Processing equipment for chip scribing dissociation

Abstract

The invention belongs to the technical field of chip processing, and particularly relates to a processing device for chip scribing dissociation, which is characterized in that the processing device comprises an operation table, the top of the operation table is provided with a fixing mechanism, one side of the top of the operation table is provided with a translation mechanism, and the top of the translation mechanism is provided with a supporting seat; a lifting mechanism is fixed to the top of the supporting seat, a moving mechanism is fixed to the position, close to the top, of one side of the lifting mechanism, a cutting mechanism is fixed to the bottom of the moving mechanism and located above the fixing mechanism, a pressing mechanism is arranged on one side of the cutting mechanism, and the pressing mechanism and the cutting mechanism are matched. According to the chip cutting device, fixing treatment can be conveniently conducted on chip cutting, and the situation that in the cutting process, when the cutting mechanism moves towards one side, the chip which is being cut deflects towards one side under the action of the cutting mechanism, so that deviation of scribing dissociation of the chip is caused, and then chip machining is affected is prevented.

Description

Technical Field

[0001] The present invention relates to the field of chip processing, and in particular to a processing device for chip dicing and dissociation. Background Art

[0002] Wafer chips are the basic materials for manufacturing semiconductor chips. Various circuit component structures can be processed on wafer chips to become IC products with specific electrical functions. Wafer dicing machines usually use precise mechanical transmission systems, high-precision cutting tools and advanced control systems to ensure the quality and efficiency of dicing.

[0003] After searching, a Chinese patent application with application publication number CN116864420A discloses a chip slicing and separation device, which relates to the field of chip slicing technology; and the present invention includes an operating table, a placement plate is fixedly provided on the outer side of the operating table, and a support plate is fixedly provided on the side of the placement plate away from the operating table; in the present invention, a film pasting mechanism and a flipping mechanism are provided, which can quickly paste a film on the back of the wafer chip, avoiding the problem of manual film pasting that is not flat enough, thereby achieving the purpose of flat film pasting, and a film pasting mechanism and a flipping mechanism are provided. The back of the wafer chip can be quickly pasted with a film, avoiding the problem of manual film pasting that is not flat enough, thereby achieving the purpose of flat film pasting, and a separation mechanism and an adjustment mechanism are provided in the present invention. The angle of the water spray head can be adjusted, avoiding the problem of inconvenience in adjusting the angle of the water spray head during the rinsing process, so that the angle of the water spray head can be adjusted according to the slicing and separation situation, so that the residue removal effect is better.

[0004] When the chip is being sliced ​​and separated, the chip is usually placed on a device and cut by a cutting mechanism to complete the chip slicing and separation. However, during the cutting process, the cutting mechanism will move to one side. At this time, the chip being cut will deflect to one side under the action of the cutting mechanism, which will cause the chip slicing and separation to deviate, thereby affecting the chip processing. Summary of the invention

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A processing device for chip dicing and dissociation comprises an operating table, wherein a fixing mechanism is arranged on the top of the operating table, a translation mechanism is arranged on one side of the top of the operating table, and a support seat is arranged on the top of the translation mechanism, a lifting mechanism is fixed on the top of the support seat, and a moving mechanism is fixed on one side of the lifting mechanism near the top, a cutting mechanism is fixed on the bottom of the moving mechanism, and the cutting mechanism is located above the fixing mechanism, and a pressing mechanism is arranged on one side of the cutting mechanism, and the pressing mechanism and the cutting mechanism are matched.

[0007] Preferably, the fixing mechanism includes a support plate, two side plates and two fastening bolts, and the bottom of the support plate is connected to the top of the operating table by bolts, and the two side plates are symmetrically fixed on both sides of the top of the support plate by bolts, and threaded holes are opened through the tops of the two side plates, which are threadedly connected to the fastening bolts, and a plurality of staggered tooth blocks are arranged on the top of the support plate.

[0008] Preferably, the translation mechanism includes a translation rail, a first screw and a first motor, and the bottom of the translation rail is fixedly connected to the top of the operating table, a moving groove is provided on the top of the translation rail, and the opposite sides of the moving groove are rotatably connected to the two ends of the first screw through bearings, one side of the translation rail is connected to the first motor by bolts, and the inner wall of the moving groove is slidably connected with a translation block, a threaded opening is provided on one side of the translation block, and the threaded opening is threadedly connected to the first screw, and the top of the translation block is fixedly connected to the bottom of the support seat.

[0009] Preferably, the lifting mechanism consists of a lifting frame, a lifting block and a hydraulic rod, and the bottom of the lifting frame is connected to the top of the support seat by bolts, the inner wall of the lifting frame is slidably connected to the lifting block, and the two ends of the hydraulic rod are respectively connected to the top of the lifting frame and the top of the lifting block by bolts.

[0010] Preferably, positioning openings are formed on opposite sides of the lifting frame, and inner walls of the two positioning openings are slidably connected with positioning blocks, which are fixedly connected to the lifting block.

[0011] Preferably, the moving mechanism includes a fixed plate, a second screw and a second motor, and one side of the fixed plate is fixedly connected to the lifting block, and through holes are opened on both sides of the top of the fixed plate, one side of one through hole is fixedly connected to the second motor, and the opposite sides of the other through hole are rotatably connected to the second screw through bearings, one end of the second motor is fixedly connected to the second screw, and the inner wall of one through hole is slidably connected to the moving block, and a threaded through hole is opened on one side of the moving block, and the threaded through hole is threadedly connected to the second screw.

[0012] Preferably, the cutting mechanism consists of a bracket, a rotating rod, a cutting disc and a third motor, and the top of the bracket is fixedly connected to the bottom of the moving block, the opposite sides of the bracket are rotationally connected to the rotating rod through bearings, the cutting disc is fixedly sleeved on the outer wall of the rotating rod, one side of the bracket is connected to the third motor by bolts, and one end of the third motor is fixedly connected to the rotating rod.

[0013] Preferably, the pressing mechanism is composed of a pressing plate and a buffer pad, and the bottom of the pressing plate and the top of the buffer pad are bonded, and protrusions are provided on both sides of the outer wall of the rotating rod, and the two protrusions are both U-shaped, and the outer wall of the protrusion is rotatably sleeved with a shaft sleeve, and a push plate is connected between the shaft sleeve and the pressing plate through a hinge, and springs are connected between the two sides of the top of the pressing plate and the bracket through bolts.

[0014] The beneficial effects of the present invention are:

[0015] The present invention provides a pressing mechanism. When the rotating rod rotates, the protrusion will rotate synchronously with the rotation of the rotating rod. At this time, the push plate will drive the pressing plate to move back and forth up and down under the action of the protrusion and the shaft sleeve. When the pressing plate drives the buffer pad to move downward, the buffer pad will be fixed on the top of the chip, so as to facilitate the fixing of the chip during cutting and prevent the cutting mechanism from moving to one side during the cutting process. The chip being cut will be deflected to one side under the action of the cutting mechanism, which will cause the chip dicing dissociation to deviate, thereby affecting the chip processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a processing device for chip dicing and dissociation proposed by the present invention;

[0017] Figure 2 A schematic diagram of the structure of a fixing mechanism of a processing device for chip dicing and dissociation proposed by the present invention;

[0018] Figure 3 A schematic diagram of the structure of a translation mechanism of a processing device for chip dicing and dissociation proposed by the present invention;

[0019] Figure 4 A schematic diagram of the structure of a lifting mechanism and a moving mechanism of a processing device for chip dicing and dissociation proposed by the present invention;

[0020] Figure 5 A schematic diagram of the structure of a cutting mechanism of a processing device for chip dicing and dissociation proposed by the present invention;

[0021] Figure 6 The present invention provides a schematic diagram of the structure of a pressing mechanism for a processing device for chip dicing and dissociation.

[0022] In the attached drawings: 1. operating table; 2. fixing mechanism; 3. translation mechanism; 4. supporting seat; 5. lifting mechanism; 6. moving mechanism; 7. cutting mechanism; 8. supporting plate; 9. side plate; 10. fastening bolt; 11. tooth block; 12. translation rail; 13. first motor; 14. moving groove; 15. first screw; 16. translation block; 17. lifting frame; 18. lifting block; 19. hydraulic rod; 20. positioning port; 21. positioning block; 22. fixing plate; 23. second motor; 24. moving block; 25. through port; 26. second screw; 27. bracket; 28. cutting disc; 29. ​​third motor; 30. pressing mechanism; 31. rotating rod; 32. bushing; 33. protrusion; 34. push plate; 35. pressing plate; 36. buffer pad. DETAILED DESCRIPTION

[0023] Reference Figure 1-Figure 6 A processing equipment for chip dicing and dissociation comprises an operating table 1, a fixing mechanism 2 is arranged on the top of the operating table 1, a translation mechanism 3 is arranged on one side of the top of the operating table 1, and a support seat 4 is arranged on the top of the translation mechanism 3, a lifting mechanism 5 is fixed on the top of the support seat 4, and a moving mechanism 6 is fixed on one side of the lifting mechanism 5 near the top, a cutting mechanism 7 is fixed on the bottom of the moving mechanism 6, and the cutting mechanism 7 is located above the fixing mechanism 2, a pressing mechanism 30 is arranged on one side of the cutting mechanism 7, and the pressing mechanism 30 cooperates with the cutting mechanism 7 to facilitate the fixed processing of the chip cutting, to prevent the cutting mechanism from moving to one side during the cutting process, and the chip being cut will be deflected to one side under the action of the cutting mechanism, which will cause the chip dicing and dissociation to deviate, thereby affecting the chip processing.

[0024] On the basis of the above, the fixing mechanism 2 includes a support plate 8, two side plates 9 and two fastening bolts 10, and the bottom of the support plate 8 is connected to the top of the operating table 1 by bolts, and the two side plates 9 are symmetrically fixed on both sides of the top of the support plate 8 by bolts. Threaded holes are opened through the tops of the two side plates 9, and the threaded holes are threadedly connected to the fastening bolts 10. A plurality of staggered tooth blocks 11 are arranged on the top of the support plate 8. The fastening bolts 10 are turned to fix the two sides of the top of the chip through the fastening bolts 10.

[0025] On the basis of the above, the translation mechanism 3 includes a translation rail 12, a first screw 15 and a first motor 13, and the bottom of the translation rail 12 is fixedly connected to the top of the operating table 1, and a moving groove 14 is provided at the top of the translation rail 12. The opposite sides of the moving groove 14 and the two ends of the first screw 15 are rotatably connected through bearings. One side of the translation rail 12 is connected to the first motor 13 by bolts, and the inner wall of the moving groove 14 is slidably connected with a translation block 16. A threaded opening is provided on one side of the translation block 16, and the threaded opening is threadedly connected to the first screw 15. The top of the translation block 16 is fixedly connected to the bottom of the support seat 4, driving the cutting mechanism 7 to move laterally to facilitate the adjustment of the dissociation position of the chip.

[0026] On the basis of the above, the lifting mechanism 5 is composed of a lifting frame 17, a lifting block 18 and a hydraulic rod 19, and the bottom of the lifting frame 17 is connected to the top of the support seat 4 by bolts, the inner wall of the lifting frame 17 is slidably connected to the lifting block 18, and the two ends of the hydraulic rod 19 are respectively connected to the top of the lifting frame 17 and the top of the lifting block 18 by bolts, driving the cutting mechanism 7 to move downward, and the third motor 29 will drive the cutting disk 28 to rotate, so that the chip is diced and separated by the cutting disk 28.

[0027] On the basis of the above, positioning holes 20 are penetrated on the opposite sides of the lifting frame 17, and the inner walls of the two positioning holes 20 are slidably connected with positioning blocks 21, which are fixedly connected to the lifting block 18 to position the downward movement of the cutting mechanism 7.

[0028] On the basis of the above, the moving mechanism 6 includes a fixed plate 22, a second screw 26 and a second motor 23, and one side of the fixed plate 22 is fixedly connected to the lifting block 18, and through holes 25 are opened on both sides of the top of the fixed plate 22, one side of one through hole 25 is fixedly connected to the second motor 23, and the opposite sides of the other through hole 25 are rotatably connected to the second screw 26 through bearings, one end of the second motor 23 is fixedly connected to the second screw 26, and the inner wall of one of the through holes 25 is slidably connected with a moving block 24, and a threaded through hole is opened on one side of the moving block 24, and the threaded through hole is threadedly connected to the second screw 26.

[0029] On the basis of the above, the cutting mechanism 7 is composed of a bracket 27, a rotating rod 31, a cutting disc 28 and a third motor 29, and the top of the bracket 27 is fixedly connected to the bottom of the moving block 24, and the opposite sides of the bracket 27 are rotatably connected to the rotating rod 31 through bearings. The cutting disc 28 is fixedly sleeved on the outer wall of the rotating rod 31, one side of the bracket 27 is connected to the third motor 29 by bolts, and one end of the third motor 29 is fixedly connected to the rotating rod 31.

[0030] On the basis of the above, the pressing mechanism 30 is composed of a pressing plate 35 and a buffer pad 36, and the bottom of the pressing plate 35 and the top of the buffer pad 36 are bonded, and protrusions 33 are provided on both sides of the outer wall of the rotating rod 31. The two protrusions 33 are both U-shaped, and the outer wall of the protrusion 33 is rotatably sleeved with a shaft sleeve 32. A push plate 34 is connected between the shaft sleeve 32 and the pressing plate 35 through a hinge, and springs are connected between the two sides of the top of the pressing plate 35 and the bracket 27 through bolts.

[0031] In summary, with the aid of the above technical solution of the present invention: in specific use, the chip is placed on the fixing mechanism 2, the fastening bolt 10 is screwed, and the two sides of the top of the chip are fixed by the fastening bolt 10. After the fixation is completed, the lifting mechanism 5 is started, and the lifting mechanism 5 will drive the cutting mechanism 7 to move downward, and the third motor 29 will drive the cutting disk 28 to rotate, so as to perform dicing and separation processing on the chip through the cutting disk 28. During this period, the front and rear positions of the cutting mechanism 7 are adjusted by the moving mechanism 6, and the cutting mechanism 7 is driven to move horizontally by the translation mechanism 3, so as to adjust the separation position of the chip. During this period, when the rotating rod 31 rotates, the protrusion 33 will rotate with the rotation. The push plate 34 will rotate synchronously with the rotation of the rod 31. At this time, the push plate 34 will drive the pressing plate 35 to move back and forth up and down under the action of the protrusion 33 and the sleeve 32. When the pressing plate 35 drives the buffer pad 36 to move downward, the buffer pad 36 will be fixed on the top of the chip, so as to facilitate the fixing of the chip cutting and prevent the cutting mechanism 7 from moving to one side during the cutting process. The chip being cut will be deflected to one side under the action of the cutting mechanism 7, which will cause the chip dicing separation to deviate, thereby affecting the chip processing. When the pressing plate 35 drives the buffer pad 36 to move upward, the buffer pad 36 will move away from the chip to facilitate the adjustment of the chip cutting position.

[0032] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A processing device for chip dicing and dissociation, comprising an operating table (1), characterized in that: The top of the operating table (1) is provided with a fixing mechanism (2), one side of the top of the operating table (1) is provided with a translation mechanism (3), and the top of the translation mechanism (3) is provided with a support seat (4), the top of the support seat (4) is fixed with a lifting mechanism (5), and a moving mechanism (6) is fixed at a position close to the top of one side of the lifting mechanism (5), the bottom of the moving mechanism (6) is fixed with a cutting mechanism (7), and the cutting mechanism (7) is located above the fixing mechanism (2), and one side of the cutting mechanism (7) is provided with a pressing mechanism (30), and the pressing mechanism (30) and the cutting mechanism (7) are matched.

2. A processing device for chip dicing and dissociation according to claim 1, characterized in that: The fixing mechanism (2) comprises a support plate (8), two side plates (9) and two fastening bolts (10), and the bottom of the support plate (8) is connected to the top of the operating table (1) by bolts, and the two side plates (9) are symmetrically fixed to the two sides of the top of the support plate (8) by bolts, and the tops of the two side plates (9) are penetrated by threaded holes, and the threaded holes are threadedly connected to the fastening bolts (10), and the top of the support plate (8) is provided with a plurality of staggered tooth blocks (11).

3. The processing equipment for chip dicing and dissociation according to claim 1, characterized in that: The translation mechanism (3) comprises a translation rail (12), a first screw rod (15) and a first motor (13), and the bottom of the translation rail (12) is fixedly connected to the top of the operating table (1), a moving groove (14) is provided at the top of the translation rail (12), and the two opposite sides of the moving groove (14) and the two ends of the first screw rod (15) are rotatably connected through bearings, one side of the translation rail (12) is connected to the first motor (13) by bolts, and the inner wall of the moving groove (14) is slidably connected with a translation block (16), one side of the translation block (16) is penetrated by a threaded opening, and the threaded opening is threadedly connected to the first screw rod (15), and the top of the translation block (16) is fixedly connected to the bottom of the support seat (4).

4. The processing equipment for chip dicing and dissociation according to claim 3, characterized in that: The lifting mechanism (5) is composed of a lifting frame (17), a lifting block (18) and a hydraulic rod (19), wherein the bottom of the lifting frame (17) is connected to the top of the support seat (4) by bolts, the inner wall of the lifting frame (17) is slidably connected to the lifting block (18), and the two ends of the hydraulic rod (19) are respectively connected to the top of the lifting frame (17) and the top of the lifting block (18) by bolts.

5. The processing equipment for chip dicing and dissociation according to claim 4, characterized in that: Positioning openings (20) are formed through the two opposite sides of the lifting frame (17), and the inner walls of the two positioning openings (20) are slidably connected with positioning blocks (21), and the positioning blocks (21) are fixedly connected to the lifting block (18).

6. The processing equipment for chip dicing and dissociation according to claim 4, characterized in that: The moving mechanism (6) comprises a fixed plate (22), a second screw rod (26) and a second motor (23), and one side of the fixed plate (22) is fixedly connected to the lifting block (18), and both sides of the top of the fixed plate (22) are penetrated with through holes (25), one side of one through hole (25) is fixedly connected to the second motor (23), and the opposite two sides of the other through hole (25) are rotatably connected to the second screw rod (26) through bearings, and one end of the second motor (23) is fixedly connected to the second screw rod (26), and the inner wall of one through hole (25) is slidably connected with a moving block (24), and a threaded through hole is penetrated with one side of the moving block (24), and the threaded through hole is threadedly connected to the second screw rod (26).

7. The processing equipment for chip dicing and dissociation according to claim 6, characterized in that: The cutting mechanism (7) is composed of a bracket (27), a rotating rod (31), a cutting disc (28) and a third motor (29), wherein the top of the bracket (27) is fixedly connected to the bottom of the moving block (24), the opposite sides of the bracket (27) and the rotating rod (31) are rotatably connected via bearings, the cutting disc (28) is fixedly sleeved on the outer wall of the rotating rod (31), one side of the bracket (27) is connected to the third motor (29) via bolts, and one end of the third motor (29) is fixedly connected to the rotating rod (31).

8. The processing equipment for chip dicing and dissociation according to claim 7, characterized in that: The pressing mechanism (30) is composed of a pressing plate (35) and a buffer pad (36), and the bottom of the pressing plate (35) and the top of the buffer pad (36) are bonded, and protrusions (33) are provided on both sides of the outer wall of the rotating rod (31), and the two protrusions (33) are both U-shaped, and the outer wall of the protrusion (33) is rotatably sleeved with a shaft sleeve (32), and a push plate (34) is connected between the shaft sleeve (32) and the pressing plate (35) through a hinge, and springs are connected between the two sides of the top of the pressing plate (35) and the bracket (27) through bolts.

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