Chip connection structure, module and manufacturing method
By using sintered solid copper sheets in the chip connection structure, a strong connection between the chip and the substrate is achieved, and a current path is formed through bending connections, the problems of insufficient connection strength and high failure risk in the existing chip connection structure are solved, and the reliability and electrical performance of the connection are improved.
Patent Information
- Application Number
- CN202411880067.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-04-08
AI Technical Summary
The connection strength of the existing chip connection structure is insufficient, resulting in a high risk of failure.
Using a chip connection structure including a substrate, a chip, a first solid copper sheet and a second solid copper sheet, the chip and the substrate are connected through the sintering connection of the first solid copper sheet and the second solid copper sheet, and a current path is formed through the bending connection of the second solid copper sheet.
It improves the reliability of chip connection, reduces the complication and impedance, and solves the problems of insufficient connection strength and high failure risk of existing chips.
Smart Images
Figure CN119786488A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of module connection structures, and in particular to a chip connection structure, a device and a manufacturing method. Background Art
[0002] With technological advancement, in the process of semiconductor chip manufacturing and packaging, most power semiconductor chips have achieved gradually increasing junction temperature capabilities. The temperature shortcoming in the module has changed from the original chip to the connection strength between chips. Most of the existing chips are connected by aluminum wire bonding and solder layers. The main reliability failure modes are aluminum wire bonding detachment and solder layer aging. Therefore, in the chip packaging process, it is necessary to improve the connection strength to reduce the risk of failure. Summary of the invention
[0003] In order to overcome the above technical defects, the purpose of the present invention is to provide a chip connection structure, module and manufacturing method, which are used to solve the problem that the existing chip connection strength is insufficient and the risk of failure is high.
[0004] The present invention discloses a chip connection structure.
[0005] It includes a substrate, a chip, a first solid copper sheet and a second solid copper sheet;
[0006] The first solid copper sheet and the second solid copper sheet are sintered and connected to the upper and lower sides of the chip, and the chip is connected to the substrate through the sintering of the first solid copper sheet.
[0007] Preferably, the first solid copper sheet and the second solid copper sheet are sintered synchronously by using a common pressing head.
[0008] Preferably, the second solid copper sheet is connected to the substrate in a certain bend, so as to form a current path on the upper and lower sides of the chip through the first solid copper sheet and the second solid copper sheet.
[0009] Preferably, after sintering, the second solid copper sheet is compressed to form a certain bend and connected to the substrate.
[0010] Preferably, the second solid copper sheet is pressed to form a certain bend and then sintered synchronously with the first solid copper sheet to be connected to the substrate.
[0011] Preferably, the first solid copper sheet and the second solid copper sheet completely cover the upper and lower surfaces of the chip.
[0012] Preferably, the substrate is a DBC substrate or an AMB substrate.
[0013] Preferably, the thickness of the first solid copper sheet and / or the second solid copper sheet does not exceed 30 μm.
[0014] The present invention also discloses a module, applying any of the chip connection structures described above; a circuit connected to the chip is formed by the first solid copper sheet and the second solid copper sheet.
[0015] The present invention also discloses a method for manufacturing a chip connection structure, which is used to generate the chip connection structure described in any of the above items, comprising: placing a first solid copper sheet, a chip and a second solid copper sheet on the substrate in sequence; arranging a pressure head at each pressure point on the first solid copper sheet and the second solid copper sheet, and sintering simultaneously so that the first solid copper sheet and the second solid copper sheet are connected to the chip and the substrate.
[0016] Compared with the prior art, the above technical solution has the following beneficial effects:
[0017] A chip connection structure, module and manufacturing method provided by the present application arrange solid copper sheets on the upper and lower sides of the chip, and realize structural connection by sintering the solid copper sheets. Furthermore, the solid copper sheets are reused to realize electrical connection of the chip, such as forming a current path, thereby improving the chip connection reliability while achieving lower inductance and impedance, solving the problem of insufficient connection strength and high risk of failure of existing chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic structural diagram of an embodiment of a chip connection structure, module and manufacturing method according to the present invention;
[0019] Figure 2 This is a schematic diagram of the structure of a pressure head in an embodiment of a chip connection structure, module and manufacturing method of the present invention;
[0020] Figure 3 It is a schematic structural diagram of the bending of the second solid copper sheet in an embodiment of a chip connection structure, module and manufacturing method described in the present invention.
[0021] Reference numerals:
[0022] 1-substrate; 2-first solid copper sheet; 3-chip; 4-second solid copper sheet; 5-pressing head. DETAILED DESCRIPTION
[0023] The advantages of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.
[0024] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.
[0025] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0026] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0027] In the description of the present invention, it is necessary to understand that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0028] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.
[0029] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and have no specific meanings. Therefore, "module" and "component" can be used interchangeably.
[0030] Embodiment: This embodiment provides a chip connection structure, see Figure 1-Figure 3 , including a substrate, a chip, a first solid copper sheet and a second solid copper sheet; the first solid copper sheet and the second solid copper sheet are sintered and connected to the upper and lower sides of the chip, and the chip is connected to the substrate through the sintering of the first solid copper sheet, wherein the first solid copper sheet is located at the lower side of the chip, and the second solid copper sheet is located at the upper side of the chip, multiple chips can be arranged on one substrate, and each chip has a first solid copper sheet and a second solid copper sheet connected.
[0031] In the chip connection structure, two solid copper sheets (i.e., the first solid copper sheet and the second solid copper sheet) are connected to the chip. On the one hand, they can be fixed to the substrate and the chip structure, that is, as welding sheets, the reliability of chip connection is improved, which is different from the existing connection methods using aluminum wires, solder layers, etc. On the other hand, they are also further reused to form a current path, that is, to realize the function of the copper busbar, that is, the circuit connection function can be realized without connecting the copper busbar, thereby making the structure simple and improving the reliability of chip connection. The connection is realized by sintering the solid copper sheet to improve the reliability strength of the chip, and the solid copper sheet is reused to form a current path, which can also reduce the loop impedance and inductive reactance.
[0032] It should be noted that electrical and structural connections are achieved by sintering solid copper sheets. It can be understood that in addition to solid copper sheets, other metal solid structures that can achieve this function through sintering can also be used to replace the solid copper sheets. This is consistent with the method and effect of achieving reuse in this implementation, and therefore should not be understood as a solution beyond the scope of this application.
[0033] In this embodiment, the substrate includes but is not limited to a DBC substrate or an AMB substrate. Both the DBC (Direct Bonding Copper) substrate and the AMB (Active Metal Brazing) substrate are ceramic substrate technologies, which are widely used in power electronic devices, especially in situations where high thermal conductivity, high insulation and high reliability are required. The DBC technology involves directly combining a copper layer with a ceramic layer (such as Al2O3 or AIN) at high temperature, and is widely used in packaging and heat dissipation of devices such as IGBT power modules, lasers and photovoltaics. The AMB technology uses metal brazing materials containing active elements (such as Ti and Zr) to tightly weld copper foil and ceramic sheets, which has higher strength and better reliability. A suitable substrate can be selected according to the actual application scenario, or other existing substrates except the above can be used to achieve chip connection and conduction.
[0034] Based on the above, the thickness of the first solid copper sheet and / or the second solid copper sheet does not exceed 30 μm. In this embodiment, there is no restriction on the size of the two solid copper sheets and the coverage area relative to the chip. It can be arranged according to the arrangement of the chip in the actual scene. As a preferred embodiment, the first solid copper sheet and the second solid copper sheet are arranged to completely cover the upper and lower surfaces of the chip, that is, the area of the two solid copper sheets is not less than the area of the chip surface ( Figure 1 The chip is not shown in the figure, and the second solid copper sheet does not completely cover the chip). Compared with the binding wires used in existing connection applications, the solid copper sheet is large and thin, which improves connection reliability, reduces the risk of failure, and can achieve lower inductance and impedance.
[0035] The first solid copper sheet and the second solid copper sheet can be sintered synchronously or in steps. In a preferred embodiment, the first solid copper sheet and the second solid copper sheet are sintered synchronously by a common pressure head. Specifically, as an example, the first solid copper sheet, the chip, and the second solid copper sheet can be arranged on the substrate in sequence, and the pressure head is placed on the upper surface of the second solid copper sheet. Synchronous sintering is performed under vertical pressure. Under the force of the pressure head, the first solid copper sheet also receives the vertical pressure to connect the chip to the substrate. Synchronous sintering can be achieved by sintering at one time with a common pressure head, thereby improving the efficiency of the preparation work, and at the same time, the sintering process parameters of the upper and lower chips can be kept consistent, thereby improving the overall stability of the chip connection structure after sintering.
[0036] In a preferred embodiment, the second solid copper sheet is connected to the substrate with a certain bend to form a current path on the upper and lower sides of the chip through the first solid copper sheet and the second solid copper sheet. Based on the above, the second solid copper sheet is located above the chip and is set to be larger and thinner, so it can be bent and connected to the substrate, thereby forming a current path on both sides of the chip.
[0037] Based on the above, as an option, the second solid copper sheet is pressed to form a certain bend and connected to the substrate after sintering, that is, after the first solid copper sheet and the second solid copper sheet are sintered, the second solid copper sheet is pressed onto the substrate to form a secondary connection. It can be arranged for use according to actual scenarios / when connecting other components, and the bending direction and handover of the second solid copper sheet can be flexibly adjusted.
[0038] Based on the above, what is not completely the same as the above-mentioned compression after sintering is that, as an option, it can also be pre-bent in advance. Specifically, the second solid copper sheet is compressed to form a certain bend and then sintered synchronously with the first solid copper sheet to be connected to the substrate. That is, it can be used in conjunction with the use of a distributed pressure head to achieve a one-time sintering connection. It can be arranged in a pre-known scenario or the bending shape can be determined in an actual application scenario, and combined with a one-time sintering, it can reduce the increase in processes caused by secondary connection and improve work efficiency.
[0039] It can be understood that the first solid copper sheet and the second solid copper sheet are respectively located at the lower side and the upper side of the chip, the first solid copper sheet is connected to the substrate, and the second solid copper sheet can also be bent and not connected to the substrate, but connected to other chips, other components, etc. Each solid copper sheet is set to be large and thin, so the part extending from the solid copper sheet can be bent, and the angle, shape, direction, area, etc. can be adjusted adaptively to achieve connection with other parts / components / devices to meet different usage requirements.
[0040] Therefore, based on the above, the chip connection structure provided in this embodiment uses solid copper sheets to achieve chip connection, which is different from existing connections such as aluminum wires, solders, etc. Solid copper sheet connections are arranged on the upper and lower sides of the chip, and the structural connection is achieved by sintering the solid copper sheets. Furthermore, the solid copper sheets are reused to achieve electrical connections of the chips, such as forming current paths, etc., thereby improving the chip connection reliability while achieving lower inductance and impedance. There is no need for connection structures such as solder and copper busbars, the structure is simple, and the risk of failure is effectively reduced, with high safety.
[0041] This embodiment also provides a module, which applies the chip connection structure described in any of the above items; a circuit connected to the chip is formed by the first solid copper sheet and the second solid copper sheet. In addition to arranging multiple chips, the module can also connect / integrate other components, such as drive circuits, control circuits, diodes, etc., which can all be electrically connected to the chip through the first solid copper sheet and / or the second solid copper sheet. The specific device arrangement can be adjusted according to the actual application scenario.
[0042] In addition, this embodiment also provides a method for manufacturing a chip connection structure, which is used to generate any of the chip connection structures described above, specifically including: placing a first solid copper sheet, a chip, and a second solid copper sheet on the substrate in sequence; arranging a pressure head at each pressure point on the first solid copper sheet and the second solid copper sheet, and sintering simultaneously so that the first solid copper sheet and the second solid copper sheet are connected to the chip and the substrate.
[0043] It can be understood that, as described above, when the second solid copper sheet / the first solid copper sheet does not need to be bent, a common pressure head can be used for simultaneous sintering to obtain a connectable structure; when the second solid copper sheet / the first solid copper sheet needs to be bent, multiple distributed pressure heads can be arranged at corresponding positions and then sintered simultaneously to improve the preparation efficiency; or, after sintering, a pressure head can be applied again (or multiple sinterings) to make the second solid copper sheet / the first solid copper sheet bend to cope with different usage scenarios.
[0044] It is further understood that the above sintering is similar to the existing solid copper sheet sintering process, so it is not described in detail. Pretreatment is required before sintering to keep the surface of the solid copper sheet, substrate, and chip clean. Sintering is usually carried out in a reducing atmosphere (such as H2) at a higher temperature (>300°C) or high pressure (>5MPa) to eliminate the harmful effects of surface oxides. After sintering, post-treatment can also be used as an option to improve quality.
[0045] Based on the above, it can also be understood that the preparation of the connection structure can be processed in batches or individually to be suitable for applications in different implementation scenarios / modules.
[0046] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.
Claims
1. A chip connection structure, characterized in that: It includes a substrate, a chip, a first solid copper sheet and a second solid copper sheet; The first solid copper sheet and the second solid copper sheet are sintered and connected to the upper and lower sides of the chip, and the chip is connected to the substrate through the sintering of the first solid copper sheet.
2. The chip connection structure according to claim 1, characterized in that: The first solid copper sheet and the second solid copper sheet are sintered synchronously by using a common pressing head.
3. The chip connection structure according to claim 1, characterized in that: The second solid copper sheet is connected to the substrate in a certain bend, so as to form a current path at the upper and lower sides of the chip through the first solid copper sheet and the second solid copper sheet.
4. The chip connection structure according to claim 3, characterized in that: After sintering, the second solid copper sheet is compressed to form a certain bend and is connected to the substrate.
5. The chip connection structure according to claim 3, characterized in that: The second solid copper sheet is pressed to form a certain bend and then is sintered synchronously with the first solid copper sheet to be connected to the substrate.
6. The chip connection structure according to claim 1, characterized in that: The first solid copper sheet and the second solid copper sheet completely cover the upper and lower surfaces of the chip.
7. The chip connection structure according to claim 1, characterized in that: The substrate is a DBC substrate or an AMB substrate.
8. The chip connection structure according to claim 1, characterized in that: The thickness of the first solid copper sheet and / or the second solid copper sheet does not exceed 30 μm.
9. A module, characterized in that: A chip connection structure according to any one of claims 1 to 8; A circuit connected to the chip is formed by the first solid copper sheet and the second solid copper sheet.
10. A method for manufacturing a chip connection structure, characterized in that: Used to generate the chip connection structure described in any one of claims 1 to 8, comprising: placing a first solid copper sheet, a chip and a second solid copper sheet on the substrate in sequence; Pressing heads are arranged at each pressing point on the first solid copper sheet and the second solid copper sheet, and the first solid copper sheet and the second solid copper sheet are connected to the chip and the substrate by synchronous sintering.