Heat dissipation structure applied to space equipment large heat dissipation integrated circuit and satellite equipment

Abstract

The application relates to a heat dissipation structure applied to a large-heat-dissipation integrated circuit of a space device and a satellite device, and relates to the satellite chip heat dissipation technical field. The heat dissipation structure comprises a first structure box body and a second structure box body which are vertically installed on a space device mounting plate surface and are arranged side by side. A first circuit board for mounting a first chip is fixedly arranged in the first structure box body, and the first chip is mounted at a position close to the mounting plate surface. A second chip is fixedly arranged in the second structure box body, and the second chip is directly sintered on the second structure box body. The position, at which the second chip is fixedly arranged on the second structure box body, is close to the mounting plate surface. The application further discloses a satellite device comprising the heat dissipation structure. The technical scheme in the application improves the chip heat dissipation efficiency of the space device, ensures the stable work of the large-heat-dissipation integrated circuit and the chip in the satellite device, and improves the reliability and service life of the satellite device.

Description

Technical Field

[0001] This application relates to the field of satellite chip heat dissipation technology, and in particular to a heat dissipation structure for high heat dissipation integrated circuits in space equipment and satellite equipment. Background Technology

[0002] In the field of space equipment, with technological advancements, the integration level of individual components is constantly increasing. For example, in some satellite equipment products, heat is mainly concentrated in a few high-heat-dissipation chips, including digital signal processing chips and power amplifier chips. These chips are typically distributed in different structural housings, and each chip consumes a significant amount of power; for instance, the power consumption of a digital signal processing chip can reach 20W, while that of a power amplifier chip can be as high as 50W. To ensure that these chips can operate stably for extended periods in a vacuum environment, effective heat dissipation measures must be implemented.

[0003] Because space equipment such as satellites operates in a vacuum environment, its heat dissipation mainly relies on contact cooling. This means that heat from the chip is first conducted to the individual component's structural frame, and then diffused throughout the entire satellite via the mounting surface between the individual component's structural frame and the satellite's overall structure. In this process, a larger individual component's heat capacity and a smaller thermal resistance along the conduction path are more conducive to heat dissipation. However, the current problem is that multiple structural housings have high temperatures and concentrated heat. Simultaneously, space equipment needs to operate continuously. Limited by the thermal conductivity of current materials, traditional heat dissipation methods cannot meet the simultaneous heat dissipation needs of multiple components. This leads to malfunctions in the chip when effective heat dissipation measures are not implemented. Without intervention, the junction temperature of a digital signal processing chip can exceed 125°C after just 10 minutes of operation, making long-term stable operation impossible. Summary of the Invention

[0004] In order to improve the heat dissipation effect of high heat dissipation integrated circuits in space equipment, thereby ensuring the stable operation, reliability and service life of space equipment, this application provides a heat dissipation structure for high heat dissipation integrated circuits in space equipment and satellite equipment.

[0005] Firstly, the heat dissipation structure for high heat dissipation integrated circuits in space equipment provided in this application adopts the following technical solution:

[0006] A heat dissipation structure for high heat dissipation integrated circuits in space equipment includes a first structural box and a second structural box, both vertically mounted on the mounting plate of the space equipment, with the first structural box and the second structural box arranged side by side.

[0007] The first structural box is fixedly provided with a first circuit board for mounting a first chip, and the first chip is mounted in a position adjacent to or close to the mounting plate. The second structural box is fixedly provided with a second chip, and the second chip is directly sintered on the second structural box. The position of the second chip on the second structural box is adjacent to or close to the mounting plate.

[0008] The first chip can be a digital signal processing chip, and the second chip can be a power amplifier chip. By adopting the above technical solution, the first and second structural housings are arranged side-by-side perpendicular to the mounting plate of the space equipment, ensuring each housing has a good heat conduction path and reducing obstacles and interference during heat transfer. Simultaneously, high-heat-dissipation devices such as the first and second chips are placed as close as possible to the bottom mounting plate, thereby shortening the heat conduction path and improving heat conduction efficiency. Furthermore, for the second chip, it is directly sintered onto the structural frame of the second structural housing, achieving efficient heat conduction between the second chip and the structural frame, reducing thermal resistance, and allowing the heat generated by the second chip to be quickly dissipated. The technical solution of this application effectively reduces the operating temperature of various chips, ensuring that multiple chips can operate stably for extended periods in a vacuum environment, thus improving the overall reliability and stability of the space equipment. Thermal testing has verified that, inside a vacuum chamber, when the temperature of the heat-conducting surface is controlled at 55°C, the junction temperature of the first chip is stabilized below 83°C using the technical solution in this application. This effectively avoids abnormal operation caused by excessively high junction temperature and ensures stable operation of the chip for a long time. Compared with the situation where the chip can only work for 10 minutes and the junction temperature exceeds 125°C when no measures are taken, this is a significant improvement.

[0009] Optionally, a heat-conducting block is provided on the top of the first chip; one side of the heat-conducting block is attached to the side of the structural frame of the first structural box, and a heat-conducting pad is provided between the other side of the heat-conducting block and the top surface of the first chip.

[0010] By adopting the above technical solution, the heat-conducting block makes large-area contact with the bottom of the structural frame of the first structural box, effectively transferring the heat generated by the first chip to the structural frame of the first structural box, thereby improving the heat dissipation capacity of the first chip.

[0011] Optionally, a gap of 0.25 to 0.35 mm is reserved between the heat-conducting block and the top surface of the first chip, the thickness of the heat-conducting pad is 0.45 to 0.55 mm, and the heat-conducting pad is embedded between the heat-conducting block and the top surface of the first chip.

[0012] A 0.3mm gap can be reserved between the heatsink and the top surface of the first chip, and a 0.5mm thermal pad is embedded in the gap. During assembly, the heatsink is first precisely machined to ensure that the flatness of its contact area with the bottom of the structural frame of the first structural housing is within 20μm. Then, the 0.5mm thick thermal pad is placed in the 0.3mm gap between the first chip and the heatsink. The heatsink is then fixed to the structural frame of the first structural housing using screws or clips. During the fixing process, it is ensured that the thermal pad is evenly stressed without wrinkles or gaps. By adopting the above technical solution, heat can be smoothly conducted from the first chip to the heatsink, and then to the structural frame of the first structural housing, improving the heat dissipation efficiency of the first chip.

[0013] Optionally, the heat-conducting block is made of graphene-reinforced metal matrix composite material; the heat-conducting pad is made of nano-silicone rubber material.

[0014] By adopting the above technical solution, the ultra-high thermal conductivity of graphene can significantly enhance the thermal conductivity of the heat-conducting block, enabling the heat generated by the first chip to be conducted more quickly to the structural frame of the first structural box. The uniformly dispersed graphene nanosheets in the heat-conducting block can form a highly efficient thermal conduction network, with a thermal conductivity more than 5 times higher than that of ordinary metal heat-conducting blocks. The heat-conducting pad is filled with nanoscale metal thermally conductive particles, which can adaptively fill the tiny gaps between the chip and the heat-conducting block under certain pressure, ensuring good thermal contact. Simultaneously, its thermal conductivity is 60% higher than that of traditional heat-conducting pads, effectively reducing interfacial thermal resistance.

[0015] Optionally, the second chip is sintered onto the second structural housing using sintered silver paste. The sintering temperature is between 150°C and 300°C, the pressure applied during sintering is between 15MPa and 30MPa, and the sintering time is between 5 and 30 minutes.

[0016] By adopting the above technical solution, the thermal conductivity of sintered silver can reach 220 W / m / K, which is far higher than that of traditional solder alloys and conductive adhesives. This allows the first chip using sintered silver paste to accelerate heat conduction, resulting in significant advantages in heat dissipation performance and efficiency. Furthermore, the sintered silver paste has good adhesion, maintaining the stability and reliability of the first chip at high temperatures. In addition, the sintered silver paste is non-flammable, non-explosive, and environmentally friendly during use.

[0017] Optionally, the structural frames of both the first and second structural boxes are made of carbon / aluminum composite materials or carbon fiber reinforced copper-based composite materials.

[0018] By adopting the above technical solutions, novel lightweight, high thermal conductivity composite materials such as carbon / aluminum or carbon fiber reinforced copper-based composites are selected as the base material for the structural frame. These materials possess the low-density characteristics of carbon fiber, effectively reducing the overall weight of the satellite, while also exhibiting high thermal conductivity, further improving heat transfer efficiency. Compared to traditional pure metal structural frames, the thermal conductivity can be increased by more than 30%, and the weight reduced by more than 20%.

[0019] Optionally, both the first and second structural boxes are provided with auxiliary heat conduction channels, and low-boiling-point working fluids are provided in the auxiliary heat conduction channels.

[0020] By adopting the above technical solution, a microchannel structure is designed inside the structural frames of the first and second structural housings, and a low-boiling-point working fluid is filled in the microchannels. When the chip's heat is conducted to the structural frames of the first and second structural housings, the low-boiling-point working fluid boils and vaporizes upon heating, rapidly carrying away the heat, and then recondenses in the low-temperature region of the structural frame, forming a highly efficient gas-liquid two-phase circulating heat dissipation system.

[0021] Optionally, at least three sets of auxiliary heat conduction channels are provided at intervals on the structural frames of both the first and second structural boxes. The interval between two adjacent sets of auxiliary heat conduction channels is 2mm to 6mm. Each set of auxiliary heat conduction channels is arranged in a ring shape along the circumference of the structural frame of the first or second structural box. The cross-section of each set of auxiliary heat conduction channels is circular and the inner diameter of the auxiliary heat conduction channel is 0.5mm to 1.8mm. The low-boiling-point working fluid is ammonia or acetone.

[0022] By adopting the above technical solution, thermal tests have verified that the heat dissipation efficiency of the chip can be improved by more than 80%.

[0023] Optionally, a graphene unidirectional heat dissipation plate is further provided between the first and second structural boxes and the space equipment mounting plate. The graphene unidirectional heat dissipation plate includes a heat dissipation layer, a heat transfer layer, and a heat absorption layer. The heat transfer layer is disposed between the heat dissipation layer and the heat absorption layer. The heat absorption layer is in close contact with the structural frame of the first and second structural boxes, and the heat dissipation layer is in close contact with the space equipment mounting plate. The heat transfer layer includes a heat insulation material layer and heat-conducting microcapsules. The heat insulation material layer forms a honeycomb structure, and the heat-conducting microcapsules are disposed in the honeycomb pores of the heat insulation material layer and filled with gas or liquid.

[0024] By adopting the above technical solution, unidirectional heat conduction and dissipation can be achieved, avoiding bidirectional heat transfer. This allows the heat generated by the chip to be dissipated efficiently, and when the entire space device is facing the sun and receiving significant thermal radiation, heat will not be transferred to the chip.

[0025] Secondly, the satellite equipment provided in this application adopts the following technical solution:

[0026] A satellite device includes a frame and multiple sets of solar panels disposed on the frame. The satellite device also includes the aforementioned heat dissipation structure. The space device mounting plate is located on the inner side of the frame, and the first structural box and the second structural box are disposed within the frame.

[0027] By adopting the above technical solution, the satellite equipment has a better chip heat dissipation effect, ensuring the stable operation of high heat-consuming integrated circuits and chips in the satellite equipment, reducing equipment failures caused by overheating, improving the overall reliability of the satellite equipment, extending the service life of the satellite equipment, and reducing the maintenance cost and risk of the satellite equipment.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] 1. This application optimizes the heat dissipation structure of chips in space equipment, ensuring the stable operation of high heat-consuming integrated circuits and chips in space equipment such as satellites, reducing equipment failures caused by overheating, extending equipment lifespan, reducing equipment maintenance costs and risks, and providing strong support for the reliable operation of space equipment in complex missions. 2. In this application, by arranging the first structural box and the second structural box side by side perpendicular to the space equipment mounting plate, each structural box has a good heat conduction path, reducing obstacles and interference in the heat conduction process.

[0030] 3. In this application, high heat-dissipating devices such as the first chip and the second chip are placed as close as possible to the bottom mounting plate surface, thereby shortening the heat conduction path and improving the heat conduction efficiency.

[0031] 4. In this application, the second chip is directly sintered onto the structural frame of the second structural box to achieve efficient heat conduction between the second chip and the structural frame of the second structural box, reduce thermal resistance, and enable the heat generated by the second chip to be quickly conducted away.

[0032] 5. In this application, by setting a heat-conducting block and a heat-conducting pad on the first chip, the heat generated by the first chip is effectively conducted to the structural frame of the first structural box, thereby improving the heat dissipation capacity of the first chip.

[0033] 6. In this application, a microchannel structure is designed inside the structural frames of the first and second structural housings, and a low-boiling-point working fluid is filled inside the microchannels. When the chip's heat is conducted to the structural frames of the first and second structural housings, the low-boiling-point working fluid boils and vaporizes upon heating, rapidly carrying away the heat, and then recondenses in the low-temperature region of the structural frame, forming a highly efficient gas-liquid two-phase circulating heat dissipation system, which significantly improves the chip's heat dissipation efficiency in a vacuum environment. Attached Figure Description

[0034] Figure 1 This is a three-dimensional structural diagram of the satellite equipment in this application.

[0035] Figure 2 This is a schematic diagram of the internal structure of the satellite equipment in this application.

[0036] Figure 3 yes Figure 2 A magnified schematic diagram of a portion of the structure.

[0037] Figure 4 This is a schematic diagram of the auxiliary heat conduction channel in the heat dissipation structure of this application.

[0038] Figure 5 This is a schematic diagram of the graphene unidirectional heat sink in the heat dissipation structure of this application.

[0039] In the picture:

[0040] 10. Solar panel; 20. Frame; 21. Mounting plate; 30. First structural box; 40. Second structural box; 50. First circuit board; 60. First chip; 70. Second chip; 80. Thermal block; 90. Thermal pad; 100. Auxiliary thermal channel; 110. Graphene unidirectional heat dissipation plate; 111. Heat dissipation layer; 112. Heat transfer layer; 1121. Thermal insulation material layer; 1122. Thermally conductive microcapsule; 113. Heat absorption layer. Detailed Implementation

[0041] The following will be combined with the appendix Figure 1 - Appendix Figure 5 The technical solutions in the embodiments of the present invention are clearly and completely described herein. The described embodiments are merely possible technical implementations of the present invention and not all possible implementations. Those skilled in the art can, in conjunction with the embodiments of the present invention, obtain other embodiments without creative effort, and these embodiments are also within the protection scope of the present invention.

[0042] Reference Figure 1 and Figure 2As shown, the heat dissipation structure for high heat dissipation integrated circuits in space equipment described in this application can be specifically applied to satellite equipment. The satellite equipment in this application includes a frame 20 and multiple sets of solar panels 10 mounted on the frame 20. The frame 20 has a cuboid or cubic structure. There can be two or four sets of solar panels 10, symmetrically arranged on both sides of the frame 20, used to power the entire satellite equipment. The solar panels 10 can be folded and retracted. One inner wall of the frame 20 has a mounting plate 21. Different functional units are installed inside the frame 20, each unit corresponding to a structural box, such as a digital signal processing module and a signal modulation and demodulation processing module. This application uses two units as an example, with a first structural box 30 and a second structural box 40 respectively installed inside the frame 20. The first structural box 30 corresponds to the digital signal processing module, and the second structural box 40 corresponds to the signal modulation and demodulation processing module.

[0043] This application rationally designs the mounting structure of the first structural housing 30 and the second structural housing 40, and optimizes the heat dissipation path of the chip to form a complete set of efficient heat dissipation structure. This ensures the stable operation of high heat dissipation integrated circuits and chips in satellite equipment, reduces equipment failures caused by overheating, extends the service life of satellite equipment, reduces the maintenance cost and risk of satellite equipment, and provides strong support for the reliable operation of satellite equipment in complex missions.

[0044] Specifically, refer to Figure 2 and Figure 3As shown, in this application, the inner side of the frame 20 has a space device mounting plate 21; the first structural box 30 and the second structural box 40 are both vertically mounted on the space device mounting plate 21, and the first structural box 30 and the second structural box 40 are arranged side by side; a first circuit board 50 for mounting a first chip 60 is fixed inside the first structural box 30, and the first chip 60 is mounted in a position adjacent to or close to the mounting plate 21; a second chip 70 is fixed inside the second structural box 40, and the second chip 70 is directly sintered onto the second structural box 40, and the position of the second chip 70 on the second structural box 40 is adjacent to or close to the mounting plate 21. In this embodiment, the first chip 60 is a digital signal processing chip, and the second chip 70 is a power amplifier chip. In this application, the second chip 70 can be sintered onto the second structural box 40 using sintering silver paste, with a sintering temperature of 150℃~300℃, a sintering pressure range of 15MPa~30MPa, and a sintering time range of 5~30 minutes. The thermal conductivity of sintered silver can reach 220 W / m / K, far exceeding that of traditional solder alloys and conductive adhesives. This allows the first chip 60, which uses sintered silver paste, to accelerate heat conduction, resulting in significant advantages in heat dissipation performance and efficiency. Furthermore, the sintered silver paste has good adhesion, maintaining the stability and reliability of the first chip 60 at high temperatures. In addition, the sintered silver paste is non-flammable, non-explosive, and environmentally friendly during use.

[0045] Furthermore, refer to Figure 3As shown, a heat-conducting block 80 is provided on the top of the first chip 60; one side of the heat-conducting block 80 abuts against the side of the structural frame of the first structural housing 30, and a heat-conducting pad 90 is provided between the other side of the heat-conducting block 80 and the top surface of the first chip 60; the heat-conducting block 80 makes large-area contact with the bottom of the structural frame of the first structural housing 30, effectively conducting the heat generated by the first chip 60 to the structural frame of the first structural housing 30, thereby improving the heat dissipation capacity of the first chip 60. In this application, a gap of 0.25 to 0.35 mm is reserved between the heat-conducting block 80 and the top surface of the first chip 60, and the thickness of the heat-conducting pad 90 is 0.45 to 0.55 mm, and the heat-conducting pad 90 is embedded between the heat-conducting block 80 and the top surface of the first chip 60. Preferably, a gap of 0.3 mm can be reserved between the heat-conducting block 80 and the top surface of the first chip 60, and a 0.5 mm heat-conducting pad 90 is embedded in the gap. During assembly, the heat-conducting block 80 is first precisely machined to ensure that the flatness of its contact area with the bottom of the structural frame of the first structural housing 30 is within 20μm. Then, a 0.5mm thick heat-conducting pad 90 is placed in the 0.3mm gap reserved between the first chip 60 and the heat-conducting block 80. The heat-conducting block 80 is fixed to the structural frame of the first structural housing 30 using screws or clips. During the fixing process, it is ensured that the heat-conducting pad 90 is evenly stressed without wrinkles or gaps. This ensures that heat can be smoothly conducted from the first chip 60 to the heat-conducting block 80, and then to the structural frame of the first structural housing 30, improving the heat dissipation efficiency of the first chip 60.

[0046] In this application, the heat-conducting block 80 is made of graphene-reinforced metal matrix composite material; the heat-conducting pad 90 is made of nano-silicone rubber material. The ultra-high thermal conductivity of graphene significantly enhances the thermal conductivity of the heat-conducting block 80, allowing the heat generated by the first chip 60 to be conducted more quickly to the structural frame of the first structural housing 30. The uniformly dispersed graphene nanosheets in the heat-conducting block 80 form a highly efficient thermal conduction network, with a thermal conductivity more than five times higher than that of a conventional metal heat-conducting block 80. The heat-conducting pad 90 is filled with nano-sized metal thermally conductive particles, which can adaptively fill the tiny gaps between the chip and the heat-conducting block 80 under certain pressure, ensuring good thermal contact. Simultaneously, its thermal conductivity is 60% higher than that of a traditional heat-conducting pad 90, effectively reducing interfacial thermal resistance.

[0047] In this application, the structural frames of the first structural box 30 and the second structural box 40 are both made of carbon / aluminum composite material or carbon fiber reinforced copper-based composite material. The structural frames of the first structural box 30 and the second structural box 40 possess the low-density characteristics of carbon fiber, which can effectively reduce the overall weight of the satellite, while also having high thermal conductivity, further improving heat transfer efficiency. Compared with traditional pure metal structural frames, their thermal conductivity can be increased by more than 30%, and their weight reduced by more than 20%.

[0048] Reference Figure 2 and Figure 4 As shown, in this application, auxiliary heat conduction channels 100 are provided within the structural frames of the first structural housing 30 and the second structural housing 40, and low-boiling-point working fluid is disposed within the auxiliary heat conduction channels 100. Microchannel structures are designed inside the structural frames of the first structural housing 30 and the second structural housing 40, and low-boiling-point working fluid is filled within the microchannels. When heat from the chip is conducted to the structural frames of the first structural housing 30 and the second structural housing 40, the low-boiling-point working fluid boils and vaporizes upon heating, rapidly carrying away the heat, and then recondenses in the low-temperature region of the structural frame, forming a highly efficient gas-liquid two-phase circulating heat dissipation system. At least three sets of auxiliary heat conduction channels 100 are spaced apart on the structural frames of both the first structural housing 30 and the second structural housing 40. The interval between adjacent sets of auxiliary heat conduction channels 100 is 2mm to 6mm. Each set of auxiliary heat conduction channels 100 is arranged in a ring along the circumference of the structural frame of the first structural housing 30 or the second structural housing 40. The cross-section of each set of auxiliary heat conduction channels 100 is circular, and the inner diameter of each auxiliary heat conduction channel 100 is 0.5mm to 1.8mm. The low-boiling-point working fluid is ammonia or acetone. Thermal testing has verified that this structure can improve the chip's heat dissipation efficiency by more than 80%.

[0049] Reference Figure 2 and Figure 5 As shown, a graphene unidirectional heat dissipation plate 110 is also provided between the first structural box 30 and the second structural box 40 and the space equipment mounting plate 21. The graphene unidirectional heat dissipation plate includes a heat dissipation layer 111, a heat transfer layer 112, and a heat absorption layer 113. The heat transfer layer 112 is disposed between the heat dissipation layer 111 and the heat absorption layer 113. The heat absorption layer 113 is in close contact with the structural frame of the first structural box 30 and the second structural box 40, and the heat dissipation layer 111 is in close contact with the space equipment mounting plate 21. The heat transfer layer 112 includes a heat insulation material layer 1121 and a heat-conducting microcapsule 1122. The heat insulation material layer 1121 forms a honeycomb structure, and the heat-conducting microcapsule 1122 is disposed in the honeycomb pores of the heat insulation material layer 1121 and filled with gas or liquid. This enables unidirectional heat conduction and dissipation, avoiding bidirectional heat transfer. This allows the heat generated by the chip to be dissipated efficiently, and when the entire space equipment is facing the sun and receiving large amounts of thermal radiation, it will not transfer heat to the chip.

[0050] The implementation principle is as follows: In this application, the first structural box 30 and the second structural box 40 are arranged side-by-side perpendicular to the space equipment mounting plate 21, ensuring that each structural box has a good heat conduction path and reducing obstacles and interference in the heat conduction process. Simultaneously, high heat-dissipating devices such as the first chip 60 and the second chip 70 are placed as close as possible to the bottom mounting plate 21, thereby shortening the heat conduction path and improving heat conduction efficiency. Furthermore, for the second chip 70, it is directly sintered onto the structural frame of the second structural box 40, achieving efficient heat conduction between the second chip 70 and the structural frame of the second structural box 40, reducing thermal resistance, and allowing the heat generated by the second chip 70 to be quickly conducted away. The technical solution of this application effectively reduces the operating temperature of various chips, ensuring that multiple chips can work stably for a long time in a vacuum environment, improving the overall reliability and stability of the space equipment. Thermal testing has verified that, inside a vacuum chamber, when the temperature of the heat-conducting surface is controlled at 55°C, the junction temperature of the first chip 60 is stabilized below 83°C using the technical solution in this application. This effectively avoids abnormal operation caused by excessively high junction temperature and ensures stable operation of the chip for a long time. Compared with the situation where the chip can only work for 10 minutes and the junction temperature exceeds 125°C when no measures are taken, this is a significant improvement.

[0051] The PCB circuit board in this application has poor thermal conductivity; even with copper plating, the overall equivalent thermal conductivity is less than 1 W / (m·K). This application optimizes the heat dissipation structure, eliminating reliance on the PCB circuit board for heat conduction. By changing the heat transfer medium and path, the satellite equipment achieves better chip heat dissipation, ensuring stable operation of high-heat-dissipation integrated circuits and chips within the satellite equipment. This reduces equipment failures caused by overheating, improves the overall reliability of the satellite equipment, extends its service life, and lowers maintenance costs and risks.

[0052] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation structure for high heat dissipation integrated circuits used in space equipment, characterized in that, It includes a first structural box (30) and a second structural box (40) that are both vertically mounted on the space equipment mounting plate (21), and the first structural box (30) and the second structural box (40) are arranged side by side; The first structural box (30) is fixedly provided with a first circuit board (50) for mounting a first chip (60) and the first chip (60) is mounted in a position adjacent to or close to the mounting plate surface (21). The second structural box (40) is fixedly provided with a second chip (70) and the second chip (70) is directly sintered on the second structural box (40). The position of the second chip (70) fixed on the second structural box (40) is adjacent to or close to the mounting plate surface (21). A heat-conducting block (80) is provided on the top of the first chip (60); one side of the heat-conducting block (80) is attached to the side of the structural frame of the first structural box (30), and a heat-conducting pad (90) is provided between the other side of the heat-conducting block (80) and the top surface of the first chip (60); a gap of 0.25 to 0.35 mm is reserved between the heat-conducting block (80) and the top surface of the first chip (60), the thickness of the heat-conducting pad (90) is 0.45 to 0.55 mm, and the heat-conducting pad (90) is embedded between the heat-conducting block (80) and the top surface of the first chip (60); the heat-conducting block (80) is made of graphene-reinforced metal matrix composite material; the heat-conducting pad (90) is made of nano-silicone rubber material; The second chip is sintered onto the second structural housing (40) using sintered silver paste; The structural frames of the first structural box (30) and the second structural box (40) are both made of carbon / aluminum composite material or carbon fiber reinforced copper-based composite material; Both the first structural box (30) and the second structural box (40) are provided with auxiliary heat conduction channels (100), and the auxiliary heat conduction channels (100) are provided with low boiling point working fluid. At least three sets of auxiliary heat conduction channels (100) are provided at intervals on the structural frames of the first structural box (30) and the second structural box (40). The interval between two adjacent sets of auxiliary heat conduction channels (100) is 2mm to 6mm. Each set of auxiliary heat conduction channels (100) is arranged in a ring shape along the circumference of the structural frame of the first structural box (30) or the second structural box (40). The cross-section of each set of auxiliary heat conduction channels (100) is circular and the inner diameter of the auxiliary heat conduction channel (100) is 0.5mm to 1.8mm. The low-boiling-point working fluid is ammonia or acetone.

2. The heat dissipation structure for high heat dissipation integrated circuits in space equipment according to claim 1, characterized in that, The sintering temperature is between 150℃ and 300℃, the pressure applied during sintering is between 15MPa and 30MPa, and the sintering time is between 5 and 30 minutes.

3. The heat dissipation structure for high heat dissipation integrated circuits in space equipment according to claim 1, characterized in that, A graphene one-way heat dissipation plate (110) is also provided between the first structural box (30) and the second structural box (40) and the space equipment mounting plate (21). The graphene one-way heat dissipation plate includes a heat dissipation layer (111), a heat transfer layer (112) and a heat absorption layer (113). The heat transfer layer (112) is disposed between the heat dissipation layer (111) and the heat absorption layer (113). The heat absorption layer (113) is in close contact with the structural frame of the first structural box (30) and the second structural box (40). The heat dissipation layer (111) is in close contact with the space equipment mounting plate (21). The heat transfer layer (112) includes a heat insulation material layer (1121) and a heat-conducting microcapsule (1122). The heat insulation material layer (1121) forms a honeycomb structure. The heat-conducting microcapsule (1122) is disposed in the honeycomb pores of the heat insulation material layer (1121) and filled with gas or liquid.

4. A satellite device, comprising a frame (20) and multiple sets of solar panels (10) disposed on the frame (20), characterized in that, The satellite equipment also includes the heat dissipation structure described in any one of claims 1 to 3, wherein the space equipment mounting plate (21) is located on the inner side of the frame (20), and the first structural box (30) and the second structural box (40) are disposed inside the frame (20).

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