Circuit board modules and electronic equipment

Abstract

The present application provides a circuit board module and an electronic device. The circuit board module includes a circuit board, a chip, and a heat storage component. One end of the chip is arranged on the circuit board, and the other end is used to connect to the shell. The heat storage component is arranged on the circuit board and / or the chip, so that when the chip is working, the heat of the chip can be transferred to the heat storage component, or the heat of the chip can be transferred to the heat storage component through the circuit board; wherein, when the power of the chip is greater than the preset power when working, the heat storage component can absorb the heat of the chip. By adding a heat storage component, the heat generated by the chip can be absorbed when the chip is working at high power consumption, which can avoid the chip itself from being too high in temperature, thereby affecting the performance and life of the chip. In addition, the heat of the chip is absorbed by the heat storage component, which can also reduce the heat transferred to the shell, thereby avoiding the shell temperature being too high, making it easier for the user to hold the shell. In other words, the introduction of the heat storage component prevents the temperature of the chip and the shell from rising too fast in some instantaneous high power consumption scenarios, thereby improving the chip fluency and holding experience.

Description

Technical Field

[0001] The present application belongs to the technical field of circuit boards, and specifically relates to circuit board modules and electronic devices. Background Art

[0002] A variety of chips are usually set on the circuit board to realize different functions, and the chips are also directly or indirectly connected to the housing of the electronic device. When the chip works in high-power mode, a lot of heat will be generated, which will affect the performance and life of the chip. At the same time, when this heat is transmitted to the housing, it will also increase the temperature of the housing, making it inconvenient for users to hold the electronic device. Summary of the invention

[0003] In view of this, the first aspect of the present application provides a circuit board module, which includes a circuit board, a chip, and a heat storage component, one end of the chip is arranged on the circuit board, and the other end is used to connect to the shell, and the heat storage component is arranged on the circuit board and / or the chip, so that when the chip is working, the heat of the chip can be transferred to the heat storage component, or the heat of the chip can be transferred to the heat storage component through the circuit board; wherein, when the power of the chip when working is greater than the preset power, the heat storage component can absorb the heat of the chip.

[0004] A second aspect of the present application provides an electronic device, which includes a housing and a circuit board module as provided in the first aspect of the present application, wherein the circuit board module is disposed in the housing, and a chip of the circuit board module is connected to the housing.

[0005] The circuit board module and electronic device provided by the present application, by adding a heat storage component on the basis of the circuit board and the chip, the heat of the chip can be directly or indirectly transferred to the heat storage component. The heat storage component is a component that can absorb heat when the heat reaches a certain level. When the chip is working, heat will be generated. When the power of the chip is less than or equal to the preset power, that is, when the chip is low power or not working, the heat storage component will not absorb the heat of the chip. When the power of the chip is greater than the preset power, that is, when the chip is working with high power consumption, the heat storage component will absorb the heat of the chip.

[0006] In summary, by adding a heat storage component, the heat generated by the chip can be absorbed when the chip is working at high power consumption, which can prevent the temperature of the chip itself from being too high, thereby affecting the performance and life of the chip. In addition, the heat of the chip absorbed by the heat storage component can also reduce the heat transferred to the shell, thereby preventing the shell temperature from being too high, making it easier for users to hold the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0008] Figure 1 It is a cross-sectional schematic diagram of a circuit board module in one embodiment of the present application.

[0009] Figure 2 for Figure 1 The schematic cross-sectional view of the circuit board module and the housing shown is shown in FIG.

[0010] Figure 3 This is a cross-sectional schematic diagram of a circuit board module in another embodiment of the present application.

[0011] Figure 4 It is a cross-sectional schematic diagram of the circuit board module and the housing when they are matched in another embodiment of the present application.

[0012] Figure 5 This is a cross-sectional schematic diagram of the circuit board module and the housing when they are matched in another embodiment of the present application.

[0013] Figure 6 This is a cross-sectional schematic diagram of a circuit board module in another embodiment of the present application.

[0014] Figure 7 This is a cross-sectional schematic diagram of a circuit board module in yet another embodiment of the present application.

[0015] Figure 8 This is a cross-sectional schematic diagram of the connection between the second sub-circuit board and the third sub-circuit board in one embodiment of the present application.

[0016] Fig. 9 It is a cross-sectional schematic diagram of a heat storage element disposed in an open cavity in one embodiment of the present application.

[0017] Fig.10 This is a cross-sectional schematic diagram of the connection between the second sub-circuit board and the first sub-circuit board in one embodiment of the present application.

[0018] Fig.11 The figure is a curve diagram showing the change of the air temperature in the receiving cavity of the second circuit board and the third circuit board over time.

[0019] Fig.12 The figure is a curve diagram showing the temperature change of the chips in the first circuit board, the second circuit board and the third circuit board over time.

[0020] Fig.13 It is a schematic diagram of the three-dimensional structure of an electronic device in one embodiment of the present application.

[0021] Fig.14 for Fig.13 A schematic cross-sectional view of an electronic device is shown.

[0022] Description of labels:

[0023] Circuit board module-1, shell-2, electronic device-3, circuit board-10, receiving cavity-100, first sub-circuit board-11, open cavity-110, second sub-circuit board-12, through hole-120, third sub-circuit board-13, glue filling hole-14, exhaust hole-15, chip-20, heat storage component-30, first shielding component-41, shielding frame-410, metal sheet-411, adhesive layer-412, second shielding component-42. DETAILED DESCRIPTION

[0024] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0025] In view of this, in order to solve the above problems, this application provides a circuit board module, please refer to Figure 1-Figure 3 , Figure 1 It is a cross-sectional schematic diagram of a circuit board module in one embodiment of the present application. Figure 2 for Figure 1 The schematic cross-sectional view of the circuit board module and the housing shown is shown in FIG. Figure 3 It is a cross-sectional schematic diagram of a circuit board module in another embodiment of the present application. The circuit board module 1 provided in this embodiment includes a circuit board 10, a chip 20, and a heat storage member 30, one end of the chip 20 is arranged on the circuit board 10, and the other end is used to connect to the housing 2, and the heat storage member 30 is arranged on the circuit board 10 and / or the chip 20, so that when the chip 20 is working, the heat of the chip 20 can be transferred to the heat storage member 30, or the heat of the chip 20 can be transferred to the heat storage member 30 through the circuit board 10; wherein, when the power of the chip 20 when working is greater than the preset power, the heat storage member 30 can absorb the heat of the chip 20.

[0026] The circuit board module 1 is the core component of the electronic device 3 and is mainly used to realize various functions of the electronic device 3. At the same time, the circuit board module 1 can also control other components in the electronic device 3. The circuit board module 1 can also be called a main board, a sub-board, a small board, etc. The circuit board module 1 usually includes a circuit board 10 and a chip 20. The circuit board 10 is mainly used to set various chips 20 and electrically connect the associated chips 20 together. The structure, shape, size, material, etc. of the circuit board 10 are not limited in this embodiment. The chip 20 is mainly used to realize various functions. This embodiment only schematically illustrates the chip 20 as a system chip 20 (SoC). The chip 20 can be arranged on the circuit board 10, so that one end of the chip 20 is directly or indirectly connected to the circuit board 10. Optionally, when the chip 20 is a system chip 20, a double data rate synchronous dynamic random access memory (Double Data Rate / DDR) can also be arranged between the system chip 20 and the circuit board 10. As for the other end of the chip 20, it can be directly or indirectly connected to the housing 2.

[0027] As is known to all, the chip 20 generates a large amount of heat when working. Although the chip 20 is connected to the circuit board 10, the thermal resistance of the heat conduction from the chip 20 to the circuit board 10 is relatively large. In other words, the thermal conductivity of the circuit board 10 is relatively low, which makes the heat have a greater impact on the junction temperature of the chip 20. The temperature of the chip 20 itself is relatively high, which will affect the performance and life of the chip 20. At the same time, when this heat is transmitted to the shell 2, the temperature of the shell 2 will also increase, which makes it inconvenient for the user to hold the electronic device 3, thereby reducing the user experience.

[0028] Based on this, the present embodiment adds a heat storage component 30, which can be a phase change material (PCM), a component that can absorb heat when the heat reaches a certain level. In other words, although the heat storage component 30 has the ability to absorb heat, it does not always absorb heat. When the heat is low, the heat storage component 30 does not absorb the heat. Only when the heat is high and reaches a certain level will the heat storage component 30 absorb the heat.

[0029] The heat storage member 30 may be disposed on the chip 20, or the heat storage member 30 may be disposed on the circuit board 10, or the heat storage member 30 may be disposed on both the chip 20 and the circuit board 10. When the heat storage member 30 is disposed on the chip 20, the heat of the chip 20 may be directly transferred to the heat storage member 30. When the heat storage member 30 is disposed on the circuit board 10, the heat of the chip 20 may be indirectly transferred to the heat storage member 30 through the circuit board 10. This embodiment is only schematically described with the heat storage member 30 being disposed on the chip 20 and the heat storage member 30 being disposed on the circuit board 10.

[0030] The chip 20 generates heat when it is working. When the power of the chip 20 is less than or equal to the preset power, that is, the chip 20 is low power or not working, the heat storage member 30 will not absorb the heat of the chip 20. When the power of the chip 20 is greater than the preset power, that is, the chip 20 is working at high power, the heat storage member 30 will absorb the heat of the chip 20.

[0031] In summary, this embodiment can absorb the heat generated by the chip 20 when the chip 20 is working at high power consumption by adding a heat storage member 30, which can prevent the temperature of the chip 20 itself from being too high, thereby affecting the performance and life of the chip 20. In addition, the heat of the chip 20 absorbed by the heat storage member 30 can also reduce the heat transferred to the housing 2, thereby preventing the temperature of the housing 2 from being too high, making it easier for users to hold the housing 2. In other words, the introduction of the heat storage member 30 prevents the temperature of the chip 20 and the housing 2 from rising too quickly in some instantaneous high power consumption scenarios, thereby improving the smoothness of the chip 20 and the holding experience.

[0032] Please refer to Figure 1 , Figure 4-Figure 5 , Figure 4 It is a cross-sectional schematic diagram of the circuit board module and the housing when they are matched in another embodiment of the present application. Figure 5 It is a cross-sectional schematic diagram of the circuit board module and the shell in another embodiment of the present application. In this embodiment, the specific position of the heat storage component 30 may be related to the material of the heat storage component 30, so that the heat storage component 30 satisfies one of the following conditions: the heat storage component 30 is arranged on the outer peripheral side of the circuit board 10. Alternatively, the circuit board module 1 also includes a first shielding component 41, the first shielding component 41 is arranged on the circuit board 10 and covers the chip 20, the first shielding component 41 is used to connect the shell 2, and the heat storage component 30 is arranged in the first shielding component 41. Alternatively, the circuit board module 1 also includes a first shielding component 41 and a second shielding component 42, the first shielding component 41 and the second shielding component 42 are arranged on the circuit board 10, the first shielding component 41 covers the chip 20 and the first shielding component 41 is used to connect the shell 2, and the heat storage component 30 is arranged in the second shielding component 42.

[0033] like Figure 1 As shown, in one embodiment, when the heat storage member 30 is always solid, the heat storage member 30 can be directly disposed outside the chip 20, or directly disposed on the outer peripheral side of the circuit board 10. Since the heat storage member 30 is solid, the position can be set arbitrarily.

[0034] The circuit board module 1 may also include a first shielding member 41, which may be disposed on the circuit board 10 and cover the chip 20. The first shielding member 41 surrounds the chip 20, thereby preventing the electric field and magnetic field of the chip 20 from affecting other chips 20. Optionally, the first shielding member 41 may not be composed of one component, but may be composed of multiple components. For example, the first shielding member 41 includes an open shielding frame 410, and the chip 20 may be exposed. A metal sheet 411 such as a copper sheet is provided above the shielding frame 410, and the chip 20 is shielded, so that the first shielding member 41 is closed to achieve a shielding effect. The chip 20 can be connected to the metal sheet 411 through an adhesive layer 412 such as a thermally conductive gel. Further optionally, the other end of the metal sheet 411 can be connected to the housing 2 such as the middle frame through the adhesive layer 412, thereby achieving further connection between the chip 20 and the housing 2.

[0035] like Figure 4 As shown, in another embodiment, when the heat storage member 30 is in a gel state at the beginning, the heat storage member 30 can be disposed in the first shielding member 41, thereby preventing the gel-like heat storage member 30 from flowing around, and forming a solid heat storage member 30 after solidification.

[0036] like Figure 5 As shown, in another embodiment, the heat storage member 30 is not disposed in the first shielding member 41 of the chip 20 to absorb heat. In this case, the circuit board module 1 also includes a second shielding member 42, which is also disposed on the circuit board 10. However, the second shielding member 42 does not cover the chip 20, but covers other components to shield other components. In this way, the heat storage member 30 can be disposed in the second shielding member 42, and the gel-like heat storage member 30 can be prevented from flowing around. At the same time, the heat of the chip 20 can be transferred to the heat storage member 30 through the circuit board 10 and the second shielding member 42, and the heat storage member 30 can also be used to absorb heat.

[0037] Therefore, when the heat storage element 30 is in a gelatinous state, there is a large amount of space in the shielding element, and the heat storage element 30 can be poured. The heat storage element 30 can be set not only in the shielding element of the chip 20 itself, but also in other shielding elements, which can also improve the thermal resistance and delay the temperature rise. Of course, in other embodiments, it can also be set in other enclosed spaces instead of in the shielding element.

[0038] In this embodiment, the phase change enthalpy value of the heat storage component 30 is ≥50J / g, and / or the phase change heat absorption temperature of the heat storage component 30 is 30℃-60℃. The phase change enthalpy value of the heat storage component 30 refers to the amount of heat that 1g of the heat storage component 30 can absorb. If the phase change enthalpy value of the heat storage component 30 is too small, for example, less than 50J / g, the heat absorbed by the heat storage component 30 is too small, and it can only absorb a small part of the heat generated by the chip 20 under high power consumption, and the heat absorption effect is weak. At the same time, since the heat storage component 30 provided on the circuit board 10 and / or the chip 20 is small in size, a larger phase change enthalpy value is also required, so the present embodiment controls the phase change enthalpy value of the heat storage component 30 to be ≥50J / g.

[0039] The phase change heat absorption temperature of the heat storage element 30 refers to the temperature at which the heat storage element 30 begins to absorb heat. If the phase change heat absorption temperature of the heat storage element 30 is too low, for example, less than 30°C, the chip 20 will easily reach 30°C at low power, and will not be able to absorb heat at high power, thereby rendering the heat storage element 30 ineffective. If the phase change heat absorption temperature of the heat storage element 30 is too high, for example, greater than 60°C, the chip 20 will not easily reach 60°C at high power, thereby rendering the heat storage element 30 ineffective.

[0040] Optionally, the greater the molecular weight of the heat storage element 30 is, the greater the phase change endothermic temperature is.

[0041] In this embodiment, the heat storage member 30 can also conduct the heat of the chip 20, and the thermal conductivity of the heat storage member 30 is ≥ 0.2W / mK. In addition to the heat storage function at high power, the heat storage member 30 can also have a heat conduction function, that is, the heat storage member 30 can also conduct the heat of the chip 20, and the heat of the chip 20 is dissipated through the heat storage member 30, thereby realizing the heat dissipation function. At this time, the heat storage member 30 can also be called a heat storage and heat conduction member, and the heat conduction function has nothing to do with the power of the chip 20, that is, whether the chip 20 is at low power or high power, the heat storage member 30 can conduct heat.

[0042] Optionally, the heat storage element 30 includes but is not limited to phase-change microcapsules filled in a conventional two-component potting glue, the two-component potting glue can play a role in heat conduction, and the phase-change microcapsules can play a role in heat absorption.

[0043] By adding materials that have both heat conduction and heat storage functions, when the chip 20 is working at high power, the heat storage thermal conductive material absorbs heat during phase change, preventing the temperature of the chip 20 and the mobile phone shell from continuing to rise, and while absorbing heat, the heat storage thermal conductive material will also slowly dissipate heat to the surroundings. When the chip 20 is at low power or not working, the heat storage thermal conductive material slowly releases heat to return to its initial state.

[0044] In addition, the present embodiment can make the thermal conductivity of the heat storage element 30 ≥ 0.2 W / mK, so that the heat storage element 30 has a higher thermal conductivity. Optionally, when the thermal conductivity of the heat storage element 30 is 0.2 W / mK, the heat storage element 30 only includes phase change microcapsules. In other words, the phase change microcapsules have a certain heat conduction function in addition to the heat absorption function.

[0045] In this embodiment, the content of small molecules D3-D10 in the heat storage element 30 is ≤300 ppm, which can prevent the silicone oil of the potting glue from precipitating and volatilizing to other places to affect other components.

[0046] In this embodiment, the hardness of the heat storage element 30 after curing is ≤ shoreOO50, which can avoid internal stress caused by excessive hardness and facilitate maintenance.

[0047] In this embodiment, the volume resistivity of the heat storage element 30 is ≥1.0E+11Ω*cm, which can reduce the thermal conductivity of the heat storage element 30 and improve the insulation of the heat storage element 30.

[0048] Please refer to Figure 6 , Figure 6 Schematic diagram of a cross section of a circuit board module in another embodiment of the present application. In this embodiment, the circuit board 10 includes a first sub-circuit board 11, a second sub-circuit board 12, and a third sub-circuit board 13 stacked in sequence, the chip 20 is arranged on a side of the first sub-circuit board 11 away from the third sub-circuit board 13, the first sub-circuit board 11, the second sub-circuit board 12, and the third sub-circuit board 13 are surrounded to form a receiving cavity 100, and the heat storage member 30 is arranged in the receiving cavity 100.

[0049] The circuit board 10 can be divided into a three-layer stacked structure along the thickness direction: a first sub-circuit board 11, a second sub-circuit board 12, and a third sub-circuit board 13, and the chip 20 is welded on the top of the first sub-circuit board 11. The three sub-circuit boards can be welded together and surrounded to form a receiving cavity 100. For example, the first sub-circuit board 11 and the third sub-circuit board 13 are flat plates, and the second sub-circuit board 12 is provided with a through hole 120, so the three sub-circuit boards can be welded together to form a receiving cavity 100. Of course, in other embodiments, the three sub-circuit boards can also be an integrated structure, but for the sake of easy distinction, different areas of the circuit board 10 are artificially named differently.

[0050] The receiving cavity 100 can be used to mount some components such as capacitors and inductors, so that most of the receiving cavity 100 is air, and the heat of air is only 0.023W / mK. Therefore, the thermal resistance of the chip 20 to the circuit board 10, that is, downward, is extremely large, resulting in heat that cannot be discharged from the circuit board 10. The heat will be accumulated in the chip 20 itself, or discharged through the shell 2, resulting in the above-mentioned technical problems.

[0051] In this embodiment, the heat storage component 30 can be arranged in the receiving cavity 100. In other words, the receiving cavity 100 is filled with a potting glue with heat conduction and heat storage functions. Compared with only air in the receiving cavity 100, the introduction of the heat storage component 30 can effectively improve the thermal resistance in the thickness direction through the heat conduction function, reduce the heat transfer resistance in the thickness direction of the circuit board 10, make it easier to transfer heat downward, and effectively reduce the temperature of the chip 20. Furthermore, the heat absorption function can also slow down the heating rate of the chip 20. In addition, it does not take up extra space.

[0052] In this embodiment, the orthographic projection of the heat storage member 30 on the first sub-circuit board 11 covers the orthographic projection of the chip 20 on the first sub-circuit board 11. In this embodiment, the heat storage member 30 can correspond to the chip 20, and the heat storage member 30 can cover the projection area of ​​the chip 20, thereby better absorbing the heat of the chip 20.

[0053] In this embodiment, the heat storage component 30 is connected to the first sub-circuit board 11, or the heat storage component 30 is connected to the first sub-circuit board 11 and the third sub-circuit board 13. In this embodiment, the heat storage component 30 can be connected to the first sub-circuit board 11 above, so as to facilitate the absorption and even conduction of the heat of the chip 20 through the first sub-circuit board 11. On this basis, in other embodiments, the heat storage component 30 can also be connected to the third sub-circuit board 13 below, and the heat of the heat storage component 30 can be exported through the third sub-circuit board 13 to achieve the purpose of heat dissipation, so as to ensure the smooth conduction of heat in the thickness direction. This embodiment is only schematically described by connecting the first sub-circuit board 11 and the third sub-circuit board 13 with the heat storage component 30.

[0054] The specific filling amount of the heat storage element 30 may be determined by the cavity of the receiving chamber 100 . The heat storage element 30 may fill the receiving chamber 100 , or may not fill the receiving chamber 100 .

[0055] Please refer to Figure 7 , Figure 7 1 is a cross-sectional schematic diagram of a circuit board module in another embodiment of the present application. In this embodiment, the circuit board 10 is provided with a glue injection hole 14 and an exhaust hole 15, the heat storage element 30 enters the receiving cavity 100 through the glue injection hole 14, and the gas in the receiving cavity 100 is discharged through the exhaust hole 15; the orthographic projection of the heat storage element 30 on the third sub-circuit board 13 and the orthographic projection of the exhaust hole 15 on the third sub-circuit board 13 are arranged in a gap.

[0056] The present application provides two specific implementations for the installation process of the heat storage element 30. In one implementation, a glue injection hole 14 and an exhaust hole 15 may be provided on the circuit board 10. As for which sub-circuit board the glue injection hole 14 and the exhaust hole 15 are provided on, the present implementation does not limit it. For example, the glue injection hole 14 and the exhaust hole 15 may be provided on two identical sub-circuit boards, or on different sub-circuit boards.

[0057] When the three sub-circuits are welded together and surrounded to form the receiving cavity 100, glue can be poured through the glue pouring hole 14, and the gel-like heat storage component 30 can enter the receiving cavity 100, and the air in the receiving cavity 100 can be discharged from the exhaust hole 15. After the filling is completed, the gel-like heat storage component 30 can be solidified to form a solid heat storage component 30.

[0058] In this embodiment, the orthographic projection of the heat storage component 30 on the third sub-circuit board 13 and the orthographic projection of the exhaust hole 15 on the third sub-circuit board 13 are arranged in a gap. In other words, the heat storage component 30 and the exhaust hole 15 are staggered, which can prevent the heat storage component 30 from flowing out of the exhaust hole 15 during glue pouring.

[0059] Optionally, the diameter of the glue hole 14 is ≥ 0.5 mm to avoid increasing the difficulty of glue filling due to the glue hole 14 being too small. Further optionally, the diameter of the glue hole 14 is ≤ 0.8 mm. When the glue hole 14 is too large, it will occupy the size of the circuit board 10, thereby increasing the size of the circuit board 10.

[0060] Optionally, the exhaust hole 15 can be shared with other holes on the circuit board 10. For example, the circuit board 10 is welded by three sub-circuit boards, and a hole needs to be formed to allow the flux to volatilize during the welding process. The exhaust hole 15 in this embodiment can share a hole with the hole for volatilizing the flux, so that one hole has two uses, saving space and reducing the size of the circuit board 10.

[0061] Please refer to Figure 8-Figure 10 , Figure 8 This is a cross-sectional schematic diagram of the connection between the second sub-circuit board and the third sub-circuit board in one embodiment of the present application. Fig. 9 It is a cross-sectional schematic diagram of a heat storage element disposed in an open cavity in one embodiment of the present application. Fig.10 Schematic diagram of a cross section of the connection between the second sub-circuit board and the first sub-circuit board in one embodiment of the present application. In this embodiment, the second sub-circuit board 12 is first connected to one of the first sub-circuit board 11 and the third sub-circuit board 13, thereby enclosing an open cavity 110, the heat storage element 30 is disposed in the open cavity 110, and the second sub-circuit board 12 is then connected to the other of the first sub-circuit board 11 and the third sub-circuit board 13, thereby enclosing the receiving cavity 100.

[0062] In another embodiment, the glue injection hole 14 and the exhaust hole 15 are not required. During the connection process of the three sub-circuit boards, the second sub-circuit board 12 in the middle can be connected to one of the first sub-circuit board 11 and the third sub-circuit board 13 on both sides, such as the second sub-circuit board 12 and the third sub-circuit board 13 are connected first. Since the second sub-circuit board 12 is provided with a through hole 120, the second sub-circuit board 12 and the third sub-circuit board 13 can be surrounded to form an open cavity 110, and the heat storage component 30 can be placed in the open cavity 110 first.

[0063] Then, the middle second sub-circuit board 12 is connected to the other of the first sub-circuit board 11 and the third sub-circuit board 13. If the second sub-circuit board 12 is connected to the first sub-circuit board 11, a closed receiving cavity 100 can be formed, and the heat storage component 30 is sealed in the cavity.

[0064] In addition to introducing the structure of the circuit board module 1 in detail, this application also conducts simulation experiments, such as Figure 11-Figure 12 As shown, Fig.11 The figure is a curve diagram showing the change of the air temperature in the receiving cavity of the second circuit board and the third circuit board over time. Fig.12 The temperature of the chip in the first circuit board, the second circuit board and the third circuit board changes with time. Three circuit board modules 1 are specifically provided. The first is that there is only air in the receiving cavity 100 of the circuit board 10, the second is that there is a potting glue with a heat-conducting function in the receiving cavity 100 of the circuit board 10, and the third is that there is a potting glue with a heat-conducting function and a heat storage component 30 composed of phase change microcapsules with a heat-absorbing function in the receiving cavity 100 of the circuit board 10. When the chip 20 works at 3W, the air temperature in the receiving cavity 100 of the second and third circuit board 10 assemblies and the temperature of the chip 20 itself of the three circuit board 10 assemblies change with time.

[0065] from Fig.11 It can be clearly seen that after adding 100 J / g of heat storage function, the air temperature in the receiving chamber 100 is significantly reduced, and the heat has been absorbed by the heat storage element 30. Fig.12 It can also be seen that the temperature of the chip 20 of the first circuit board 10 assembly is the highest. After adding the potting glue with heat conduction function to the second circuit board 10 assembly, it can conduct heat to a certain extent, thereby reducing the temperature of the chip 20. The third circuit board 10 assembly can further absorb the heat of the chip 20 after adding the material with heat storage function on the basis of the second circuit board 10 assembly, thereby further reducing the temperature of the chip 20. Compared with the second chip 20, the temperature can be further reduced by about 2°C. It can be foreseen that the temperature gain of the chip 20 is more obvious in higher power consumption scenarios.

[0066] Please refer to Figure 13-Figure 14 , Fig.13 It is a schematic diagram of the three-dimensional structure of an electronic device in one embodiment of the present application. Fig.14 for Fig.13 The present embodiment also provides an electronic device 3, the electronic device 3 comprises a housing 2 and a circuit board module 1 as provided in the above embodiment of the present application, the circuit board module 1 is arranged in the housing 2, and the chip 20 of the circuit board module 1 is connected to the housing 2.

[0067] The electronic device 3 provided in this embodiment includes but is not limited to mobile terminals such as mobile phones, tablet computers, laptop computers, PDAs, personal computers (PCs), personal digital assistants (PDAs), portable media players (PMPs), navigation devices, wearable devices, smart bracelets, pedometers, etc. This embodiment does not limit the types of electronic devices 3, and only uses mobile phones for schematic illustration.

[0068] The electronic device 3 provided in this embodiment, by adopting the circuit board module 1 provided in the above embodiment of the present application, can be equipped with a heat storage component 30 to absorb the heat generated by the chip 20 when the chip 20 is working at high power consumption, so as to avoid the temperature of the chip 20 itself being too high, thereby affecting the performance and life of the chip 20. In addition, the heat of the chip 20 absorbed by the heat storage component 30 can also reduce the heat transferred to the housing 2, thereby avoiding the temperature of the housing 2 being too high, making it easier for the user to hold the housing 2. In other words, the introduction of the heat storage component 30 prevents the temperature of the chip 20 and the housing 2 from rising too quickly in some instantaneous high power consumption scenarios, thereby improving the smoothness of the chip 20 and the holding experience.

[0069] In the description of the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0070] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0071] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0072] The above describes the contents provided by the implementation methods of the present application in detail, and describes and illustrates the principles and implementation methods of the present application. These descriptions are only used to help understand the method and its core ideas of the present application. However, the contents of this specification should not be construed as limiting the present application, and those skilled in the art may make various changes and modifications to the present application without departing from the spirit and scope of the present application. These modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents.

Claims

1. A circuit board module, characterized in that: The circuit board module includes a circuit board, a chip, and a heat storage component. One end of the chip is arranged on the circuit board, and the other end is used to connect to the shell. The heat storage component is arranged on the circuit board and / or the chip, so that when the chip is working, the heat of the chip can be transferred to the heat storage component, or the heat of the chip can be transferred to the heat storage component through the circuit board; wherein, when the power of the chip when working is greater than the preset power, the heat storage component can absorb the heat of the chip.

2. The circuit board module according to claim 1, characterized in that: The circuit board includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board which are stacked in sequence. The chip is arranged on a side of the first sub-circuit board away from the third sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are arranged to form a receiving cavity, and the heat storage component is arranged in the receiving cavity.

3. The circuit board module according to claim 2, characterized in that: The orthographic projection of the heat storage component on the first sub-circuit board covers the orthographic projection of the chip on the first sub-circuit board.

4. The circuit board module according to claim 2, characterized in that: The heat storage component is connected to the first sub-circuit board, or the heat storage component is connected to the first sub-circuit board and the third sub-circuit board.

5. The circuit board module according to claim 2, characterized in that: The circuit board is provided with a glue injection hole and an exhaust hole, the heat storage component enters the receiving cavity through the glue injection hole, and the gas in the receiving cavity is discharged through the exhaust hole; the orthographic projection of the heat storage component on the third sub-circuit board and the orthographic projection of the exhaust hole on the third sub-circuit board are arranged in a gap.

6. The circuit board module according to claim 2, wherein: The second sub-circuit board is first connected to one of the first sub-circuit board and the third sub-circuit board to form an open cavity, and the heat storage component is arranged in the open cavity. The second sub-circuit board is then connected to the other of the first sub-circuit board and the third sub-circuit board to form the receiving cavity.

7. The circuit board module according to claim 1, wherein: The heat storage element satisfies one of the following conditions: The heat storage member is arranged on the outer peripheral side of the circuit board; The circuit board module further includes a first shielding member, which is disposed on the circuit board and covers the chip, and is used to connect the housing, and the heat storage member is disposed in the first shielding member; The circuit board module further includes a first shielding member and a second shielding member, wherein the first shielding member and the second shielding member are arranged on the circuit board, the first shielding member covers the chip and is used to connect the shell, and the heat storage member is arranged in the second shielding member.

8. The circuit board module according to any one of claims 1 to 7, characterized in that: The phase change enthalpy value of the heat storage element is ≥50 J / g, and / or the phase change endothermic temperature of the heat storage element is 30° C.-60° C.

9. The circuit board module according to any one of claims 1 to 7, characterized in that: The heat storage component can also conduct the heat of the chip, and the thermal conductivity of the heat storage component is ≥0.2W / mK.

10. An electronic device, characterized in that: The electronic device comprises a housing and a circuit board module as described in any one of claims 1 to 9, wherein the circuit board module is arranged in the housing, and a chip of the circuit board module is connected to the housing.

Images