Multilayer electronic component and method of manufacturing the same

Abstract

The present disclosure provides a multilayer electronic component and a method of manufacturing the same. The multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the first surface and the second surface are opposite to each other in the first direction, the third surface and the fourth surface are connected to the first surface and the second surface and are opposite to each other in the second direction, and the fifth surface and the sixth surface are connected to the first surface to the fourth surface and are opposite to each other in the third direction; the side edge parts are respectively arranged on the fifth surface and the sixth surface; and outer electrodes disposed on the third surface and the fourth surface, respectively, in which at least one of both end portions of the inner electrodes in the third direction is spaced apart from a corresponding side edge portion and has an average thickness smaller than an average thickness of a center portion of the inner electrodes in the third direction.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2023-0131633 filed in the Korean Intellectual Property Office on October 4, 2023, Korean Patent Application No. 10-2023-0171332 filed in the Korean Intellectual Property Office on November 30, 2023, and Korean Patent Application No. 10-2024-0013673 filed in the Korean Intellectual Property Office on January 30, 2024, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCC, a type of multilayer electronic component) are chip capacitors that are mounted on printed circuit boards of various electronic products (such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones) for charging or discharging therefrom.

[0004] Multilayer ceramic capacitors are used as components in various electronic devices due to their small size, high capacitance, and ease of installation. With the miniaturization and high power output of various electronic devices such as computers and mobile devices, the demand for miniaturization and high capacitance of multilayer ceramic capacitors is also increasing.

[0005] In addition, with the recent increase in industry interest in automotive electrical components, multilayer ceramic capacitors also require high reliability characteristics for use in automotive or infotainment systems.

[0006] A method for manufacturing a multilayer ceramic capacitor has been developed as follows: by exposing the inner electrodes in the width direction of the body, the overlapping area of ​​the inner electrodes can be maximized through an edgeless design, and the side edge portions are separately attached to the two side surfaces of the body in the width direction to minimize the edge portions in the width direction, thereby maximizing the capacitance per unit volume.

[0007] However, moisture may easily penetrate between the side edge portion and the main body, which may reduce moisture resistance reliability, and when the side edge portion is not properly attached to the main body and a gap is generated between the side edge portion and the main body, there is a concern that moisture resistance reliability may further deteriorate.

[0008] In addition, during the cutting process that exposes the internal electrode in the width direction of the body, blade chipping may occur, and vertical scratches may occur due to the damaged blade. When blade chipping occurs, a moisture penetration path may be formed from the cover part to the effective part, which may reduce moisture resistance reliability.

[0009] Therefore, a method of improving the moisture resistance reliability while improving the capacitance per unit volume is required. Summary of the invention

[0010] An aspect of the present disclosure is to improve the reliability of multi-layer electronic components.

[0011] One aspect of the present disclosure is to increase the capacitance per unit volume of a multilayer electronic component.

[0012] An aspect of the present disclosure is to improve a bonding force between a side edge portion and a main body.

[0013] However, aspects of the present disclosure are not limited to the above and may be more easily understood in the course of describing specific embodiments of the present disclosure.

[0014] According to one aspect of the present disclosure, a multilayer electronic component may include: a main body, including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; side edge portions, respectively arranged on the fifth surface and the sixth surface of the main body; and external electrodes, respectively arranged on the third surface and the fourth surface of the main body, wherein at least one of the two end portions of the internal electrode in the third direction may be spaced apart from the corresponding side edge portion, and may have an average thickness smaller than the average thickness of the central portion of the internal electrode in the third direction.

[0015] According to one aspect of the present disclosure, a method for manufacturing a multilayer electronic component may include: forming a plurality of conductive patterns on a surface of a ceramic green sheet in a first direction, the plurality of conductive patterns being arranged in a second direction perpendicular to the first direction and in a third direction perpendicular to the first direction and the second direction; obtaining a stack by stacking a plurality of the ceramic green sheets in the first direction; a stack cutting operation of cutting the stack along the second direction and the third direction to obtain a plurality of unit sheets, wherein, during cutting the stack along the third direction, the stack is cut to obtain a unit sheet including a first internal electrode pattern and a second internal electrode pattern, in which a cut surface of the conductive pattern is exposed to a surface of the unit sheet in the second direction, in which a cut surface of the conductive pattern is exposed to another surface of the unit sheet opposite to the one surface in the second direction, and cutting the stack so that the conductive patterns of the first internal electrode pattern and the second internal electrode pattern are spaced apart from at least one of a first side surface and a second side surface of the unit sheet opposite to each other in the third direction; and a side edge portion forming operation of attaching a ceramic green sheet for a side edge portion to the first side surface and the second side surface of the unit sheet.

[0016] When the spacing distance between the conductive pattern and the adjacent conductive pattern in the third direction is defined as We, during cutting of the stack along the second direction, the stack is cut within the range of We in the third direction from the center of the area where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction.

[0017] According to one aspect of the present disclosure, a multilayer electronic component may include: a main body, including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; side edge portions, respectively arranged on the fifth surface and the sixth surface of the main body; and external electrodes, respectively arranged on the third surface and the fourth surface of the main body, wherein at least one of the two end portions of the internal electrode in the third direction is spaced apart from the corresponding side edge portion and has a shape bent toward the center of the main body in the first direction.

[0018] According to one aspect of the present disclosure, a multilayer electronic component may include: a main body, including an effective part, the effective part forming a capacitor by including a dielectric layer and an internal electrode alternately arranged with the dielectric layer in a first direction, and the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; a side edge part, respectively arranged on the fifth surface and the sixth surface of the main body; and an external electrode, respectively arranged on the third surface and the fourth surface of the main body, wherein at least one end of the two ends of at least one internal electrode in the effective part in the third direction is spaced apart from the corresponding side edge part, and when the area between the at least one end of the at least one internal electrode and the corresponding side edge part is defined as an edge area, the corresponding side edge part and the edge area have different compositions from each other.

[0019] One of the various effects of the present disclosure is to improve the reliability of a multilayer electronic component.

[0020] One of the various effects of the present disclosure is to improve the capacitance per unit volume of a multilayer electronic component.

[0021] One of various effects of the present disclosure is to improve the adhesive force between the side edge portion and the main body.

[0022] One of various effects of the present disclosure is to reduce the occurrence of a step portion caused by an internal electrode.

[0023] However, the advantages and effects of the present disclosure are not limited to the above and may be more easily understood in the course of describing specific embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an example embodiment of the present disclosure; Figure 2 It is shown Figure 1 A perspective view of a separated main body and side edge portion excluding an external electrode in a multilayer electronic component; Figure 3 is along Figure 1 A cross-sectional view taken along line II'; Figure 4 is along Figure 1 A cross-sectional view taken along line II-II'; Figure 5is along Figure 1 A cross-sectional view taken along line III-III'; Figure 6 yes Figure 4 An enlarged view of area K1; Figure 7 yes Figure 4 An enlarged view of area K2; Figure 8 is according to another exemplary embodiment corresponding to Figure 7 ; Fig. 9 is according to another exemplary embodiment corresponding to Figure 7 ; Fig.10 A ceramic green sheet having an internal electrode pattern printed thereon for manufacturing a multilayer electronic component according to an example embodiment of the present disclosure is shown; Fig.11 is a diagram showing a stack with Fig.10 A cross-sectional view of a stack of ceramic green sheets in a first direction and a third direction; Fig.12 is a first modification example corresponding to Figure 4 ; Fig.13 is a second modification example corresponding to Figure 4 ; Fig.14 is a third modification example corresponding to Figure 4 ; Fig.15 is a fourth modification example corresponding to Figure 4 ; Fig.16 is a fifth modification example corresponding to Figure 4 ; Fig.17 is a sixth modification example corresponding to Figure 4 ; Fig.18 is a seventh modification example corresponding to Figure 4 ; Fig.19 is based on the corresponding Figure 4 ; Fig. 20 is a perspective view schematically showing a multilayer electronic component according to Comparative Example 1; Fig.21 It is shown in Fig. 20 A perspective view of a separated main body and side edge portion excluding an external electrode in a multilayer electronic component; Fig. 22 is along Fig. 20A cross-sectional view taken along line IV-IV'; Fig.23 is a perspective view schematically showing a multilayer electronic component according to Comparative Example 2; and Fig.24 is along Fig.23 A cross-sectional view taken along line V-V'. DETAILED DESCRIPTION

[0025] Hereinafter, example embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the embodiments of the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. The example embodiments disclosed herein are provided to better explain the present disclosure to those skilled in the art. Therefore, in the accompanying drawings, for the sake of clarity, the shapes and sizes of the elements may be exaggerated, and the same reference numerals will always be used to represent the same or similar elements.

[0026] In addition, in order to clearly describe the present disclosure in the drawings, contents irrelevant to the description are omitted, and although the size (e.g., thickness) of each component shown in the drawings is arbitrarily shown for the convenience of description, the present disclosure is not limited thereto. In addition, components having the same functions within the scope of the same concept are described using the same reference numerals. Throughout the specification, unless otherwise specified, when a part "includes" or "contains" a component, this means that other components are not excluded and other components may be further included.

[0027] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0028] Multilayer electronic components Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an example embodiment of the present disclosure.

[0029] Figure 2 It is shown Figure 1 A perspective view of a separated main body and side edge portions excluding external electrodes in a multilayer electronic component.

[0030] Figure 3 is along Figure 1 A cross-sectional view taken along line II'.

[0031] Figure 4 is along Figure 1 A cross-sectional view taken along line II-II'.

[0032] Figure 5 is along Figure 1 A cross-sectional view taken along line III-III'.

[0033] Figure 6 yes Figure 4 Magnified view of area K1.

[0034] Figure 7 yes Figure 4 Magnified view of area K2.

[0035] In the following, reference is made to Figures 1 to 7 , a multilayer electronic component according to an example embodiment of the present disclosure will be described in detail.

[0036] A multilayer electronic component 100 according to an example embodiment of the present disclosure may include: a main body 110, including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, and the main body 110 includes a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 to the fourth surface 4 and opposite to each other in a third direction; side edge portions 114 and 115, respectively arranged on the fifth surface 5 and the sixth surface 6; and external electrodes 131 and 132, respectively arranged on the third surface 3 and the fourth surface 4, wherein at least one of the two end portions of the internal electrode in the third direction is spaced apart from the side edge portion and may have an average thickness smaller than an average thickness of a central portion of the internal electrode in the third direction.

[0037] A method for manufacturing a multilayer ceramic capacitor has been developed as follows: by exposing the inner electrodes in the width direction of the body, the overlapping area of ​​the inner electrodes can be maximized through an edgeless design, and the side edge portions are separately attached to the two side surfaces of the body in the width direction to minimize the edge portions in the width direction, thereby maximizing the capacitance per unit volume.

[0038] However, moisture may easily penetrate between the side edge portion and the main body, which may reduce moisture resistance reliability, and when the side edge portion is not properly attached to the main body and a gap is generated between the side edge portion and the main body, there is a concern that moisture resistance reliability may further deteriorate.

[0039] In addition, during the cutting process that exposes the internal electrode in the width direction of the body, blade chipping may occur, and vertical scratches may occur due to the damaged blade. When blade chipping occurs, a moisture penetration path may be formed from the cover part to the effective part, which may reduce moisture resistance reliability.

[0040] According to an exemplary embodiment of the present disclosure, the average thickness of at least one of the two end portions of the internal electrodes 121 and 122 in the third direction can be made smaller than the average thickness of the central portion of the internal electrodes 121 and 122 in the third direction, so that the contact area between the side edge portions 114 and 115 and the internal electrodes 121 and 122 can be reduced, or the side edge portions 114 and 115 and the internal electrodes 121 and 122 can be prevented from contacting each other, thereby improving the adhesive force between the side edge portions 114 and 115 and the body 110 and reducing the occurrence of blade chipping. Therefore, the moisture resistance reliability of the multilayer electronic component 100 can be improved while the capacitance per unit volume can be improved. In addition, at least one of the two end portions of the internal electrodes 121 and 122 in the third direction is arranged to be spaced apart from the side edge portions 114 and 115, so that the moisture resistance reliability can be further improved.

[0041] Hereinafter, each configuration included in the multilayer electronic component 100 according to the example embodiment of the present disclosure will be described.

[0042] The body 110 may include dielectric layers 111 and internal electrodes 121 and 122 that are alternately stacked.

[0043] There is no particular limitation on the specific shape of the body 110, but Figure 1 and Figure 2 As shown, the body 110 may have a hexahedral shape or a shape similar to the hexahedral shape. Due to shrinkage of ceramic powder particles included in the body 110 during a sintering process, the body 110 may not have a hexahedral shape with completely straight lines but may have a substantially hexahedral shape.

[0044] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0045] In a state where the plurality of dielectric layers 111 forming the body 110 are sintered, adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to identify boundaries between the adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0046] According to an exemplary embodiment of the present disclosure, the material included in the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material may include BaTiO3-based ceramic powder particles, and examples of the BaTiO3-based ceramic powder particles may include BaTiO3 and (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0047] Various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powder particles such as barium titanate (BaTiO3) as the material included in the dielectric layer 111 according to the purpose of the present disclosure.

[0048] In addition, the average thickness td of the dielectric layer 111 does not need to be particularly limited, but can be, for example, 0.05 μm to 3.0 μm. In addition, the average thickness td of the dielectric layer 111 can be arbitrarily set according to desired characteristics or purposes.

[0049] The average thickness td of the dielectric layer 111 may refer to the dimension of the dielectric layer 111 in the first direction. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections of the main body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average value can be obtained by measuring the thicknesses at multiple regions of one dielectric layer 111 (for example, 30 regions spaced apart from each other at equal intervals in the second direction). The 30 regions with equal intervals can be specified in the effective part Ac to be described later. In addition, when the average value is obtained by extending the average value measurement to 10 dielectric layers 111, the average thickness td of the dielectric layer 111 can be further generalized.

[0050] The inner electrodes 121 and 122 may be alternately provided with the dielectric layer 111.

[0051] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 may be alternately disposed to face each other with the dielectric layer 111 interposed therebetween, and the first internal electrodes 121 and the second internal electrodes 122 may be exposed to the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0052] In example embodiments, the internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 alternately disposed in a first direction with the dielectric layer 111 interposed therebetween, the first internal electrode 121 may be connected to the third surface, and the second internal electrode 122 may be connected to the fourth surface.

[0053] Reference Figures 2 to 4 , the first internal electrode 121 may be spaced apart from the fourth surface 4 , the fifth surface 5 , and the sixth surface 6 and may be exposed through the third surface 3 , and the second internal electrode 122 may be spaced apart from the third surface 3 , the fifth surface 5 , and the sixth surface 6 and may be exposed through the fourth surface 4 .

[0054] In this case, the first and second internal electrodes 121 and 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0055] The internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0056] The body 110 may include: an effective portion Ac, which is disposed inside the body 110 and forms a capacitor by including a first internal electrode 121 and a second internal electrode 122 disposed to face each other with a dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122; and covering portions 112 and 113, which are formed above and below the effective portion Ac in a first direction.

[0057] In addition, the effective portion Ac is a portion contributing to the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0058] The covering parts 112 and 113 may include an upper covering part 112 and a lower covering part 113. The upper covering part 112 and the lower covering part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in a thickness direction on the upper surface and the lower surface of the effective part Ac, respectively, and may mainly serve to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0059] The upper cover 112 and the lower cover 113 do not include an internal electrode, and may include the same material as the dielectric layer 111 .

[0060] That is, the upper cover 112 and the lower cover 113 may include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0061] In addition, there is no particular limitation on the thickness of the cover portions 112 and 113. However, in order to more easily achieve miniaturization and high capacitance of a multilayer electronic component, the average thickness tc of the cover portions 112 and 113 may be 80 μm or less.

[0062] The average thickness tc of the covering portions 112 and 113 may refer to a first direction average dimension and may be a value obtained by averaging the first direction dimensions of the covering portions 112 and 113 measured at five regions equally spaced from each other in the second direction on the upper or lower portion of the effective portion Ac.

[0063] The side edge portions 114 and 115 may be disposed on the fifth surface 5 and the sixth surface 6 of the body 110 .

[0064] The side edge portions 114 and 115 may include a first side edge portion 114 disposed on the fifth surface 5 of the body 110 and a second side edge portion 115 disposed on the sixth surface 6 of the body 110. That is, the side edge portions 114 and 115 may be disposed on both side surfaces of the body 110 in the third direction.

[0065] The side edge parts 114 and 115 may be provided to cover both side surfaces of the cover parts 112 and 113 in the third direction.

[0066] The side margin parts 114 and 115 may mainly serve to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0067] In example embodiments, the average thickness of at least one of the two end portions of the internal electrodes 121 and 122 in the third direction may be less than the average thickness of the central portion of the internal electrodes 121 and 122 in the third direction. Therefore, the contact area between the side edge portions 114 and 115 and the internal electrodes 121 and 122 may be reduced, or the side edge portions 114 and 115 and the internal electrodes 121 and 122 may be prevented from contacting each other, thereby improving the adhesive force between the side edge portions 114 and 115 and the body 110 and reducing the occurrence of blade chipping. Therefore, the moisture resistance reliability of the multilayer electronic component 100 may be improved while the capacitance per unit volume may be improved.

[0068] A method for manufacturing a multilayer ceramic capacitor has been developed as follows: by exposing the inner electrodes in the width direction of the body, the overlapping area of ​​the inner electrodes can be maximized through an edgeless design, and the side edge portions are separately attached to the two side surfaces of the body in the width direction to minimize the edge portions in the width direction, thereby maximizing the capacitance per unit volume.

[0069] Reference Figure 20 to Figure 22 ( Figure 20 to Figure 22 2 is a drawing of a multilayer electronic component 200 of Comparative Example 1 manufactured by the method), because the multilayer electronic component 200 according to Comparative Example 1 has no step portion because the internal electrodes 221 and 222 are exposed to the fifth surface 5 and the sixth surface 6 of the body 210, the internal electrodes 221 and 222 can have a constant thickness in the third direction. In addition, the internal electrodes 221 and 222 are exposed to the fifth surface 5 and the sixth surface 6 of the body 210 and are in contact with the side edge portions 214 and 215.

[0070] However, moisture may easily penetrate between the side edge portions 214 and 215 and the body 210, which may reduce moisture resistance reliability, and when the side edge portions 214 and 215 are not properly attached to the body 210 and a gap is generated between the side edge portions 214 and 215 and the body 210, the moisture resistance reliability may be further deteriorated. In addition, during the cutting process for exposing the internal electrodes 221 and 222 in the width direction of the body 210, blade chipping may occur, and vertical scratches may occur due to the damaged blade. When blade chipping occurs, a moisture penetration path may be formed from the cover portions 212 and 213 to the effective portion Ac, which may reduce moisture resistance reliability.

[0071] On the other hand, refer to Fig.23 and Fig.24 ( Fig.23 and Fig.24 2 is a drawing of a multilayer electronic component 300 according to Comparative Example 2 manufactured by a conventional manufacturing method that forms an internal electrode by coating a conductive paste on an area of ​​a ceramic green sheet other than an area where a side edge portion is to be formed, without separately attaching the side edge portion so as to sufficiently protect the internal electrodes 321 and 322 from the outside), because the width Wm'' of the side edge portions 314 and 315 must be made large, the capacitance per unit volume may be reduced, and in the process of stacking the ceramic green sheets, as the height difference between the portion of the ceramic green sheet where the conductive paste for the internal electrode is not printed and the portion of the ceramic green sheet where the conductive paste for the internal electrode is printed accumulates, a large number of step portions may appear in the height direction. These step portions may cause the end of each sheet to bend to generate stress, which may cause defects such as delamination with gaps between layers.

[0072] On the other hand, according to the exemplary embodiment of the present disclosure, since separate side edge portions 114 and 115 are provided on the body 110, unlike the comparative example 2, even if the widths W of the edge regions G1 and G2 in the body 110 are g1 and W g2 The internal electrodes 121 and 122 can be sufficiently protected from external influences, and the width W of the edge regions G1 and G2 in the body 110 can be reduced. g1 and W g2 The width W of the side edges 114 and 115 is s1 and W s2 The sum of the width of the entire width direction edge portion W m1 and W m2 The width Wm″ is smaller than that of the side edge portions 314 and 315 of Comparative Example 2, thereby increasing the capacitance per unit volume.

[0073] According to the example embodiment of the present disclosure, since the edge regions G1 and G2 exist in the body 110, the blade chipping that may occur in the comparative example 1 can be reduced, and the moisture penetration can be prevented by improving the bonding force between the side edge portions 114 and 115 and the body 110. In addition, even if moisture penetrates between the side edge portions 114 and 115 and the body 110, it is difficult for the moisture to reach the internal electrodes 121 and 122 due to the presence of the edge regions G1 and G2, thereby improving the moisture resistance reliability. In addition, according to the modified example of the present disclosure, even when one of the two ends of the internal electrode contacts the side edge portion, since the thickness of the two ends of the internal electrode is thin, the bonding force between the side edge portion and the body can be greater than the bonding force between the side edge portion and the body in the comparative example 1, which can be beneficial to ensure the moisture resistance reliability.

[0074] That is, compared with Comparative Example 2, according to the exemplary embodiment of the present disclosure, the capacitance per unit volume can be increased while ensuring high moisture resistance reliability. In addition, compared with Comparative Example 1, according to the exemplary embodiment of the present disclosure, the moisture resistance reliability of the multilayer electronic component can be increased while increasing the capacitance per unit volume.

[0075] Reference Figure 6, when the first internal electrode 121 is divided into 10 regions with equal intervals in the third direction (the 10 regions are respectively defined as the first region R1, the second region R2, the third region R3, the fourth region R4, the fifth region R5, the sixth region R6, the seventh region R7, the eighth region R8, the ninth region R9 and the tenth region R10), both end portions 121e1 and 121e2 of the first internal electrode 121 may be the first region R1 and the tenth region R10, and the central portion 121c of the first internal electrode 121 may be the second region R2 to the ninth region R9. Both end portions 122e1 and 122e2 and the central portion 122c of the second internal electrode 122 may be identified in the same manner.

[0076] As an example of a specific measurement method, the average thickness of both ends and the average thickness of the central portion of the internal electrodes 121 and 122 may be measured by scanning the first and third direction cross sections cut from the center of the body 110 in the second direction with a scanning electron microscope (SEM). After selecting one internal electrode from the scanned image, the selected internal electrode may be divided into 10 regions with equal intervals in the third direction (the 10 regions are defined as the first region to the tenth region, respectively), and a value obtained by averaging the thicknesses of the internal electrodes at five regions spaced at equal intervals from each other in the first region may be defined as the average thickness of one end of the internal electrodes 121 and 122, a value obtained by averaging the thicknesses of the internal electrodes at five regions spaced at equal intervals from each other in the tenth region may be defined as the average thickness of the other end of the internal electrodes 121 and 122, and an average of the average thickness of one end of the internal electrodes 121 and 122 and the average thickness of the other end of the internal electrodes 121 and 122 may be the average thickness of both ends of the internal electrodes 121 and 122. In addition, a value obtained by averaging thicknesses of the internal electrodes at 10 regions spaced equally apart from each other among the second to ninth regions may be determined as an average thickness of central portions of the internal electrodes 121 and 122 .

[0077] In addition, when an average value is obtained after performing average thickness measurement on 10 internal electrodes 121 and 122 , the average thickness of both end portions and the average thickness of the central portion of the internal electrodes 121 and 122 may be further generalized.

[0078] In example embodiments, the ratio of the average thickness of both ends of the internal electrodes 121 and 122 to the average thickness of the central portions of the internal electrodes 121 and 122 may be 0.90 or less. Therefore, the effect of improving the adhesive force between the side edge portions 114 and 115 and the body 110 and the effect of reducing the occurrence of blade chipping may be further improved. In addition, the ratio of the average thickness of both ends of the internal electrodes 121 and 122 to the average thickness of the central portions of the internal electrodes 121 and 122 may be more preferably 0.80 or less, and even more preferably 0.70 or less.

[0079] The average thickness of the central portions of the internal electrodes 121 and 122 does not need to be particularly limited, but may be, for example, 0.05 μm to 3.0 μm.

[0080] In example embodiments, at least one of the two end portions of the internal electrodes 121 and 122 may have a shape bent toward the center of the body in the first direction. Therefore, at least one of the two end portions of the internal electrodes 121 and 122 may be disposed closer to the center of the body in the first direction than the central portion of the internal electrodes 121 and 122.

[0081] The average width W in the third direction from both ends of the internal electrodes 121 and 122 in the third direction to the outer surfaces of the corresponding side edge portions 114 and 115 is m1 and W m2 However, the average width W in the third direction from both ends of the inner electrodes 121 and 122 in the third direction to the outer surfaces of the corresponding side edge portions 114 and 115 can be more significantly improved while ensuring the moisture resistance reliability of the multilayer electronic component according to the present disclosure. m1 and W m2 It may be greater than or equal to 20 μm and less than or equal to 55 μm. In the present disclosure, expressions such as “at least one of the two ends of the inner electrode in the third direction is spaced apart from the corresponding side edge portion” may refer to “at least one of the two ends of the inner electrode in the third direction is spaced apart from the adjacent side edge portion”.

[0082] In addition, in the case of Comparative Example 1, the width Wm' of the side edge portions 214 and 215 for maximizing the capacitance per unit volume is 20 μm or less, and in the case of Comparative Example 2, the width Wm'' of the edge portions 314 and 315 for stably ensuring the moisture resistance reliability is 50 μm or more. m1 and W m2 The width Wm′ of the side edge portions 214 and 215 of the comparative example 1 may be greater than or equal to the width Wm′ of the side edge portions 214 and 215 of the comparative example 1, but may be less than the width Wm″ of the side edge portions 314 and 315 of the comparative example 2. m1 and W m2When the width Wm′ of the side edge portions 214 and 215 is equal to that of Comparative Example 1, the capacitance per unit volume is the same as that of Comparative Example 1, but the moisture resistance reliability may be better than that of Comparative Example 1.

[0083] Reference Figure 4 , W m1 The spacing distance W between the first end portion 121e1 or 122e1 of the inner electrode and the fifth surface 5 may be g1 The width W of the first side edge portion s1 The sum, W m2 The spacing distance W between the second end portion 121e2 or 122e2 of the inner electrode and the sixth surface 6 may be g2 The width W of the second side edge portion s2 The sum of W m1 and W m2 It may be measured by first and third direction cross sections cut from the center of the multilayer electronic component 100 in the second direction, and may be a value obtained by averaging values ​​measured at five regions spaced equally apart from each other in the first direction.

[0084] The average width W of the side edge portions 114 and 115 in the third direction is s1 and W s2 No particular limitation is required. For example, W s1 and W s2 Each of can be 50μm or less, and for miniaturization and high capacitance, W s1 and W s2 Each of may be 20 μm or less. Here, the third direction width of the side margin parts 114 and 115 may refer to the third direction dimension of the side margin parts 114 and 115 .

[0085] In addition, according to an exemplary embodiment of the present disclosure, since the edge in the width direction may also exist in the body 110, the width of the side edge portions 114 and 115 in the third direction may be thinned to improve the capacitance per unit volume while ensuring moisture resistance reliability. For example, when the average width W of the side edge portions 114 and 115 in the third direction is s1 and W s2 When the thickness is 15 μm or less, the effect of improving the capacitance per unit volume while ensuring moisture resistance reliability of the multilayer electronic component according to the present disclosure can be more significantly achieved.

[0086] In addition, the width of each position of the side margins 114 and 115 in the first direction may be substantially the same, and the deviation of the width may be within 5%. This may be caused by forming the side margins 114 and 115 by attaching a ceramic green sheet for the side margins to the side surface of the body 110.

[0087] In example embodiments, at least one of both end portions of the internal electrodes 121 and 122 in the third direction may be spaced apart from the side edge portions 114 and 115 .

[0088] In this case, both ends of the internal electrodes 121 and 122 in the third direction may be spaced apart from the side edge portions 114 and 115. Therefore, the bonding force between the side edge portions 114 and 115 and the body 110 may be further improved. This is because the bonding force between the side edge portions 114 and 115 and the dielectric layer 111 is greater than the bonding force between the side edge portions 114 and 115 and the internal electrodes 121 and 122. In addition, since both ends of the internal electrodes 121 and 122 in the third direction are spaced apart from the side edge portions 114 and 115, even if moisture penetrates between the side edge portions 114 and 115 and the body 110, it may be difficult to reach the internal electrodes, thereby further improving moisture resistance reliability. In addition, blade chipping that may occur during cutting may be suppressed.

[0089] However, the present disclosure is not limited to the form in which the two end portions of the inner electrodes 121 and 122 in the third direction are spaced apart from the side edge portions 114 and 115 , and as a modified example described below, at least one of the two end portions of the inner electrodes 121 and 122 in the third direction may be in contact with the side edge portions 114 and 115 .

[0090] In example embodiments, when, of the two ends of the internal electrodes 121 and 122 in the third direction, the end close to the fifth surface of the body 110 is defined as the first end 121e1 or 122e1 and the end close to the sixth surface of the body 110 is defined as the second end 121e2 or 122e2, the distance W between the first end 121e1 or 122e1 and the fifth surface is g1 and a distance W between the second end 121e2 or 122e2 and the sixth surface g2 The sum can be 15 μm or more. g1 and W g2 The sum can be set to 15 μm or more, thereby further improving the moisture resistance reliability improvement effect according to the present disclosure.

[0091] In addition, there is no need to specifically limit W g1 and W g2 The upper limit of the sum of W and W may be 82 μm or less. In order to further improve the capacitance improvement effect per unit volume according to the present disclosure, W g1 and W g2 The sum may be 60 μm or less.

[0092] In addition, the side margin parts 114 and 115 may be formed by stacking a single dielectric layer or two or more dielectric layers on both side surfaces in the third direction of the body 110. The side margin parts 114 and 115 may have a different composition from the dielectric layer 111, may have a different grain size from the dielectric layer 111, and / or may have a different porosity from the dielectric layer 111. However, the present disclosure is not limited thereto, and the side margin parts 114 and 115 may have the same composition as the dielectric layer 111.

[0093] In example embodiments, when regions between both ends of the internal electrodes 121 and 122 spaced apart from the side edge portions 114 and 115 in the third direction and the side edge portions 114 and 115 are defined as edge regions G1 and G2, the side edge portions 114 and 115 and the edge regions G1 and G2 may have different compositions.

[0094] In this case, the mole number of Mg relative to 100 moles of Ti included in the side edge portions 114 and 115 may be higher than the mole number of Mg relative to 100 moles of Ti included in the edge regions G1 and G2. Therefore, the adhesion between the side edge portions 114 and 115 and the body 110 may be further improved, and the capacitance per unit volume may be further improved.

[0095] In example embodiments, when regions between both ends of the internal electrodes 121 and 122 spaced apart from the side margin portions 114 and 115 in the third direction and the side margin portions 114 and 115 are defined as the edge regions G1 and G2, an average size of dielectric grains included in the side margin portions 114 and 115 may be smaller than an average size of dielectric grains included in the edge regions G1 and G2. Therefore, adhesion of the side margin portions 114 and 115 to the body 110 may be further improved, and capacitance per unit volume may be further improved.

[0096] In example embodiments, when the average size of dielectric grains in a region adjacent to the ends spaced apart from the side edge portions 114 and 115 among the two ends of the internal electrodes 121 and 122 in the third direction is defined as Gs1, the average size of dielectric grains in a region adjacent to the central portion of the internal electrodes 121 and 122 in the third direction is defined as Gs2, and the average size of dielectric grains in a region adjacent to the outer surfaces of the side edge portions 114 and 115 is defined as Gs3, the absolute value of the difference between Gs1 and Gs2 may be smaller than the absolute value of the difference between Gs1 and Gs3. In this case, Gs1 and Gs2 may be substantially the same, and Gs3 may be smaller than or larger than Gs1 and Gs2. For a more specific example, Gs1 may be 0.95 to 1.05 times greater than Gs2, and Gs3 may be greater than 1.1 times greater than Gs1 or less than 0.9 times greater than Gs1. This may be because the ceramic green sheet used to form the side margin parts 114 and 115 and the ceramic green sheet used to form the dielectric layer 111 of the body 110 have different compositions.

[0097] Reference Figure 7 , one end 114e of the first side edge portion 114 may intersect with one end of the fifth surface in the first direction and may be connected to the second surface of the body 110. In addition, the other end of the first side edge portion 114 may intersect with the other end of the fifth surface in the first direction and may be connected to the first surface of the body 110. Similarly, one end of the second side edge portion 115 may intersect with one end of the sixth surface in the first direction and may be connected to the second surface of the body 110, and the other end of the second side edge portion 115 may intersect with the other end of the sixth surface in the first direction and may be connected to the first surface of the body 110.

[0098] However, considering the manufacturing error in the side edge portion, etc., one end portion of the first side edge portion does not necessarily have to have such a Figure 7 The shape of an example embodiment.

[0099] For example, according to another exemplary embodiment of the present disclosure, Figure 8 As shown, one end 114e' and / or the other end of the first side edge portion 114' may be disposed on the fifth surface, and the first side edge portion 114' may be disposed so as not to cover a portion of the fifth surface. Similarly, one end and / or the other end of the second side edge portion may be disposed on the sixth surface, and the second side edge portion may be disposed so as not to cover a portion of the sixth surface. Therefore, according to another embodiment of the present disclosure, the first side edge portion 114' may be disposed so as not to intersect with the extension line E5 of the fifth surface, and the second side edge portion may be disposed so as not to intersect with the extension line of the sixth surface. In addition, as Figure 8As shown, when the first side margin portion 114 ′ covers only a portion of the fifth surface, a step portion may appear in the boundary of the body 110 .

[0100] In addition, according to another exemplary embodiment of the present disclosure, a portion of the side edge portions 114 ″ and 115 ″ may be disposed on the first surface and the second surface. Fig. 9 , one end 114e'' of the first side edge portion 114'' may be disposed on the second surface. In this case, the other end of the first side edge portion 114'' may be disposed on the first surface, one end of the second side edge portion may be disposed on the second surface, and the other end of the second side edge portion may be disposed on the first surface. Therefore, according to another embodiment of the present disclosure, the first side edge portion 114'' may be disposed to intersect with an extension line E5 of the fifth surface, and the second side edge portion may be disposed to intersect with an extension line of the sixth surface.

[0101] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 .

[0102] The external electrodes 131 and 132 may include first and second external electrodes 131 and 132 that are respectively disposed on the third and fourth surfaces 3 and 4 of the body 110 and are respectively connected to the first and second internal electrodes 121 and 122 .

[0103] Reference Figure 1 , the external electrodes 131 and 132 may be disposed to cover both end surfaces of the side edge portions 114 and 115 in the second direction.

[0104] In this example embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the number or shape of the external electrodes 131 and 132 may be changed according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0105] In an example embodiment, the external electrodes 131 and 132 include a first external electrode 131 disposed on a third surface of the body 110 and a second external electrode 132 disposed on a fourth surface of the body 110, and the first external electrode 131 may cover one end of the side edge portions 114 and 115 in the second direction, and the second external electrode 132 may cover the other end of the side edge portions 114 and 115 in the second direction.

[0106] In addition, the external electrodes 131 and 132 may be formed using any material such as metal as long as the material has conductivity, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may also have a multi-layer structure.

[0107] For example, the external electrodes 131 and 132 may include electrode layers 131 a and 132 a disposed on the body 110 and plating layers 131 b and 132 b formed on the electrode layers 131 a and 132 a .

[0108] For a more specific example of the electrode layers 131 a and 132 a , the electrode layers 131 a and 132 a may be fired electrodes including a conductive metal and glass, or may be resin-based electrodes including a conductive metal and resin.

[0109] In addition, the electrode layers 131a and 132a can be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal to the main body, or by transferring a sheet including a conductive metal to the fired electrode.

[0110] As the conductive metal included in the electrode layers 131a and 132a, a material having excellent conductivity may be used without particular limitation. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0111] The plating layers 131b and 132b are used to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and the plating layers 131b and 132b may be plating layers including one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0112] For a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, or may be in a form in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, or may be in a form in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed on the electrode layers 131a and 132a. In addition, the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0113] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0114] However, in order to achieve both miniaturization and high capacitance, the thickness of the dielectric layer and the internal electrode must be thinned to increase the number of stacks, and therefore, the reliability improvement effect according to the present disclosure may be more significant in a multilayer electronic component 100 having a size of 1005 (length×width, 1.0 mm×0.5 mm) or less.

[0115] Considering manufacturing errors, the size of the external electrodes, etc., when the length of the multilayer electronic component 100 is 1.1 mm or less and the width of the multilayer electronic component 100 is 0.55 mm or less, the effect of improving reliability and capacitance per unit volume according to the present disclosure may be more significant. Here, the length of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0116] Fig.10 A ceramic green sheet 10 having a conductive pattern 120 printed thereon for manufacturing a multilayer electronic component according to an example embodiment of the present disclosure is illustrated. Fig.11 shows a stack with Fig.10 FIG. 1 is a cross section of a stacked body 10 ′ of ceramic green sheets in the first direction and the third direction.

[0117] Reference Fig.10 and Fig.11 , a method of manufacturing a multilayer electronic component according to an example embodiment of the present disclosure will be described.

[0118] First, in Fig.10 After a plurality of conductive patterns 120 are printed on the ceramic green sheets 10 as shown, a plurality of ceramic green sheets 10 are stacked and pressed to form a stacked body 10 ′.

[0119] Then, refer to Fig.11 , the stacked body 10' can be cut by selecting reference cutting lines C1 and C2 at the center of the region where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction, thereby obtaining a unit piece U1 (corresponding to the main body). Fig.11 When the stacked body 10 ′ is cut along the reference cutting lines C1 and C2 , the internal electrodes 121 and 122 may be spaced apart from the fifth and sixth surfaces of the body, and the internal electrodes 121 and 122 may be spaced apart from the side margin portions 114 and 115 .

[0120] Then, when Figure 2 When one or more dielectric sheets for the side margin portions are attached to the fifth and sixth surfaces of the body as shown, both end portions of the inner electrode may be disposed to be spaced apart from the side margin portions.

[0121] Then, after performing a sintering process, a multilayer electronic component may be obtained by forming the external electrodes 131 and 132 on the third and fourth surfaces of the body 110 .

[0122] On the other hand, when dispersion occurs during cutting, the stacked body 10 ′ may not be accurately cut according to the reference cutting lines C1 and C2 and may be cut on the left side A1 or right side B1 of the first reference cutting line C1 or may be cut on the left side A2 or right side B2 of the second reference cutting line C2.

[0123] According to the spread of the cutting process, the multilayer electronic component according to the example embodiment of the present disclosure may have various forms as described below.

[0124] Fig.12 is a first modification example corresponding to Figure 4 When cutting on the left side A2 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.12 As shown, a multilayer electronic component 100-1 in which the internal electrodes 121-1 and 122-1 are spaced apart from the fifth surface but exposed to the sixth surface and in contact with the second side edge portion 115 can be obtained. Therefore, when the end portions close to the fifth surface are referred to as first end portions and the end portions close to the sixth surface are defined as second end portions of the internal electrodes 121-1 and 122-1 in the third direction, the first end portions may be spaced apart from the fifth surface and the second end portions may be disposed to contact the sixth surface. In this case, the spacing distance between the first end portions and the fifth surface may be 5 μm or more.

[0125] Fig.13 is a second modification example corresponding to Figure 4 When cutting on the right side B1 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.13 As shown, a multilayer electronic component 100 - 2 in which the internal electrodes 121 - 2 and 122 - 2 are spaced apart from the sixth surface but exposed to the fifth surface and in contact with the first side margin portion 114 may be obtained.

[0126] Fig.14 is a third modification example corresponding to Figure 4 When cutting on the right side B2 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.14 As shown, the internal electrodes 121-3 and 122-3 may be spaced apart from the fifth and sixth surfaces, but a portion of an adjacent conductive pattern may be included in the body. Therefore, the multilayer electronic component 100-3 may include second additional patterns 141b-3 and 142b-3 contacting the sixth surface and spaced apart from the second end.

[0127] Fig.15 is a fourth modification example corresponding to Figure 4 When cutting on the left side A1 of the first reference cutting line C1 and the second reference cutting line C2, as shown in FIG. Fig.15As shown, the internal electrodes 121-4 and 122-4 may be spaced apart from the fifth and sixth surfaces, but a portion of an adjacent conductive pattern may be included in the body. Therefore, the multilayer electronic component 100-4 may include first additional patterns 141a-4 and 142a-4 contacting the fifth surface and spaced apart from the first end.

[0128] like Fig.14 and Fig.15 As shown, according to an example embodiment of the present disclosure, the two ends of the inner electrode in the third direction may be spaced apart from the side edge portion, and when, among the two ends of the inner electrode in the third direction, the end close to the fifth surface is defined as the first end and the end close to the sixth surface is defined as the second end, the body may include at least one of a first additional pattern contacting the fifth surface and spaced apart from the first end and a second additional pattern contacting the sixth surface and spaced apart from the second end.

[0129] In this case, an end portion of the first additional pattern that is closer to the first end portion among the two ends in the third direction, an end portion of the second additional pattern that is closer to the second end portion among the two ends in the third direction, and the first end portion and the second end portion of the inner electrode may have a shape that is bent toward the center of the body in the first direction.

[0130] In addition, the thickness of the portion of the first additional pattern in contact with the fifth surface may be greater than the thickness of the end of the first additional pattern close to the first end, and the thickness of the portion of the second additional pattern in contact with the sixth surface may be greater than the thickness of the end of the second additional pattern close to the second end.

[0131] Fig.16 is a fifth modification example corresponding to Figure 4 When cutting on the left side A1 of the first reference cutting line C1 and the left side A2 of the second reference cutting line C2, as shown in FIG. Fig.16 As shown, the inner electrodes 121-5 and 122-5 may be spaced apart from the fifth surface but in contact with the sixth surface, and a portion of an adjacent conductive pattern may be included in the body. Therefore, the multilayer electronic component 100-5 may include first additional patterns 141a-5 and 142a-5 in contact with the fifth surface and spaced apart from the first end.

[0132] Therefore, when, among the two ends of the internal electrodes 121-5 and 122-5 in the third direction, the end close to the fifth surface is defined as the first end and the end close to the sixth surface is defined as the second end, the first end may be spaced apart from the fifth surface, the second end may be in contact with the sixth surface, and the body may further include first additional patterns 141a-5 and 142a-5 in contact with the fifth surface and spaced apart from the first end.

[0133] In this case, a spaced distance between the first end portions and the first additional patterns 141 a - 5 and 142 a - 5 may be 15 μm or more.

[0134] In addition, the ends of the first additional patterns 141a-5 and 142a-5 in the third direction, which are close to the first end, and the first end of the internal electrode may have a shape bent toward the center of the body in the first direction. In addition, the thickness of the portion of the first additional patterns 141a-5 and 142a-5 contacting the fifth surface may be greater than the thickness of the ends of the first additional patterns 141a-5 and 142a-5 close to the first end.

[0135] Fig.17 is a sixth modification example corresponding to Figure 4 When cutting on the right side B1 of the first reference cutting line C1 and the right side B2 of the second reference cutting line C2, as shown in FIG. Fig.17 As shown, the inner electrodes 121-6 and 122-6 may contact the fifth surface but may be spaced apart from the sixth surface, and a portion of an adjacent conductive pattern may be included in the body. Therefore, the multilayer electronic component 100-6 may include second additional patterns 141b-6 and 142b-6 contacting the sixth surface and spaced apart from the second end.

[0136] Fig.18 is a seventh modification example corresponding to Figure 4 When cutting on the left side A1 of the first reference cutting line C1 and the right side B2 of the second reference cutting line C2, as shown in FIG. Fig.18 As shown, the internal electrodes 121-7 and 122-7 may be spaced apart from the fifth surface and the sixth surface, and a portion of the adjacent conductive pattern may be included in the body. Therefore, the multilayer electronic component 100-7 may include first additional patterns 141a-7 and 142a-7 contacting the fifth surface and spaced apart from the first end, and may include second additional patterns 141b-7 and 142b-7 contacting the sixth surface and spaced apart from the second end.

[0137] Fig.19 is based on the corresponding Figure 4 When cutting on the right side B1 of the first reference cutting line C1 and the left side A2 of the second reference cutting line C2, as shown in FIG. Fig.19As shown, the internal electrodes 121-8 and 122-8 may be in contact with the fifth surface and the sixth surface. Therefore, in the multilayer electronic component 100-8 according to Comparative Example 3, the two ends of the internal electrodes 121-8 and 122-8 in the third direction may be set to contact the side edge portions 114 and 115. This case may have a form similar to that of Comparative Example 1, and since the two ends of the internal electrodes in the third direction may be set to contact the side edge portions 114 and 115, there may be concerns that moisture resistance reliability may be reduced. On the other hand, according to an example embodiment of the present disclosure, at least one of the two ends of the internal electrodes 121 and 122 in the third direction may be spaced apart from the side edge portions 114 and 115, thereby improving moisture resistance reliability.

[0138] Method for manufacturing a multi-layer electronic assembly The method for manufacturing a multilayer electronic component according to an example embodiment of the present disclosure may include: forming a plurality of conductive patterns 120 on a surface of a ceramic green sheet 10 in a first direction, the plurality of conductive patterns 120 being arranged in a second direction perpendicular to the first direction and in a third direction perpendicular to the first direction and the second direction; obtaining a stacked body 10' by stacking a plurality of ceramic green sheets in the first direction; and cutting the stacked body 10' in the second direction and the third direction to obtain a plurality of unit sheets U1, wherein during the cutting of the stacked body in the third direction, cutting the stacked body 10' including a first internal electrode pattern and a second internal electrode pattern, in which a cut surface of the conductive pattern is exposed to the unit sheet in the second direction. a surface, in which a cut surface of the conductive pattern is exposed to another surface of the unit chip in the second direction in a second inner electrode pattern, and when a spacing distance between the conductive pattern and an adjacent conductive pattern in a third direction is defined as We, during cutting of the stack body along the second direction, the stack body 10' is cut within the range of We in the third direction from the centers C1 and C2 of the regions where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction, and the stack body 10' is cut so that the conductive pattern is spaced apart from at least one of a first side surface and a second side surface of the unit chip that are opposite to each other in the third direction; and an operation of attaching a ceramic green sheet for a side edge portion to the side edge portion of the first side surface and the second side surface of the unit chip.

[0139] Fig.10 A ceramic green sheet having an internal electrode pattern printed thereon for manufacturing a multilayer electronic component according to an example embodiment of the present disclosure is illustrated. Fig.11 Shown by stacking Fig.10 A cross section of a stacked body obtained by forming the ceramic green sheets in the first direction and the third direction.

[0140] Reference Fig.10 and Fig.11, a method of manufacturing a multi-layer electronic component according to an exemplary embodiment of the present disclosure will be described.

[0141] First, as Fig.10 shown, a plurality of conductive patterns 120 may be formed on one surface of the green ceramic sheet 10 in a first direction, and the plurality of conductive patterns 120 are arranged in a second direction perpendicular to the first direction and a third direction perpendicular to the first and second directions.

[0142] The green ceramic sheet 10 is not particularly limited, and the green ceramic sheet may be formed using ceramic powder particles. For example, a slurry including ceramic powder particles, an organic solvent, and a binder may be used to form the green ceramic sheet. Specifically, after adding an additive to the ceramic powder particles, ethanol and toluene may be used as solvents and may be mixed with a dispersant, and then, their mixture may be mixed with a binder to form the green ceramic sheet 10. The ceramic powder particles may be BaTiO3-based ceramic powder particles, and may be, for example, BaTiO3 and (Ba 1- x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1- y Zr y )O3 (0 < y < 1).

[0143] The method of forming the conductive pattern 120 is not particularly limited, and the inner electrode pattern 120 may be formed by coating a conductive paste for an inner electrode including a conductive metal, and the method of coating the conductive paste for an inner electrode may be a screen printing method or a gravure printing method, but the present disclosure is not limited thereto. In addition, the conductive pattern 120 may be included in the inner electrodes 121 and 122 after a sintering process, and some of the conductive patterns 120 may be included in the additional patterns 141a, 141b, 142a, and 142b.

[0144] Then, a stacked body 10' may be obtained by stacking and pressing a plurality of green ceramic sheets 10 on which a plurality of conductive patterns 120 are formed in the first direction.

[0145] A covering portion may be formed by stacking green ceramic sheets 10 on which no conductive pattern 120 is formed on the upper and lower portions of the stacked body 10' in the first direction.

[0146] Then, a stack cutting operation may be performed, in which the stack may be cut along the second direction and the third direction to obtain a plurality of unit pieces U1, wherein, during cutting along the third direction, a stack including a first internal electrode pattern and a second internal electrode pattern may be cut, in the first internal electrode pattern, a cutting surface of the conductive pattern is exposed to one surface of the unit piece in the second direction, in the second internal electrode pattern, a cutting surface of the conductive pattern is exposed to another surface of the unit piece in the second direction, and when a spacing distance between a conductive pattern and an adjacent conductive pattern in the third direction is defined as We, during cutting along the second direction, the stack may be cut within the range of We in the third direction from the center of an area where the conductive pattern is spaced apart from an adjacent conductive pattern in the third direction, and the conductive pattern may be cut to be spaced apart from at least one of a first side surface and a second side surface of the unit piece that are opposite to each other in the third direction.

[0147] Reference Fig.11 , during cutting along the second direction, the center of the region where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction may be selected as the reference cutting lines C1 and C2, and the stack 10' may be cut within the range of We in the third direction from the reference cutting lines C1 and C2. That is, when the reference cutting line on the left side of the unit chip U1 is defined as the first reference cutting line C1 and the reference cutting line on the right side of the unit chip U1 is defined as the second reference cutting line C2, during cutting from the left side A1 of the first reference cutting line C1, the stack may be cut within the range of WA1, and the size of WA1 may be less than or equal to We. In addition, during cutting on the right side B1 of the first reference cutting line C1, the stack may be cut within the range of WB1, and the size of WB1 may be less than or equal to We. Similarly, during cutting on the left side A2 of the second reference cutting line C2, the stack may be cut within the range of WA2, and the size of WA2 may be less than or equal to We. In addition, when cutting at the right side B2 of the second reference cutting line C2, the stacked body may be cut within the range of WB2, and the size of WB2 may be less than or equal to We.

[0148] When based on Fig.11 When the stacked body 10 ′ is cut along the reference cutting lines C1 and C2 , the internal electrodes 121 and 122 may be spaced apart from the fifth and sixth surfaces of the body, and the internal electrodes 121 and 122 may be spaced apart from the side margin portions 114 and 115 .

[0149] When dispersion occurs during the cutting process, the stacked body 10' may not be accurately cut according to the reference cutting lines C1 and C2, and may be cut on the left side A1 or right side B1 of the first reference cutting line C1, or may be cut on the left side A2 or right side B2 of the second reference cutting line C2. According to the dispersion of the cutting process, the multilayer electronic component according to the example embodiment of the present disclosure may have various forms as described above.

[0150] In an example embodiment, during cutting of the stacked body in the second direction, the stacked body 10' may be cut in the third direction within a range less than We / 2 from the center of the region where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction. Therefore, a multilayer electronic component in a form in which both end portions of the internal electrode are spaced apart from the side edge portion can be obtained, and the adhesive force between the side edge portion and the body can be improved and the moisture resistance reliability can be improved. Fig.11 During cutting from the left side A1 of the first reference cutting line C1, the stacked body may be cut within the range of WA1, and the size of WA1 may be smaller than We / 2, and during cutting from the right side B1 of the first reference cutting line C1, the stacked body may be cut within the range of WB1, and the size of WB1 may be smaller than We / 2. Similarly, during cutting from the left side A2 of the second reference cutting line C2, the stacked body may be cut within the range of WA2, and the size of WA2 may be smaller than We / 2, and during cutting from the right side B2 of the second reference cutting line C2, the stacked body may be cut within the range of WB2, and the size of WB2 may be smaller than We / 2.

[0151] That is, during cutting the stacked body along the second direction, the stacked body may be cut so that the conductive pattern 120 may not be exposed to the first and second side surfaces of the die. The first side surface of the die corresponds to the fifth surface of the body, and the second side surface of the die corresponds to the sixth surface of the body.

[0152] In this case, it is possible to produce Figures 1 to 5 The multi-layer electronic assembly 100 is shown in FIG.

[0153] In example embodiments, during cutting of the stacked body in the second direction, the stacked body may be cut such that the conductive pattern may be exposed to one of the first and second side surfaces of the die.

[0154] In this case, in order to expose the conductive pattern to the first side surface of the unit chip U1, the stacked body may be cut within the range of WB1 on the right side B1 of the first reference cutting line C1, and the size of WB1 may be greater than or equal to We / 2 and less than or equal to We. Fig.13 , Fig.17 and Fig.19 As shown, the inner electrode may be exposed at the fifth surface.

[0155] In addition, in order to expose the conductive pattern to the second side surface of the unit chip U1, the stacked body can be cut within the range of WA2 on the left side A2 of the second reference cutting line C2, and the size of WA2 can be greater than or equal to We / 2 and less than or equal to We. In this case, Fig.12 , Fig.16 and Fig.19 As shown, the inner electrode may be exposed at the sixth surface.

[0156] In example embodiments, during cutting of the stacked body in the second direction, the stacked body may be cut such that the additional pattern adjacent to the conductive pattern is exposed to at least one of the first and second side surfaces of the die U1 .

[0157] In this case, in order to expose the additional pattern to the first side surface of the unit piece U1, the stacked body may be cut within the range of WA1 on the left side A1 of the first reference cutting line C1, and the size of WA1 may be greater than We / 2 and less than or equal to We. In this case, the first additional pattern may be exposed to the fifth surface, such as Fig.15 , Fig.16 and Fig.18 shown.

[0158] In addition, in order to expose the additional pattern to the second side surface of the unit chip U1, the stacked body can be cut within the range of WB2 on the right side B2 of the second reference cutting line C2, and the size of WB2 can be greater than We / 2 and less than or equal to We. In this case, the second additional pattern can be exposed to the sixth surface, such as Fig.14 , Fig.17 and Fig.18 shown.

[0159] After the stacked body cutting step, a side margin portion forming operation may be performed by attaching a ceramic green sheet for the side margin portion to first and second side surfaces of the die sheet that are opposite to each other in the third direction.

[0160] The ceramic green sheet for the side edge portion does not need to be particularly limited, and ceramic powder particles can be used to form the ceramic green sheet for the side edge portion, and the ceramic green sheet for forming the stacked body can also be used. For example, a slurry including ceramic powder particles, an organic solvent and a binder can be used to form the ceramic green sheet. Specifically, after adding additives to the ceramic powder particles, ethanol and toluene can be used as solvents and can be mixed with a dispersant, and then, their mixture can be mixed with a binder to form a ceramic green sheet. The ceramic powder particles can be BaTiO3-based ceramic powder particles, and can be, for example, BaTiO3 and (BaTiO3) formed by partially dissolving calcium (Ca) and / or zirconium (Zr) in BaTiO3. 1-x Ca x )TiO3(0 <x<1)、Ba(Ti1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0161] In addition, the green sheet for the side edge portion may have a higher Mg content than the green sheet for forming the stacked body in order to improve the bonding force with the stacked body. In this case, the Mg content may refer to the number of moles of Mg relative to 100 moles of Ti.

[0162] In addition, after sintering the unit sheet to which the green sheet for the side edge portion is attached, outer electrodes 131 and 132 may be formed on the third surface and the fourth surface of the main body 110 to obtain a multilayer electronic component.

[0163] The method of forming the outer electrodes 131 and 132 is not particularly limited, and a method of dipping into a paste including a conductive metal and glass may be used, or the outer electrodes 131 and 132 may also be formed by transferring a sheet including a conductive metal. In addition, the outer electrodes may be formed using a paste including a conductive metal and a resin, or formed using an atomic layer deposition (ALD) method, a molecular layer deposition (MLD) method, a chemical vapor deposition (CVD) method, and a sputtering method.

[0164] In addition, a plating process may be additionally performed so that the outer electrodes include plating layers 131b and 132b.

[0165] In addition, the Figure 20 to Figure 22 of the multilayer electronic component according to Comparative Example 1 Figure 23 to Figure 24 and the Figures 1 to 7 of the multilayer electronic component according to Comparative Example 2

[0166] Elements not mentioned in may be understood similarly to the elements in the exemplary embodiments of, for example, the dielectric layers 211 and 311, the covering portions 312 and 313, and the main body 310.

[0167] In addition, the expression "exemplary embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and explain different unique features. However, the embodiment presented above does not exclude the combination of features with another embodiment. For example, although a matter described in a specific embodiment is not described in another embodiment, the matter can be understood as a description related to another embodiment unless there is a description opposite or contradictory to the matter in another embodiment.

[0168] In the present disclosure, the terms are only used to describe specific embodiments and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, a singular form may also include a plural form.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; Side edge portions, respectively disposed on the fifth surface and the sixth surface of the main body; as well as external electrodes, respectively disposed on the third surface and the fourth surface of the body, At least one of the two ends of the internal electrode in the third direction is spaced apart from the corresponding side edge portion and has an average thickness smaller than an average thickness of a central portion of the internal electrode in the third direction.

2. The multilayer electronic component according to claim 1, wherein One of the two end portions of the inner electrode in the third direction is spaced apart from one of the side edge portions, and the other of the two end portions of the inner electrode in the third direction is disposed to contact the other of the side edge portions.

3. The multilayer electronic component according to claim 1, wherein: When, of the two ends of the inner electrode in the third direction, the end close to the fifth surface of the main body is defined as a first end and the end close to the sixth surface of the main body is defined as a second end, the first end is spaced apart from the fifth surface of the main body, and the second end is in contact with the sixth surface of the main body.

4. The multilayer electronic component according to claim 3, wherein: A spacing distance between the first end portion and the fifth surface of the body in the third direction is 5 μm or more.

5. The multilayer electronic component according to claim 3, wherein: The body further includes a first additional pattern contacting the fifth surface of the body and spaced apart from the first end.

6. The multilayer electronic component according to claim 5, wherein: A spacing distance between the first end portion and the first additional pattern in the third direction is 15 μm or more.

7. The multilayer electronic component according to claim 5, wherein: An end portion of the first additional pattern close to the first end portion and the first end portion among both end portions in the third direction have a shape bent toward the center of the body in the first direction.

8. The multilayer electronic component according to claim 5, wherein: In the first additional pattern, a thickness of a portion contacting the fifth surface of the body is greater than a thickness of an end portion close to the first end portion.

9. The multilayer electronic component according to claim 1, wherein: The two end portions of the inner electrode in the third direction are respectively spaced apart from the corresponding side edge portions.

10. The multilayer electronic component according to claim 9, wherein When, of the two ends of the inner electrode in the third direction, the end close to the fifth surface of the main body is defined as a first end and the end close to the sixth surface of the main body is defined as a second end, the sum of the distance between the first end and the fifth surface of the main body and the distance between the second end and the sixth surface of the main body is 15 μm or greater.

11. The multilayer electronic component according to claim 9, wherein When, of the two ends of the inner electrode in the third direction, the end close to the fifth surface of the main body is defined as a first end and the end close to the sixth surface of the main body is defined as a second end, the main body includes at least one of a first additional pattern contacting the fifth surface of the main body and being spaced apart from the first end and a second additional pattern contacting the sixth surface of the main body and being spaced apart from the second end.

12. The multilayer electronic component according to claim 11, wherein The body includes both the first additional pattern and the second additional pattern.

13. The multilayer electronic component according to claim 12, wherein: An end portion of the first additional pattern closer to the first end portion among the two ends in the third direction, an end portion of the second additional pattern closer to the second end portion among the two ends in the third direction, and the first and second ends of the internal electrode have a shape bent toward the center of the body in the first direction.

14. The multilayer electronic component according to claim 12, wherein: In the first additional pattern, a thickness of a portion in contact with the fifth surface of the body is greater than a thickness of an end portion close to the first end portion, and In the second additional pattern, a thickness of a portion contacting the sixth surface of the body is greater than a thickness of an end portion close to the second end portion.

15. The multilayer electronic component according to claim 1, wherein When a region between the at least one end portion of the internal electrode and the corresponding side margin portion is defined as an edge region, the corresponding side margin portion and the edge region have different compositions from each other.

16. The multilayer electronic component according to claim 15, wherein The number of moles of Mg relative to 100 moles of Ti included in the side edge portion is higher than the number of moles of Mg relative to 100 moles of Ti included in the edge region.

17. The multilayer electronic component according to claim 1, wherein: When a region between the at least one end portion of the inner electrode and the corresponding side edge portion is defined as an edge region, An average size of dielectric grains included in the respective side edge portions is smaller than an average size of dielectric grains included in the edge region.

18. The multilayer electronic component according to claim 1, wherein When the average size of dielectric grains in a region adjacent to at least one end portion of the inner electrode is defined as Gs1, the average size of dielectric grains in a region adjacent to the central portion of the inner electrode is defined as Gs2, and the average size of dielectric grains in a region adjacent to the outer surface of the side edge portion is defined as Gs3, the absolute value of the difference between Gs1 and Gs2 is smaller than the absolute value of the difference between Gs1 and Gs3.

19. The multilayer electronic component according to claim 1, wherein: The side edge portion includes a first side edge portion provided on the fifth surface of the main body and a second side edge portion provided on the sixth surface of the main body, The first side edge portion is arranged so as not to cover a portion of the fifth surface of the main body, and an end portion of the first side edge portion is arranged on the fifth surface of the main body, and The second side edge portion is disposed so as not to cover a portion of the sixth surface of the main body, and an end portion of the second side edge portion is disposed on the sixth surface of the main body.

20. The multilayer electronic assembly according to claim 1, wherein: A portion of at least one of the side edge portions is disposed on the first surface and the second surface of the body.

21. The multilayer electronic assembly of claim 1, wherein: When at least one of the inner electrodes is divided into 10 regions with equal intervals in the third direction and the 10 regions are respectively defined as a first region, a second region, a third region, a fourth region, a fifth region, a sixth region, a seventh region, an eighth region, a ninth region and a tenth region, the two ends of the inner electrode in the third direction refer to the first region and the tenth region, respectively, and the central portion of the inner electrode refers to the second region to the ninth region.

22. The multilayer electronic assembly of claim 1, wherein: A ratio of an average thickness of the both end portions of the internal electrode to an average thickness of the central portion of the internal electrode is 0.90 or less.

23. The multilayer electronic assembly of claim 1, wherein: At least one of the two end portions of the inner electrode in the third direction has a shape bent toward a center of the body in the first direction.

24. The multilayer electronic assembly of claim 1, wherein: An average width in the third direction from the at least one end portion of the internal electrode to the outer surface of the corresponding side edge portion is greater than or equal to 20 μm and less than or equal to 55 μm.

25. The multilayer electronic assembly of claim 24, wherein: An average size of the side edge portion in the third direction is 15 μm or less.

26. A method of manufacturing a multilayer electronic component, the method comprising: forming a plurality of conductive patterns on one surface of the ceramic green sheet in a first direction, the plurality of conductive patterns being arranged in a second direction perpendicular to the first direction and in a third direction perpendicular to the first direction and the second direction; obtaining a stacked body by stacking a plurality of the ceramic green sheets in the first direction; a stack cutting operation of cutting the stack along the second direction and the third direction to obtain a plurality of unit sheets, wherein during the cutting of the stack along the third direction, the stack is cut to obtain a unit sheet including a first internal electrode pattern and a second internal electrode pattern, in which a cut surface of a conductive pattern is exposed to one surface of the unit sheet in the second direction, in which a cut surface of a conductive pattern is exposed to another surface of the unit sheet opposite to the one surface in the second direction, and the stack is cut so that the conductive patterns of the first internal electrode pattern and the second internal electrode pattern are spaced apart from at least one side surface of a first side surface and a second side surface of the unit sheet opposite to each other in the third direction; as well as A side margin portion forming operation of attaching a ceramic green sheet for a side margin portion to the first side surface and the second side surface of the die.

27. The method of manufacturing a multilayer electronic component according to claim 26, wherein: When the spacing distance between the conductive pattern and the adjacent conductive pattern in the third direction is defined as We, during cutting of the stack along the second direction, the stack is cut within the range of We in the third direction from the center of the area where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction.

28. The method of manufacturing a multilayer electronic component according to claim 27, wherein: During cutting of the stacked body along the second direction, the stacked body is cut within a range smaller than We / 2 in the third direction from the center of the region where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction.

29. The method of manufacturing a multilayer electronic component according to claim 27, wherein: During cutting of the stacked body in the second direction, the stacked body is cut such that the conductive patterns of the first and second internal electrode patterns are not exposed to the first and second side surfaces of the die.

30. The method of manufacturing a multilayer electronic component according to claim 27, wherein: During cutting of the stacked body in the second direction, the stacked body is cut such that the conductive patterns of the first and second internal electrode patterns are exposed to one of the first and second side surfaces of the die.

31. The method of manufacturing a multilayer electronic component according to claim 26, wherein: When the spacing distance between the conductive pattern and the adjacent conductive pattern in the third direction is defined as We, during cutting of the stack along the second direction, the stack is cut within a range greater than We / 2 and less than or equal to We on the left or right side of the third direction from the center of the area where the conductive pattern is spaced apart from the adjacent conductive pattern in the third direction, so that an additional pattern adjacent to the first internal electrode pattern and the second internal electrode pattern is formed in the unit sheet, and the additional pattern is exposed to at least one of the first side surface and the second side surface.

32. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; Side edge portions, respectively disposed on the fifth surface and the sixth surface of the main body; as well as external electrodes, respectively disposed on the third surface and the fourth surface of the body, At least one of the two ends of the inner electrode in the third direction is spaced apart from the corresponding side edge portion and has a shape bent toward the center of the body in the first direction.

33. The multilayer electronic assembly of claim 32, wherein: All internal electrodes disposed in the body are spaced apart from the side edge portion in the third direction.

34. The multilayer electronic assembly of claim 32, wherein: When a region between the at least one end portion of the internal electrode and the corresponding side margin portion is defined as an edge region, the corresponding side margin portion and the edge region have different compositions from each other.

35. The multilayer electronic assembly of claim 32, wherein: A region of the internal electrode between the two end portions in the third direction and the side edge portion has a composition different from that of the side edge portion.

36. A multilayer electronic assembly comprising: a body including an effective portion, the effective portion forming a capacitor by including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; Side edge portions, respectively disposed on the fifth surface and the sixth surface of the main body; as well as external electrodes, respectively disposed on the third surface and the fourth surface of the body, wherein at least one end of the two ends of at least one internal electrode in the effective portion in the third direction is spaced apart from the corresponding side edge portion, and When a region between the at least one end portion of the at least one internal electrode and the corresponding side margin portion is defined as an edge region, the corresponding side margin portion and the edge region have different compositions from each other.

37. The multilayer electronic assembly of claim 36, wherein: The body further includes an additional pattern disposed in the edge region and in contact with an inner side surface of the corresponding side edge portion, and The additional pattern is spaced apart from the at least one end portion of the at least one internal electrode in the third direction.

38. The multilayer electronic assembly of claim 37, wherein: One end of the additional pattern away from the inner side surface of the corresponding side edge portion and the at least one end of the at least one internal electrode facing the one end of the additional pattern have shapes bent toward the center of the body in the first direction.

39. The multilayer electronic assembly of claim 37, wherein: The thickness of one end of the additional pattern away from the inner side surface of the corresponding side edge portion is smaller than the thickness of the other end of the additional pattern in contact with the inner side surface of the corresponding side edge portion, and A thickness of the at least one end portion of the at least one internal electrode facing the one end portion of the additional pattern is smaller than a thickness of a central portion of the internal electrode in the third direction.

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