional patterns 141b and 142b can be arranged to contact the second side edge portion on the sixth surface.

[0105] Then, after performing a sintering process, a multilayer electronic component may be obtained by forming the external electrodes 131 and 132 on the third and fourth surfaces of the body 110 .

[0106] On the other hand, when dispersion occurs during cutting, the stacked body 10 ′ cannot be accurately cut according to the reference cutting lines C1 and C2 and may be cut on the left side A1 or right side B1 of the first reference cutting line C1 or may be cut on the left side A2 or right side B2 of the second reference cutting line C2.

[0107] The multilayer electronic component according to the example embodiment of the present disclosure may have various forms of modified examples according to the spread of the cutting process, as described below.

[0108] Fig.11 is a first modification example corresponding to Figure 4 When cutting on the left side A1 of the first reference cutting line C1 and the left side A2 of the second reference cutting line C2, as shown in FIG. Fig.11 As shown, a multilayer electronic component 100-1 in which the additional patterns 141a-1 and 142a-1 are disposed only between the first side margin portion 114 and the internal electrodes 121 and 122 can be obtained. Fig.11 As shown, the additional patterns 141 a - 1 and 142 a - 1 may have a shape spaced apart from the first side margin portion 114 .

[0109] Fig.12 is a second modification example corresponding to Figure 4 When cutting on the left side A2 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.12 As shown, a multilayer electronic component 100-2 can be obtained in which the additional patterns 141a-2 and 142a-2 are disposed only between the first side margin portion 114 and the internal electrodes 121 and 122. Fig.12 As shown, the additional patterns 141 a - 2 and 142 a - 2 may have a shape in contact with the first side margin portion 114 .

[0110] Fig.13 is a third modification example corresponding to Figure 4 When cutting on the right side B1 of the first reference cutting line C1 and the right side B2 of the second reference cutting line C2, as shown in FIG. Fig.13 As shown, a multilayer electronic component 100-3 in which the additional patterns 141b-3 and 142b-3 are disposed only between the second side margin portion 115 and the internal electrodes 121 and 122 can be obtained. Fig.13 As shown, the additional patterns 141 b - 3 and 142 b - 3 may have a shape spaced apart from the second side margin portion 115 .

[0111] Fig.14 is a fourth modification example corresponding to Figure 4 When cutting on the right side B1 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.14 As shown, a multilayer electronic component 100-4 in which the additional patterns 141b-4 and 142b-4 are disposed only between the second side margin portion 115 and the internal electrodes 121 and 122 can be obtained. Fig.14 As shown, the additional patterns 141 b - 4 and 142 b - 4 may have a shape in contact with the second side margin portion 115 .

[0112] Fig.15 is a fifth modification example corresponding to Figure 4 When cutting on the left side A1 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.15 As shown, a multilayer electronic component 100-5 can be obtained in which the first additional patterns 141a-5 and 142a-5 are disposed between the first side margin portion 114 and the internal electrodes 121 and 122 and the second additional patterns 141b-5 and 142b-5 are disposed between the second side margin portion 115 and the internal electrodes 121 and 122. Fig.15 As shown, the first additional patterns 141 a - 5 and 142 a - 5 may be spaced apart from the first side margin portion 114 , and the second additional patterns 141 b - 5 and 142 b - 5 may contact the second side margin portion 115 .

[0113] Fig.16 is a sixth modification example corresponding to Figure 4 When cutting on the right side B2 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.16 As shown, a multilayer electronic component 100-6 in which the first additional patterns 141a-6 and 142a-6 are disposed between the first side margin portion 114 and the internal electrodes 121 and 122 and the second additional patterns 141b-6 and 142b-6 are disposed between the second side margin portion 115 and the internal electrodes 121 and 122 can be obtained. Fig.16 As shown, the first additional patterns 141 a - 6 and 142 a - 6 may contact the first side margin portion 114 , and the second additional patterns 141 b - 6 and 142 b - 6 may be spaced apart from the second side margin portion 115 .

[0114] Fig.17 is a seventh modification example corresponding to Figure 4 When cutting on the left side A1 of the first reference cutting line C1 and the right side B2 of the second reference cutting line C2, as shown in FIG. Fig.17As shown, a multilayer electronic component 100-7 may be obtained in which the first additional patterns 141a-7 and 142a-7 may be disposed between the first side margin portion 114 and the internal electrodes 121 and 122 and the second additional patterns 141b-7 and 142b-7 are disposed between the second side margin portion 115 and the internal electrodes 121 and 122. Fig.17 As shown, the first additional patterns 141 a - 7 and 142 a - 7 may be spaced apart from the first side margin portion 114 , and the second additional patterns 141 b - 7 and 142 b - 7 may be spaced apart from the second side margin portion 115 .

[0115] Fig.18 is a signal signal corresponding to the eighth modification example Figure 4 When cutting on the right side B1 of the first reference cutting line C1 and the left side A2 of the second reference cutting line C2, as shown in FIG. Fig.18 As shown, a multilayer electronic component 100-8 without an additional pattern can be obtained. Even if the multilayer electronic component 100-8 does not include an additional pattern, the additional pattern 140 can be used to absorb cutting stress during the cutting process and can have an effect of suppressing delamination between dielectric layers.

[0116] Although the exemplary embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and the accompanying drawings, but is defined by the appended claims. Therefore, those of ordinary skill in the art may make various substitutions, modifications or changes without departing from the scope of the present disclosure defined by the appended claims, and these substitutions, modifications or changes should be interpreted as being included within the scope of the present disclosure.

[0117] In addition, the expression "exemplary embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and explain different unique features. However, the embodiment presented above does not exclude the combination of features with another embodiment. For example, although the content described in a specific embodiment is not described in another embodiment, the content can be understood as a description related to another embodiment, unless there is a description contrary to or contradictory to the content in another embodiment.

[0118] In the present disclosure, the terms are used only to describe specific embodiments and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, a singular form may also include a plural form.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the third direction; Side edge portions, respectively disposed on the fifth surface and the sixth surface of the main body; as well as external electrodes, respectively disposed on the third surface and the fourth surface of the body, wherein at least one additional pattern spaced apart from the internal electrode is disposed in at least one of a region between the internal electrode and the fifth surface of the body and a region between the internal electrode and the sixth surface of the body.

2. The multilayer electronic component according to claim 1, wherein An average thickness of both end portions of at least one of the internal electrodes in the third direction is smaller than an average thickness of a central portion of the at least one of the internal electrodes in the third direction.

3. The multilayer electronic component according to claim 1, wherein: Both end portions of at least one of the internal electrodes in the third direction have a shape bent toward the center of the body in the first direction.

4. The multilayer electronic component according to claim 1, wherein: The at least one additional pattern is spaced apart from the third surface and the fourth surface of the body.

5. The multilayer electronic component according to claim 1, wherein The at least one additional pattern is spaced apart from the internal electrode by a distance of 15 μm to 45 μm in the third direction.

6. The multilayer electronic component according to claim 1, wherein: Among both end portions of the at least one additional pattern in the third direction, an average thickness of an end portion close to the internal electrode is smaller than an average thickness of a central portion of the at least one additional pattern in the third direction.

7. The multilayer electronic component according to claim 1, wherein: Of both ends of the at least one additional pattern in the third direction, an end close to the internal electrode has an average thickness smaller than an average thickness of the other end of the at least one additional pattern contacting one of the side edge portions.

8. The multilayer electronic component according to claim 1, wherein Among both end portions of the at least one additional pattern in the third direction, an end portion close to the internal electrode has a shape bent toward a center of the body in the first direction.

9. The multilayer electronic component according to claim 1, wherein: An upper end of at least one of the side edge portions in the first direction is arranged on the same plane as the second surface of the main body, and a lower end of at least one of the side edge portions in the first direction is arranged on the same plane as the first surface of the main body.

10. The multilayer electronic component according to claim 1, wherein An upper end of at least one of the side edge portions in the first direction is arranged to be lower than the second surface of the main body in the first direction, and a lower end of at least one of the side edge portions in the first direction is arranged to be higher than the first surface of the main body in the first direction.

11. The multilayer electronic component according to claim 1, wherein An upper end of at least one of the side edge portions in the first direction is arranged to be higher than the second surface of the main body in the first direction, and a lower end of at least one of the side edge portions in the first direction is arranged to be lower than the first surface of the main body in the first direction.

12. The multilayer electronic component according to claim 1, wherein The at least one additional pattern includes a first additional pattern disposed in a region between the internal electrode and the fifth surface of the body and a second additional pattern disposed in a region between the internal electrode and the sixth surface of the body.

13. The multilayer electronic component according to claim 12, wherein: The first additional pattern is disposed to contact the fifth surface of the body, and the second additional pattern is disposed to contact the sixth surface of the body.

14. The multilayer electronic component according to claim 12, wherein: The first additional pattern is disposed to contact the fifth surface of the body, and the second additional pattern is disposed to be spaced apart from the sixth surface of the body.

15. The multilayer electronic component according to claim 12, wherein: The first additional pattern is spaced apart from the fifth surface of the body, and the second additional pattern is spaced apart from the sixth surface of the body.

16. The multilayer electronic component according to claim 1, wherein The at least one additional pattern is disposed only in one of a region between the internal electrode and the fifth surface of the body and a region between the internal electrode and the sixth surface of the body.

17. The multilayer electronic component according to claim 1, wherein: The external electrodes include a first external electrode disposed on the third surface of the body and a second external electrode disposed on the fourth surface of the body, and The first external electrode covers one end of at least one of the side margin portions in the second direction, and the second external electrode covers the other end of the at least one of the side margin portions in the second direction.

18. The multilayer electronic component according to claim 1, wherein The side margin portion has a different composition than the dielectric layer.

19. The multilayer electronic component according to claim 18, wherein: The side margin portion has a different grain size from that of the dielectric layer and a different porosity from that of the dielectric layer.

20. The multilayer electronic assembly of claim 1, wherein: The side margin portion has the same composition as the dielectric layer.

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