Semiconductor module and setting method thereof

Abstract

The invention relates to a semiconductor module and a setting method thereof, and the method comprises the steps: configuring a checking element at a side edge of a circuit structure of the semiconductor module, so as to control a hot-pressing head to lift or press the semiconductor module by a preset distance through sensing the height of the semiconductor module relative to a substrate when the hot-pressing head presses the semiconductor module to the substrate. Therefore, the height can be adjusted in real time when hot pressing is carried out, so that the product accuracy is improved, and the operation process is simplified.

Description

Technical Field

[0001] The present invention relates to a semiconductor connection technology, in particular to a semiconductor module and a setting method thereof. Background Art

[0002] With the development of semiconductor technology, semiconductor products have developed different packaging product types. In the process of placing a semiconductor device on a substrate, the semiconductor device electrically connects the active surface of the chip to the circuit structure through a plurality of solder bumps, and a plurality of conductive elements that can serve as input / output (I / O) terminals are planted on the other surface of the circuit structure to configure the semiconductor device on the substrate through the conductive elements.

[0003] In the prior art, as a configuration method for configuring the semiconductor device on the substrate, a thermal press head may be used to heat and press down the semiconductor device, so that the semiconductor device is bonded to the substrate through the conductive element.

[0004] However, during this process, the conductive element will be heated and pressed down by the hot pressing head and melted and deformed, so the height of the conductive element will change after being heated and pressed down by the hot pressing head, which will affect the size of the overall product. Although the height of the conductive element can be measured after the hot pressing process is completed to confirm whether it meets the requirements, this will cause the product manufacturing time to be prolonged, and it will consume a lot of manpower and time, which will increase the manufacturing cost.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0006] In view of the various deficiencies of the above-mentioned prior art, the present invention provides a semiconductor module, comprising: a circuit structure having a first side and a second side opposite to each other and side edges adjacent to the first side and the second side; an electronic element disposed on the first side of the circuit structure and electrically connected to the circuit structure; a conductive element disposed on the second side of the circuit structure and electrically connected to the circuit structure; and a check element disposed on the circuit structure and exposed at the side edge of the circuit structure.

[0007] The present invention also provides a method for setting up a semiconductor module, comprising: providing a semiconductor module and a substrate, wherein the semiconductor module includes a circuit structure, an electronic component, a conductive component and a check component, the electronic component and the conductive component are respectively arranged on a first side and a second side opposite to the circuit structure and electrically connected to the circuit structure, and the check component is arranged on the circuit structure and exposed on the side adjacent to the first side and the second side; moving the semiconductor module toward the substrate by a thermal compression head; and sensing the check component by a sensor to sense the height of the semiconductor module relative to the substrate, and transmitting the sensing result to a control system.

[0008] In the aforementioned semiconductor module and the method for setting the same, the control system transmits instructions to the thermal compression head according to the sensing result, so that the thermal compression head raises or lowers the semiconductor module by a predetermined distance.

[0009] In the aforementioned semiconductor module and the method for setting it, the check element and the circuit structure or the conductive element are manufactured simultaneously.

[0010] In the aforementioned semiconductor module and its setting method, the check element is arranged in a ring outside the circuit structure.

[0011] In the aforementioned semiconductor module and its setting method, the sensor is an infrared sensor or an image capture lens sensor.

[0012] In the aforementioned semiconductor module and its setting method, the check element is made of metal.

[0013] In the aforementioned semiconductor module and its setting method, the control system is a computer.

[0014] As can be seen from the above, the semiconductor module and its setting method of the present invention are mainly configured by configuring a check element on the side of the circuit structure of the semiconductor module, so that when the hot pressing head presses the semiconductor module down to the substrate, the height of the semiconductor module relative to the substrate is determined by sensing the check element, and the hot pressing head is controlled to raise or press the semiconductor module down a predetermined distance. In this way, the height can be adjusted immediately during the hot pressing process, so compared with the existing semiconductor devices, the product accuracy can be improved and the operation process can be simplified. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a cross-sectional schematic diagram of the semiconductor module of the present invention.

[0016] Figure 2 It is a schematic diagram of a semiconductor module of the present invention being disposed on a substrate.

[0017] Main component symbols

[0018] 1 Semiconductor module

[0019] 2 substrate

[0020] 3. Thermal head

[0021] 4 Sensors

[0022] 5 Control System

[0023] 10 Line structure

[0024] 10a First side

[0025] 10b Second side

[0026] 10c Side

[0027] 11 Electronic components

[0028] 11a Action surface

[0029] 11b Non-active surface

[0030] 110 Conductive bumps

[0031] 111 Primer

[0032] 12 Check components

[0033] 13 Encapsulation layer

[0034] 14 Conductive elements

[0035] 140 Metal Column

[0036] 141 metal bumps

[0037] H Height. DETAILED DESCRIPTION

[0038] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and technical effects of the present invention from the contents described in this specification.

[0039] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content recorded in the present invention without affecting the technical effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "first", and "second" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0040] Figure 1 FIG. 1 is a cross-sectional schematic diagram of a semiconductor module 1 of the present invention. Figure 1 As shown, the semiconductor module 1 of this embodiment includes: a circuit structure 10 , at least one electronic element 11 , a check element 12 , a packaging layer 13 and a conductive element 14 .

[0041] The circuit structure 10 may be a packaging substrate (substrate) with a core layer and a circuit portion or a circuit structure without a core layer (coreless). In the present embodiment, the circuit structure 10 includes at least one dielectric layer and a circuit layer combined with the dielectric layer, such as a fan-out type redistribution layer (RDL) specification. However, it should be understood that the circuit structure 10 may also be other carrier units for carrying chips, such as a lead frame, a wafer, a silicon interposer, or other boards with metal routing, etc., and is not limited to the above. In addition, the circuit structure 10 has a first side 10a and a second side 10b opposite to each other and a side 10c adjacent to the first side 10a and the second side 10b.

[0042] The at least one electronic component 11 is disposed on the first side 10a of the circuit structure 10 through a plurality of conductive bumps 110, and a coating layer such as a primer 111 is filled and formed between the first side 10a of the circuit structure 10 and the electronic component 11 to cover the conductive bumps 110. In the present embodiment, two electronic components 11 are disposed on the circuit structure 10, but any desired type and number of electronic components 11 can be placed on the circuit structure 10, and the present invention is not limited to the above embodiment.

[0043] Furthermore, the electronic component 11 is an active component, a passive component or a combination of the two, and the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. In the present embodiment, the electronic component 11 is a semiconductor chip, which has an active surface 11a and an inactive surface 11b opposite to each other, and the active surface 11a has a plurality of electrode pads (not shown), so that the electrode pads are combined and electrically connected to the circuit layer of the circuit structure 10 in a flip chip manner through a plurality of conductive bumps 110 such as solder materials.

[0044] In other embodiments, the electronic component 11 may also be electrically connected to the circuit layer of the circuit structure 10 by bonding multiple wires; or, the electronic component 11 may directly contact the circuit layer of the circuit structure 10. It should be understood that there are many ways for the electronic component 11 to be electrically connected to the circuit structure 10, and it is not limited to the above embodiments.

[0045] The check element 12 is disposed on the circuit structure 10 , for example, on the side 10 c of the circuit structure 10 , so that the check element 12 can be exposed on the side 10 c of the circuit structure 10 , so that the sensor 4 described later can easily sense the check element 12 .

[0046] In this embodiment, the check element 12 is disposed around the periphery of the circuit structure 10. However, in other embodiments, as long as the sensor 4 can easily sense the check element 12, the check element 12 can also be disposed only on one side of the circuit structure 10. The present invention is not limited to the above. Furthermore, the check element 12 is made of metal material or a material that can be easily identified by the sensor 4. In addition, in one embodiment, the check element 12 can be manufactured together with the circuit layer of the circuit structure 10. For example, the check element 12 can be a metal block formed around the circuit structure 10 without adding a manufacturing process.

[0047] The packaging layer 13 is formed on the first side 10a of the circuit structure 10, so that the packaging layer 13 covers the electronic component 11. In this embodiment, the packaging layer 13 exposes the inactive surface 11b of the electronic component 11, but the packaging layer 13 can also completely cover the electronic component 11 without exposing the inactive surface 11b of the electronic component 11.

[0048] In the present embodiment, the packaging layer 13 is an insulating material, such as polyimide (PI), dry film, packaging colloid or molding compound such as epoxy. For example, the packaging layer 13 can be formed on the first side 10a of the circuit structure 10 by a process such as liquid compound, injection, lamination or compression molding.

[0049] The conductive element 14 is disposed on the second side 10b of the circuit structure 10. The conductive element 14 can be a plurality of metal pillars such as copper pillars, metal bumps coated with insulating blocks, solder balls, solder balls with core copper balls, or other conductive structures. In this embodiment, the conductive element 14 includes a metal pillar 140 (such as a copper pillar) and a metal bump 141 (such as a solder ball) formed on the metal pillar 140. In addition, in one embodiment, the check element 12 can also be selected to be manufactured on the circuit structure 10 when manufacturing the conductive element 14, without increasing the manufacturing process.

[0050] Through the above design, the present invention can efficiently and accurately dispose the semiconductor module 1 on the substrate, and its disposition method will be described in detail below.

[0051] Figure 2 FIG. 1 is a schematic diagram of the semiconductor module 1 being arranged on the substrate 2 according to the present invention. Figure 2 As shown, the device for placing the semiconductor module 1 on the substrate 2 includes a thermal compression head 3 , a sensor 4 and a control system 5 .

[0052] The thermal compression head 3 receives the command of the control system 5 to heat and lift the semiconductor module 1 based on the command of the control system 5. The thermal compression head 3 can be connected to the control system 5 by wired or wireless communication to receive the command, and the present invention has no particular limitation on this.

[0053] Furthermore, the hot pressing head 3 can move the semiconductor module 1 by clamping or adsorption, and it has at least the function of heating and lifting the semiconductor module 1. In detail, the hot pressing head 3 heats the semiconductor module 1 to melt the conductive element 14, so that the semiconductor module 1 can be bonded to the substrate 2 through the melted conductive element 14. In addition, the hot pressing head 3 can at least move up and down in the vertical direction to press down or lift the semiconductor module 1. In other embodiments, the hot pressing head 3 can also be configured to be able to move left and right in the horizontal direction, so that the semiconductor module 1 can be moved from another place to the top of the substrate 2, and it is not limited to the above embodiments.

[0054] The sensor 4 is an infrared sensor or an image sensor, which is disposed on the upper side of the substrate 2 to sense the check element 12 of the semiconductor module 1 located above the substrate 2, and transmit the sensing result to the control system 5. The sensor 4 can be connected to the control system 5 by wired or wireless communication to transmit the sensing result, and the present invention has no particular limitation on this.

[0055] The control system 5 is a computer. The user can input relevant data into the control system 5 in advance. After receiving the sensing result from the sensor 4, the control system 5 can analyze and judge the sensing result based on the data input by the user, thereby outputting instructions to the thermal compression head 3.

[0056] The following is a detailed description of the process of placing the semiconductor module 1 on the substrate 2. First, the semiconductor module 1 and the substrate 2 as described above are provided, and the semiconductor module 1 is placed on the substrate 2.

[0057] Furthermore, the thermal compression head 3 heats and presses the semiconductor module 1 above the semiconductor module 1, and the conductive element 14 of the semiconductor module 1 is melted by the heating of the thermal compression head 3, thereby bonding with the substrate 2. Moreover, due to the downward pressure of the thermal compression head 3, the melted conductive element 14 is deformed and flattened. In other words, the height H of the conductive element 14 changes according to the downward pressing distance of the thermal compression head 3.

[0058] Next, the sensor 4 senses the position of the check element 12, and based on the position of the check element 12, calculates the distance between the check element 12 and the substrate 2, that is, the height H of the conductive element 14. Here, the sensor 4 can transmit the position of the check element 12 as a sensing result to the control system 5, and the control system 5 calculates the height H of the conductive element 14, or the sensor 4 can also be provided with a calculation function, and the calculated height H of the conductive element 14 is transmitted to the control system 5 as a sensing result, and the present invention is not particularly limited to this.

[0059] After receiving the sensing result, the control system 5 can analyze the sensing result according to the data input in advance by the user, and output a command corresponding to the analysis result to the thermal compression head 3 .

[0060] Specifically, when the sensed height H of the conductive element 14 is higher than a predetermined height, the control system 5 calculates the difference between the sensed height H of the conductive element 14 and the predetermined height to output instructions to the thermal compression head 3 so that the thermal compression head 3 continues to press down the semiconductor module 1 a predetermined distance, and the predetermined distance can be set as the difference between the sensed height H of the conductive element 14 and the predetermined height.

[0061] Furthermore, when the sensed height H of the conductive element 14 is lower than a predetermined height, the control system 5 calculates the difference between the sensed height H of the conductive element 14 and the predetermined height to output instructions to the thermal compression head 3, so that the thermal compression head 3 raises the semiconductor module 1 a predetermined distance, and the predetermined distance can be set to the difference between the sensed height H of the conductive element 14 and the predetermined height.

[0062] After the thermal compression head 3 presses down or raises the semiconductor module 1, the sensor 4 can sense the position of the check element 12 again and output the sensing result to the control system 5. If the control system 5 determines after analysis that the height H of the sensed conductive element 14 is still not equal to the predetermined height, the above steps are repeated. When the height H of the sensed conductive element 14 is equal to the predetermined height, the control system 5 outputs a stop command, thereby completing the processing operation of placing the semiconductor module 1 on the substrate 2.

[0063] By means of the above-mentioned method for setting up the semiconductor module 1, the connection between the semiconductor module 1 and the substrate 2 can be efficiently and accurately controlled during the hot pressing process, so that the height H of the conductive element 14 of the semiconductor module 1 meets the predetermined height, thereby making the entire product meet the predetermined size.

[0064] In summary, the semiconductor module and its setting method of the present invention are mainly to configure a check element in the circuit structure of the semiconductor module, so that when the hot pressing head presses the semiconductor module down to the substrate, the height of the semiconductor module relative to the substrate is determined by sensing the check element, so as to control the hot pressing head to raise or press the semiconductor module down to a predetermined distance. In this way, the height can be adjusted immediately during the hot pressing process, thereby improving product accuracy and simplifying the operation process.

[0065] The above embodiments are only used to illustrate the principles and technical effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the inventive concept and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. A semiconductor module, comprising: A circuit structure having a first side and a second side opposite to each other and a side edge adjacent to the first side and the second side; an electronic component disposed on the first side of the circuit structure and electrically connected to the circuit structure; A conductive element disposed on the second side of the circuit structure and electrically connected to the circuit structure; as well as The check element is arranged on the circuit structure and is exposed on the side of the circuit structure.

2. The semiconductor module according to claim 1, wherein: The checking element and the circuit structure or the conductive element are manufactured simultaneously.

3. The semiconductor module according to claim 1, wherein: The check element is arranged on the outer side of the circuit structure.

4. The semiconductor module according to claim 1, wherein: The checking element is sensed by an infrared sensor or an image capture lens sensor.

5. The semiconductor module according to claim 1, wherein: The inspection element is made of metal.

6. A method for setting a semiconductor module, comprising: A semiconductor module and a substrate are provided, wherein the semiconductor module comprises a circuit structure, an electronic component, a conductive component and a check component, wherein the electronic component and the conductive component are respectively disposed on a first side and a second side opposite to the circuit structure and electrically connected to the circuit structure, and the check component is disposed on the circuit structure and exposed at sides adjacent to the first side and the second side; Moving the semiconductor module toward the substrate by a thermal compression head; and The checking element is sensed by a sensor, and the sensing result is transmitted to a control system.

7. The method for setting a semiconductor module according to claim 6, wherein: The control system transmits a command to the thermal compression head according to the sensing result, so that the thermal compression head raises or presses the semiconductor module down by a predetermined distance.

8. The method for setting a semiconductor module according to claim 6, wherein: The checking element and the circuit structure or the conductive element are manufactured simultaneously.

9. The method for setting a semiconductor module according to claim 6, wherein: The check element is arranged on the outer side of the circuit structure.

10. The method for setting a semiconductor module according to claim 6, wherein: The sensor is an infrared sensor or an image capture lens sensor.

11. The method for installing a semiconductor module according to claim 6, wherein: The checking element is made of metal.

12. The method for setting a semiconductor module according to claim 6, wherein: The control system is a computer.

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